A host heat dissipation structure, a mini host and a data processing device

Abstract

The application discloses a host heat dissipation structure, a mini host and a data processing device. The host heat dissipation structure comprises a shell, the shell is provided with a first air inlet, a second air inlet and an air outlet, and an air blowing structure is arranged in the shell. The air blowing structure comprises a first air inlet, a second air inlet and a converging air outlet. A first air duct is connected between the first air inlet and the first air inlet and is configured to pass through a first heat source. A second air duct is connected between the second air inlet and the second air inlet and is configured to pass through a second heat source. That is, a single air blowing structure is used to simultaneously generate suction on the first air duct and the second air duct, realizing unified convergence and discharge of two air flows. On the premise that the first heat source and the second heat source can both obtain relatively independent heat dissipation air flow, the material cost and the assembly cost are reduced, the internal space occupation of the shell is reduced, and the technical problems that it is difficult to meet the host heat dissipation demand in limited space and reduce the material cost in the prior art are solved.

Description

Technical Field

[0001] This disclosure relates to the field of host heat dissipation technology, and more specifically, to a host heat dissipation structure, a mini host, and a data processing device. Background Technology

[0002] In existing technologies, computer cooling typically employs air cooling, which involves installing a fan inside the casing. The fan drives airflow, drawing cool outside air into the casing and passing it over the heat-generating components, thus carrying away heat. Common cooling structures include single-fan integrated cooling systems and multi-fan independent cooling systems.

[0003] Single-fan integrated cooling structures typically feature a single air inlet and outlet on the casing. A fan creates a continuous airflow circulation within the casing, allowing the air to pass sequentially through multiple heat-generating components before being expelled from the machine. This approach is simple and low-cost. However, because multiple heat sources share the same airflow path, downstream heat sources often draw in air heated by upstream heat sources, leading to increased intake air temperature, decreased cooling efficiency, and potential heat accumulation and localized hotspots, ultimately affecting the overall cooling performance. To improve cooling, some devices employ multi-fan independent cooling solutions, using separate fans and corresponding air ducts for different heat sources. This allows each heat source to receive relatively independent cool air. While this reduces thermal interference between heat sources and improves cooling efficiency to some extent, the need for multiple fans and corresponding installation structures increases material and assembly costs and occupies significant internal space, hindering miniaturization and highly integrated design of the main unit.

[0004] Therefore, how to meet the heat dissipation requirements of the host computer within a limited space and reduce material costs has become a technical problem that urgently needs to be solved by those skilled in the art.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure. Summary of the Invention

[0006] The purpose of this disclosure is to provide a host heat dissipation structure, a mini host, and a data processing device to solve the technical problem in the prior art that it is difficult to meet the heat dissipation requirements of the host in a limited space and reduce material costs.

[0007] Other features and advantages of this disclosure will become apparent from the following detailed description, or may be learned in part from practice of this disclosure.

[0008] According to one aspect of this disclosure, a host heat dissipation structure is provided, comprising: The housing is disposed on the mounting surface and is equipped with a first air inlet, a second air inlet and an air outlet. The first air inlet is disposed on a first surface of the housing opposite to the mounting surface, and the second air inlet is disposed on a second surface of the housing that is not coplanar with the first surface. A blower structure is disposed within the housing, including a first airflow inlet, a second airflow inlet, and a collecting airflow outlet; The first air duct, connecting the first air inlet and the first airflow inlet, is configured to pass through the first heat source; The second air duct, connecting the second air inlet and the second airflow inlet, is configured to pass through the second heat source; An air outlet duct connects the collected airflow outlet and the air outlet.

[0009] In some embodiments of this disclosure, based on the foregoing scheme, the heat of the first heat source is greater than the heat of the second heat source; a heat-conducting component is provided in the first air duct, and the heat-conducting component is attached to the end of the first heat source away from the mounting surface; the wall surface of the heat-conducting component away from the mounting surface is at least partially in contact with the outer wall surface of the air outlet duct.

[0010] In some embodiments of this disclosure, based on the foregoing scheme, along the air outlet direction, one end of the heat-conducting element extends in a direction close to the blower structure, such that one end of the heat-conducting element is located on one side of the blower structure in the vertical direction; the other end of the heat-conducting element extends in a direction away from the blower structure, such that the other end of the heat-conducting element is at least partially in contact with the outer wall surface of the air outlet channel.

[0011] In some embodiments of this disclosure, based on the foregoing scheme, along the vertical direction, the projected area of ​​the other end of the heat-conducting element is greater than the projected area of ​​one end of the heat-conducting element.

[0012] In some embodiments of this disclosure, based on the foregoing scheme, the heat-conducting component includes a first heat-conducting portion, a second heat-conducting portion, and a heat-conducting middle portion in contact with the first heat source. The first heat-conducting portion extends from the heat-conducting middle portion in a direction close to the blower structure, and the second heat-conducting portion extends from the heat-conducting middle portion in a direction away from the blower structure. A third heat-conducting portion is also connected to the end of the second heat-conducting portion away from the heat-conducting middle portion. The third heat-conducting portion extends in a horizontal direction, which is perpendicular to both the vertical direction and the air outlet direction. The second heat-conducting portion forms the other end of the heat-conducting component.

[0013] In some embodiments of this disclosure, based on the aforementioned scheme, the portion of the first heat-conducting part connected to the heat-conducting middle part is inclined relative to the air outlet direction, the portion of the second heat-conducting part connected to the heat-conducting middle part is inclined relative to the air outlet direction, and both the portion of the first heat-conducting part connected to the heat-conducting middle part and the portion of the second heat-conducting part connected to the heat-conducting middle part are inclined in a direction away from the mounting surface.

[0014] In some embodiments of this disclosure, based on the foregoing scheme, the number of heat-conducting elements is two, and they are symmetrically arranged with the partition surface as a reference. The partition surface is perpendicular to the mounting surface and passes through the centerline of the first heat source. The second heat-conducting part extends in a direction parallel to the partition surface, and the third heat-conducting part extends in a direction perpendicular to the partition surface.

[0015] In some embodiments of this disclosure, based on the foregoing scheme, a heat-conducting channel is provided inside the heat-conducting component, the heat-conducting channel is equidistant from the outer contour of the heat-conducting component, and the heat-conducting channel is filled with a flowable heat-conducting medium.

[0016] In some embodiments of this disclosure, based on the foregoing scheme, the heat-conducting channel includes a heat-conducting cavity disposed at a position corresponding to the first heat source, a first channel communicating with one side of the heat-conducting cavity, and a second channel communicating with the other side of the heat-conducting cavity; The first flow channel is formed in the first heat-conducting part. The inlet of the first flow channel is located on a cavity surface of the heat-conducting cavity away from the partition surface, and the outlet of the first flow channel is located on a cavity surface of the heat-conducting cavity close to the partition surface. The heat-conducting cavity is provided with baffles at intervals corresponding to the outlet of the first flow channel. The second flow channel is formed in the second heat-conducting part and the third heat-conducting part. The inlet of the second flow channel is located on another cavity surface of the heat-conducting cavity near the partition surface, and the outlet of the second flow channel is located on another cavity surface of the heat-conducting cavity away from the partition surface. The heat-conducting cavity is provided with baffles at intervals at the outlet of the second flow channel.

[0017] In some embodiments of this disclosure, based on the foregoing scheme, the number of second heat sources is multiple, and they are arranged at intervals along the vertical direction on the side of the blower structure away from the mounting surface.

[0018] According to one aspect of this disclosure, a mini PC is provided, including a PC heat dissipation structure as described above, a first heat source being provided in a first air duct of the PC heat dissipation structure, and a second heat source being provided in a second air duct of the PC heat dissipation structure.

[0019] In some embodiments of this disclosure, based on the foregoing scheme, the first heat source is a CPU chip and the second heat source is a hard disk.

[0020] According to one aspect of this disclosure, a data processing device is provided, characterized in that it includes a host heat dissipation structure as described above, a first heat source is provided in a first air duct of the host heat dissipation structure, and a second heat source is provided in a second air duct of the host heat dissipation structure.

[0021] As can be seen from the above technical solutions, the host heat dissipation structure, mini-host, and data processing device in the exemplary embodiments of this disclosure have at least the following advantages and positive effects: The host cooling structure, mini-host, and data processing device provided in this application allow airflows from the first and second heat sources to enter the blower structure through their respective airflow inlets, converge, and then enter the exhaust channel through the converged airflow outlet, ultimately exiting through the exhaust port. This utilizes a single blower structure to simultaneously draw in air from both the first and second air ducts, achieving unified convergence and exhaust of the two airflows. Compared to solutions using multiple fans to drive multiple independent air ducts, this approach reduces the number of fans and their corresponding installation structures and control components while ensuring that both the first and second heat sources receive relatively independent cooling airflows. This reduces material and assembly costs, while also minimizing internal space occupation, facilitating miniaturization and high integration of the host design. Therefore, through the coordination of the first and second air inlets, the first and second air ducts, the blower structure, and the exhaust channel, this application achieves relatively independent cooling of multiple heat sources within a limited space, and utilizes a single blower structure to drive and converge multiple airflows. This balances cooling requirements with material cost control, solving the technical problem in existing technologies of meeting host cooling needs and reducing material costs within a limited space.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0025] Figure 1 This is a schematic diagram of the overall structure of the host heat dissipation structure provided in an embodiment of the present invention; Figure 2 This is a cross-sectional structural diagram of the host heat dissipation structure provided in an embodiment of the present invention; Figure 3 This is a first partial structural diagram of the host heat dissipation structure provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the air duct structure of the host heat dissipation structure provided in an embodiment of the present invention; Figure 5 This is a second partial structural diagram of the host heat dissipation structure provided in an embodiment of the present invention; Figure 6 This is a partial side view of the host heat dissipation structure provided in an embodiment of the present invention; Figure 7 This is a partial exploded view of the host heat dissipation structure provided in an embodiment of the present invention; Figure 8 This is a side view of a heat-conducting component in an embodiment of the present invention. Figure 9 This is a side view of another heat-conducting component in an embodiment of the present invention; Figure 10 This is a partial top view of the host heat dissipation structure provided in an embodiment of the present invention; Figure 11 A partial top-view cross-sectional structural diagram of the host heat dissipation structure provided in an embodiment of the present invention; Figure 12 for Figure 11 A magnified schematic diagram of the structure at point A; Figure 13 This is a schematic diagram of a third partial structure of the host heat dissipation structure provided in an embodiment of the present invention; Illustration description: 001, mounting surface; 002, partition surface; 100. Housing; 1001. First surface; 1002. Second surface; 101. First air inlet; 102. Second air inlet; 103. Air outlet; 200. Blower structure; 201. First airflow inlet; 202. Second airflow inlet; 203. Collecting airflow outlet; 300, First air duct; 400, Second air duct; 500, Air outlet channel; 610, First heat source; 620, Second heat source; 700, heat-conducting component; 701, first heat-conducting section; 702, second heat-conducting section; 703, third heat-conducting section; 704, heat-conducting middle section; 710, heat-conducting flow channel; 711, first flow channel; 712, second flow channel; 713, heat-conducting cavity; 714, baffle; 800, heat dissipation fins. Detailed Implementation

[0026] To make the inventive objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] In the description of this application, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0028] The technical solution of this application will be further described below with reference to the accompanying drawings and specific embodiments.

[0029] Example 1: This embodiment provides a host heat dissipation structure that can be applied to mini PCs, data processing devices, edge computing devices, small servers, or other electronic devices that require multiple heat-generating components to be arranged within a limited internal space. Based on the above-mentioned usage scenarios and heat dissipation requirements, the motivation for improvement in this embodiment is to enable the first heat source 610 and the second heat source 620 to obtain relatively independent heat dissipation airflow without significantly increasing the complexity of the internal structure of the housing 100. To achieve this goal, this embodiment does not simply increase the number of fans, but adopts a new host heat dissipation structure to balance the heat dissipation effect of multiple heat sources, the miniaturization of the entire machine, and the improvement of cost control.

[0030] like Figures 1 to 4As shown, the host heat dissipation structure in this embodiment is mainly used to dissipate heat from the first heat source 610 and the second heat source 620 inside the housing 100; the host heat dissipation structure includes the housing 100, the blower structure 200, the first air duct 300, the second air duct 400 and the air outlet duct 500. Specifically, the housing 100 can be understood as an external support component used to house the motherboard, heat source, air duct, and blower structure 200. In practice, the housing 100 can be a metal housing, a plastic housing, or a metal and plastic composite housing. The housing 100 serves both to form the appearance of the equipment and the internal installation space, and to define the boundaries for airflow into and out of the equipment. The mounting surface 001 can be understood as the external bearing surface upon which the host is placed or installed. In practice, the mounting surface 001 can be a desktop, a bracket surface, a cabinet mounting surface, or an equipment base surface. The housing 100 is disposed on the mounting surface 001 and is equipped with a first air inlet 101, a second air inlet 102 and an air outlet 103. The first air inlet 101 is disposed on a first surface 1001 of the housing 100 opposite to the mounting surface 001. The first surface 1001 can be understood as the side wall of the housing 100 facing the mounting surface 001. In specific implementation, the first surface 1001 can be the bottom surface of the housing 100. The second air inlet 102 is disposed on a second surface 1002 of the housing 100 that is not coplanar with the first surface 1001. The second surface 1002 can be understood as the other side wall of the housing 100 that is different from the first surface 1001. In specific implementation, the second surface 1002 can be the side or rear side of the housing 100. By setting the first air inlet 101 and the second air inlet 102 on different walls, the sources of external air entering the first air duct 300 and the second air duct 400 can be distinguished from each other, reducing the mutual air competition between the two air intakes before and after entering the housing 100, and constructing relatively independent low-temperature airflow inlets for the first heat source 610 and the second heat source 620 respectively. The blower structure 200 is disposed within the housing 100. The blower structure 200 can be understood as an active air supply component used to generate negative pressure suction and drive airflow. In specific implementations, the blower structure 200 can be a centrifugal fan, a turbine fan, a blower, or a fan assembly with multi-inlet converging capability. The blower structure 200 includes a first airflow inlet 201, a second airflow inlet 202, and a collecting airflow outlet 203. The first airflow inlet 201 is used to receive airflow from the first air duct 300, the second airflow inlet 202 is used to receive airflow from the second air duct 400, and the collecting airflow outlet 203 is used to collect the airflow entering the blower structure 200 and send it into the subsequent exhaust path. The first air duct 300 is connected between the first air inlet 101 and the first airflow inlet 201, and is configured to pass through the first heat source 610; the second air duct 400 is connected between the second air inlet 102 and the second airflow inlet 202, and is configured to pass through the second heat source 620. An air duct can be understood as an airflow path formed by the internal space of the housing 100, partitions, air guides, covers, or adjacent components. In specific implementations, the first air duct 300 and the second air duct 400 can be formed solely by air guides, or they can be jointly formed by the inner wall of the housing 100, the main board, the bracket, and local windbreak structures. The air outlet duct 500 connects the collecting airflow outlet 203 and the air outlet 103. The air outlet duct 500 can be understood as an exhaust path that guides the airflow discharged from the blower structure 200 to the outside of the housing 100. In specific implementations, the air outlet duct 500 can be a rectangular air guide duct, a flat air guide hood, an exhaust cavity formed by the inner wall of the housing 100, or an exhaust section integrally formed with the blower structure 200. By connecting the collecting airflow outlet 203 and the air outlet 103 through the air outlet duct 500, the airflow that has completed heat exchange in the first air duct 300 and the second air duct 400 can be uniformly collected at the blower structure 200 and then concentratedly discharged to the outside of the housing 100 along the air outlet duct 500.

[0031] Therefore, outside air can enter the first air duct 300 through the first air inlet 101 and flow through the first heat source 610, carrying away the heat generated by the first heat source 610 before entering the blower structure 200 through the first airflow inlet 201. Simultaneously, outside air can enter the second air duct 400 through the second air inlet 102 and flow through the second heat source 620, carrying away the heat generated by the second heat source 620 before entering the blower structure 200 through the second airflow inlet 202. Since the first air duct 300 and the second air duct 400 correspond to different heat sources before reaching the blower structure 200, the heat transfer effect between the first heat source 610 and the second heat source 620 can be reduced. This prevents the airflow heated by the upstream heat source in a single path from continuing to serve as the intake air for the downstream heat source, thereby improving the heat dissipation stability of multiple heat sources.

[0032] This embodiment utilizes a single blower structure 200 to simultaneously draw air from the first air duct 300 and the second air duct 400, achieving unified convergence and exhaust of the two airflows. Compared to a solution using multiple fans to drive multiple independent air ducts, this reduces the number of fans and their corresponding installation structures and control components, while ensuring that both the first heat source 610 and the second heat source 620 receive relatively independent cooling airflow. This reduces material and assembly costs, while also minimizing the internal space occupied by the housing 100, which is more conducive to the miniaturization and high integration design of the host. Therefore, through the coordination between the first air inlet 101, the second air inlet 102, the first air duct 300, the second air duct 400, the blower structure 200, and the exhaust channel 500, this embodiment achieves relatively independent cooling of multiple heat sources within a limited space, and uses a single blower structure 200 to drive and converge multiple airflows, thus balancing cooling requirements with material cost control. This solves the technical problem in the prior art of meeting the host's cooling requirements and reducing material costs within a limited space.

[0033] In some optional embodiments of this example, the heat generated by the first heat source 610 is greater than that generated by the second heat source 620. Specifically, the first heat source 610 can be a CPU chip, a main control SoC, or a high-performance processing unit, while the second heat source 620 can be a storage device, a hard disk, or a relatively low-power functional module. By distinguishing between the first heat source 610 (higher heat load) and the second heat source 620 (lower heat load), the system can design differentiated heat dissipation paths for different heat intensities in its thermal management strategy, thereby improving overall thermal balance and local heat dissipation efficiency.

[0034] Based on the aforementioned heat load difference settings, a heat-conducting component 700 is provided in the first air duct 300. The heat-conducting component 700 can be understood as a heat-conducting member used to enhance the heat exchange efficiency between the heat source and the airflow. Its main function is to quickly conduct the heat generated by the first heat source 610 and extend it to the airflow's effective area, thereby improving the overall heat exchange capacity within the first air duct 300. In specific implementations, the heat-conducting component 700 can be a metal heat-conducting structure, such as an aluminum alloy heat-conducting component, a copper heat-conducting component, or a copper-aluminum composite heat-conducting structure, or it can be a composite material structure with high thermal conductivity.

[0035] The thermally conductive component 700 is attached to the end of the first heat source 610 furthest from the mounting surface 001. Specifically, the first heat source 610 is typically mounted on a motherboard or mounting substrate, with the side closer to the mounting surface 001 being the mounting side and the side furthest from the mounting surface 001 being the heat release side. By tightly attaching the thermally conductive component 700 to the end furthest from the mounting surface 001, the thermally conductive component 700 can directly contact or closely couple with the main heat dissipation interface of the first heat source 610, thereby reducing the thermal resistance path and improving thermal conductivity. This attachment method can be surface contact attachment, elastic compression attachment, or an interface attachment structure filled with thermally conductive silicone grease.

[0036] Furthermore, the wall surface of the heat-conducting component 700 away from the mounting surface 001 is at least partially in contact with the outer wall surface of the air outlet duct 500. This structural design allows the heat-conducting component 700 to not only perform the heat diffusion function of the first heat source 610, but also to form a thermal coupling path with the air outlet duct 500. This allows some heat to be pre-dissipated through the structural wall surface before the airflow exits, further reducing the instantaneous heat load entering the airflow and improving overall heat exchange efficiency. During the specific heat dissipation process, the heat generated by the first heat source 610 is first transferred to the interior of the heat-conducting component 700 through the contact interface with it, and then diffused and conducted within the component, expanding the heat from a point or localized heat source to a planar or linear heat distribution, thereby increasing the heat exchange area with the airflow within the first air duct 300. Simultaneously, because part of the wall surface of the heat-conducting component 700 is in contact with the outer wall of the air outlet duct 500, heat can be further transferred to the area of ​​the air outlet duct 500 through a solid heat conduction path, forming a multi-path heat dissipation structure before and after airflow, thus enhancing the overall heat dissipation capacity.

[0037] Through the above-described configuration, this embodiment strengthens the structure of the first air duct 300 by introducing a heat-conducting component 700 when the power consumption of the first heat source 610 is high. This achieves a synergistic enhancement effect between the heat conduction capacity on the heat source side and the convective heat transfer capacity on the air duct side, thereby preventing local overheating or heat accumulation in high heat flux density areas under a single airflow heat transfer mode. Simultaneously, this structure can also improve local heat dissipation capacity without adding additional fan components, further demonstrating the design concept of balancing heat dissipation performance and structural complexity under miniaturized space constraints.

[0038] In some optional embodiments of this example, along the air outlet direction, one end of the heat-conducting element 700 extends in a direction close to the blower structure 200, such that one end of the heat-conducting element 700 is located on one side of the blower structure 200 in the vertical direction; the other end of the heat-conducting element 700 extends in a direction away from the blower structure 200, such that the other end of the heat-conducting element 700 is at least partially in contact with the outer wall surface of the air outlet channel 500. The air outlet direction can be understood as the overall flow direction of the airflow from the collecting airflow outlet 203 of the blower structure 200 to the air outlet 103. In specific implementations, the air outlet direction can be the direction extending from the blower structure 200 toward the air outlet 103 inside the housing 100. The vertical direction can be understood as the direction extending vertically relative to the mounting surface 001. In specific implementations, when the mounting surface 001 is a horizontal tabletop or a horizontal support surface, the vertical direction can be the height direction of the housing 100.

[0039] Specifically, one end of the heat-conducting element 700 extends in a direction close to the blower structure 200. This can be understood as the portion of the heat-conducting element 700 located on the side of the first heat source 610 extending towards the blower structure 200, allowing this end to enter the local area between or near the first heat source 610 and the blower structure 200. Since the blower structure 200 exerts a suction effect on the first air duct 300 during operation, resulting in a high airflow velocity within the first air duct 300, arranging one end of the heat-conducting element 700 close to the blower structure 200 makes it easier for the heat transferred from the first heat source 610 to the heat-conducting element 700 to be carried away by the high-speed airflow close to the blower structure 200, thereby improving the convective heat transfer efficiency of the near-end region of the heat-conducting element 700. In specific implementation, one end of the heat-conducting component 700 can be selected as a plate-shaped extension structure, a strip-shaped extension structure, or a bent extension structure, and can be adapted and arranged according to the shape of the blower structure 200, the position of the first airflow inlet 201, and the height of the first air duct 300.

[0040] In some optional embodiments of this example, the projected area of ​​the other end of the heat-conducting element 700 is larger than the projected area of ​​one end of the heat-conducting element 700 in the vertical direction. The projected area can be understood as the area formed by projecting the heat-conducting element 700 in the vertical direction onto a reference plane that is approximately parallel to the mounting surface 001. In specific implementations, it can be determined by the top-view outline area of ​​the heat-conducting element 700 in the height direction of the housing 100. One end of the heat-conducting element 700 is a portion extending in a direction close to the blower structure 200, and the other end of the heat-conducting element 700 is a portion extending in a direction away from the blower structure 200 and at least partially in contact with the outer wall surface of the air outlet duct 500. By making the projected area of ​​the other end larger than the projected area of ​​the first end, a larger heat diffusion area can be formed on the side of the heat-conducting element 700 away from the blower structure 200.

[0041] Specifically, one end of the heat-conducting component 700 is positioned close to the blower structure 200. This area needs to balance heat conduction and airflow. If the area of ​​this end is too large, it may occupy the suction space near the blower structure 200 and obstruct the airflow near the first airflow inlet 201 in the first air duct 300, leading to increased airflow resistance and affecting the suction efficiency of the blower structure 200 in the first air duct 300. Therefore, in this embodiment, the end of the heat-conducting component 700 near the blower structure 200 is set to a relatively small projected area, so that this end can guide the heat from the first heat source 610 to the high-speed airflow area near the blower structure 200, while not excessively obstructing the air intake space near the first airflow inlet 201, thereby enhancing local heat exchange while maintaining airflow unobstructedness. The other end of the heat-conducting element 700 is located away from the blower structure 200 and in contact with the outer wall of the air outlet channel 500. This area has less impact on the airflow inlet space compared to the area near the blower structure 200, and can form a more stable structural contact relationship with the air outlet channel 500. Therefore, by increasing the projected area of ​​the other end of the heat-conducting element 700 in the vertical direction, the contact area between the other end and the outer wall of the air outlet channel 500 can be increased, as can the heat exchange area of ​​the heat-conducting element 700 itself exposed to the airflow environment inside the first air duct 300 or the housing 100 can also be increased. In specific implementations, the other end of the heat-conducting element 700 can be configured as a wide plate structure, an extended plate structure, a flat extended structure, or a fitted structure extending along the outer wall of the air outlet channel 500, thereby expanding the planar coverage of the heat-conducting element 700 without significantly increasing the height of the housing 100.

[0042] With the above structure, the heat generated by the first heat source 610 is transferred to the heat conductor 700. It can then be conducted from one end of the heat conductor 700 towards the vicinity of the blower structure 200, or from the other end towards the vicinity of the air outlet 500. Because the projected area of ​​the other end is larger, it can receive and diffuse more heat from the first heat source 610, dispersing the high heat flux density area of ​​the first heat source 610 into a larger heat-conducting area. This reduces the local temperature rise of the heat conductor 700 and improves the uniformity of heat distribution. Simultaneously, the increased contact area between the other end and the outer wall of the air outlet 500 provides a more efficient path for heat transfer from the heat conductor 700 to the air outlet 500, reducing contact thermal resistance and allowing heat to be further discharged outside the housing 100 via the wall of the air outlet 500 and the exhaust airflow. Therefore, through the above-described configuration, this embodiment utilizes the differentiated design of the projected areas at both ends of the heat-conducting component 700. The end closer to the blower structure 200 primarily serves to draw heat and prevent airflow obstruction, while the other end further away from the blower structure 200 primarily serves to amplify heat and assist in heat transfer. Compared to structures where both ends of the heat-conducting component 700 have the same area or the end closer to the blower structure 200 has a larger area, this embodiment reduces the wind resistance near the blower structure 200 and improves the thermal coupling between the heat-conducting component 700 and the air outlet channel 500. This further enhances the heat dissipation efficiency of the first heat source 610 and the overall thermal stability of the machine without increasing the number of additional fans or significantly increasing the space occupied by the housing 100.

[0043] In some optional implementations of this embodiment, such as Figure 13 As shown, the air outlet duct 500 may be equipped with heat dissipation fins 800, which improves the heat dissipation efficiency of the air outlet duct 500.

[0044] In some optional implementations of this embodiment, such as Figures 5 to 10 As shown, the heat-conducting component 700 includes a first heat-conducting part 701, a second heat-conducting part 702, a third heat-conducting part 703, and a heat-conducting middle part 704. The heat-conducting middle part 704 is in contact with the first heat source 610. The first heat-conducting part 701 extends from the heat-conducting middle part 704 in a direction close to the blower structure 200. The second heat-conducting part 702 extends from the heat-conducting middle part 704 in a direction away from the blower structure 200. The end of the second heat-conducting part 702 away from the heat-conducting middle part 704 is connected to the third heat-conducting part 703. The heat-conducting middle part 704 can be understood as the main contact area in the heat-conducting component 700 that directly receives the heat from the first heat source 610. In specific implementations, the heat-conducting middle part 704 can be a flat contact part, a pressure plate contact part, or a bonding part with a heat-conducting interface material to ensure that the heat generated by the first heat source 610 can be preferentially transferred to the heat-conducting component 700.

[0045] The first heat-conducting part 701 can be understood as the heat-drawing part of the heat-conducting element 700 extending toward the blower structure 200. It is mainly used to guide the heat at the heat-conducting middle part 704 to the airflow suction area near the blower structure 200, so that this part of the heat can be carried away by the airflow near the first airflow inlet 201 in the first air duct 300. The second heat-conducting part 702 can be understood as the heat-expanding part of the heat-conducting element 700 extending toward the side away from the blower structure 200. It is mainly used to guide the heat at the heat-conducting middle part 704 to the vicinity of the air outlet duct 500, and as a major component of the other end of the heat-conducting element 700, it enables the heat-conducting element 700 to form a thermal coupling relationship with the outer wall surface of the air outlet duct 500.

[0046] The third heat-conducting part 703 is connected to the end of the second heat-conducting part 702 away from the heat-conducting center part 704 and extends horizontally. The horizontal direction can be understood as a transverse extension direction that is perpendicular to both the vertical direction and the airflow direction; in specific implementations, it can be a direction extending along the width direction inside the housing 100. By setting the third heat-conducting part 703 to extend horizontally, the planar coverage area of ​​the heat-conducting member 700 on the side away from the blower structure 200 can be expanded without significantly increasing the length of the heat-conducting member 700 along the airflow direction, thereby giving the other end of the heat-conducting member 700 a larger projected area.

[0047] With the above configuration, the central heat-conducting part 704 is responsible for concentrating heat from the first heat source 610, the first heat-conducting part 701 is responsible for guiding some of the heat to the high-speed airflow area near the blower structure 200, and the second heat-conducting part 702 and the third heat-conducting part 703 are responsible for diffusing heat to the area away from the blower structure 200 and near the air outlet 500. Thus, the heat-conducting component 700 can form a heat-conducting path that draws heat from the center, diverts heat to both sides, and extends to the far end. While maintaining smooth airflow near the blower structure 200, it expands the heat dissipation area and contact area on the side away from the blower structure 200, thereby improving the heat diffusion efficiency of the first heat source 610 and further reducing the risk of localized heat accumulation.

[0048] In some optional implementations of this embodiment, such as Figure 8 and Figure 9 As shown, the heat-conducting component 700 can adopt different lateral configurations according to the internal space of the housing 100 and the airflow requirements of the first air duct 300. Specifically, Figure 8 A horizontal configuration is shown in which the first heat-conducting part 701, the heat-conducting middle part 704, and the second heat-conducting part 702 extend approximately at the same height, making the heat-conducting component 700 have a relatively straight structure. This structure is easy to process and can cover the first heat source 610 at a lower installation height, thus making it suitable for use scenarios where the internal height space of the housing 100 is small.

[0049] like Figure 9 As shown, in another optional embodiment, the portion of the first heat-conducting part 701 connected to the heat-conducting middle part 704 is inclined relative to the air outlet direction (inclined to the upper left), and the portion of the second heat-conducting part 702 connected to the heat-conducting middle part 704 is inclined relative to the air outlet direction (inclined to the upper right). Furthermore, both the portions of the first heat-conducting part 701 and the second heat-conducting part 702 connected to the heat-conducting middle part 704 are inclined away from the mounting surface 001. This inclined arrangement can be understood as the first heat-conducting part 701 and the second heat-conducting part 702 not extending completely straight outwards from the heat-conducting middle part 704, but rather forming an upwardly curved transition structure near the heat-conducting middle part 704, causing both ends of the heat-conducting component 700 to tend to move away from the mounting surface 001 relative to the heat-conducting middle part 704. In specific implementations, this inclined structure can be formed by bending, stamping, arc transition forming, or partial bending.

[0050] Understandably, the upward curve of the two ends of the first heat-conducting part 701 and the second heat-conducting part 702 creates a more reasonable clearance space between the heat-conducting component 700 and the mounting surface 001, and between the heat-conducting component 700 and the motherboard or adjacent devices, reducing the risk of interference between the heat-conducting component 700 and surrounding electronic components, solder joints, or mounting structures of the first heat source 610. Simultaneously, Figure 9 The angled design at both ends allows the first heat-conducting part 701 and the second heat-conducting part 702 to better conform to the airflow distribution requirements inside the housing 100. Since the airflow within the first air duct 300 flows under the suction of the blower structure 200, the tilting of the two ends of the heat-conducting part 700 away from the mounting surface 001 guides the airflow to form a smoother flow transition along the surface of the heat-conducting part 700, reducing the local turbulence and flow resistance caused by the direct impact of airflow on the straight ends. This improves the ventilation smoothness within the first air duct 300 while ensuring the heat-conducting area. Therefore, the adopted design... Figure 9 The structure of the heat-conducting component 700 with its two ends raised as shown allows the heat-conducting component 700 to maintain effective contact between the heat-conducting middle part 704 and the first heat source 610. The inclined transition structure of the first heat-conducting part 701 and the second heat-conducting part 702 takes into account device avoidance, airflow guidance and heat diffusion, thereby improving the assembly adaptability and heat dissipation stability of the heat-conducting component 700 in the miniaturized housing 100.

[0051] like Figure 10As shown, in some optional embodiments of this example, there are two heat-conducting elements 700, symmetrically arranged with respect to the partition surface 002. The partition surface 002 can be understood as an imaginary reference plane used to divide the first heat source 610 and its surrounding heat-conducting area laterally. The partition surface 002 is perpendicular to the mounting surface 001 and passes through the centerline of the first heat source 610. The centerline of the first heat source 610 can be understood as the central reference line of the first heat source 610 in its length or width direction. In specific implementations, the centerline can be taken as a line passing through the center of the first heat source 610 and extending along the air outlet direction, according to the arrangement direction of the first heat source 610 within the housing 100. By having the partition surface 002 pass through the centerline of the first heat source 610, the two heat-conducting elements 700 can be located on both sides of the first heat source 610, forming a relatively balanced heat-conducting layout with the central area of ​​the first heat source 610 as a reference.

[0052] Specifically, both heat-conducting components 700 can be in contact with or thermally coupled to the first heat source 610, allowing the heat generated by the first heat source 610 to be transferred to the heat-conducting components 700 on both sides. The symmetrical arrangement of the two heat-conducting components 700 can disperse the heat at the first heat source 610 to the left and right sides, reducing the local temperature rise caused by the concentrated conduction of heat to one side, and improving the uniformity of the contact pressure above the first heat source 610 and the heat conduction path, thereby reducing the risk of hot spots generated by uneven local heat dissipation at the first heat source 610.

[0053] Furthermore, the second heat-conducting part 702 extends in a direction parallel to the partition surface 002, and the third heat-conducting part 703 extends in a direction perpendicular to the partition surface 002. The direction parallel to the partition surface 002 can be understood as the second heat-conducting part 702 extending approximately along the centerline of the first heat source 610 or along the air outlet direction, enabling it to guide heat from the heat-conducting center 704 to a position away from the blower structure 200 and close to the air outlet duct 500. The direction perpendicular to the partition surface 002 can be understood as the third heat-conducting part 703 extending laterally outward, increasing the coverage area of ​​the distal end of the heat-conducting element 700 in the width direction of the housing 100. Through the directional cooperation between the second heat-conducting part 702 and the third heat-conducting part 703, the heat-conducting element 700 can first conduct heat longitudinally in a direction parallel to the partition surface 002, and then laterally expand heat in a direction perpendicular to the partition surface 002, thereby forming a more suitable zigzag heat conduction path within the limited space inside the housing 100.

[0054] Through the above arrangement, the two heat-conducting components 700 can form heat-conducting extension areas on both sides of the first heat source 610, consisting of a heat-conducting center 704, a second heat-conducting part 702, and a third heat-conducting part 703, respectively. This allows the heat generated by the first heat source 610 to be diverted from the center to both sides and further diffused to the lateral area away from the partition surface 002. Therefore, on the one hand, the heat exchange range between the heat-conducting component 700 and the airflow within the first air duct 300 or the outer wall of the air outlet duct 500 can be increased; on the other hand, it can prevent a single heat-conducting component 700 from excessively occupying space on one side and affecting the airflow near the blower structure 200. In other words, this embodiment, through the symmetrical arrangement of the two heat-conducting components 700 and the extension direction limitation of the second heat-conducting part 702 and the third heat-conducting part 703, enables the heat-conducting components 700 to maintain balanced heat absorption from the first heat source 610 and to form a distributed heat dissipation layout inside the housing 100, thereby further improving the heat dissipation uniformity of the first heat source 610 and the overall operational stability of the machine.

[0055] Based on the above embodiments, a heat-conducting channel 710 is formed within the heat-conducting component 700. The heat-conducting channel 710 is equidistant from the outer contour of the heat-conducting component 700, and is filled with a flowable heat-conducting medium. The heat-conducting channel 710 can be understood as an internal channel disposed within the heat-conducting component 700 for the flow of the heat-conducting medium. In specific implementations, the heat-conducting channel 710 can be formed by machining, die casting, welding and sealing, pipe embedding, or composite molding of sheet metal. The heat-conducting medium can be understood as a heat transfer material that can flow within the heat-conducting channel 710 and carry heat. In specific implementations, the heat-conducting medium can be a heat-conducting liquid, coolant, phase change working fluid, or other media with high thermal conductivity and flowability.

[0056] The heat-conducting channels 710 are equidistant from the outer contour of the heat-conducting component 700. This can be understood as the heat-conducting channels 710 being arranged along the overall extension of the heat-conducting component 700 and maintaining a relatively uniform distance from its outer edge. This structural design allows the heat-conducting medium to be distributed within the heat-conducting component 700 along the extension paths of the first heat-conducting section 701, the heat-conducting middle section 704, the second heat-conducting section 702, and the third heat-conducting section 703. This avoids situations where the heat-conducting channels 710 are too close to the outer wall, resulting in insufficient structural strength, and also avoids situations where the heat-conducting channels 710 are too far from the outer wall, resulting in an excessively long heat transfer path. Therefore, the heat-conducting component 700 maintains good structural reliability while allowing the internal heat-conducting medium to absorb and diffuse heat from the first heat source 610 relatively uniformly.

[0057] Furthermore, such as Figures 11 to 12As shown, the heat-conducting channel 710 includes a heat-conducting cavity 713 positioned corresponding to the first heat source 610, a first channel 711 communicating with one side of the heat-conducting cavity 713, and a second channel 712 communicating with the other side of the heat-conducting cavity 713. The heat-conducting cavity 713 can be understood as a heat-extraction cavity in the heat-conducting channel 710 corresponding to the first heat source 610, primarily used to create a large medium-containing space near the first heat source 610, allowing the heat-conducting medium to concentrate heat absorption in the high-temperature region of the first heat source 610. The first channel 711 can be understood as a branch channel disposed within the first heat-conducting section 701, used to guide the heat-conducting medium to the side closer to the blower structure 200; the second channel 712 can be understood as a branch channel disposed within the second heat-conducting section 702 and the third heat-conducting section 703, used to guide the heat-conducting medium to the side away from the blower structure 200 and closer to the air outlet channel 500.

[0058] Specifically, a first flow channel 711 is formed in a first heat-conducting section 701. The inlet of the first flow channel 711 is located on a cavity surface of the heat-conducting cavity 713 away from the partition surface 002, and the outlet of the first flow channel 711 is located on a cavity surface of the heat-conducting cavity 713 close to the partition surface 002. A second flow channel 712 is formed in a second heat-conducting section 702 and a third heat-conducting section 703. The inlet of the second flow channel 712 is located on another cavity surface of the heat-conducting cavity 713 close to the partition surface 002, and the outlet of the second flow channel 712 is located on another cavity surface of the heat-conducting cavity 713 away from the partition surface 002. By staggering the inlet and outlet as described above, the first flow channel 711 and the second flow channel 712 can form medium flow paths on different sides of the heat-conducting cavity 713, respectively. After being heated, the heat-conducting medium can flow along the first flow channel 711 and the second flow channel 712 to different extension areas of the heat-conducting component 700, thereby carrying the heat at the heat-conducting cavity 713 to the first heat-conducting part 701, the second heat-conducting part 702 and the third heat-conducting part 703, respectively, forming a multi-directional heat diffusion effect.

[0059] In this embodiment, baffles 714 are spaced apart at the outlet of the heat-conducting cavity 713 corresponding to the first flow channel 711, and baffles 714 are also spaced apart at the outlet of the heat-conducting cavity 713 corresponding to the second flow channel 712. Specifically, the baffles 714 can be protrusions, baffle ribs, flow guides, or partial baffles integrally formed with the heat-conducting component 700. By setting baffles 714 at the outlets of the first flow channel 711 and the second flow channel 712, since the heat-conducting medium flows towards easily diffused locations when heated, the position of the baffles 714 is unfavorable for the heat-conducting medium to move from the heat-conducting cavity 713 to the flow channel, ensuring that the inlet of the heat-conducting flow channel is always the inlet and the outlet of the heat-conducting flow channel is always the outlet, thus clearly defining the flow direction of the heat-conducting medium in this embodiment.

[0060] Therefore, this embodiment provides a heat-conducting channel 710 within the heat-conducting component 700, and further divides the heat-conducting channel 710 into a heat-conducting cavity 713, a first channel 711, and a second channel 712, enabling the heat-conducting component 700 to possess a medium-borne heat diffusion capability on top of solid heat conduction. This embodiment can utilize a flowable heat-conducting medium to more quickly disperse heat from the first heat source 610 to the distal region of the heat-conducting component 700, and achieve composite heat dissipation by combining the airflow within the first air duct 300 and the exhaust path near the outlet air duct 500, thereby further improving the heat dissipation efficiency and temperature uniformity of the first heat source 610.

[0061] In a preferred embodiment of this invention, the portion where the first heat-conducting part 701 is connected to the heat-conducting middle part 704 is inclined relative to the air outlet direction, and the portion where the second heat-conducting part 702 is connected to the heat-conducting middle part 704 is also inclined relative to the air outlet direction. Furthermore, both the portions where the first heat-conducting part 701 and the heat-conducting middle part 704 are connected and the portions where the second heat-conducting part 702 and the heat-conducting middle part 704 are connected are inclined in a direction away from the mounting surface 001. There are two heat-conducting elements 700, symmetrically arranged with respect to the partition surface 002. The partition surface 002 is perpendicular to the mounting surface 001 and passes through the centerline of the first heat source 610. The second heat-conducting part 702 extends in a direction parallel to the partition surface 002, and the third heat-conducting part 703 extends in a direction perpendicular to the partition surface 002. A heat-conducting component 700 has a heat-conducting channel 710 formed within it. The heat-conducting channel 710 is equidistant from the outer contour of the heat-conducting component 700 and is filled with a flowable heat-conducting medium. The heat-conducting channel 710 includes a heat-conducting cavity 713 positioned corresponding to the first heat source 610, a first channel 711 communicating with one side of the heat-conducting cavity 713, and a second channel 712 communicating with the other side of the heat-conducting cavity 713. The first channel 711 is formed within the first heat-conducting part 701. The inlet of the first channel 711 is located on a cavity surface of the heat-conducting cavity 713 away from the partition surface 002, and the outlet of the first channel 711 is located on a cavity surface of the heat-conducting cavity 713 close to the partition surface 002. The heat-conducting cavity 713 is provided with baffles 714 at intervals at the outlet of the first flow channel 711; the second flow channel 712 is opened in the second heat-conducting part 702 and the third heat-conducting part 703, the inlet of the second flow channel 712 is located on another cavity surface of the heat-conducting cavity 713 near the partition surface 002, and the outlet of the second flow channel 712 is located on another cavity surface of the heat-conducting cavity 713 away from the partition surface 002, and the heat-conducting cavity 713 is provided with baffles 714 at intervals at the outlet of the second flow channel 712.

[0062] Through the above preferred embodiment, a composite heat dissipation structure with raised ends, symmetrical double parts, and internal flow channel circulation is formed within the original plate-shaped extension space of the heat-conducting component 700. Specifically, the portions of the first heat-conducting part 701 and the second heat-conducting part 702 connected to the heat-conducting middle part 704 are all inclined in a direction away from the mounting surface 001, so that the heat-conducting medium can flow to the upward inclined channels on both sides after being heated.

[0063] Meanwhile, the two heat-conducting components 700 are symmetrically arranged with the partition surface 002 as a reference. The partition surface 002 is perpendicular to the mounting surface 001 and passes through the centerline of the first heat source 610. Therefore, the heat-conducting cavities 713 of the two heat-conducting components 700 can be arranged close to both sides of the central region of the first heat source 610. When the first heat source 610 is working, its central region is usually the region with the highest temperature. In this embodiment, through the symmetrical arrangement of the two heat-conducting components 700, the heat generated in the central region of the first heat source 610 can be applied to the heat-conducting cavity 713 region of the two heat-conducting components 700 close to the partition surface 002 respectively and accurately, so that the heat-conducting medium in the heat-conducting cavity 713 close to the partition surface 002 is preferentially heated. Since the inlet of the second flow channel 712 is located on another cavity surface of the heat-conducting cavity 713 near the partition surface 002, when the heat from the central region of the first heat source 610 is concentrated on the position of the heat-conducting cavity 713 near the partition surface 002, the temperature of the heat-conducting medium at this position increases and its density decreases after being heated, and it is easier to enter the second flow channel 712 under the influence of temperature and density differences. In other words, the symmetrical arrangement of the two heat-conducting elements 700 is not only used to evenly diffuse the heat from the first heat source 610 to both sides, but also to form a more accurate thermal correspondence between the high-temperature region at the center of the first heat source 610 and the inlet region of the second flow channel 712, thereby matching the heated position of the heat-conducting medium with the predetermined flow direction, improving the reliability and flow continuity of the heat-conducting medium entering the second flow channel 712.

[0064] Next, since the second flow channel 712 is formed in the second heat-conducting part 702 and the third heat-conducting part 703, and the second heat-conducting part 702 extends in a direction parallel to the partition surface 002, while the third heat-conducting part 703 extends in a direction perpendicular to the partition surface 002, the heated heat-conducting medium, after entering the second flow channel 712, can first carry the heat away from the central high-temperature region of the first heat source 610 along the second heat-conducting part 702, and then diffuse towards the lateral region of the shell 100 along the third heat-conducting part 703. Therefore, the concentrated heat in the central region of the first heat source 610 does not rely solely on the slow diffusion of the solid heat-conducting element 700, but can be transported more quickly to a location away from the central high-temperature region through the directional flow of the heat-conducting medium, thereby reducing the risk of heat accumulation in the central region of the first heat source 610.

[0065] Subsequently, the heat-conducting medium returns to the heat-conducting cavity 713 away from the partition surface 002 through the gap between the baffle 714 and the outlet of the second flow channel 712, and can continue to enter the first flow channel 711. After passing through the first heat-conducting part 701, it returns to the heat-conducting cavity 713 near the partition surface 002 through the gap between the baffle 714 and the outlet of the first flow channel 711. At this time, the heat-conducting medium returns to the high-temperature heat-extracting position corresponding to the central region of the first heat source 610, and can absorb the heat transferred from the central region of the first heat source 610 again, and continue to enter the second flow channel 712, thereby forming a circulating heat extraction and heat expansion path around the central high-temperature region of the first heat source 610.

[0066] Therefore, the symmetrical arrangement of the two heat-conducting elements 700 in this embodiment not only enables the bilateral diversion of heat from the first heat source 610, but also ensures that the central high-temperature region of the first heat source 610 accurately corresponds to the region of the heat-conducting cavity 713 near the partition surface 002. This allows the central heat to preferentially act on the heat-conducting medium within this region, and promotes the heat-conducting medium to enter the second flow channel 712 for heat transport. This structure ensures that the flow of the heat-conducting medium no longer relies solely on random heat diffusion within the internal space of the heat-conducting element 700, but rather forms a more defined path of heating, inflow, diffusion, and return around the central high-temperature region of the first heat source 610, thereby improving the circulation heat exchange efficiency of the heat-conducting medium.

[0067] Through the above preferred embodiment, the heat-conducting component 700 does not improve heat dissipation capacity by simply increasing its thickness or adding an external heat sink. Instead, it forms a composite heat dissipation structure with both ends raised, symmetrical, and internally circulating flow channels within the original plate-like extension space of the heat-conducting component 700. The raised ends of the heat-conducting component 700 reduce the vertical space occupation. The symmetrical arrangement of the two heat-conducting components 700 allows the heat from the center of the first heat source 610 to be accurately applied to the heat-conducting medium. The folded extensions of the second heat-conducting part 702 and the third heat-conducting part 703 can fully utilize the flat space within the housing 100. The heat-conducting flow channels 710 and the flowable heat-conducting medium can enhance the diffusion and transport of heat within the heat-conducting component 700. The above structures work together to improve the heat dissipation efficiency of the first heat source 610 within a relatively small housing 100 space without adding an additional fan, independent pump, or large-volume heat sink fins, thereby achieving both a miniaturized layout and good heat dissipation effect for the host heat dissipation structure.

[0068] In some optional embodiments of this example, there are multiple second heat sources 620, which are arranged vertically at intervals on the side of the blower structure 200 away from the mounting surface 001. The second heat sources 620 can be understood as auxiliary heating devices within the housing 100 other than the first heat source 610. Specifically, the second heat sources 620 can be multiple hard drives, multiple storage modules, multiple communication modules, or multiple functional modules with relatively low power consumption. The multiple second heat sources 620 being arranged vertically at intervals can be understood as the multiple second heat sources 620 being arranged in layers along the height direction of the housing 100, with a space between adjacent second heat sources 620 for airflow.

[0069] Example 2: This embodiment provides a mini-PC, which includes the PC heat dissipation structure described in Embodiment 1. A mini-PC can be understood as a computing device smaller than a conventional desktop PC with a more compact internal space. In specific implementations, a mini-PC can be an office mini-PC, an edge computing host, an industrial control mini-PC, or a small data processing terminal.

[0070] like Figures 1 to 4 As shown, in this embodiment, the mini-PC has a first heat source 610 in the first air duct 300 of the PC heat dissipation structure and a second heat source 620 in the second air duct 400 of the PC heat dissipation structure. The first heat source 610 can be a CPU chip, and the second heat source 620 can be a hard drive. The CPU chip can be understood as the core component of the mini-PC that performs the main computing functions and generates relatively high heat. In specific implementations, the CPU chip can also be replaced by a main control SoC, a graphics processing chip, or a high-performance computing unit. The hard drive can be understood as a device used to store data in the mini-PC. In specific implementations, the hard drive can be a solid-state drive, a hard disk drive, a storage expansion module, or other storage devices.

[0071] Example 3: This embodiment provides a data processing device, which includes the host heat dissipation structure described in Embodiment 1. A data processing device can be understood as an electronic device used to perform data computation, data storage, data forwarding, data analysis, or edge computing processing. In specific implementations, the data processing device can be an edge computing device, an industrial data acquisition device, a network data processing terminal, a small server, an artificial intelligence inference device, or other electronic devices with multiple heat source heat dissipation requirements. Since such data processing devices typically need to house processing chips, storage modules, communication modules, and interface circuits within a relatively compact housing 100, and are often in a state of continuous operation for extended periods, their heat dissipation structure not only needs to meet the heat dissipation requirements of high heat sources but also needs to ensure stable heat dissipation from multiple auxiliary heat sources.

[0072] In this embodiment, the data processing device has a first heat source 610 in the first air duct 300 of the host heat dissipation structure and a second heat source 620 in the second air duct 400 of the host heat dissipation structure. The first heat source 610 can be understood as a high-heat-generating device in the data processing device that performs the main data processing or control functions. Specifically, the first heat source 610 can be a CPU chip, a main control SoC, an AI computing chip, a graphics processing chip, or other high-computing-power processing unit. The second heat source 620 can be understood as an auxiliary heat-generating device in the data processing device that works in conjunction with the first heat source 610. Specifically, the second heat source 620 can be a hard drive, a storage module, a communication module, a network interface module, or other functional modules with relatively low power consumption but requiring stable heat dissipation.

[0073] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

[0074] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0075] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A host heat dissipation structure, characterized in that, include: A housing (100) is disposed on a mounting surface (001) and is provided with a first air inlet (101), a second air inlet (102) and an air outlet (103). The first air inlet (101) is disposed on a first surface (1001) of the housing (100) opposite to the mounting surface (001), and the second air inlet (102) is disposed on a second surface (1002) of the housing (100) that is not coplanar with the first surface (1001). A blower structure (200) is disposed within the housing (100) and includes a first airflow inlet (201), a second airflow inlet (202), and a collecting airflow outlet (203). The first air duct (300) is connected between the first air inlet (101) and the first airflow inlet (201) and is configured to pass through the first heat source (610). The second air duct (400), connected between the second air inlet (102) and the second airflow inlet (202), is configured to pass through the second heat source (620). An air outlet duct (500) is connected between the collected airflow outlet (203) and the air outlet (103).

2. The host heat dissipation structure according to claim 1, characterized in that, The heat of the first heat source (610) is greater than that of the second heat source (620); a heat-conducting element (700) is provided in the first air duct (300), the heat-conducting element (700) is attached to the end of the first heat source (610) away from the mounting surface (001); the wall surface of the heat-conducting element (700) away from the mounting surface (001) is at least partially in contact with the outer wall surface of the air outlet duct (500).

3. The host heat dissipation structure according to claim 2, characterized in that, Along the air outlet direction, one end of the heat-conducting element (700) extends in a direction close to the blower structure (200), such that one end of the heat-conducting element (700) is located on one side of the blower structure (200) in the vertical direction; the other end of the heat-conducting element (700) extends in a direction away from the blower structure (200), such that the other end of the heat-conducting element (700) is at least partially in contact with the outer wall surface of the air outlet channel (500).

4. The host heat dissipation structure according to claim 3, characterized in that, Along the vertical direction, the projected area of ​​the other end of the heat-conducting element (700) is greater than the projected area of ​​one end of the heat-conducting element (700).

5. A host heat dissipation structure according to claim 3, characterized in that, The heat-conducting component (700) includes a first heat-conducting part (701), a second heat-conducting part (702), and a heat-conducting middle part (704) in contact with the first heat source (610). The first heat-conducting part (701) extends from the heat-conducting middle part (704) in a direction close to the blower structure (200). The second heat-conducting part (702) extends from the heat-conducting middle part (704) in a direction away from the blower structure (200). The end of the second heat-conducting part (702) away from the heat-conducting middle part (704) is also connected to a third heat-conducting part (703). The third heat-conducting part (703) extends in a horizontal direction, which is perpendicular to the vertical direction and the air outlet direction. The second heat-conducting part (702) forms the other end of the heat-conducting component (700).

6. The host heat dissipation structure according to claim 5, characterized in that, The portion of the first heat-conducting part (701) connected to the heat-conducting middle part (704) is inclined relative to the air outlet direction, and the portion of the second heat-conducting part (702) connected to the heat-conducting middle part (704) is inclined relative to the air outlet direction. The portions of the first heat-conducting part (701) connected to the heat-conducting middle part (704) and the portions of the second heat-conducting part (702) connected to the heat-conducting middle part (704) are both inclined in a direction away from the mounting surface (001).

7. A host heat dissipation structure according to claim 5, characterized in that, There are two heat-conducting components (700), which are symmetrically arranged with respect to the partition surface (002). The partition surface (002) is perpendicular to the mounting surface (001) and passes through the centerline of the first heat source (610). The second heat-conducting part (702) extends in a direction parallel to the partition surface (002), and the third heat-conducting part (703) extends in a direction perpendicular to the partition surface (002).

8. A host heat dissipation structure according to claim 7, characterized in that, The heat-conducting component (700) has a heat-conducting channel (710) inside, and the heat-conducting channel (710) is equidistant from the outer contour of the heat-conducting component (700). The heat-conducting channel (710) is filled with a flowable heat-conducting medium.

9. A mini PC, characterized in that, The host heat dissipation structure includes any one of claims 1-8, wherein a first heat source (610) is provided in the first air duct (300) of the host heat dissipation structure, and a second heat source (620) is provided in the second air duct (400) of the host heat dissipation structure.

10. A data processing device, characterized in that, The host heat dissipation structure includes any one of claims 1-8, wherein a first heat source (610) is provided in the first air duct (300) of the host heat dissipation structure, and a second heat source (620) is provided in the second air duct (400) of the host heat dissipation structure.

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