A TRIZ-based electromechanical three-dimensional stacked integrated module layout auxiliary teaching method and system, electronic equipment and readable storage medium

Abstract

The application provides a TRIZ-based electromechanical three-dimensional stacked integrated module layout auxiliary teaching method and system, electronic equipment and readable storage medium, and relates to the technical field of three-dimensional structure processing. The method comprises the following steps: S1: input the performance constraint conditions and plane layout data of a target electromechanical three-dimensional stacked integrated module through an intelligent terminal; S2: input the plane layout data into an analysis model for processing to obtain corresponding physical contradiction data; S3: match the physical contradiction data with a TRIZ separation principle rule base to obtain a corresponding first matching result, and convert the plane layout data according to the first matching result to obtain a corresponding multi-layer stacked layout; and S4: match the multi-layer stacked layout with the example knowledge database to obtain a corresponding second matching result, and generate a candidate interlayer vertical stacked topology structure according to the second matching result. The application realizes the visualization of the reasoning process.

Description

Technical Field

[0001] This invention relates to the field of three-dimensional structure processing technology, and more specifically to a TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching method, system, electronic device, and readable storage medium. Background Technology

[0002] Currently, TRIZ (Teoriya Resheniya Izobretatelskikh Zadach, the Theory of Inventive Problem Solving) is a systematic innovation methodology developed by inventor Genrich Altshuller and his colleagues after analyzing millions of high-value invention patents. Its core tools include technical contradictions, physical contradictions, the separation principle, function-oriented search, and contradiction matrices, and it has been widely applied to innovative design in engineering fields such as mechanical, electronic, and chemical engineering.

[0003] However, in the teaching practice of innovative design courses in universities (such as related electronic and mechanical innovative design practices), TRIZ theory is usually taught primarily through lectures. Students find it difficult to quickly transfer abstract separation principles, function-oriented search, and other tools to the generation of solutions for specific technical problems. Current teaching lacks interactive and automated computer-aided tools, resulting in a long learning cycle and poor application effectiveness for the TRIZ method. In recent years, the influence of TRIZ in the engineering field has weakened, partly due to misunderstandings that it is oversimplified as a lookup table tool, and the impact of emerging methods (such as design thinking).

[0004] On the other hand, in the field of engineering technology (such as 3D chip stacking, 3D layout of mechanical modules, and microelectromechanical system integration), how to improve system performance by increasing spatial dimensions without relying on higher precision manufacturing processes is a common design challenge. Traditional design methods rely on engineers' experience and lack a systematic innovation generation process.

[0005] Therefore, how to provide a TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching method that can solve the above problems is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] In view of this, the present invention provides a teaching method, system, electronic device and readable storage medium for layout of electromechanical three-dimensional stacked integrated modules based on TRIZ. It transforms TRIZ from a divergent tool that provides innovative directions into a convergent design tool that outputs three-dimensional stacked structure parameters, and realizes the visualization of the reasoning process through the teaching assistance system.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A TRIZ-based teaching method for layout-assisted electromechanical three-dimensional stacked integrated modules includes the following steps: S1: The teacher inputs the performance constraints of the target electromechanical three-dimensional stacked integrated module through the smart terminal, and the student inputs the planar layout data of the target electromechanical three-dimensional stacked integrated module through the smart terminal; S2: The intelligent terminal constructs an analysis model and inputs the planar layout data into the analysis model for processing to obtain the corresponding physical contradiction data; S3: Construct a TRIZ separation principle rule base, match the physical contradiction data with the TRIZ separation principle rule base to obtain the corresponding first matching result, and transform the planar layout data according to the first matching result to obtain the corresponding multi-layer stacked layout; S4: Construct an instance knowledge database, match the multi-layer stacked layout with the instance knowledge database to obtain the corresponding second matching result, and generate a candidate inter-layer vertical stacking topology based on the second matching result; S5: Process the candidate interlayer vertical stacking topology and output a three-dimensional stacking structure scheme.

[0008] Preferably, S3 includes: S31: Construct a TRIZ separation principle rule base, wherein the TRIZ separation principle rule base includes preset spatial separation rules, preset temporal separation rules, preset conditional separation rules, preset hierarchical separation rules, as well as spatial separation topology transformation templates, temporal separation topology transformation templates, conditional separation topology transformation templates, and hierarchical separation topology transformation templates; S32: Match the physical contradiction data with the preset spatial separation rule, preset temporal separation rule, preset conditional separation rule, and preset hierarchical separation rule to obtain the corresponding first matching result; S33: Select the corresponding transformation template based on the first matching result; S34: The planar layout data is transformed according to the selected transformation template to obtain the corresponding multi-layer stacked layout.

[0009] Preferably, S4 includes: S41: Construct an instance knowledge database, wherein each instance in the instance knowledge database includes labels from different domains, two-dimensional constraint descriptions, and three-dimensional extended structures; S42: Use the first matching result to match in the instance knowledge database to obtain the corresponding second matching result, and use the second matching result to extract general transformation rules; S43: Map the planar layout data using the general transformation rules to generate candidate inter-layer vertical stacking topology.

[0010] Preferably, S4 further includes: S44: The multi-layer stacked layout is refined using a preset TRIZ contradiction matrix table.

[0011] Preferred options also include: S6: Perform simulation evaluation on the three-dimensional stacked structure scheme, and iteratively optimize the analysis model based on the evaluation results.

[0012] Preferably, S6 includes: S61: Simulate and evaluate the three-dimensional stacked structure scheme and calculate the optimization index; S62: Iteratively optimize the analysis model based on the optimization indicators.

[0013] This invention also provides a TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching system, comprising: The smart terminal is used to receive floor plan layout parameters and performance constraints input by teachers and students. The physical contradiction identification module is used to construct an analysis model and input the planar layout data into the analysis model for processing to obtain the corresponding physical contradiction data; The separation principle rule base and transformation module are used to construct the TRIZ separation principle rule base, match the physical contradiction data with the TRIZ separation principle rule base to obtain the corresponding first matching result, and transform the planar layout data according to the first matching result to obtain the corresponding multi-layer stacked layout. The function-oriented search module constructs an instance knowledge database, matches the multi-layer stacked layout with the instance knowledge database to obtain the corresponding second matching result, and generates a candidate inter-layer vertical stacking topology based on the second matching result. The scheme output module is used to process the candidate interlayer vertical stacking topology and output a three-dimensional stacking structure scheme. The evaluation module is used to perform simulation evaluation on the three-dimensional stacked structure scheme and to iteratively optimize the analysis model based on the evaluation results. The report generation module is used to record the operation paths and scheme selections of teachers and students on the smart terminal, and generate learning or design analysis reports.

[0014] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the method described in any of the preceding claims.

[0015] The present invention also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method described in any of the preceding claims.

[0016] As can be seen from the above technical solution, compared with the prior art, the present invention discloses a TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching method, system, electronic device, and readable storage medium, which has the following beneficial effects: 1. Teaching Benefits: This system transforms abstract TRIZ principles such as separation, function-oriented search, and contradiction matrices into a visual, interactive computer-aided deduction process. Students can intuitively understand the systematic generation logic of 3D stacking solutions by inputting parameters and observing the automatic reasoning process, significantly lowering the learning threshold and enhancing the cultivation of innovative design capabilities. Teaching experiments have verified that students using this system demonstrate approximately a 35% higher accuracy rate in understanding the TRIZ "dimensionality change" principle compared to traditional lecture-based groups, and a 40% reduction in design solution generation time. 2. Design Automation: Solves the problem of relying on manual trial and error for 3D stacking solutions in engineering design, and provides a fully automated process from physical contradiction identification to solution output; 3. Cross-domain knowledge transfer: Through a built-in cross-domain analogy example knowledge base, it automatically introduces mature "2D→3D" solutions from architecture, transportation, warehousing, and even the biological world, broadening design thinking. This reflects the core concept of TRIZ theory: "A problem in one field already has a solution in another field." 4. High versatility: It is not only applicable to three-dimensional chip stacking, but can also be extended to mechanical engineering fields such as three-dimensional layout of mechanical modules, integration of MEMS devices, and compact design of robot joints; 5. Iterative optimization: Supports simulation evaluation and feedback iteration to continuously improve the quality of the solution. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] Figure 1 The overall flowchart of a TRIZ-based electromechanical three-dimensional stacked integrated module layout auxiliary teaching method provided by the present invention; Figure 2 A schematic diagram comparing the connection path length of chip wiring planar layout and vertical stacking provided in an embodiment of the present invention; Figure 3A schematic diagram illustrating instance retrieval and mapping of a cross-domain analogy knowledge base provided in an embodiment of the present invention; Figure 4 A schematic diagram illustrating the change in dimension #17 of the contradiction matrix lookup table provided in an embodiment of the present invention; Figure 5 A schematic diagram of the user interface of the teaching assistance system provided in an embodiment of the present invention; Figure 6 The present invention provides a structural principle block diagram of a TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching system. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Example 1

[0021] See Figure 1 As shown in the figure, this invention discloses a TRIZ-based method for assisting in the layout of electromechanical three-dimensional stacked integrated modules, implemented through a smart terminal, and includes the following steps: S1: The teacher inputs the performance constraints of the target electromechanical three-dimensional stacked integrated module through the smart terminal, and the student inputs the planar layout data of the target electromechanical three-dimensional stacked integrated module through the smart terminal. The performance constraints may include distance constraints for inter-unit communication or connection, upper limits of performance indicators (such as signal delay, force transmission time, fluid resistance, etc.), and limitations of available manufacturing processes or assembly space. S2: The intelligent terminal constructs an analysis model and inputs the planar layout data into the analysis model for processing to obtain the corresponding physical contradiction data; S3: Construct a TRIZ separation principle rule base, match the physical contradiction data with the TRIZ separation principle rule base to obtain the corresponding first matching result, and transform the planar layout data according to the first matching result to obtain the corresponding multi-layer stacked layout; S4: Construct an instance knowledge database, match the multi-layer stacked layout with the instance knowledge database to obtain the corresponding second matching result, and generate a candidate inter-layer vertical stacking topology based on the second matching result; S5: Process the candidate interlayer vertical stacking topology and output a three-dimensional stacking structure scheme.

[0022] In one specific embodiment, S2 includes: (1) Construct an analysis model and input the planar layout data into the analysis model for processing. The analysis model can be implemented by a causal chain analysis module. Specifically, the causal chain analysis module can be a state machine model based on causal relationships (Cause-Effect Chains Analysis, CECA). (2) Calculate the ratio of the delay (or resistance, time) of the in-plane connection path to the inherent switching time of the unit through the causal chain analysis module; (3) When the ratio exceeds a preset threshold and the planar path length cannot be further shortened, a physical contradiction data is generated, which includes: First attribute: The connection path must be long (constrained by the system's physical dimensions and interface layout). Second attribute: The connection path must be short (to meet high performance requirements). See [link / details] for specific results. Figure 2 As shown.

[0023] In one specific embodiment, S3 includes: S31: Construct a TRIZ separation principle rule base, wherein the TRIZ separation principle rule base includes preset spatial separation rules, preset temporal separation rules, preset conditional separation rules, preset hierarchical separation rules, as well as spatial separation topology transformation templates, temporal separation topology transformation templates, conditional separation topology transformation templates, and hierarchical separation topology transformation templates; S32: Match the physical contradiction data with the preset spatial separation rule, preset temporal separation rule, preset conditional separation rule, and preset hierarchical separation rule to obtain the corresponding first matching result; S33: Select the corresponding transformation template based on the first matching result and trigger the transformation template from low dimension to high dimension; S34: The planar layout data is transformed according to the selected transformation template to obtain the corresponding multi-layer stacked layout. The transformation template automatically outputs: the current two-dimensional planar layout is transformed into a multi-layer stacked layout, and the original horizontal connection path is split into horizontal segments and vertical segments, wherein the vertical segments are realized through inter-layer connection structures (such as through holes, columns, flexible hinges, etc.).

[0024] In one specific embodiment, S4 includes: S41: Construct an instance knowledge database, wherein each instance in the instance knowledge database includes labels from different domains, two-dimensional constraint descriptions, and three-dimensional extended structures; S42: Use the first matching result to match in the instance knowledge database to obtain the corresponding second matching result, and use the second matching result to extract general transformation rules. See the details below. Figure 3 As shown; S43: Map the planar layout data using the general transformation rules to generate candidate inter-layer vertical stacking topology structures, wherein the candidate inter-layer vertical stacking topology structures include the number of stacking layers, the sub-module division carried by each layer, the layout density and position of the inter-layer connection structure, and the inter-layer connection protocol or constraint conditions.

[0025] In one specific embodiment, S4 further includes: S44: The candidate inter-layer vertical stacking topology is refined using a preset TRIZ contradiction matrix table. The specific implementation process includes: (1) The improvement parameter is predefined as "speed of moving objects" or "productivity", and the deterioration parameter is the volume or shape of stationary objects. In the chip design scenario, "speed of moving objects" can be understood as either signal transmission speed or data processing speed, which is a cross-domain standard mapping of TRIZ parameters. (2) Query the preset TRIZ contradiction matrix table to obtain the recommended invention principle code, which includes at least the #17 dimension change. For details, please refer to [link to relevant documentation]. Figure 4 As shown; (3) Based on the #17 dimensional change principle, strengthen the transformation template and the stacking direction of the vertical stacking topology output between candidate layers, and optionally generate specific suggestions for dividing the system into multiple sub-modules and stacking them vertically based on the #1 segmentation principle and the #5 merging principle.

[0026] In one specific embodiment, it also includes: S6: Perform simulation evaluation on the three-dimensional stacked structure scheme, and iteratively optimize the analysis model based on the evaluation results.

[0027] In one specific embodiment, S6 includes: S61: Simulate and evaluate the three-dimensional stacked structure scheme and calculate the optimization index; S62: Iteratively optimize the analysis model based on the optimization indicators.

[0028] See Figure 6 As shown, this embodiment of the invention also provides a system for teaching the layout-assisted teaching method of electromechanical three-dimensional stacked integrated modules based on TRIZ as described in any of the above embodiments, comprising: The smart terminal is used to receive floor plan layout parameters and performance constraints input by teachers and students. The physical contradiction identification module is used to construct an analysis model and input the planar layout data into the analysis model for processing to obtain the corresponding physical contradiction data; The separation principle rule base and transformation module are used to construct the TRIZ separation principle rule base, match the physical contradiction data with the TRIZ separation principle rule base to obtain the corresponding first matching result, and transform the planar layout data according to the first matching result to obtain the corresponding multi-layer stacked layout. The function-oriented search module constructs an instance knowledge database, matches the multi-layer stacked layout with the instance knowledge database to obtain the corresponding second matching result, and generates a candidate inter-layer vertical stacking topology based on the second matching result. The scheme output module is used to process the candidate interlayer vertical stacking topology and output a three-dimensional stacking structure scheme. The evaluation module is used to perform simulation evaluation on the three-dimensional stacked structure scheme and to iteratively optimize the analysis model based on the evaluation results. The report generation module is used to record the operation paths and scheme selections of teachers and students on the smart terminal, and generate learning or design analysis reports.

[0029] Specifically, animations or diagrams dynamically displaying the physical contradiction generation process, spatial separation rule matching process, and cross-domain analogy instance retrieval process via smart terminals are provided. See the relevant user interface for details. Figure 5 As shown.

[0030] This invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the method described in any of the above embodiments.

[0031] This invention also provides a computer-readable storage medium having a computer program stored thereon, wherein the program, when executed by a processor, implements the method described in any of the above embodiments.

[0032] Example 2

[0033] The process of the method provided in Specific Application Example 1 is as follows: 1. Taking an AI inference chip limited by mature process technology (such as 28nm planar process) as an example, the input parameters are: area 200mm², critical path delay 5ns, and planar wiring delay accounts for 70% of the total signal delay.

[0034] The smart terminal executes step S2, calculates that the wiring delay accounts for 70%, which exceeds the threshold of 0.5, and the planar path length is limited by the chip's physical size and cannot be further shortened, generating a physical contradiction: the critical signal path must be long (constrained by the chip's I / O layout and physical size), while at the same time it must be short (to meet the low latency performance requirements). Access the TRIZ separation principle rule base and output a two-layer stacked template: split the original planar layout into upper and lower layers, and split the horizontal connection path into horizontal segments and vertical segments; Searching the instance knowledge database, we found an automated storage and retrieval system instance that demonstrates how to achieve rapid access to more storage locations within a limited floor area through vertical expansion. This is mapped to chip design and generates a two-layer stacked TSV (through silicon via) array solution. Querying the preset TRIZ contradiction matrix table (improving #14 "speed", worsening #9 "shape") yields #17 "dimensional change", #7 "overlapping", and #15 "dynamics". Based on this, the single chip is divided into four dies, stacked in two layers, with two dies per layer.

[0035] Step S6 output: Number of stacked layers = 2, TSV density = 5000 particles / mm², each layer carries 2 core particles. See details for specific results. Figure 2 As shown.

[0036] Step S7 Simulation: The equivalent critical path length is shortened to 1 / 20 of the planar layout, the delay is reduced to 0.9ns, and the performance is improved by about 5.6 times.

[0037] Example 2 (Application of Three-Dimensional Layout of Mechanical Modules)

[0038] In the compact design of robot joints, multiple sensors, drivers and control circuit modules need to be arranged within a limited planar area, and the length of the signal lines between modules causes delays.

[0039] Using the method of this invention: input planar layout parameters (100mm×100mm area, 5 functional modules, high-speed communication required between modules).

[0040] Step S2 identifies physical contradictions—the wires must be long (due to the dispersed layout of the modules) and short (to reduce signal delay).

[0041] Step S3 triggers spatial separation, generating a two-layer stacking scheme.

[0042] Step S4 matches the knowledge base to the "skyscraper" example—accommodating more functional space through vertical expansion on a limited land area. This is mapped to layering control circuitry on top of the drive layer, vertically connected via flexible circuit boards.

[0043] Step S5 involves checking the contradiction matrix to obtain the #17 "dimensional change" principle, which strengthens the stacking direction.

[0044] Step S6 output scheme: number of stacking layers = 2, vertical connection column layout density 200 / cm².

[0045] Simulation results show that signal delay is reduced by 42% and the area occupied by the plane is reduced by approximately 45%.

[0046] Example 3 (Teaching Application)

[0047] The method provided in this invention is encapsulated into a TRIZ innovative design-assisted teaching system and deployed in the computer laboratory of the mechanical innovative design practice course. The specific process is as follows: ① The teacher sets the following constraints: Five functional modules are arranged in a 100mm×100mm planar area. High-speed communication is required between the modules. The signal transmission delay must be minimized, and higher precision manufacturing processes cannot be used. ②Students input module coordinates, connection relationships, and delay constraints through the interactive interface; ③ The system automatically executes steps S2-S4 and displays them step by step: (1) Physical contradiction extraction: Dynamically display the contradiction generation process of connection paths being required to be long (due to the dispersion of modules) / short (to reduce latency); (2) Spatial separation rule matching: The prompt suggests that a third dimension can be introduced and an animation of the transformation from a two-dimensional planar layout to a three-dimensional stacked layout is displayed; (3) Cross-domain analogy retrieval: Simultaneously display the analogy chain animation of urban overpasses → skyscrapers → automated warehouses → 3D chips to help students understand the logic of function-oriented search; (4) Contradiction matrix lookup results: show the recommended invention principles and their meanings, such as "#17 Dimensional Change".

[0048] ④ The system outputs at least three candidate stacking schemes (two-layer stacking, three-layer stacking, and non-uniform stacking), and compares and displays indicators such as the equivalent path length reduction rate and the percentage of performance improvement.

[0049] ⑤ Select the optimal solution and write an analysis report as the basis for course assessment.

[0050] Example 4 (Cross-Domain Analogy Knowledge Base Extension)

[0051] In S4, the example knowledge database adds a honeycomb structure example from nature: honeycombs are arranged in hexagonal planes and then stacked vertically to achieve maximum space utilization with minimal material consumption. Mapping the honeycomb structure to chip design generates a non-uniform TSV array scheme, further shortening the critical path while ensuring heat dissipation. This example is particularly popular with students in teaching demonstrations, enhancing their interdisciplinary analogical thinking training.

[0052] Example 5 (Teaching Comparison Experiment)

[0053] To verify the teaching effectiveness of the method provided in the embodiments of the present invention, a comparative experiment was set up in the mechanical innovation design practice course. The experimental group (23 people) used the teaching assistance system of the present invention to complete the design task of a three-dimensional stacking scheme, while the control group (22 people) learned the same content by traditional lecture methods.

[0054] Experimental task: Design a three-dimensional stacking scheme for the given chip planar layout data (area 150mm², 5 functional modules, critical path delay constraint <1ns). The specific experimental results are shown in Table 1.

[0055] Table 1 Experimental Results

[0056] The results show that the method provided in this embodiment of the invention is significantly more effective than traditional lecture methods in teaching TRIZ theory.

[0057] Example 6 (Teaching and Verification of TRIZ Theory - Explanation of the Non-obviousness of the Reasoning Process)

[0058] To more fully illustrate the inventiveness of the method provided in the embodiments of the present invention, this embodiment elaborates in detail the non-obviousness of the method provided in the embodiments of the present invention relative to existing TRIZ-CAI systems from the perspective of TRIZ theory teaching.

[0059] 1. General characteristics of existing TRIZ-CAI systems: Existing TRIZ computer-aided innovation tools generally employ a generalized contradiction-solving framework. For example, PatSnap's TRIZAI Agent, a solution-finding tool, follows a technical path of functional analysis to identify problems → causal chain analysis to identify key defects → TRIZ methodology to generate R&D inspiration → refinement into experimental, implementable solutions. This is a general-purpose innovation aid tool applicable to all fields, and its output is divergent, domain-independent creative directions. Another example is the TRIZ-semantic fusion engine disclosed in patent CN121435962A, which uses knowledge graph-based contradiction solving to automatically generate innovative solutions from contradictions detected in the knowledge graph. Its technical solution is based on the DIKWP model's knowledge graph, integrating a TRIZ invention principle database, extracting semantic parameters for each contradiction point and mapping them to the TRIZ contradiction matrix index. This solution is also a domain-independent, general-purpose engine.

[0060] 2. Field-specific modifications of this invention: Compared with the prior art described above, the method provided in this invention anchors the TRIZ tool to the specific technical problem domain of three-dimensional stacked structure innovation, and has the following non-obvious domain adaptation features: (1) Precise identification of the problem domain: The method provided in this invention is not designed for all technical contradictions, but specifically addresses the specific functional requirement of achieving efficient connection or communication between multiple units within a limited two-dimensional area. The physical contradiction triggering condition—the ratio of the delay (or resistance) of the in-plane connection path to the inherent switching time of the unit exceeds a preset threshold, and the in-plane path length cannot be further shortened—is a quantitative judgment rule specifically designed for three-dimensional stacking scenarios, rather than the open contradiction input in general TRIZ software. While general TRIZ-CAI systems require users to manually input contradiction descriptions, the method provided in this invention achieves automatic quantitative identification of physical contradictions. This improvement requires specialized modeling of the path length-performance contradiction inherent in three-dimensional stacking problems.

[0061] (2) Targeted construction logic of the instance knowledge database: Existing TRIZ knowledge bases prioritize breadth (covering as many technical fields as possible), while the knowledge base provided in this embodiment prioritizes depth, organizing itself around a specific transformation pattern from 2D to 3D. Each instance in the knowledge base is abstracted according to the same functional template—achieving efficient connections or communication between multiple units within a limited two-dimensional area, and all satisfying the same transformation pattern: two-dimensional planar layout → three-dimensional spatial stacking, shortening passage / connection distances. This instance knowledge database structure, organized by transformation pattern rather than by technical field, is specifically designed for the three-dimensional stacking problem, unlike the general TRIZ knowledge base's organization by technical field or inventive principle.

[0062] (3) Multi-level specialization of the TRIZ toolchain: The method provided in this embodiment of the invention has undergone multi-level specialization modification of the TRIZ standard tool for three-dimensional stacking problems, as detailed below: A. Physical contradiction identification: The general implementation involves the user manually inputting a contradiction description; in embodiment S2 of this invention, the physical contradiction is automatically triggered when the delay / switching time ratio exceeds a threshold. This improvement transforms qualitative contradiction identification into a quantitative triggering rule, and is specifically designed for three-dimensional stacking problems.

[0063] B. Spatial Separation Principles: The general implementation provides textual descriptions of four separation principles; the specialized modification of this invention involves hard-binding the spatial separation rules to a transformation template from low-dimensional to high-dimensional, automatically outputting a multi-layer stacked layout. In general TRIZ, spatial separation can lead to various solutions (such as temporal separation and conditional separation). This invention fixes the transformation direction, which is a deliberate constraint for three-dimensional stacking problems.

[0064] C. Function-oriented search: The general implementation is to freely search in a general knowledge base; the specialization of this invention is to limit the search function to achieve efficient connection within a limited two-dimensional area and limit the output to the vertical stacking topology between layers. This dual limitation narrows the solution space and makes the scheme generation change from divergent to convergent.

[0065] D. Contradiction Matrix: The general implementation returns multiple inventive principle codes; the specialized modification of this invention embodiment forces the #17 dimension change as the core, with #1 splitting and #5 merging as optional supplements. The general matrix lookup table may return principles such as #7 nesting and #15 dynamicization. This invention prioritizes fixing #17 and constructs a stacking scheme around it.

[0066] (4) Deep integration of teaching scenarios

[0067] The core technology of existing TRIZ teaching aids lies in the digital presentation of content, rather than the visual deduction of the reasoning process. This invention deeply couples the three-dimensional stacking scheme generation process with the teaching and cognitive process: the system sequentially displays each step of the reasoning process, with each step's output being a necessary result of the previous step, forming a complete causal reasoning chain. Simultaneously, it can display animated analogy chains across disciplines, concretizing the abstract cross-disciplinary knowledge transfer process in TRIZ-guided searches. This pedagogical transformation requires balancing the logical rigor of TRIZ theory with the gradual progression of teaching and cognition; it is not simply a functional reduction of general TRIZ software.

[0068] 3. Non-obvious conclusions: In summary, this invention is not a simple application of known TRIZ software to a known domain, but rather a systematic and multi-layered specialization of the TRIZ toolchain specifically addressing the technical problem of 3D stacking. Existing technologies are all developing in a more general and broader direction, while the domain-focused and specialized modifications of this invention represent an unconventional technical approach. Such modifications are not found in existing technologies and are not obvious to those skilled in the art.

[0069] 4. Industrial applicability: The method provided in this invention can be packaged into independent teaching software, EDA tool plugins, or online experimental platforms. It is suitable for experimental teaching in mechanical, electronic, and innovative design courses at universities, and can also be used to assist innovative design in enterprise R&D departments. The core value of this invention lies in liberating TRIZ from the misconceptions that limit creative thinking, guiding creative thinking from "undirected divergence" to directed focus, and making referencing solutions from other fields no longer random inspiration, but an operational process. Under the challenges of physical limits, this systematic innovation methodology is more important than ever.

[0070] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0071] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A TRIZ-based teaching method for layout-assisted electromechanical three-dimensional stacked integrated modules, implemented via a smart terminal, characterized in that... Includes the following steps: S1: The teacher inputs the performance constraints of the target electromechanical three-dimensional stacked integrated module through the smart terminal, and the student inputs the planar layout data of the target electromechanical three-dimensional stacked integrated module through the smart terminal; S2: The intelligent terminal constructs an analysis model and inputs the planar layout data into the analysis model for processing to obtain the corresponding physical contradiction data; S3: Construct a TRIZ separation principle rule base, match the physical contradiction data with the TRIZ separation principle rule base to obtain the corresponding first matching result, and transform the planar layout data according to the first matching result to obtain the corresponding multi-layer stacked layout; S4: Construct an instance knowledge database, match the multi-layer stacked layout with the instance knowledge database to obtain the corresponding second matching result, and generate a candidate inter-layer vertical stacking topology based on the second matching result; S5: Process the candidate interlayer vertical stacking topology and output a three-dimensional stacking structure scheme.

2. The TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching method according to claim 1, characterized in that, S3 includes: S31: Construct a TRIZ separation principle rule base, wherein the TRIZ separation principle rule base includes preset spatial separation rules, preset temporal separation rules, preset conditional separation rules, preset hierarchical separation rules, as well as spatial separation topology transformation templates, temporal separation topology transformation templates, conditional separation topology transformation templates, and hierarchical separation topology transformation templates; S32: Match the physical contradiction data with the preset spatial separation rule, preset temporal separation rule, preset conditional separation rule, and preset hierarchical separation rule to obtain the corresponding first matching result; S33: Select the corresponding transformation template based on the first matching result; S34: The planar layout data is transformed according to the selected transformation template to obtain the corresponding multi-layer stacked layout.

3. The TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching method according to claim 1, characterized in that, S4 includes: S41: Construct an instance knowledge database, wherein each instance in the instance knowledge database includes labels from different domains, two-dimensional constraint descriptions, and three-dimensional extended structures; S42: Use the first matching result to match in the instance knowledge database to obtain the corresponding second matching result, and use the second matching result to extract general transformation rules; S43: Map the planar layout data using the general transformation rules to generate candidate inter-layer vertical stacking topology.

4. The TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching method according to claim 3, characterized in that, S4 further includes: S44: The multi-layer stacked layout is refined using a preset TRIZ contradiction matrix table.

5. The TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching method according to claim 1, characterized in that, Also includes: S6: Perform simulation evaluation on the three-dimensional stacked structure scheme, and iteratively optimize the analysis model based on the evaluation results.

6. The TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching method according to claim 5, characterized in that, S6 includes: S61: Simulate and evaluate the three-dimensional stacked structure scheme and calculate the optimization index; S62: Iteratively optimize the analysis model based on the optimization indicators.

7. A system utilizing the TRIZ-based electromechanical three-dimensional stacked integrated module layout-assisted teaching method according to any one of claims 1-6, characterized in that, include: The smart terminal is used to receive floor plan layout parameters and performance constraints input by teachers and students. The physical contradiction identification module is used to construct an analysis model and input the planar layout data into the analysis model for processing to obtain the corresponding physical contradiction data; The separation principle rule base and transformation module are used to construct the TRIZ separation principle rule base, match the physical contradiction data with the TRIZ separation principle rule base to obtain the corresponding first matching result, and transform the planar layout data according to the first matching result to obtain the corresponding multi-layer stacked layout. The function-oriented search module constructs an instance knowledge database, matches the multi-layer stacked layout with the instance knowledge database to obtain the corresponding second matching result, and generates a candidate inter-layer vertical stacking topology based on the second matching result. The scheme output module is used to process the candidate interlayer vertical stacking topology and output a three-dimensional stacking structure scheme. The evaluation module is used to perform simulation evaluation on the three-dimensional stacked structure scheme and to iteratively optimize the analysis model based on the evaluation results. The report generation module is used to record the operation paths and scheme selections of teachers and students on the smart terminal, and generate learning or design analysis reports.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the method according to any one of claims 1-6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the method described in any one of claims 1-6.

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