A high-power microwave protection design method of an electronic device and a related device

Abstract

Embodiments of the present application provide a high-power microwave protection design method of an electronic device and related equipment, belonging to the technical field of electromagnetic protection. The method comprises: constructing an electromagnetic simulation model according to the geometric structure and material parameters of a target electronic device; inputting preset electromagnetic parameters as excitation into the electromagnetic simulation model to perform simulation calculation on the target electronic device, and obtaining a response data set; the response data set represents the coupling electric field intensity distribution of the target electronic device; determining target protection points and their risk levels according to the response data set and the structural characteristics of the target electronic device; formulating a protection design scheme of the target electronic device according to the electric field intensity levels of the target protection points; and the protection design scheme comprises protection strategies of the target protection points. According to the simulation, the embodiments of the present application scientifically divide the protection design, so that the protection design has a basis, the protection resources are accurately put in, and the pertinence, effectiveness and engineering economy of the protection reinforcement are improved as a whole.

Description

Technical Field

[0001] This application relates to the field of electromagnetic protection technology, and in particular to a high-power microwave protection design method and related equipment for electronic devices. Background Technology

[0002] With the rapid development of electronic technology, electronic devices are increasingly widely used in military and civilian fields; however, the electromagnetic environment they face is becoming increasingly complex. High-power microwaves (HPM), as a typical strong electromagnetic threat, are characterized by high peak power, wide bandwidth, short duration, and strong penetration. They can intrude into internal circuits through coupling paths between "front doors" and "back doors," such as equipment gaps and cable interfaces, leading to component damage, functional abnormalities, or even system failure, seriously threatening the reliability and safety of electronic equipment.

[0003] Existing protection methods mainly rely on experience and knowledge to design protection schemes, including technologies such as overall shielding, filtering, and grounding. However, they still have problems such as limited protection effectiveness, large size and weight, and narrow applicable frequency bands. For example, although overall metal shielding has a certain shielding effect, it is not conducive to heat dissipation and lightweight design of equipment; filters have insufficient ability to suppress out-of-band interference; and grounding measures are difficult to achieve low-impedance connections in complex installation environments.

[0004] In summary, the technical problems existing in the relevant technologies need to be improved. Summary of the Invention

[0005] The main objective of this application is to propose a high-power microwave protection design method and related equipment for electronic devices, aiming to achieve precise quantitative formulation of protection and hardening.

[0006] To achieve the above objectives, one aspect of this application proposes a high-power microwave protection design method for electronic devices, the method comprising: An electromagnetic simulation model is constructed based on the geometric structure and material parameters of the target electronic device; The electromagnetic simulation model is used as an excitation input with preset electromagnetic parameters to perform simulation calculations on the target electronic device and obtain a response dataset; the response dataset characterizes the coupled electric field intensity distribution of the target electronic device. The target protection points and their risk levels are determined based on the response dataset and the structural characteristics of the target electronic device. The protection design scheme for the target electronic device is formulated based on the risk level of each of the target protection points; the protection design scheme includes the protection strategy for each of the target protection points.

[0007] In some embodiments, after the step of formulating a protection design scheme for the target electronic device based on the risk level of each of the target protection points, the method further includes: Obtain the hardening parameters of the target electronic device and feed the hardening parameters back to the electromagnetic simulation model to update the electromagnetic simulation model; The ruggedized target electronic device is the target electronic device that applies the protection design scheme described above.

[0008] In some embodiments, constructing an electromagnetic simulation model based on the geometry and material parameters of the target electronic device includes: Construct a geometric model of the target electronic device based on its geometric structure; The electromagnetic simulation model is constructed based on the material properties of the target electronic device and the geometric model.

[0009] In some embodiments, determining the target protection point and its risk level based on the response dataset and the structural characteristics of the target electronic device includes: The target electronic device is divided into regions with different electric field strength levels based on the response dataset; Based on the electric field strength level and structural characteristics of each region, target protection points of different risk levels are determined; The risk level and the electric field strength level are in a corresponding relationship.

[0010] In some embodiments, the protection design scheme further includes shielding effectiveness targets for each of the target protection points, and the step of formulating the protection design scheme for the target electronic device based on the risk level of each of the target protection points includes: For the target protection points that are at a high risk level, a multi-layer composite shielding reinforcement structure is adopted as the protection strategy, and a first shielding effectiveness target is set. For the target protection points that are at medium or low risk levels, a lightweight protection structure is adopted as the protection strategy, and a second shielding effectiveness target is set. The first shielding effectiveness target is lower than the second shielding effectiveness target.

[0011] In some embodiments, after the step of updating the electromagnetic simulation model, the method further includes: Based on the updated electromagnetic simulation model, the hardened target electronic device is simulated and calculated to determine whether each target protection point has achieved the corresponding shielding effectiveness target. If the shielding effectiveness target is not achieved, the protection design scheme shall be adjusted and the protection reinforcement shall be carried out again.

[0012] In some embodiments, the step of using preset electromagnetic parameters as excitation inputs to the electromagnetic simulation model to perform simulation calculations on the target electronic device and obtain a response dataset includes: The electromagnetic simulation model is divided into differentiated meshes based on the structural characteristics of the target electronic device to obtain multiple simulation meshes; The coupled electric field intensity of each of the simulation grids is collected to obtain the response dataset; In this context, the grid size corresponding to the critical parts of the target electronic device is smaller than the grid size corresponding to the non-critical parts.

[0013] To achieve the above objectives, another aspect of this application proposes a high-power microwave protection and hardening system for electronic devices, the system comprising: The building module is used to construct an electromagnetic simulation model based on the geometry and material parameters of the target electronic device; The simulation module is used to input preset electromagnetic parameters as excitation into the electromagnetic simulation model to perform simulation calculations on the target electronic device and obtain a response dataset; the response dataset characterizes the coupled electric field intensity distribution of the target electronic device. The positioning module is used to determine the target protection point and its risk level based on the response dataset and the structural characteristics of the target electronic device; A design module is used to formulate a protection design scheme for the target electronic device based on the risk level of each of the target protection points; the protection design scheme includes protection strategies for each of the target protection points.

[0014] To achieve the above objectives, another aspect of this application provides a high-power microwave protection and hardening computer device for electronic devices. The computer device includes at least one processor and at least one memory for storing at least one program. When the at least one program is executed by the at least one processor, the at least one processor implements the high-power microwave protection design method for electronic devices described above.

[0015] To achieve the above objectives, another aspect of this application provides a computer program product, including a computer program that, when executed by a processor, implements the high-power microwave protection design method for the aforementioned electronic device.

[0016] The embodiments of this application include at least the following beneficial effects: This application provides a high-power microwave protection design method and related equipment for electronic devices. This method constructs an electromagnetic simulation model by acquiring the geometric structure and materials of the target electronic device, uses preset electromagnetic parameters as excitation to perform simulation calculations on the target electronic device, obtains a response dataset of the coupling strength distribution of the target electronic device, accurately locates the target protection points and risk levels of the target electronic device based on the response dataset and the structural characteristics of the target electronic device, and designs differentiated protection schemes for target protection points of different risk levels. This method changes the traditional experience-based protection and hardening approach, acquiring scientific data through simulation and scientifically dividing the data, making protection design based on evidence and accurately allocating protection resources. It ensures sufficient protection strength for high-risk areas while avoiding over-protection of low-risk areas, thereby improving the overall targeting, effectiveness, and engineering economy of protection and hardening. Attached Figure Description

[0017] Figure 1 This is a flowchart illustrating a high-power microwave protection design method for an electronic device provided in an embodiment of this application; Figure 2 This is a flowchart illustrating another high-power microwave protection design method for electronic devices provided in an embodiment of this application; Figure 3 This is a schematic diagram of a high-power microwave protection and ruggedization computer device for an electronic device provided in an embodiment of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit it. In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with those of this application; they are merely examples of apparatuses and methods consistent with some aspects of the embodiments of this application as detailed in the appended claims.

[0019] It is understood that the terms "first," "second," etc., used in this application may be used to describe various concepts herein, but unless otherwise specified, these concepts are not limited by these terms. These terms are only used to distinguish one concept from another. For example, without departing from the scope of the embodiments of this application, a first shielding effectiveness target may also be referred to as a second shielding effectiveness target, and similarly, a second shielding effectiveness target may also be referred to as a first shielding effectiveness target.

[0020] As used in this application, the terms "at least one", "multiple", "each", "any", etc., "at least one" includes one, two or more, "multiple" includes two or more, "each" refers to each of the corresponding multiples, and "any" refers to any one of the multiples.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0022] This application provides a high-power microwave protection design method and related equipment for electronic devices. The method constructs an electromagnetic simulation model by acquiring the geometry and materials of the target electronic device. Preset electromagnetic parameters are used as excitations to perform simulation calculations on the target electronic device, obtaining a response dataset of the coupling strength distribution. Based on the response dataset and the structural characteristics of the target electronic device, the target protection points and risk levels are accurately located. Differentiated protection schemes are designed for target protection points of different risk levels. This method changes the traditional experience-based approach to protection and hardening. It obtains scientific data through simulation calculations and performs scientific classification, making protection design based on evidence and ensuring precise allocation of protection resources. This ensures sufficient protection strength for high-risk areas while avoiding over-protection of low-risk areas, thereby improving the overall targeting, effectiveness, and economic efficiency of protection and hardening.

[0023] Figure 1 This is an optional flowchart of a high-power microwave protection design method for electronic devices provided in this application embodiment. Figure 1 The method may include, but is not limited to, steps S101 to S104.

[0024] S101, Construct an electromagnetic simulation model based on the geometric structure and material parameters of the target electronic device; S102, the preset electromagnetic parameters are used as excitation input to the electromagnetic simulation model to perform simulation calculations on the target electronic device and obtain a response dataset; the response dataset characterizes the coupled electric field intensity distribution of the target electronic device; S103, Determine the target protection point and its risk level based on the response dataset and the structural characteristics of the target electronic equipment; S104, Develop a protection design scheme for the target electronic equipment based on the risk level of each target protection point; the protection design scheme includes the protection strategy for each target protection point.

[0025] In step S101 of some embodiments, the geometry of the target electronic device may include the complete structural parameters of the target electronic device, or it may only retain the three-dimensional geometry and dimensional accuracy of the key protective parts. Specifically, it includes the housing gaps (length, width, direction and corner radius), heat dissipation holes (hole diameter, hole spacing and opening area outline), aviation plugs (mounting surface size, interface gap and metal contact distribution), and the cable laying path and the location of the device connection node, and is not limited thereto.

[0026] In this embodiment, the geometric structure and material parameters of the target electronic device are acquired. The geometric structure is constructed by eliminating redundant features based on the core simulation requirements, ensuring consistent relative positional relationships after simplification. An electromagnetic simulation model is built by simulating the actual electromagnetic environment and accurately acquiring high-power microwave electromagnetic parameters.

[0027] In step S102 of some embodiments, the preset electromagnetic parameters can be a type of high-power microwave electromagnetic parameters. High-power microwave electromagnetic parameters can include frequency range, peak power density, pulse width, repetition frequency and frequency spectrum distribution characteristics, etc., and are not limited thereto.

[0028] In this embodiment, based on the constructed electromagnetic simulation model, a simulation analysis of the coupling path between high-power microwave electromagnetic fields and the equipment is conducted. Simulation software is used to simulate high-power microwave electromagnetic field incident scenarios at different frequencies, accurately reproducing the coupling process of microwaves through key channels such as housing gaps, heat dissipation hole arrays, aviation connector interfaces, and cable laying paths, quantifying the microwave coupling strength. During the simulation, the interaction with the equipment's structural features is analyzed in detail; simultaneously, considering the electromagnetic properties of the equipment materials and environmental parameters, the propagation, reflection, and absorption processes of microwaves within the equipment are dynamically simulated, forming an electromagnetic response dataset containing each coupling path.

[0029] In step S103 of some embodiments, based on the simulation results of the coupling path, the electromagnetic leakage risk point is located using the "intensity grading-feature matching" method, and the risk point is divided into different levels.

[0030] In step S104 of some embodiments, based on the simulation results of the coupling path and the location of risk points, a differentiated electromagnetic protection scheme is designed according to the principle of "graded protection and precise adaptation".

[0031] Steps S101 to S104, as illustrated in this embodiment, involve acquiring the geometric structure and material parameters of the target electronic device and constructing an electromagnetic simulation model based on preset electromagnetic parameters. This allows for simulation calculations of the target electronic device, obtaining a response dataset of the coupling strength distribution. Based on the response dataset and the structural characteristics of the target electronic device, the target protection points and risk levels are accurately located. Differentiated protection schemes are then designed for target protection points at different risk levels. This approach changes the traditional experience-based approach to protection and hardening. By acquiring scientific data through simulation and scientifically dividing the data, protection design becomes more data-driven, and protection resources are allocated more precisely. This ensures sufficient protection strength for high-risk areas while avoiding over-protection of low-risk areas, thereby improving the overall targeting, effectiveness, and economic efficiency of protection and hardening.

[0032] In some embodiments, after step S104, the method of this application embodiment may also include, but is not limited to, step S201: S201, Obtain the hardening parameters of the target electronic device and feed the hardening parameters back to the electromagnetic simulation model to update the electromagnetic simulation model; Among them, ruggedized target electronic equipment refers to target electronic equipment for which a protective design scheme is applied.

[0033] In step S201 of some embodiments, the methods for collecting the hardening parameters of the target electronic device include, but are not limited to, using a multimeter and milliohm meter to detect the contact resistance and lap surface resistance in real time, and simultaneously recording the structural parameters of the protective material.

[0034] In this embodiment, key reinforcement parameters and protective performance data are collected; contact resistance and overlap resistance are measured in real time using a multimeter and milliohm meter to ensure that the conductivity continuity of gaps, aviation plugs, and cables meets the requirements (contact resistance not greater than 20mΩ, overlap resistance less than 100mΩ); structural parameters such as the integrity of protective material adhesion, copper foil overlap size, and copper mesh porosity are recorded simultaneously. This provides an accurate basis for model correction.

[0035] Based on the collected reinforcement data, a correction mechanism is constructed. The corrected model should meet the requirements for shielding effectiveness prediction, ensuring that the simulation results are highly consistent with the actual reinforcement effect, forming a closed-loop control process of "reinforcement-collection-correction-optimization", thereby ensuring the accuracy and reliability of the protection reinforcement.

[0036] In this embodiment, after hardening the target electronic device, the actual hardening parameters obtained are fed back to the electromagnetic simulation model to update and form a closed-loop control process of "processing-acquisition-correction-optimization". This corrects the disconnect between the theoretical model and the actual hardening, thereby ensuring the accuracy and reliability of the protection and hardening.

[0037] In some embodiments, step S101 may include, but is not limited to, steps S301 to S302: S301, Construct a geometric model of the target electronic device based on its geometric structure; S302, construct an electromagnetic simulation model based on the material properties and geometric model of the target electronic device.

[0038] In steps S301 to S302 of some embodiments, the geometric model of the target electronic device can be simplified by equivalent means, retaining the key dimensions and orientation of each segment, and fitting the complex undulating continuous surface with a smooth surface, thereby improving the overall shape accuracy while reducing the amount of modeling data; or the dense heat dissipation hole array can be modeled as a whole region equivalently, based on the outer contour of the array, to equivalently restore its opening ratio and overall electromagnetic transparency characteristics, replacing the modeling of each hole position, and is not limited thereto.

[0039] In this embodiment, during the structural model simplification stage, redundant features are eliminated based on the core simulation requirements. The structural model simplification stage retains the three-dimensional geometry and dimensional accuracy of key protective components, specifically including the length, width, direction, and angular curvature of housing gaps; the diameter, center-to-center spacing, and opening area contour of heat dissipation holes; the mounting surface dimensions, interface gaps, and metal contact distribution of aviation plugs; and the cable routing path and the location of equipment connection nodes. Features that do not affect the microwave coupling path, such as non-load-bearing ribs, decorative grooves, and markings inside the equipment, are ignored, eliminating redundant geometric elements to reduce model complexity. For segmented long gaps, an equivalent simplification method is adopted, retaining the key dimensions and direction of each segment. Complex undulating continuous surfaces are fitted with smooth curved surfaces, reducing the amount of modeling data while ensuring the accuracy of the overall shape. For dense heat dissipation hole arrays, overall regional equivalent modeling is implemented, using the array's outer contour as a basis to equivalently restore its opening ratio and overall electromagnetic permeability, replacing individual hole-by-hole modeling. For non-conductive structures, simplified geometric entities are used as substitutes, retaining key parameters such as positioning dimensions and mating clearances while ignoring fine structures. At the same time, it is ensured that the relative positional relationships are consistent after simplification, so as not to affect the simulation results of electromagnetic coupling paths.

[0040] The simplification process ensures that the electromagnetic coupling channel characteristics of key components are not lost, significantly reducing model complexity while balancing computational efficiency and simulation accuracy.

[0041] During the data modeling phase, the simplified model is imported into electromagnetic simulation software (including CST, HFSS, and FEKO electromagnetic simulation software). The material properties of the equipment housing are accurately mapped into the model, and detailed local models are created for key protected areas.

[0042] In the high-power microwave electromagnetic parameter extraction stage, the actual electromagnetic environment is simulated to accurately acquire core electromagnetic parameters. These core electromagnetic parameters include frequency range, peak power density, pulse width, repetition frequency, and its frequency spectrum distribution characteristics.

[0043] The electromagnetic simulation model was constructed using HFSS / CST electromagnetic simulation software based on the simplified geometric model of the equipment. The conductivity and dielectric constant properties of each component were assigned according to the actual material, while the fine geometric features of the key protective parts were preserved. Material parameters were imported to set the excitation source type, incident angle and environmental boundary conditions. At the same time, key nodes of the coupling path such as housing gaps and heat dissipation holes were marked.

[0044] By combining the frequency and power density parameters of high-power microwave electromagnetic fields, setting electromagnetic environment boundary conditions and excitation source configurations, a simulation carrier of "geometrically simplified model - electromagnetic properties - environmental parameters" is formed, providing a foundation for subsequent coupling path analysis and protection scheme optimization.

[0045] This application embodiment ensures the morphological integrity of the key structures of the target electronic device, making the relative positional relationships of the models consistent and not affecting the electromagnetic simulation results; it accurately maps the material properties of the device shell in the model, providing a simulation carrier with consistent properties for subsequent coupling path simulation, thereby improving the initial accuracy of risk location and protection scheme design; it sets high-power microwave electromagnetic parameters to form a simulation carrier that fits the geometric model, electromagnetic properties and environmental parameters, providing a foundation for subsequent coupling path analysis and protection scheme optimization.

[0046] In some embodiments, step S103 may include, but is not limited to, steps S401 to S402: S401, the target electronic device is divided into regions with different electric field strength levels based on the response dataset; S402, based on the electric field strength level and structural characteristics of each region, determine the target protection points with different risk levels; the risk level and the electric field strength level are in a corresponding relationship.

[0047] In step S401 of some embodiments, the classification of electric field strength levels can be defined by specific scores for each target electronic device; in some embodiments, a field strength level greater than or equal to 100V / m can be used as a high electric field strength level, a field strength level less than 100V / m but greater than or equal to 40V / m can be used as a medium electric field strength level, and a field strength level less than 40V / m can be used as a low electric field strength level, and so on.

[0048] In step S402 of some embodiments, structural features include, but are not limited to, gaps, heat dissipation holes, gaps in aviation plug interfaces, connection nodes between cables and equipment, housing surfaces, and areas of insulating components. Different structural features are considered as target protection points, i.e., electromagnetic leakage risk points, or simply risk points.

[0049] In this embodiment, based on the simulation results of the coupling path, the "intensity grading-feature matching" method is used to locate electromagnetic leakage risk points. The equipment is divided into three risk levels: high (target electronic device field strength ≥ 100V / m), medium (100V / m > target electronic device field strength ≥ 40V / m), and low (target electronic device field strength < 40V / m). Generally, high-risk points mainly include long gaps, the edges of dense heat dissipation hole arrays, gaps in aviation plug interfaces, and connection nodes between cables and equipment; medium-risk points include short gaps, the central area of ​​heat dissipation holes, and the middle section of cables; low-risk points are well-sealed casing surfaces and areas of insulating components. For high-risk points, their structural defects are further analyzed, including gap corners and gaps around screw holes, to identify the key factors leading to microwave leakage. A risk point location list is formed, marking the location coordinates, coupling strength, structural characteristics, and dominant coupling path of each risk point, providing a basis for the precise optimization of subsequent protection schemes.

[0050] This application embodiment locates electromagnetic leakage risk points by matching risk levels with equipment characteristics, and correlates simulation values ​​with actual physical defects of the target electronic equipment, providing a basis for precise optimization of subsequent protection schemes and realizing precise quantitative design of protection and hardening.

[0051] In some embodiments, step S104 may also include, but is not limited to, steps S501 to S502: S501, for target protection points at high risk levels, adopts a multi-layer composite shielding reinforcement structure as a protection strategy and sets a first shielding effectiveness target; S502, for target protection points at medium or low risk levels, adopts a lightweight protection structure as a protection strategy and sets a second shielding effectiveness target; Among them, the first shielding effectiveness target is lower than the second shielding effectiveness target.

[0052] In step S501 of some embodiments, the shielding effectiveness target can be determined by the ratio of the unshielded electric field strength to the shielded electric field strength; it can also be determined by the ratio of the unshielded power to the shielded power, and is not limited thereto.

[0053] In this embodiment of the application, based on the simulation results of the coupling path and the location of risk points, a differentiated electromagnetic protection scheme is designed according to the principle of "graded protection and precise adaptation".

[0054] For high-risk areas, a multi-layer composite shielding reinforcement structure is adopted. Through chassis shielding effectiveness testing and optimization, it was found that when the copper foil extends outwards by ≥3cm, the shielding effectiveness at the gap can be improved to over 70dB. In designing the protection strategy, for long gaps in the chassis, a multi-layer copper foil overlapping design is used, with the copper foil size extending outwards by 3-5cm based on the gap parameters to ensure complete coverage of the gap area. For dense heat dissipation hole arrays, a copper mesh structure is used, with the mesh count adapted to the high-power microwave electromagnetic frequency. For aviation plug interfaces, a conductive cloth wrapping process is used, with the copper foil wrapping angle between 30-75° to ensure a contact resistance of no more than 20mΩ, forming a waveguide cutoff structure. For cable connection nodes, a conductive cloth full wrapping and adjustable spring grounding method are used, controlling the grounding resistance to within 30mΩ.

[0055] The copper foil winding angle is based on the central axis of the conductor. The angle between the copper foil strip and this axis can range from 30° to 75°, or it can be an acute angle, and is not limited to this range. The copper foil winding angle is measured as follows: draw a reference straight line along the axis of the mandrel; draw the tangent line of the long side of the copper foil on the surface of the copper foil; align one side of the angle ruler with the axis and the other side with the tangent line of the copper foil.

[0056] For medium- and low-risk areas, a lightweight protective structure is adopted to balance protective effectiveness and equipment load: short gaps are sealed with a single layer of conductive adhesive; and the central area of ​​heat dissipation holes is shielded with a conventional copper mesh structure. Simultaneously, the original performance of the equipment is considered in the protective design. Simulation predictions are used to adjust the thickness of the protective materials and the installation method to avoid affecting the equipment's heat dissipation and signal transmission performance. Specifically, the porosity of the heat dissipation hole shielding layer is no less than 60%, and the cable shielding layer thickness is no greater than 0.3mm.

[0057] This solution clearly defines the selection of protective materials, structural dimensional parameters, processing requirements, and installation sequence, forming a standardized operation manual. Simultaneously, a solution verification module is included to simulate the electromagnetic shielding effectiveness after implementation, ensuring that the shielding effectiveness at high-risk points is no less than the first shielding effectiveness, and the shielding effectiveness at medium-risk points is no less than the second shielding effectiveness, thus meeting the reliable operation requirements of electronic equipment in high-power microwave electromagnetic threat environments.

[0058] In some embodiments, the first shielding effectiveness target and the second shielding effectiveness target can be determined by referring to past experience shielding effectiveness targets, such as the first shielding effectiveness target being 60dB and the second shielding effectiveness target being 70dB; or the data can be set individually for each target electronic device, and is not limited thereto.

[0059] The following environmental conditions should be met at the protective reinforcement work site: temperature 15℃-45℃, relative humidity 20%-80%, dust concentration not exceeding 10mg / m³, and a stable ventilation system with at least 5 air changes per hour. Protective railings and buffer mats must be installed on site, with adequate operating space reserved. Processing platforms should avoid hard contact with equipment, and vibration damping layers should be laid under high-precision or high-vibration equipment. Before work begins, materials such as copper foil tape, conductive cloth tape, and copper mesh, as well as instruments such as multimeters and specialized operating tools, should be prepared, and the equipment interface diagrams and structural instructions should be thoroughly understood.

[0060] Before reinforcement, surface accessories of the equipment must be removed, debris and debris cleared, and the equipment's appearance, function, and key dimensions checked to ensure they meet requirements. After verification by the design unit, minor surface defects should be addressed; however, if deviations affect basic functionality, reinforcement will not be carried out. Based on the electromagnetic characteristics of high-power microwaves and test evaluation results, cable coupling interference is low. Protection measures should focus on key areas such as equipment gaps, heat dissipation holes, aviation connectors, and cables. Specific steps are as follows: (1) Gap treatment: Use copper foil of the same model, accurately measure and record the gap length L and width W; cut the first layer of copper foil to a size no smaller than (L+1) × (W+1) cm, align and paste it with the gap as the center line, push and stretch the copper foil from one side, and use a plastic scraper to scrape and press outward along the gap 2-3 times; the second layer of copper foil should be no smaller than (L+3) × (W+3) cm, and press it onto the first layer in the same steps; the third layer of copper foil should be no smaller than (L+5) × (W+5) cm, and press it onto the second layer in the same steps.

[0061] (2) Heat dissipation hole treatment: Measure the dimensions of the ventilation hole area, select a copper mesh with sides 1-5cm larger than the ventilation holes, and apply 1-2cm wide copper foil tape to each side to form a sealed area. Cut along the outer side and clean the surface; then apply copper foil tape of the same width, align it with the ventilation holes, cover and press firmly, and check the integrity of the wrapping. For corner ventilation holes, the copper mesh should be bent at the angle. When encountering protruding screws, the copper mesh should cover the protrusion. When cutting, the copper mesh should be laid flat to avoid stress affecting the uniformity of the pores.

[0062] (3) Reinforcement of aviation connectors: Record the connection panel number and use a multimeter or milliohm meter to test conductivity. Determine the interface size according to the design documents. After drilling holes in the large-area conductive copper foil tape, apply it to the socket panel and press it firmly. Use thin strips of copper foil tape to reinforce the gap between the plug and the equipment interface, ensuring a connection with the metal parts. Repeat the testing, drilling, and pasting steps, and use large-size copper foil tape for secondary reinforcement. During operation, the connection function must not be affected, and special display areas such as indicator lights must not be covered.

[0063] (4) Cable reinforcement: For non-coaxial, non-power, and non-fiber optic cables, record the number, remove and lay flat; using a cylindrical plastic rod as the axis, wrap the conductive cloth clockwise 360° from the aviation plug, with adjacent turns overlapping by more than 2 / 3, and secure the beginning and end with cable ties; measure the resistance between the cable conductive cloth and the equipment casing ground, which should not exceed 100mΩ, and finally use decorative tape to mark the number.

[0064] (5) Overlap treatment: Use a multimeter to confirm the conductivity of the surface of the equipment to be connected, clean the surface and keep it dry, and determine the size of the overlap surface; cut conductive copper foil slightly wider than the overlap surface, crimp and press it tightly, then completely cover and press it with a crimping strip of 1.5 times the size; measure the resistance of the overlap surface, which should be less than 100mΩ.

[0065] This application embodiment formulates differentiated protection design schemes and sets different shielding effectiveness targets by different risk levels, realizing the principle of "graded protection and precise adaptation". By adopting a multi-layer composite shielding reinforcement structure in high-risk areas and a lightweight protection structure in medium and low-risk areas, a balance is achieved between the overall protection effectiveness and equipment function of the target electronic device, ensuring the quality controllability of the processing process.

[0066] In some embodiments, steps S502 and later include, but are not limited to, steps S601 to S602: S601, based on the updated electromagnetic simulation model, performs simulation calculations on the hardened target electronic equipment to determine whether each target protection point has achieved the corresponding shielding effectiveness target; S602 If the shielding effectiveness target is not achieved, the protection design scheme shall be adjusted and the protection reinforcement shall be carried out again.

[0067] In this embodiment, simulation calculations are performed on the hardened target electronic equipment based on the updated electromagnetic simulation model. If the shielding effectiveness target is not achieved, condition judgment and iterative processing are performed based on the comparison results. If the simulated shielding effectiveness of a certain risk point does not reach its corresponding target threshold, it is determined that the protection and hardening measures at that point do not meet the design requirements, and the protection design scheme related to that risk point needs to be adjusted.

[0068] Adjustment strategies may include, but are not limited to: for gap areas with insufficient shielding effectiveness, increasing the number of copper foil layers, their size, and the number of times the copper foil is stretched outwards; for heat dissipation hole areas with insufficient shielding effectiveness, increasing the copper mesh density, copper foil tape width, and the number of copper foil tape layers; for aviation connector areas with insufficient shielding effectiveness, increasing the copper foil tape width and the number of copper foil tape layers; for cable areas with insufficient shielding effectiveness, increasing the number of conductive cloth layers, etc., and are not limited to these. After completing the targeted adjustments to the protection design scheme, it is necessary to modify the geometric structure or material property parameters of the corresponding locations in the electromagnetic simulation model accordingly to form an updated electromagnetic simulation model.

[0069] The embodiments of this application use an updated electromagnetic simulation model for simulation calculations, which enables the protection effect to be evaluated and iteratively improved in advance without relying on actual high-power microwave test equipment, thus significantly improving the reliability of protection and hardening.

[0070] In some embodiments, step S302 may include, but is not limited to, steps S701 to S702: S701, Based on the structural characteristics of the target electronic device, the electromagnetic simulation model is divided into differentiated meshes to obtain multiple simulation meshes; S702, Collect the coupled electric field intensity of each of the simulation grids to obtain the response dataset; In this context, the grid size corresponding to critical parts in the target electronic device is smaller than the grid size corresponding to non-critical parts.

[0071] In this embodiment, a differentiated meshing method is used, with the mesh size of critical parts ≤ λ / 15 and the mesh size of non-critical parts ≤ λ / 10, to balance simulation accuracy and computational efficiency, where λ is the lowest frequency of the excitation source.

[0072] This application embodiment implements differentiated meshing of the electromagnetic simulation model based on the structural characteristics of the electronic device. The critical parts with microwave coupling paths are divided into smaller first preset meshes, while non-sensitive areas without coupling are divided into relatively larger second preset meshes. This can accurately capture subtle changes in the electromagnetic field at vulnerable points such as casing gaps, heat dissipation holes, and aviation plugs, while effectively reducing the overall mesh size and computational load of the model. It ensures the accuracy of high-power microwave coupling simulation while significantly reducing the solver's computational resource consumption and shortening the simulation cycle.

[0073] Please see Figure 2 , Figure 2 This is a flowchart illustrating another high-power microwave protection design method for electronic devices provided in the application embodiment. Below, the solution of this embodiment will be described in detail and explained with reference to specific electronic device application examples: A certain type of communication equipment was modified using the electromagnetic shielding and reinforcement method described in the embodiments of this application. The equipment shell is made of aluminum alloy. The original structure has an electromagnetic leakage path in the panel splicing gap, which is a typical high-risk leakage structure (field strength ≥100V / m). Within the operating frequency band, the simulated shielding efficiency is about 40dB. The electromagnetic leakage at the joints of the equipment shell is relatively obvious and does not meet the design requirements.

[0074] To address the aforementioned issues, a three-layer copper foil overlap structure was adopted for the panel seams of the equipment to increase the conductive contact area and extend the electromagnetic leakage path. The shielding effectiveness was then recalculated using simulation. Test results show that within the target operating frequency band, the overall shielding effectiveness of the equipment reaches 70dB, which meets the requirements.

[0075] A certain type of equipment was modified using the electromagnetic shielding and reinforcement method described in this invention. The equipment shell is made of aluminum alloy and has openings (cross-section 53mm*24mm), which is a typical medium-leakage structure (100V / m > field strength ≥ 40V / m). Within the operating frequency band, electromagnetic leakage at the joints of the equipment shell is quite obvious, and the simulated shielding efficiency is about 30dB, which does not meet the design requirements.

[0076] To address the aforementioned issues, a copper mesh design was implemented in the opening area to increase the cutoff frequency. The shielding effectiveness was then recalculated using simulation. Test results show that within the target operating frequency band, the overall shielding effectiveness of the device reaches over 90dB, meeting the requirements.

[0077] This application also provides a high-power microwave protection and hardening system for electronic devices, which can implement the above-mentioned method. The system includes: The building module is used to construct an electromagnetic simulation model based on the geometry and material parameters of the target electronic device; The simulation module is used to input preset electromagnetic parameters as excitation into the electromagnetic simulation model to perform simulation calculations on the target electronic device and obtain a response dataset; the response dataset characterizes the coupled electric field intensity distribution of the target electronic device. The positioning module is used to determine the target protection point and its risk level based on the response dataset and the structural characteristics of the target electronic device; The module is used to develop protection design schemes for target electronic devices based on the risk level of each target protection point; the protection design schemes include protection strategies for each target protection point.

[0078] It is understood that the content of the above method embodiments is applicable to this system embodiment. The specific functions implemented in this system embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0079] This application also provides a high-power microwave protection and hardening computer device for electronic devices. The computer device includes at least one processor; at least one memory for storing at least one program; when the at least one program is executed by the at least one processor, the at least one processor implements the above-mentioned high-power microwave protection design method for electronic devices.

[0080] It is understood that the content of the above method embodiments is applicable to the present device embodiments. The specific functions implemented by the present device embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0081] Please see Figure 3 , Figure 3 This is a schematic diagram of a high-power microwave protection and hardening computer device for electronic devices according to an embodiment of this application. The high-power microwave protection and hardening computer device for electronic devices according to this embodiment includes: The processor 301 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application. The memory 302 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 302 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 302 and is called and executed by the processor 301 using the methods described above in the embodiments of this application. Input / output interface 303 is used to implement information input and output; The communication interface 304 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.). Bus 305 transmits information between various components of the device (e.g., processor 301, memory 302, input / output interface 303, and communication interface 304); The processor 301, memory 302, input / output interface 303, and communication interface 304 are connected to each other within the device via bus 305.

[0082] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described high-power microwave protection design method for electronic devices.

[0083] It is understood that the content of the above method embodiments is applicable to the embodiments of this program product. The specific functions implemented in the embodiments of this program product are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments. Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0084] This application provides a high-power microwave protection design method for electronic devices, along with related equipment, storage media, and program products. By acquiring the geometric structure and material parameters of the target electronic device, an electromagnetic simulation model is constructed. Preset electromagnetic parameters are used as excitation inputs to the electronic simulation model, enabling simulation calculations of the electromagnetic coupling strength in various regions of the target electronic device. Based on the response dataset, the device is classified into risk levels, and risk points are accurately located. Risk levels are determined according to coupling strength, and differentiated protection schemes and shielding effectiveness targets are designed and implemented based on different risk levels. This approach changes the traditional experience-based approach to protection and hardening. It uses scientific data obtained from simulation for scientific classification, making protection design based on evidence and ensuring precise allocation of protection resources. This ensures sufficient protection strength for high-risk areas while avoiding over-protection of low-risk areas, thereby improving the overall targeting, effectiveness, and economic efficiency of protection and hardening.

[0085] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0086] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0087] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0088] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0089] The terms "first" and "second" in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0090] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0091] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0092] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0093] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0094] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A high-power microwave protection design method for electronic devices, characterized in that, The method includes the following steps: An electromagnetic simulation model is constructed based on the geometric structure and material parameters of the target electronic device; The electromagnetic simulation model is used as an excitation input with preset electromagnetic parameters to perform simulation calculations on the target electronic device and obtain a response dataset; the response dataset characterizes the coupled electric field intensity distribution of the target electronic device. The target protection points and their risk levels are determined based on the response dataset and the structural characteristics of the target electronic device. The protection design scheme for the target electronic device is formulated based on the risk level of each of the target protection points; the protection design scheme includes the protection strategy for each of the target protection points.

2. The high-power microwave protection design method for electronic devices according to claim 1, characterized in that, After the step of formulating a protection design scheme for the target electronic device based on the risk level of each of the target protection points, the method further includes: Obtain the hardening parameters of the target electronic device and feed the hardening parameters back to the electromagnetic simulation model to update the electromagnetic simulation model; The ruggedized target electronic device is the target electronic device that applies the protection design scheme described above.

3. The high-power microwave protection design method for electronic devices according to claim 1, characterized in that, The construction of the electromagnetic simulation model based on the geometric structure and material parameters of the target electronic device includes: Construct a geometric model of the target electronic device based on its geometric structure; The electromagnetic simulation model is constructed based on the material properties of the target electronic device and the geometric model.

4. The high-power microwave protection design method for electronic devices according to claim 1, characterized in that, The step of determining the target protection point and its risk level based on the response dataset and the structural characteristics of the target electronic device includes: The target electronic device is divided into regions with different electric field strength levels based on the response dataset; Based on the electric field strength level and structural characteristics of each region, target protection points of different risk levels are determined; The risk level and the electric field strength level are in a corresponding relationship.

5. The high-power microwave protection design method for electronic devices according to claim 4, characterized in that, The protection design scheme also includes the shielding effectiveness target for each of the target protection points. The step of formulating the protection design scheme for the target electronic device based on the risk level of each of the target protection points includes: For the target protection points that are at a high risk level, a multi-layer composite shielding reinforcement structure is adopted as the protection strategy, and a first shielding effectiveness target is set. For the target protection points that are at medium or low risk levels, a lightweight protection structure is adopted as the protection strategy, and a second shielding effectiveness target is set. The first shielding effectiveness target is lower than the second shielding effectiveness target.

6. The high-power microwave protection design method for electronic devices according to claim 2, characterized in that, The protection design scheme also includes the shielding effectiveness target for each of the target protection points. After the step of updating the electromagnetic simulation model, the method further includes: Based on the updated electromagnetic simulation model, the hardened target electronic device is simulated and calculated to determine whether each target protection point has achieved the corresponding shielding effectiveness target. If the shielding effectiveness target is not achieved, the protection design scheme shall be adjusted and the protection reinforcement shall be carried out again.

7. The high-power microwave protection design method for electronic devices according to claim 3, characterized in that, The step of using preset electromagnetic parameters as excitation input to the electromagnetic simulation model to perform simulation calculations on the target electronic device and obtain a response dataset includes: The electromagnetic simulation model is divided into differentiated meshes based on the structural characteristics of the target electronic device to obtain multiple simulation meshes; The coupled electric field intensity of each of the simulation grids is collected to obtain the response dataset; In this context, the grid size corresponding to the critical parts of the target electronic device is smaller than the grid size corresponding to the non-critical parts.

8. A high-power microwave protection and hardening system for electronic equipment, characterized in that, The system includes: The building module is used to construct an electromagnetic simulation model based on the geometry and material parameters of the target electronic device; The simulation module is used to input preset electromagnetic parameters as excitation into the electromagnetic simulation model to perform simulation calculations on the target electronic device and obtain a response dataset; the response dataset characterizes the coupled electric field intensity distribution of the target electronic device. The positioning module is used to determine the target protection point and its risk level based on the response dataset and the structural characteristics of the target electronic device; A design module is used to formulate a protection design scheme for the target electronic device based on the risk level of each of the target protection points; the protection design scheme includes protection strategies for each of the target protection points.

9. A high-power microwave protection and ruggedization computer device for electronic equipment, characterized in that, include: At least one processor; At least one memory for storing at least one program; When the at least one program is executed by the at least one processor, the at least one processor implements the high-power microwave protection design method for the electronic device as claimed in any one of claims 1 to 7.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the high-power microwave protection design method for the electronic device according to any one of claims 1 to 7.

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