A sizing die for a taping machine and method of manufacture

Abstract

The present application relates to the technical field of sizing die, especially to a sizing die for tape wrapping machine and a manufacturing method, comprising: a die body provided with a through sizing hole; an upper cover installed above the die body and forming a closed upper cavity with the die body; a lower support installed below the die body and forming a closed lower cavity with the die body; the upper cavity and the lower cavity are both connected to external cooling medium circulation through cooling pipelines, and the two cooling pipelines are in parallel, to solve the technical problems of the existing sizing die, such as the slow heat dissipation affecting the product quality stability and the tape wrapping efficiency, and the uneven stress on the two ground wires leading to deviation during wrapping.

Description

Technical Field

[0001] This invention relates to the field of sizing die technology, and in particular to a sizing die for a tape wrapping machine and its manufacturing method. Background Technology

[0002] During the manufacturing process of high-speed data communication cables, wrapping molds are typically used to wrap the cables. The wrapping layers (such as rubber pads, aluminum foil shielding tape, etc.) protect and shield the internal cables. Existing high-speed data communication cable wrapping molds generally include components such as a feed tube, a conveying mold, and a sizing mold. The cable enters the sizing mold through the feed hole of the conveying mold, and the sizing and wrapping are completed through the sizing hole of the sizing mold.

[0003] Existing technology also discloses a high-speed data communication line wrapping mold, utility model patent with announcement number CN219393046U, which includes a transmission tube, a conveying mold set at the right side of the transmission tube, a transmission hole set at the middle inner side of the conveying mold, a fixing plate set at the upper right side of the conveying mold, a sizing mold base set at the lower side of the fixing plate, and a wrapping hole set at the middle inner right side of the sizing mold base. Through the arrangement of the moving groove, fixing bolt, fixing nut, fixing plate, and moving plate, when it is necessary to quickly adjust the pitch of the sizing mold base, the fixing nut can be loosened, the fixing bolt can be removed from the left side of the moving groove, and the moving plate including the sizing mold base can be moved horizontally to the right or left along the moving groove under the fixing plate. The pitch can be adjusted to adapt to the wrapping work of different high-speed communication cables. The related technologies, including the above technical solutions, still have many problems, such as: ① When the cable passes through the sizing hole, the outer layer of the cable and the inner wall of the sizing hole will generate continuous friction, which will generate a lot of heat. Due to thermal expansion and contraction, the dimensions of the sizing die will change, affecting the stability of the product's structural dimensions. More seriously, the outer material of the cable (such as the plastic insulation layer, rubber pads, etc.) is prone to softening or even melting when heated, and some material will adhere to the inner wall of the sizing hole. Over time, this accumulation leads to blockage of the sizing hole, not only affecting its normal use but also requiring manual shutdown to clean the blockage, severely reducing production efficiency and product quality. Secondly, in the wrapping process, after the core wire (i.e., high-speed data communication cable) passes through the sizing die, it usually needs to be transported together with two ground wires and wrapped. In existing technology, the two ground wires are generally symmetrically arranged on both sides of the core wire. However, during the actual wrapping process, the wrapping tape material applies a certain wrapping force to the core wire and the two ground wires. Since the two ground wires are symmetrically arranged on both sides of the sizing hole, the wrapping force on the two ground wires is in opposite directions during wrapping. This can easily cause the relative position of the core wire and the two ground wires to shift after wrapping, resulting in the three wires not being neatly arranged. This affects the normal progress of subsequent processes (such as stripping and assembly) and reduces the electrical performance and structural consistency of the finished cable.

[0004] To address the aforementioned issues, some improvements have been proposed. For example, some existing technologies place the heat sink or air-cooling structure outside the mold, but the cooling effect is limited and it cannot directly cool the inner wall of the sizing hole. Furthermore, some existing technologies use grounding grooves to position the grounding wires, but this does not solve the problem of uneven force on the two grounding wires during the wrapping process, leading to misalignment. Therefore, effectively solving the problem of blockage in the sizing hole caused by frictional heat, and improving the uneven alignment of the two grounding wires and the core wire after wrapping, are pressing technical challenges that need to be addressed in this field. Summary of the Invention

[0005] The purpose of this invention is to provide a sizing mold and manufacturing method for a wrapping machine, which solves the technical problems commonly found in existing sizing molds, such as untimely heat dissipation affecting product quality stability and wrapping efficiency, and uneven force on the two ground wires during wrapping causing misalignment.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A sizing die for a tape wrapping machine, comprising: The mold body has a through-hole for sizing; The top cover is installed above the mold body and forms a sealed upper cavity with the mold body; The lower support is installed below the mold body and forms a sealed lower cavity with the mold body; Both the upper and lower cavities are connected to external cooling media via cooling pipes to circulate and remove heat, and the two cooling pipes are connected in parallel.

[0007] Furthermore, the mold body is provided with grounding grooves penetrating the mold body on both sides of the sizing hole along the horizontal direction. The grounding grooves include a first grounding groove and a second grounding groove, and the extension direction of the first grounding groove and the second grounding groove is the same as the extension direction of the sizing hole.

[0008] Furthermore, the upper cavity of the upper cover is provided with an upper partition plate, which is integrally formed with the top wall of the inner cavity of the upper cover. The upper partition plate divides the upper cavity into two cavities that are connected only at the bottom and the front end. The two cavities separated by the upper partition plate are respectively connected to the upper inlet pipe and the upper outlet pipe of a cooling pipeline.

[0009] Furthermore, the lower cavity of the lower support is provided with a lower partition plate, which is integrally formed with the bottom wall of the lower support cavity. The lower partition plate divides the lower cavity into two cavities that are only connected at the top and front end. The two cavities separated by the lower partition plate are respectively connected to the lower inlet pipe and the lower outlet pipe of another cooling pipeline.

[0010] Furthermore, both the upper inlet pipe and the lower inlet pipe are connected to the side facade of the rear end of the upper cover, and both the lower inlet pipe and the lower outlet pipe are connected to the bottom surface of the rear end of the lower support. In the vertical projection direction, the upper inlet pipe and the lower outlet pipe are located on the same side of the sizing hole, and the lower outlet pipe and the upper inlet pipe are located on the other side of the sizing hole. The lowest point of both the upper inlet pipe and the upper outlet pipe is higher than the lowest point of the upper partition.

[0011] Furthermore, both the first and second grounding grooves are configured as grooves extending from both sides toward the sizing hole. The upper and lower planes of the first and second grounding grooves are arranged in parallel. The closest distance between the first and second grounding grooves decreases from the rear end to the front end of the mold body. The first and second grounding grooves are centrally symmetrical about the axis of the sizing hole.

[0012] Furthermore, extending from the rear end of the mold body to the front end along the axis of the sizing hole, the upper plane of the first grounding groove makes an angle γ with the horizontal plane containing the axis of the sizing hole, and the lower plane of the second grounding groove makes an angle γ with the horizontal plane containing the axis of the sizing hole. From the horizontal direction perpendicular to the axis of the sizing hole, the upper plane of the first grounding groove makes an angle β with the horizontal plane containing the axis of the sizing hole, and the lower plane of the second grounding groove makes an angle β with the horizontal plane containing the axis of the sizing hole, where 0.4° < γ < 0.8°, 0.5° < β < 1.2°. The upper plane of the first grounding groove and the lower plane of the second grounding groove are respectively located above and below the plane containing the axis of the sizing hole, and the lower plane of the first grounding groove and the upper plane of the second grounding groove are respectively located below and above the plane containing the axis of the sizing hole.

[0013] Furthermore, the mid-plane between the two planes of the first grounding groove is located above the horizontal plane containing the axis of the sizing hole and at a distance of h, the mid-plane between the two planes of the second grounding groove is located below the horizontal plane containing the axis of the sizing hole and at a distance of h, and the distance between the upper and lower planes of the sizing hole is H, wherein: 4h < H < 6h.

[0014] Furthermore, the mold body, the upper cover, and the lower support together form the outer shape of the sizing mold, which includes a cylindrical section and a conical section. The cylindrical section is located at the rear end of the mold body, and the conical section is located at the front end of the mold body. The bottom of the lower support is provided with a mounting slide, which extends along the axis of the sizing hole and is configured as a dovetail shape.

[0015] A method for manufacturing a sizing die for a tape wrapping machine, the method comprising the following steps: S1. First, process the upper cover and the lower support. Process the upper cavity and the lower cavity of the upper cover and the lower support respectively. Weld the upper partition and the lower partition onto the upper cavity of the upper cover and the lower cavity of the lower support respectively. S2. The upper cover and lower support are connected to the upper and lower parts of the mold body by friction welding or ultrasonic welding to form the mold body. Then, the overall shape of the mold body, the interface for connecting with the cooling pipes, the grounding groove and the mounting slide are processed so that the rear end of the mold body is cylindrical and the front end is conical. S3. After welding the cooling pipes, the sizing mold is processed and manufactured to obtain the finished sizing mold.

[0016] Compared with the prior art, the technical solution of the present invention has the following beneficial effects: (1). The present invention sets up an upper cavity and a lower cavity inside the upper cover and the lower support respectively, and transports the cooling medium through the upper cavity and the lower cavity through parallel cooling pipes. This removes the heat generated by friction when the core wire passes through the sizing hole in time. At the same time, ground wire grooves are set on both sides of the sizing hole. This can improve the heat dissipation effect of the sizing hole. At the same time, the upper cavity and the lower cavity dissipate heat for the sizing hole and the ground wire groove. The parallel design makes the flow of cooling medium in the upper cavity and the lower cavity independent and does not interfere with each other. Moreover, the cooling medium of each branch in the parallel pipe comes from the same source and has the same temperature, which can ensure that the cooling effect of the upper cavity and the lower cavity is consistent. This achieves the purpose of preventing the sizing hole and the ground wire groove from blocking the entire structure. This not only ensures the stability of the product structure dimensions, but also avoids the impact of sizing hole blockage on production efficiency and product quality. (2). By limiting the positional relationship between the first and second ground wire grooves and the sizing hole, the present invention suppresses the "S-shaped" torsion problem caused by the reverse torque of the two ground wires through the synergy of angles γ and β. Through the synergy of central symmetry and the ratio of h and H, the ground wire cross-linking caused by the sudden change in tension when the wrapping tape is finished is offset, ensuring the "one-line" neatness of the three wires (core wire + double ground wire) on the cross-section of the cable. It effectively avoids the phenomenon that the two ground wires are subjected to opposite and asymmetrical winding forces during wrapping, which easily leads to the relative position of the core wire and the two ground wires shifting after wrapping, and the three wires not being neatly arranged. This is conducive to ensuring the normal progress of subsequent processes and improving the electrical performance and structural consistency of the product cable. Attached Figure Description

[0017] Figure 1 This is a front-view perspective three-dimensional structural diagram of the sizing mold of the present invention; Figure 2 This is a rear-view three-dimensional structural diagram of the sizing mold of the present invention; Figure 3 This is a rear view of the sizing die of the present invention; Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure at point AA; Figure 5 for Figure 3 Schematic diagram of the cross-sectional structure at the middle GG point; Figure 6 for Figure 3 Schematic diagram of the cross-sectional structure at the middle HH; Figure 7 for Figure 3 Schematic diagram of the cross-sectional structure at point BB; Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure at the CC section; Figure 9 for Figure 7 Schematic diagram of the cross-sectional structure at point DD; Figure 10 for Figure 7 Schematic diagram of the cross-sectional structure at the middle EE section; Figure 11 for Figure 7 Schematic diagram of the cross-sectional structure at the FF section.

[0018] In the diagram: 100, mold body; 101, sizing hole; 1021, first grounding groove; 1022, second grounding groove; 200, top cover; 201, upper inlet pipe; 202, upper outlet pipe; 203, upper partition; 204, upper cavity; 300, lower support; 301, mounting slide; 302, lower inlet pipe; 303, lower outlet pipe; 304, lower partition; 305, lower cavity. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of this patent. The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of this application. The singular forms “a,” “described,” and “…” used in the embodiments of this application and the appended claims are also considered. The word "the" is also intended to include the majority form unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0021] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0022] In the description of this application, it should be understood that the terms "first," "second," "third," etc., are used only to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more. "And / or" The description of the relationships between related objects indicates that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects have an "OR" relationship. The invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] To address the limitations of existing technologies, this embodiment provides a technical solution. The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] In existing technologies, cable wrapping molds generally include components such as a feed tube, a conveying mold, and a sizing mold. The cable enters the sizing mold through the feed hole of the conveying mold, and the sizing and wrapping are completed through the sizing hole 101 of the sizing mold. However, there are many problems. For example, when the cable core passes through the sizing hole 101, it rubs against the inner wall of the sizing hole 101 and generates heat. The heat causes changes in the size of the sizing mold, affecting the dimensional stability of the product. On the other hand, the outer layer material of the core is very easy to soften or even melt when heated. Some material adheres to the inner wall of the sizing hole 101 and will block the sizing hole 101 over a long period of time, affecting product quality. At the same time, manual cleaning requires machine shutdown, which affects production efficiency. In addition, the core and the two ground wires need to be neatly wrapped after passing through the sizing mold. However, in existing technologies, when the wrapping material is wrapped, it will apply a certain wrapping force to the core and the two ground wires. Moreover, the wrapping force on the two ground wires is in opposite directions during wrapping, which can easily cause the relative position of the core and the two ground wires to shift after wrapping, affecting the normal progress of subsequent processes.

[0026] See appendix Figure 1 and attached Figure 2A sizing die for a tape wrapping machine is disclosed, which can promptly cool and dissipate heat from the wall of the sizing hole 101, thereby preventing the outer layer material of the product from remaining on the inner wall of the sizing hole 101 due to frictional heat generation, which would affect product quality and reduce production efficiency due to downtime for cleaning. This application discloses a sizing die for a tape wrapping machine comprising: a die body 100, which has a through sizing hole 101. The sizing hole 101 is designed as an elongated cross-section hole, mainly for guiding the core wire through it; see attached... Figure 8-11 The upper cover 200 is installed above the mold body 100, forming a sealed upper cavity 204 with the mold body 100. Welding is the preferred installation method. The lower support 300 is installed below the mold body 100, forming a sealed lower cavity 305 with the mold body 100. Welding is the preferred installation method. Both the upper cavity 204 and the lower cavity 305 are connected in parallel to each other. The function of the upper cavity 204 and the lower cavity 305 is to allow the cooling medium to be introduced to exchange the heat generated by the friction between the inner wall of the sizing hole 101 and the product, thereby achieving heat dissipation. The die body 100, upper cover 200, and lower support 300 together form the sizing die, which includes a cylindrical section and a conical section. The cylindrical section is located at the rear end of the die body 100, and the conical section is located at the front end. A mounting slide 301 is provided at the bottom of the lower support 300, extending along the axis of the sizing hole 101. The mounting slide 301 is designed in a dovetail shape. It should be noted that the rear end of the die body 100 is the end where the core wire enters the sizing hole 101, and the front end is the end where the core wire exits the sizing hole 101. The dovetail-shaped mounting slide 301 has self-centering and alignment functions, ensuring the precise installation position of the sizing die on the wrapping machine and providing good guidance along the axis of the sizing hole 101. Simultaneously, the dovetail structure has high connection strength, capable of withstanding vibrations and impacts generated during wrapping, ensuring the positional stability of the die during operation. Furthermore, the dovetail slide structure facilitates quick installation and disassembly of the die, improving the efficiency of changing between dies of different specifications.

[0027] See appendix Figure 3-9The upper cavity 204 of the upper cover 200 is provided with an upper partition 203. The upper partition 203 is integrally formed with the top wall of the inner cavity of the upper cover 200. The upper partition 203 divides the upper cavity 204 into two cavities that are only connected at the bottom and the front end. The two cavities separated by the upper partition 203 are respectively connected to the upper inlet pipe 201 and the upper outlet pipe 202 of a cooling pipe. The function of the upper partition 203 here is to divide the upper cavity 204 into two cavities. The lower cavity 305 of the lower support 300 is provided with a lower partition 304, which is integrally formed with the bottom wall of the inner cavity of the lower support 300. The lower partition 304 divides the lower cavity 305 into two cavities that are only connected at the top and front end. The two cavities separated by the lower partition 304 are respectively connected to the lower inlet pipe 302 and the lower outlet pipe 303 of another cooling pipe. It should be understood that the partition structure forces the cooling medium to flow through the entire cavity along a specific path after entering from the inlet pipe before it can be discharged from the outlet pipe, thus avoiding short-circuit flow of the cooling medium. The partition divides the cavity into a U-shaped or similar path, increasing the flow path length and residence time of the cooling medium in the cavity, allowing for sufficient heat exchange between the cooling medium and the mold wall, and improving cooling efficiency. The partition design allows the cooling medium to cover the entire area of ​​the cavity, avoiding local overheating or underheating, and ensuring the temperature uniformity of the entire upper cavity 204 area. The upper inlet pipe 201 and the lower inlet pipe 302 are both connected to the side surface of the rear end of the upper cover 200, and the lower inlet pipe 302 and the lower outlet pipe 303 are both connected to the bottom surface of the rear end of the lower support 300. In the vertical projection direction, the upper inlet pipe 201 and the lower outlet pipe 303 are located on the same side of the sizing hole 101, and the lower outlet pipe 303 and the upper inlet pipe 201 are located on the other side of the sizing hole 101. It is understandable that the upper inlet pipe 201 / upper outlet pipe 202 is located on the rear side of the upper cover 200, and the lower inlet pipe 302 / lower outlet pipe 303 is located on the rear bottom surface of the lower support 300, making full use of the space at the rear of the mold and avoiding mutual interference between the pipes. In addition, in the vertical projection direction, the upper inlet pipe 201 and the upper outlet pipe 202 are located on different sides of the sizing hole 101, and the lower inlet pipe 302 and the lower outlet pipe 303 are also located on different sides of the sizing hole 101. This diagonal staggered layout makes the flow direction of the cooling medium in the upper cavity 204 and the lower cavity 305 opposite or intersecting, which helps to eliminate the problem of uneven temperature field that may be caused by unidirectional flow. The lowest point of the upper inlet pipe 201 and the upper outlet pipe 202 is higher than the lowest point of the upper partition 203. It is understandable that the lowest point of the upper inlet pipe 201 and the upper outlet pipe 202 is higher than the lowest point of the upper baffle 203. This means that the cooling medium must accumulate to a certain level in the upper cavity 204 before it can be discharged from the upper outlet pipe 202, ensuring that the upper cavity 204 is always filled with cooling medium and avoiding the phenomenon of "air cooling". In addition, the reasonable pipe height setting is conducive to the discharge of gas in the cavity, avoiding the formation of local hot spots by the retention of air bubbles in the cavity, and further ensuring the uniformity and stability of cooling.

[0028] See appendix Figure 3-9 The mold body 100 is provided with ground wire grooves on both sides of the sizing hole 101 along the horizontal direction. The ground wire grooves include a first ground wire groove 1021 and a second ground wire groove 1022. The extension direction of the first ground wire groove 1021 and the second ground wire groove 1022 is the same as the extension direction of the sizing hole 101. The first ground wire groove 1021 and the second ground wire groove 1022 are both used to guide the ground wires so that the two ground wires and the core wire can pass through together for the wrapping operation. Specifically, both the first grounding groove 1021 and the second grounding groove 1022 are configured as grooves extending from both sides toward the sizing hole 101. This means that both the first grounding groove 1021 and the second grounding groove 1022 are U-shaped through grooves opening to both sides. The upper and lower planes of the first grounding groove 1021 and the second grounding groove 1022 are parallel, meaning the distance between the upper and lower planes of the first grounding groove 1021 and the second grounding groove 1022 remains constant. This application uses a flat-shaped grounding groove instead of a conventional circular grounding hole. The flat-shaped grounding groove can be made relatively narrow to meet the size requirements of the grounding wire, ensuring accurate positioning. Its flat shape also facilitates the discharge of solder ash and other contaminants, preventing blockages and perfectly solving the contradiction of traditional circular grounding holes where "small holes are prone to blockage, and large holes result in inaccurate positioning." Furthermore, the grounding groove can accurately limit the grounding wire's position, preventing it from deviating or vibrating during the wrapping process, thus making the product performance more stable. The parallel structure of the upper and lower planes of the grounding groove ensures that the grounding wire is constrained by a plane rather than a point or line when passing through the groove. The planar contact method makes the grounding wire bear the force evenly when passing through the groove, and will not deform or be damaged due to local stress concentration. Compared with a circular hole, the planar guidance of the flat groove reduces the frictional resistance between the grounding wire and the groove wall, which is conducive to the smooth passage of the grounding wire. The closest distance between the first grounding groove 1021 and the second grounding groove 1022 decreases from the rear end to the front end of the mold body 100, and the first grounding groove 1021 and the second grounding groove 1022 are centrally symmetrical about the axis of the sizing hole 101. This means that the grounding grooves gradually narrow from the rear end to the front end, which plays a progressive guiding and positioning role for the grounding wire, so that the grounding wire is gradually adjusted to the precise position before entering the sizing hole 101, avoiding jamming or damage that may be caused by sudden diameter change. The central symmetry of the first grounding groove 1021 and the second grounding groove 1022 about the axis of the sizing hole 101 ensures that the two grounding wires are subjected to symmetrical force and position during the wrapping process, ensuring the roundness and symmetry of the final cable product. In addition, the symmetrical grounding wire positioning can effectively prevent the cable from twisting or becoming twisted during the wrapping process.

[0029] See appendix Figure 3-6Extending from the rear end to the front end of the mold body 100 along the axis of the sizing hole 101, the upper plane of the first grounding groove 1021 makes an angle γ with the horizontal plane containing the axis of the sizing hole 101, and the lower plane of the second grounding groove 1022 makes an angle γ with the horizontal plane containing the axis of the sizing hole 101. From a horizontal direction perpendicular to the axis of the sizing hole 101, the upper plane of the first grounding groove 1021 makes an angle β with the horizontal plane containing the axis of the sizing hole 101, and the lower plane of the second grounding groove 1022 makes an angle β with the horizontal plane containing the axis of the sizing hole 101. The included angle of the horizontal plane containing the axis of the sizing hole 101 is β, where 0.4° < γ < 0.8°, 0.5° < β < 1.2°, preferably γ = 0.5°, β = 0.8°. The upper plane of the first grounding groove 1021 and the lower plane of the second grounding groove 1022 are respectively located above and below the plane containing the axis of the sizing hole 101. The lower plane of the first grounding groove 1021 and the upper plane of the second grounding groove 1022 are respectively located below and above the plane containing the axis of the sizing hole 101. The midpoint plane between the two planes of the first grounding groove 1021 is located above the horizontal plane containing the axis of the sizing hole 101 and at a distance of h. The midpoint plane between the two planes of the second grounding groove 1022 is located below the horizontal plane containing the axis of the sizing hole 101 and at a distance of h. The distance between the upper and lower planes of the sizing hole 101 is H, where 4h < H < 6h, preferably H = 5h. It can be understood here that the median plane is the plane between two parallel planes and equidistant from the two parallel planes; through the proportional relationship between h and H, combined with the values ​​of the inclination angles γ and β of the first grounding groove 1021 and the second grounding groove 1022, the grounding groove can provide sufficient guiding force to ensure that the grounding wire accurately enters the predetermined position, without causing a sharp increase in the frictional resistance of the grounding wire or causing jamming due to excessive angle; at the same time, the reasonable guiding angle allows the grounding wire and the wrapping material to fit tightly at the sizing hole 101, ensuring the tightness and roundness of the wrapping material.

[0030] This application also provides a method for manufacturing a sizing die for a tape wrapping machine, the method comprising the following steps: S1. First, process the upper cover 200 and the lower support 300. Then, process the upper cavity 204 and the lower cavity 305 of the upper cover 200 and the lower support 300 respectively. Weld the upper partition 203 and the lower partition 304 onto the upper cavity 204 of the upper cover 200 and the lower cavity 305 of the lower support 300 respectively. It can be understood that the partition is connected to the cavity wall by welding, which has high connection strength and good sealing performance. It can withstand the pressure and temperature changes of the cooling medium for a long time without leakage or falling off. In addition, each component is processed separately and then assembled, so that each component can be completed under optimal processing conditions, ensuring the dimensional accuracy and surface quality of each component.

[0031] S2. The upper cover 200 and the lower support 300 are connected to the upper and lower parts of the mold body 100 by friction welding or ultrasonic welding to form the mold as a whole. Then, the overall shape of the mold, the interface for connecting with the cooling pipes, the grounding groove and the mounting slide 301 are machined so that the rear end of the mold is cylindrical and the front end is conical. It can be understood that friction welding and ultrasonic welding are both solid-state welding technologies, which can achieve metallurgical bonding of materials at the joint, with high connection strength and no gaps, ensuring the sealing of the upper cavity 204 and the lower cavity 305. Compared with traditional fusion welding, friction welding and ultrasonic welding have less heat input and a narrow heat-affected zone, which can effectively avoid thermal deformation of the mold as a whole during the welding process. After welding, the overall shape is machined to ensure the coaxiality of the mold body 100, the upper cover 200 and the lower support 300, and to ensure the concentricity of the sizing hole 101 and the mold shape.

[0032] S3. After welding the cooling pipes, the sizing mold is manufactured to obtain the finished sizing mold. It's important to understand that during welding, spot welding for positioning should be performed first, followed by fixing with a fixture before the final welding. Spot welding pre-determines the relative positions of the components, and the fixture overcomes the shrinkage deformation caused by heat during the final welding, effectively controlling the final deformation. Welding the cooling pipes is the final step in the manufacturing process, ensuring that the dimensions and form tolerances of the finished mold are not lost due to the final welding.

[0033] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A sizing die for a tape wrapping machine, characterized in that, include: The mold body (100) has a through sizing hole (101). The top cover (200) is installed above the mold body (100) and forms a closed upper cavity (204) between it and the mold body (100). The lower support (300) is installed below the mold (100) and forms a closed lower cavity (305) between it and the mold (100). The upper cavity (204) and the lower cavity (305) are respectively connected to external cooling medium through cooling pipes to circulate and remove heat, and the two cooling pipes are set in parallel.

2. A sizing die for a tape wrapping machine according to claim 1, characterized in that, The mold body (100) is provided with grounding grooves on both sides of the sizing hole (101) along the horizontal direction. The grounding grooves include a first grounding groove (1021) and a second grounding groove (1022). The extension direction of the first grounding groove (1021) and the second grounding groove (1022) is the same as the extension direction of the sizing hole (101).

3. A sizing die for a tape wrapping machine according to claim 2, characterized in that, The upper cavity (204) of the upper cover (200) is provided with an upper partition (203). The upper partition (203) is integrally formed with the top wall of the inner cavity of the upper cover (200). The upper partition (203) divides the upper cavity (204) into two cavities that are only connected at the bottom and the front end. The two cavities separated by the upper partition (203) are respectively connected to the upper inlet pipe (201) and the upper outlet pipe (202) of a cooling pipeline.

4. A sizing die for a tape wrapping machine according to claim 3, characterized in that, The lower cavity (305) of the lower support (300) is provided with a lower partition (304). The lower partition (304) is integrally formed with the bottom wall of the inner cavity of the lower support (300). The lower partition (304) divides the lower cavity (305) into two cavities that are only connected at the top and the front end. The two cavities separated by the lower partition (304) are respectively connected to the lower inlet pipe (302) and the lower outlet pipe (303) of another cooling pipe.

5. A sizing die for a tape wrapping machine according to claim 4, characterized in that, The upper inlet pipe (201) and the lower inlet pipe (302) are both connected to the side surface of the rear end of the upper cover (200). The lower inlet pipe (302) and the lower outlet pipe (303) are both connected to the bottom surface of the rear end of the lower support (300). In the vertical projection direction, the upper inlet pipe (201) and the lower outlet pipe (303) are located on the same side of the sizing hole (101), and the lower outlet pipe (303) and the upper inlet pipe (201) are located on the other side of the sizing hole (101). The lowest point of the upper inlet pipe (201) and the upper outlet pipe (202) is higher than the lowest point of the upper partition (203).

6. A sizing die for a tape wrapping machine according to any one of claims 2-5, characterized in that, The first grounding groove (1021) and the second grounding groove (1022) are both configured as grooves extending from both sides toward the sizing hole (101). The upper and lower planes of the first grounding groove (1021) and the second grounding groove (1022) are arranged in parallel. The closest distance between the first grounding groove (1021) and the second grounding groove (1022) decreases from the rear end to the front end along the mold body (100). The first grounding groove (1021) and the second grounding groove (1022) are arranged in a centrally symmetrical manner about the axis of the sizing hole (101).

7. A sizing die for a tape wrapping machine according to claim 6, characterized in that, Extending from the rear end of the mold body (100) towards the front end along the axis of the sizing hole (101), the upper plane of the first grounding groove (1021) forms an angle γ with the horizontal plane containing the axis of the sizing hole (101), and the lower plane of the second grounding groove (1022) forms an angle γ with the horizontal plane containing the axis of the sizing hole (101). From a horizontal direction perpendicular to the axis of the sizing hole (101), the upper plane of the first grounding groove (1021) forms an angle β with the horizontal plane containing the axis of the sizing hole (101), and the lower plane of the second grounding groove (1022) forms an angle β with the horizontal plane containing the axis of the sizing hole (101). The angle between the lower plane of the wire groove (1022) and the horizontal plane containing the axis of the sizing hole (101) is β, where 0.4° < γ < 0.8° and 0.5° < β < 1.2°. The upper plane of the first ground wire groove (1021) and the lower plane of the second ground wire groove (1022) are located above and below the plane containing the axis of the sizing hole (101), respectively. The lower plane of the first ground wire groove (1021) and the upper plane of the second ground wire groove (1022) are located below and above the plane containing the axis of the sizing hole (101), respectively.

8. A sizing die for a tape wrapping machine according to claim 7, characterized in that, The mid-plane between the two planes of the first grounding groove (1021) is located above the horizontal plane containing the axis of the sizing hole (101) and the distance is h. The mid-plane between the two planes of the second grounding groove (1022) is located below the horizontal plane containing the axis of the sizing hole (101) and the distance is h. The distance between the upper and lower planes of the sizing hole (101) is H, where: 4h < H < 6h.

9. A sizing die for a tape wrapping machine according to claim 8, characterized in that, The mold body (100), the upper cover (200) and the lower support (300) together form the outer shape of the sizing mold, which includes a cylindrical section and a conical section. The cylindrical section is located at the rear end of the mold body (100) and the conical section is located at the front end of the mold body (100). The bottom of the lower support (300) is provided with a mounting slide (301). The mounting slide (301) extends along the axial direction of the sizing hole (101) and is set in a dovetail shape.

10. A method for manufacturing a sizing die for a tape wrapping machine, based on the sizing die for a tape wrapping machine according to any one of claims 1-9, characterized in that, The steps of this method are as follows: S1. First, process the upper cover (200) and the lower support (300). Process the upper cavity (204) and the lower cavity (305) of the upper cover (200) and the lower support (300) respectively. Weld the upper partition (203) and the lower partition (304) onto the upper cavity (204) of the upper cover (200) and the lower cavity (305) of the lower support (300) respectively. S2. The upper cover (200) and the lower support (300) are respectively connected to the upper and lower parts of the mold body (100) by friction welding or ultrasonic welding to form the mold body as a whole. Then, the shape of the mold body, the interface connected to the cooling pipe, the grounding groove and the mounting slide (301) are processed so that the rear end of the mold body is cylindrical and the front end is conical. S3. After welding the cooling pipes, the sizing mold is processed and manufactured to obtain the finished sizing mold.

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