Pressurizing device and pressurizing method

Abstract

The present application provides a kind of simple structure and can be heated to workpiece pressurizing device and pressurizing method.The pressurizing device of the present application includes pressurizing heat storage unit (6, 6A-6F) and pressure vessel (2).The pressurizing heat storage unit is configured to be transported to the pressurizing area (2) of the workpiece W together with the workpiece (W) and be pressurized together with the workpiece.The pressurizing heat storage unit includes a first heating plate (61), which is configured to be arranged above or below the workpiece and heat the workpiece.The pressurizing process can pressurize the pressurizing heat storage unit from at least the top and bottom directions within a first temperature range.The first heating plate does not have a heat source for heating the first heating plate, but is configured to be preheated to a higher temperature than the first temperature range to store heat, and use the heat accumulated in the first heating plate to act as a heat source for heating the workpiece, so that the temperature of the workpiece in the pressurizing process is within the first temperature range.The pressurizing heat storage unit is subjected to hydrostatic pressure with liquid as the medium in the pressure vessel.

Description

Technical Field

[0001] This invention relates to a pressurizing device and a pressurizing method. Background Technology

[0002] For example, when pressing (crimping) workpieces such as electronic components, a pressing device is used (see, for example, Patent Documents 1 and 2). The pressing device disclosed in Patent Document 1 (hereinafter referred to as the "first prior art device") presses the workpiece using upper and lower dies with planar pressing surfaces. The pressing device disclosed in Patent Document 2 (hereinafter referred to as the "second prior art device") places the workpiece in a pressure vessel filled with liquid and presses the workpiece using the hydrostatic pressure of the liquid. Existing technical documents Patent documents:

[0003] Patent Document 1: Japanese Patent Application Publication No. 2002-254199 Patent Document 2: Japanese Patent Application Publication No. 2008-221306 Patent Document 3: International Publication No. 2014 / 111974 Summary of the Invention

[0004] Among these workpieces, some require pressurization at high temperatures. The first existing device lacks a structure for heating the workpiece (e.g., a heater). Therefore, when pressurizing such workpieces, the pressurizing device itself must possess this structure (e.g., see Patent Document 3). The pressurizing device disclosed in Patent Document 3 employs an upper and lower mold structure with a heater, allowing for pressurization while heating the workpiece. However, when using the first existing device to heat the workpiece, complex modifications such as replacing the upper and lower molds are required.

[0005] On the other hand, in the second existing apparatus, the workpiece can be heated using warm water. However, the workpiece is only heated before pressurization (i.e., at atmospheric pressure). Therefore, the temperature of the warm water is below the boiling point of water at atmospheric pressure (100°C). In other words, the second existing apparatus cannot handle situations where the workpiece is heated to above this boiling point. Here, for example, by increasing the pressure inside a pressure vessel, the temperature of the warm water can be heated to above this boiling point. In this case, the pressure vessel belongs to the first category of pressure vessels. Therefore, this pressure vessel will be subject to various regulations and requires various procedures that were not previously necessary. Furthermore, for example, by using oil as a liquid, the workpiece can be heated to above 100°C. In this case, not only is a new process for removing oil contamination from the workpiece required, but new considerations must also be made regarding the safety of personnel handling high-temperature oil.

[0006] The present invention aims to provide a pressurizing device and pressurizing method with a simple structure that can heat workpieces.

[0007] One embodiment of the pressurizing device of the present invention is a pressurizing device for performing pressurization processing on a workpiece, wherein the pressurizing device includes: a pressurizing heat storage unit configured to be conveyed together with the workpiece to a pressurizing area for performing the pressurization processing and to be pressurized together with the workpiece; and a pressure vessel containing the pressurizing heat storage unit and a liquid, and serving as the pressurizing area, the pressurizing heat storage unit having a heating plate configured to be disposed above or below the workpiece to heat the workpiece, and the pressurization processing being able to be performed within a first temperature range. The pressurizing heat storage unit is pressurized at least from the top and bottom. The heating plate does not have a heat source for heating the heating plate, but is configured to store heat by being heated to a preheating temperature higher than the first temperature range. The heat stored in the heating plate is used as a heat source to heat the workpiece, so that the temperature of the workpiece in the pressurization process is within the first temperature range. The pressurizing heat storage unit and the workpiece are transported together to the pressurization area. In the pressure vessel, hydrostatic pressure is applied to the pressurizing heat storage unit using the liquid as a medium.

[0008] One embodiment of the pressurization method of the present invention is a pressurization method performed by a pressurization device for pressurizing a workpiece, wherein the pressurization method includes: a preheating treatment in which a first heating plate and a second heating plate are heated to a preheating temperature; a placement treatment in which the workpiece is placed between the preheated first heating plate and the second heating plate; a conveying treatment in which the first heating plate, the second heating plate, and the workpiece are conveyed to a pressurization area where the workpiece is pressurized; and a pressurization treatment in which, within the pressurization area, at least from a vertical direction, the conveyed first heating plate, the second heating plate, and the workpiece are pressurized within a first temperature range. The workpiece is pressurized. In the preheating treatment, the preheating temperature is set to a temperature higher than the first temperature range. The first heating plate and the second heating plate are heated to the preheating temperature by a heat source disposed outside each of the first heating plate and the second heating plate. In the pressurization treatment, the first heating plate, the second heating plate and the workpiece are immersed in the liquid inside the pressure vessel of the pressurization device. The liquid is used as a medium to apply hydrostatic pressure to the first heating plate, the second heating plate and the workpiece. The heat stored in the first heating plate and the second heating plate is used to heat the workpiece so that the temperature of the workpiece is within the first temperature range. Invention Effects

[0009] The present invention provides a pressurizing device and pressurizing method with a simple structure that can heat the workpiece. Attached Figure Description

[0010] Figure 1 This is a schematic diagram illustrating an embodiment of the pressurizing device of the present invention. Figure 2 This is a schematic side view of an embodiment of the pressurized heat storage unit of the present invention. Figure 3 It is shown Figure 1 The flowchart shows the operation of the pressurization device. Figure 4 This is a flowchart illustrating the assembly heating process included in the above operation. Figure 5 This is a schematic diagram illustrating the above assembly and heating process. Figure 6 This is a schematic diagram of the pressurization device, showing the state of the pressurization process included in the above operation. Figure 7 These are schematic diagrams illustrating various modifications of the pressurized heat storage unit of the present invention. (a) shows the unit in the first modification, (b) shows the unit in the second modification, (c) shows the unit in the third modification, (d) shows the unit in the fourth modification, (e) shows the unit in the fifth modification, and (f) shows the unit in the sixth modification. Explanation of reference numerals in the attached figures 1: This device (pressurization device) 2: Pressure vessel (pressurized area) 6: This unit (pressurized heat storage unit) 6A~6F: This unit (pressurized heat storage unit) 61: First heating plate (heating plate) 62: Second heating plate (heating plate) 63: First insulation board (insulation board) 64: Second insulation board (insulation board) 67: Pressure pad (heat insulation board, second heat insulation board) 68: First insulation board (insulation board) 68c: Concave 68d: convex part 69: Second insulation board (insulation board) 69c: Concave 69d: convex part 8: Preheating device (heat source) W: Workpiece Detailed Implementation

[0011] The following describes embodiments of the pressurization heat storage unit (hereinafter referred to as "this unit"), the pressurization device (hereinafter referred to as "this device"), and the pressurization method (hereinafter referred to as "this method") of the present invention. In the following description, reference will be made to the accompanying drawings as appropriate. In the drawings, the same reference numerals are used to denote the same parts and elements, and repeated descriptions are omitted. Furthermore, for ease of explanation, the dimensions of the elements may be exaggerated and are not limited to the proportions shown in the drawings.

[0012] In the following description, unless otherwise stated, "lower surface" means the plane facing downwards and "upper surface" means the plane facing upwards.

[0013] pressurization device Composition of the pressurization device Figure 1 This is a schematic diagram illustrating an embodiment of the device.

[0014] This device 1 heats and pressurizes the workpiece W. This device 1 is, for example, a hydrostatic pressurization device that pressurizes the workpiece W using hydrostatic pressure with liquid Lq as the medium. This device 1 includes a pressure vessel 2, a top cover 3, a basket 4, a pin 5, the main unit 6, a heating and pressurizing device 7, a preheating device 8, and a sealing device 9. The respective structures of the pressure vessel 2, the top cover 3, the basket 4, the pin 5, the heating and pressurizing device 7, and the sealing device 9 are the same as those in known hydrostatic pressurization devices. Therefore, detailed descriptions of these structures are omitted in the following description.

[0015] "Workpiece W" is the object to be pressurized by this device 1, such as a rectangular sheet substrate, a flat substrate carrying electronic components, circuits, etc. Specifically, workpiece W is a ceramic green stack used to manufacture multilayer ceramic electronic components (e.g., multilayer ceramic capacitors (MLCCs), chip inductors, low-temperature co-fired ceramics (LTCCs)). Workpiece W has an upper surface Wa and a lower surface Wb (see [reference needed]). Figure 2 (The same applies below).

[0016] Furthermore, in this invention, the shape of the workpiece W is only required to fit into the unit 6 and be pressurized, and is not limited to a sheet or plate shape. The upper surface Wa and lower surface Wb of the workpiece W are preferably planar.

[0017] "Liquid Lq" is, for example, water. In this embodiment, when the workpiece W is pressurized, warm water heated to the pressurization temperature is used as liquid Lq. "Pressurization temperature" refers to a temperature below the boiling point (e.g., 80°C to 90°C).

[0018] When workpiece W is pressurized, pressure vessel 2 contains liquid Lq, basket 4, unit 6, and workpiece W. Pressure vessel 2 is, for example, a cylindrical shape with a bottom. Pressure vessel 2 has two pin insertion holes 2a, an inlet hole 2b, and an upper opening 2c. Pressure vessel 2 functions as a pressurized area in this invention.

[0019] The pin insertion hole 2a is a through hole for inserting the pin 5 when the pressure vessel 2 is closed. The pin insertion hole 2a extends horizontally through the upper part of the pressure vessel 2. The two pin insertion holes 2a are arranged on the same axis.

[0020] The inlet hole 2b is a through hole used to introduce liquid Lq into the interior of pressure vessel 2. The inlet hole 2b extends vertically through the bottom of pressure vessel 2.

[0021] The upper opening 2c is an upward-facing opening in the pressure vessel 2. The upper opening 2c is located at the upper end of the pressure vessel 2.

[0022] The top cover 3 is a cover used to open or close the upper opening 2c of the pressure vessel 2. The shape of the top cover 3 is, for example, a flattened cylinder in the vertical direction. The top cover 3 has a pin insertion hole 3a, an outlet hole 3b, a discharge valve 3c, and a lower surface 3d.

[0023] The pin insertion hole 3a is a through hole for inserting the pin 5 when the pressure vessel 2 is closed. The pin insertion hole 3a extends horizontally through the center of the upper cover 3 in the vertical direction.

[0024] The outlet hole 3b is a through hole used to drain liquid Lq from the inside of the pressure vessel 2 when the upper cover 3 is configured with the upper opening 2c. The outlet hole 3b extends vertically through the lower part of the upper cover 3. The outlet hole 3b communicates with the pin insertion hole 3a.

[0025] Discharge valve 3c is a valve used to open or close outlet port 3b. Discharge valve 3c is located at the upper end of outlet port 3b. When pin 5 is inserted into pin insertion hole 3a, discharge valve 3c closes outlet port 3b. When pin 5 is not inserted into pin insertion hole 3a, discharge valve 3c is in the open state of outlet port 3b.

[0026] The basket 4 is used to contain the workpiece assembly 10 (described later). The basket 4 is made of, for example, a mesh material or perforated metal, allowing liquid Lq to flow freely in and out. The basket 4 is configured to be mounted on or detached from the lower surface 3d of the upper cover 3.

[0027] Pin 5 is used to secure the top cover 3 to the pressure vessel 2. Pin 5 is, for example, cylindrical in shape. Pin 5 is movable in the horizontal direction.

[0028] Figure 2This is a schematic side view illustrating an embodiment of unit 6. In the following description, [the following text is in conjunction with...]. Figure 2 Refer to in a timely manner Figure 1 .

[0029] This unit 6 is used to transport workpiece W and serves as a heat source and pressure mold for heating workpiece W. This unit 6 includes a first heating plate 61, a second heating plate 62, a first heat insulation plate 63, a second heat insulation plate 64, a first metal plate 65, a second metal plate 66, and multiple protective plates (not shown, the same below).

[0030] The first heating plate 61 is used to heat the workpiece W. The first heating plate 61 is made of a known insulating material (e.g., glass fiber, etc.) having a low thermal conductivity (e.g., below 0.05 W / m·K). In other words, the first heating plate 61 is only composed of an insulating material capable of accumulating a specified amount of heat (described later) during the processing time (described later). That is, the first heating plate 61 does not have a heat source (e.g., a heater, etc.) for heating itself. The shape of the first heating plate 61 is, for example, a rectangular plate. When viewed from above, the size of the first heating plate 61 is larger than that of the workpiece W. The first heating plate 61 has an upper surface 61a and a lower surface 61b. The first heating plate 61 is an example of a heating plate in this invention.

[0031] "Processing time" refers to the time from preheating treatment (ST11: see...) Figure 4 From the end of the process, at least until the pressurization treatment of workpiece W (ST3: see...) Figure 3 (The same applies below) The time up to the end.

[0032] "Specified heat" refers to the heat applied during assembly processing (ST12: see...). Figure 4 After the pressurization process (ST3) is completed, the workpiece W is heated to bring its temperature within the first temperature range (described later) by the amount of heat energy.

[0033] "First temperature range" refers to the recommended temperature range for workpiece W during the pressure treatment (ST3). The first temperature range only needs to be a temperature range that will not have an adverse effect on workpiece W (e.g., insufficient heating, overheating, etc.), and can be set according to the characteristics of workpiece W. The first temperature range is preferably above the boiling point of water at atmospheric pressure, for example, 110°C to 150°C.

[0034] The second heating plate 62 is used to heat the workpiece W. The second heating plate 62 is made of a known insulating material (e.g., glass fiber) having a low thermal conductivity (e.g., below 0.05 W / m·K). In other words, the second heating plate 62 is composed only of an insulating material capable of storing a specified amount of heat during the processing time. That is, the second heating plate 62 does not have a heat source (e.g., a heater) for heating itself. The shape of the second heating plate 62 is, for example, a rectangular plate. The second heating plate 62 has an upper surface 62a and a lower surface 62b. In this embodiment, the material and shape of the second heating plate 62 are the same as those of the first heating plate 61. The second heating plate 62 is an example of a heating plate in this invention.

[0035] Furthermore, in this invention, the material and shape of the second heating plate 62 may also be different from those of the first heating plate 61.

[0036] The first heat insulation plate 63 is used to suppress the cooling (heat dissipation from the first heating plate 61) of the first heating plate 61. The first heat insulation plate 63 is made, for example, of a known heat insulation material (e.g., glass fiber) having a low thermal conductivity (e.g., below 0.05 W / m·K). The shape of the first heat insulation plate 63 is, for example, a rectangular plate. When viewed from above, the size of the first heat insulation plate 63 is larger than that of the first heating plate 61. The first heat insulation plate 63 has an upper surface 63a and a lower surface 63b. The outer edge of the lower surface 63b is, for example, chamfered. The first heat insulation plate 63 is an example of a heat insulation plate in this invention.

[0037] Furthermore, in this invention, the material of the first heat insulation plate 63 can be the same as or different from the material of the first heating plate 61. Additionally, the thermal conductivity of the first heat insulation plate 63 is preferably less than or equal to the thermal conductivity of the first heating plate 61, and more preferably less than the thermal conductivity of the first heating plate 61.

[0038] The second heat insulation plate 64 is used to suppress the cooling (heat dissipation from the second heating plate 62) of the second heating plate 62. The second heat insulation plate 64 is made, for example, of a known heat insulation material (e.g., glass fiber) having a low thermal conductivity (e.g., below 0.05 W / m·K). The shape of the second heat insulation plate 64 is, for example, a rectangular plate. When viewed from above, the size of the second heat insulation plate 64 is larger than that of the second heating plate 62. The second heat insulation plate 64 has an upper surface 64a and a lower surface 64b. The outer edge of the upper surface 64a is, for example, chamfered. In this embodiment, the material and shape of the second heat insulation plate 64 are the same as those of the first heat insulation plate 63. The second heat insulation plate 64 is an example of a heat insulation plate in this invention.

[0039] Furthermore, in this invention, the materials of the first heat insulation plate 63 and the second heat insulation plate 64 may be the same as or different from the material of the first heating plate 61.

[0040] Furthermore, in this invention, the thermal conductivity of the first heat insulation plate 63 and the second heat insulation plate 64 is preferably less than or equal to the thermal conductivity of the first heating plate 61, and more preferably less than the thermal conductivity of the first heating plate 61.

[0041] Furthermore, in this invention, the material and shape of the second heat insulation plate 64 may be different from those of the first heat insulation plate 63.

[0042] The first metal plate 65 is used to uniformly conduct heat from the first heating plate 61 to the workpiece W. The first metal plate 65 is made of, for example, a metallic material with high thermal conductivity (e.g., copper, stainless steel, etc.). The thermal conductivity of the first metal plate 65 is much greater than that of the first heating plate 61 (e.g., several to tens of times greater). The shape of the first metal plate 65 is, for example, a rectangular plate. When viewed from above, the first metal plate 65 has the same shape (size) as the first heating plate 61. The first metal plate 65 has an upper surface 65a and a lower surface 65b.

[0043] The second metal plate 66 is used to uniformly conduct heat from the second heating plate 62 to the workpiece W. The second metal plate 66 is made of, for example, a metallic material with high thermal conductivity (e.g., copper, stainless steel, etc.). The thermal conductivity of the second metal plate 66 is much greater than that of the second heating plate 62 (e.g., several to tens of times greater). The shape of the second metal plate 66 is, for example, a rectangular plate. When viewed from above, the second metal plate 66 has the same shape (size) as the second heating plate 62. The second metal plate 66 has an upper surface 66a and a lower surface 66b. In this embodiment, the material and shape of the second metal plate 66 are the same as those of the first metal plate 65.

[0044] Furthermore, in this invention, the material and shape of the second metal plate 66 may be different from those of the first metal plate 65.

[0045] The protective sheet is used to protect the first heating plate 61, the second heating plate 62, the first heat insulation plate 63, the second heat insulation plate 64, the first metal plate 65, and the second metal plate 66. The protective sheet prevents adhesion between the components configured in a clamping manner. The protective sheet is made of, for example, a known resin material (e.g., silicone).

[0046] Here, when the workpiece W is sent into this device 1 (pressure vessel 2), the workpiece W has been pre-assembled in this unit 6 to form the workpiece assembly 10.

[0047] The following description mainly refers to the attached figures. Figure 1The heating and pressurizing device 7 is used to heat the liquid Lq and pressurize it. The heating and pressurizing device 7 includes a constant temperature bath 71, a first flow channel L1, a second flow channel L2, a third flow channel L3, a fourth flow channel L4, a first valve V1, a second valve V2, a circulation pump P1, a booster pump P2, and a heater H.

[0048] A thermostatic bath 71 heats liquid Lq and keeps both liquid Lq and pressure vessel 2 at a constant temperature. A predetermined amount of liquid Lq is stored in the thermostatic bath 71. Pressure vessel 2 is immersed in the liquid Lq stored in the thermostatic bath 71. As a result, pressure vessel 2 is kept at a constant temperature by liquid Lq.

[0049] The first flow channel L1 to the fourth flow channel L4 are the flow channels for liquid Lq. The first valve V1 is a known three-way valve used to switch between the connection of the second flow channel L2 and the inlet port 2b, and the connection of the fourth flow channel L4 and the inlet port 2b. The second valve V2 is a known on / off valve used to open or close the second flow channel L2. The circulation pump P1 is a known pump used to circulate liquid Lq in the first flow channel L1 to the third flow channel L3 and in the thermostatic bath 71. The booster pump P2 is a known pump used to pressurize liquid Lq. The first valve V1 is connected to the third flow channel L3. The second valve V2 is connected to the second flow channel L2. The first flow channel L1 is connected to the thermostatic bath 71 and the circulation pump P1. The second flow channel L2 is connected to the circulation pump P1 and the thermostatic bath 71. The third flow channel L3 is connected between the circulation pump P1 and the second valve V2 in the second flow channel L2 and to the inlet port 2b. The fourth flow channel L4 is connected to the booster pump P2 and the first valve V1.

[0050] Heater H is used to heat liquid Lq. Heater H is installed on the thermostatic bath 71 and is capable of heating liquid Lq.

[0051] The preheating device 8 heats the components in unit 6 that require preheating treatment (ST11) (e.g., the first heating plate 61 and the second heating plate 62) to a preheating temperature (described later). The preheating device 8 is, for example, a known heating device (e.g., an oven, an electric heating plate, etc.). The preheating device 8 is disposed outside the pressure vessel 2. That is, the preheating device 8 is disposed outside the first heating plate 61 and the second heating plate 62. The preheating device 8 is an example of a heat source in this invention.

[0052] "Preheating temperature" refers to the temperature at which the first heating plate 61 and the second heating plate 62 can accumulate a specified amount of heat during the processing time. The preheating temperature is set to a temperature higher than a first temperature range (e.g., 200°C).

[0053] The sealing device 9 evacuates the interior of the bag 11 containing the workpiece assembly 10 and seals the bag 11. The sealing device 9 is, for example, a known vacuum sealing device. The sealing device 9 is disposed outside the pressure vessel 2. The bag 11 is, for example, a known vacuum packaging bag.

[0054] The operation of this device Next, the operation of this device 1 will be explained. In the following explanation, refer to... Figure 1 and Figure 2 .

[0055] Figure 3 This is a flowchart illustrating the operation of device 1.

[0056] First, perform assembly heat treatment (ST1).

[0057] "Assembly heat treatment (ST1)" refers to the process of assembling the workpiece assembly 10 and then heating the workpiece W. Assembly heat treatment (ST1) is an example of this method.

[0058] Figure 4 This is a flowchart illustrating the assembly heat treatment (ST1). Figure 5 This is a schematic diagram illustrating the assembly heat treatment (ST1).

[0059] First, the preheating device 8 heats the first heating plate 61 and the second heating plate 62 to the preheating temperature (ST11: preheating treatment).

[0060] Furthermore, in this invention, preheating treatment (ST11) can also be performed on the first metal plate 65 and the second metal plate 66.

[0061] Furthermore, in this invention, preheating treatment (ST11) can also be performed on the workpiece W. In this case, for example, the workpiece W can be heated together with the first heating plate 61 and the second heating plate 62 while being sandwiched between them.

[0062] Next, the workpiece assembly 10 is assembled (ST12: Assembly Process). Specifically, a first heat insulation plate 63 is placed on a protective sheet, another protective sheet is placed on the first heat insulation plate 63, a preheated first heating plate 61 is placed on the protective sheet, another protective sheet is placed on the first heating plate 61, a preheated first metal plate 65 is placed on the protective sheet, another protective sheet is placed on the first metal plate 65, and the workpiece W is placed on the protective sheet. Next, another protective sheet is placed on the workpiece W, a preheated second metal plate 66 is placed on the protective sheet, another protective sheet is placed on the second metal plate 66, a preheated second heating plate 62 is placed on the protective sheet, another protective sheet is placed on the second heating plate 62, a second heat insulation plate 64 is placed on the protective sheet, and another protective sheet is placed on the second heat insulation plate 64. As a result, the workpiece W is positioned between the first heating plate 61 and the second heating plate 62. At this time, heating of the workpiece W begins. Assembly process (ST12) is an example of placement process in this invention.

[0063] In the workpiece assembly 10, a first heating plate 61 is positioned below the workpiece W, covering it when viewed from below (heating plate configuration). A first heat insulation plate 63 is positioned below the first heating plate 61, covering it when viewed from below, in the opposite direction to the workpiece W (heat insulation plate configuration). A first metal plate 65 is positioned between the workpiece W and the first heating plate 61 (metal plate configuration). A second heating plate 62 is positioned above the workpiece W, covering it when viewed from above (heating plate configuration). A second heat insulation plate 64 is positioned above the second heating plate 62, covering it when viewed from above, in the opposite direction to the workpiece W (heat insulation plate configuration). A second metal plate 66 is positioned between the workpiece W and the second heating plate 62 (metal plate configuration). Each protective plate is respectively positioned between the workpiece W and the first metal plate 65, between the first metal plate 65 and the first heating plate 61, between the first heating plate 61 and the first heat insulation plate 63, between the workpiece W and the second metal plate 66, between the second metal plate 66 and the second heating plate 62, between the second heating plate 62 and the second heat insulation plate 64, below the first heat insulation plate 63, and above the second heat insulation plate 64.

[0064] Furthermore, in this invention, the protective sheet can be configured only as needed, or it can be configured only in some of the aforementioned locations.

[0065] Thus, the workpiece assembly 10 is composed of this unit 6 and the workpiece W. As a result, a portion of the heat accumulated in the first heating plate 61 is conducted to the first metal plate 65, and after being evenly distributed on the first metal plate 65, it is conducted to the workpiece W. Similarly, a portion of the heat accumulated in the second heating plate 62 is also conducted to the workpiece W. As a result, the workpiece W is heated to a temperature above the first temperature range (at least the lower limit temperature) and below the preheating temperature.

[0066] As previously described, the first heat insulation plate 63 is positioned below the first heating plate 61 so as to cover it when viewed from below. The second heat insulation plate 64 is positioned above the second heating plate 62 so as to cover it when viewed from above. Therefore, the first heat insulation plate 63 suppresses heat release from the first heating plate 61 to the atmosphere, while the second heat insulation plate 64 suppresses heat release from the second heating plate 62 to the atmosphere. As a result, even if the first heating plate 61 does not have a heat source for heating itself, the temperature drop of the first heating plate 61 can be suppressed. The same applies to the second heating plate 62.

[0067] Next, the workpiece assembly 10 is vacuum-sealed inside the bag 11 (ST13: Sealing process). Since vacuum sealing is also performed in a known hydrostatic pressurization device, its detailed description is omitted.

[0068] The following description mainly refers to the attached figures. Figures 1-3 Next, the workpiece assembly 10 is conveyed (placed) into the pressure vessel 2 (ST2: conveying process). Specifically, the packaged workpiece assembly 10 is housed in the basket 4 and conveyed together with the basket 4 to the bottom of the upper cover 3. That is, this unit 6 is conveyed together with the workpiece W and the basket 4. Then, the basket 4 is mounted on the lower surface 3d of the upper cover 3.

[0069] At this time, the first valve V1 connects the second flow channel L2 to the inlet port 2b. The second valve V2 is in the closed state. The circulation pump P1 circulates the liquid Lq in, for example, the sequence of circulation pump P1, second flow channel L2, third flow channel L3, inside pressure vessel 2, inside thermostatic bath 71, first flow channel L1, and circulation pump P1. The heater H heats the liquid Lq inside thermostatic bath 71. As a result, the temperature of the liquid Lq inside pressure vessel 2 is maintained at the pressurization temperature.

[0070] Next, the top cover 3 is conveyed to the pressure vessel 2 to seal the upper opening 2c of the pressure vessel 2. At this time, the pin insertion hole 3a communicates with the pin insertion hole 2a, and the discharge valve 3c is in the open state. Therefore, the liquid Lq inside the pressure vessel 2 is discharged to the constant temperature bath 71 through the outlet hole 3b, the pin insertion holes 2a and 3a. The basket 4 and the encapsulated workpiece assembly 10 are immersed in the liquid Lq inside the pressure vessel 2.

[0071] Next, pin 5 is inserted into pin insertion holes 2a and 3a. As a result, discharge valve 3c is closed. The top cover 3 is then secured to pressure vessel 2.

[0072] Next, the first valve V1 connects the fourth flow channel L4 to the inlet port 2b. At this time, the interior of the pressure vessel 2 is filled with liquid Lq. Then, the second valve V2 opens. At this time, the circulation pump P1 circulates the liquid Lq in, for example, the sequence of circulation pump P1, second flow channel L2, interior of the thermostatic bath 71, first flow channel L1, and circulation pump P1.

[0073] Figure 6 This is a schematic diagram of the device 1 showing the state in which pressurization processing (ST3) is being performed. In the following description, [the following text is in conjunction with...] Figure 6 Refer to in a timely manner Figures 1-3 .

[0074] Next, the workpiece W is pressurized (ST3: pressurization process). Specifically, the booster pump P2 increases the pressure of the liquid Lq inside the pressure vessel 2 to the pressurization pressure (e.g., 200 MPa) by delivering liquid Lq into the pressure vessel 2. At this time, hydrostatic pressure is applied to the workpiece assembly 10 (this unit 6 and workpiece W) using liquid Lq as the medium. That is, this unit 6 and workpiece W are pressurized together. In other words, the pressure vessel 2 serves as the pressurization area for performing the pressurization process (ST3). Furthermore, the workpiece W is sandwiched between the first metal plate 65 and the second metal plate 66 through a protective plate, with the upper surface 65a and the lower surface 66b being planar. That is, when the workpiece W is pressurized, it is pressurized in a state of contact with a planar rigid body. Therefore, it is possible to prevent the workpiece W from being pressurized in a bent or folded state. The pressurization process (ST3) begins when the pressure reaches the pressurization pressure and ends after a predetermined time (e.g., 5 minutes). When the pressurization process is complete, the booster pump P2 stops operating (pressurizing), and the liquid Lq is depressurized.

[0075] In the pressurization process (ST3), although the temperatures of the first heating plate 61 and the second heating plate 62 are lower than the preheating temperature, they are still maintained above the first temperature range (at least above the lower limit temperature). Furthermore, although the temperature of the workpiece W is lower than the temperature at the end of the assembly heating process (ST1), it is still within the first temperature range. Thus, the preheating temperature is preset in the pressurization process (ST3) to maintain the temperatures of the first heating plate 61 and the second heating plate 62 above the lower limit temperature and the temperature of the workpiece W within the first temperature range. In other words, the first heating plate 61 and the second heating plate 62 act as heat sources to heat the workpiece W, ensuring that the temperature of the workpiece W remains within the first temperature range during the pressurization process (ST3). Furthermore, in the pressurization process (ST3), the workpiece assembly 10 (this unit 6) is subjected to pressure (isostatic pressure) applied by the liquid Lq from all directions. The workpiece W is mainly pressurized by this unit 6 from a uniaxial direction (vertical direction).

[0076] As described above, the first heat insulation plate 63 is positioned below the first heating plate 61 so as to cover it when viewed from below. The second heat insulation plate 64 is positioned above the second heating plate 62 so as to cover it when viewed from above. Therefore, the first heat insulation plate 63 inhibits heat conduction from the first heating plate 61 to the liquid Lq, while the second heat insulation plate 64 inhibits heat conduction from the second heating plate 62 to the liquid Lq. As a result, even if the first heating plate 61 does not have a heat source for heating itself, the temperature drop of the first heating plate 61 can be prevented. The same applies to the second heating plate 62. Furthermore, due to the placement of the first heat insulation plate 63 and the second heat insulation plate 64, the bag body 11 will not come into contact with the first heating plate 61 and the second heating plate 62, which are heated to high temperatures. Therefore, damage such as melting of the bag body 11 can be prevented.

[0077] Furthermore, as previously described, the first metal plate 65 is disposed between the workpiece W and the first heating plate 61, and the second metal plate 66 is disposed between the workpiece W and the second heating plate 62. The thermal conductivity of the first metal plate 65 and the second metal plate 66 is much greater than that of the first heating plate 61 and the second heating plate 62. Therefore, heat from the first heating plate 61 can be conducted relatively uniformly on the first metal plate 65 and then to the workpiece W. The same applies to the second metal plate 66.

[0078] Furthermore, as previously stated, in this invention, the workpiece W is heated only by the components (first heating plate 61 and second heating plate 62) that have undergone preheating treatment (ST11). Therefore, unlike known hydrostatic pressurizing devices, this invention does not require a waiting time from the moment the workpiece W is immersed in the liquid Lq until the temperatures of the workpiece W and the liquid Lq stabilize. Similarly, in this invention, the liquid Lq may not be heated to the pressurization temperature, and the pressurization temperature may be lower (e.g., room temperature). Thus, in this invention, the electricity and time required for heating the liquid Lq and stabilizing its temperature, as in known hydrostatic pressurizing devices, are not consumed.

[0079] Next, the workpiece assembly 10 is removed from the pressure vessel 2 (ST4: Removal Process). Specifically, the pressure of the liquid Lq inside the pressure vessel 2 is reduced to atmospheric pressure, and the operation of the circulation pump P1 is stopped (circulation). Next, the pins 5 are pulled out from the pin insertion holes 2a and 3a, and the top cover 3 is removed from the pressure vessel 2 (the upper opening 2c is opened). Next, the basket 4 is removed from the top cover 3 and taken out together with the workpiece assembly 10.

[0080] By configuring this unit 6 in this way, even if this unit 6 itself does not have a heat source for heating itself, the workpiece W can be heated to a high temperature of over 100°C during the pressurization process (ST3) without using a liquid Lq above 100°C (pressure vessel 2 is not a Class I pressure vessel). Furthermore, by simply mounting this unit 6 onto the workpiece W (assembling the workpiece assembly 10), the workpiece W can be heated to a high temperature of over 100°C during the pressurization process (ST3). Therefore, this unit 6 can be easily applied to known (i.e., existing) hydrostatic pressurization devices without requiring modification to those devices.

[0081] Variations Next, modifications to this unit 6 will be described, mainly focusing on the differences from the embodiments described above (hereinafter referred to as "first embodiments"). In the following description of the modifications, for ease of explanation, elements identical to those in the first embodiment and elements having the same functions will be labeled with the same reference numerals as those in the first embodiment, and their descriptions will be omitted. In the following description, reference will be made as appropriate. Figures 1-2 .

[0082] First Variation Example to Sixth Variation Example Figure 7 The diagram shows various variations of this unit 6. (a) shows unit 6A in the first variation, (b) shows unit 6B in the second variation, (c) shows unit 6C in the third variation, (d) shows unit 6D in the fourth variation, (e) shows unit 6E in the fifth variation, and (f) shows unit 6F in the sixth variation. Figure 7 (d) shows a schematic cross-sectional view of this unit 6D.

[0083] like Figure 7 As shown in (a), this unit 6A does not include the first metal plate 65 and the second metal plate 66. In this structure, the uniformity of heat conduction to the workpiece W is slightly reduced compared to the first embodiment. However, apart from this, this unit 6A has the same effect as this unit 6.

[0084] like Figure 7 As shown in (b), unit 6B does not include the second heating plate 62 and the second metal plate 66. The second heat insulation plate 64 is disposed above the workpiece W, that is, in the opposite direction to the direction in which the first heating plate 61 is disposed relative to the workpiece W. In this structure, the workpiece W is heated only by the first heating plate 61. Therefore, compared with the first embodiment and the first variation, the heat conducted to the workpiece W is reduced. However, apart from this, unit 6B has the same effect as unit 6A.

[0085] like Figure 7 As shown in (c), this unit 6C does not have a second heating plate 62 and a second metal plate 66, but instead has a pressure pad 67. When the workpiece W is pressurized, the pressure pad 67 deforms according to the surface shape of the workpiece W, thereby applying uniform pressure to the workpiece W. The pressure pad 67 is made, for example, of a known fibrous material with high flexibility and low thermal conductivity. That is, the pressure pad 67 also functions as a heat insulation material. The pressure pad 67 is an example of the heat insulation plate and the second heat insulation plate in this invention. In this structure, when the workpiece W is pressurized, pseudo-isostatic pressure is applied to the workpiece W from approximately all directions (multi-directional) by the first metal plate 65 and the pressure pad 67.

[0086] like Figure 7 As shown in (d), this unit 6D does not have a first heat insulation plate 63, a second heat insulation plate 64, a first metal plate 65 and a second metal plate 66, but has a first heating plate 61, a second heating plate 62, a first heat insulation plate 68 and a second heat insulation plate 69.

[0087] The material of the first heat insulation plate 68 is the same as that of the first heat insulation plate 63. The first heat insulation plate 68 has an upper surface 68a, a lower surface 68b, a recess 68c, and a protrusion 68d. In the upper surface 68a, the portion excluding the outer edge (the central portion) is rectangularly recessed downwards, forming the recess 68c. In the upper surface 68a, the outer edge where the recess 68c is not formed forms a protrusion 68d that, when viewed from above, forms a rectangular frame surrounding the entire circumference of the recess 68c. That is, the protrusion 68d is disposed on the entire circumference of the outer edge of the upper surface 68a. When viewed from above, the shape of the recess 68c is approximately the same as that of the first heating plate 61. In the vertical direction, the length (depth) of the recess 68c is the same as or slightly smaller than the length (thickness) of the first heating plate 61. The first heating plate 61 is disposed (embedded) within the recess 68c. The first heat insulation plate 68 is an example of a heat insulation plate in this invention.

[0088] The material of the second heat insulation plate 69 is the same as that of the second heat insulation plate 64. The second heat insulation plate 69 has an upper surface 69a, a lower surface 69b, a recess 69c, and a protrusion 69d. In the lower surface 69b, the portion excluding the outer edge (the central portion) is rectangularly recessed upwards, forming the recess 69c. In the lower surface 69b, the outer edge where the recess 69c is not formed forms a protrusion 69d that, when viewed from below, forms a rectangular frame surrounding the entire circumference of the recess 69c. That is, the protrusion 69d is disposed on the entire circumference of the outer edge of the lower surface 69b. When viewed from below, the shape of the recess 69c is approximately the same as that of the second heating plate 62. In the vertical direction, the length (depth) of the recess 69c is the same as or slightly smaller than the length (thickness) of the second heating plate 62. The second heating plate 62 is disposed (embedded) within the recess 69c. The second heat insulation plate 69 is an example of a heat insulation plate in this invention.

[0089] According to this structure, except for the upper surface 61a, the first heating plate 61 is wrapped by the first heat insulation plate 68. Except for the lower surface 62b, the second heating plate 62 is wrapped by the second heat insulation plate 69. Therefore, compared with the first embodiment, the temperature drop of the first heating plate 61 and the second heating plate 62 is suppressed.

[0090] like Figure 7 As shown in (e), this unit 6E does not include the first heat insulation plate 63, the second heat insulation plate 64, the first metal plate 65, and the second metal plate 66. In this structure, compared with the first embodiment, the heat storage time of the first heating plate 61 and the second heating plate 62 is shortened. However, if the time is shorter and the temperature is lower than in the first embodiment, this unit 6E can heat the workpiece W like this unit 6. The first heating plate 61 and the second heating plate 62 are configured such that their respective volumes (heat capacities) are larger than those in the first embodiment.

[0091] like Figure 7As shown in (f), this unit 6F does not include the second heating plate 62, the second heat insulation plate 64, and the second metal plate 66. In this structure, the workpiece W continuously dissipates heat. However, if the time is shorter and the temperature is lower compared to the first embodiment and the fifth variation, this unit 6F can heat the workpiece W like this unit 6.

[0092] Summarize According to the above description, units 6, 6A to 6F are configured to be conveyed together with workpiece W into pressure vessel 2 for pressurization processing (ST3) and pressurized together with workpiece W. Unit 6 includes a first heating plate 61 configured to be disposed below workpiece W for heating workpiece W. Pressurization processing (ST3) can pressurize unit 6 at least from the vertical direction within a first temperature range. The first heating plate 61 does not have a heat source for heating itself. The first heating plate 61 stores heat by being heated to a preheating temperature and uses this heat as a heat source to heat workpiece W, keeping the temperature of workpiece W within the first temperature range during pressurization processing (ST3). According to this structure, units 6, 6A to 6F adopt a simple structure that uses the heat stored in the preheated first heating plate 61 to heat workpiece W, thereby enabling the workpiece W to be heated. Therefore, even though units 6, 6A to 6F do not have a heat source for heating themselves, the workpiece W can be heated to a temperature above 100°C during pressurization (ST3) without using a liquid Lq above 100°C (pressure vessel 2 is not a Class I pressure vessel). In other words, by simply mounting units 6, 6A to 6F onto the workpiece W (assembling workpiece assembly 10), the workpiece W can be heated to a temperature above 100°C during pressurization (ST3). As a result, units 6, 6A to 6F can be easily applied to known hydrostatic pressurization devices without requiring modifications to the device.

[0093] As described above, the first heating plate 61 is made of heat-insulating material. With this structure, the first heating plate 61 can store heat for a relatively long time. As a result, temperature drops in the first heating plate 61 are suppressed.

[0094] According to the above description, units 6, 6A to 6D, and 6F include first heat insulation plates 63 and 68, which are configured to be positioned in the opposite direction (below) to the direction of the first heating plate 61 and the direction in which the workpiece W is disposed. The first heat insulation plates 63 and 68 are made of heat-insulating material. The thermal conductivity of the first heat insulation plates 63 and 68 is less than or equal to the thermal conductivity of the first heating plate 61. With this structure, the first heat insulation plates 63 and 68 can suppress the transfer of heat from the first heating plate 61 to the liquid Lq. As a result, even if the first heating plate 61 does not have a heat source for heating itself, the temperature drop of the first heating plate 61 can be further suppressed.

[0095] As described above, the first heat insulation plate 68 has a recess 68c and a protrusion 68d. The first heating plate 61 is disposed within the recess 68c. This structure further suppresses the temperature drop of the first heating plate 61.

[0096] As described above, units 6, 6A to 6D include second heat insulation plates 64 and 69, which are configured to be positioned in the opposite direction (above) to the direction in which the first heating plate 61 is positioned relative to the workpiece W. This structure suppresses the release of heat from the workpiece W.

[0097] According to the above description, the pressure pad 67, which functions as the second heat insulation plate in this invention, is made of an elastic material that can deform according to the surface shape of the workpiece W. Based on this structure, when the workpiece W is pressurized, pseudo-isostatic pressure is applied to the workpiece W from approximately all directions (multi-directional) by the first metal plate 65 and the pressure pad 67.

[0098] As described above, units 6, 6A, 6D, and 6E each include a second heating plate 62, which is configured to be positioned above the workpiece W to heat it. The second heating plate 62 does not have a heat source for heating itself. The second heating plate 62 stores heat by being heated to a preheating temperature and utilizes this heat to act as a heat source for heating the workpiece W, keeping the temperature of the workpiece W within a first temperature range during the pressure treatment (ST3). With this structure, the performance of heating the workpiece W by units 6, 6A to 6E is improved. Furthermore, temperature drops in the workpiece W are suppressed.

[0099] As described above, the second heating plate 62 is made of heat-insulating material. With this structure, the second heating plate 62 can store heat for a longer period. As a result, temperature drops in the second heating plate 62 are suppressed.

[0100] As described above, units 6, 6A to 6D include second heat insulation plates 64 and 69, which are configured to be positioned in the opposite direction (above) to the direction of the second heating plate 62 and the direction in which the workpiece W is disposed. The second heat insulation plate 64 is made of heat-insulating material. The thermal conductivity of the second heat insulation plate 64 is less than or equal to the thermal conductivity of the second heating plate 62. With this structure, the temperature drop of the second heating plate 62 is further suppressed.

[0101] As described above, the second heat insulation plate 69 has a recess 69c and a protrusion 69d. The second heating plate 62 is disposed within the recess 69c. With this structure, the temperature drop of the second heating plate 62 is further suppressed.

[0102] As described above, this unit 6 includes a first metal plate 65 and a second metal plate 66. The first metal plate 65 is disposed between the workpiece W and the first heating plate 61. The second metal plate 66 is disposed between the workpiece W and the second heating plate 62. The thermal conductivity of the first metal plate 65 and the second metal plate 66 is greater than that of the first heating plate 61 and the second heating plate 62. According to this structure, heat from the first heating plate 61 is conducted relatively uniformly on the first metal plate 65 and then to the workpiece W. The same applies to the second metal plate 66.

[0103] According to the above description, this device 1 includes units 6, 6A to 6F and a pressure vessel 2. Within the pressure vessel 2, hydrostatic pressure is applied to the workpiece assembly 10 using liquid Lq as the medium. Based on this structure, even if units 6, 6A to 6F do not have a heat source for heating themselves, the workpiece W can be heated to a temperature above 100°C during the pressurization process (ST3) without using liquid Lq at a temperature above 100°C. Furthermore, by using this simple structure of mounting units 6, 6A to 6F onto the workpiece W (assembling the workpiece assembly 10), the workpiece W can be heated to a temperature above 100°C during the pressurization process (ST3).

[0104] Other implementation methods In this invention, the device 1 is not limited to a hydrostatic pressurizing device. That is, for example, the device 1 can also be a pressurizing device that uses a mold with a planar pressing surface to pressurize the workpiece W. In this case, the space adjacent to the pressing surface (located in the vertical direction of the pressing surface) functions as the pressurizing area in this invention. Even with this structure, the units 6, 6A to 6F can be applied to the pressurizing device without modifying it.

[0105] In this invention, units 6, 6A, and 6E may also not have a first heating plate 61 or a second heating plate 62.

[0106] In this invention, units 6, 6A to 6C, and 6F may also not have the first heat insulation plate 63 and / or the second heat insulation plate 64.

[0107] In this invention, units 6, 6B, 6C, and 6F may also not have the first metal plate 65 and / or the second metal plate 66.

[0108] In this invention, the first heating plate 61 can also function as the second heating plate 62, and the second heating plate 62 can also function as the first heating plate 61. That is, for example, the first heating plate 61 can be positioned above the workpiece W, and the second heating plate 62 can be positioned below the workpiece W.

[0109] In this invention, the first heat insulation plate 63 can also function as the second heat insulation plate 64, and the second heat insulation plate 64 can also function as the first heat insulation plate 63. That is, for example, the first heat insulation plate 63 can also be disposed above the second heating plate 62, and the second heat insulation plate 64 can also be disposed below the first heating plate 61.

[0110] In this invention, the first heat insulation plate 63 only needs to have a structure that prevents the bag body 11 from contacting the first heating plate 61, and it may also not cover the first heating plate 61 when viewed from below. That is, for example, the first heat insulation plate 63 may only cover the sides and edges of the first heating plate 61. The same applies to the second heat insulation plate 64.

[0111] In this invention, the first metal plate 65 can also function as the second metal plate 66, and the second metal plate 66 can also function as the first metal plate 65. That is, for example, the first metal plate 65 can also be disposed below the second heating plate 62, and the second metal plate 66 can also be disposed above the first heating plate 61.

[0112] In this invention, the materials of the first heating plate 61 and the second heating plate 62 are any materials capable of storing a specified amount of heat, and are not limited to heat-insulating materials. That is to say, for example, the materials of the first heating plate 61 and the second heating plate 62 can also be metals.

[0113] In this invention, units 6, 6A to 6D, and 6F may also include cushioning components made of elastic materials such as rubber. These cushioning components are disposed between the components to prevent gaps from forming between the components of units 6, 6A to 6D, and 6F. In this case, a protective sheet may also be configured as a cushioning component. Furthermore, unit 6 may also include a cushioning component made of elastic materials such as rubber, which, when viewed from the side, covers the boundaries between the components. In this structure, gaps with residual air are not formed during vacuum sealing, thereby preventing damage to the bag 11 that may occur due to such gaps during pressurization.

[0114] In the third variation, the pressure pad 67 can also be positioned below the workpiece W. In this case, the unit 6C can also include a second heating plate 62 and a second metal plate 66 to replace the first heating plate 61 and the first metal plate 65.

[0115] In the fourth variation, the unit 6D may also have a first heat insulation plate 63 instead of the first heat insulation plate 68, or a second heat insulation plate 64 instead of the second heat insulation plate 69.

[0116] In the fourth variation, the unit 6D may also not have either the first heat insulation plate 68 or the second heat insulation plate 69.

[0117] In the fourth variation, the first heating plate 61 can be disposed within the recess 68c in a manner abutting against the protrusion 68d, or it can be disposed within the recess 68c separately from the protrusion 68d. Similarly, the second heating plate 62 can be disposed within the recess 69c in a manner abutting against the protrusion 69d, or it can be disposed within the recess 69c separately from the protrusion 69d.

[0118] In this invention, the first temperature range may also include temperatures below the boiling point of water (100°C) at atmospheric pressure, or even below that boiling point. That is, for example, units 6, 6A to 6F can be used not only to heat workpiece W to temperatures above 100°C, but also to heat workpiece W to temperatures below 100°C.

[0119] In this invention, the device 1 may also be without the preheating device 8 and the packaging device 9. In this case, the preheating device 8 and the packaging device 9 are configured separately from the device 1.

[0120] In this invention, the configuration of each of the units 6, 6A to 6F in the first embodiment and the first to sixth modifications can be replaced or combined as appropriate, as long as they can heat the workpiece W. They can also be configured to be opposite in the up and down direction relative to the workpiece W.

[0121] Embodiments of the present invention Next, embodiments of the present invention, which can be understood from the above embodiments, will be described with reference to the terminology and reference numerals used in the above embodiments.

[0122] The first embodiment of the present invention is a heat storage unit for pressurization (e.g., this unit 6, 6A to 6F), which is configured to be transported together with a workpiece (e.g., workpiece W) to a pressurization area (e.g., pressure vessel 2) where a pressurization process (e.g., pressurization process (ST3)) is performed on the workpiece, and is pressurized together with the workpiece. The heat storage unit for pressurization includes a heating plate (e.g., a first heating plate 61), which is configured to be disposed above or below the workpiece to heat the workpiece. The pressurization process can pressurize the heat storage unit for pressurization at least from the vertical direction within a first temperature range. The heating plate does not have a heat source for heating the heating plate, but is configured to store heat by being heated to a preheating temperature higher than the first temperature range, and utilize the heat stored in the heating plate to act as a heat source for heating the workpiece, so that the temperature of the workpiece in the pressurization process is within the first temperature range. Based on this structure, this unit can heat the workpiece in a simple manner.

[0123] The second embodiment of the present invention is a pressurized heat storage unit according to the first embodiment, wherein the heating plate is made of heat-insulating material. According to this structure, the temperature drop of the first heating plate is suppressed.

[0124] The third embodiment of the present invention is a pressurization heat storage unit (e.g., this unit 6, 6A to 6D, 6F) according to the first embodiment, wherein the pressurization heat storage unit includes a heat insulation plate (e.g., a first heat insulation plate 63, 68), the heat insulation plate is configured to be disposed in a direction opposite to the direction in which the heating plate is disposed and the workpiece is disposed, the heat insulation plate is made of a heat insulation material, and the thermal conductivity of the heat insulation plate is less than or equal to the thermal conductivity of the heating plate. According to this structure, the temperature drop of the first heating plate is further suppressed.

[0125] The fourth embodiment of the present invention is a pressurized heat storage unit (e.g., this unit 6D) according to the third embodiment, wherein the heat insulation plate (e.g., the first heat insulation plate 68) includes: a protrusion (e.g., protrusion 68d) disposed around the entire circumference of the outer edge of the heat insulation plate; and a recess (e.g., recess 68c) disposed in a manner surrounded by the protrusion, wherein the heating plate is disposed in the recess. According to this structure, the temperature drop of the first heating plate is further suppressed.

[0126] The fifth embodiment of the present invention is a pressurization heat storage unit (e.g., this unit 6, 6A to 6D) according to any one of the first to third embodiments, wherein the pressurization heat storage unit includes a second heat insulation plate (e.g., second heat insulation plates 64, 69, pressure pad 67), the second heat insulation plate is configured to be disposed in a direction opposite to the direction in which the workpiece is disposed and the heating plate is disposed, the second heat insulation plate is made of heat insulation material, and the thermal conductivity of the second heat insulation plate is less than or equal to the thermal conductivity of the heating plate. This structure can suppress the release of heat from the workpiece.

[0127] The sixth embodiment of the present invention is a heat storage unit for pressurization according to the fifth embodiment (e.g., this unit 6C), wherein the second heat insulation plate (e.g., pressure pad 67) is made of an elastic material that can deform with the shape of the workpiece surface during the pressurization process. Based on this structure, pseudo-isostatic pressure is applied to the workpiece from approximately all directions (multi-directional).

[0128] The seventh embodiment of the present invention is a pressurization heat storage unit (e.g., this unit 6, 6A, 6D, 6E) according to any one of the first to fourth embodiments, wherein the pressurization heat storage unit comprises: a first heating plate (e.g., a first heating plate 61) disposed below the workpiece and functioning as the heating plate; and a second heating plate (e.g., a second heating plate 62) disposed above the workpiece and functioning as the heating plate. This structure can suppress the drop in workpiece temperature.

[0129] The eighth embodiment of the present invention is a pressurization heat storage unit (e.g., this unit 6, 6A, 6D) according to the seventh embodiment related to the third embodiment, wherein the pressurization heat storage unit includes: a first heat insulation plate disposed below the first heating plate and functioning as the heat insulation plate; and a second heat insulation plate (e.g., second heat insulation plate 64, 69) disposed above the second heating plate and functioning as the heat insulation plate. This structure can further suppress the temperature drop of the second heating plate.

[0130] The ninth embodiment of the present invention is a pressurization heat storage unit (e.g., this unit 6) according to the seventh embodiment, wherein the pressurization heat storage unit comprises: a first metal plate (e.g., first metal plate 65) disposed between the first heating plate and the workpiece, having a thermal conductivity greater than that of the first heating plate; and / or a second metal plate (e.g., second metal plate 66) disposed between the second heating plate and the workpiece, having a thermal conductivity greater than that of the second heating plate. According to this structure, the heat from the first heating plate and the second heating plate can be conducted to the workpiece W relatively evenly.

[0131] The tenth embodiment of the present invention is a pressurizing device (e.g., this device 1) for performing pressurizing treatment (e.g., pressurizing treatment (ST3)) on a workpiece (e.g., workpiece W), wherein the pressurizing device includes: a heat storage unit for pressurizing (e.g., this unit 6, 6A to 6F) according to the first embodiment; and a pressurizing region (e.g., pressure vessel 2) for performing the pressurizing treatment, wherein the heat storage unit for pressurizing is conveyed to the pressurizing region together with the workpiece. According to this structure, a workpiece can be heated to a high temperature of over 100°C during pressure treatment using a simple structure.

[0132] The eleventh embodiment of the present invention is a pressurizing device according to the tenth embodiment, wherein the pressurizing device includes a pressure vessel (e.g., pressure vessel 2) for accommodating the pressurizing heat storage unit and a liquid (e.g., liquid Lq) and functioning as the pressurizing area, wherein hydrostatic pressure is applied to the pressurizing heat storage unit in the pressure vessel using the liquid as a medium. According to this structure, a workpiece can be heated to a high temperature of over 100°C during pressure treatment using a simple structure.

[0133] The twelfth embodiment of the present invention is a pressurization method performed by a pressurization device (e.g., this device 1) that performs pressurization processing (e.g., pressurization processing (ST3)) on a workpiece (e.g., workpiece W), wherein the pressurization method includes: a preheating process (e.g., preheating process (ST11)) in which a first heating plate (e.g., first heating plate 61) and a second heating plate (e.g., second heating plate 62) are heated to a preheating temperature; a placement process (e.g., assembly process (ST12)) in which the workpiece is placed between the preheated first heating plate and the second heating plate; and a conveying process (e.g., conveying process (ST2)) in which the first heating plate, the second heating plate, and the workpiece are conveyed to... The workpiece is pressurized in a pressurized area; and a pressurization process (e.g., pressurization process (ST3)) in which, within the pressurized area, the first heating plate, the second heating plate, and the workpiece are pressurized at least from the top and bottom directions within a first temperature range. In the preheating process, the preheating temperature is set to a temperature higher than the first temperature range. The first heating plate and the second heating plate are heated to the preheating temperature by a heat source (e.g., preheating device 8) disposed outside each of the first heating plate and the second heating plate. In the pressurization process, the workpiece is heated by the heat stored in each of the first heating plate and the second heating plate, so that the temperature of the workpiece is within the first temperature range. According to this structure, the workpiece can be heated to a high temperature of over 100°C without using a liquid above 100°C during pressurization.

Claims

1. A pressurizing device for applying pressure to a workpiece, wherein, The pressurizing device includes: A heat storage unit for pressurization, configured to be conveyed together with the workpiece to a pressurization zone where the pressurization process is performed, and to be pressurized together with the workpiece; and A pressure vessel that houses the pressurized heat storage unit and the liquid, and serves as the pressurized zone. The pressurized heat storage unit includes a heating plate, which is configured to be positioned above or below the workpiece to heat the workpiece. The pressurization process can pressurize the heat storage unit for pressurization at least from the vertical direction within a first temperature range. The heating plate does not have a heat source for heating itself, but is configured to store heat by being heated to a preheating temperature higher than the first temperature range, and utilize the heat stored in the heating plate to act as a heat source for heating the workpiece, so that the temperature of the workpiece during the pressurization process is within the first temperature range. The pressurization heat storage unit is transported to the pressurization area together with the workpiece. Within the pressure vessel, hydrostatic pressure is applied to the pressurized heat storage unit using the liquid as a medium.

2. The pressurizing device according to claim 1, wherein, The heating plate is made of heat-insulating material.

3. The pressurizing device according to claim 1, wherein, The pressurized heat storage unit includes a heat insulation plate, which is configured to be positioned in a direction opposite to that of the heating plate and the workpiece. The heat insulation panel is made of heat insulation material. The thermal conductivity of the insulation plate is less than or equal to that of the heating plate.

4. The pressurizing device according to claim 3, wherein, The heat insulation panel has the following features: A protrusion, which is disposed around the entire circumference of the outer edge of the heat insulation plate; and A recess, which is configured to be surrounded by the protrusion. The heating plate is disposed in the recess.

5. The pressurizing device according to any one of claims 1 to 3, wherein, The pressurized heat storage unit includes a second heat insulation plate, which is configured to be positioned in a direction opposite to the direction in which the heating plate is positioned relative to the workpiece. The second heat insulation panel is made of heat insulation material. The thermal conductivity of the second insulation plate is less than or equal to that of the heating plate.

6. The pressurizing device according to claim 5, wherein, The second heat insulation plate is made of an elastic material that can deform with the shape of the workpiece surface during the pressurization process.

7. The pressurizing device according to any one of claims 1 to 4, wherein, The pressurized heat storage unit includes: A first heating plate, positioned below the workpiece, serves as the heating plate; and The second heating plate is positioned above the workpiece and performs the function of the heating plate.

8. The pressurizing device according to claim 1, wherein, The pressurized heat storage unit includes: The first heating plate is positioned below the workpiece and serves as the heating plate. The second heating plate is positioned above the workpiece and performs the function of the heating plate. The first heat insulation plate is disposed below the first heating plate; as well as The second heat insulation plate is positioned above the second heating plate. The first and second heat insulation panels are made of heat insulation material. The thermal conductivity of the first insulation plate is less than or equal to the thermal conductivity of the first heating plate. The thermal conductivity of the second insulation plate is less than or equal to that of the second heating plate.

9. The pressurizing device according to claim 7, wherein, The pressurized heat storage unit includes: A first metal plate, disposed between the first heating plate and the workpiece, has a thermal conductivity greater than that of the first heating plate; and / or The second metal plate, disposed between the second heating plate and the workpiece, has a thermal conductivity greater than that of the second heating plate.

10. A pressurization method performed by a pressurization device for pressurizing a workpiece, wherein, The pressurization method includes: Preheating treatment, in which the first heating plate and the second heating plate are heated to the preheating temperature; The placement process involves placing the workpiece between the preheated first heating plate and the second heating plate. A conveying process, in which the first heating plate, the second heating plate, and the workpiece are conveyed to a pressurization area where the workpiece is pressurized; and The pressurization process involves applying pressure to the first heating plate, the second heating plate, and the workpiece, at least vertically, within the pressurization zone and a first temperature range. In the preheating treatment, The preheating temperature is set to a temperature higher than the first temperature range. The first heating plate and the second heating plate are heated to the preheating temperature by a heat source disposed outside each of the first heating plate and the second heating plate. In the pressurization process, The first heating plate, the second heating plate, and the workpiece are immersed in the liquid inside the pressure vessel of the pressurizing device. Hydrostatic pressure is applied to the first heating plate, the second heating plate, and the workpiece using the liquid as a medium. The workpiece is heated by the heat stored in the first heating plate and the second heating plate, so that the temperature of the workpiece is within the first temperature range.

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