A high speed connector soldering apparatus and method

Abstract

The application belongs to the technical field of electronic assembly welding of electronic and electrical products, and discloses a high-speed connector tin plating device and method, which comprises a protective film, a plurality of pin through holes are formed in the protective film, the positions of the pin through holes correspond to the positions of gold-plated pins of the high-speed connector one by one, a protection device is arranged, a sunken slot and an opening structure are arranged on the protection device, the sunken slot is used for accommodating the body of the high-speed connector, and the opening structure is used for exposing the gold-plated pins of the high-speed connector; in use, the protective film is located between the protection device and the high-speed connector, and the gold-plated pins of the high-speed connector correspond to pass through the pin through holes and are exposed through the opening structure. The tin plating height of the gold-plated pins of the high-speed connector can be improved, tin beads in the tin plating process can be prevented from splashing into the body of the connector, and the reliability of the welding point connection is ensured.

Description

Technical Field

[0001] This invention belongs to the field of electronic assembly and welding technology for electronic and electrical products, specifically a high-speed connector tinning device and method. Background Technology

[0002] High-speed connectors are critical components in electronic devices used for the stable and reliable transmission of high-speed digital signals between multilayer printed circuit boards (PCBs) or different PCBs. Compared to ordinary connectors, high-speed connectors are typically designed for GHz-level high-speed signals and have extremely high bandwidth. Ordinary connectors often cause signal reflection, attenuation, crosstalk, and timing jitter, while high-speed connectors, through impedance matching, shielding design, and shortest return path design, can minimize these negative effects, ensuring that signals are not distorted when passing through the connector, and guaranteeing high-speed, high-volume, low-latency, and low-loss data transmission.

[0003] In the assembly and soldering process of high-speed connectors, the tinning height of the gold-plated leads is a core factor affecting the soldering quality. Insufficient tinning height of the gold-plated leads can lead to "gold brittleness" and a high void ratio in the solder joints of the connector after soldering. Specifically, such defects have the following serious effects: 1. The dielectric constant of air holes caused by a large void ratio is much lower than that of the PCB and solder, which will cause a sudden change in the characteristic impedance at that location, resulting in impedance discontinuity and signal reflection; 2. Incomplete solder joints will increase signal path loss, leading to increased insertion loss and weaker signal strength; 3. The void structure will act like a tiny antenna, radiating or receiving electromagnetic waves, thus exacerbating electromagnetic interference problems; 4. A large void ratio means a small contact area between the solder joint and the pin, resulting in weak mechanical bonding force, making the solder joint prone to cracking under vibration, impact, and daily insertion and extraction forces; 5. Due to the different coefficients of thermal expansion of the connector, PCB, and solder, stress will be generated on the solder joint. A qualified solder joint can absorb these stresses through its toughness, but a solder joint with a large void ratio is prone to stress concentration and is more likely to crack; 6. If gold-plated leads are directly soldered without tinning, the gold and tin will react to form brittle intermetallic compounds, resulting in fragile and unreliable solder joints, leading to poor mechanical strength, unreliable electrical connections, and a risk of long-term failure.

[0004] Currently, the existing technologies for soldering high-speed connectors mainly employ either tilted soldering without protection or the use of non-woven fabric for protection. However, the connector body frame and gold-plated pins are generally at the same horizontal height, and the connector itself is a multi-module assembly structure. During the soldering process, flux needs to be applied. Without protection, even tilting at a certain angle only increases the soldering height of the outer pins, and the overall soldering height is still insufficient. Furthermore, solder beads can easily enter the connector body. While using non-woven fabric provides some protection and increases the overall soldering height, insufficient soldering height and solder beads entering the connector body through the gaps in the non-woven fabric still exist, resulting in a high failure rate after soldering and affecting the long-term operational reliability of electronic equipment. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a high-speed connector tinning device and method.

[0006] To achieve the above objectives, the present invention employs the following technical solution: In a first aspect, the present invention provides a high-speed connector tinning device, comprising: a protective film having a plurality of pin through holes, the positions of which correspond one-to-one with the gold-plated pins of the high-speed connector; a protective device having a recessed slot and an opening structure; the recessed slot being used to accommodate the body of the high-speed connector, and the opening structure being used to expose the gold-plated pins of the high-speed connector; in use, the protective film is located between the protective device and the high-speed connector, and the gold-plated pins of the high-speed connector pass through the pin through holes and are exposed through the opening structure.

[0007] Optionally, the protective film is a polyimide film.

[0008] Optionally, the thickness of the polyimide film is not greater than 0.05 mm.

[0009] Optionally, the protective device is a graphite protective device.

[0010] Optionally, the protective film is further provided with a plurality of first positioning holes, and the protective device is provided with a plurality of positioning posts corresponding to the first positioning holes. The protective film is positioned by the cooperation of the first positioning holes and the positioning posts.

[0011] Optionally, it also includes a connector; the protective device is also provided with a protective device mounting hole, and the protective film is also provided with a protective film mounting hole; in use, one end of the connector is connected to the protective device, and the other end passes through the protective device mounting hole and the protective film mounting hole in sequence and is connected to the mounting hole of the high-speed connector.

[0012] Optionally, the connector is a mounting screw.

[0013] Optionally, the protective device may also be equipped with a handle.

[0014] Optionally, the handles are located on both sides of the protective device.

[0015] In a second aspect, the present invention provides a method for soldering a high-speed connector based on the aforementioned soldering device, comprising: covering the bottom of a high-speed connector with a protective film, such that the gold-plated pins of the high-speed connector extend through pin holes in the protective film; placing the high-speed connector covered with the protective film into a recessed slot of the protective device, such that the gold-plated pins of the high-speed connector are exposed through the opening structure; wherein the protective film is sandwiched between the high-speed connector and the protective device; driving the protective device and immersing the gold-plated pins of the high-speed connector into a solder pot for soldering; and removing the protective device and the protective film after soldering is completed.

[0016] Compared with the prior art, the present invention has the following beneficial effects: This invention relates to a high-speed connector soldering device. It employs a protective film with pin through-holes and a protective device with recessed slots and openings. During use, the protective film is positioned between the protective device and the high-speed connector, with the gold-plated pins of the connector passing through the pin through-holes and exposed through the openings. The protective film precisely covers the connector body, exposing only the gold-plated pins requiring soldering. The combined use of the protective film and the protective device provides dual protection for the connector body, effectively preventing solder splatter from entering the connector during soldering. Simultaneously, the protective film adheres tightly to the bottom of the high-speed connector, maximizing solder contact with the roots of the gold-plated pins. This effectively increases the soldering height of the gold-plated pins, ensuring a consistent solder level and guaranteeing that the solder joints are fully filled with solder. This avoids problems such as gold brittleness and high void ratios caused by insufficient soldering height, significantly improving the mechanical strength and electrical connection reliability of the solder joints and reducing rework and repair costs due to connector soldering defects. Furthermore, the protective film will not damage the connector body or gold-plated pins during installation. The protective device is designed according to the structure of the high-speed connector and can be fully matched with the structure of the high-speed connector without any interference. The installation process is simple and can effectively improve production efficiency. Moreover, the device and method can be applied to different models of high-speed connectors and have good versatility. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the protective film structure according to an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the protection device structure according to an embodiment of the present invention.

[0019] Figure 3 This is a front view schematic diagram of the high-speed connector tinning device in use according to an embodiment of the present invention.

[0020] Figure 4 This is a rear view schematic diagram of the high-speed connector tinning device in use according to an embodiment of the present invention.

[0021] Among them: 1-protective film; 2-protective device; 3-high-speed connector; 4-gold-plated pins. Detailed Implementation

[0022] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0023] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0024] The present invention will now be described in further detail with reference to the accompanying drawings: See Figures 1 to 4 In one embodiment of the present invention, a high-speed connector tinning device is provided to solve the problems of insufficient tinning height and large void ratio after soldering in high-speed connectors.

[0025] Specifically, the high-speed connector tinning device of the present invention includes a protective film 1 and a protective device 2.

[0026] The protective film 1 has a plurality of pin holes, the positions of which correspond one-to-one with the positions of the gold-plated pins 4 of the high-speed connector 3; the protective device 2 has a recessed groove and an opening structure; the recessed groove is used to accommodate the body of the high-speed connector 3, and the opening structure is used to expose the gold-plated pins 4 of the high-speed connector 3; in use, the protective film 1 is located between the protective device 2 and the high-speed connector 3, and the gold-plated pins 4 of the high-speed connector 3 pass through the pin holes and are exposed through the opening structure.

[0027] Explained, the protective film 1 is generally made of high-temperature resistant material. It is perforated according to the size, spacing, and layout of the gold-plated pins 4 of the high-speed connector 3 to ensure precise matching between the protective film 1 and the high-speed connector 3 and the protective device 2, thus protecting the body of the high-speed connector 3 and the exposed gold-plated pins 4. During manufacturing, the protective film 1 is cut using a film-cutting device according to the distribution of the gold-plated pins 4 of the high-speed connector 3 and the corresponding device shape, ensuring that only the gold-plated pins 4 are exposed after assembly to protect the body of the high-speed connector 3.

[0028] The protection device 2 is generally made of high temperature resistant and reusable materials. The protection device 2 has a recessed groove at the body position of the high-speed connector 3 and a full opening at the gold-plated pin 4 position to ensure that the protective film 1 can be completely attached to the high-speed connector 3 and the protection device 2.

[0029] This invention relates to a high-speed connector soldering device. It comprises a protective film 1 with pin through-holes and a protective device 2 with recessed slots and openings. During use, the protective film 1 is positioned between the protective device 2 and the high-speed connector 3, with the gold-plated pins 4 of the connector 3 passing through the pin through-holes and exposed through the openings. The protective film 1 precisely covers the connector body, exposing only the gold-plated pins 4 that require soldering. The combined use of the protective film 1 and the protective device 2 provides dual protection for the connector body, effectively preventing solder splatter during soldering and the entry of excess material into the connector. Simultaneously, the protective film 1 fits tightly against the bottom of the high-speed connector 3, allowing the solder to contact the roots of the gold-plated pins 4 to the maximum extent. This effectively increases the soldering height of the gold-plated pins 4, ensuring a consistent solder height and guaranteeing that the solder joints are fully filled with solder. This avoids problems such as gold brittleness and high void ratios caused by insufficient soldering height, significantly improving the mechanical strength and electrical connection reliability of the solder joints and reducing rework and repair costs due to connector soldering defects. Furthermore, the protective film 1 will not damage the connector body and gold-plated pins 4 during installation. The protective device 2 is designed according to the structure of the high-speed connector 3 and can be fully matched with the structure of the high-speed connector 3 without interference. The installation process is simple and can effectively improve production efficiency. Moreover, the device and method can be applied to different models of high-speed connectors 3 and have good versatility.

[0030] In one possible implementation, the protective film 1 is a polyimide film.

[0031] Explained, polyimide film is a high-temperature resistant material that can withstand the high temperature of the solder pot without melting or deforming. At the same time, it has good flexibility and can fit tightly to the bottom of the connector, effectively preventing solder from splashing into the connector body during the soldering process.

[0032] In one possible implementation, the thickness of the polyimide film is no greater than 0.05 mm.

[0033] Explanatoryly, using a polyimide film with a thickness of less than 0.05mm can maximize the contact between the solder and the root of the gold-plated pin 4 of the connector, achieving sufficient soldering height. At the same time, the flexibility of the film allows it to fit tightly against the bottom of the connector, providing good protection.

[0034] In one possible implementation, the protective device 2 is a graphite protective device.

[0035] Explanatoryly, graphite material is heat-resistant and reusable. By making a recessed groove in the body of the high-speed connector 3 and making a full opening in the gold-plated pin 4, the body of the high-speed connector 3 can be protected, while the gold-plated pin 4 can be exposed for tinning.

[0036] In one possible implementation, the protective film 1 is further provided with a plurality of first positioning holes, and the protective device 2 is provided with a plurality of positioning posts corresponding to the first positioning holes. The protective film 1 is positioned by the cooperation of the first positioning holes and the positioning posts.

[0037] Explanatoryly, by setting positioning posts, the protective film 1 can be reliably positioned, avoiding misalignment during installation and ensuring precise matching between the protective film 1 and the high-speed connector 3 and the protection device 2.

[0038] In one possible implementation, a connector is also included; the protective device 2 is also provided with a protective device 2 mounting hole, and the protective film 1 is also provided with a protective film 1 mounting hole; in use, one end of the connector is connected to the protective device 2, and the other end passes through the protective device 2 mounting hole and the protective film 1 mounting hole in sequence and is connected to the mounting hole of the high-speed connector 3.

[0039] Explanatoryly, by setting the connectors, the protective film 1, the protective device 2 and the high-speed connector 3 are ensured to have a stable connection and tight fit during the tinning process, and the solder can also be prevented from seeping into the body of the high-speed connector 3.

[0040] In one possible implementation, the connector is a mounting screw.

[0041] Explanatoryly, the high-speed connector 3 and the protective film 1 are fixed in the fixed position of the protective device 2 using mounting screws. After tinning, the mounting screws are removed, and the high-speed connector 3 is taken off. The assembly and disassembly process is simple.

[0042] In one possible implementation, the protective device 2 is also provided with a handle.

[0043] Explanatoryly, during soldering, the high-speed connector 3 is soldered using a solder pot by holding the handle, which facilitates control of the high-speed connector 3's immersion in and removal from the solder pot, improving the safety and convenience of operation.

[0044] In one possible implementation, the handles are located on both sides of the protective device 2.

[0045] Explanatoryly, by providing handles on both sides of the protective device 2, it can be held from both sides for tinning operations, ensuring that the protective device 2 remains horizontal and balanced during immersion in the tin pot, and ensuring that the tinning height of the gold-plated pins 4 is consistent.

[0046] The principle of the high-speed connector tinning device of the present invention is as follows: By providing pin through holes on the protective film 1 that correspond one-to-one with the positions of the gold-plated pins 4 and mounting holes that match the protective device 2, the protective film 1 exposes only the gold-plated pins 4 while fully covering the body of the high-speed connector 3, ensuring accurate matching between the protective film 1, the high-speed connector 3, and the protective device 2. This effectively prevents solder from splashing into the interior of the high-speed connector 3 during the tinning process. In use, the protective film 1 is tightly fitted to the body of the high-speed connector 3, allowing the gold-plated pins 4 to protrude through the pin through holes on the protective film 1. The body of the high-speed connector 3 is accommodated by the recessed slot on the protective device 2, and the gold-plated pins 4 are exposed through the opening structure. After the mounting screw passes through the mounting holes of the protective device 2 and the protective film 1, it is connected to the mounting hole of the high-speed connector 3. The tightening force of the mounting screw ensures that the protective film 1 is tightly fitted between the bottom of the high-speed connector 3 and the protective device 2, eliminating the gap between the protective film 1 and the high-speed connector 3. By holding the handle, move the protective device 2 along with the high-speed connector 3 toward the solder pot, immerse the gold-plated pins 4 in molten solder for soldering. After soldering, remove the mounting screws, take off the high-speed connector, and clean the high-speed connector 3 to remove residual flux and other non-metallic impurities from the gold-plated pins 4.

[0047] After testing, the high-speed connector 3 treated with the high-speed connector tinning device of this invention achieved a tinning height that met welding requirements, and the solder joints were 100% filled with solder after welding. This high-speed connector tinning device effectively improves defects such as insufficient tinning height and high void ratio in high-speed connectors. Furthermore, protected by the protective film 1, the interior of the tinned high-speed connector 3 is free of solder dross, solder balls, and other excess materials. This effectively improves the first-pass welding yield and, after application in production, increases the welding qualification rate of high-speed connector 3 by approximately 18%.

[0048] In another embodiment of the present invention, a method for soldering a high-speed connector based on the aforementioned high-speed connector soldering device is provided. Specifically, the high-speed connector soldering method includes the following steps: Step 1: Cover the bottom of the high-speed connector 3 with the protective film 1, so that the gold-plated pins 4 of the high-speed connector 3 protrude through the pin holes on the protective film 1.

[0049] Step 2: Place the high-speed connector 3 covered with the protective film 1 into the recessed slot of the protective device 2, so that the gold-plated pins 4 of the high-speed connector 3 are exposed through the opening structure; wherein, the protective film 1 is sandwiched between the high-speed connector 3 and the protective device 2.

[0050] Step 3: Drive the protection device 2 and immerse the gold-plated pins 4 of the high-speed connector 3 into the solder pot for soldering, and remove the protection device 2 and the protective film 1 after soldering is completed.

[0051] For example, before soldering, a sample can be used to verify the soldering process to ensure that the soldering temperature is lower than the temperature that the high-speed connector 3 body can withstand. At the same time, the soldering temperature can also be measured during the gold removal soldering process to ensure that the temperature of the high-speed connector 3 body does not exceed the allowable range of the material. After soldering, the high-speed connector 3 is subjected to visual and X-ray inspection to ensure that the soldering does not cause damage to the high-speed connector 3.

[0052] In summary, the high-speed connector soldering apparatus and method of the present invention have at least the following advantages: (1) Using a polyimide film with a thickness of 0.05 mm or less can maximize the contact between the solder and the gold-plated pins 4 of the connector. The mounting screws between the polyimide film and the protective device 2 can ensure a tight fit between the film and the protective device 2, preventing solder from seeping into the body of the high-speed connector 3. The positioning post can reliably position the polyimide film and prevent misalignment during installation. The high-speed connector 3 was tinned using the present invention and the non-woven fabric protection method, respectively. The tinning result of the present invention is significantly better than that of the non-woven fabric protection method.

[0053] (2) For different models of high-speed connectors 3, the corresponding protection device 2 can be designed to remove the gold and tin from the connector, avoiding the problem of gold brittleness after soldering due to insufficient tinning height and unreliable connection due to large voids in the solder joints of the high-speed connector 3 after soldering. This solves the problems of rework and repair due to soldering defects of the high-speed connector 3.

[0054] (3) The polyimide film is a soft film, which will not damage the high-speed connector 3 body and the gold-plated pins 4 during the installation process; the protection device 2 is accurately designed according to the structure of the high-speed connector 3, and can be fully matched with the structure of the high-speed connector 3 without interference. It will not damage the high-speed connector 3 during the installation process.

[0055] (4) Different models of high-speed connectors 3 can be matched by designing a matching protection device 2. The installation process is simple and does not involve complicated operations, which can effectively improve productivity.

[0056] (5) The polyimide film contacts the bottom of the high-speed connector 3, which can ensure that the tinning height meets the welding requirements and solves the problem of inconsistent tinning height on the gold-plated pins 4 after tinning in the traditional method.

[0057] The above content is only for illustrating the technical concept of the present invention and should not be construed as limiting the scope of protection of the present invention. Any modifications made to the technical solution based on the technical concept proposed in this invention shall fall within the scope of protection of the claims of this invention.

Claims

1. A high-speed connector soldering device, characterized in that, include: A protective film has a plurality of pin holes, the positions of which correspond one-to-one with the positions of the gold-plated pins of the high-speed connector. The protective device has a recessed slot and an opening structure; the recessed slot is used to accommodate the body of the high-speed connector, and the opening structure is used to expose the gold-plated pins of the high-speed connector. In use, the protective film is located between the protective device and the high-speed connector, and the gold-plated pins of the high-speed connector pass through the pin holes and are exposed through the opening structure.

2. The high-speed connector soldering device according to claim 1, characterized in that, The protective film is a polyimide film.

3. The high-speed connector soldering device according to claim 2, characterized in that, The thickness of the polyimide film is no greater than 0.05 mm.

4. The high-speed connector soldering device according to claim 1, characterized in that, The protective device is a graphite protective device.

5. The high-speed connector soldering device according to claim 1, characterized in that, The protective film is also provided with a plurality of first positioning holes, and the protective device is provided with a plurality of positioning posts corresponding to the first positioning holes. The protective film is positioned by the cooperation of the first positioning holes and the positioning posts.

6. The high-speed connector soldering apparatus according to claim 1, characterized in that, It also includes a connector; the protective device is also provided with a protective device mounting hole, and the protective film is also provided with a protective film mounting hole; in use, one end of the connector is connected to the protective device, and the other end passes through the protective device mounting hole and the protective film mounting hole in sequence and is connected to the mounting hole of the high-speed connector.

7. The high-speed connector soldering apparatus according to claim 6, characterized in that, The connector is a mounting screw.

8. The high-speed connector soldering apparatus according to claim 1, characterized in that, The protective device is also equipped with a handle.

9. The high-speed connector soldering apparatus according to claim 8, characterized in that, The handles are located on both sides of the protective device.

10. A method for soldering a high-speed connector based on the high-speed connector soldering apparatus according to any one of claims 1 to 9, characterized in that, include: A protective film is placed over the bottom of the high-speed connector, allowing the gold-plated pins of the high-speed connector to protrude through pin holes in the protective film; The high-speed connector covered with the protective film is placed into the recessed slot of the protection device, so that the gold-plated pins of the high-speed connector are exposed through the opening structure; wherein, the protective film is sandwiched between the high-speed connector and the protection device; The protective device is driven to immerse the gold-plated pins of the high-speed connector into a solder pot for tinning, and the protective device and the protective film are removed after tinning is completed.

Images