Control circuit assembly

Abstract

The application discloses a control circuit assembly for driving a brushless motor of a power tool, comprising a main control board, the main control board being electrically connected with a positive metal conductive plate, a negative metal conductive plate and a plurality of power semiconductors, the positive metal conductive plate being connected with a positive pole of a power supply, the negative metal conductive plate being connected with a negative pole of the power supply, and the positive metal conductive plate and the negative metal conductive plate and the power semiconductors forming a power supply circuit. The plurality of power semiconductors are divided into a first group and a second group, the first group being attached to the positive metal conductive plate, and the second group being attached to the negative metal conductive plate, the positive metal conductive plate and the negative metal conductive plate serving as heat dissipation bases of the power semiconductors. Therefore, the assembly integrates the current-carrying conductor and the heat dissipation base, can improve the current-carrying capacity and the heat dissipation effect, and is beneficial to realizing compact structure and cost control.

Description

Technical Field

[0001] This application belongs to the field of motor control technology, and in particular relates to a control circuit assembly for driving electric tools. Background Technology

[0002] Electric motors are widely used in various electromechanical equipment, and the current-carrying capacity and heat dissipation performance of their control circuit boards directly determine the motor's operational stability and service life. Currently, the structural design and heat dissipation solutions of traditional motor control circuit boards have significant defects, making it difficult to adapt to the industry's development needs for miniaturized, high-power, and highly reliable motors.

[0003] Traditional control circuit boards typically employ external heat dissipation methods with added heat sinks or heat plates. This structure occupies a large installation space, increasing the overall size of the motor and hindering its miniaturization and integration. Furthermore, the additional heat dissipation components not only increase material and assembly costs and structural complexity but also impede the mass production of lightweight motors.

[0004] Furthermore, the conductive copper foil traces on traditional circuit boards are thin and have a limited conductive cross-sectional area, resulting in poor current-carrying capacity. This limits their suitability for low-current applications and makes them unsuitable for the high-current operation of high-power motors. Under high-current conditions, the thin copper foil easily generates a large amount of heat. Traditional heat dissipation structures, with their limited space and low efficiency, cannot dissipate heat effectively, leading to localized heat buildup and overheating on the circuit board. This can cause component aging, short circuits, and burnout, severely impacting motor reliability and shortening equipment lifespan.

[0005] In summary, existing motor control circuit boards have many drawbacks, such as bulky heat dissipation structures, high production costs, difficulty in miniaturization upgrades, insufficient current carrying capacity, and susceptibility to heat accumulation and failure, which cannot meet the requirements of high-quality motors.

[0006] Therefore, there is an urgent need to design a motor assembly that can carry large currents, has good heat dissipation, a compact structure, and controllable cost to solve the problems existing in the above-mentioned technologies. Summary of the Invention

[0007] In view of the foregoing background technology, the object of the present invention is to provide a control circuit assembly to at least solve one of the above-mentioned technical problems.

[0008] The technical problem to be solved by the present invention is achieved through the following technical solution:

[0009] This application provides a control circuit assembly for driving a brushless motor of an electric tool. The assembly includes a main control board electrically connected to a positive metal conductive plate, a negative metal conductive plate, and multiple power semiconductors. The positive metal conductive plate is connected to the positive terminal of a power supply, and the negative metal conductive plate is connected to the negative terminal. The positive and negative metal conductive plates, together with the power semiconductors, form a power supply circuit. The multiple power semiconductors are divided into a first group and a second group. The first group of power semiconductors is attached to the positive metal conductive plate, and the second group of power semiconductors is attached to the negative metal conductive plate. The positive and negative metal conductive plates also serve as heat dissipation substrates for the power semiconductors.

[0010] In the above basic scheme, the main control board is also electrically connected to a three-phase metal conductive plate. The first group of power semiconductors and the second group of power semiconductors are electrically connected through the three-phase metal conductive plate. The three-phase metal conductive plate is divided into a U-phase metal conductive plate, a V-phase metal conductive plate and a W-phase metal conductive plate, which correspond to the three-phase windings of the brushless motor, respectively.

[0011] Furthermore, the first group of power semiconductors includes MOSFETs Q1, Q2, and Q3, and the second group of power semiconductors includes MOSFETs Q4, Q5, and Q6. MOSFETs Q1 and Q4 are electrically connected through the U-phase metal conductive plate, MOSFETs Q2 and Q5 are electrically connected through the V-phase metal conductive plate, and MOSFETs Q3 and Q6 are electrically connected through the W-phase metal conductive plate, thereby forming a three-phase inverter bridge circuit.

[0012] In one implementation, the first group of power semiconductors and the second group of power semiconductors are both located on the same side of the main control board. The U-phase metal conductive plate, the V-phase metal conductive plate, and the W-phase metal conductive plate are all in a "V" shape. The U-phase metal conductive plate is composed of an integrally formed first connector, a second connector, and a third connector. The V-phase metal conductive plate is composed of an integrally formed fourth connector, a fifth connector, and a sixth connector. The W-phase metal conductive plate is composed of an integrally formed seventh connector, an eighth connector, and a ninth connector.

[0013] In this embodiment, the first connector is electrically connected to the MOSFET Q1, the second connector is electrically connected to the MOSFET Q4, and the third connector is electrically connected to the U-phase terminal of the brushless motor; the fourth connector is electrically connected to the MOSFET Q2, the fifth connector is electrically connected to the MOSFET Q5, and the sixth connector is electrically connected to the V-phase terminal of the brushless motor; the seventh connector is electrically connected to the MOSFET Q3, the eighth connector is electrically connected to the MOSFET Q6, and the ninth connector is electrically connected to the W-phase terminal of the brushless motor.

[0014] In another implementation, the first group of power semiconductors and the second group of power semiconductors are located on opposite sides of the main control board. The U-phase metal conductive plate, the V-phase metal conductive plate and the W-phase metal conductive plate are all in the shape of a cuboid. The main control board body has three mounting slots, and the U-phase metal conductive plate, the V-phase metal conductive plate and the W-phase metal conductive plate are respectively embedded in the mounting slots.

[0015] In this embodiment, the U-phase metal conductive plate has a first connecting surface and a second connecting surface that are arranged opposite to each other along the thickness direction of the main control plate; the V-phase metal conductive plate has a third connecting surface and a fourth connecting surface that are arranged opposite to each other along the thickness direction of the main control plate; and the W-phase metal conductive plate has a fifth connecting surface and a sixth connecting surface that are arranged opposite to each other along the thickness direction of the main control plate.

[0016] Furthermore, the first connection surface is electrically connected to the MOSFET Q1, the second connection surface is electrically connected to the MOSFET Q4, and the first connection surface is also electrically connected to the U-phase terminal of the brushless motor; the third connection surface is electrically connected to the MOSFET Q2, the fourth connection surface is electrically connected to the MOSFET Q5, and the third connection surface is also electrically connected to the V-phase terminal of the brushless motor; the fifth connection surface is electrically connected to the MOSFET Q3, the sixth connection surface is electrically connected to the MOSFET Q6, and the fifth connection surface is also electrically connected to the W-phase terminal of the brushless motor.

[0017] It is worth noting that the first connecting surface and the second connecting surface are respectively flush with the plane of the main control board on the corresponding side; the third connecting surface and the fourth connecting surface are respectively flush with the plane of the main control board on the corresponding side; the fifth connecting surface and the sixth connecting surface are respectively flush with the plane of the main control board on the corresponding side.

[0018] In addition, the positive terminal of the power supply, the positive terminal metal conductive plate, the first group of power semiconductors, the second group of power semiconductors, the brushless motor, the negative terminal metal conductive plate, and the negative terminal of the power supply constitute the control circuit of the brushless motor.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] First, this application combines the positive and negative metal conductive plates as heat dissipation substrates for power semiconductors, thus eliminating the need for traditional external heat sinks or heat dissipation plates. This reduces the overall size of the control circuit components, which is beneficial for the miniaturization and integration of motors, while also reducing material and assembly costs.

[0021] Second, this application uses a metal conductive plate instead of the traditional PCB copper foil trace as the power current carrying channel. The conductive cross-sectional area of ​​the metal conductive plate is much larger than that of the copper foil trace, which can improve the current carrying capacity and adapt to the high current working scenario of high-power motors. At the same time, the thermal conductivity of the metal conductive plate is higher than that of the PCB substrate, which is conducive to the rapid conduction and diffusion of heat generated by power semiconductors and reduces the risk of local heat accumulation.

[0022] Third, this application divides multiple power semiconductors into two groups and attaches them to the positive electrode metal conductive plate and the negative electrode metal conductive plate respectively, so that each group of power semiconductors has its own independent heat dissipation substrate, which is conducive to heat dispersion and conduction and avoids the heat superposition caused by multiple power semiconductors concentrating on the same heat sink.

[0023] Fourth, in the implementation where the three-phase metal conductive plates are arranged on the same side, the three-phase metal conductive plates adopt an integrally formed "human" shaped structure, with each connector corresponding to a MOS transistor and a phase motor terminal, which simplifies the connection structure of the three-phase inverter bridge, reduces the number of soldering points, and helps improve assembly efficiency and connection reliability.

[0024] Fifth, in the double-sided arrangement implementation, the three-phase metal conductive plate adopts a cuboid structure and is embedded in the mounting slot of the main control board. Its two connecting surfaces are electrically connected to the power semiconductors on both sides of the main control board, which can realize reliable cross-board connection between the double-sided power semiconductors. The design of the connecting surfaces being flush with the plane of the main control board is conducive to the mounting and soldering of power semiconductors, ensuring the contact area and soldering quality. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall assembly structure of the control circuit assembly of this application.

[0026] Figure 2 This is a schematic diagram of the first embodiment of the control circuit assembly of this application.

[0027] Figure 3 This is a schematic diagram of the structure of the three-phase metal conductive plate of this application.

[0028] Figure 4 This is a schematic diagram of the first embodiment of the control circuit assembly of this application (excluding the power semiconductor).

[0029] Figure 5This is a schematic diagram of the second embodiment of the control circuit assembly of this application (first side of the main control board).

[0030] Figure 6 This is a schematic diagram of the structure of the three-phase metal conductive plate of this application.

[0031] Figure 7 This is a schematic diagram of the second embodiment of the control circuit assembly of this application (second side of the main control board).

[0032] Figure 8 This is an exploded view of the three-phase metal conductive plate and the main control board of this application.

[0033] Explanation of reference numerals in the attached drawings: 1-Control circuit assembly, 100-Main control board, 200-Brushless motor, 201-Positive metal conductive plate, 208-Negative metal conductive plate, 203-Power semiconductor, 30-Three-phase metal conductive plate, 31-First connector, 32-Second connector, 33-Third connector, 34-Fourth connector, 35-Fifth connector, 36-Sixth connector, 37-Seventh connector, 38-Eighth connector, 39-Ninth connector, 40-Mounting slot, 41-First connecting surface, 42-Second connecting surface, 43-Third connecting surface, 44-Fourth connecting surface, 45-Fifth connecting surface, 46-Sixth connecting surface, 50-First group of power semiconductors, 60-Second group of power semiconductors. Detailed Implementation

[0034] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0035] Example 1: Power semiconductor 203 arranged on the same side

[0036] like Figures 1 to 8 As shown, the control circuit assembly 1 of this embodiment is used to drive the brushless motor 200 of the power tool. It includes a main control board 100. The main control board 100 is electrically connected to a positive metal conductive plate 201, a negative metal conductive plate 208, and a plurality of power semiconductors 203. The positive metal conductive plate 201 is used to connect to the positive terminal of the power supply, and the negative metal conductive plate 208 is used to connect to the negative terminal of the power supply. The positive metal conductive plate 201, the negative metal conductive plate 208, and the power semiconductors 203 together constitute a power supply circuit.

[0037] In this embodiment, the multiple power semiconductors 203 are divided into a first group of power semiconductors 50 and a second group of power semiconductors 60. The first group of power semiconductors 50 is attached to the positive electrode metal conductive plate 201, and the second group of power semiconductors 60 is attached to the negative electrode metal conductive plate 208. The positive electrode metal conductive plate 201 and the negative electrode metal conductive plate 208 also serve as heat dissipation substrates for the power semiconductors 203. The heat generated when the power semiconductors 203 are working can be directly conducted to the corresponding metal conductive plates through the contact surfaces, and then diffused to the surrounding environment from the metal conductive plates.

[0038] In addition, the main control board 100 is also electrically connected to a three-phase metal conductive plate 30, and the first group of power semiconductors 50 and the second group of power semiconductors 60 are electrically connected through the three-phase metal conductive plate 30. The three-phase metal conductive plate 30 is divided into a U-phase metal conductive plate, a V-phase metal conductive plate and a W-phase metal conductive plate, which correspond to the U-phase, V-phase and W-phase three-phase windings of the brushless motor 200, respectively.

[0039] In this embodiment, the first group of power semiconductors includes MOSFETs Q1, Q2, and Q3, forming the upper arm of the three-phase inverter bridge circuit; the second group of power semiconductors includes MOSFETs Q4, Q5, and Q6, forming the lower arm of the three-phase inverter bridge circuit. MOSFETs Q1 and Q4 are electrically connected via a U-phase metal conductive plate, MOSFETs Q2 and Q5 are electrically connected via a V-phase metal conductive plate, and MOSFETs Q3 and Q6 are electrically connected via a W-phase metal conductive plate.

[0040] like Figures 1-4 As shown, in this embodiment, the first group of power semiconductors 50 and the second group of power semiconductors 60 are both located on the same side of the main control board 100. The U-phase metal conductive plate, V-phase metal conductive plate, and W-phase metal conductive plate all have a "V"-shaped structure, as detailed below:

[0041] The U-phase metal conductive plate is composed of an integrally formed first connector 31, second connector 32, and third connector 33. The first connector 31 is electrically connected to MOSFET Q1, the second connector 32 is electrically connected to MOSFET Q4, and the third connector 33 is electrically connected to the U-phase terminal of the brushless motor 200. Therefore, MOSFET Q1 and MOSFET Q4 are electrically connected via the U-phase metal conductive plate, and the U-phase output is led out to the U-phase terminal of the brushless motor 200 via the third connector 33.

[0042] The V-phase metal conductive plate is composed of an integrally formed fourth connector 34, fifth connector 35, and sixth connector 36. The fourth connector 34 is electrically connected to MOSFET Q2, the fifth connector 35 is electrically connected to MOSFET Q5, and the sixth connector 36 is electrically connected to the V-phase terminal of the brushless motor 200. Therefore, MOSFETs Q2 and Q5 are electrically connected via the V-phase metal conductive plate, and the V-phase output is led out to the V-phase terminal of the brushless motor 200 via the sixth connector 36.

[0043] The W-phase metal conductive plate is composed of a single-piece molded seventh connector 37, eighth connector 38, and ninth connector 39. The seventh connector 37 is electrically connected to MOSFET Q3, the eighth connector 38 is electrically connected to MOSFET Q6, and the ninth connector 39 is electrically connected to the W-phase terminal of the brushless motor 200. Therefore, MOSFET Q3 and MOSFET Q6 are electrically connected via the W-phase metal conductive plate, and the W-phase output is led out to the W-phase terminal of the brushless motor 200 via the ninth connector 39.

[0044] It is worth noting that the three-phase metal conductive plate 30 with the "human" shaped structure is made by an integral molding process. The three connectors extend from the same bus point in different directions, respectively corresponding to the upper bridge arm MOSFET, the lower bridge arm MOSFET and the motor phase terminal. This can complete the phase node connection of the three-phase inverter bridge circuit within a limited board space, reducing the use of jumper wires or vias.

[0045] like Figure 2 and Figure 5 As shown, in this embodiment, the positive terminal of the power supply, the positive metal conductive plate 201, the first group of power semiconductors 50, the second group of power semiconductors 60, the brushless motor 200, the negative metal conductive plate 208, and the negative terminal of the power supply together constitute the control circuit of the brushless motor 200. Current flows from the positive terminal of the power supply into the positive metal conductive plate 201, passes through the first group of power semiconductors 50 (upper bridge arm) and the three-phase metal conductive plate 30, enters the corresponding phase winding of the brushless motor 200, then flows through the second group of power semiconductors 60 (lower bridge arm) into the negative metal conductive plate 208, and finally flows back to the negative terminal of the power supply. That is, by controlling the turn-on and turn-off timing of the six MOSFETs, the three-phase inverter drive of the brushless motor 200 is achieved.

[0046] Example 2: Double-sided arrangement of power semiconductor 203

[0047] like Figures 5-8 As shown, the difference between this embodiment and Embodiment 1 lies in the arrangement of the power semiconductors 203 and the structure of the three-phase metal conductive plate 30. In this embodiment, the first group of power semiconductors 50 and the second group of power semiconductors 60 are located on opposite sides of the main control board 100.

[0048] In this embodiment, the U-phase metal conductive plate, the V-phase metal conductive plate, and the W-phase metal conductive plate are all in the shape of a cuboid. The main control board 100 has three mounting slots 40, and the U-phase metal conductive plate, the V-phase metal conductive plate, and the W-phase metal conductive plate are respectively embedded in the corresponding mounting slots 40.

[0049] Furthermore, the U-phase metal conductive plate has a first connecting surface 41 and a second connecting surface 42 arranged opposite to each other along the thickness direction of the main control board 100. The first connecting surface 41 is located on one side of the main control board 100 and is electrically connected to the MOSFET Q1; the second connecting surface 42 is located on the other side of the main control board 100 and is electrically connected to the MOSFET Q4; the first connecting surface 41 is also electrically connected to the U-phase terminal of the brushless motor 200. Thus, the MOSFETs Q1 and Q4 located on both sides of the main control board 100 are electrically connected across the board through the U-phase metal conductive plate embedded in the mounting slot 40, and the U-phase output is led out to the U-phase terminal of the brushless motor 200 via the first connecting surface 41.

[0050] The V-phase metal conductive plate has a third connection surface 43 and a fourth connection surface 44 arranged opposite to each other along the thickness direction of the main control board 100. The third connection surface 43 is electrically connected to MOSFET Q2, and the fourth connection surface 44 is electrically connected to MOSFET Q5. The third connection surface 43 is also electrically connected to the V-phase terminal of the brushless motor 200. Thus, MOSFETs Q2 and Q5, located on both sides of the main control board 100, are electrically connected across the board through the V-phase metal conductive plate embedded in the mounting slot 40. The V-phase output is led out to the V-phase terminal of the brushless motor 200 via the third connection surface 43.

[0051] The W-phase metal conductive plate has a fifth connection surface 45 and a sixth connection surface 46 arranged opposite to each other along the thickness direction of the main control board 100. The fifth connection surface 45 is electrically connected to MOSFET Q3, and the sixth connection surface 46 is electrically connected to MOSFET Q6. The fifth connection surface 45 is also electrically connected to the W-phase terminal of the brushless motor 200. Thus, MOSFETs Q3 and Q6 located on both sides of the main control board 100 are electrically connected across the board through the W-phase metal conductive plate embedded in the mounting slot 40, and the W-phase output is led out to the W-phase terminal of the brushless motor 200 via the fifth connection surface 45.

[0052] like Figures 5-8As shown, in this embodiment, the first connecting surface 41 and the second connecting surface 42 are flush with the plane of the main control board 100 on the corresponding side; the third connecting surface 43 and the fourth connecting surface 44 are flush with the plane of the main control board 100 on the corresponding side; and the fifth connecting surface 45 and the sixth connecting surface 46 are flush with the plane of the main control board 100 on the corresponding side. Therefore, the design of the connecting surfaces being flush with the plane of the main control board 100 allows the power semiconductor 203 to be flatly mounted on the connecting surface of the three-phase metal conductive plate 30, ensuring the welding contact area and facilitating heat conduction between the power semiconductor 203 and the three-phase metal conductive plate 30.

[0053] It is worth noting that the double-sided arrangement places the upper and lower bridge arm power semiconductors on the two sides of the main control board 100 respectively, which helps to further reduce the area occupied by the control circuit component 1 in the board direction and is suitable for motor application scenarios with strict requirements for radial dimensions. At the same time, the cuboid-shaped three-phase metal conductive plate 30 embedded in the mounting slot 40 not only undertakes the cross-board electrical connection, but also undertakes the function of phase node output. There is no need to set a large number of vias on the main control board 100, which helps to improve the high current carrying capacity and connection reliability.

[0054] The remaining structure and power supply circuit configuration of this embodiment are the same as those of Embodiment 1, and will not be described again here.

[0055] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A control circuit assembly for driving a brushless motor of an electric tool, comprising a main control board electrically connected to a positive metal conductive plate, a negative metal conductive plate, and a plurality of power semiconductors, wherein the positive metal conductive plate is connected to a positive power supply terminal, the negative metal conductive plate is connected to a negative power supply terminal, and the positive metal conductive plate, the negative metal conductive plate, and the power semiconductors constitute a power supply circuit; characterized in that: The power semiconductors are divided into a first group of power semiconductors and a second group of power semiconductors. The first group of power semiconductors is attached to the positive electrode metal conductive plate, and the second group of power semiconductors is attached to the negative electrode metal conductive plate. The positive electrode metal conductive plate and the negative electrode metal conductive plate also serve as heat dissipation substrates for the power semiconductors.

2. The control circuit assembly according to claim 1, characterized in that, The main control board is also electrically connected to a three-phase metal conductive plate. The first group of power semiconductors and the second group of power semiconductors are electrically connected through the three-phase metal conductive plate, wherein the three-phase metal conductive plate is divided into a U-phase metal conductive plate, a V-phase metal conductive plate and a W-phase metal conductive plate.

3. The control circuit assembly according to claim 2, characterized in that, The first group of power semiconductors includes MOSFETs Q1, Q2, and Q3, and the second group of power semiconductors includes MOSFETs Q4, Q5, and Q6. MOSFETs Q1 and Q4 are electrically connected through the U-phase metal conductive plate, MOSFETs Q2 and Q5 are electrically connected through the V-phase metal conductive plate, and MOSFETs Q3 and Q6 are electrically connected through the W-phase metal conductive plate.

4. The control circuit assembly according to claim 3, characterized in that, The first group of power semiconductors and the second group of power semiconductors are both located on the same side of the main control board, and the U-phase metal conductive plate, V-phase metal conductive plate and W-phase metal conductive plate are all in a "human" shaped structure; The U-phase metal conductive plate is composed of an integrally formed first connector, second connector and third connector; The V-phase metal conductive plate is composed of an integrally formed fourth connector, fifth connector and sixth connector; The W-phase metal conductive plate is composed of an integrally formed seventh connector, eighth connector, and ninth connector.

5. The control circuit assembly according to claim 4, characterized in that, The first connector is electrically connected to the MOSFET Q1, the second connector is electrically connected to the MOSFET Q4, and the third connector is electrically connected to the U-phase terminal of the brushless motor; The fourth connector is electrically connected to the MOSFET Q2, the fifth connector is electrically connected to the MOSFET Q5, and the sixth connector is electrically connected to the V-phase terminal of the brushless motor; The seventh connector is electrically connected to the MOSFET Q3, the eighth connector is electrically connected to the MOSFET Q6, and the ninth connector is electrically connected to the W-phase terminal of the brushless motor.

6. The control circuit assembly according to claim 3, characterized in that, The first group of power semiconductors and the second group of power semiconductors are located on opposite sides of the main control board. The U-phase metal conductive plate, the V-phase metal conductive plate and the W-phase metal conductive plate are all in the shape of a cuboid. The main control board body has three mounting slots, and the U-phase metal conductive plate, the V-phase metal conductive plate and the W-phase metal conductive plate are respectively embedded in the mounting slots.

7. The control circuit assembly according to claim 6, characterized in that, The U-phase metal conductive plate has a first connecting surface and a second connecting surface that are arranged opposite to each other along the thickness direction of the main control plate. The V-phase metal conductive plate has a third connecting surface and a fourth connecting surface that are arranged opposite to each other along the thickness direction of the main control plate; The W-phase metal conductive plate has a fifth connecting surface and a sixth connecting surface that are arranged opposite to each other along the thickness direction of the main control plate.

8. The control circuit assembly according to claim 7, characterized in that, The first connection surface is electrically connected to the MOS transistor Q1, the second connection surface is electrically connected to the MOS transistor Q4, and the first connection surface is also electrically connected to the U-phase terminal of the brushless motor; The third connection surface is electrically connected to the MOS transistor Q2, the fourth connection surface is electrically connected to the MOS transistor Q5, and the third connection surface is also electrically connected to the V-phase terminal of the brushless motor; The fifth connection surface is electrically connected to the MOS transistor Q3, the sixth connection surface is electrically connected to the MOS transistor Q6, and the fifth connection surface is also electrically connected to the W-phase terminal of the brushless motor.

9. The control circuit assembly according to claim 7, characterized in that, The first connecting surface and the second connecting surface are respectively flush with the plane of the main control board on the corresponding side; The third connecting surface and the fourth connecting surface are respectively flush with the plane of the main control board on the corresponding side; The fifth connecting surface and the sixth connecting surface are respectively flush with the plane of the main control board on the corresponding side.

10. The control circuit assembly according to claim 1, characterized in that, The positive terminal of the power supply, the positive terminal metal conductive plate, the first group of power semiconductors, the second group of power semiconductors, the brushless motor, the negative terminal metal conductive plate, and the negative terminal of the power supply constitute the control circuit of the brushless motor.

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