Power module

Abstract

The application discloses a power module, which comprises a circuit board, at least one power chip arranged on a first surface of the circuit board, and an inductor arranged on the first surface of the circuit board, wherein the inductor comprises a supporting leg, the inductor is arranged above the power chip through the supporting leg, and the supporting leg is connected to the circuit board from the outside of the power chip. The power module provided by the application adopts a vertical stacking layout of the suspended inductor and the power chip, the inductor body is arranged at intervals from the circuit board through the supporting leg, so that the inductor can be stacked above the power chip, the planar space is saved, and the heat of the power chip is directly conducted to the heat dissipation fins of the inductor through the heat-conducting adhesive, thereby forming an efficient heat dissipation path. The design reduces the parasitic impedance and direct current resistance of the power module, and the flexible configuration of the inductor or transformer function can be realized through the non-coupling and coupling magnet structures, thereby meeting the requirements of multiple scenes.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and more specifically, to a power supply module. Background Technology

[0002] With the rapid development of consumer electronics, industrial automation, and new energy, the performance requirements of power supply systems for electronic devices are continuously increasing. Power modules not only need higher power density to adapt to the trend of device miniaturization, but also need to consider low power consumption, high stability, and wide operating condition adaptability. Currently, one type of power module typically uses discrete components such as power chips and inductors mounted separately on a circuit board. This method not only has a large number of components but also occupies a large area, making it difficult to meet current miniaturization demands. Another type of power module uses a multi-layer stacking approach, embedding inductors into the circuit board or housing, and then placing power chips and other components on top. However, this method involves various customized components, and the assembly and connection process is complex. In mass production, product consistency is poor, costs are high, and it also has drawbacks such as poor parasitic impedance and insufficient compatibility.

[0003] Furthermore, existing general-purpose power modules often meet the needs of multiple scenarios through "modular stacking," that is, performance expansion is achieved by connecting different functional modules. However, this design not only increases the overall size and assembly complexity of the module, but may also introduce new performance losses due to parasitic parameters of the interfaces between modules. On the other hand, dedicated power modules developed for specific scenarios can optimize local performance, but they suffer from poor compatibility, long R&D cycles, and high mass production costs, making it difficult to adapt to the rapidly iterating market demands.

[0004] Therefore, how to achieve high compatibility, low loss, and high stability of power modules while ensuring power density and efficiency has become a key issue that urgently needs to be addressed in the current power supply technology field. Summary of the Invention

[0005] The purpose of this invention is to provide a power module that solves the problems of complex processes, poor compatibility, and high costs in the prior art, thereby enhancing product compatibility, consistency, and production efficiency.

[0006] The present invention provides a power module, comprising: a circuit board; at least one power chip disposed on a first surface of the circuit board; an inductor disposed on the first surface of the circuit board; wherein the inductor includes a support foot, the inductor is disposed above the power chip via the support foot, and the support foot is connected to the circuit board from the outside of the power chip.

[0007] The inductor in the power module described above also includes: a main body, the main body including a winding and a magnet matching the winding, the winding being arranged laterally, and the two ends of the winding being electrically connected to the circuit board through corresponding support feet; the support feet having a preset height, so that the main body of the inductor is spaced apart from the circuit board.

[0008] As described above, the inductor further includes a heat sink disposed on the surface of the magnet, and the top surface of the power chip is connected to at least a portion of the heat sink.

[0009] Optionally, the magnet surface is provided with a groove, the heat sink includes at least a C-shaped structure portion, the heat sink is at least partially embedded in the groove, and the portion of the heat sink located below the magnet is connected to the top surface of the power chip.

[0010] Optionally, the groove is an annular groove.

[0011] Optionally, a thermally conductive adhesive is further provided between the top surface of the power chip and the heat sink. The thermally conductive adhesive fills the gap between the top surface of the power chip and the corresponding area of ​​the heat sink. The thermally conductive adhesive is a thermal interface material adhesive, which has both thermal conduction and structural bonding functions.

[0012] Optionally, the first surface of the circuit board is further provided with capacitors and resistors, the height of which does not exceed the sum of the thickness of the power chip and the thickness of the thermally conductive adhesive.

[0013] Optionally, the height of the support foot is matched with the thickness of the power chip and the thickness of the thermally conductive adhesive, so that the top surface of the power chip is in close contact with the corresponding area of ​​the heat sink.

[0014] Optionally, the thermally conductive adhesive is a thermal interface material adhesive, which has both thermal conduction and structural bonding functions.

[0015] Optionally, the circuit board may also include an auxiliary chip disposed on a first surface of the circuit board. Both the auxiliary chip and the power chip are located below the inductor, and the top surfaces of the auxiliary chip and the power chip are respectively connected to at least a portion of the heat sink.

[0016] Optionally, the inductor includes at least two inductors arranged in parallel, wherein the magnets of the two inductors are of a coupled or uncoupled design.

[0017] The power module provided by this invention significantly optimizes power density and heat dissipation performance through innovative structural design. Specifically, it adopts a vertically stacked layout of suspended inductors and power chips, using support feet to space the inductor body from the circuit board. This allows the inductors to be stacked above the power chips, saving planar space and directly conducting heat from the power chips to the inductor's heat sink via thermally conductive adhesive, forming an efficient heat dissipation path. This design reduces the parasitic impedance and DC resistance of the power module and allows for flexible configuration of inductor or transformer functions through uncoupled and coupled magnetic structures, accommodating various scenario requirements.

[0018] This solution offers significant advantages for industrial applications: First, the standardized circuit board and modular inductor design simplify the assembly process and reduce complexity, improving the consistency of mass-produced products and reducing production costs. Second, the connection structure between the heat sink and the power chip eliminates the need for additional heat dissipation components, achieving both miniaturization and high heat dissipation efficiency, making it suitable for various compact devices such as consumer electronics and industrial automation. Third, by adjusting the coupling method between the inductor windings and the magnet, different voltage / current requirements can be quickly adapted, shortening the R&D cycle and meeting the demands of rapid market iteration. Attached Figure Description

[0019] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the accompanying drawings.

[0020] Figure 1 A schematic diagram of a power module according to an embodiment of the present invention is shown;

[0021] Figure 2 A perspective view of a power module according to an embodiment of the present invention is shown;

[0022] Figure 3 This diagram shows a circuit board in a power module according to an embodiment of the present invention.

[0023] Figure 4 A schematic diagram of an inductor in a power module according to an embodiment of the present invention is shown;

[0024] Figure 5 A top view of a power module according to an embodiment of the present invention is shown;

[0025] Figure 6 This shows a first cross-sectional view of a power module according to an embodiment of the present invention;

[0026] Figure 7 A second cross-sectional view of the power module according to an embodiment of the present invention is shown. Detailed Implementation

[0027] The invention will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, some well-known parts may not be shown.

[0028] It should be understood that when describing a structure, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the device is flipped, the layer or region will be located "below" or "under" the other layer or region.

[0029] To describe a situation where it is located directly on another layer or another area, this article will use the expressions "directly on top of" or "on and adjacent to".

[0030] Many specific details of certain embodiments of the invention are described below, such as the structure, materials, dimensions, processing methods, and techniques of devices or circuit elements, to provide a clearer understanding of the invention. However, as those skilled in the art will understand, the invention may be implemented without following these specific details.

[0031] This invention can be presented in various forms, some of which will be described below.

[0032] Figure 1 A schematic diagram of a power module according to an embodiment of the present invention is shown. The power module includes a circuit board 100, a power chip 200, and an inductor 300. The power chip 200 is mounted on a first surface of the circuit board 100, and the inductor 300 is also disposed on the first surface of the circuit board 100. Other discrete components such as capacitors 110 and resistors are also disposed on the first surface of the circuit board 100. The inductor 300 is, for example, a customized inductor, which includes a body and supporting feet. The body of the inductor 300 includes a winding and a magnet. Supporting feet 310 are respectively disposed at opposite ends of the body of the inductor 300, allowing the body of the inductor 300 to suspend above the first surface of the circuit board 100 via the supporting feet 310. The supporting feet 310 also serve as pins of the inductor 300 for electrical connection with the circuit board 100.

[0033] The first surface of the circuit board 100 is provided with pads for mounting electrical components, wherein the pads corresponding to the inductor 300 are located on both sides of the pads corresponding to the power chip 200. Specifically, for example, the power chip 200, as well as capacitors 110, resistors and other discrete components are first placed on the circuit board 100, and the height of the capacitors 110, inductors and other discrete components does not exceed the thickness of the power chip 200, for example; thermally conductive adhesive 210 is provided on the top surface of the power chip 200, and then the inductor 300 is placed on the circuit board 100, the inductor 300 is positioned above the power chip 200, and the inductor 300 is connected to the corresponding pads on the circuit board 100 through support feet 310. The main body of the inductor 300 is also provided with an annular groove, and heat sinks 301 are provided on the left and right sides of the main body. The heat sinks 301 are, for example, C-shaped and are embedded in the groove. The support foot 310 has a preset height. Its height design allows the lower surface of the lower part of the heat sink 301 to be connected to the top surface of the power chip 200 through thermally conductive adhesive 210, so that the power chip 200 can conduct its heat through the heat sink 301.

[0034] The power module provided by this invention utilizes support feet 310 to achieve a spacing between the inductor 300 body and the circuit board 100. The height of this spacing is greater than the thickness of the power chip, allowing the inductor 300 to be stacked on top of the power chip 200. This not only saves planar space but also directly conducts the heat from the power chip 200 to the heat sink 301 of the inductor 300 via thermally conductive adhesive 210, forming an efficient heat dissipation path. The power module provided by this invention has a simple product structure, a clear and concise manufacturing process, and low cost. Furthermore, the power module has low direct current resistance (DCR) and parasitic impedance, exhibiting excellent overall electrical performance. The heat sink 301 effectively dissipates the heat from the power chip 200, demonstrating good heat dissipation capabilities.

[0035] Figure 2This diagram shows a perspective view of a power module according to an embodiment of the present invention. The power module includes, for example, two power chips 200. Correspondingly, the inductor 300 includes two inductors with a gap between them. The two inductors correspond to the two power chips 200 respectively. Taking the right inductor as an example, it is located above the right power chip 200 and includes a support foot 310, a winding 320, a magnet 330, and a heat sink 301. The two support feet 310 are located at the two ends of the inductor respectively. The winding 320 is arranged horizontally, and the magnet 330 is arranged correspondingly to the winding 320. The two ends of the winding 320 are connected to the two support feet 310 respectively, and are electrically connected to the circuit board 100 through the support feet 310. Since the inductor 300 includes two inductors arranged in parallel, the inductor 300 includes a total of four support feet 310. Furthermore, depending on specific requirements, the magnets of the two inductors in the inductor 300 can be designed to be coupled, so that the two inductors in the inductor 300 form a transformer. Of course, the two inductors in the inductor 300 can also be designed to be uncoupled, and the two inductors can work as separate inductor devices.

[0036] Of course, Figure 2 The embodiments shown with two power chips 200 and an inductor 300 with two inductors are merely examples. The power chip 200 in the power module of the present invention may also be a single chip or more than two chips, and the inductor 300 may also include only a single inductor or more than two inductors. The heat sink 301 may also be of other shapes, such as an annular shape surrounding the inductor 300. The grooves provided on the inductor magnet may also be configured in other ways according to the actual application, such as providing grooves only where heat sinks are required. Furthermore, in addition to the power chip 200, an auxiliary chip can also be provided on the circuit board 100 of the power module. The power chip 200 is, for example, a MOS chip. The auxiliary chip is used to cooperate with the power chip. The auxiliary chip is, for example, at least one of a driver chip, a power management chip, a logic control chip, and an interface chip. The size of the inductor 300 is, for example, larger than the size of the power chip 200. The auxiliary chip is, for example, located near the power chip 200, and it is located below the inductor 300 together with the power chip 200. The top surface of the auxiliary chip and the top surface of the power chip 200 are respectively connected to the corresponding part of the heat sink 301 of the inductor 300 through thermal adhesive, so that the heat of the two chips can be dissipated through the heat sink 301.

[0037] Figure 3This diagram illustrates a circuit board in a power module according to an embodiment of the present invention. The pads on the circuit board 100 are, for example, symmetrically designed. Two power chips 200 are arranged side-by-side on the circuit board 100. The two power chips 200 have the same external dimensions, and each power chip 200 has thermally conductive adhesive 210 on its top surface. The thermally conductive adhesive 210 is, for example, sheet-like, and its size corresponds to the size of the power chip 200. The thermally conductive adhesive 210 is, for example, TIM adhesive (Thermal Interface Material Adhesive), which combines thermal conductivity and structural bonding functions. The thermally conductive adhesive 210 can fill the gap between the contact surfaces of the power device 200 and the heat sink 301, improving heat conduction capacity and further enhancing the physical connection between the inductor 300 and the circuit board 100. Two power chips 200 are arranged side-by-side on the circuit board 100 with a certain spacing between them. Each power chip 200 corresponds to one of the two inductors in the inductor 300. The circuit board 100 has inductor pads 101 on opposite sides of the power chips 200, which are connected to the inductors 300. The inductor pads 101 are, for example, long rectangular strips. Their larger size increases the connection strength with the inductor 300, and the larger connection surface also reduces resistance, improving the performance of the inductors in the inductor 300. To fully utilize the space on the circuit board 100, capacitors 110, resistors, and other discrete components are also placed in the area between the two power chips 200. Naturally, to avoid interference with the connection between the power chips 200 and the inductors 300, the top surfaces of the other discrete components on the circuit board 100 are not higher than the sum of the thickness of the power chip 200 and the thickness of the thermally conductive adhesive 210.

[0038] Figure 4 This diagram illustrates an inductor in a power module according to an embodiment of the present invention; the inductor 300 includes a support leg 310 and a winding 320. Figure 4 The components include a 330 (obscured and not visible), a magnet 330, and a heat sink 301. Support feet 310 also function as pins, electrically connecting the winding 320 to the circuit board 100. For example, four support feet 310 are arranged in pairs, each positioned at one of the opposite ends of the magnet 330. The dimensions of the support feet 310 are, for example, similar to... Figure 3The inductor pads 101 correspond to the magnet 330. The magnet 330 also has an annular groove, allowing C-shaped heat sinks 301 to be mounted on its left and right sides. The heat sinks 301 are at least partially embedded in the annular groove of the magnet 330, thus fixing the heat sinks 301 to the magnet 330. The support foot 310 has a preset height, so that after the inductor 300 is connected to the circuit board 100, its lower surface is suspended above the circuit board 100. Specifically, the height of the support foot 310 matches the thickness of the power chip 200 and the thickness of the thermally conductive adhesive 210, so that after the inductor 300 is connected to the circuit board 100, the bottom surface of the lower part of the heat sink 301 can be connected to the top surface of the power chip 200 through the thermally conductive adhesive 210. Heat from the power chip 200 can be quickly dissipated from the heat sink 301 through the thermally conductive adhesive 210 on its top surface, achieving better heat dissipation.

[0039] Figure 5 This shows a top view of a power module according to an embodiment of the present invention. Figure 6 and Figure 7 The following are cross-sectional views of the power module taken along section lines AA and BB, respectively; Figure 5 As shown in the top view, the inductor 300 of this power module completely covers the two power chips 200 located on the same side surface of the circuit board 100 below it. The two heat sinks 301 of the inductor 300 are symmetrically arranged along the dotted line in the annular groove of the magnet 330. See also Figure 6 The cross-sectional view shown by section line AA is intended to more clearly illustrate the structure of inductor 300 and its positional relationship with power chip 200. For example... Figure 6 As shown, the inductor 300 includes support legs 310 at both ends, a winding 320 between the two support legs 310, and a magnet 330 matching the winding 320. The winding 320 is, for example, arranged horizontally, and its two ends are respectively connected to corresponding pads on the circuit board 100 through the support legs 310. A heat sink 301 is embedded in the annular groove of the magnet 330. The heat sink 301 is, for example, C-shaped. The lower surface of the portion of the heat sink 301 located below the magnet 330 is connected to the top surface of the power chip 200, for example, through thermally conductive adhesive 210. The heat of the power chip 200 can be promptly dissipated from its top surface through the thermally conductive adhesive 210 and the heat sink 301, enhancing its heat dissipation capacity. See also Figure 7The inductor 300 includes, for example, two inductors arranged side by side, with their windings 320 arranged side by side. The magnets 330 of the two inductors are, for example, designed to be coupled, so that the two inductors in the inductor 300 can form a transformer. Two C-shaped heat sinks 301 are embedded into the annular grooves of the magnets 330 from the left and right sides, respectively. The portion of the heat sink 301 located below the magnets 330 is connected to the top surface of the power chip 200 through thermally conductive adhesive 210. On the one hand, the power chip 200 and the thermally conductive adhesive 210 can provide support and fixation for the inductor 300. On the other hand, the power chip 200 can dissipate heat in a timely manner through the thermally conductive adhesive 210 and the heat sink 301, avoiding heat accumulation and obtaining better heat dissipation capabilities.

[0040] The power module provided by this invention significantly optimizes power density and heat dissipation performance through innovative structural design. Specifically, it adopts a vertically stacked layout of suspended inductors and power chips, using support feet to space the inductor body from the circuit board. This allows the inductors to be stacked above the power chips, saving planar space and directly conducting heat from the power chips to the inductor's heat sink via thermally conductive adhesive, forming an efficient heat dissipation path. This design reduces the parasitic impedance and DC resistance of the power module and allows for flexible configuration of inductor or transformer functions through uncoupled and coupled magnetic structures, accommodating various scenario requirements.

[0041] This solution offers significant advantages for industrial applications: First, the standardized circuit board and modular inductor design simplify the assembly process and reduce complexity, improving the consistency of mass-produced products and reducing production costs. Second, the connection structure between the heat sink and the power chip eliminates the need for additional heat dissipation components, achieving both miniaturization and high heat dissipation efficiency, making it suitable for various compact devices such as consumer electronics and industrial automation. Third, by adjusting the coupling method between the inductor windings and the magnet, different voltage / current requirements can be quickly adapted, shortening the R&D cycle and meeting the demands of rapid market iteration.

[0042] The above description does not provide detailed explanations of the technical aspects of the device's layout and injection molding. However, those skilled in the art should understand that various technical means can be used to form windings, support legs, etc., of the desired shape. Furthermore, to form the same structure, those skilled in the art can design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0043] The embodiments of the present invention have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of the invention. The scope of the invention is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the invention, and all such substitutions and modifications should fall within the scope of the invention.

Claims

1. A power supply module, characterized in that, include: Circuit board; At least one power chip, the power chip being disposed on a first surface of the circuit board; An inductor is disposed on the first surface of the circuit board; The inductor includes a support foot, which is positioned above the power chip via the support foot. The support foot is connected to the circuit board from the outside of the power chip.

2. The power module according to claim 1, characterized in that, The inductor also includes: The main body includes a winding and a magnet that matches the winding. The winding is arranged laterally, and both ends of the winding are electrically connected to the circuit board through corresponding support feet. The support foot has a preset height, so that the body of the inductor is spaced apart from the circuit board.

3. The power module according to claim 2, characterized in that, The inductor also includes a heat sink disposed on the surface of the magnet, and the top surface of the power chip is connected to at least a portion of the heat sink.

4. The power supply module according to claim 3, characterized in that, The magnet has a groove on its surface, and the heat sink includes at least a C-shaped structure. The heat sink is at least partially embedded in the groove, and the portion of the heat sink located below the magnet is connected to the top surface of the power chip.

5. The power supply module according to claim 4, characterized in that, The groove is an annular groove.

6. The power supply module according to claim 4, characterized in that, A thermally conductive adhesive is also provided between the top surface of the power chip and the heat sink. The thermally conductive adhesive fills the gap between the top surface of the power chip and the corresponding area of ​​the heat sink. The thermally conductive adhesive is a thermal interface material adhesive, which has both thermal conduction and structural bonding functions.

7. The power supply module according to claim 6, characterized in that, The first surface of the circuit board is also provided with capacitors and resistors, the height of which does not exceed the sum of the thickness of the power chip and the thickness of the thermally conductive adhesive.

8. The power supply module according to claim 6, characterized in that, The height of the support foot is matched with the thickness of the power chip and the thickness of the thermally conductive adhesive, so that the top surface of the power chip is in close contact with the corresponding area of ​​the heat sink.

9. The power supply module according to claim 3, characterized in that, It also includes an auxiliary chip disposed on the first surface of the circuit board. Both the auxiliary chip and the power chip are located below the inductor. The top surface of the auxiliary chip and the top surface of the power chip are respectively connected to at least a portion of the heat sink.

10. The power supply module according to claim 1, characterized in that, The inductor includes at least two inductors arranged in parallel, wherein the magnets of the two inductors are either coupled or uncoupled.

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