A circuit board, display device and wearable device

Abstract

The application discloses a circuit board, a display device and a wearable device. The circuit board comprises a circuit board body and a light sensing structure, the circuit board body is provided with a first opening, the first opening penetrates through the circuit board body and exposes a light sensing surface of at least part of the light sensing structure; the circuit board further comprises an adhesive structure, the adhesive structure bonds the light sensing structure and the circuit board body; the circuit board further comprises a barrier structure, along the thickness direction of the circuit board, the light sensing structure covers the barrier structure; at least part of the adhesive structure is located on the side of the barrier structure away from the first opening. By adopting the technical scheme, the adhesive structure is arranged in the circuit board, the light sensing structure and the circuit board body are bonded through the adhesive structure, the stability of the circuit board structure is ensured, and the light sensing structure is not easy to fall off. Furthermore, the barrier structure is arranged in the circuit board, the adhesive structure is inhibited from flowing into the first opening by the barrier structure, the first opening can normally transmit light to the light sensing structure, and the light sensing performance of the light sensing structure is good.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a circuit board, display device, and wearable device. Background Technology

[0002] An ambient light sensor (ALS) can automatically adjust screen brightness based on the intensity of ambient light, and many display devices currently incorporate this device. In current manufacturing processes, the pads of the ambient light sensor are typically soldered to the trace layer on a flexible circuit board to conduct current and secure the sensor.

[0003] However, the current circuit board structure with ambient light sensor still has some problems that need further improvement.

[0004] Application content This application provides a circuit board, a display device, and a wearable device. An adhesive structure is used to adhere a photosensitive structure to the circuit board body, ensuring the stability of the circuit board structure. Furthermore, a barrier structure is used to suppress the flow of the adhesive structure into the first opening, reducing the risk of the adhesive structure flowing into the first opening and ensuring the photosensitivity of the photosensitive structure.

[0005] In a first aspect, this application provides a circuit board, including a circuit board body and a photosensitive structure, wherein a first opening is provided in the circuit board body, the first opening penetrates the circuit board body and exposes at least a portion of the photosensitive surface of the photosensitive structure; The circuit board also includes an adhesive structure that bonds the photosensitive structure and the circuit board body. The circuit board further includes a barrier structure, and the photosensitive structure covers the barrier structure along the thickness direction of the circuit board; at least a portion of the adhesion structure is located on the side of the barrier structure away from the first opening.

[0006] In a second aspect, a display device includes the circuit board described in any one of the first aspects; The display device further includes a display panel, which is electrically connected to the circuit board.

[0007] Thirdly, this application provides a wearable device including the display device described in the second aspect.

[0008] The technical solution of this application embodiment provides an adhesive structure and a barrier structure in the circuit board. The adhesive structure bonds the photosensitive structure to the circuit board body, ensuring a stable connection between the photosensitive structure and the circuit board, thereby ensuring the overall structural stability and performance stability of the circuit board. Furthermore, along the thickness direction of the circuit board, the photosensitive structure covers the barrier structure, and at least part of the adhesive structure is located on the side of the barrier structure away from the first opening. The barrier structure prevents the adhesive structure from flowing into the first opening, ensuring that light can pass through the first opening normally to the photosensitive structure, thus guaranteeing the photosensitive area and photosensitive performance of the photosensitive structure.

[0009] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 A schematic diagram of a circuit board structure provided in an embodiment of this application; Figure 2 for Figure 1 A schematic diagram of a cross-sectional structure along the central section line AA'; Figure 3 for Figure 1 Another cross-sectional structure diagram along the central section line AA'; Figure 4 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 5 for Figure 4 A schematic diagram of a cross-sectional structure along the central section line BB'; Figure 6 for Figure 4 Another cross-sectional structure diagram along the central section line BB'; Figure 7 for Figure 4 Another cross-sectional structure diagram along the central section line BB'; Figure 8 for Figure 4 Another cross-sectional structure diagram along the central section line BB'; Figure 9 for Figure 4 Another cross-sectional structure diagram along the central section line BB'; Figure 10 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 11 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 12 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 13 for Figure 12 A schematic diagram of a cross-sectional structure along the central section line CC'; Figure 14 This is another cross-sectional structural schematic diagram provided for an embodiment of this application; Figure 15 This is another cross-sectional structural schematic diagram provided for an embodiment of this application; Figure 16 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 17 for Figure 16 A schematic diagram of a cross-sectional structure along the central section line DD'; Figure 18 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 19 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 20 for Figure 19 A schematic diagram of a cross-sectional structure along the central section line EE'; Figure 21 This is a schematic diagram of the structure of a top-level isolation layer provided in an embodiment of this application; Figure 22 for Figure 19 Another cross-sectional structure diagram along the central section line EE'; Figure 23 This is a schematic diagram of the structure of a first lead layer provided in an embodiment of this application; Figure 24 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 25 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 26 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 27 This is a schematic diagram of another circuit board structure provided in an embodiment of this application; Figure 28 This is a schematic diagram of the structure of a wearable device provided in an embodiment of this application. Detailed Implementation

[0012] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0013] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0014] Figure 1 This is a schematic diagram of a circuit board structure provided in an embodiment of this application. Figure 2 for Figure 1 A schematic diagram of a cross-sectional structure along section line AA'. Figure 3 for Figure 1 Another cross-sectional structure diagram along section line AA', as shown below. Figures 1 to 3 As shown, the circuit board includes a circuit board body 101 and a photosensitive structure 102. The circuit board body 101 has a first opening 103 that penetrates the circuit board body 101 and exposes at least a portion of the photosensitive surface 104 of the photosensitive structure 102. The circuit board also includes an adhesive structure 105 that bonds the photosensitive structure 102 and the circuit board body 101. The circuit board also includes a barrier structure 106, with the photosensitive structure 102 covering the barrier structure 106 along the thickness direction Z of the circuit board. At least a portion of the adhesive structure 105 is located on the side of the barrier structure 106 away from the first opening 103.

[0015] The circuit board body 101 can be a flexible circuit board. The photosensitive structure 102 can be electrically connected to the circuit board body 101 through a soldering process to ensure the electrical connection between the photosensitive structure 102 and the circuit board body 101, and to ensure normal signal transmission between the circuit board body 101 and the photosensitive structure 102. Furthermore, the circuit board body 101 is provided with a first opening 103, which penetrates the circuit board body 101 and exposes at least a portion of the photosensitive surface 104 of the photosensitive structure 102. The first opening 103 is used to allow ambient light to pass through, so that ambient light can enter the photosensitive surface 104 of the photosensitive structure 102 through the first opening 103, enabling the photosensitive structure 102 to recognize changes in ambient light.

[0016] The circuit board also includes an adhesion structure 105, which is used to bond the photosensitive structure 102 and the circuit board body 101. The adhesion structure 105 can fill the gap between the photosensitive structure 102 and the circuit board body 101, making the connection between the photosensitive structure 102 and the circuit board body 101 more stable. A barrier structure 106 is also provided on the circuit board. Along the thickness direction Z of the circuit board, the photosensitive structure 102 covers the barrier structure 106, so that the photosensitive structure 102 has a large size to ensure its photosensitive area, so that the photosensitive structure 102 can receive enough ambient light and ensure its photosensitivity performance. However, since the adhesive structure 105 is typically adhesive with high fluidity, in this embodiment, at least a portion of the adhesive structure 105 is located on the side of the barrier structure 106 away from the first opening 103. That is, the barrier structure 106 is positioned on the flow path of the adhesive structure 105. This barrier structure 106 prevents the adhesive structure 105 from flowing towards the first opening 103, thus avoiding affecting the light flux incident on the photosensitive structure 102 and ensuring that the photosensitive structure 102 receives sufficient light for optical recognition or detection. Furthermore, by positioning at least a portion of the adhesive structure 105 on the side of the barrier structure 106 away from the first opening 103, it also effectively prevents the adhesive structure 105 from flowing to the side of the circuit board away from the photosensitive structure 102. This prevents unevenness on the surface of the circuit board away from the photosensitive structure 102 due to residue of the adhesive structure 105, thus avoiding impact on subsequent assembly processes.

[0017] This embodiment of the application provides a barrier structure on the circuit board, with at least a portion of the adhesive structure located on the side of the barrier structure away from the first opening. By positioning the barrier structure along the flow path of the adhesive structure, the adhesive structure is prevented from flowing into the first opening, ensuring that the photosensitive structure receives sufficient light to guarantee the sensitivity and accuracy of optical recognition or detection. Furthermore, positioning at least a portion of the adhesive structure on the side of the barrier structure away from the first opening effectively prevents the adhesive structure from flowing to the side of the circuit board away from the photosensitive structure, ensuring a smooth surface on that side and facilitating subsequent assembly processes.

[0018] Optional, continue to refer to Figure 2 and Figure 3 The barrier structure 106 includes at least one groove structure 61; the groove structure 61 penetrates a portion of the circuit board body 101, and a portion of the adhesion structure 105 is located within the groove structure 61.

[0019] The barrier structure 106 can be a groove structure 61, which can be formed in the circuit board body 101 by grooving a portion of the film layer on the circuit board body 101. The groove structure 61 is formed on the flow path of the adhesion structure 105. The groove structure 61 can accommodate at least a portion of the adhesion structure 105, preventing the adhesion structure 105 from continuing to flow into the first opening 103, thus ensuring the light transmittance at the first opening 103 and the photosensitivity of the photosensitive structure 102.

[0020] Understandably, continue to refer to Figure 2 and Figure 3 As shown, the number of film layers on the circuit board body 101 and the number of film layers penetrated on the circuit board body 101 can be diverse. Under the premise of ensuring the performance of the circuit board, the number of film layers penetrated on the circuit board body 101 can be selected according to the actual design requirements. This application embodiment does not make specific limitations.

[0021] Optional, continue to refer to Figure 2 and Figure 3 As shown, the circuit board body 101 includes a substrate layer 11, a first lead layer 12, and multiple first isolation layers 13 stacked together. The first isolation layers 13 are located on the side of the first lead layer 12 away from the substrate layer 11. The photosensitive structure 102 includes a photosensitive chip 21 and a connection pin 22. The connection pin 22 is located on the side of the photosensitive chip 21 facing the circuit board body 101. The groove structure 61 includes a first groove structure 611, which penetrates the multiple first isolation layers 13 and exposes the first lead layer 12. At least a portion of the connection pin 22 is located within the first groove structure 611 and is electrically connected to the first lead layer 12. A partial adhesion structure 105 is located within the first groove structure 611.

[0022] Among them, such as Figure 2 As shown, the circuit board body 101 can be a single-layer wiring structure, and the circuit board body 101 includes a base layer 11, a first lead layer 12, and multiple first isolation layers 13 stacked together. Figure 3 As shown, the circuit board body 101 can also be a double-layer trace structure. The circuit board body 101 includes multiple layers of first isolation layer 13, first lead layer 12, base layer 11, second lead layer 14, and multiple layers of second isolation layer 15 stacked together. The specific structure of the circuit board body 101 can be selected according to actual design requirements, and the embodiments of this application do not impose specific limitations.

[0023] The base layer 11 can be made of polyimide material, the first lead layer 12 and the second lead layer 14 can both be made of metal materials such as copper, and the multilayer first isolation layer 13 and the multilayer second isolation layer 15 can both include an insulating adhesive layer 131, an insulating dielectric layer 132 and an electromagnetic shielding layer 133 stacked together.

[0024] The groove structure 61 may include a first groove structure 611. When the circuit board body 101 is a single-layer or double-layer trace structure, the first groove structure 611 penetrates multiple layers of the first isolation layer 13 and exposes the first lead layer 12. The connection pin 22 of the photosensitive structure 102 can be located within the first groove structure 611 and electrically connected to the first lead layer 12, thereby realizing the electrical connection between the photosensitive chip 21 of the photosensitive structure 102 and the circuit board body 101. The first groove structure 611 is located between at least a portion of the adhesive structure 105 and the first opening 103. The first groove structure 611 can also accommodate a portion of the flowing adhesive structure 105, that is, the first groove structure 611 can accommodate the connection pin 22 of the photosensitive structure 102 and at least a portion of the adhesive structure 105. Thus, by setting the first groove structure 611 to simultaneously accommodate the connection pin 22 of the photosensitive structure 102 and at least a portion of the adhesive structure 105, the function of the first groove structure 611 can be reused, thereby reducing the number of slots on the circuit board body 101 and ensuring the structural stability of the circuit board body 101.

[0025] Optional, Figure 4 This is a schematic diagram of another circuit board structure provided in an embodiment of this application. Figure 5 for Figure 4 A schematic diagram of a cross-sectional structure along section line BB', as shown below. Figure 4 and Figure 5As shown, the circuit board body 101 includes a substrate layer 11, a first lead layer 12, and a first isolation layer 13 stacked together. The first isolation layer 13 is located on the side of the first lead layer 12 away from the substrate layer 11. The photosensitive structure 102 includes a photosensitive chip 21 and a connection pin 22. The connection pin 22 is located on the side of the photosensitive chip 21 facing the circuit board body 101. The groove structure 61 includes a first groove structure 611 and at least one second groove structure 612. The first groove structure 611 penetrates multiple layers of the first isolation layer 13 and exposes the first lead layer 12. The second groove structure 612 penetrates at least one layer of the first isolation layer 13 and is located on the side of the first groove structure 611 near the first opening 103. At least a portion of the connection pin 22 is located within the first groove structure 611 and is electrically connected to the first lead layer 12. A partial adhesion structure 105 is located within the second groove structure 612.

[0026] In this circuit board body 101, a first recessed structure 611 and at least one second recessed structure 612 are spaced apart. The first recessed structure 611 penetrates multiple layers of first isolation layers 13 and exposes a first lead layer 12. The connection pin 22 of the photosensitive structure 102 is located within the first recessed structure 611 and is electrically connected to the first lead layer 12, thereby realizing the electrical connection between the photosensitive chip 21 of the photosensitive structure 102 and the circuit board body 101. The second recessed structure 612 penetrates at least one layer of the first isolation layer 13, for example, as shown in... Figure 5 As shown, the second groove structure 2 penetrates the electromagnetic shielding layer 133 and the insulating dielectric layer 132 in the first isolation layer 13, exposing the insulating adhesive layer 131. Compared to the first groove structure 611, the second groove structure 612 is closer to the first opening 103. The second groove structure 612 is located on the flow path of the adhesive structure 105. The second groove structure 612 can accommodate part of the adhesive structure 105, preventing the adhesive structure 105 from flowing into the first opening 103, and ensuring that the photosensitive structure 102 can receive enough light to ensure the sensitivity and accuracy of optical recognition or optical detection.

[0027] Furthermore, the second groove structure 612 is located on the side of the first groove structure 611 near the first opening 103, meaning that the first groove structure 611 and the second groove structure 612 are set independently. On the one hand, this ensures that the design of the first groove structure 611 and the second groove structure 612 has a greater degree of freedom. On the other hand, the depth of the second groove structure 612 can be reasonably set according to the capacity of the adhesive structure 105 to ensure that the second groove structure 612 can accommodate a sufficient number of adhesive structures 105, effectively reducing the risk of the adhesive structure 105 overflowing into the first opening 103.

[0028] Optional, Figure 6 for Figure 4 Another cross-sectional structural diagram along section line BB', as shown below. Figure 6As shown, the second groove structure 612 penetrates multiple layers of the first isolation layer 13 and exposes the first lead layer 12.

[0029] The second groove structure 612 can penetrate multiple layers of the first isolation layer 13 and expose the first lead layer 12. That is, the second groove structure 612 and the first groove structure 611 have the same depth. Thus, the second groove structure 612 and the first groove structure 611 can be etched in the same process, reducing the difficulty of fabricating the first groove structure 611 and the second groove structure 612 and simplifying the process flow.

[0030] Optional, Figure 7 for Figure 4 Another cross-sectional structural diagram along section line BB', as shown below. Figure 7 As shown, the second groove structure 612 penetrates the multiple layers of the first isolation layer 13 and at least penetrates the first lead layer 12.

[0031] The second groove structure 612 penetrates multiple layers of the first isolation layer 13 and at least penetrates the first lead layer 12, and exposes the base layer 11, so that the depth of the second groove structure 612 can be greater than the depth of the first groove 611. In this way, the second groove structure 612 can accommodate more adhesive structures 105, further reducing the risk of adhesive structures 105 flowing into the first opening 103.

[0032] Optional, Figure 8 for Figure 4 Another cross-sectional structural diagram along section line BB', as shown below. Figure 8 As shown, the circuit board body 101 also includes a second lead layer 14 and multiple second isolation layers 15 stacked together. The second isolation layer 15 is located on the side of the second lead layer 14 away from the base layer 11. The second groove structure 612 penetrates multiple first isolation layers 13 and penetrates at least one of the first lead layer 12, the base layer 11, the second lead layer 14, and the second isolation layer 15.

[0033] When the circuit board body 101 has a double-layer trace structure, the second groove structure 612 can penetrate multiple layers of the first isolation layer 13 and at least one of the first lead layer 12, the base layer 11, the second lead layer 14, and the second isolation layer 15. For example, as shown... Figure 8 As shown, the second groove structure 612 can penetrate multiple layers of the first isolation layer 13 and the insulating adhesive layer 131 in the first lead layer 12, the base layer 11, the second lead layer 14, and the second isolation layer 15, exposing the insulating dielectric layer 132 in the second isolation layer 15. By reasonably setting the depth of the second groove structure 612, the depth of the second groove structure 612 is matched with the capacity of the adhesive structure 105, ensuring that the second groove structure 612 can accommodate more adhesive structures 105 and preventing the adhesive structures 105 from flowing into the first opening 103.

[0034] Optional, Figure 9 for Figure 4 Another cross-sectional structural diagram along section line BB', as shown below. Figure 9 As shown, corresponding to the second groove structure 612, the opening area in the first lead layer 12 is larger than the opening area in the first isolation layer 13.

[0035] The second groove structure 612 penetrates multiple layers of the first isolation layer 13 and at least penetrates the first lead layer 12. Since the first isolation layer 13 and the first lead layer 12 are made of different materials, the fabrication process of the second groove structure 612 becomes complex when the openings penetrating the first isolation layer 13 and the first lead layer 12 are fabricated in the same process. Therefore, in this embodiment, the openings in the first lead layer 12 can be obtained by etching the first lead layer 12 using a patterning process after its fabrication is completed. Similarly, the openings in the multiple layers of the first isolation layer 13 can be obtained by etching the multiple layers of the first isolation layer 13 after its fabrication is completed. In other words, the openings penetrating the first isolation layer 13 and the openings penetrating the first lead layer 12 are fabricated in different processes. Furthermore, to ensure that the opening penetrating the first isolation layer 13 and the opening penetrating the first lead layer 12 can communicate, and to reduce the alignment difficulty between the opening penetrating the first isolation layer 13 and the opening penetrating the first lead layer 12, the area of ​​the opening in the first lead layer 12 can be set to be larger than the area of ​​the opening in the first isolation layer 13, such as... Figure 9 As shown, the opening width w1 in the first lead 12 is greater than the opening width w2 in the first isolation layer 12. By setting the openings in the first lead layer 12 and the first isolation layer 13 to be independently set, and setting the opening area in the first lead layer 12 to be greater than the opening area in the first isolation layer 13, the fabrication difficulty of the second groove structure 612 is effectively reduced.

[0036] Optional, such as Figure 4 As shown, the second groove structure 612 is arranged around the first opening 103.

[0037] The second groove structure 612 is a ring-shaped closed structure and is arranged around the first opening 103, so that the second groove structure 612 can accommodate the adhesive structure 105 in different directions, preventing the adhesive structure 105 from flowing into the first opening 103, ensuring that the photosensitive structure 102 can receive a sufficient amount of light, and further ensuring the sensitivity and accuracy of optical recognition or optical detection.

[0038] Optional, Figure 10 This is a schematic diagram of another circuit board structure provided in an embodiment of this application. Figure 11 This is a schematic diagram of another circuit board structure provided in an embodiment of this application, such as... Figure 10 and Figure 11As shown, the groove structure 61 includes a plurality of second groove structures 612; the plurality of second groove structures 612 are arranged sequentially along the direction from the first groove structure 611 to the first opening 103.

[0039] Multiple second groove structures 612 can be provided on the circuit board body 101, arranged sequentially along the direction from the first groove structure 611 to the first opening 103. By providing multiple second groove structures 612, the capacity for the flowing adhesive structure 105 is increased, preventing the adhesive structure 105 from flowing into the first opening 103, ensuring that the photosensitive structure 102 can receive sufficient light, and further ensuring the sensitivity and accuracy of optical recognition or optical detection.

[0040] It should be noted that the number of the second groove structure 612 can be selected according to actual design requirements, and this application embodiment does not impose a specific limitation. For example, Figure 10 and Figure 11 The example shown is based on setting two second groove structures 612.

[0041] Optional, continue to refer to Figure 10 and Figure 11 As shown, the plurality of second groove structures 612 include a first sub-groove structure 6121 and a second sub-groove structure 6122. The first sub-groove structure 6121 is located on the side of the second sub-groove structure 6122 away from the first opening 103. The groove depth h1 of the first sub-groove structure 6121 is greater than or equal to the groove depth h2 of the second sub-groove structure 6122.

[0042] The plurality of second groove structures 612 include a first sub-groove structure 6121 and a second sub-groove structure 6122, wherein the second sub-groove structure 6122 is located between the first sub-groove structure 6121 and the first opening 103. Figure 10 As shown, the groove depth h1 of the first sub-groove structure 6121 is set to be equal to the groove depth h2 of the second sub-groove structure 6122. In this way, the first sub-groove structure 6121 and the second sub-groove structure 6122 are prepared simultaneously using the same process, reducing the difficulty of preparation. Figure 11 As shown, the groove depth h1 of the first sub-groove structure 6121 is greater than the groove depth h2 of the second sub-groove structure 6122. The groove depth of the first sub-groove structure 6121, which is farther away from the first opening 103, is greater. Compared with the second sub-groove structure 6122, the first sub-groove structure 6121 can accommodate more adhesive structures 105, preventing a large number of adhesive structures 105 from flowing into the first opening 103. The groove depth of the second sub-groove structure 6122, which is closer to the first opening 103, is smaller. This can ensure the strength of the area of ​​the circuit board body 101 near the first opening 103, reduce deformation, and ensure the structural stability of the circuit board body 101.

[0043] Optional, Figure 12 This is a schematic diagram of another circuit board structure provided in an embodiment of this application. Figure 13 for Figure 12 A schematic diagram of a cross-sectional structure along the section line CC', such as... Figure 12 and Figure 13 As shown, the barrier structure 106 includes at least one bump structure 62; the circuit board includes a first lead layer 12; the photosensitive structure 102 includes a photosensitive chip 21 and a connection pin 22, the connection pin 22 is located on the side of the photosensitive chip 21 facing the circuit board body 101 and is electrically connected to the first lead layer 12; the bump structure 62 is located on the side of the connection pin 22 near the first opening 103.

[0044] The circuit board body 101 may be provided with a first groove structure 611, which exposes the first lead layer 12 in the circuit board body 101, and the connection pin 22 is provided in the first groove structure 611. In this way, the photosensitive chip 21 in the photosensitive structure 102 can be electrically connected to the first lead layer 12 through the connection pin 22, thus ensuring the electrical connection effect between the photosensitive chip 21 and the circuit board body 101.

[0045] And, as Figure 12 and Figure 13 As shown, the barrier structure 106 in the circuit board body 101 may include at least one bump structure 62. The bump structure 62 is located on the side of the connection pin 22 near the first opening 103, and at least part of the adhesion structure 105 is located on the side of the bump structure 62 away from the first opening 103. The bump structure 62 can block the adhesion structure 105, preventing the adhesion structure 105 from flowing to the first opening 103, ensuring that the photosensitive structure 102 can receive a sufficient amount of light, and further ensuring the sensitivity and accuracy of optical recognition or optical detection.

[0046] Optionally, the bump structure 62 can be prepared by screen printing. The bump structure 62 prepared by screen printing is structurally matched with the photosensitive structure 102, and the formation process of the bump structure 62 is mature and stable, and the structure and performance of the bump structure 62 are stable.

[0047] Optional, such as Figure 12 As shown, the bump structure 62 is arranged around the first opening 103.

[0048] The bump structure 62 is a ring-shaped closed structure and is arranged around the first opening 103, so that the bump structure 62 can block the adhesive structure 105 in different directions, preventing the adhesive structure 105 from flowing into the first opening 103 and ensuring a good blocking effect on the adhesive structure 105.

[0049] Optional, Figure 14 This is another cross-sectional structural schematic diagram provided in an embodiment of this application. Figure 15 Another cross-sectional structural schematic diagram provided for an embodiment of this application, such as... Figure 14 and Figure 15 As shown, the barrier structure 106 includes a plurality of bump structures 62; the plurality of bump structures 62 are arranged sequentially along the direction from the connection pin 22 to the first opening 103.

[0050] The barrier structure 106 may include multiple bump structures 62 arranged sequentially along the direction from the connecting pin 22 toward the first opening 103. By setting multiple bump structures 62, multi-stage blocking of the flowing adhesive structure 105 is achieved, preventing the adhesive structure 105 from flowing into the first opening 103.

[0051] It should be noted that the number of protrusion structures 62 can be selected according to actual design requirements, and this application embodiment does not impose a specific limitation. For example, Figure 14 and Figure 15 The examples all use two bump structures 62 as an example.

[0052] Optional, continue to refer to Figure 15 As shown, the plurality of bump structures 62 include a first bump structure 621 and a second bump structure 622. The first bump structure 621 is located on the side of the second bump structure 622 away from the first opening 103. The thickness h3 of the first bump structure 621 is greater than or equal to the thickness h4 of the second bump structure 622.

[0053] The plurality of bump structures 62 may include a first bump structure 621 and a second bump structure 622, wherein the second bump structure 622 is located between the first bump structure 621 and the first opening 103. Figure 14 As shown, the thickness h3 of the first protrusion structure 621 is set to be equal to the thickness h4 of the second protrusion structure 622. The first protrusion structure 621 and the second protrusion structure 622 can be fabricated using the same process, simplifying the fabrication process. Figure 15 As shown, the thickness h3 of the first bump structure 621 is greater than the thickness h4 of the second bump structure 622. The first bump structure 621 has a larger thickness, which can block most of the adhesion structure 105. The second bump structure 622 has a smaller thickness, which can not only block the overflow adhesion structure 105, but also reduce the obstruction of oblique light passing through the first opening 103, thereby increasing the light transmittance of the first opening 103. This allows the photosensitive chip 21 to receive more large-angle light, ensuring the photosensitive performance of the photosensitive structure 102.

[0054] Optional, Figure 16 This is a schematic diagram of another circuit board structure provided in an embodiment of this application. Figure 17 for Figure 16 A schematic diagram of a cross-sectional structure along the section line DD', such as... Figure 16 and Figure 17 As shown, the barrier structure 106 includes at least one groove structure 61 and at least one bump structure 62; the groove structure 61 penetrates a portion of the circuit board body 101, and at least a portion of the adhesion structure 105 is located within the groove structure 61; the bump structure 62 is located on the side of the groove structure 61 near the first opening 103.

[0055] The barrier structure 106 includes at least one groove structure 61 and at least one protrusion structure 62, for example, as shown in the example. Figure 17 As shown, the barrier structure 106 includes a groove structure 61 and a bump structure 62. Specifically, the groove structure 61 may include a first groove structure 611 and a second groove structure 612. The first groove structure 611 at least accommodates the connection pin 22 of the photosensitive structure 102, realizing the electrical connection function between the photosensitive structure 102 and the circuit board body 101. The second groove structure 612 accommodates at least part of the adhesive structure 105, reducing the risk of the adhesive structure 105 overflowing into the first opening 103. The bump structure 62 is disposed between the groove structure 61 and the first opening 103, further blocking the adhesive structure 105. By setting the barrier structure 106 to include at least one groove structure 61 and at least one bump structure 62, when the adhesive structure 105 flows towards the first opening 103, most of the adhesive structure 105 will be accommodated by the groove structure 61. When part of the adhesive structure 105 completely fills the groove structure 61, part of the adhesive structure 105 will be blocked by the bump structure 62. By combining the groove structure 61 and the bump structure 62, the adhesive structure 105 is blocked in multiple ways, ensuring that the adhesive structure 105 does not flow into the first opening 103.

[0056] Optional, Figure 18 This is a schematic diagram of another circuit board structure provided in an embodiment of this application, such as... Figure 18 As shown, the barrier structure includes at least one bump structure 62; the circuit board includes a first lead layer 12; the photosensitive structure includes a photosensitive chip 21 and a connection pin 22, the connection pin 22 being located on the side of the photosensitive chip 21 facing the circuit board body and electrically connected to the first lead layer 12; the bump structure 62 is located between two adjacent connection pins 22.

[0057] The barrier structure may include at least one bump structure 62. The number of bump structures 62 can be one, two, three, four, etc., and can be set according to actual design requirements. For example, Figure 18Taking a barrier structure comprising four bump structures 62 as an example, bump structures are provided between adjacent connection pins 22, and multiple bump structures 62 are combined to form a non-closed structure. The circuit board also includes a first lead layer 12, a portion of which is exposed and electrically connected to the connection pins 22 of the photosensitive structure 102, realizing the electrical connection between the photosensitive chip 21 of the photosensitive structure 102 and the circuit board body. The material of the first lead layer 12 can be a metal such as copper. The bump structures 62 are disposed between adjacent connection pins 22, and the bump structures 62 can block the adhesion structure 105, preventing the adhesion structure 105 from flowing to the first opening 103, ensuring that the photosensitive structure 102 can receive a sufficient amount of light, further ensuring the sensitivity and accuracy of optical recognition or optical detection.

[0058] Optional, Figure 19 This is a schematic diagram of another circuit board structure provided in an embodiment of this application. Figure 20 for Figure 19 A schematic diagram of a cross-sectional structure along the section line EE'. Figure 21 This is a schematic diagram of the structure of a top-level isolation layer provided in an embodiment of this application, as shown below. Figure 19 , Figure 20 and Figure 21 As shown, the circuit board includes a base layer 11, a first lead layer 12, and multiple first isolation layers 13 stacked together. The first isolation layer 13 is located on the side of the first lead layer 12 away from the base layer 11. The first isolation layer 13 includes a top isolation layer 134, which is located on the side of the other first isolation layers 13 away from the base layer 11. The surface of the top isolation layer 134 away from the base layer 11 includes a protrusion 41 and a recess 42.

[0059] The first isolation layer 13 includes a top isolation layer 134, which is located on the side of the other isolation layers closest to the photosensitive surface 104 of the photosensitive chip 21. The top isolation layer 134 can be an electromagnetic shielding layer 133. Since the top isolation layer 134 and the photosensitive chip 21 are filled with an adhesive structure 105, a protrusion 41 and a recess 42 are provided on the surface of the top isolation layer 134 away from the substrate layer 11. With the help of the protrusion 41 and the recess 42, a physical barrier is formed to the flowing adhesive structure 105. The adhesive structure 105 needs to fill the recess 42 and climb over the protrusion 41 to continue to move forward, which effectively reduces the flow of the adhesive structure 105 and further reduces the risk of the adhesive structure 105 flowing into the first opening 103.

[0060] Optional, Figure 22 for Figure 19 Another cross-sectional structure diagram along the central section line EE'. Figure 23 This is a schematic diagram of the structure of a first lead layer provided in an embodiment of this application, as shown below. Figure 22 and Figure 23 As shown, the first lead layer 12 includes a grid lead layer 121, which includes grid leads 1211 and grid holes 1212. The grid leads 1211 surround the grid holes 1212. Along the thickness direction Z of the circuit board, the protrusion 41 overlaps with the grid leads 1211, and the recess 42 overlaps with the grid holes 1212.

[0061] The first lead layer 12 can be designed in a grid pattern to form a grid lead layer 121. The first lead layer 12 includes raised grid leads 1211 and recessed grid holes 1212, with the grid lines surrounding the grid holes 1212. Multiple first isolation layers 13 are sequentially prepared above the first lead layer 12. Due to the presence of the grid lines and grid holes 1212, and the relatively thin thickness of the first isolation layers 13, the multiple first isolation layers 13 will also have corresponding recesses and protrusions, so that the top isolation layer 134 in the first isolation layers 13 forms protrusions 41 and recesses 42. Along the thickness direction Z of the circuit board, the protrusion 41 overlaps with the grid lead 1211, and the recess 42 overlaps with the grid hole 1212. The adhesion structure 105 flows on the top isolation layer 134. With the presence of the protrusion 41 and the recess 42, the flow resistance of the adhesion structure 105 is increased, effectively suppressing the flow speed of the adhesion structure 105 and reducing the risk of the adhesion structure 105 flowing into the first opening 103.

[0062] Optional, Figure 24 This is a schematic diagram of another circuit board structure provided in an embodiment of this application. Figure 25 This is a schematic diagram of another circuit board structure provided in an embodiment of this application. Figure 26 This is a schematic diagram of another circuit board structure provided in an embodiment of this application, such as... Figure 24 , Figure 25 and Figure 26 As shown, the circuit board body 101 includes a base layer 11, a first lead layer 12, and multiple first isolation layers 13 stacked together; the circuit board body 101 also has a second opening 107, which penetrates the multiple first isolation layers 13 and exposes the first lead layer 12; along the thickness direction Z of the circuit board, the second opening 107 covers a photosensitive structure 102; the photosensitive structure 102 includes a photosensitive chip 21 and a connection pin 22, which is electrically connected to the first lead layer 12 in the second opening 107; a barrier structure 106 is disposed in the second opening 107 and includes a groove structure 61 and / or a bump structure 62; the groove structure 61 penetrates at least the first lead layer 12, and the bump structure 62 is located on the side of the first lead layer 12 away from the base layer 11 and on the side of the groove structure 61 near the first opening 103.

[0063] A second opening 107 is provided on the circuit board body 101. The second opening 107 penetrates multiple layers of the first isolation layer 13 and exposes the first lead layer 12. The second opening 107 forms a receiving space for the connection pin 22 of the photosensitive structure 102. The connection pin 22 and the first lead layer 12 are electrically connected in the second opening 107. Furthermore, since the second opening 107 covers the photosensitive structure 102 along the thickness direction Z of the circuit board, it can accommodate a portion of the photosensitive structure 102, thus reducing the thickness of the circuit board. Within the second opening 107, the gap between the photosensitive chip 21 and the circuit board body 101 can be filled with an adhesion structure 105, and a blocking structure 106 with a blocking function can be disposed within the second opening 107, such as... Figure 23 As shown, the barrier structure 106 may consist only of the groove structure 61; as Figure 25 As shown, the barrier structure 106 may consist only of the bump structure 62; as Figure 26 As shown, the barrier structure 106 may include a groove structure 61 and a protrusion structure 62. The specific arrangement of the barrier structure 106 can be selected according to actual design requirements, and this embodiment does not impose specific limitations.

[0064] Specifically, the groove structure 61 penetrates at least through the first lead layer 12 and can accommodate part of the adhesive structure 105. The bump structure 62 is located on the side of the first lead layer 12 away from the base layer 11 and on the side of the connection pin 22 near the first opening 103. The bump structure 62 can block part of the adhesive structure 105, reducing the risk of the adhesive structure 105 flowing into the first opening 103.

[0065] Optional, Figure 27 This is a schematic diagram of another circuit board structure provided in an embodiment of this application, such as... Figure 13 and Figure 27 The thickness h5 of the bump structure 62 is less than or equal to the thickness h6 of the connecting pin 22.

[0066] Specifically, the thickness of the bump structure 62 can be reasonably set according to the distance between the photosensitive surface 104 of the photosensitive chip 21 and the circuit board body 101, as well as the amount of adhesive overflow of the adhesion structure 105. This ensures that the bump structure 62 will not push up the photosensitive structure 102, thus preventing a break in the circuit between the connection pin 22 and the circuit board body 101; at the same time, it ensures that the bump structure 62 has a good blocking effect on the adhesion structure 105. For example, such as... Figure 13 As shown, the thickness h5 of the bump structure 62 is less than the thickness h6 of the connecting pin 22, so that the connecting pin 22 and the circuit board body 101 have a good electrical connection.

[0067] like Figure 27As shown, due to the second opening 107, a space for accommodating the photosensitive structure 102 is formed in the circuit board body 101. The thickness adaptability of the connection pins 22 of the photosensitive structure 102 is reduced, thereby reducing the overall thickness of the circuit board and facilitating its miniaturization. At this time, the thickness h5 of the connection pins 22 can be set to be equal to the thickness h6 of the bump structure 62, ensuring that the bump structure 62 can effectively block the adhesion structure 105 and prevent the adhesion structure 105 from flowing into the first opening 103.

[0068] Based on the same concept, this application also provides a display device, including the circuit board described in any of the above embodiments; the display device further includes a display panel, which is electrically connected to the circuit board. The circuit board can sense changes in ambient light through a photosensitive structure and output a corresponding drive signal to the display panel according to the ambient light intensity, so as to adjust the display brightness of the display panel or control the display panel to execute instructions related to the drive signal, ensuring the normal operation of the display panel.

[0069] Figure 28 This is a schematic diagram of the structure of a wearable device provided in an embodiment of this application, as shown below. Figure 28 As shown, the wearable device includes the display device 100 described in the above embodiments.

[0070] It should be noted that since the wearable device provided in this embodiment has the same or corresponding beneficial effects as the display device in the above embodiments, it will not be described in detail here. The wearable device provided in this application embodiment can be Figure 28 The smartwatch shown can also be any electronic product with a display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet, digital camera, mobile phone, smart bracelet, smart glasses, in-vehicle display, medical device, industrial control equipment, touch interactive terminal, etc. This application embodiment does not make any special limitation in this regard.

[0071] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A circuit board, characterized in that, The device includes a circuit board body and a photosensitive structure. The circuit board body has a first opening that penetrates the circuit board body and exposes at least a portion of the photosensitive surface of the photosensitive structure. The circuit board also includes an adhesive structure that bonds the photosensitive structure and the circuit board body. The circuit board further includes a barrier structure, and the photosensitive structure covers the barrier structure along the thickness direction of the circuit board; at least a portion of the adhesion structure is located on the side of the barrier structure away from the first opening.

2. The circuit board according to claim 1, characterized in that, The barrier structure includes at least one groove structure; The groove structure penetrates a portion of the circuit board body, and a portion of the adhesive structure is located within the groove structure.

3. The circuit board according to claim 2, characterized in that, The circuit board body includes a substrate layer, a first lead layer and multiple first isolation layers stacked together, wherein the first isolation layer is located on the side of the first lead layer away from the substrate layer; The photosensitive structure includes a photosensitive chip and connection pins, with the connection pins located on the side of the photosensitive chip facing the circuit board body; The groove structure includes a first groove structure that penetrates multiple layers of the first isolation layer and exposes the first lead layer. At least a portion of the connection pin is located within the first groove structure and is electrically connected to the first lead layer. Part of the adhesion structure is located within the first groove structure.

4. The circuit board according to claim 2, characterized in that, The circuit board body includes a base layer, a first lead layer and a first isolation layer stacked together, wherein the first isolation layer is located on the side of the first lead layer away from the base layer; The photosensitive structure includes a photosensitive chip and connection pins, with the connection pins located on the side of the photosensitive chip facing the circuit board body; The groove structure includes a first groove structure and at least one second groove structure. The first groove structure penetrates multiple layers of the first isolation layer and exposes the first lead layer. The second groove structure penetrates at least one layer of the first isolation layer and is located on the side of the first groove structure near the first opening. At least a portion of the connection pin is located within the first groove structure and is electrically connected to the first lead layer; Part of the adhesion structure is located within the second groove structure.

5. The circuit board according to claim 4, characterized in that, The second groove structure penetrates multiple layers of the first isolation layer and exposes the first lead layer.

6. The circuit board according to claim 4, characterized in that, The second groove structure penetrates multiple layers of the first isolation layer and at least penetrates the first lead layer.

7. The circuit board according to claim 6, characterized in that, The circuit board body further includes a second lead layer and multiple second isolation layers stacked together, wherein the second isolation layer is located on the side of the second lead layer away from the substrate layer; The second groove structure penetrates multiple layers of the first isolation layer and penetrates at least one of the first lead layer, the base layer, the second lead layer, and the second isolation layer.

8. The circuit board according to claim 6, characterized in that, Corresponding to the second groove structure, the opening area in the first lead layer is larger than the opening area in the first isolation layer.

9. The circuit board according to claim 4, characterized in that, The second groove structure is arranged around the first opening.

10. The circuit board according to claim 4, characterized in that, The groove structure includes a plurality of second groove structures; Multiple second groove structures are sequentially arranged along the direction from the first groove structure to the first opening.

11. The circuit board according to claim 10, characterized in that, The plurality of second groove structures include a first sub-groove structure and a second sub-groove structure, wherein the first sub-groove structure is located on the side of the second sub-groove structure away from the first opening; The groove depth of the first sub-groove structure is greater than or equal to the groove depth of the second sub-groove structure.

12. The circuit board according to claim 1, characterized in that, The barrier structure includes at least one bump structure; The circuit board includes a first lead layer; The photosensitive structure includes a photosensitive chip and a connection pin. The connection pin is located on the side of the photosensitive chip facing the circuit board body and is electrically connected to the first lead layer. The bump structure is located on the side of the connection pin closest to the first opening.

13. The circuit board according to claim 12, characterized in that, The bump structure is arranged around the first opening.

14. The circuit board according to claim 12, characterized in that, The thickness of the bump structure is less than or equal to the thickness of the connection pin.

15. The circuit board according to claim 12, characterized in that, The barrier structure includes a plurality of the aforementioned bump structures; Along the direction of the connection pin pointing to the first opening, a plurality of the bump structures are arranged sequentially.

16. The circuit board according to claim 15, characterized in that, The plurality of said bump structures include a first bump structure and a second bump structure, wherein the first bump structure is located on the side of the second bump structure away from the first opening; The thickness of the first bump structure is greater than or equal to the thickness of the second bump structure.

17. The circuit board according to claim 1, characterized in that, The barrier structure includes at least one bump structure; The circuit board includes a first lead layer; The photosensitive structure includes a photosensitive chip and a connection pin. The connection pin is located on the side of the photosensitive chip facing the circuit board body and is electrically connected to the first lead layer. The bump structure is located between two adjacent connection pins.

18. The circuit board according to claim 1, characterized in that, The barrier structure includes at least one groove structure and at least one bump structure; The groove structure extends through a portion of the circuit board, and at least a portion of the adhesive structure is located within the groove structure; The bump structure is located on the side of the groove structure near the first opening.

19. The circuit board according to claim 1, characterized in that, The circuit board body includes a substrate layer, a first lead layer and multiple first isolation layers stacked together, wherein the first isolation layer is located on the side of the first lead layer away from the substrate layer; The first isolation layer includes a top isolation layer, which is located on the side of the other first isolation layers away from the base layer; The surface of the top insulating layer away from the base layer includes protrusions and recesses.

20. The circuit board according to claim 19, characterized in that, The first lead layer includes a grid lead layer, the grid lead layer including grid leads and grid holes, the grid leads surrounding the grid holes; Along the thickness direction of the circuit board, the protrusions overlap with the grid leads, and the recesses overlap with the grid holes.

21. The circuit board according to claim 1, characterized in that, The circuit board body includes a substrate layer, a first lead layer and multiple first isolation layers stacked together; The circuit board body is further provided with a second opening, which penetrates the multilayer first isolation layer and exposes the first lead layer; along the thickness direction of the circuit board, the second opening covers the photosensitive structure; The photosensitive structure includes a photosensitive chip and a connection pin, wherein the connection pin is electrically connected to the first lead layer in the second opening; The barrier structure is disposed within the second opening and includes a groove structure and / or a bump structure; the groove structure penetrates at least through the first lead layer, and the bump structure is located on the side of the first lead layer away from the substrate layer and on the side of the groove structure close to the first opening.

22. A display device, characterized in that, Includes the circuit board as described in any one of claims 1-21; The display device further includes a display panel, which is electrically connected to the circuit board.

23. A wearable device, characterized in that, Includes the display device as described in claim 22.

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