PCB board processing equipment with dust removal function

Abstract

The application provides a PCB processing equipment with dust removal function, and relates to the technical field of integrated circuit manufacturing. The PCB processing equipment with dust removal function comprises a machine body, a drilling mechanism movably arranged on the machine body and used for drilling a PCB, the drilling mechanism comprising a drilling shaft, an elastic cover movably sleeved outside the drilling shaft, a hollow sealing ring arranged at the bottom of the elastic cover, a first air duct arranged inside the elastic cover, and a buffer mechanism connected between the drilling mechanism and the elastic cover and used for providing buffer for the elastic cover. In the first working mode, the suction pipe is used for efficiently capturing the dust flying upward before drilling, so as to prevent the dust from polluting the hole wall surface and forming a drilling pollution layer affecting subsequent copper plating. In the second working mode, the displacement detection unit accurately identifies the drilling time, the air supply pipe supplies air into the hole, and the dust that has entered the hole is blown downward, so as to ensure that the liquid medicine is fully soaked and the plating layer is continuously grown in the subsequent hole metallization process.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to a PCB board processing equipment with dust removal function. Background Technology

[0002] In the drilling process of printed circuit boards (PCBs), a large amount of dust is generated when the drill bit rotates at high speed and cuts the substrate material made of resin and glass fiber. The diffusion behavior of dust during drilling changes significantly with different processing stages: before the drill bit penetrates the board, the dust mainly flies upward along the helical groove of the drill bit and disperses around the drill spindle and the upper surface area of ​​the board; at the moment the drill bit penetrates the board, the high-pressure airflow forces some of the dust into the hole and diffuses downwards from the board.

[0003] If drilling dust is not removed in time, it will form an adhesion layer (drill sludge) on the hole wall surface, clogging the tiny through holes. This directly affects the wetting effect of the solution in subsequent hole metallization processes such as copper plating, leading to serious defects such as no copper in the hole or hole wall separation, ultimately reducing the yield and electrical connection reliability of the printed circuit board. Therefore, timely and effective dust removal in the PCB drilling process is a key step in ensuring hole metallization quality and product yield. Existing PCB drilling equipment is usually only equipped with a single exhaust or blowing dust removal device, and its dust removal position and timing are relatively fixed, making it difficult to adapt to changes in the dust diffusion direction during the drilling process. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a PCB board processing equipment with dust removal function.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A PCB board processing equipment with dust removal function includes: Organism; The XZ axis drive module is mounted on the machine body; The Y-axis drive module is mounted on the machine body; The positioning seat is connected to the Y-axis drive module and is used to support the PCB board; A drilling mechanism is connected to the XZ axis drive module. The drilling mechanism includes a frame, a motor mounted on the frame, and a drill spindle driven by the motor. The XZ axis drive module is used to drive the drill spindle to move along the X-axis and Z-axis directions. An elastic cover is movably fitted outside the drill shaft. The bottom of the elastic cover is provided with a hollow sealing ring, and the interior of the elastic cover is provided with a first air passage. A buffer mechanism, connected between the frame and the elastic shield, is used to provide buffering for the elastic shield; An upper suction pipe is connected to the first air passage and is used to suck up dust in the area covered by the elastic cover during the drilling process. An air supply pipe, with its outlet facing the drill tip of the drill shaft, is used to blow gas into the drilled hole. And a displacement detection unit, used to detect the displacement of the drill shaft in the Z-axis direction; The device has a first operating mode and a second operating mode: In the first working mode, the drill spindle does not drill through the PCB board, the upper air extraction pipe draws air, and the elastic cover is deformed by pressure and compresses the buffer mechanism. In the second working mode, when the displacement detection unit detects that the displacement of the drill shaft reaches a preset value, the drill shaft stops rotating, and the air supply pipe blows gas into the drilled hole.

[0006] Preferably, the elastic cover includes: The upper extension section connects to the buffer mechanism; And the lower narrowing section, the upper section of the lower narrowing section is integrally formed with the upper expanding section, the lower section of the lower narrowing section first bends towards the drill shaft and then extends away from the drill shaft, and the hollow sealing ring is set at the bottom of the lower narrowing section.

[0007] Preferably, the middle section of the lower narrowing section is configured such that when the drill shaft moves downward to drill through the PCB board, the middle section of the lower narrowing section can be squeezed and adhered to the circumferential surface of the upper part of the drill shaft, so that the part below the middle section of the lower narrowing section forms a closed small cover.

[0008] Preferably, the buffer mechanism includes: The cylinder barrel is connected to the frame; The piston is slidably connected inside the cylinder. A spring, with its two ends connected to the inner top surface of the cylinder and the upper surface of the piston, respectively; The rod shaft has its top end connected to the lower surface of the piston and its bottom end extending out of the bottom of the cylinder and connected to the elastic cover. The rod shaft has a second air passage, one end of which communicates with the first air passage of the elastic cover, and the other end of which communicates with the cylinder chamber below the piston.

[0009] Preferably, in the first working mode, the elastic cover is compressed downwards, and the gas in the hollow sealing ring enters the cylinder chamber below the piston through the first air passage and the second air passage, pushing the piston upwards and compressing the spring to reduce the contact pressure of the hollow sealing ring on the upper surface of the PCB board.

[0010] Preferably, the upper suction pipe is located in the upper section of the upper expansion section and the lower narrowing section of the elastic cover, and the air supply pipe is located in the lower section of the lower narrowing section, with the air outlet of the air supply pipe aligned with the drilled hole in the second working mode.

[0011] Preferably, the Y-axis drive module is driven and connected to the positioning seat to drive the positioning seat to move along the Y-axis direction. The positioning seat is provided with a lower air extraction pipe, which is connected to the positioning seat and is used to synchronously extract air with the air supply pipe in the second working mode.

[0012] Preferably, the positioning seat is provided with multiple positioning grooves that run through the X-axis direction, and rubber strips are connected between the positioning grooves. The rubber strips support the PCB board on the one hand, and form a seal for the upper area between adjacent positioning grooves on the other hand.

[0013] Preferably, the lower suction pipe is connected to the positioning groove. In the second working mode, the air supply pipe delivers air to the drilled hole, and the lower suction pipe draws air synchronously through the positioning groove to form a negative pressure suction path under the PCB board.

[0014] Preferably, the displacement detection unit is a displacement sensor installed on the Z-axis drive mechanism that drives the drilling mechanism to move along the Z-axis, and the preset value is set according to the thickness of the PCB board to be processed.

[0015] Compared with the prior art, the beneficial effects of the present invention are: The XZ-axis drive module and Y-axis drive module work together to achieve precise alignment between the drilling mechanism and the positioning seat, ensuring that the drill spindle is accurately aligned with the drilling position. In the first working mode, the exhaust pipe utilizes the semi-enclosed space formed by the elastic cover on the surface of the PCB board to efficiently capture dust that flies upwards before drilling, preventing dust from contaminating the hole wall surface and forming a drilling smudge layer that affects subsequent copper plating. The elastic cover is compressed and buffered by a mechanism to avoid hard pressure damage to the surface of the PCB board. In the second working mode, the displacement detection unit accurately identifies the drilling moment, and the air supply pipe blows air into the hole, blowing away the dust that has entered the hole downwards, preventing dust from clogging the hole or adhering to the hole wall, thereby ensuring sufficient wetting of the solution and continuous growth of the plating layer in the subsequent hole metallization process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the PCB board processing equipment with dust removal function proposed in this invention; Figure 2 This is a front view of the PCB board processing equipment with dust removal function proposed in this invention; Figure 3 for Figure 2 Sectional view along line AA in the middle; Figure 4This is a schematic diagram of the elastic cover in the PCB board processing equipment with dust removal function proposed in this invention; Figure 5 This is a diagram showing the state of the PCB board processing equipment with dust removal function proposed in this invention when the drill spindle has not penetrated the PCB board. Figure 6 for Figure 5 Enlarged view of the structure at point A in the image; Figure 7 This is a diagram showing the state of the drill spindle drilling through the PCB board in the PCB board processing equipment with dust removal function proposed in this invention. Figure 8 for Figure 7 Enlarged view of the structure at point B in the image.

[0017] In the diagram: 1. Body; 11. Drilling mechanism; 111. Motor; 112. Frame; 113. Drill spindle; 12. Positioning seat; 13. XZ axis drive module; 14. Y axis drive module; 2. Elastic cover; 21. Upper expansion section; 22. Lower narrowing section; 23. Hollow sealing ring; 3. Buffer mechanism; 31. Cylinder; 32. Spring; 33. Piston; 34. Rod shaft; 4. Upper suction pipe; 5. Air supply pipe; 6. Lower suction pipe; 7. Rubber strip; 100. PCB board. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0020] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature.

[0021] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 This invention provides a PCB board processing equipment with dust removal function, comprising: Body 1; The XZ axis drive module 13 is mounted on the body 1; Y-axis drive module 14 is disposed on the body 1; The positioning seat 12 is connected to the Y-axis drive module 14 and is used to support the PCB board 100. A drilling mechanism 11 is connected to the XZ axis drive module 13. The drilling mechanism 11 includes a frame 112, a motor 111 mounted on the frame 112, and a drill spindle 113 driven by the motor 111. The XZ axis drive module 13 is used to drive the drill spindle 113 to move along the X-axis and Z-axis directions. The elastic cover 2 is movably sleeved on the outside of the drill shaft 113. The bottom of the elastic cover 2 is provided with a hollow sealing ring 23, and the inside of the elastic cover 2 is provided with a first air passage. A buffer mechanism 3 is connected between the frame 112 and the elastic cover 2, and is used to provide buffering for the elastic cover 2; The upper suction pipe 4 is connected to the first air passage and is used to suck up dust in the area covered by the elastic cover 2 during the drilling process. The air supply pipe 5 has its air outlet facing the drill tip of the drill shaft 113 and is used to blow gas into the drilled hole. And a displacement detection unit, used to detect the displacement of the drill shaft 113 in the Z-axis direction; The device has a first operating mode and a second operating mode: In the first working mode, the drill shaft 113 does not drill through the PCB board 100, the upper air extraction pipe 4 draws air, and the elastic cover 2 is deformed by pressure and compresses the buffer mechanism 3. In the second working mode, when the displacement detection unit detects that the displacement of the drill shaft 113 has reached a preset value, the drill shaft 113 stops rotating, and the air supply pipe 5 blows gas into the drilled hole.

[0022] Specifically, the XZ-axis drive module 13 includes an X-axis drive mechanism and a Z-axis drive mechanism mounted on the slider of the X-axis drive mechanism, used to drive the drilling mechanism 11 to move along the X and Z axes. The Y-axis drive module 14 is used to drive the positioning seat 12 to move along the Y-axis, realizing the relative positioning between the drilling mechanism 11 and the positioning seat 12. The drilling mechanism 11 includes a frame 112, a motor 111 mounted on the frame 112, and a drill spindle 113 driven and connected to the motor 111. The frame 112 is fixedly connected to the slider of the Z-axis drive mechanism of the XZ-axis drive module 13, and the drill spindle 113 is driven by the motor 111 to rotate at high speed to perform the drilling action. An elastic cover 2 is movably sleeved on the outside of the drill spindle 113. A hollow sealing ring 23 is provided at the bottom of the elastic cover 2, and a first air passage is opened inside the cover wall. A buffer mechanism 3 is connected between the frame 112 and the elastic cover 2. The upper air extraction pipe 4 is connected to the first air passage, and the air outlet of the air supply pipe 5 faces the drill tip direction of the drill spindle 113. The equipment is also equipped with a displacement detection unit for detecting the displacement of the drill spindle 113 in the Z-axis direction. In the first working mode, the drill spindle 113 does not drill through the PCB board 100, and only the upper air extraction pipe 4 draws air, while the elastic cover 2 is deformed under pressure and compresses the buffer mechanism 3; in the second working mode, when the displacement detection unit detects that the displacement reaches the preset value, the drill spindle 113 stops rotating, and the air supply pipe 5 delivers air into the drilled hole.

[0023] In this optional embodiment, the precise alignment between the drilling mechanism 11 and the positioning seat 12 is achieved through the cooperation of the XZ axis drive module 13 and the Y axis drive module 14, ensuring that the drill spindle 113 is accurately aligned with the drilling position to be processed. In the first working mode, the exhaust pipe 4 utilizes the semi-enclosed space formed by the elastic cover 2 on the upper surface of the PCB board 100 to efficiently capture the dust that flies upward before drilling, preventing dust from contaminating the hole wall surface and forming a drilling smudge layer that affects subsequent copper plating. After the elastic cover 2 is pressed, the compression buffer mechanism 3 is used to avoid hard pressure damage to the upper surface of the PCB board 100. In the second working mode, the displacement detection unit accurately identifies the drilling moment, and the air supply pipe 5 blows air into the hole, blowing away the dust that has entered the hole downward, preventing dust from clogging the hole or adhering to the hole wall, thereby ensuring sufficient wetting of the solution and continuous growth of the plating layer in the subsequent hole metallization process.

[0024] Furthermore, the elastic shield 2 includes: The upper extension section 21 is connected to the buffer mechanism 3; And the lower narrowing section 22, the upper section of the lower narrowing section 22 is integrally formed with the upper expanding section 21, the lower section of the lower narrowing section 22 first bends towards the drill shaft 113 and then extends away from the drill shaft 113, and the hollow sealing ring 23 is set at the bottom of the lower narrowing section 22.

[0025] Specifically, the upper end of the expanding section 21 is connected to the buffer mechanism 3, and the whole is in the shape of a trumpet that gradually expands from top to bottom. The upper section of the narrowing section 22 is integrally formed with the lower end of the expanding section 21. The lower section of the narrowing section 22 first bends towards the drill shaft 113, and then extends outward in a direction away from the drill shaft 113. The hollow sealing ring 23 is fixedly installed on the bottom edge of the narrowing section 22. The elastic cover 2 is integrally injection molded from an elastic polymer material.

[0026] In this optional embodiment, the flared structure of the upper expansion section 21 provides ample internal space, preventing interference between the drill shaft 113 and the elastic cover 2 when it descends. The lower narrowing section 22, with its inward bending and outward extension, exhibits an "inward contraction" deformation tendency when the elastic cover 2 is compressed, causing the hollow sealing ring 23 to move closer to the drill shaft 113, enhancing the sealing effect and preventing dust from escaping upward from the gap between the drill shaft 113 and the elastic cover 2 and contaminating the processing environment.

[0027] Optionally, the middle section of the lower narrowing section 22 is configured such that when the drill spindle 113 moves downward to drill through the PCB board 100, the middle section of the lower narrowing section 22 can be squeezed and adhered to the circumferential surface of the upper part of the drill spindle 113, so that the part below the middle section of the lower narrowing section 22 forms a closed small cover.

[0028] Specifically, when the drill spindle 113 moves downward to drill through the PCB board 100, the inner wall of the middle section of the lower narrowing section 22 can be squeezed and adhered to the circumferential surface of the upper part of the drill spindle 113, so that the cover part below the middle section of the lower narrowing section 22 and the drill spindle 113 form a relatively closed annular small cover, and the lower end of the small cover is sealed to the upper surface of the PCB board 100 by the hollow sealing ring 23.

[0029] In this optional embodiment, the middle section of the lower narrowing section 22 fits against the upper part of the drill shaft 113 to form a closed guide cavity, which restricts the gas blown out by the air supply pipe 5 to the inside of the small cover, preventing it from spreading outward or escaping upward. Instead, the gas is concentrated and enters the hole through the gap between the drill shaft 113 and the hole wall and the spiral groove channel, which significantly improves the utilization efficiency of the air supply, effectively removes the dust attached to the hole wall, and avoids the formation of a contamination layer on the hole wall that hinders the wetting of the electroplating solution.

[0030] Furthermore, the buffer mechanism 3 includes: Cylinder 31 is connected to frame 112; Piston 33 is slidably connected inside cylinder 31; Spring 32 is connected at both ends to the inner top surface of cylinder 31 and the upper surface of piston 33, respectively. And a rod shaft 34, the top end of which is connected to the lower surface of the piston 33, and the bottom end of which extends out of the bottom of the cylinder 31 and is connected to the elastic cover 2; a second air passage is provided inside the rod shaft 34, one end of which is connected to the first air passage of the elastic cover 2, and the other end of which is connected to the cylinder 31 chamber below the piston 33.

[0031] Specifically, the top of cylinder 31 is fixedly connected to frame 112, keeping cylinder 31 stationary and preventing displacement when drill shaft 113 rotates. Cylinder 31 has a cylindrical hollow structure with an opening at the bottom. Piston 33 is slidably sealed inside cylinder 31, dividing the inner cavity of cylinder 31 into a first chamber above piston 33 and a second chamber below piston 33. Spring 32 is connected between the inner top surface of cylinder 31 and the upper surface of piston 33, and is always in a pre-compressed state. The top of rod shaft 34 is fixedly connected to the lower surface of piston 33, and the bottom end protrudes from the bottom opening of cylinder 31 and is fixedly connected to the top of the upper expansion section 21 of elastic cover 2. A seal is provided between rod shaft 34 and the bottom opening of cylinder 31. A second air passage is axially formed inside rod shaft 34, one end of which communicates with the first air passage of elastic cover 2, and the other end communicates with the cylinder 31 chamber below piston 33.

[0032] In this optional embodiment, the top of the cylinder 31 is fixedly connected to the frame 112, so that the cylinder 31 remains stationary throughout the drilling process, while the rod shaft 34 and the elastic cover 2 move up and down with the feed motion of the drill shaft 113. This relative motion allows the buffer mechanism 3 to stably perform its buffering function. When the elastic cover 2 is subjected to a reaction force, it pushes the piston 33 upward through the rod shaft 34 and compresses the spring 32. The elastic deformation of the spring 32 absorbs the impact force, preventing the hollow sealing ring 23 from pressing the upper surface of the PCB board 100 with excessive pressure, thus avoiding damage to the circuitry on the board surface. At the same time, the gas inside the hollow sealing ring 23 enters the cylinder 31 chamber below the piston 33 through the first air passage and the second air passage. The increased air pressure forms a pneumatic buffer, which, together with the spring 32, constitutes a composite buffering mechanism, making the force more uniform and stable, and ensuring that the hollow sealing ring 23 always maintains an appropriate contact force with the board surface.

[0033] Optionally, in the first working mode, the elastic cover 2 is compressed downwards, and the gas in the hollow sealing ring 23 enters the cylinder 31 chamber below the piston 33 through the first air passage and the second air passage, pushing the piston 33 upwards and compressing the spring 32, so as to reduce the contact pressure of the hollow sealing ring 23 on the upper surface of the PCB board 100.

[0034] Specifically, in the first working mode, when the elastic cover 2 is compressed, the internal volume of the hollow sealing ring 23 decreases and the gas pressure increases. The gas enters the cylinder 31 chamber below the piston 33 through the first air passage and the second air passage, pushing the piston 33 to move upward and compressing the spring 32. The gas inside the hollow sealing ring 23 is partially discharged, its internal gas pressure decreases, and the radial expansion force decreases.

[0035] In this optional embodiment, by transferring the gas inside the hollow sealing ring 23 to the lower chamber of the piston 33, the compression stroke of the elastic cover 2 is converted into the upward stroke of the piston 33, so that the contact pressure of the hollow sealing ring 23 on the upper surface of the PCB board 100 is limited to below a safe threshold and will not increase indefinitely as the drill spindle 113 continues to drill down, thus avoiding irreversible damage such as the conductive lines being crushed and the solder mask being cracked, and ensuring the manufacturing yield of the printed circuit board.

[0036] Furthermore, the upper suction pipe 4 is located in the upper section of the upper expansion section 21 and the lower narrowing section 22 of the elastic cover 2, and the air supply pipe 5 is located in the lower section of the lower narrowing section 22. In the second working mode, the air outlet of the air supply pipe 5 is aligned with the drilled hole.

[0037] Specifically, the upper suction pipe 4 is located in the upper section of the upper expansion section 21 and the lower narrowing section 22, and multiple pipe openings can be evenly distributed circumferentially. The air supply pipe 5 is located in the lower section of the lower narrowing section 22, and its central axis points towards the drill tip of the drill shaft 113. The upper suction pipe 4 and the air supply pipe 5 are each independently connected to an external air source or negative pressure source and are independently controlled by valves.

[0038] In this optional embodiment, the upper suction pipe 4 is located in the upper region of the elastic cover 2, forming an upward airflow path before drilling, capturing upward-scattering dust. The air supply pipe 5 is located in the lower region of the elastic cover 2, adjacent to the drill tip, reaching the hole location via the shortest path in the second mode, avoiding gas pressure attenuation and directional deviation. The flow paths of the two modes do not interfere with each other, ensuring their respective dust removal effects and ensuring that the hole wall is cleaned promptly after drilling.

[0039] Optionally, the Y-axis drive module 14 is driven to the positioning seat 12 and is used to drive the positioning seat 12 to move along the Y-axis. The positioning seat 12 is provided with a lower air extraction pipe 6, which is connected to the positioning seat 12 and is used to synchronously extract air with the air supply pipe 5 in the second working mode.

[0040] Specifically, the Y-axis drive module 14 is driven to move along the Y-axis, thereby adjusting the position of the PCB board 100 in the Y-axis direction. The positioning seat 12 is located below the drilling mechanism 11 and is used to support the PCB board 100. The lower exhaust pipe 6 is connected to the positioning seat 12 and starts exhausting synchronously with the air supply pipe 5 in the second working mode.

[0041] In this optional embodiment, the Y-axis drive module 14 drives the positioning seat 12 to move along the Y-axis, which cooperates with the XZ-axis drive module 13 to drive the drilling mechanism 11 to move along the X and Z axes, thereby achieving precise positioning of the drilling mechanism 11 and the positioning seat 12 in three-dimensional space to meet the drilling requirements at different positions on the PCB board 100. In the second working mode, the air supply pipe 5 blows gas from above to push the dust downwards, and the lower air extraction pipe 6 creates a negative pressure environment below the PCB board 100, so that the blown dust is immediately sucked in and discharged after leaving the hole, forming a coordinated "blowing from above and extraction from below" linkage. The dust is quickly removed from the inside of the hole, avoiding secondary accumulation or re-adsorption on the lower surface of the PCB board 100, ensuring the cleanliness of both sides of the printed circuit board, and providing clean board surface conditions for subsequent lamination, exposure or electroplating processes.

[0042] Furthermore, the positioning seat 12 is provided with multiple positioning grooves that run through the X-axis direction, and rubber strips 7 are connected between the positioning grooves. The rubber strips 7 support the PCB board 100 on the one hand, and seal the upper area between adjacent positioning grooves on the other hand.

[0043] Specifically, the positioning base 12 is provided with multiple positioning grooves that run through the X-axis. A rubber strip 7 is fixedly connected between adjacent positioning grooves, and the upper surface of the rubber strip 7 is slightly higher than the surface of the positioning base 12. The PCB board 100 is placed on the rubber strip 7, supported by the rubber strip 7, and the area between the upper opening of the positioning groove and the lower surface of the PCB board 100 is sealed by the rubber strip 7, while the two ends of the positioning groove remain open.

[0044] In this optional embodiment, the rubber strip 7 serves as a flexible support layer to adapt to the slight warping of the PCB board 100 and prevent local depression deformation during drilling, which would affect the drilling position accuracy. On the other hand, it forms a sealing strip with the lower surface of the PCB board 100, making the positioning groove a relatively closed negative pressure cavity, preventing the negative pressure from leaking from above the positioning groove when the lower exhaust pipe 6 is drawing air, improving the exhaust efficiency and preventing dust from spreading to other areas of the lower surface of the PCB board 100.

[0045] Optionally, the lower suction pipe 6 is connected to the positioning groove. In the second working mode, the air supply pipe 5 supplies air to the drilled hole, and the lower suction pipe 6 simultaneously draws air through the positioning groove to form a negative pressure suction path below the PCB board 100.

[0046] Specifically, in the second working mode, the air supply pipe 5 delivers air from top to bottom into the drilled hole, blowing the dust downwards into the gap between the lower surface of the PCB board 100 and the positioning seat 12. The lower exhaust pipe 6 simultaneously draws air through the positioning groove, creating a negative pressure inside the positioning groove, drawing the dust into the positioning groove and discharging it through the lower exhaust pipe 6, forming a through airflow path from top to bottom.

[0047] In this optional embodiment, the air supply pipe 5 provides a positive blowing force to push the dust out of the hole, while the lower suction pipe 6 provides a negative suction force to immediately suck away the pushed-out dust. The two form a vertical airflow relay. The dust is subjected to a continuous driving force in the same direction, forming a unidirectional transport path from the inside of the hole to the positioning groove, without backflow or stagnation, achieving thorough removal of dust from the hole and avoiding dust residue affecting the continuity and adhesion of the coating in the subsequent hole metallization process.

[0048] Furthermore, the displacement detection unit is a displacement sensor installed on the Z-axis drive mechanism that drives the drilling mechanism 11 to move along the Z-axis, and the preset value is set according to the thickness of the PCB board 100 to be processed.

[0049] Specifically, the displacement detection unit is a displacement sensor mounted on the slider of the Z-axis drive mechanism, using an optical or magnetic ruler, with its signal output connected to the control system. Before processing, the operator inputs the thickness value of the PCB board 100 into the control system, which calculates the corresponding preset displacement value. During drilling, when the real-time detection value of the displacement sensor reaches the preset value, the control system determines that the drill spindle 113 has drilled through the PCB board 100, sends a control signal to stop the drill spindle 113 and switches to the second working mode to start the air supply pipe 5.

[0050] In this optional embodiment, the displacement sensor directly measures the displacement of the Z-axis slider. The device can quickly adapt to different thickness plates by pre-setting the displacement value according to the thickness. The detection ensures that the triggering time of the second mode is accurate. If the triggering is too early, the gas cannot enter the unpenetrated hole. If the triggering is too late, the dust has already adhered and deposited. This achieves a seamless connection of "stopping after drilling and supplying air immediately after stopping", compressing the residence time of dust in the hole and ensuring the cleanliness of the hole wall to the greatest extent, so as to provide a good hole wall condition for the subsequent hole metallization process.

[0051] While the present invention has been disclosed above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the scope of protection of the present invention.

Claims

1. A PCB board processing equipment with dust removal function, characterized in that, include: Body (1); The XZ axis drive module (13) is mounted on the body (1); The Y-axis drive module (14) is mounted on the body (1); The positioning seat (12) is connected to the Y-axis drive module (14) and is used to support the PCB board (100); A drilling mechanism (11) is connected to the XZ axis drive module (13). The drilling mechanism (11) includes a frame (112), a motor (111) mounted on the frame (112), and a drill spindle (113) driven by the motor (111). The XZ axis drive module (13) is used to drive the drill spindle (113) to move along the X-axis and Z-axis directions. An elastic cover (2) is movably sleeved on the outside of the drill shaft (113). The bottom of the elastic cover (2) is provided with a hollow sealing ring (23), and the inside of the elastic cover (2) is provided with a first air passage. A buffer mechanism (3) is connected between the frame (112) and the elastic cover (2) to provide buffering for the elastic cover (2); The upper suction pipe (4) is connected to the first air passage and is used to suck up the dust in the area covered by the elastic cover (2) during the drilling process. The air supply pipe (5) has its air outlet facing the drill tip of the drill shaft (113) and is used to blow gas into the drilled hole. And a displacement detection unit, used to detect the displacement of the drill shaft (113) in the Z-axis direction; The device has a first operating mode and a second operating mode: In the first working mode, the drill shaft (113) does not drill through the PCB board (100), the upper air extraction pipe (4) draws air, and the elastic cover (2) is deformed by pressure and compresses the buffer mechanism (3). In the second working mode, when the displacement detection unit detects that the displacement of the drill shaft (113) reaches a preset value, the drill shaft (113) stops rotating, and the air supply pipe (5) blows gas into the drilled hole.

2. The PCB board processing equipment with dust removal function according to claim 1, characterized in that, The elastic shield (2) includes: The upper extension section (21) is connected to the buffer mechanism (3); And a lower narrowing section (22), the upper section of which is integrally formed with the upper expanding section (21), the lower section of which first bends toward the drill shaft (113) and then extends away from the drill shaft (113), and the hollow sealing ring (23) is disposed at the bottom of the lower narrowing section (22).

3. The PCB board processing equipment with dust removal function according to claim 2, characterized in that, The middle section of the lower narrowing section (22) is configured such that when the drill spindle (113) moves downward to drill through the PCB board (100), the middle section of the lower narrowing section (22) can be squeezed and adhered to the circumferential surface of the upper part of the drill spindle (113), so that the part below the middle section of the lower narrowing section (22) forms a closed small cover.

4. The PCB board processing equipment with dust removal function according to claim 3, characterized in that, The buffer mechanism (3) includes: The cylinder (31) is connected to the frame (112); Piston (33) is slidably connected inside cylinder (31); The spring (32) is connected at both ends to the inner top surface of the cylinder (31) and the upper surface of the piston (33); And a rod shaft (34), the top end of which is connected to the lower surface of the piston (33), and the bottom end of which extends out of the bottom of the cylinder (31) and is connected to the elastic cover (2); a second air passage is provided inside the rod shaft (34), one end of the second air passage is connected to the first air passage of the elastic cover (2), and the other end of the second air passage is connected to the cylinder (31) chamber below the piston (33).

5. The PCB board processing equipment with dust removal function according to claim 4, characterized in that, In the first working mode, the elastic cover (2) is compressed downwards, and the gas in the hollow sealing ring (23) enters the cylinder (31) chamber below the piston (33) through the first air passage and the second air passage, pushing the piston (33) upwards and compressing the spring (32) to reduce the contact pressure of the hollow sealing ring (23) on the upper surface of the PCB board (100).

6. The PCB board processing equipment with dust removal function according to claim 5, characterized in that, The upper suction pipe (4) is located on the upper section of the upper expansion section (21) and the lower narrowing section (22) of the elastic cover (2), and the air supply pipe (5) is located on the lower section of the lower narrowing section (22). The air outlet of the air supply pipe (5) is aligned with the drilled hole in the second working mode.

7. The PCB board processing equipment with dust removal function according to claim 6, characterized in that, The Y-axis drive module (14) is driven to connect with the positioning seat (12) and is used to drive the positioning seat (12) to move along the Y-axis. The positioning seat (12) is provided with a lower air extraction pipe (6), which is connected to the positioning seat (12) and is used to draw air synchronously with the air supply pipe (5) in the second working mode.

8. The PCB board processing equipment with dust removal function according to claim 7, characterized in that, The positioning seat (12) is provided with a plurality of positioning grooves that run through the X-axis. A rubber strip (7) is connected between the positioning grooves. The rubber strip (7) supports the PCB board (100) on the one hand and seals the upper area between adjacent positioning grooves on the other hand.

9. The PCB board processing equipment with dust removal function according to claim 8, characterized in that, The lower suction pipe (6) is connected to the positioning groove. In the second working mode, the air supply pipe (5) supplies air to the drilled hole, and the lower suction pipe (6) simultaneously draws air through the positioning groove to form a negative pressure suction path below the PCB board (100).

10. The PCB board processing equipment with dust removal function according to claim 9, characterized in that, The displacement detection unit is a displacement sensor installed on the Z-axis drive mechanism that drives the drilling mechanism (11) to move along the Z-axis. The preset value is set according to the thickness of the PCB board (100) to be processed.

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