A method for single-sided and double-sided die cutting and etching circuitry of copper electroplated on aluminum foil

Abstract

The application discloses a kind of aluminium foil copper electroplating single-sided and double-sided die cutting and etching circuit set position method, comprising the following steps, S1: preparation material;S2: silk screen circuit;S3: copper aluminium foil etching and membrane stripping, comprising the following steps: S3.1 etching copper foil, the roll material of silk screen complete circuit is to etching line, first cylinder is added copper foil etching solution and is etched, and plate material is evenly passed through etching machine and selectively etched copper foil on the surface of aluminium foil;S3.2 clean the plate material after etching;S3.3 etching aluminium foil, the plate material of etching complete copper foil is to second cylinder is added aluminium foil etching solution and is etched, and plate material is evenly passed through etching machine and selectively etched aluminium foil, and leak out circuit layer;S3.4 clean the plate material after etching;S3.5 circuit board pressing;S4: AOI appearance detection.The application uses aluminium foil copper electroplating material through etching line, etching copper first, etching aluminium again, and is manufactured into aluminium foil copper electroplating material flexible circuit board, reduces material cost, improves economy.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, specifically to a method for single and double-sided die-cutting and etching of circuit patterns using aluminum foil electroplated with copper. Background Technology

[0002] Currently, LED light strips generally use LED chips assembled on strip-shaped FPCs (flexible printed circuit boards) or LED lead boards. However, existing LED flexible printed circuit boards are all etched with pure copper, and the substrate material is a single pure copper. Since pure copper has better corrosion resistance than pure aluminum, the etching requirements are lower, but the material cost is high. Therefore, to avoid the shortcomings of the existing technology, it is necessary to improve the existing technology. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings and deficiencies of the prior art and to provide a method for single and double-sided die-cutting and etching of copper-plated aluminum foil for circuit positioning.

[0004] This invention is achieved through the following technical solution:

[0005] A method for single- and double-sided die-cutting and etching of copper-plated aluminum foil for circuit positioning includes the following steps:

[0006] S1: Prepare materials and hoist the aluminum foil electroplated copper composite substrate onto the screen printing machine;

[0007] S2: Screen printing lines, uniform speed squeegee printing, accurately covering the line areas that need to be retained, exposing the copper and aluminum foil to be etched, and removing the plate immediately after printing to avoid ink streaking and rough edges of lines;

[0008] S3: Copper and aluminum foil etching and stripping;

[0009] S3.1: Etching copper foil. The roll of material with the screen-printed circuit is fed to the etching line. Copper foil etching solution is added to the first cylinder for etching. The board passes through the etching machine at a uniform speed to selectively etch away the copper foil on the surface of the aluminum foil.

[0010] S3.2: Clean the etched substrate;

[0011] S3.3: Etching aluminum foil. The board after etching copper foil is placed in the second tank and aluminum foil etching solution is added for etching. The board passes through the etching machine at a uniform speed to selectively etch away the aluminum foil, exposing the circuit layer. Then the film is removed and proceeded to the next process.

[0012] S3.4: Clean the etched substrate;

[0013] S3.5: Circuit board lamination;

[0014] S4: AOI visual inspection, checking for open and short circuits, and whether the wire width and spacing exceed the standard.

[0015] Furthermore, in step S3.1, the etching temperature is controlled between 35°C and 40°C.

[0016] Furthermore, in step S3.1, the copper foil etching solution comprises, by mass percentage, 0.62%–0.82% sulfuric acid, 0.035%–0.055% urea, 0.2%–0.4% hydrogen peroxide, 0.0005%–0.0007% stabilizer and pure water.

[0017] Furthermore, in S3.3, the aluminum foil etching solution comprises, by mass percentage, 60%–70% industrial hydrochloric acid with a concentration of 31% and 30%–40% pure water.

[0018] Furthermore, in step S3.3, etching can only be performed at a working temperature of 40°C, and the temperature after the process cannot exceed 58°C.

[0019] Furthermore, in S3.5, when manufacturing a double-sided circuit board, the front circuit is first cut out to form conductive positions using a blind hole mold, and the back circuit is cut out using a circular die. Then, the etched aluminum foil electroplated copper front circuit and the back circuit are combined by a circular die cutting machine to form a double-sided circuit board. After the client applies solder paste, double-sided conductivity can be achieved.

[0020] Furthermore, it also includes S5: screen printing solder resist and baking. After the circuit etching is completed, a layer of solder resist ink is printed on the surface of the circuit to provide insulation protection, prevent oxidation of aluminum foil and copper foil, avoid LED soldering short circuits, resist moisture, and improve the appearance of the finished product.

[0021] Furthermore, it also includes S6: anti-oxidation treatment, which generates an organic protective film on the surface of the bare copper circuit, isolating it from air and preventing the aluminum foil and copper foil from oxidizing and discoloring, while not affecting the subsequent LED solder paste soldering, ensuring solderability.

[0022] Furthermore, it also includes S7: shape cutting and slitting, which cuts the roll material into strips using a die-cutting circular knife machine. While ensuring that the circuit is not damaged, the cutting should be centered as much as possible to prevent damage to aluminum or copper and leakage. After cutting, connection points are formed, which makes it convenient for customers to separate the finished products into individual strips after attaching components.

[0023] Furthermore, it also includes S8: split-roll packaging and shipping, splitting the rolls into the required length of meters according to requirements, wrapping them with protective film, packing them into boxes, and affixing product labels to the outer boxes.

[0024] Compared to existing technologies, this invention uses aluminum foil electroplated copper material through an etching line, adjusting the chemical ratio to first etch copper, then etch aluminum, and finally cover with a solder resist protective layer to manufacture a flexible circuit board made of aluminum foil electroplated copper material. This reduces material costs, improves economic efficiency, and adapts to the current market environment. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a single-sided circuit board produced by the aluminum foil electroplating copper single and double-sided die-cutting and etching circuit positioning method of the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of a double-sided circuit board produced by the method of single and double-sided die-cutting and etching of copper-plated aluminum foil according to the present invention.

[0028] In the diagram: 1-Substrate insulation layer; 2-Adhesive layer; 3-Aluminum foil layer; 4-Copper foil layer; 5-Etching ink protective layer; 6-Solder resist protective layer; 7-First adhesive layer on the back; 8-Copper foil layer or copper-aluminum foil layer on the back; 9-Second adhesive layer on the back; 10-Substrate insulation layer on the back. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] A method for single- and double-sided die-cutting and etching of copper-plated aluminum foil for circuit positioning includes the following steps:

[0031] S1: Prepare materials and hoist the aluminum foil electroplated copper composite substrate onto the screen printing machine;

[0032] S2: Screen printing lines, uniform speed squeegee printing, accurately covering the line areas that need to be retained, exposing the copper and aluminum foil to be etched, and removing the plate immediately after printing to avoid ink streaking and rough edges of lines;

[0033] S3: Copper and aluminum foil etching and stripping;

[0034] S3.1: Etching copper foil. The roll of material with the screen-printed circuit is fed to the etching line. Copper foil etching solution is added to the first cylinder for etching. The board passes through the etching machine at a uniform speed to selectively etch away the copper foil on the surface of the aluminum foil.

[0035] S3.2: Clean the etched substrate;

[0036] S3.3: Etching aluminum foil. The board after etching copper foil is placed in the second tank and aluminum foil etching solution is added for etching. The board passes through the etching machine at a uniform speed to selectively etch away the aluminum foil, exposing the circuit layer. Then the film is removed and proceeded to the next process.

[0037] S3.4: Clean the etched substrate;

[0038] S3.5: Circuit board lamination;

[0039] S4: AOI visual inspection, checking for open and short circuits, and whether the wire width and spacing exceed the standard.

[0040] In S2, the screen is an infinitely long concave roller screen printing screen, and the ink is a special acid-resistant etching screen printing ink. Ordinary solder resist oil cannot be used. It automatically aligns, accurately registers, and compensates for the cumulative tensile error of the roll material in real time.

[0041] In S3.1, the etching temperature is controlled between 35℃ and 40℃.

[0042] In S3.1, the copper foil etching solution comprises, by mass percentage, 0.62%–0.82% sulfuric acid, 0.035%–0.055% urea, 0.2%–0.4% hydrogen peroxide, 0.0005%–0.0007% stabilizer and pure water.

[0043] In S3.3, the aluminum foil etching solution comprises, by mass percentage, 60%–70% industrial hydrochloric acid at a concentration of 31% and 30%–40% pure water.

[0044] In S3.3, etching can only be performed at an operating temperature of 40°C, and the temperature after operation cannot exceed 58°C.

[0045] In S3.5, when manufacturing a double-sided circuit board, the front circuitry is first cut out for conductive positions using a blind hole mold, while the back circuitry is cut out using a rotary die. Then, the etched aluminum foil electroplated copper front and back circuitry are die-cut together using a rotary die-cutting machine to form the double-sided circuit board. After the client applies solder paste, double-sided conductivity is achieved. Edge correction and tension control complete the circuit pattern registration and printing. A dual photoelectric edge correction system is installed on the left and right sides, and the tension parameters for the front and rear sections are set to match the material rigidity, preventing stretching, wrinkling, and misalignment.

[0046] It also includes S5: screen printing solder resist and baking. After the circuit etching is completed, a layer of solder resist ink is printed on the surface of the circuit to provide insulation protection, prevent oxidation of aluminum foil and copper foil, avoid LED soldering short circuits, resist moisture, and improve the appearance of the finished product.

[0047] It also includes S6: anti-oxidation treatment, which generates an organic protective film on the surface of the bare copper circuit, isolating it from the air and preventing the aluminum foil and copper foil from oxidizing and discoloring. At the same time, it does not affect the subsequent LED solder paste soldering and ensures solderability.

[0048] It also includes S7: shape cutting and slitting, which cuts the roll material into strips using a die-cutting circular knife machine. While ensuring that the circuit is not damaged, the cutting should be centered as much as possible to prevent damage to aluminum or copper and leakage. After cutting, connection points are formed, which makes it convenient for customers to separate the finished products into individual strips after attaching components.

[0049] It also includes S8: split-roll packaging and shipping, splitting into the required length of meters according to requirements, wrapping with protective film, packing into boxes, and affixing product labels to the outer boxes.

[0050] I. Single-sided circuit board manufacturing process: Roll material → Silk screen printing → Etching and electroplating copper → Cleaning → Etching aluminum foil → Cleaning / removal of film → Drying → AOI visual inspection → Silk screen printing of solder resist → Baking → Anti-oxidation treatment → Shape cutting → Roll packaging and shipping.

[0051] II. Double-sided circuit board manufacturing process: Roll material → Silk screen printing → Etching and electroplating copper → Cleaning → Etching aluminum foil → Cleaning / removal → Drying → Die-cutting and assembly → AOI appearance inspection → Anti-oxidation treatment → Roll packaging and shipping.

[0052] Circuit boards made using aluminum foil electroplated copper etching have lower substrate costs, reducing overall costs by 30% compared to traditional pure copper boards.

[0053] like Figure 1 The diagram shows a structural schematic of a single-sided circuit board manufactured using the aluminum foil electroplating copper single and double-sided die-cutting and etching circuit positioning method of the present invention.

[0054] like Figure 2 The diagram shows a schematic of the structure of a double-sided circuit board manufactured using the aluminum foil electroplating copper single and double-sided die-cutting and etching circuit positioning method of the present invention.

[0055] Compared to existing technologies, this invention uses aluminum foil electroplated copper material through an etching line, adjusting the chemical ratio to first etch copper, then etch aluminum, and finally cover with a solder resist protective layer to manufacture a flexible circuit board made of aluminum foil electroplated copper material. This reduces material costs, improves economic efficiency, and adapts to the current market environment.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for single- and double-sided die-cutting and etching of copper-plated aluminum foil for circuit positioning, characterized in that: Includes the following steps, S1: Prepare materials and hoist the aluminum foil electroplated copper composite substrate onto the screen printing machine; S2: Screen printing lines, uniform speed squeegee printing, accurately covering the line areas that need to be retained, exposing the copper and aluminum foil to be etched, and removing the plate immediately after printing to avoid ink streaking and rough edges of lines; S3: Copper and aluminum foil etching and film removal; S3.1: Etching copper foil. The roll of material with the screen-printed circuit is fed to the etching line. Copper foil etching solution is added to the first cylinder for etching. The board passes through the etching machine at a uniform speed to selectively etch away the copper foil on the surface of the aluminum foil. S3.2: Clean the etched substrate; S3.3: Etching aluminum foil. The board after etching copper foil is placed in the second tank and aluminum foil etching solution is added for etching. The board passes through the etching machine at a uniform speed to selectively etch away the aluminum foil, exposing the circuit layer. Then the film is removed and proceeded to the next process. S3.4: Clean the etched substrate; S3.5: Circuit board lamination; S4: AOI visual inspection, checking for open and short circuits, and whether the wire width and spacing exceed the standard.

2. The method for single and double-sided die-cutting and etching of copper-plated aluminum foil and its circuit positioning according to claim 1, characterized in that: In step S3.1, the etching temperature is controlled between 35°C and 40°C.

3. The method for single and double-sided die-cutting and etching of copper-plated aluminum foil and its circuit positioning according to claim 1, characterized in that: In step S3.1, the copper foil etching solution comprises, by mass percentage, 0.62%–0.82% sulfuric acid, 0.035%–0.055% urea, 0.2%–0.4% hydrogen peroxide, 0.0005%–0.0007% stabilizer and pure water.

4. The method for single and double-sided die-cutting and etching of copper-plated aluminum foil and its circuit positioning according to claim 1, characterized in that: In S3.3, the aluminum foil etching solution comprises, by mass percentage, 60%–70% industrial hydrochloric acid with a concentration of 31% and 30%–40% pure water.

5. The method for single and double-sided die-cutting and etching of copper-plated aluminum foil and its circuit positioning according to claim 1, characterized in that: In S3.3, etching can only be performed at a working temperature of 40°C, and the temperature after the operation cannot exceed 58°C.

6. The method for single and double-sided die-cutting and etching of copper-plated aluminum foil and its circuit positioning according to claim 1, characterized in that: In S3.5, when manufacturing a double-sided circuit board, the front circuit is first cut out to form the conductive position through a blind hole mold, and the back circuit is cut out through a circular die. Then, the etched aluminum foil electroplated copper front circuit and the back circuit are combined by a circular die cutting machine to form a double-sided circuit board. After the client applies solder paste, double-sided conductivity can be achieved.

7. The method for single and double-sided die-cutting and etching of copper-plated aluminum foil and its circuit positioning according to claim 1, characterized in that: It also includes S5: screen printing solder resist and baking. After the circuit etching is completed, a layer of solder resist ink is printed on the surface of the circuit to provide insulation protection, prevent oxidation of aluminum foil and copper foil, avoid LED soldering short circuits, resist moisture, and improve the appearance of the finished product.

8. The method for single and double-sided die-cutting and etching of copper-plated aluminum foil and its circuit positioning according to claim 1, characterized in that: It also includes S6: anti-oxidation treatment, which generates an organic protective film on the surface of the bare copper circuit, isolating it from the air and preventing the aluminum foil and copper foil from oxidizing and discoloring. At the same time, it does not affect the subsequent LED solder paste soldering and ensures solderability.

9. The method for single and double-sided die-cutting and etching of copper-plated aluminum foil and its circuit positioning according to claim 1, characterized in that: It also includes S7: shape cutting and slitting, which cuts the roll material into strips using a die-cutting circular knife machine. While ensuring that the circuit is not damaged, the cutting should be centered as much as possible to prevent damage to aluminum or copper and leakage. After cutting, connection points are formed, which makes it convenient for customers to separate the finished products into individual strips after attaching components.

10. The method for single and double-sided die-cutting and etching of copper-plated aluminum foil and its circuit positioning according to claim 1, characterized in that: It also includes S8: split-roll packaging and shipping, splitting into the required length of meters according to requirements, wrapping with protective film, packing into boxes, and affixing product labels to the outer boxes.

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