A surface residue cleaning device for a circuit board processing based on a high-pressure jet

Abstract

The application relates to the field of circuit board cleaning processing, in particular to a surface residue cleaning device for circuit board processing based on high-pressure jet flow. The application describes a surface residue cleaning device for circuit board processing based on high-pressure jet flow, a conveyor drives a conveying support to perform inclined conveying work on a circuit board, the circuit board passes between a first nozzle and a second nozzle, a first nozzle downward sprays pressurized water flow on the upper surface of the circuit board, and a second nozzle upward sprays high-pressure water flow on the inner surface of a hole of the circuit board, bidirectional flushing is performed, so that high-pressure jet flow cleaning is realized on the inner surface of the hole of the circuit board under the premise of avoiding damage to the upper surface of the circuit board. The application overcomes the technical defects that the existing circuit board cleaning equipment is difficult to effectively remove the residues on the inner surface of the hole while avoiding damage to the upper surface of the circuit board caused by high-pressure water flow.

Description

Technical Field

[0001] This invention relates to the field of circuit board cleaning and processing, and in particular to a surface residue cleaning device for circuit board processing based on high-pressure jet. Background Technology

[0002] Drilling is a necessary step in PCB manufacturing. During drilling, the high-speed rotation of the drill bit generates significant heat due to friction with the substrate material. This causes the epoxy resin in the substrate to melt and adhere to the hole walls, forming what's known as epoxy resin drilling sludge. Simultaneously, dust, burrs, and fiberglass debris generated during drilling also remain inside the holes. If these residues are not thoroughly removed, they will severely affect the adhesion between the subsequent electroless copper plating layer and the hole wall substrate, leading to fatal defects such as plating voids, hole wall separation, and even the absence of copper within the hole. This directly impacts the electrical connection reliability and product yield of the PCB. When using conventional pressure water flow for cleaning, the limited water pressure makes it difficult to transfer sufficient kinetic energy to the depth of the drilled hole. This is especially problematic for PCBs with small hole diameters or large hole diameters due to board thickness; the water flow cannot effectively penetrate the hole to achieve effective scouring. Stubborn contaminants such as drill cuttings and resin residue remaining at the bottom of the borehole are difficult to remove completely. Conventional pressurized water jet cleaning methods have very limited effectiveness in removing residues from the inner surface of the borehole. While directly increasing the pressure of the jetting water to enhance cleaning ability can improve the cleaning capacity, and high-pressure water jets have stronger impact and penetrating power, allowing them to enter the borehole and remove residues to some extent, the direct spraying of large amounts of high-pressure water jets onto the surface of the circuit board can cause significant damage. The violent impact of high-pressure water jets can easily damage the circuit patterns on the surface of the circuit board, damage the solder mask layer, and even cause micro-cracks or delamination in the substrate material, seriously affecting the electrical performance and mechanical strength of the circuit board. Therefore, how to effectively remove residues from the inner surface of the borehole while avoiding damage to the surface of the circuit board from high-pressure water jets has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0003] In order to overcome the shortcomings of existing circuit board cleaning equipment that cannot effectively remove residues from the inner surface of drill holes while avoiding damage to the surface of the circuit board by high-pressure water jets, the present invention provides a surface residue cleaning device for circuit board processing based on high-pressure jets.

[0004] Technical Solution: A surface residue cleaning device for circuit board processing based on high-pressure jet, comprising a mounting frame, a first wastewater tank, a first outlet pipe, a first filter filling layer, a conveyor, a conveyor support, a crossbeam frame, a first infusion pipe, a first nozzle, a material identification sensor, a second infusion pipe, and a second nozzle; the conveyor is mounted on the mounting frame at an angle, with its conveying direction facing the upper left; the conveyor is equipped with several conveyor supports that drive the circuit board to move; a crossbeam frame is fixedly connected to the mounting frame; the crossbeam frame... A first infusion pipe is fixedly connected to the top; the first infusion pipe is connected to several first nozzles that apply pressure jet cleaning to the upper surface of the circuit board; a first wastewater tank is fixedly connected to the lower side of the mounting bracket; a first outlet pipe is connected to the first wastewater tank; a first filter filling layer is installed inside the first wastewater tank; a material identification sensor for identifying the circuit board is installed on the crossbeam frame; a second infusion pipe is installed inside the conveyor, and the second infusion pipe is located below the first infusion pipe; the second infusion pipe is connected to several second nozzles that apply high-pressure jet cleaning to the inner surface of the drilled holes in the circuit board.

[0005] Based on the above scheme, a more preferred option is that a first hanger is slidably connected to the crossbeam; a wiper is fixedly connected to the first hanger, and the wiper is located on the left side of the first infusion tube; a compression spring is fixedly connected between the first hanger and the crossbeam; and a baffle is fixedly connected to the first hanger.

[0006] Based on the above scheme, a more preferred option is that a second wastewater tank is fixedly connected inside the conveyor, and the second wastewater tank is located directly below the second infusion pipe; a second outlet pipe is connected to the second wastewater tank; and a second filter filling layer is provided inside the second wastewater tank.

[0007] More preferably, the second wastewater tank is slidably connected to two inclined baffles on the left and right, and the second infusion tube is located in the gap between the two inclined baffles; the second wastewater tank is equipped with an electric slider that drives the inclined baffles to move left and right.

[0008] Based on the above scheme, a more preferred option is to have a second hanger fixedly connected to the mounting bracket; the second hanger is equipped with several blowers that blow air downwards, and the blowers are located to the left of the squeegee.

[0009] More preferably, the conveyor is equipped with a suction cup with the suction port facing upwards and the suction cup is located directly below all the blowers.

[0010] More preferably, the suction port of the suction cup is equipped with a rubber frame strip.

[0011] Based on the above scheme, a more preferred option is that a washing roller is rotatably connected to the mounting frame, and the washing roller is located on the right side of the first infusion tube; a drive motor that drives the washing roller to rotate is installed on the mounting frame.

[0012] More preferably, the washing components of the washing roller are made of water-absorbing sponge material.

[0013] More preferably, a vibration motor is mounted on the mounting frame; the output end of the vibration motor is fixedly connected to a vibration transmission plate, which is attached to the surface of the washing roller.

[0014] This invention has the following advantages: The high-pressure jet-based surface residue cleaning device for circuit board processing describes a conveyor that drives a conveyor support to tilt and transport the circuit board between a first nozzle and a second nozzle. The first nozzle, pointing downwards, sprays pressurized water onto the surface of the circuit board, while the second nozzle, pointing upwards, sprays high-pressure water onto the inner surface of the drilled holes, providing bidirectional rinsing. This achieves high-pressure jet cleaning of the inner surface of the drilled holes without damaging the surface of the circuit board. Simultaneously, the second filter layer in the second wastewater tank performs simple filtration of excess high-pressure water, eliminating the need for external wastewater ultrafiltration equipment for deep filtration. This reduces the energy consumption of the wastewater ultrafiltration equipment and significantly improves the water reuse rate. While ensuring effective cleaning of the inner surface of the drilled holes, this invention achieves a balance between energy saving and high-efficiency production. This high-pressure jet-based surface residue cleaning device for circuit board processing overcomes the technical shortcomings of existing circuit board cleaning equipment, which struggles to effectively remove residues from the inner surface of drilled holes while avoiding damage to the surface of the circuit board from high-pressure water. Attached Figure Description

[0015] Figure 1 A perspective view illustrating the present invention; Figure 2 A perspective view of the conveyor for illustrating the present invention; Figure 3 A perspective view illustrating the second wastewater tank of the present invention; Figure 4 A perspective view illustrating the second infusion tube of the present invention; Figure 5 A perspective view of the beam frame for describing the present invention; Figure 6 A perspective view illustrating the first infusion tube of the present invention.

[0016] Reference numerals: 1-Mounting frame, 11-First wastewater tank, 12-First outlet pipe, 13-First filter filling layer, 2-Conveyor, 21-Conveyor support, 3-Crossbeam frame, 31-First infusion pipe, 32-First nozzle, 33-Material identification sensor, 34-First hanger, 35-Scraper strip, 36-Compression spring, 37-Water baffle, 41-Second infusion pipe, 42-Second nozzle, 43-Second wastewater tank, 44-Second outlet pipe, 45-Second filter filling layer, 46-Inclined baffle, 47-Electric slider, 5-Second hanger, 51-Blower, 61-Suction cup, 62-Rubber frame strip, 71-Washing roller, 72-Drive motor, 81-Vibration motor, 82-Vibration plate. Detailed Implementation

[0017] The present invention will now be described in detail with reference to the accompanying drawings.

[0018] Example 1: This example describes a surface residue cleaning device for circuit board processing based on high-pressure jetting, such as... Figures 1-6 As shown, the system includes a mounting frame 1, a first wastewater tank 11, a first outlet pipe 12, a first filter filling layer 13, a conveyor 2, a conveyor support 21, a crossbeam frame 3, a first infusion pipe 31, a first nozzle 32, a material identification sensor 33, a second infusion pipe 41, and a second nozzle 42. The conveyor 2 is mounted on the mounting frame 1 at an angle, with its conveying direction facing the upper left. Several conveyor supports 21 are provided on the conveyor 2. A crossbeam frame 3 is fixedly connected to the mounting frame 1. The first infusion pipe 31 is fixedly connected to the crossbeam frame 3. Several first nozzles 32 are connected to the bottom of the first infusion pipe 31; the first nozzles 32 are flat. A wide-mouth nozzle with a narrow spray nozzle along the left and right direction is used to spray pressurized water downwards onto the upper surface of the circuit board; a first wastewater tank 11 is fixedly connected to the lower side of the mounting bracket 1; a first outlet pipe 12 is connected to the first wastewater tank 11; a first filter filling layer 13 is provided inside the first wastewater tank 11; a material identification sensor 33 is installed on the crossbeam frame 3; a second infusion pipe 41 is installed inside the conveyor 2, and the second infusion pipe 41 is located below the first infusion pipe 31; several second nozzles 42 are connected to the top of the second infusion pipe 41, and the second nozzles 42 are small-diameter nozzles used to spray high-pressure water upwards onto the inner surface of the drilled holes in the circuit board.

[0019] The working steps of a surface residue cleaning device for circuit board processing based on high-pressure jet in this embodiment are as follows.

[0020] First, the staff connects the first infusion pipe 31 to a pressurized water delivery device, the second infusion pipe 41 to a high-pressure water delivery device, and the first outlet pipe 12 to a wastewater ultrafiltration treatment device. Then, the circuit board is clamped onto the conveyor support 21 of the conveyor 2. The conveyor 2 drives the conveyor support 21 to transport the circuit board from the lower right to the upper left. When the material identification sensor 33 detects that the circuit board passes between the first nozzle 32 of the first infusion pipe 31 and the second nozzle 42 of the second infusion pipe 41, the external pressurized water delivery device continuously delivers pressurized water to the first infusion pipe 31. The pressurized water is sprayed downwards through the first nozzle 32 of the first infusion pipe 31 onto the surface of the circuit board for routine cleaning. Simultaneously, the external high-pressure water delivery device continuously delivers high-pressure water to the second infusion pipe 41. The high-pressure water passes through... The second nozzle 42 of the second infusion tube 41 sprays upwards onto the lower surface of the circuit board. When the drilled hole of the circuit board aligns with the second nozzle 42, the high-pressure water flow passes upwards through the inner surface of the drilled hole to perform high-pressure cleaning, powerfully flushing away residues on the inner surface of the drilled hole. Since the lower surface of the circuit board has no fine circuit structure, it is not easily damaged. Thus, high-pressure jet cleaning of the inner surface of the drilled hole of the circuit board is achieved without damaging the upper surface of the circuit board. This balances the needs of protecting the upper surface of the circuit board and the cleanliness of the inner surface of the drilled hole, effectively solving the contradiction between the insufficient capacity of conventional cleaning and the damage to the board surface caused by high-pressure cleaning in the existing technology. It significantly improves the reliability and product yield of the circuit board cleaning process, and provides a safe, efficient and easily automated solution for drilling cleaning of high-precision, high aspect ratio circuit boards.

[0021] like Figure 6 As shown, a first hanger 34 is slidably connected to the crossbeam 3; a wiper strip 35 is fixedly connected to the first hanger 34, and the wiper strip 35 is located to the left of the first infusion tube 31; two compression springs 36 are connected between the first hanger 34 and the crossbeam 3; when the circuit board passes the wiper strip 35, the upper surface of the circuit board applies an upward squeezing force to the wiper strip 35, the wiper strip 35 drives the first hanger 34 to move upward, the first hanger 34 compresses the compression springs 36 upward, and the elastic force of the compression springs 36 pushes the first hanger 34 in the opposite direction, causing the wiper to... The squeegee 35 is in close contact with the surface of the circuit board. The squeegee 35 removes residual water stains from the surface of the circuit board, reducing the residual moisture on the left side of the circuit board. A baffle 37 is fixed to the first hanger 34. When the first nozzle 32 sprays pressurized water downward onto the surface of the circuit board, the water splashed from the surface of the circuit board to the upper left is intercepted by the baffle 37, preventing a large amount of splashed water from adhering to the surface of the circuit board on the left side of the squeegee 35, thus ensuring the dryness of the circuit board surface with low moisture content.

[0022] like Figure 3 and Figure 4As shown, a second wastewater tank 43 is fixedly connected inside the conveyor 2, and the second wastewater tank 43 is located directly below the second infusion pipe 41; a second outlet pipe 44 is connected to the second wastewater tank 43, and the second outlet pipe 44 is connected to the water storage tank component of the wastewater ultrafiltration treatment equipment; a second filter filling layer 45 is provided inside the second wastewater tank 43; when the second nozzle 42 sprays high-pressure water upward to the lower surface of the circuit board, only a small portion of the high-pressure water will pass through the hole in the circuit board, and most of the high-pressure water will be intercepted by the lower surface of the circuit board and bounce downward into the second wastewater tank 43. Because the lower surface of the circuit board is relatively clean, The water recovered in this second wastewater tank 43 has a low residue content. The water only needs to pass through the second filter filling layer 45 in the second wastewater tank 43 for simple filtration, and can then be directly returned to the high-pressure water conveying equipment through the second outlet pipe 44. There is no need to use external wastewater ultrafiltration equipment for deep filtration of this part of the water, which reduces the operating energy consumption of the wastewater ultrafiltration equipment and significantly improves the water resource reuse rate. While ensuring the cleaning effect of the inner surface of the circuit board drilling, it achieves the unity of energy saving and consumption reduction and high-efficiency production, and optimizes the economy and environmental protection of the overall process.

[0023] like Figure 3 and Figure 4 As shown, two inclined baffles 46 are slidably connected to the second wastewater tank 43, and the second infusion pipe 41 is located in the gap between the two inclined baffles 46; two electric sliders 47 are installed on the front side of the second wastewater tank 43; two electric sliders 47 are also installed on the rear side of the second wastewater tank 43; each electric slider 47 is fixed to the inclined baffle 46 on the same side; when the circuit board moves to the left and completely covers the second nozzle 42, the water flowing down and to the right along the upper surface of the circuit board will not fall into the second wastewater tank 43. At this time, the electric slider 47 drives the inclined baffles 46 to move away from the second nozzle 42, and the two inclined baffles 46 move away from each other, making the opening of the second wastewater tank 43 larger. At this time, the water sprayed at high speed by the second nozzle 42 to the bottom of the circuit board will splash in a wide range. Because the inclined baffles 46 are fixed to the second wastewater tank 43, the water flow will not fall into the second wastewater tank 43. With less coverage from nozzle 32, most of the water splashed from the bottom of the circuit board can fall smoothly into the second wastewater tank 43 for recycling. When the right edge of the circuit board is about to pass over the second nozzle 42 to the left, the electric slider 47 drives the two inclined baffles 46 to move towards each other, increasing the coverage area of ​​the inclined baffles 46 on the second wastewater tank 43. The pressurized water jetted downward from the first nozzle 32 flows to the lower right along the upper surface of the circuit board. This part of the water carries a large amount of residue. When this part of the water leaves the upper surface of the circuit board, it will be intercepted by the inclined baffles 46, preventing the water containing a large amount of residue from entering the second wastewater tank 43. This reduces the workload of the second filter filling layer 45 in filtering the residue in the water, extends the service life of the second filter filling layer 45, and further improves the operational stability and economy of the overall water circulation system.

[0024] Example 2, based on Example 1, such as Figures 1-6 As shown, a second hanger 5 is fixedly connected to the mounting bracket 1 in this embodiment; several hair dryers 51 are installed on the second hanger 5, the air outlets of the hair dryers 51 face downwards, and the hair dryers 51 are located to the left of the squeegee 35; a suction cup 61 is installed inside the conveyor 2, the suction port of the suction cup 61 is set upwards, and the suction cup 61 is located directly below all the hair dryers 51; a rubber frame strip 62 covers the outside of the suction port of the suction cup 61.

[0025] After the conveyor bracket 21 moves the circuit board away from the squeegee 35 after the pressurized jet cleaning section moves to the left, only a small amount of water stains remain on the cleaned section of the circuit board. When this cleaned section of the circuit board moves between the blower 51 and the suction cup 61, the lower surface of the circuit board is pressed against the rubber frame 62, forming a sealed structure between the lower surface of the circuit board and the suction port of the suction cup 61. The blower 51 continuously blows air downwards towards the upper surface of the circuit board, and the airflow removes the residual water stains on the upper surface of the circuit board. At the same time, the suction cup 61 continuously draws airflow from the lower surface of the circuit board, allowing high-speed airflow to circulate on the inner surface of the drill hole aligned between the blower 51 and the suction cup 61. The high-speed airflow can promptly remove the residual water stains on the inner surface of the drill hole of the circuit board, thus achieving the removal of residual water stains on the upper surface of the circuit board and the inner surface of the drill hole, providing a clean and dry board surface for subsequent processes.

[0026] Example 3, based on Example 1, such as Figures 1-6 As shown, a washing roller 71 is rotatably connected to the mounting frame 1 in this embodiment, and the washing roller 71 is located to the right of the first infusion tube 31; a drive motor 72 is mounted on the mounting frame 1; the output shaft of the drive motor 72 is fixedly connected to the washing roller 71; the washing component of the washing roller 71 is made of water-absorbing sponge material; two vibration motors 81 are mounted on the mounting frame 1; each vibration component of the two vibration motors 81 is fixedly connected to a vibration transmission plate 82, and the vibration transmission plate 82 is in close contact with the surface of the washing roller 71.

[0027] Water sprayed from the first nozzle 32 onto the surface of the circuit board flows downwards and to the right to contact the scrubbing roller 71. The drive motor 72 rotates the scrubbing roller 71. The sponge material of the scrubbing roller 71 is compressed upon contact with the circuit board surface and expands upon leaving it. During this expansion, the sponge material absorbs water, resulting in a large amount of water within the scrubbing roller 71. As the scrubbing roller 71 rotates past the circuit board surface, it squeezes the water out again, leaving a large amount of water between the circuit board surface and the scrubbing roller 71. This retained water soaks and expands residues on the circuit board surface and the inner surface of the drilled holes, making these expanded residues easier to remove during subsequent pressurized jet cleaning. Simultaneously, the scrubbing roller... During rotation, the large volume of residue that has expanded from soaking on the surface of the circuit board is thoroughly cleaned and removed, greatly reducing the workload of subsequent pressurized jet cleaning. At the same time, the vibration motor 81 applies low-frequency micro-vibration to the washing roller 71 through the vibration plate 82, so that the washing roller 71 applies vibration disturbance to the surface of the circuit board in a flexible contact manner during the rotation and washing process. Since the washing component of the washing roller 71 is made of water-absorbing sponge material, the sponge material can absorb the cleaning liquid and wet the residue while buffering the vibration impact, avoiding hard impact contact between the washing roller 71 and the surface of the circuit board. As a result, the residue on the surface of the circuit board and the residue near the drill hole opening are loosened under the combined action of wetting, brushing and micro-vibration, and are more easily peeled off when rinsed by the pressurized water flow of the first nozzle 32 and the high-pressure jet of the second nozzle 42, thereby improving the cleaning efficiency and reducing the risk of damage to the surface of the circuit board.

[0028] The technical principles of the embodiments of the present invention have been described above with reference to specific examples. These descriptions are merely for explaining the principles of the embodiments of the present invention and should not be construed as limiting the scope of protection of the embodiments of the present invention in any way. Based on the explanation herein, those skilled in the art can conceive of other specific embodiments of the present invention without creative effort, and these embodiments will all fall within the scope of protection of the embodiments of the present invention.

Claims

1. A surface residue cleaning device for circuit board processing based on high-pressure jet, comprising a mounting bracket (1); characterized in that, It also includes a conveyor (2); the conveyor (2) is installed on the mounting frame (1), the conveyor (2) is installed at an angle, and its conveying direction is towards the upper left side; the conveyor (2) is provided with several conveying brackets (21) that drive the circuit board to move; a crossbeam frame (3) is fixedly connected to the mounting frame (1); a first infusion pipe (31) is fixedly connected to the crossbeam frame (3); the first infusion pipe (31) is connected to several first nozzles (32) that pressurize and jet clean the upper surface of the circuit board; a first infusion pipe (32) is fixedly connected to the lower side of the mounting frame (1). Wastewater tank (11); a first outlet pipe (12) is connected to the first wastewater tank (11); a first filter filling layer (13) is provided inside the first wastewater tank (11); a material identification sensor (33) for identifying circuit boards is installed on the crossbeam frame (3); a second infusion pipe (41) is installed inside the conveyor (2), and the second infusion pipe (41) is located below the first infusion pipe (31); the second infusion pipe (41) is connected to several second nozzles (42) for high-pressure jet cleaning of the inner surface of the drilled holes of the circuit board.

2. The surface residue cleaning device for circuit board processing based on high-pressure jet as described in claim 1, characterized in that, A first hanger (34) is slidably connected to the crossbeam frame (3); a wiper (35) is fixedly connected to the first hanger (34), and the wiper (35) is located on the left side of the first infusion tube (31); a compression spring (36) is fixedly connected between the first hanger (34) and the crossbeam frame (3); a baffle plate (37) is fixedly connected to the first hanger (34).

3. The surface residue cleaning device for circuit board processing based on high-pressure jet as described in claim 1, characterized in that, A second wastewater tank (43) is fixed inside the conveyor (2), and the second wastewater tank (43) is located directly below the second infusion pipe (41); a second outlet pipe (44) is connected to the second wastewater tank (43); a second filter filling layer (45) is provided inside the second wastewater tank (43).

4. The surface residue cleaning device for circuit board processing based on high-pressure jet as described in claim 3, characterized in that, The second wastewater tank (43) is slidably connected to two inclined baffles (46), and the second infusion tube (41) is located in the gap between the two inclined baffles (46); the second wastewater tank (43) is equipped with an electric slider (47) that drives the inclined baffles (46) to move left and right.

5. The surface residue cleaning device for circuit board processing based on high-pressure jet as described in claim 1, characterized in that, A second hanger (5) is fixedly connected to the mounting bracket (1); several blowers (51) that blow air downwards are installed on the second hanger (5), and the blowers (51) are located to the left of the squeegee (35).

6. The surface residue cleaning device for circuit board processing based on high-pressure jet as described in claim 5, characterized in that, The conveyor (2) is equipped with a suction cup (61), the suction port of the suction cup (61) is set upward, and the suction cup (61) is located directly below all the blowers (51).

7. The surface residue cleaning device for circuit board processing based on high-pressure jet as described in claim 6, characterized in that, The suction port of the suction cup (61) is equipped with a rubber frame strip (62).

8. A surface residue cleaning device for circuit board processing based on high-pressure jet according to any one of claims 1-7, characterized in that, A washing roller (71) is rotatably connected to the mounting frame (1), and the washing roller (71) is located on the right side of the first infusion tube (31); a drive motor (72) that drives the washing roller (71) to rotate is installed on the mounting frame (1).

9. A surface residue cleaning device for circuit board processing based on high-pressure jet as described in claim 8, characterized in that, The washing component of the washing roller (71) is made of water-absorbing sponge material.

10. A surface residue cleaning device for circuit board processing based on high-pressure jet according to claim 9, characterized in that, A vibration motor (81) is mounted on the mounting bracket (1); a vibration plate (82) is fixedly connected to the output end of the vibration motor (81), and the vibration plate (82) is attached to the surface of the washing roller (71).

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