Housing assembly and electronic device

Abstract

This application relates to the field of waterproof sealing technology for electronic devices. An embodiment discloses a housing assembly and an electronic device. The housing assembly is used to mount a working component and includes a support frame, a partition, an inner shell, and a first cover plate. A support portion is provided on the support frame, and the working component is mounted on the support portion. A first sealing gasket is provided between the working component and the support portion. The partition is located on the side of the support frame away from the support portion and includes an elastic structure that abuts against the support frame for sealing. The inner shell is located on the periphery of the support frame. The first cover plate is located on the side of the partition away from the support portion, forming a closed inner cavity between the support frame, inner shell, working component, partition, and first cover plate. This application can achieve effective sealing of the inner cavity, reducing the entry of external liquids and dust into the inner cavity, improving the waterproof and dustproof performance of the housing assembly and the electronic device, and enhancing the reliability of the electronic device.

Description

Technical Field

[0001] This application relates to the field of waterproof sealing technology for electronic devices, and more particularly to a housing assembly and an electronic device. Background Technology

[0002] With the development of technology, the application of various electronic devices is becoming increasingly widespread, and the requirements for the waterproof and dustproof performance of electronic devices are also becoming higher. For example, existing audio equipment mainly consists of a housing and various electrical components (such as speakers, amplifiers, tuning devices, microphones, and display devices) housed within the housing. When used outdoors, audio equipment often encounters sandstorms or rainy weather, and existing audio equipment has poor dust and water resistance. Using it in such weather can damage the internal structure of the audio equipment. In addition, when the audio equipment is not in use, dust can also enter the interior of the audio equipment through the housing, which not only affects the sound quality but also reduces the reliability of the audio equipment. Summary of the Invention

[0003] Some embodiments of this application provide a housing assembly and electronic device that can effectively seal the inner cavity, reduce the entry of external liquids and dust into the inner cavity, improve the waterproof and dustproof performance of the housing assembly and electronic device, and improve the reliability of the electronic device.

[0004] On the one hand, embodiments of this application provide a housing assembly, which adopts the following technical solution: Housing assembly for mounting working components, the housing assembly comprising: A support frame, on which a support portion is provided, a working component is mounted on the support portion, and a first sealing gasket is provided between the working component and the support portion; A partition is disposed on the side of the support frame away from the support portion, the partition includes an elastic structure, and the elastic structure abuts and seals against the support frame; The inner shell is disposed on the periphery of the supporting frame; A first cover plate is disposed on the side of the partition member away from the support portion, and a closed inner cavity is formed between the support frame, the inner shell, the working component, the partition member and the first cover plate.

[0005] In some possible implementations, the surface of the support portion that contacts the first sealing gasket is provided with a first sealing rib, and the first sealing rib and the first sealing gasket are sealed by compression interference.

[0006] In some possible implementations, the partition includes an integrally formed inner ring and an outer ring, the elastic structure is disposed on the inner ring, the outer ring is fixedly connected to the support frame by bolts, and the inner ring abuts and seals against the support frame.

[0007] In some possible implementations, a second sealing rib is provided on the surface of the support frame that contacts the inner ring portion, and the second sealing rib is sealed to the inner ring portion by compression interference.

[0008] In some possible implementations, the working component is provided with a connecting wire, at least a portion of which is embedded in the first sealing block; the support frame is provided with a first wire passage hole, and the first sealing block is disposed in the first wire passage hole by an interference fit.

[0009] In some possible implementations, the support frame is provided with a second through hole for the flexible circuit board to pass through. The second through hole is stepped and includes an inner hole near the inner cavity and an outer hole away from the inner cavity. The inner hole and the outer hole are interconnected. A second sealing block is sealed inside the inner hole, and the second sealing block blocks the space between the outer hole and the inner cavity, so that the outer hole forms a potting groove. The portion of the flexible circuit board located in the inner hole is tightly sealed against the second sealing block. The potting groove is filled with potting compound for sealing, and the portion of the flexible circuit board located in the outer hole is covered and sealed by the potting compound.

[0010] In some possible implementations, the housing assembly is provided with an interface assembly, which includes an interface circuit board fixed to the support frame and a connector body disposed on the interface circuit board. The support frame is provided with a mounting hole, and the connector body is disposed within the mounting hole. A sealing ring is provided on the outer periphery of the connector body, and the sealing ring is pressed against the inner wall of the mounting hole to form an interference seal.

[0011] In some possible implementations, a support leg is also included, which is disposed on the side of the partition away from the inner cavity; the partition has a plurality of positioning grooves on the side facing the support leg, and the support leg has a plurality of positioning posts on the side facing the partition, the positioning posts being hollow inside and having notches on their side walls, and each positioning post being inserted into the positioning groove in a corresponding manner by interference fit.

[0012] In some possible implementations, the outer wall of the positioning post is further provided with several protruding ribs, which are pressed together with the positioning groove.

[0013] In some possible implementations, the partition is provided with a central hole, and the first cover plate is sealed to the central hole.

[0014] In some possible implementations, the support frame includes a first frame, a second frame, and a third frame, with the first frame and the second frame respectively disposed at both ends of the third frame; the working component is disposed on the first frame, and the partition is disposed on the second frame.

[0015] In some possible implementations, the inner shell includes a first inner shell and a second inner shell, which are respectively fixed to the third frame, and the first inner shell and the second inner shell are joined together to form a sealed cylindrical structure.

[0016] In some possible implementations, a housing is also included, comprising a first housing and a second housing that are mated together, the first housing and the second housing being disposed on the outer sides of the first inner housing and the second inner housing, respectively, and being fixedly connected to the third frame.

[0017] On the other hand, embodiments of this application provide an electronic device, including a housing assembly and a working component as described in any of the above solutions, wherein the working component is mounted on the housing assembly.

[0018] In some possible implementations, the electronic device further includes a motherboard assembly mounted in the cavity, with a heat-insulating pad disposed between one end of the working component and the motherboard assembly.

[0019] In some possible implementations, the electronic device is an audio device, and the working components include a tweeter and a woofer, the tweeter and the woofer being respectively disposed on the support frame, with the tweeter disposed on the side of the woofer away from the partition; the woofer is mounted on the support portion, and a first sealing gasket is disposed between the woofer and the support portion; the tweeter is fixed to the support frame by a locking member; and a heat insulation pad is disposed between the woofer and the motherboard assembly.

[0020] The beneficial effects of this application are: The housing assembly provided in this application includes a support frame, a partition, an inner shell, and a first cover plate. A support portion is provided on the support frame, and a working component is mounted on the support portion. A first sealing gasket is provided between the working component and the support portion. The compression of the first sealing gasket achieves a reliable seal between the working component and one end of the support frame. The partition is located on the side of the support frame away from the support portion. The partition includes an elastic structure that abuts against the support frame for sealing, thus sealing the other end of the support frame. The inner shell surrounds the periphery of the support frame, and the first cover plate is located on the side of the partition away from the support portion. The support frame, inner shell, working component, partition, and first cover plate form a closed inner cavity, ensuring the airtightness of the inner cavity and reducing the entry of external liquids and dust into the inner cavity through gaps at both ends of the support frame. This improves the waterproof and dustproof performance of the housing assembly and electronic equipment, reduces the risk of damage to the electronic equipment due to water or dust, and improves the reliability of the electronic equipment. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the external structure of the electronic device provided in the embodiments of this application; Figure 2 This is a schematic diagram of the internal structure of the electronic device provided in this application after removing part of the outer shell and inner shell; Figure 3 This is a first-view structural schematic diagram of the electronic device (handle assembly not shown) provided in an embodiment of this application; Figure 4 This is a second-view structural schematic diagram of the electronic device (handle assembly not shown) provided in an embodiment of this application; Figure 5 This is a cross-sectional view of the electronic device (handle assembly not shown) provided in the embodiments of this application along the XX direction; Figure 6 yes Figure 5 A magnified view of a section at point A in the middle; Figure 7 yes Figure 5 A magnified view of a section at point B in the middle; Figure 8 This is a cross-sectional view of the electronic device (handle assembly not shown) provided in the embodiments of this application along the YY direction; Figure 9 yes Figure 8 A magnified view of a section at point C; Figure 10 yes Figure 8 A magnified view of a section at point D; Figure 11 This is a schematic diagram of the connecting line and the first sealing block provided in an embodiment of this application; Figure 12This is an exploded view of the electronic device (handle assembly not shown) provided in the embodiments of this application; Figure 13 This is a first-view structural diagram of the support framework provided in the embodiments of this application; Figure 14 This is a second-view structural diagram of the support framework provided in the embodiments of this application; Figure 15 yes Figure 14 A magnified view of a section at point E in the middle; Figure 16 This is a schematic diagram of the structure of the partition provided in the embodiment of this application; Figure 17 This is a schematic diagram of the structure of the support leg provided in the embodiment of this application; Figure 18 yes Figure 17 A magnified view of a section at point F in the middle; Figure 19 This is a schematic diagram of the structure of the interface component provided in the embodiments of this application.

[0022] In the picture: 1. Support frame; 11. Support part; 111. First sealing rib; 12. Connecting part; 121. Second sealing rib; 13. First wire through hole; 14. Second wire through hole; 141. Inner hole; 142. Outer hole; 15. Mounting hole; 110. First frame; 120. Second frame; 130. Third frame; 131. Support arm; 1311. First mounting groove; 1312. Second mounting groove; 2. Working component; 21. Tweeter; 211. Locking element; 22. Woofer; 23. Connecting wire; 24. First sealing block; 3. First sealing gasket; 4. Partition; 41. Inner ring; 41 1. Center hole; 42. Outer ring; 421. Positioning groove; 5. Support foot; 51. Positioning post; 511. Notch; 512. Rib; 52. Foot pad; 6. Flexible circuit board; 7. Second sealing block; 8. Interface assembly; 81. Interface circuit board; 82. Connector body; 821. Sealing ring; 9. Heat insulation pad; 10. Encapsulating glue; 20. Main board assembly; 1000. Inner cavity; 100. Inner shell; 101. First inner shell; 102. Second inner shell; 200. Outer shell; 201. First outer shell; 202. Second outer shell; 300. First cover plate; 400. Second cover plate; 500. Handle assembly. Detailed Implementation

[0023] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0024] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] In the description of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] The technical solution of this application will be further described below with reference to the accompanying drawings and specific embodiments.

[0027] like Figures 1 to 19 As shown, this embodiment provides an electronic device, including a housing assembly and a working component 2 mounted on the housing assembly. This embodiment solves the problem of poor sealing in existing electronic devices, allowing external liquids and dust to easily enter the device's internal cavity, thus affecting the normal operation of the electronic device. Specifically, the electronic device provided in this embodiment can be an indoor or outdoor speaker, a portable Bluetooth speaker, a smart pet robot, a children's electronic toy, etc.

[0028] The housing assembly provided in this embodiment includes a support frame 1, a first sealing gasket 3, a partition 4, an inner shell 100, and a first cover plate 300. The support frame 1 has an annular support portion 11, on which the edge of the working component 2 is mounted, providing stable support for the working component 2. Simultaneously, the working component 2 is fixedly connected to the support frame 1 by fasteners (such as bolts) to further ensure the stability of its installation. The first sealing gasket 3 is disposed between the edge of the working component 2 and the support portion 11. When the working component 2 is fixed to the support frame 1, the working component 2 and the support frame 1 exert a squeezing effect on the first sealing gasket 3 from both sides. Through the elastic deformation of the first sealing gasket 3, a reliable seal is achieved between the working component 2 and the support frame 1. Optionally, the first sealing gasket 3 and the working component 2 are fixed by adhesive bonding, which facilitates assembly and ensures reliable connection. In this embodiment, the material of the first sealing gasket 3 can be silicone, which has good elastic deformation properties and can effectively improve the waterproof reliability between the working component 2 and the support frame 1. Of course, in other possible embodiments, the material of the first sealing gasket 3 can also be rubber, foam, polytetrafluoroethylene, etc. The partition 4 is fixed to the side of the support frame 1 away from the support portion 11. The partition 4 includes an elastic structure; when the partition 4 is locked and fixed to the support frame 1, the elastic material on the partition 4 abuts against the support frame 1 through its own elastic deformation. Specifically, the partition 4 is fixed to the side of the support frame 1 away from the support portion 11 by fasteners (such as bolts), thus achieving a seal on one side of the support frame 1. The inner shell 100 is disposed on the periphery of the support frame 1 for sealing the periphery of the support frame 1. The first cover plate 300 is located on the side of the partition 4 away from the support part 11. The support frame 1, inner shell 100, working component 2, partition 4 and first cover plate 300 form a closed inner cavity 1000, which ensures the sealing of the inner cavity 1000 and prevents external liquids and dust from entering the inner cavity 1000 through the gaps at both ends of the support frame 1. This improves the waterproof and dustproof performance of the electronic device, reduces the risk of damage to the electronic device due to water or dust, and improves the reliability of the electronic device.

[0029] Optionally, the surface of the support portion 11 that contacts the first sealing gasket 3 is further provided with an annular first sealing rib 111, and the first sealing rib 111 and the first sealing gasket 3 are sealed by compression. In this embodiment, by providing the first sealing rib 111, the elastic deformation of the first sealing gasket 3 can be increased, thereby further improving the sealing performance between the support portion 11 and the working component 2. Specifically, the number of first sealing ribs 111 can be one, two, or more, which can be set as needed.

[0030] Optionally, the support frame 1 is provided with a connecting part 12, and the partition 4 is tightly connected to the connecting part 12. The surface of the connecting part 12 in contact with the partition 4 is also provided with a protruding annular second sealing rib 121, which is pressed and sealed to the partition 4. In this embodiment, by providing the second sealing rib 121, the elastic deformation of the partition 4 can be increased, thereby further improving the sealing performance between the partition 4 and the support frame 1. Specifically, the number of second sealing ribs 121 can be one, two, or more, depending on the needs.

[0031] In some embodiments, the partition 4 includes an inner ring portion 41 and an outer ring portion 42. An elastic structure is provided in the inner ring portion 41, wherein the material hardness of the outer ring portion 42 is higher than that of the inner ring portion 41, ensuring that the outer ring portion 42 has higher fixed support strength, while the inner ring portion 41 can achieve sealing through elastic deformation. Optionally, the outer ring portion 42 is made of plastic for fixed connection with the support frame 1. The high structural strength of the plastic material ensures the reliability of the fixation between the partition 4 and the support frame 1. Optionally, the outer ring portion 42 is fixedly connected to the support frame 1 by bolts. The inner ring portion 41 is made of silicone for sealing against the support frame 1. The good elastic deformation properties of silicone effectively improve the sealing performance between the inner ring portion 41 and the support frame 1. Furthermore, the outer ring portion 42 and the inner ring portion 41 are integrally molded by two-color injection molding, which ensures the structural strength of the partition 4 while facilitating processing and reducing assembly steps. In addition, the inner ring portion 41 is provided with a central hole 411. The first cover plate 300 is bonded to the inner ring portion 41 and covers the outer periphery of the central hole 411, thereby achieving closure and sealing of the central hole 411. Optionally, the material of the first cover plate 300 is plastic or metal, which can improve structural strength and ensure the reliability of electronic equipment.

[0032] In some embodiments, the housing assembly further includes a support leg 5, which is disposed on the side of the partition 4 away from the inner cavity 1000 and is fixedly connected to the partition 4. Specifically, the support leg 5 and the partition 4 are fixed by fasteners or by snap-fit. Exemplarily, in this embodiment, the support leg 5 is fixed to the partition 4 by a snap-fit ​​structure. The outer ring portion 42 of the partition 4 is provided with a plurality of positioning grooves 421 on the side facing the support leg 5, and the support leg 5 is provided with a plurality of positioning posts 51 on the side facing the partition 4. Each positioning post 51 is inserted into the positioning groove 421 one by one by interference fit, thereby realizing the fixation of the support leg 5 and the partition 4. Optionally, the positioning post 51 is hollow inside, and its side wall has a notch 511. When the positioning post 51 is inserted into the positioning groove 421, it is compressed by the groove and undergoes elastic deformation through the notch 511, facilitating easy insertion and improving assembly convenience. After the positioning post 51 is inserted into the positioning groove 421, its outer wall and the inner wall of the groove are press-fitted together, improving the reliability of the support leg 5 and the spacer 4. Furthermore, the outer wall of the positioning post 51 is also provided with several protruding ribs 512. The mutual pressing action between the ribs 512 and the positioning groove 421 further increases the connection strength between the support leg 5 and the spacer 4. It should be noted that when the outer periphery of the positioning post 51 does not have protruding ribs 512, the outer diameter of the positioning post 51 should be larger than the inner diameter of the positioning groove 421 to ensure a tight fit between the outer wall of the positioning post 51 and the inner wall of the positioning groove 421. When the outer periphery of the positioning post 51 has protruding ribs 512, the outer diameter of the positioning post 51 may not be larger than the inner diameter of the positioning groove 421, but the overall outer diameter of the positioning post 51 including all the protruding ribs 512 should be larger than the inner diameter of the positioning groove 421 to ensure a tight fit between the protruding ribs 512 and the inner wall of the positioning groove 421. Furthermore, the outside of the support leg 5 is also covered with a foot pad 52. By setting the foot pad 52, wear on the support leg 5 can be reduced, and the stability of the electronic device can be increased. Optionally, the material of the foot pad 52 is rubber. In addition, a magnetic component can be set inside the foot pad 52 to facilitate placing the electronic device on a magnetically adsorbable object, thereby further improving the placement stability.

[0033] In this embodiment, the electronic device further includes a motherboard assembly 20, which is installed in the inner cavity 1000. The working component 2 is provided with a connecting wire 23, one end of which is connected to the working component 2, and the other end is connected to the motherboard assembly 20. A portion of the connecting wire 23 passes through the side wall of the support frame 1. To achieve sealing of the connecting wire 23, in this embodiment, a portion of the connecting wire 23 is embedded in a first sealing block 24. Simultaneously, a first wire-passing hole 13 is also provided in the support frame 1. The first sealing block 24 is sealed within the first wire-passing hole 13 through an interference fit. Embedding the connecting wire 23 into the first sealing block 24 using an injection molding process not only achieves reliable sealing of the connecting wire 23 but also provides protection for it, preventing damage or breakage due to external forces during use. Optionally, in this embodiment, the material of the first sealing block 24 is silicone. Silicone has good elastic deformation properties, which can effectively improve the sealing performance between the first sealing block 24 and the first wire-passing hole 13.

[0034] Furthermore, the housing assembly also includes a flexible circuit board 6, a portion of which passes through the sidewall of the support frame 1. To facilitate the through-hole assembly of the flexible circuit board 6, the support frame 1 is also provided with a second through-hole 14 for the flexible circuit board 6 to pass through. The second through-hole 14 has a stepped structure, including an inner hole 141 on the side closer to the inner cavity 1000 and an outer hole 142 on the side away from the inner cavity 1000. The inner hole 141 and the outer hole 142 are interconnected. One end of the flexible circuit board 6 passes through the inner hole 141 and enters the inner cavity 1000, where it is plugged into the corresponding connector in the main board assembly 20. In this embodiment, a second sealing block 7 is installed inside the inner hole 141. The second sealing block 7 and the inner hole 141 are tightly sealed by an interference fit. The second sealing block 7 also seals the space between the outer hole 142 and the inner cavity 1000, allowing the outer hole 142 to form a bottom-closed injection groove. This facilitates the injection of potting compound 10 into the injection groove by potting compound. The second sealing block 7 in the inner hole 141 prevents glue from flowing into the interior of the electronic device along the pores. The portion of the flexible circuit board 6 located in the inner hole 141 is tightly sealed against one side of the second sealing block 7. The injection groove is filled with potting compound 10 for sealing. The portion of the flexible circuit board 6 located in the outer hole 142 is covered and sealed by potting compound 10. This embodiment provides a double seal for the flexible circuit board 6 through the second sealing block 7 and the potting compound 10, effectively ensuring a reliable seal for the flexible circuit board 6 and preventing external liquids or dust from entering the interior of the inner cavity 1000 along the pores through which the flexible circuit board 6 passes. At the same time, this embodiment saves space and avoids increasing the size of the device. Optionally, in this embodiment, the potting compound 10 is made of silicone. After the potting compound 10 is applied into the dispensing tank, the liquid potting compound 10 encapsulates and seals the flexible circuit board 6. After standing for 0.5H to 2H and allowing the potting compound 10 to solidify, the sealing structure can successfully pass IPX8 and IP68 tests, meeting the user's requirements. Optionally, in this embodiment, the second sealing block 7 is made of EVA (ethylene-vinyl acetate copolymer), which has a certain degree of softness and elasticity, and can adapt to the expansion and contraction of the inner hole 141, ensuring good sealing performance.

[0035] In some embodiments, the housing assembly further includes an interface assembly 8 for connecting to an external device. Optionally, the interface assembly 8 in this embodiment is a Universal Serial Bus Type-C interface (USB Type-C interface). Specifically, the interface assembly 8 includes an interface circuit board 81 fixed to the support frame 1 and a connector body 82 disposed on the interface circuit board 81. The support frame 1 has a mounting hole 15, and the connector body 82 is installed within the mounting hole 15. To achieve a seal for the interface assembly 8, in this embodiment, a sealing ring 821 is also provided on the outer periphery of the connector body 82. The sealing ring 821 and the inner wall of the mounting hole 15 are sealed by an interference fit. This ensures a reliable seal between the interface assembly 8 and the support frame 1. Optionally, the sealing ring 821 is a waterproof silicone ring. Specifically, the number of sealing rings 821 can be one, two, or more, depending on the needs.

[0036] Furthermore, a heat insulation pad 9 is provided between one end of the working component 2 and the motherboard component 20. In this embodiment, by providing the heat insulation pad 9, the high temperature generated by the working component 2 during operation is reduced from being transferred to the motherboard, thereby reducing the damage to the components on the motherboard.

[0037] In some embodiments, the electronic device is an audio system, and the working component 2 is a speaker. Specifically, the working component 2 includes a tweeter 21 and a woofer 22, which are respectively disposed on the support frame 1. The tweeter 21 is disposed on the side of the woofer 22 away from the partition 4, that is, the tweeter 21 is further away from the partition 4 than the woofer 22. The woofer 22 is mounted on the support portion 11, and a first sealing gasket 3 is disposed between the woofer 22 and the support portion 11. The aforementioned heat insulation gasket 9 is disposed between the woofer 22 and the mainboard assembly 20. The tweeter 21 is fixed to the support frame 1 by a locking member 211. The locking member 211 can be a bolt, which provides reliable fixation and convenient assembly. This embodiment achieves effective sealing of the audio system cavity, reduces the entry of external liquids and dust into the audio system cavity, improves the waterproof and dustproof performance of the audio system, and improves the reliability of the electronic device.

[0038] In some embodiments, the support frame 1 includes a first frame 110, a second frame 120, and a third frame 130, wherein the first frame 110 and the second frame 120 are respectively disposed at both ends of the third frame 130. Specifically, the third frame 130 includes two opposing support arms 131 extending along the height direction of the electronic device. The first frame 110 is annular and fixed to one end of the third frame 130, and the second frame 120 is annular and fixed to the other end of the third frame 130. This support frame 1 has a simple structure, good support performance, and helps save internal space and reduce the weight of the electronic device. Furthermore, the support frame 1 is integrally formed, for example, by injection molding, resulting in good structural strength and convenient processing. Optionally, the material of the support frame 1 is plastic.

[0039] In some embodiments, the inner shell 100 includes a first inner shell 101 and a second inner shell 102, which are respectively fixed to a third frame 130 and are joined together to form a sealed cylindrical structure. By setting the inner shell 100 as a split type with a first inner shell 101 and a second inner shell 102, the processing of the inner shell 100 and the assembly of electronic devices are facilitated. Optionally, in the third frame 130, each support arm 131 has a first mounting groove 1311 on both sides. The two side edges of the first inner shell 101 are respectively inserted into two first mounting grooves 1311, and the two side edges of the second inner shell 102 are respectively inserted into two other first mounting grooves 1311. This facilitates the positioning and assembly of the first inner shell 101 and the second inner shell 102, improving processing efficiency. Optionally, a sealing strip is also provided in the first mounting groove 1311, which can improve the sealing between the third frame 130 and the first inner shell 101 and the second inner shell 102, and ensure the reliable sealing of the inner cavity 1000.

[0040] Furthermore, the working component 2 is installed on the first frame 110 to block the upper end of the cylindrical structure formed by the inner shell 100; the partition 4 is set on the second frame 120 to cooperate with the first cover plate 300 to block the lower end of the cylindrical structure formed by the inner shell 100, thereby forming an integrally closed inner cavity 1000.

[0041] In some embodiments, the housing assembly further includes an outer shell 200, which includes a first outer shell 201 and a second outer shell 202 that are mated together. The first outer shell 201 and the second outer shell 202 are respectively disposed outside the first inner shell 101 and the second inner shell 102, and the first outer shell 201 and the second outer shell 202 are respectively fixedly connected to the third frame 130. By providing the outer shell 200, the inner shell 100 can be protected and the aesthetics of the electronic device can be improved. By setting the outer shell 200 as a split first outer shell 201 and the second outer shell 202, the processing of the outer shell 200 and the assembly of the electronic device are facilitated. Optionally, in the third frame 130, each support arm 131 has a second mounting groove 1312 on both sides, and the second mounting groove 1312 is further away from the inner cavity 1000 than the first mounting groove 1311; the two side edges of the first outer shell 201 are respectively inserted into two second mounting grooves 1312, and the two side edges of the second outer shell 202 are respectively inserted into two other second mounting grooves 1312. This facilitates the positioning and assembly of the first housing 201 and the second housing 202, improving processing efficiency. Optionally, a sealing strip is also provided in the second mounting groove 1312 to improve the sealing between the third frame 130 and the first housing 201 and the second housing 202.

[0042] Furthermore, the electronic device also includes a handle assembly 500, which is fixedly connected to the third frame 130 of the support frame 1 by fasteners. The handle assembly 500 improves the portability of the electronic device. Furthermore, the support frame 1 is also fixed with a second cover plate 400, which covers the outside of the working component 2 to provide protection for it. For example, when the electronic device is a speaker, the second cover plate 400 may include a mesh cover and a dustproof mesh cloth, etc.

[0043] Obviously, the above embodiments of this application are merely examples for clear illustration and are not intended to limit the implementation of this application. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of the claims of this application.

Claims

1. A housing assembly, characterized in that, The housing assembly is used to mount the working components, and the housing assembly includes: A support frame, on which a support portion is provided, a working component is mounted on the support portion, and a first sealing gasket is provided between the working component and the support portion; A partition is disposed on the side of the support frame away from the support portion, the partition includes an elastic structure, and the elastic structure abuts and seals against the support frame; The inner shell is disposed on the periphery of the supporting frame; A first cover plate is disposed on the side of the partition member away from the support portion, and a closed inner cavity is formed between the support frame, the inner shell, the working component, the partition member and the first cover plate.

2. The housing assembly according to claim 1, characterized in that, The surface of the support portion that contacts the first sealing gasket is provided with a first sealing rib, and the first sealing rib and the first sealing gasket are sealed by compression.

3. The housing assembly according to claim 1, characterized in that, The partition includes an integrally formed inner ring and an outer ring. The elastic structure is disposed on the inner ring, and the outer ring is fixedly connected to the support frame by bolts. The inner ring abuts and seals against the support frame.

4. The housing assembly according to claim 3, characterized in that, The surface of the support frame that contacts the inner ring is provided with a second sealing rib, and the second sealing rib and the inner ring are sealed by compression.

5. The housing assembly according to claim 1, characterized in that, The working component is provided with a connecting line, at least a portion of which is embedded in the first sealing block; the support frame is provided with a first wire passage hole, and the first sealing block is disposed in the first wire passage hole by interference fit.

6. The housing assembly according to claim 1, characterized in that, The support frame is provided with a second through hole for the flexible circuit board to pass through. The second through hole is stepped and includes an inner hole near the inner cavity and an outer hole away from the inner cavity. The inner hole and the outer hole are interconnected. A second sealing block is sealed inside the inner hole and blocks the space between the outer hole and the inner cavity, so that the outer hole forms a potting groove. The portion of the flexible circuit board located in the inner hole is tightly sealed against the second sealing block. The potting groove is filled with potting compound for sealing. The portion of the flexible circuit board located in the outer hole is covered and sealed by the potting compound.

7. The housing assembly according to claim 1, characterized in that, The housing assembly is provided with an interface assembly, which includes an interface circuit board fixed on the support frame and a connector body disposed on the interface circuit board. The support frame is provided with a mounting hole, and the connector body is disposed in the mounting hole. A sealing ring is provided on the outer periphery of the connector body, and the sealing ring is sealed to the inner wall of the mounting hole by compression interference.

8. The housing assembly according to any one of claims 1-7, characterized in that, It also includes a support leg, which is disposed on the side of the partition away from the inner cavity; the partition has a plurality of positioning grooves on the side facing the support leg, and the support leg has a plurality of positioning posts on the side facing the partition. The positioning posts are hollow inside and have notches on their side walls. Each positioning post is inserted into the positioning groove in a corresponding manner by interference fit.

9. The housing assembly according to claim 8, characterized in that, The outer wall of the positioning post is also provided with several protruding ribs, which are pressed together with the positioning groove.

10. The housing assembly according to claim 8, characterized in that, The partition is provided with a central hole, and the first cover plate is sealed and connected to the central hole.

11. The housing assembly according to claim 1, characterized in that, The support frame includes a first frame, a second frame, and a third frame, with the first frame and the second frame respectively disposed at both ends of the third frame; the working component is disposed on the first frame, and the partition is disposed on the second frame.

12. The housing assembly according to claim 11, characterized in that, The inner shell includes a first inner shell and a second inner shell, which are respectively fixed to the third frame, and the first inner shell and the second inner shell are joined together to form a sealed cylindrical structure.

13. The housing assembly according to claim 12, characterized in that, It also includes an outer shell, which comprises a first outer shell and a second outer shell that are mated together. The first outer shell and the second outer shell are respectively disposed on the outside of the first inner shell and the second inner shell, and are fixedly connected to the third frame.

14. An electronic device, characterized in that, It includes the housing assembly as described in any one of claims 1-13 and the working assembly, wherein the working assembly is mounted on the housing assembly.

15. The electronic device according to claim 14, characterized in that, The electronic device also includes a motherboard assembly, which is installed in the inner cavity, and a heat insulation pad is provided between one end of the working component and the motherboard assembly.

16. The electronic device according to claim 15, characterized in that, The electronic device is an audio system. The working components include a tweeter and a woofer. The tweeter and the woofer are respectively disposed on the support frame, and the tweeter is disposed on the side of the woofer away from the partition. The woofer is mounted on the support and a first sealing gasket is disposed between the woofer and the support. The tweeter is fixed to the support frame by a locking member. A heat insulation pad is disposed between one end of the woofer and the motherboard assembly.

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