Refrigeration system and test handling equipment

Abstract

The application relates to a refrigeration system and a test sorting device, which comprises a first refrigeration module, a second refrigeration module, and a temperature rising heat exchanger and a temperature dropping heat exchanger arranged between the first refrigeration module and the second refrigeration module. The first refrigeration module comprises a first compressor, a condenser, a first throttling valve and an evaporative condenser which are sequentially connected to form a first circulation loop. The second refrigeration module comprises a second compressor, a second throttling valve and a load evaporator which are sequentially connected to form a second circulation loop. The second circulation loop comprises a first pipeline between an output end of the load evaporator and an input end of the second compressor and a second pipeline between an output end of the second compressor and an input end of the second throttling valve, and the first pipeline and the second pipeline are heat-coupled through the temperature rising heat exchanger. The first circulation loop comprises a third pipeline between an output end of the condenser and an input end of the evaporative condenser, and the first pipeline and the third pipeline are heat-coupled through the temperature dropping heat exchanger. The temperature rising heat exchanger is arranged between the load evaporator and the temperature dropping heat exchanger.

Description

Technical Field

[0001] This invention relates to the field of temperature control technology, and in particular to a refrigeration system and a testing and sorting device. Background Technology

[0002] Electronic components need to be tested on testing and sorting equipment before leaving the factory to test their stability and reliability under high and low temperature environments. Typically, the testing and sorting equipment includes a refrigeration system, which consists of a high-temperature refrigeration module and a low-temperature refrigeration module. The high-temperature and low-temperature refrigeration modules achieve two-stage heat exchange through an evaporator-condenser. The load evaporator of the low-temperature refrigeration module exchanges heat with the electronic components to control their temperature.

[0003] Typically, under high and low temperature operating conditions, there are certain requirements for the automatic temperature control (ATC) capability of the refrigeration system. However, the ATC capability of refrigeration systems in traditional technologies is limited under high and low temperature conditions and cannot be further improved. This results in the testing capability of testing and sorting equipment being limited and unable to meet the high and low temperature control requirements of high-power electronic components. Summary of the Invention

[0004] Therefore, it is necessary to address the problem that the ATC capability of traditional refrigeration systems under high and low temperature conditions is limited and cannot meet the high and low temperature control requirements of high-power electronic components. A refrigeration system and testing and sorting equipment that can improve the ATC capability under high and low temperature conditions to meet the high and low temperature control requirements of high-power electronic components should be provided.

[0005] A refrigeration system, comprising:

[0006] The first refrigeration module includes a first compressor, a condenser, a first expansion valve, and an evaporator-condenser that are connected in sequence to form a first circulation loop;

[0007] The second refrigeration module includes a second compressor, a second throttle valve, and a load evaporator. The second compressor, the evaporator-condenser, the second throttle valve, and the load evaporator are sequentially connected to form a second circulation loop. The first circulation loop and the second circulation loop are thermally coupled through the evaporator-condenser.

[0008] The heating heat exchanger, the second circulation loop includes a first pipeline located between the output end of the load evaporator and the input end of the second compressor and a second pipeline located between the output end of the second compressor and the input end of the second throttle valve, the first pipeline and the second pipeline being thermally coupled through the heating heat exchanger;

[0009] A cooling heat exchanger, wherein the first circulation loop includes a third pipeline located between the output end of the condenser and the input end of the evaporative condenser, and the first pipeline and the third pipeline are thermally coupled through the cooling heat exchanger;

[0010] The heating heat exchanger is connected in series between the load evaporator and the cooling heat exchanger.

[0011] In one embodiment, the second pipeline is located between the output of the second compressor and the input of the evaporator-condenser.

[0012] In one embodiment, the second pipeline is located between the output end of the evaporator-condenser and the input end of the second throttling valve.

[0013] In one embodiment, the third pipeline is located between the output of the first throttling valve and the input of the evaporator-condenser;

[0014] or

[0015] The third pipeline is located between the output end of the condenser and the input end of the first throttle valve.

[0016] In one embodiment, a first regulating valve is provided on the second pipeline;

[0017] The first regulating valve is located upstream of the heating heat exchanger, and the opening degree of the first regulating valve is adjustable.

[0018] In one embodiment, the first refrigeration module further includes a first bypass pipe, the two ends of which are respectively connected to the third pipe and connected in parallel with the cooling heat exchanger;

[0019] A bypass valve is provided on the first bypass pipeline.

[0020] In one embodiment, the second refrigeration module further includes a second bypass pipe, one end of which is connected to the output end of the second compressor, and the other end of which is connected to the input end of the load evaporator;

[0021] The second bypass pipeline is equipped with a thermostatic valve.

[0022] In one embodiment, the second refrigeration module further includes a third bypass pipe, one end of which is connected to the portion of the second circulation loop located between the output end of the evaporator condenser and the input end of the load evaporator, and the other end is connected to the first pipe;

[0023] The third bypass pipeline is equipped with a cooling valve.

[0024] In one embodiment, one end of the third bypass line is connected to the portion between the output end of the evaporator and the input end of the second throttling valve, and the other end is connected to the first line.

[0025] A testing and sorting device includes the aforementioned refrigeration system.

[0026] The aforementioned refrigeration system and testing and sorting equipment have the following beneficial effects:

[0027] 1. The refrigeration system has a heating heat exchanger and a cooling heat exchanger, with the heating heat exchanger connected in series between the load evaporator and the cooling heat exchanger. Under low-temperature conditions, the first refrigerant output from the load evaporator and the second refrigerant discharged from the output end of the second compressor exchange heat in the heating heat exchanger. This not only effectively reduces the dryness of the refrigerant after throttling by the second expansion valve, but also effectively increases the return gas temperature of the second compressor, thus effectively increasing the cooling capacity of the second refrigeration module. This improves the ATC capability of the refrigeration system under low-temperature conditions, thereby enhancing the testing capability of the testing and sorting equipment and meeting the high and low temperature control requirements of high-power electronic components.

[0028] 2. The refrigeration system has a heating heat exchanger and a cooling heat exchanger, with the heating heat exchanger connected in series between the load evaporator and the cooling heat exchanger. Under high-temperature conditions, the refrigerant in the first and third pipelines exchanges heat in the cooling heat exchanger, effectively reducing the return gas temperature of the second compressor, thus effectively increasing the cooling capacity of the second refrigeration module. This improves the ATC (Automatic Temperature Control) capability of the refrigeration system under low-temperature conditions. Because the ATC capability of the refrigeration system is improved under high-temperature conditions, the testing capability of the testing and sorting equipment is enhanced, meeting the high and low temperature control requirements of high-power electronic components. Attached Figure Description

[0029] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0030] Figure 1 A schematic diagram of a refrigeration system provided in an embodiment of this application;

[0031] Figure 2 A schematic diagram of a refrigeration system provided in another embodiment of this application;

[0032] Figure 3 A schematic diagram of a refrigeration system provided in yet another embodiment of this application;

[0033] Figure 4A schematic diagram of a refrigeration system provided in another embodiment of this application;

[0034] Figure 5 A schematic diagram of a refrigeration system provided in yet another embodiment of this application;

[0035] Figure 6 A schematic diagram of a refrigeration system provided in another embodiment of this application.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100. Refrigeration system; 10. First refrigeration module; 11. First compressor; 12. Condenser; 13. First throttle valve; 14. Evaporator-condenser; 15. First bypass line; 16. Bypass valve; 20. Second refrigeration module; 21. Second compressor; 22. Second throttle valve; 23. Load evaporator; 24. First regulating valve; 25. Second bypass line; 26. Thermostatic valve; 27. Third bypass line; 28. Cooling valve; 30. Heating heat exchanger; 40. Cooling heat exchanger; A. First circulation loop; A1. Third line; B. Second circulation loop; B1. First line; B2. Second line. Detailed Implementation

[0038] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0039] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0044] As described in the background section, the ATC (Automatic Temperature Control) capability of traditional refrigeration systems under high and low temperature conditions (the comprehensive technical capability of a refrigeration system to continuously, stably, and accurately maintain the temperature of electronic components at a set production temperature (target process temperature) under closed-loop control without human intervention) is limited and cannot be further improved. This makes it impossible for testing and sorting equipment to meet the high and low temperature control requirements of high-power electronic components, thus limiting the testing capabilities of the testing and sorting equipment. The inventors have discovered that the root cause of the above problem is that the refrigeration system operates only through a conventional refrigeration cycle without a bypass branch participating in the adjustment. This results in insufficient refrigeration capacity under high and low temperature conditions and limited temperature control stability (large temperature fluctuations), which in turn limits the ATC capability of the refrigeration system, thus preventing the testing and sorting equipment from meeting the high and low temperature control requirements of high-power electronic components.

[0045] See Figure 1 To address the aforementioned problems, one embodiment of this application provides a refrigeration system 100, which includes a first refrigeration module 10. The first refrigeration module 10 includes a first compressor 11, a condenser 12, a first throttle valve 13, and an evaporator-condenser 14. The first compressor 11, condenser 12, first throttle valve 13, and evaporator-condenser 14 are sequentially connected to form a first circulation loop A. The first throttle valve 13 can be a thermostatic expansion valve.

[0046] The refrigeration system 100 also includes a second refrigeration module 20, which includes a second compressor 21, a second throttle valve 22, and a load evaporator 23. The second compressor 21, the evaporator-condenser 14, the second throttle valve 22, and the load evaporator 23 are sequentially connected to form a second circulation loop B. The second throttle valve 22 can be an electronic expansion valve.

[0047] The first circulation loop A is thermally coupled to the second circulation loop B through the evaporator-condenser 14. Specifically, the evaporator-condenser 14 includes a first channel and a second channel. The first compressor 11, condenser 12, first throttle valve 13, and the first channel of the evaporator-condenser 14 form the first circulation loop A. The second compressor 21, the second channel of the evaporator-condenser 14, the second throttle valve 22, and the load evaporator 23 form the second circulation loop B. The refrigerant in the first circulation loop A and the second circulation loop B exchanges heat as it flows through the first channel and the second channel, respectively. The first refrigeration module 10 is a high-temperature stage refrigeration module, and the second refrigeration module 20 is a low-temperature stage refrigeration module.

[0048] When the first circulation loop A is working, the refrigerant circulates between the first compressor 11, condenser 12, first throttle valve 13, and evaporator-condenser 14. When the refrigerant flows through the evaporator-condenser 14, it exchanges heat with the refrigerant in the second circulation loop B to lower the temperature of the refrigerant in the second circulation loop B. When the second circulation loop B is working, the refrigerant circulates between the second compressor 21, evaporator-condenser 14, second throttle valve 22, and load evaporator 23. When the refrigerant flows through the load evaporator 23, it can exchange heat with the electronic components, thereby controlling the temperature of the electronic components.

[0049] Further reading Figure 1 The second circulation loop B includes a first pipe B1 and a second pipe B2. The first pipe B1 is located between the output end of the load evaporator 23 and the input end of the second compressor 21, and the second pipe B2 is located between the output end of the second compressor 21 and the input end of the second throttle valve 22. The refrigerant flowing out of the load evaporator 23 can flow through the first pipe B1 to the input end (return gas end) of the second compressor 21, and the refrigerant flowing out of the output end (discharge end) of the second compressor 21 can flow through the second pipe B2 to the second throttle valve 22. The refrigeration system 100 includes a heating heat exchanger 30, and the first pipe B1 and the second pipe B2 are thermally coupled through the heating heat exchanger 30, that is, the refrigerant in the first pipe B1 and the second pipe B2 can exchange heat in the heating heat exchanger 30. Typically, the heating heat exchanger 30 is a dual-channel heat exchanger, with one channel for the refrigerant in the first pipe B1 to flow through and the other channel for the refrigerant in the second pipe B2 to flow through, so that the refrigerants in the first pipe B1 and the second pipe B2 can exchange heat in the heating heat exchanger 30.

[0050] It should be noted that the input end mentioned in the text refers to the end of the corresponding structure where refrigerant is input, and the output end refers to the end of the corresponding structure where refrigerant flows out. It should also be noted that, since the first circulation loop A includes a first channel and the second circulation loop B includes a second channel, for the first circulation loop A, the input end and output end of the evaporator-condenser 14 are respectively the input end and output end of the first channel; for the second circulation loop B, the input end and output end of the evaporator-condenser 14 are respectively the input end and output end of the second channel.

[0051] Continue reading Figure 1The first circulation loop A includes a third pipe A1, which is located between the output end of the condenser 12 and the input end of the evaporator-condenser 14. The refrigerant flowing out of the condenser 12 can flow to the evaporator-condenser 14 via the third pipe A1. The refrigeration system 100 also includes a cooling heat exchanger 40, through which the first pipe B1 and the third pipe A1 are thermally coupled. That is, the refrigerant in the first pipe B1 and the third pipe A1 can exchange heat in the cooling heat exchanger 40. Typically, the cooling heat exchanger 40 is also a dual-channel heat exchanger, with one channel for the refrigerant in the first pipe B1 and the other channel for the refrigerant in the third pipe A1, so that the refrigerant in the first pipe B1 and the third pipe A1 exchange heat in the cooling heat exchanger 40.

[0052] The heating heat exchanger 30 is connected in series between the load evaporator 23 and the cooling heat exchanger 40. That is, the refrigerant flowing out of the load evaporator 23 first flows through the heating heat exchanger 30 and then flows to the cooling heat exchanger 40.

[0053] Under low-temperature operating conditions (low-temperature production temperature), the second throttle valve 22 controls the parameters of the low-temperature stage refrigeration module. The low-temperature two-phase refrigerant, throttled by the second throttle valve 22, enters the load evaporator 23 to exchange heat with electronic components. The refrigerant evaporates and absorbs heat in the load evaporator 23 before being output. The first refrigerant output from the load evaporator 23 exchanges heat with the second refrigerant discharged from the output of the second compressor 21, which has not yet been throttled by the second throttle valve 22, in the heating heat exchanger 30. As the temperature of the first refrigerant increases, it flows to the second compressor 21, while the temperature of the second refrigerant decreases, resulting in a lower condensation pressure. When the evaporation temperature reached by the second refrigeration module 20 remains constant, the refrigerant condensed by the condenser 12 is more prone to subcooling, increasing its latent heat. This means that the refrigerant throttled by the second throttle valve 22 has a lower dryness (more liquid refrigerant). Under normal circumstances, the temperature of the low-temperature refrigerant in the first circulation loop A is higher than that in the second circulation loop B. After the temperature of the first refrigerant rises in the heating heat exchanger 30, it enters the cooling heat exchanger 40. At this time, the temperature difference between the first refrigerant and the refrigerant in the third pipeline A1 is small, and the heat exchange is small. The temperature change of the first refrigerant before and after flowing through the cooling heat exchanger 40 is not significant, which is almost equivalent to the case where the first refrigerant does not pass through the cooling heat exchanger 40 and exchange heat with the refrigerant in the third pipeline A1 (that is, the cooling heat exchanger 40 is approximately or equivalent to not working, that is, it does not play a substantial working role). Therefore, the temperature of the refrigerant flowing back to the second compressor 21 is similar to the temperature of the first refrigerant flowing out of the heating heat exchanger 30, so that the return gas temperature of the second compressor 21 is kept within a suitable range.

[0054] The above configuration, under low-temperature conditions, effectively reduces the dryness of the refrigerant after throttling by the second expansion valve 22 and increases the return gas temperature of the second compressor 21, thereby increasing the cooling capacity of the second refrigeration module 20 and improving the ATC capability of the refrigeration system 100 under low-temperature conditions, due to the heat exchange between the first and second refrigerants in the heating heat exchanger 30. Furthermore, the lower the production temperature, i.e., the lower the temperature of the first refrigerant output from the load evaporator 23, the greater the heat exchange with the second refrigerant, and the greater the improvement in the ATC capability of the refrigeration system 100 under low-temperature conditions. Because the ATC capability of the refrigeration system 100 is improved under low-temperature conditions, the testing capability of the testing and sorting equipment is enhanced, meeting the low-temperature temperature control requirements for high-power electronic components.

[0055] In some specific embodiments, the low-temperature production temperature is set to -55°C. At this temperature, the temperature of the first refrigerant output from the load evaporator 23 is approximately -60°C, and the discharge temperature of the second compressor 21 is approximately 80°C-90°C. The temperature of the refrigerant in the third pipeline A1 is -20°C to -30°C. The temperature of the first refrigerant after heat exchange in the heating heat exchanger 30 is not significantly different from the temperature of the refrigerant in the third pipeline A1. Therefore, the return gas temperature of the second compressor 21 is approximately -20°C to -30°C. It is conceivable that in other embodiments, the specific value of the low-temperature production temperature is not limited. However, regardless of the specific value of the low-temperature production temperature, as long as it is within the low-temperature production temperature range under low-temperature operating conditions, the structural configuration of the above-mentioned refrigeration system 100 can improve its ATC (Automatic Temperature Control).

[0056] Under high-temperature operating conditions (high-temperature production temperature), the temperature difference between the first refrigerant flowing out of the load evaporator 23 and the second refrigerant discharged from the output end of the second compressor 21, before being throttled by the second expansion valve 22, is small, resulting in a small heat exchange. The temperature change of the first refrigerant before and after flowing through the heating heat exchanger 30 is minimal, almost equivalent to the situation where the first refrigerant does not exchange heat with the refrigerant in the second pipeline B2 without the heating heat exchanger 30 (i.e., the heating heat exchanger 30 is approximately or equivalent to not working, meaning it does not play a substantial working role). At this time, the first refrigerant flowing out of the load evaporator 23 enters the cooling heat exchanger 40 to exchange heat with the refrigerant in the third pipeline A1, thereby reducing the temperature of the refrigerant returning to the second compressor 21.

[0057] The above configuration, under high-temperature conditions, effectively reduces the return gas temperature of the second compressor 21 by exchanging heat between the first refrigerant and the refrigerant in the third pipeline A1 in the cooling heat exchanger 40. This also effectively increases the cooling capacity of the second refrigeration module 20, thereby improving the ATC capability of the refrigeration system 100 under high-temperature conditions. Because the ATC capability of the refrigeration system 100 is improved under high-temperature conditions, the testing capability of the testing and sorting equipment is also improved, meeting the high-temperature temperature control requirements of high-power electronic components.

[0058] The refrigeration system 100 provided in this application embodiment includes both a heating heat exchanger 30 and a cooling heat exchanger 40. The heating heat exchanger 30 is connected in series between the load evaporator 23 and the cooling heat exchanger 40. Under low temperature conditions, the first refrigerant and the second refrigerant exchange heat in the heating heat exchanger 30 to increase the cooling capacity, and the cooling heat exchanger 40 is approximately or equivalent to not working. Under high temperature conditions, the first refrigerant and the refrigerant in the third pipeline A1 exchange heat in the cooling heat exchanger 40 to increase the cooling capacity, and the heating heat exchanger 30 is approximately or equivalent to not working. In other words, regardless of whether the refrigeration system 100 operates under low-temperature or high-temperature conditions, at least one heat exchanger can stably perform its actual working function and can stably increase the cooling capacity under any condition. The other heat exchanger, which is almost or equivalent to not working, does not perform its actual working function and does not require active or manual adjustment of its working state, nor will it affect the actual working function of the former heat exchanger. As a result, the ATC capability of the refrigeration system 100 can be stably improved under all operating conditions, thereby improving the testing capability of the testing and sorting equipment and meeting the high and low temperature control requirements of high-power electronic components.

[0059] It should be noted that the above are merely illustrative examples of the working principles of each heat exchanger under extreme conditions (low-temperature conditions such as -55℃, -60℃, etc., and high-temperature conditions such as 140℃, 150℃, etc.), to facilitate understanding of why the ATC capability of the refrigeration system 100 of this invention can be consistently and stably improved under various conditions. In actual operation of the refrigeration system 100, due to the numerous and complex types of operating conditions, it is generally difficult to guarantee that "one heat exchanger consistently performs a substantial working function while the other does not." For example, under normal temperature conditions such as 25℃, medium temperature conditions such as 80℃, or other non-absolute high-temperature or low-temperature conditions, both the heating heat exchanger 30 and the cooling heat exchanger 40 may perform a certain substantial working function. Based on the above principle, they can automatically adjust the relative proportion of their substantial working functions, thereby achieving the effect of consistently and stably improving the ATC capability of the refrigeration system 100. Therefore, the working states of heat exchangers under other complex conditions will not be elaborated further.

[0060] In some embodiments, see Figure 2The second pipe B2 is located between the output end of the second compressor 21 and the input end of the evaporator-condenser 14. At this time, the second refrigerant output from the second compressor 21 first exchanges heat with the first refrigerant through the heating heat exchanger 30 before flowing to the evaporator-condenser 14. Because the refrigerant directly discharged from the output end of the second compressor 21 has a higher temperature, it can increase the temperature difference between the first and second refrigerants flowing out through the load evaporator 23, ensuring the heat exchange effect and contributing to the increase in the cooling capacity of the second refrigeration module 20, further enhancing the ATC capability of the refrigeration system 100.

[0061] In other embodiments, see further description. Figure 1 The second pipe B2 is located between the output end of the evaporator-condenser 14 and the input end of the second throttle valve 22. With this configuration, the temperature of the second refrigerant in the second pipe B2 remains higher than the temperature of the first refrigerant flowing out through the load evaporator 23, ensuring effective heat exchange between the first and second refrigerants in the heating heat exchanger 30. This contributes to increasing the cooling capacity of the second refrigeration module 20 and further enhances the ATC capability of the refrigeration system 100.

[0062] In some embodiments, see further reference. Figure 2 A first regulating valve 24 is provided on the second pipeline B2. The first regulating valve 24 is located upstream of the heating heat exchanger 30, and its opening degree is adjustable. By adjusting the opening degree of the first regulating valve 24, the flow rate of refrigerant flowing from the output end of the second compressor 21 to the heating heat exchanger 30 can be controlled, thereby controlling the heat exchange of refrigerant in the first pipeline B1 and the second pipeline B2 in the heating heat exchanger 30. This ensures that the refrigeration system 100 can maintain optimal heat exchange matching under different loads and ambient temperatures, avoiding insufficient or excessive heat recovery and improving the overall cycle efficiency.

[0063] Optionally, the first regulating valve 24 is an electronic expansion valve. Of course, in other embodiments, the type of the first regulating valve 24 is not limited, as long as it can achieve the effect of regulating the flow rate of refrigerant to the heating heat exchanger 30. For example, the first regulating valve 24 can also be a thermostatic expansion valve.

[0064] It is understood that in other embodiments, see [reference] Figure 3 The first regulating valve 24 can also be omitted from the refrigeration system 100. When the first regulating valve 24 is omitted, the refrigeration system 100 can still increase its cooling capacity regardless of whether it is operating under low-temperature or high-temperature conditions. Furthermore, since the first regulating valve 24 is omitted from the refrigeration system 100, all the exhaust gas from the second compressor 21 is used for heat exchange with the refrigerant flowing out of the load evaporator 23, and the increase in cooling capacity can be maximized under low-temperature conditions.

[0065] In some embodiments, see further reference. Figure 1The third pipe A1 is located between the output end of the first throttling valve 13 and the input end of the evaporator-condenser 14. At this time, the refrigerant after being throttled by the first throttling valve 13 flows to the cooling heat exchanger 40 to exchange heat with the first refrigerant. Because the refrigerant temperature after being throttled by the first throttling valve 13 is lower, it can increase the temperature difference between the first refrigerant flowing out of the output end of the second compressor 21 and the refrigerant in the third pipe A1, ensuring the heat exchange effect and contributing to the increase in the cooling capacity of the second refrigeration module 20, further enhancing the ATC capability of the refrigeration system 100.

[0066] In other embodiments, see Figure 4 The third pipe A1 is located between the output end of the condenser 12 and the input end of the first throttle valve 13. With this configuration, the temperature of the refrigerant in the third pipe A1 remains lower than the temperature of the first refrigerant flowing out through the load evaporator 23, ensuring effective heat exchange between the first refrigerant and the refrigerant in the third pipe A1 in the cooling heat exchanger 40. This contributes to increasing the cooling capacity of the second refrigeration module 20 and further enhances the ATC capability of the refrigeration system 100.

[0067] In some embodiments, see Figure 5 The first refrigeration module 10 also includes a first bypass pipe 15, both ends of which are connected to the third pipe A1, and the first bypass pipe 15 is connected in parallel with the cooling heat exchanger 40. A bypass valve 16 is provided on the first bypass pipe 15, and the opening degree of the bypass valve 16 is adjustable. By adjusting the opening degree of the bypass valve 16, the flow rate of refrigerant in the third pipe A1 can be controlled, thereby controlling the heat exchange between the refrigerant in the first pipe B1 and the third pipe A1 in the cooling heat exchanger 40. This ensures that the refrigeration system 100 maintains optimal heat exchange matching under different loads and ambient temperatures, avoiding insufficient or excessive heat recovery, and improving overall cycle efficiency.

[0068] It is understood that in some embodiments, the first bypass pipe 15 and bypass valve 16 may also be omitted from the first refrigeration module 10. When the first bypass pipe 15 and bypass valve 16 are omitted, the refrigeration system 100 can still increase its cooling capacity regardless of whether it is operating under low-temperature or high-temperature conditions. Furthermore, since the first bypass pipe 15 and bypass valve 16 are omitted from the first refrigeration module 10, all the refrigerant flowing out through the condenser 12 or the first throttling valve 13 is used for heat exchange with the refrigerant flowing out of the load evaporator 23, thereby maximizing the increase in cooling capacity under high-temperature conditions and maximizing the return gas cooling.

[0069] In some embodiments, see Figure 5 and Figure 6The second refrigeration module 20 also includes a second bypass pipe 25, one end of which is connected to the output of the second compressor 21, and the other end is connected to the input of the load evaporator 23. The second bypass pipe 25 is equipped with a thermostatic valve 26, the opening of which is adjustable. Thus, under the adjustment of the thermostatic valve 26, a portion of the refrigerant discharged from the second compressor 21 mixes with the refrigerant throttled by the second throttling valve 22 and flows together to the load evaporator 23, helping to maintain the load evaporator 23 at a constant temperature, thereby facilitating precise temperature control of electronic components.

[0070] Optionally, the thermostatic valve 26 is an electronic expansion valve. Of course, in some other embodiments, the type of thermostatic valve 26 is not limited.

[0071] It should be understood that in some other embodiments, the second refrigeration module 20 may omit the second bypass pipe 25 and the thermostatic valve 26, which is not limited here.

[0072] In some embodiments, see further reference. Figure 5 and Figure 6 The second refrigeration module 20 also includes a third bypass pipe 27. One end of the third bypass pipe 27 is connected to the portion of the second circulation loop B located between the output end of the evaporator-condenser 14 and the input end of the load evaporator 23, and the other end is connected to the first pipe B1. Specifically, one end of the third bypass pipe 27 is connected to the portion of the second circulation loop B located between the output end of the condenser 12 and the second throttle valve 22, and the connection point between the third bypass pipe 27 and the first pipe B1 is located between the heating heat exchanger 30 and the cooling heat exchanger 40. A cooling valve 28 is provided on the third bypass pipe 27, and the opening degree of the cooling valve 28 is adjustable. Because the refrigerant temperature in the portion of the second circulation loop B located between the output end of the evaporator-condenser 14 and the input end of the load evaporator 23 is low, by adjusting the opening degree of the cooling valve 28, a portion of the low-temperature refrigerant in the second circulation loop B can flow through the third bypass pipe 27 to the first pipe B1 for cooling the return gas of the second compressor 21.

[0073] Optionally, the cooling valve 28 is an electronic expansion valve. Of course, in some other embodiments, the type of cooling valve 28 is not limited.

[0074] It should be understood that in some other embodiments, the third bypass pipe 27 and the cooling valve 28 may also be omitted from the second refrigeration module 20, which is not limited here.

[0075] Normally, when the refrigeration system 100 operates under low-temperature conditions, both the thermostatic valve 26 and the cooling valve 28 remain closed. Furthermore, due to the presence of the cooling heat exchanger 40, the first refrigerant can exchange heat with the refrigerant in the third pipeline A1 through the cooling heat exchanger 40, lowering the temperature of the first refrigerant and directing it to the second compressor 21, thus preventing excessively high return gas temperature in the second compressor 21. Therefore, because the presence of the cooling heat exchanger 40 prevents excessively high return gas temperature in the second compressor 21, the cooling valve 28 also typically remains closed under high-temperature conditions. Under high-temperature conditions, when the cooling valve 28 is closed, the third bypass pipeline 27 will not bypass the refrigerant flow in the second circulation loop B, preventing any loss of refrigerant flow in the second circulation loop B and ensuring stable temperature control.

[0076] See Figure 6 Since the refrigeration system 100 of this application can increase the cooling capacity of the second refrigeration module 20 even without opening the cooling valve 28 under high temperature conditions, that is, the setting of the cooling heat exchanger 40 enables the refrigeration system 100 to increase the cooling capacity without opening the cooling valve 28. Therefore, when the first refrigeration module 10 cancels the first bypass pipe 15 and bypass valve 16, all the refrigerant in the first circulation loop A participates in heat exchange. This is equivalent to the design of the first refrigeration module 10 having the first bypass pipe 15 and bypass valve 16, which can also increase the cooling capacity and solve the problem of system fluctuation caused by the bypass valve 16.

[0077] Another embodiment of this application provides a testing and sorting device, which includes the aforementioned cooling system 100. Optionally, the testing and sorting device further includes a heating system, with the cooling system 100 and the heating system counteracting each other to control the temperature of the electronic components.

[0078] The refrigeration system 100 and the testing and sorting equipment provided in this application embodiment have the following beneficial effects:

[0079] 1. The refrigeration system 100 has a heating heat exchanger 30. Under low temperature conditions, the first refrigerant output from the load evaporator 23 and the second refrigerant discharged from the output end of the second compressor 21 exchange heat in the heating heat exchanger 30. This not only effectively reduces the dryness of the refrigerant after throttling by the second throttling valve 22, but also effectively increases the return gas temperature of the second compressor 21. This effectively increases the cooling capacity of the second refrigeration module 20, thereby improving the ATC capability of the refrigeration system 100 under low temperature conditions. This also improves the testing capability of the testing and sorting equipment, enabling it to meet the low temperature control requirements of high-power electronic components.

[0080] 2. The refrigeration system 100 includes a cooling heat exchanger 40. Under high-temperature conditions, the refrigerant in the first refrigerant and the refrigerant in the third pipeline A1 exchange heat in the cooling heat exchanger 40, which effectively reduces the return gas temperature of the second compressor 21, thereby effectively increasing the cooling capacity of the second refrigeration module 20. This improves the ATC capability of the refrigeration system 100 under low-temperature conditions. Because the ATC capability of the refrigeration system 100 is improved under high-temperature conditions, the testing capability of the testing and sorting equipment is enhanced, meeting the high-temperature temperature control requirements of high-power electronic components.

[0081] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A refrigeration system, characterized in that, include: The first refrigeration module (10) includes a first compressor (11), a condenser (12), a first throttle valve (13) and an evaporator-condenser (14) connected in sequence to form a first circulation loop (A). The second refrigeration module (20) includes a second compressor (21), a second throttle valve (22) and a load evaporator (23). The second compressor (21), the evaporator-condenser (14), the second throttle valve (22) and the load evaporator (23) are connected in sequence to form a second circulation loop (B). The first circulation loop (A) and the second circulation loop (B) are thermally coupled through the evaporator-condenser (14). The heating heat exchanger (30) includes a first pipe (B1) located between the output end of the load evaporator (23) and the input end of the second compressor (21) and a second pipe (B2) located between the output end of the second compressor (21) and the input end of the second throttle valve (22), the first pipe (B1) and the second pipe (B2) being thermally coupled through the heating heat exchanger (30); The cooling heat exchanger (40) includes a first circulation loop (A) comprising a third pipe (A1) located between the output end of the condenser (12) and the input end of the evaporative condenser (14), wherein the first pipe (B1) and the third pipe (A1) are thermally coupled through the cooling heat exchanger (40). The heating heat exchanger (30) is connected in series between the load evaporator (23) and the cooling heat exchanger (40).

2. The refrigeration system according to claim 1, characterized in that, The second pipeline (B2) is located between the output end of the second compressor (21) and the input end of the evaporator-condenser (14).

3. The refrigeration system according to claim 1, characterized in that, The second pipe (B2) is located between the output end of the evaporator condenser (14) and the input end of the second throttle valve (22).

4. The refrigeration system according to claim 1, characterized in that, The third pipeline (A1) is located between the output end of the first throttle valve (13) and the input end of the evaporator condenser (14); or The third pipeline (A1) is located between the output end of the condenser (12) and the input end of the first throttle valve (13).

5. The refrigeration system according to claim 1, characterized in that, The second pipeline (B2) is equipped with a first regulating valve (24); The first regulating valve (24) is located upstream of the heating heat exchanger (30), and the opening degree of the first regulating valve (24) is adjustable.

6. The refrigeration system according to claim 1, characterized in that, The first refrigeration module (10) further includes a first bypass pipe (15), the two ends of which are connected to the third pipe (A1) and in parallel with the cooling heat exchanger (40); A bypass valve (16) is provided on the first bypass pipeline (15).

7. The refrigeration system according to claim 1, characterized in that, The second refrigeration module (20) also includes a second bypass pipe (25), one end of which is connected to the output end of the second compressor (21), and the other end is connected to the input end of the load evaporator (23); The second bypass pipeline (25) is equipped with a thermostatic valve (26).

8. The refrigeration system according to claim 1, characterized in that, The second refrigeration module (20) also includes a third bypass pipe (27), one end of which is connected to the portion of the second circulation loop (B) located between the output end of the evaporator condenser (14) and the input end of the load evaporator (23), and the other end is connected to the first pipe (B1); The third bypass pipe (27) is equipped with a cooling valve (28).

9. The refrigeration system according to claim 8, characterized in that, One end of the third bypass pipe (27) is connected to the portion between the output end of the evaporator condenser (14) and the input end of the second throttle valve (22), and the other end is connected to the first pipe (B1).

10. A testing and sorting device, characterized in that, Includes the refrigeration system as described in any one of claims 1-9.

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