A heat dissipation device of a thermal control system of a thermal power plant

Abstract

The application relates to a heat dissipation device of a thermal control system of a thermal power plant, which comprises a device main body, a detachable sealing cover plate connected to the front end of the main body, symmetric ventilation openings arranged on the two sides, a circulating heat dissipation mechanism arranged on the inner side of the ventilation openings, a base fixedly installed on the inner bottom, a thermal control module placed on the installation base, and a group of heat dissipation fins fixed on the top. The circulating heat dissipation mechanism is integrated with a driving motor, a heat dissipation fan and a semiconductor refrigeration sheet, and a circulating cooling pipe is embedded in the installation base. The application adopts a triple synergistic heat dissipation structure of air cooling, semiconductor refrigeration precooling and water cooling, can stably control the working temperature of the thermal control module within the rated interval of components and elements, the semiconductor refrigeration sheet does not directly contact the surface of the module, the condensation and liquid leakage risk is avoided from the root, the full-sealing structure effectively blocks the invasion of dust and corrosive flue gas in the plant area, and the operation reliability of the thermal control system is greatly improved.

Description

Technical Field

[0001] This invention belongs to the technical field of supporting equipment for thermal control systems in thermal power plants, and particularly relates to a heat dissipation device for thermal control systems in thermal power plants. Background Technology

[0002] The thermal control system of a thermal power plant is the core control unit ensuring the safe and stable operation of the unit. It is responsible for the real-time acquisition, closed-loop regulation, and interlocking protection of operating parameters of core equipment such as boilers, turbines, and generators. Its reliability directly determines the power generation efficiency and production safety of the thermal power unit. Currently, the integration level of thermal control systems for large-capacity, high-parameter thermal power units is continuously improving. The density of modules for computational processing, signal acquisition, and power drive within a unit space has increased significantly, resulting in a significant increase in operating heat generation.

[0003] Existing conventional cabinet-based natural ventilation or single-fan direct-blowing heat dissipation modes have significant drawbacks: First, insufficient heat dissipation capacity means that the accumulated heat from highly integrated modules cannot be quickly dissipated, leading to prolonged overheating of local hotspots, resulting in decreased module operational accuracy, accelerated component aging, and even serious hidden dangers such as false signal transmission and malfunctioning protection systems. Second, the lack of an intake pre-cooling structure means that when the ambient temperature in the factory exceeds 40°C in summer, the intake airflow itself is already close to the module's allowable operating temperature, rendering air cooling essentially ineffective. Third, conventional water-cooling solutions involve pipes directly contacting the modules without a buffer structure, resulting in a high risk of condensation and leakage, which can easily cause module short circuits and burnout. Fourth, the cabinet's low sealing level allows dust and corrosive fumes to easily intrude, adhering to the surface of components, reducing heat dissipation efficiency, causing circuit corrosion, and significantly shortening the lifespan of the thermal control system. Summary of the Invention

[0004] (a) Purpose of the invention To overcome the above shortcomings, the present invention aims to provide a heat dissipation device for a thermal control system in a thermal power plant, so as to solve the above-mentioned technical problems.

[0005] (II) Technical Solution To achieve the above objectives, the technical solution provided in this application is as follows: A heat dissipation device for a thermal control system in a thermal power plant includes a main body. A sealing cover is detachably connected to the front end of the main body. Symmetrically arranged ventilation openings are provided on both sides of the main body. A dustproof grille is fixedly installed inside the ventilation opening. A circulating heat dissipation mechanism is provided inside the main body, located inside the ventilation opening. An installation base is fixedly installed at the bottom of the main body. A thermal control module is placed on the upper surface of the installation base. A heat dissipation fin assembly is fixedly connected to the upper surface of the main body.

[0006] Preferably, the circulating heat dissipation mechanism includes a flow guide mounting frame, which is fixed to the inner wall of the device body. A drive motor is fixedly mounted on the inner side of the flow guide mounting frame, and a heat dissipation fan is connected to the output end of the drive motor. A semiconductor cooling chip is fixedly mounted on the inner side of the flow guide mounting frame at one side of the heat dissipation fan.

[0007] Preferably, a cooling grid is fixedly embedded on the inner side of the flow guide mounting bracket at the outer position of the semiconductor cooling chip, and a heat dissipation fin is provided on the other side of the semiconductor cooling chip, with the heat dissipation fin corresponding to the position of the heat dissipation fan.

[0008] Preferably, the upper surface of the mounting base is provided with a placement groove, the inner bottom wall of the placement groove is fixedly connected with a thermally conductive silicone pad, and a circulating cooling pipe is embedded inside the mounting base, with both ends of the circulating cooling pipe extending to the outside of the device body.

[0009] Preferably, a sealing strip is embedded in the inner edge of the sealing cover, and a viewing window is opened on the surface of the sealing cover.

[0010] Preferably, the heat dissipation fin assembly consists of multiple copper fins arranged in parallel at equal intervals, with ventilation gaps reserved between adjacent fins.

[0011] Preferably, the circulating cooling pipe contains a cooling medium, which is a mixed solution of deionized water and ethylene glycol.

[0012] Preferably, the cooling grid is in close contact with the cold end of the thermoelectric cooler, and the heat dissipation fins are in close contact with the hot end of the thermoelectric cooler.

[0013] Preferably, a wiring port is fixedly installed on the rear side wall of the main body of the device, and a protective plug is detachably connected to the outside of the wiring port.

[0014] Preferably, the heat dissipation path of the heat dissipation device is as follows: part of the heat generated by the thermal control module is conducted to the mounting base through the thermally conductive silicone pad and carried away by the cooling medium inside the circulating cooling pipe; the other part of the heat is driven by the circulating heat dissipation mechanism to drive the internal airflow, and after being cooled by the semiconductor cooling chip, it blows the thermal control module; finally, the heat is dissipated to the external environment through the heat dissipation fins on the top of the device body. Beneficial effects

[0015] It adopts a triple-coordinated heat dissipation structure of air cooling, semiconductor cooling and water cooling, which can automatically match the heat dissipation power according to the real-time operating temperature of the thermal control module. Even in high-temperature factory environments above 40℃ in summer, it can stably control the operating temperature of the thermal control module within the rated temperature range of the components, completely avoiding problems such as abnormal operation and protection malfunction caused by local hot spot overheating. The cold end of the semiconductor cooling chip pre-cools the incoming airflow through a cooling grid, avoiding direct contact with the surface of the thermal control module and preventing the risk of condensation and dripping. Combined with the embedded circulating cooling pipe structure in the mounting base, the cooling medium does not directly contact the electronic components, eliminating the risk of leakage and short circuit, and greatly improving operational safety. The fully sealed cabinet, combined with the dustproof grille at the ventilation opening, can effectively block dust and corrosive fumes from entering the device, prevent dust from adhering to the surface of components and reducing heat dissipation efficiency, and extend the service life of the thermal control module. The overall structure features a modular design, allowing each heat dissipation component to be disassembled and maintained individually. This eliminates the need for a complete disassembly device to replace vulnerable parts, significantly improving the ease of operation and maintenance. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of the invention. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of the invention.

[0017] The present invention discloses a heat dissipation device for a thermal control system in a thermal power plant, comprising a main body 1. The main body 1 is formed by welding an integral cold-rolled steel plate and has an anti-corrosion powder coating treatment on the surface, making it suitable for the high humidity and high corrosion environment of a thermal power plant. A sealing cover 2 is detachably connected to the front end of the main body 1 via a snap-fit ​​structure. A nitrile rubber sealing strip 201 is embedded on the inner edge of the sealing cover 2, achieving an IP54 protection rating when closed, effectively preventing dust and moisture from entering the cabinet. A transparent tempered glass viewing window 202 is provided on the surface of the sealing cover 2, allowing direct observation of the operating status indicator lights of the internal thermal control module without opening the cover.

[0018] The main body 1 of the device has symmetrically arranged ventilation openings 3 on both sides. Stainless steel dustproof grilles 4 are fixedly installed inside the ventilation openings 3, with pore sizes less than 0.5mm, effectively preventing large dust particles and foreign objects from entering the cabinet. A circulating heat dissipation mechanism 5 is located inside the main body 1, inside the ventilation openings 3. The symmetrically arranged circulating heat dissipation mechanism 5 on both sides drives the internal airflow to form a convection circulation, significantly improving heat exchange efficiency.

[0019] An aluminum alloy mounting base 6 is fixedly installed at the bottom of the main body 1. A thermal control module 7 is placed on the upper surface of the mounting base 6. A heat dissipation fin assembly 8 is fixedly connected to the upper surface of the main body 1. The heat dissipation fin assembly 8 is welded together from multiple copper fins arranged in parallel at equal intervals. A 2mm ventilation gap is reserved between adjacent fins, which can quickly conduct the heat accumulated inside the cabinet to the external environment.

[0020] The circulating heat dissipation mechanism 5 includes a flow guide mounting bracket 501, which is fixed to the inner wall of the main body 1 by bolts. A silent drive motor 502 is fixedly installed on the inner side of the flow guide mounting bracket 501. The output end of the drive motor 502 is connected to an ABS heat dissipation fan 503. During operation, the drive fan drives the airflow to flow in a directional manner inside the cabinet. A semiconductor cooling chip 504 is fixedly installed on the inner side of the flow guide mounting bracket 501, located on one side of the heat dissipation fan 503. The power supply end of the semiconductor cooling chip 504 is connected in parallel with the power supply line of the thermal control module 7 inside the main body 1 through the temperature control module, and can automatically start and stop according to the real-time detected internal temperature.

[0021] An aluminum cooling grid 505 is fixedly embedded on the inner side of the heat guide mounting bracket 501 at the outer position of the thermoelectric cooler 504. The cooling grid 505 is tightly attached to the cold end of the thermoelectric cooler 504 with thermal grease. An aluminum heat dissipation fin 506 is provided on the other side of the thermoelectric cooler 504. The heat dissipation fin 506 is tightly attached to the hot end of the thermoelectric cooler 504 with thermal grease. The heat dissipation fin 506 is positioned corresponding to the heat dissipation fan 503. The airflow blown out by the heat dissipation fan 503 directly blows the heat dissipation fin 506, quickly removing the heat generated at the hot end of the thermoelectric cooler and ensuring the cooling efficiency of the thermoelectric cooler.

[0022] The upper surface of the mounting base 6 has a placement groove 601 that matches the shape of the thermal control module 7. A thermally conductive silicone pad 602 with a high thermal conductivity is fixedly connected to the inner bottom wall of the placement groove 601. The thermally conductive silicone pad 602 fits perfectly against the bottom shell of the thermal control module 7, which can both fill the contact gap to improve heat conduction efficiency and play an insulating and buffering role to avoid module wear caused by rigid contact. A copper circulating cooling pipe 603 is embedded inside the mounting base 6. Both ends of the circulating cooling pipe 603 extend to the outside of the device body 1 and are respectively connected to the inlet and return water headers of the public cooling water pipeline at the thermal power plant.

[0023] The internal circulation cooling pipe 603 contains a cooling medium, which is a mixed solution of deionized water and ethylene glycol in a 50 / 50 mass ratio. The freezing point is below -20°C, so the pipe will not freeze and crack in low-temperature winter environments.

[0024] The rear wall of the main body 1 of the device is fixedly installed with an aviation plug-in wiring port. When the wiring port is not connected, a rubber protective plug can be detachably connected to the outside of the wiring port to prevent dust and moisture from entering the cabinet through the wiring gap.

[0025] The working principle of this implementation method is as follows: The heat generated during the operation of the thermal control module 7 is dissipated simultaneously through two paths: the first part of the heat is directly conducted through the bottom shell to the thermally conductive silicone pad 602, and then to the aluminum alloy mounting base 6. The heat is carried away by the cooling medium flowing inside the circulating cooling pipe 603 embedded in the mounting base 6, and directly flows into the power plant's common cooling circuit. The second part of the heat is carried away by the convective airflow driven by the circulating heat dissipation mechanism 5. The airflow is pre-cooled when it passes through the cooling grid 505 on the cold end side of the semiconductor cooling chip 504. The low-temperature airflow continuously blows across the sides and top of the thermal control module 7, and the heat carried away is finally transferred to the heat dissipation fin group 8 on the top of the main body 1 and dissipated into the external atmosphere. When the internal temperature of the device is below 35℃, the semiconductor cooling chip 504 automatically shuts off, dissipating heat only through a combination of air cooling and water cooling to reduce operating power consumption. When the internal temperature exceeds 45℃, the semiconductor cooling chip 504 automatically starts, forcibly cooling the circulating airflow to increase heat dissipation power and ensure that the operating temperature of the thermal control module 7 is always controlled below 60℃.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0027] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device for a thermal control system in a thermal power plant, characterized in that, The device includes a main body, a sealing cover plate detachably connected to the front end of the main body, symmetrically arranged ventilation openings on both sides of the main body, dustproof grilles fixedly installed inside the ventilation openings, a circulating heat dissipation mechanism located inside the ventilation openings of the main body, an installation base fixedly installed at the bottom of the main body, a thermal control module placed on the upper surface of the installation base, and a heat dissipation fin assembly fixedly connected to the upper surface of the main body.

2. The heat dissipation device for a thermal control system in a thermal power plant according to claim 1, characterized in that, The circulating heat dissipation mechanism includes a flow guide mounting frame, which is fixed to the inner wall of the main body of the device. A drive motor is fixedly installed on the inner side of the flow guide mounting frame, and a heat dissipation fan is connected to the output end of the drive motor. A semiconductor cooling chip is fixedly installed on the inner side of the flow guide mounting frame, located on one side of the heat dissipation fan.

3. A heat dissipation device for a thermal control system in a thermal power plant according to claim 2, characterized in that, The inner side of the flow guide mounting bracket is fixedly embedded with a cooling grid located on the outer side of the semiconductor cooling chip. The other side of the semiconductor cooling chip is provided with heat dissipation fins, which correspond to the position of the heat dissipation fan.

4. The heat dissipation device for a thermal control system in a thermal power plant according to claim 1, characterized in that, The upper surface of the mounting base is provided with a placement groove, and a thermally conductive silicone pad is fixedly connected to the inner bottom wall of the placement groove. A circulating cooling pipe is embedded inside the mounting base, and both ends of the circulating cooling pipe extend to the outside of the main body of the device.

5. A heat dissipation device for a thermal control system in a thermal power plant according to claim 1, characterized in that, The inner edge of the sealing cover is fitted with a sealing strip, and a viewing window is provided on the surface of the sealing cover.

6. A heat dissipation device for a thermal control system in a thermal power plant according to claim 1, characterized in that, The heat dissipation fin assembly consists of multiple copper fins arranged in parallel at equal intervals, with ventilation gaps reserved between adjacent fins.

7. A heat dissipation device for a thermal control system in a thermal power plant according to claim 4, characterized in that, The circulating cooling pipe contains a cooling medium, which is a mixed solution of deionized water and ethylene glycol.

8. A heat dissipation device for a thermal control system in a thermal power plant according to claim 3, characterized in that, The cooling grid is in close contact with the cold end of the semiconductor cooling chip, and the heat dissipation fins are in close contact with the hot end of the semiconductor cooling chip.

9. A heat dissipation device for a thermal control system in a thermal power plant according to claim 1, characterized in that, A wiring port is fixedly installed on the rear side wall of the main body of the device, and a protective plug is detachably connected to the outside of the wiring port.

10. A heat dissipation device for a thermal control system of a thermal power plant according to any one of claims 1-9, characterized in that, The heat dissipation path of the heat dissipation device is as follows: part of the heat generated by the thermal control module is conducted to the mounting base through the thermally conductive silicone pad and carried away by the cooling medium inside the circulating cooling pipe. The other part of the heat is driven by the circulating heat dissipation mechanism to drive the internal airflow, which is cooled by the semiconductor cooling chip and then blows the thermal control module. Finally, the heat is dissipated to the external environment through the heat dissipation fins on the top of the device body.