Integrated circuit full-automatic SMT reflow soldering chip mounter and process

Abstract

The application discloses a kind of integrated circuit full-automatic SMT reflow soldering chip mounter and process, belong to surface mounting technical field, the chip mounter includes base, space adjusting assembly, suction assembly and feeding assembly, suction assembly includes gripper and the suction detection assembly being set in the middle part of gripper, suction detection assembly includes center seat, the center suction post being slidably arranged in the accommodating groove of center seat, the suction disc being slidably set in the lower part of center suction post, the positioning disc being installed at the bottom of center seat and the multiple positioning rods being installed at the bottom of positioning disc, pressure sensor is set on each positioning rod, the present application can detect element position and size synchronously in picking process, and according to the detection result, adaptively switch picking mode, improve the adaptability and picking reliability of chip mounter to different working conditions.

Description

Technical Field

[0001] This invention relates to the field of surface mount technology, specifically to a fully automated SMT reflow soldering placement machine and process for integrated circuits. Background Technology

[0002] Surface Mount Technology (SMT) is a mainstream process in the electronics assembly industry. A typical SMT production process includes three main steps: solder paste printing, component placement, and reflow soldering. First, solder paste is printed on the pads of the printed circuit board. Then, a pick-and-place machine picks up electronic components and places them onto the corresponding pads. Finally, the printed circuit board carrying the components is sent to a reflow oven, where the solder paste is melted by heating, achieving a metallurgical connection between the component leads and the pads.

[0003] The component placement process is a crucial intermediate step connecting solder paste printing and reflow soldering. Existing pick-and-place machines typically use vacuum nozzles to pick up components. However, in actual pick-and-place operations, when components are significantly off-center or exceed the effective pick-and-place range of the nozzle, relying solely on a single nozzle may lead to pick-up failure and component loss. Furthermore, traditional pick-and-place machines have limited ability to detect component positional offsets and dimensional changes, usually requiring an additional independent vision inspection system. This not only increases equipment cost and size but also creates timing coordination issues between inspection and pick-up actions.

[0004] Therefore, it is necessary to provide a fully automated SMT reflow soldering and placement machine and process for integrated circuits to solve the above problems. Summary of the Invention

[0005] To solve the above problems, the present invention provides the following technical solution: a fully automatic SMT reflow soldering and placement machine for integrated circuits, comprising:

[0006] Base;

[0007] A space adjustment component is mounted on the base, and the space adjustment component has an output terminal;

[0008] An adsorption component is installed at the output end of the space adjustment component;

[0009] A feeding assembly for supplying elements to the adsorption assembly;

[0010] The adsorption assembly includes grippers and an adsorption detection assembly. The adsorption detection assembly is disposed in the middle of the grippers and is configured to adsorb elements and detect the position and size of the elements. The grippers are configured to selectively clamp the elements according to the detection results of the adsorption detection assembly.

[0011] Furthermore, preferably, the adsorption detection component includes:

[0012] A center seat is fixed to the middle of the gripper, and a receiving groove is provided at the bottom of the center seat;

[0013] The central suction column is slidably disposed in the receiving groove at its upper part and is connected to the central seat through a second elastic member;

[0014] A suction cup is slidably fitted onto the lower part of the central suction column, and a first elastic element connects the suction cup and the central suction column.

[0015] Furthermore, as a preferred embodiment, a positioning plate is installed at the bottom of the central seat, and a through hole is opened in the middle of the positioning plate for the central suction column to pass through. Multiple positioning rods are installed at the bottom of the positioning plate, and each positioning rod is equipped with a pressure sensor.

[0016] Furthermore, preferably, the adsorption assembly is configured such that: during the adsorption process, the space adjustment assembly drives the adsorption assembly to move downward, so that the suction cup and the central suction column sequentially contact the element, and the upper surface of the element approaches the lower surface of the positioning rod; the pressure sensor on the positioning rod is configured to acquire the positional deviation of the element relative to the suction cup and the size of the element; the suction cup is configured to adsorb the element; when the positional deviation is within a first deviation threshold range, or when the size is within a first size threshold range, the central suction column is configured to activate to assist the suction cup in adsorbing the element.

[0017] Furthermore, preferably, the gripper is configured to hold the element when the position deviation is within a second deviation threshold range, or when the size is within a second size threshold range.

[0018] Furthermore, preferably, the elastic modulus of the second elastic element is greater than that of the first elastic element.

[0019] Furthermore, preferably, in the free state, the first elastic member causes the lower surface of the suction cup to be lower than the lower surface of the central suction column.

[0020] Furthermore, preferably, the feeding assembly includes:

[0021] A base, wherein a mounting groove is provided in the middle of the base, and the mounting groove is configured to limit the movement direction of the element;

[0022] Two rotating wheels are symmetrically mounted on the base.

[0023] A conveyor belt is driven between the two said rollers, and the upper surface of the conveyor belt is configured as a load-bearing element;

[0024] An electric motor is connected to one of the wheels for driving the wheels to rotate.

[0025] Furthermore, as a preferred embodiment, the space adjustment component includes a longitudinal adjustment component, a lateral adjustment component, and a vertical adjustment component.

[0026] This invention also provides a fully automated SMT reflow soldering and placement process for integrated circuits, comprising:

[0027] S1. The component is transported to the pickup station using the feeding assembly;

[0028] S2. Using the space adjustment component, drive the adsorption component to move above the pickup station, and drive the adsorption component to move down, so that the suction cup and the central suction column contact the element in sequence, and bring the upper surface of the element close to the lower surface of the positioning rod.

[0029] S3. Use the pressure sensors on each of the positioning rods to obtain the positional deviation of the component relative to the suction cup and the size of the component;

[0030] S4. When the position deviation is within the first deviation threshold range, or when the size is within the first size threshold range, the central suction column assists in adsorbing and picking up the element; when the position deviation is within the second deviation threshold range, or when the size is within the second size threshold range, the grippers assist in clamping and picking up the element.

[0031] S5. Using the space adjustment component, drive the adsorption component, along with the picked-up element, to the pad position on the printed circuit board, and release the element.

[0032] Compared with the prior art, the present invention provides a fully automated SMT reflow soldering and placement machine and process for integrated circuits, which has the following beneficial effects:

[0033] In this invention, by setting multiple positioning rods with pressure sensors at the bottom of the positioning disk, the positional deviation and size information of the element can be obtained simultaneously during the process of the adsorption component moving down to contact the element.

[0034] In this invention, based on the position deviation and size information fed back by the pressure sensor, the suction cup continuously applies an adsorption force to the component during the pickup process. When neither the component deviation nor the size falls within any threshold range, the component is picked up solely by the suction cup, with neither the central suction column nor the gripper moving. When the position deviation is within a first deviation threshold range or the size is within a first size threshold range, the central suction column activates and works with the suction cup to pick up the component, while the gripper remains open. When the position deviation is within a second deviation threshold range or the size is within a second size threshold range, the gripper clamps and picks up the component, while the suction cup and central suction column stop adsorbing. This achieves adaptive selection of the pickup method based on the actual deviation and size of the component, ensuring pickup reliability.

[0035] In this invention, the feeding assembly constrains the movement direction of the components through the mounting groove, and with the smooth conveyor belt, ensures the consistency of the components' position when they arrive at the picking station, providing good initial conditions for subsequent position detection. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the planar structure of a fully automated SMT reflow soldering and placement machine for integrated circuits;

[0037] Figure 2 A three-dimensional structural diagram of a fully automated SMT reflow soldering and placement machine for integrated circuits;

[0038] Figure 3 This is a schematic diagram of the material feeding assembly;

[0039] Figure 4 This is a schematic diagram of the adsorption component.

[0040] In the diagram: 1. Base; 2. Vertical adjustment component; 3. Horizontal adjustment component; 4. Vertical adjustment component; 5. Adsorption component; 6. Feeding component; 61. Base; 62. Mounting slot; 63. Rotary wheel; 64. Conveyor belt; 65. Motor; 51. Gripper; 52. Center seat; 53. Center suction column; 54. Suction cup; 55. First elastic element; 56. Positioning plate; 57. Positioning rod. Detailed Implementation

[0041] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements, but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0042] Example: Please refer to Figures 1 to 4 This embodiment provides a fully automatic SMT reflow soldering and placement machine for integrated circuits, including a base 1, a space adjustment component, an adsorption component 5, and a feeding component 6.

[0043] The base 1 is fixed to the workbench or frame to support the entire device. A space adjustment assembly is mounted on the base 1 and includes a longitudinal adjustment assembly 2, a transverse adjustment assembly 3, and a vertical adjustment assembly 4. The longitudinal adjustment assembly 2 is mounted on the base 1, the transverse adjustment assembly 3 is mounted at the output end of the longitudinal adjustment assembly 2, the vertical adjustment assembly 4 is mounted at the output end of the transverse adjustment assembly 3, and the adsorption assembly 5 is mounted at the output end of the vertical adjustment assembly 4, which is also the output end of the space adjustment assembly. The longitudinal adjustment assembly 2 drives the adsorption assembly 5 to move horizontally longitudinally, the transverse adjustment assembly 3 drives the adsorption assembly 5 to move horizontally transversely, and the vertical adjustment assembly 4 drives the adsorption assembly 5 to move vertically. The combination of these three components allows the adsorption assembly 5 to reach any designated position in three-dimensional space to complete the component pickup from the feeding assembly 6 and transfer it to the corresponding pad on the printed circuit board for placement. The longitudinal adjustment assembly 2, transverse adjustment assembly 3, and vertical adjustment assembly 4 can all be implemented using conventional linear drive mechanisms, such as lead screw and nut mechanisms, synchronous belt drive mechanisms, or linear motor drive mechanisms, which will not be elaborated upon here.

[0044] See Figure 4 The adsorption component 5 includes a gripper 51 and an adsorption detection component. The gripper 51 can be an electric gripper. The adsorption detection component is located in the middle of the gripper 51. Specifically, the adsorption detection component is installed in the central area between the two claws of the gripper 51.

[0045] The adsorption detection assembly includes a central seat 52, a central suction column 53, a suction cup 54, a first elastic element 55, a positioning plate 56, and a positioning rod 57.

[0046] The center seat 52 is fixed to the middle of the gripper 51, specifically to the base or connecting plate of the gripper 51. A receiving groove is provided at the bottom of the center seat 52, with the opening of the receiving groove facing downwards. The upper part of the center suction column 53 is slidably disposed within this receiving groove and is connected to the center seat 52 via a second elastic element (not shown separately in the figure). The second elastic element can be a spring, with its upper end connected to the top wall of the receiving groove and its lower end connected to the top end face of the center suction column 53. A negative pressure channel is provided on the central axis of the center suction column 53. The lower port of the negative pressure channel is located on the lower end face of the center suction column 53, and the upper port of the negative pressure channel is connected to an external negative pressure source to generate an adsorption force on the lower end face of the center suction column 53.

[0047] The suction cup 54 is slidably fitted onto the lower part of the central suction column 53. A through hole is formed in the center of the suction cup 54, through which the central suction column 53 passes, with its lower end exposed below the suction cup 54. A first elastic element 55 connects the suction cup 54 and the central suction column 53. The first elastic element 55 is fitted around the outer periphery of the central suction column 53, with its upper end connected to a shoulder or retaining ring on the central suction column 53 and its lower end connected to the upper end face of the suction cup 54. An annular suction lip is formed on the lower end face of the suction cup 54, and this suction lip communicates with a vacuum source through an internal air passage within the suction cup 54 to generate suction force at the suction lip.

[0048] In its free state, i.e., in its natural state where the adsorption component 5 is not in contact with the element, the first elastic element 55 lowers the lower surface of the suction cup 54 below the lower surface of the central suction column 53. In other words, the lower surface of the suction cup 54 is lower than the lower end face of the central suction column 53. This height difference design ensures that during the downward movement of the adsorption component 5, the adsorption lip of the suction cup 54 contacts the element before the lower end face of the central suction column 53, thus establishing adsorption and positioning of the element first.

[0049] The elastic modulus of the second elastic element is greater than that of the first elastic element 55. Elastic modulus is a physical quantity characterizing a material's resistance to elastic deformation. A larger elastic modulus results in smaller elastic deformation of the material under the same stress. In actual operation, when the adsorption assembly 5 moves downwards and the suction cup 54 contacts the element, the first elastic element 55 is compressed first as the adsorption assembly 5 continues to move downwards. The suction cup 54 retracts upwards relative to the central suction column 53, causing the lower end face of the central suction column 53 to gradually approach the upper surface of the element. Because the second elastic element has a larger elastic modulus, its resistance to deformation is correspondingly stronger. In the initial stage of compression of the first elastic element 55, the central suction column 53 hardly undergoes any upward displacement relative to the central seat 52, thus ensuring that a stable adsorption is established between the suction cup 54 and the element. When the first elastic element 55 is compressed to a certain extent and the lower end face of the central suction column 53 has contacted the element, if the adsorption assembly 5 continues to move downwards, the second elastic element begins to be compressed, and the central suction column 53 slides upwards relative to the central seat 52, thereby avoiding excessive contact force on the element.

[0050] A positioning plate 56 is installed at the bottom of the center seat 52. The positioning plate 56 is fixedly connected to the lower end face of the center seat 52. A through hole is opened in the middle of the positioning plate 56. The diameter of the through hole is larger than the outer diameter of the central suction column 53 so that the central suction column 53 can pass through freely. Multiple positioning rods 57 are installed at the bottom of the positioning plate 56. The multiple positioning rods 57 are arranged in an array or ring around the axis of the central suction column 53. The lower end face of each positioning rod 57 is located on the same horizontal plane. Each positioning rod 57 is equipped with a pressure sensor. For example, a thin film pressure sensor or a piezoresistive pressure sensor is installed between the top of each positioning rod 57 and the positioning plate 56. When the lower end of the positioning rod 57 is subjected to an upward resisting force, the pressure sensor can sense and output a corresponding pressure signal. A flexible buffer layer is provided on the lower end face of the positioning rod 57. The buffer layer is made of hard plastic, polyurethane or rubber material and has a thickness of 0.5 to 1 mm to avoid damage to the surface of the component by hard contact.

[0051] See Figure 1 and Figure 4 During the actual component pickup process, the space adjustment component drives the adsorption component 5 to move above the feeding component 6 and drives the adsorption component 5 to move vertically downward. First, the lower surface of the suction cup 54 contacts the upper surface of the component, and the suction cup 54 applies an adsorption force to the component, initially positioning it. As the adsorption component 5 continues to move downward, the first elastic element 55 is compressed, the lower end face of the central suction column 53 contacts the upper surface of the component, and at the same time, the upper surface of the component also approaches the lower surface of the positioning rod 57.

[0052] The pressure sensor on each positioning rod 57 transmits the sensed pressure value to the control system. By analyzing the presence and magnitude of the pressure values ​​sensed by each positioning rod 57, the positional deviation and dimensional information of the component can be obtained. Specifically:

[0053] When the component is in a perfectly aligned position relative to the center of the suction cup 54, the pressure values ​​sensed by each positioning rod 57, which are symmetrically distributed with the axis of the central suction column 53 as the axis of symmetry, are basically equal. Based on this, the control system determines that the component has not deviated from its position, that is, the position deviation is zero or close to zero.

[0054] When the component deviates from the center of the suction cup 54, the number of positioning rods 57 that sense pressure in the direction of deviation increases. Based on this, the amount and direction of the component's positional deviation are calculated.

[0055] Meanwhile, by counting the number of positioning rods 57 that do not sense pressure or the distribution range of positioning rods 57 that sense pressure, the upper surface contour boundary of the component can be deduced, thereby obtaining the component's size information. For example, when the component size is small, only a few positioning rods 57 around the central suction post 53 can contact the upper surface of the component; when the component size is large, more or even all positioning rods 57 can contact the upper surface of the component.

[0056] After acquiring the component's positional deviation and dimensional information, the control system selects the pickup method according to preset logic:

[0057] During the pickup process, the suction cup 54 always applies adsorption force to the component as the main adsorption method. When the positional deviation of the component relative to the suction cup 54 and the component size are both small and do not enter any threshold range, the component can be reliably fixed by the adsorption force of the suction cup 54 alone. At this time, the central suction column 53 is not activated, the gripper 51 remains open, and the suction cup 54 independently completes the adsorption and pickup.

[0058] When the positional deviation is within the first deviation threshold range, or when the size is within the first size threshold range, it indicates that the component has a certain degree of deviation or is too large. The suction force of the suction cup 54 alone is insufficient to stably fix the component. The control system determines that the central suction column 53 needs to intervene to assist in the suction. At this time, the central suction column 53 is activated, and its lower end face applies suction force to the upper surface of the component through negative pressure, together with the suction cup 54, to form a double suction, improving the reliability of picking up. The gripper 51 remains open in this state and does not participate in picking up.

[0059] When the positional deviation is within the second deviation threshold range, or when the size is within the second size threshold range, it indicates that the deviation or size of the component has exceeded the reliable adsorption capability of the dual adsorption of the suction cup 54 and the central suction column 53. At this time, the control system determines that the adsorption method is unreliable, and the gripper 51 clamps and picks up the component. The two claws of the gripper 51 point inward and close, clamping the component from both sides. In this state, the suction cup 54 and the central suction column 53 can stop adsorption.

[0060] It should be noted that the first deviation threshold range and the second deviation threshold range can be set as continuous but non-overlapping intervals. In addition, the spacing between the positioning rods is 2 to 4 mm, which is suitable for medium and large-sized components with a side length of not less than 12 mm.

[0061] See Figure 3 The feeding assembly 6 is used to supply elements to the adsorption assembly 5. The feeding assembly 6 includes a base 61, two rollers 63, a conveyor belt 64, and a motor 65. The base 61 is fixed to the base 1 or the worktable, and a mounting groove 62 is formed in the middle of the base 61. The mounting groove 62 extends along the conveying direction of the elements, and the width of the mounting groove 62 is adapted to the width of the elements to be conveyed, so as to limit the lateral displacement of the elements during the conveying process. The two rollers 63 are symmetrically rotated on the base 61 and are located at both ends of the mounting groove 62. The conveyor belt 64 is driven between the two rollers 63, and the upper surface of the conveyor belt 64 is basically flush with or slightly higher than the bottom surface of the mounting groove 62. The upper surface of the conveyor belt 64 is used to support the elements.

[0062] This embodiment also provides a fully automated SMT reflow soldering and placement process for integrated circuits, implemented using the aforementioned placement machine. In a complete work cycle, this placement process includes the following steps:

[0063] Step 1: The feeding assembly 6 transports the component to the picking station. Specifically, the motor 65 drives the rotating wheel 63 to rotate, which in turn drives the conveyor belt 64 to run in a cycle. The component located on the upper surface of the conveyor belt 64 moves forward along the mounting groove 62 with the conveyor belt 64 and stops after reaching the preset picking station, waiting for the adsorption assembly 5 to pick it up.

[0064] Step Two: The space adjustment component drives the adsorption component 5 to move longitudinally and laterally to directly above the pickup station; subsequently, the vertical adjustment component 4 drives the adsorption component 5 to move vertically downward. During the downward movement, since the lower surface of the suction cup 54 is lower than the lower surface of the central suction column 53 in its free state, the lower surface of the suction cup 54 contacts the upper surface of the element before the lower end face of the central suction column 53, and the suction cup 54 applies an adsorption force to the element, performing initial adsorption and positioning. As the adsorption component 5 continues to move downward, the first elastic element 55 is compressed, and the lower end face of the central suction column 53 contacts the upper surface of the element; at the same time, since the suction cup 54 and the central suction column 53 retract upward relative to the central seat 52, the upper surface of the element approaches the lower surface of the positioning rod 57, and part or all of the lower end face of the positioning rod 57 abuts against the upper surface of the element.

[0065] Step 3: The pressure sensors on each positioning rod 57 transmit their sensed pressure values ​​to the control system. Based on the differences in pressure signals from each positioning rod 57, the control system calculates the positional deviation of the component relative to the suction cup 54 and the size of the component.

[0066] Step 4: The control system determines the pickup method based on the obtained positional deviation and size. In adsorption mode, the suction cup 54 always applies adsorption force to the component as the primary adsorption method. When the positional deviation and size of the component relative to the suction cup 54 are both small and do not enter any threshold range, the adsorption force of the suction cup 54 alone is sufficient to reliably fix the component. At this time, the central suction column 53 is not activated, the gripper 51 remains open, and the suction cup 54 independently completes the adsorption and pickup. When the positional deviation is within the first deviation threshold range, or when the size is within the first size threshold range, it indicates that the adsorption force of the suction cup 54 alone is insufficient to stably fix the component. At this time, the central suction column 53 is activated, and together with the suction cup 54, it applies adsorption force to the component, while the gripper 51 remains open. When the positional deviation is within the second deviation threshold range, or when the size is within the second size threshold range, it indicates that the component has exceeded the reliable adsorption capacity range of the suction cup 54 and the central suction column 53. At this time, the gripper 51 clamps and picks up the component. The two claws of the gripper 51 point inward and close, clamping the component from both sides, and the suction cup 54 and the central suction column 53 stop adsorption.

[0067] Step 5: The space adjustment component drives the adsorption component 5, along with the picked-up component, to rise and move horizontally above the corresponding pad position on the printed circuit board. Then, the vertical adjustment component 4 drives the adsorption component 5 to move downward to the placement height. The control system selects the corresponding release method according to the pickup method, releasing the component onto the pad position, completing one placement cycle. Subsequently, the adsorption component 5 returns to above the pickup station, and the next work cycle begins.

[0068] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A fully automatic SMT reflow soldering and placement machine for integrated circuits, characterized in that, include: Base (1); A space adjustment component is installed on the base (1), and the space adjustment component has an output terminal; Adsorption component (5) is installed at the output end of the space adjustment component; A feeding assembly (6) is used to supply elements to the adsorption assembly (5); The adsorption component (5) includes a gripper (51) and an adsorption detection component. The adsorption detection component is disposed in the middle of the gripper (51). The adsorption detection component is configured to adsorb elements and detect the position and size of the elements. The gripper (51) is configured to selectively clamp the elements according to the detection result of the adsorption detection component.

2. The fully automatic SMT reflow soldering and placement machine for integrated circuits according to claim 1, characterized in that, The adsorption detection component includes: A center seat (52) is fixed to the middle of the gripper (51), and a receiving groove is provided at the bottom of the center seat (52); The central suction column (53) is slidably disposed in the receiving groove and is connected to the central seat (52) through the second elastic member; The suction cup (54) is slidably sleeved on the lower part of the central suction column (53), and a first elastic element (55) is connected between the suction cup (54) and the central suction column (53).

3. The fully automatic SMT reflow soldering and placement machine for integrated circuits according to claim 2, characterized in that, The bottom of the center seat (52) is equipped with a positioning plate (56), and the center of the positioning plate (56) has a through hole for the center suction column (53) to pass through. The bottom of the positioning plate (56) is equipped with multiple positioning rods (57), and each positioning rod (57) is equipped with a pressure sensor.

4. The fully automatic SMT reflow soldering and placement machine for integrated circuits according to claim 3, characterized in that, The adsorption component (5) is configured such that, during the adsorption process, the space adjustment component drives the adsorption component (5) to move downward, so that the suction cup (54) and the central suction column (53) sequentially contact the element, and the upper surface of the element approaches the lower surface of the positioning rod (57); the pressure sensor on the positioning rod (57) is configured to acquire the positional deviation of the element relative to the suction cup (54) and the size of the element; when the positional deviation is within a first deviation threshold range, or when the size is within a first size threshold range, the central suction column (53) is configured to activate to assist the suction cup (54) in adsorbing the element.

5. The fully automatic SMT reflow soldering and placement machine for integrated circuits according to claim 4, characterized in that, When the position deviation is within a second deviation threshold range, or when the size is within a second size threshold range, the gripper (51) is configured to grip the element.

6. The fully automatic SMT reflow soldering and placement machine for integrated circuits according to claim 3, characterized in that, The elastic modulus of the second elastic element is greater than that of the first elastic element (55).

7. The fully automatic SMT reflow soldering and placement machine for integrated circuits according to claim 3, characterized in that, In the free state, the first elastic member (55) causes the lower surface of the suction cup (54) to be lower than the lower surface of the central suction column (53).

8. The fully automatic SMT reflow soldering and placement machine for integrated circuits according to claim 3, characterized in that, The feeding assembly (6) includes: A base (61) has a mounting groove (62) in the middle, and the mounting groove (62) is configured to limit the movement direction of the element; Two rotating wheels (63) are symmetrically arranged on the base (61); A conveyor belt (64) is driven between the two said rollers (63), and the upper surface of the conveyor belt (64) is configured as a load-bearing element; A motor (65) is driven to one of the wheels (63) for driving the wheel (63) to rotate.

9. The fully automatic SMT reflow soldering and placement machine for integrated circuits according to claim 3, characterized in that, The space adjustment components include a longitudinal adjustment component (2), a lateral adjustment component, and a vertical adjustment component (4).

10. A fully automated SMT reflow soldering and placement process for integrated circuits, comprising using a fully automated SMT reflow soldering and placement machine for integrated circuits as described in any one of claims 3 to 9, characterized in that, include: S1. The component is transported to the picking station using the feeding assembly (6); S2. Use the space adjustment component to drive the adsorption component (5) to move above the picking station, and drive the adsorption component (5) to move down so that the suction cup (54) and the central suction column (53) contact the element in sequence, and make the upper surface of the element close to the lower surface of the positioning rod (57). S3. The positional deviation of the element relative to the suction cup (54) and the size of the element are obtained by using the pressure sensors on each of the positioning rods (57); S4. When the position deviation is within the first deviation threshold range, or when the size is within the first size threshold range, the central suction column (53) assists in adsorbing and picking up the element; when the position deviation is within the second deviation threshold range, or when the size is within the second size threshold range, the gripper (51) assists in clamping and picking up the element. S5. Using the space adjustment component, drive the adsorption component (5) together with the picked-up element to the pad position of the printed circuit board and release the element.

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