Display panel and preparation method thereof

Abstract

Embodiments of the present application provide a display panel and a preparation method thereof. The display panel comprises a display area, an opening area and an isolation area between the two. The display panel further comprises: a substrate; a barrier layer arranged in the isolation area, comprising a first barrier layer and a second barrier layer arranged in sequence in a direction away from the substrate, wherein the first barrier layer comprises at least one first groove, and the second barrier layer comprises at least one first opening, and the first opening exposes part of the first groove. By the size difference between the first groove and the first opening, the present application can effectively prevent the spread of water vapor and oxygen from the opening area to the display area when the common layer is broken in the isolation area, thereby improving the reliability of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel and its manufacturing method. Background Technology

[0002] Organic light-emitting diode (OLED) displays are widely used due to their advantages such as rich colors, fast response time, and foldability. OLED display devices include tandem devices. By setting stacked light-emitting layers in tandem devices, the lifespan and brightness of the light-emitting devices are improved, and power consumption is reduced to meet users' requirements for display device lifespan, power consumption, and good display quality. Summary of the Invention

[0003] This application provides a display panel and a method for manufacturing the same, in order to address the shortcomings of related technologies.

[0004] According to a first aspect of the embodiments of this application, a display panel is provided, the display panel including: a display area, an opening area and an isolation area, the isolation area being located between the display area and the opening area, and at least partially surrounding the opening area;

[0005] The display panel also includes: Substrate; A barrier layer is disposed in the isolation region, the barrier layer comprising a first barrier layer and a second barrier layer sequentially stacked along a direction away from the substrate. The first barrier layer includes at least one first groove, and the second barrier layer includes at least one first opening, the first opening exposing a portion of the first groove.

[0006] In one possible implementation, the display panel further includes: Multiple isolation pillars are disposed on one side of the substrate and located in the isolation area, and the isolation pillars are disposed around the opening area; each isolation pillar includes a first surface close to the substrate and a second surface away from the substrate, and the orthographic projection of the first surface is within the orthographic projection range of the second surface along the thickness direction of the substrate. The barrier layer is disposed between some of the isolation pillars. The first barrier layer includes at least one first barrier unit, which is disposed between two adjacent isolation pillars. The first barrier unit covers the isolation area within the opening between the two adjacent isolation pillars and the opposing sides of the two adjacent isolation pillars, and partially covers the surfaces of the two adjacent isolation pillars away from the substrate. The second barrier layer includes at least one second barrier unit, which is disposed on the side of the first barrier unit away from the substrate. The first barrier unit includes at least one first groove, and the second barrier unit includes at least one first opening. The orthographic projection of the first opening is located within the orthographic projection range of the first groove along the thickness direction of the substrate. In one possible implementation, the display panel further includes: A first electrode layer is disposed on one side of the substrate and located in the display area, and the first electrode layer includes a plurality of first electrodes arranged in an array; A pixel definition layer is disposed on one side of the substrate and located in the display area. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. Each first electrode is exposed through the pixel opening. The pixel definition layer also includes a plurality of second grooves. The orthographic projection of the plurality of second grooves on the substrate is located around the orthographic projection of the pixel opening on the substrate, and each second groove is spaced apart from each other. A light-emitting functional layer is disposed on the side of the pixel definition layer away from the substrate and located in the display area and the isolation area, and the light-emitting functional layer is disconnected at least at the first opening position; a second electrode layer is disposed on the side of the light-emitting functional layer away from the substrate, and the second electrode layer is disconnected at least at the first opening position.

[0007] In one possible implementation, along the thickness direction of the substrate, the orthographic projection of the second barrier layer is located within the orthographic projection range of the first barrier layer; along the direction away from the substrate, the first barrier layer includes a first barrier sub-part and a second barrier sub-part stacked together, the second barrier sub-part including at least one second opening, the second opening and the first barrier sub-part enclosing each other to form the first groove; in the direction perpendicular to the substrate, the orthographic projection of the second barrier sub-part is located within the orthographic projection range of the second barrier layer.

[0008] In one possible implementation, the first blocking sub-part includes at least one sub-groove that communicates with the second opening to form the first groove.

[0009] In one possible implementation, the display panel includes a plurality of isolation units, each isolation unit including two adjacent isolation pillars and a first blocking unit and a second blocking unit disposed between the two adjacent isolation pillars, and at least one isolation pillar is disposed between two adjacent isolation units.

[0010] In one possible implementation, the isolation pillar includes a first isolation portion and a second isolation portion stacked sequentially in a direction away from the substrate, the edge of the second isolation portion protruding relative to the edge of the first isolation portion, and both the first isolation portion and the second isolation portion are made of conductive materials.

[0011] In one possible implementation, the first isolation portion and the second isolation portion are made of different materials, and the etching rate of the material of the first isolation portion is greater than the etching rate of the material of the second isolation portion.

[0012] In one possible implementation, the isolation pillar further includes a third isolation portion in a direction away from the substrate, the third isolation portion being located between the first isolation portion and the substrate, the edge of the first isolation portion being recessed inward relative to the edges of the second isolation portion and the third isolation portion, and the first isolation portion, the second isolation portion and the third isolation portion being made of conductive materials.

[0013] In one possible implementation, the second isolation portion and the third isolation portion are made of the same material, the first isolation portion is made of a different material than both the second and third isolation portions, and the etching rate of the material of the first isolation portion is greater than the etching rate of the materials of the second and third isolation portions.

[0014] A second aspect of this application provides a method for manufacturing a display panel, used to manufacture the display panel in any embodiment of the first aspect described above. The display panel includes: a display area, an opening area, and an isolation area, wherein the isolation area is located between the display area and the opening area, and at least partially surrounds the opening area; the manufacturing method includes the following steps: Provide substrates; A barrier layer is formed on one side of the substrate and in the isolation region. The barrier layer includes a first barrier layer and a second barrier layer stacked sequentially in a direction away from the substrate. The first barrier layer includes at least one first groove, and the second barrier layer includes at least one first opening, the first opening exposing a portion of the first groove.

[0015] In one possible implementation, before forming a barrier layer on one side of the substrate and in the isolation region, the method further includes: forming a plurality of isolation pillar transition structures on one side of the substrate and in the isolation region, the isolation pillar transition structures surrounding the opening region; The step of forming a barrier layer on one side of the substrate and in the isolation region includes: forming a barrier layer between a portion of the isolation pillar transition structures, the barrier layer being disposed between the isolation pillar transition structures, the first barrier layer including at least one first barrier unit, the first barrier unit being disposed between two adjacent isolation pillar transition structures, the first barrier unit covering the isolation region within the opening between the two adjacent isolation pillar transition structures on opposite sides of the two adjacent isolation pillar transition structures, and partially covering the surfaces of the two adjacent isolation pillar transition structures away from the substrate; the second barrier layer including at least one second barrier unit, the second barrier unit being disposed on the side of the first barrier unit away from the substrate; wherein, the first barrier unit includes at least one first groove, the second barrier unit includes at least one first opening, and the orthographic projection of the first opening is located within the orthographic projection range of the first groove along the thickness direction of the substrate; After forming a barrier layer on one side of the substrate and in the isolation region, the method further includes: etching the sidewall of the isolation pillar transition structure that is not covered by the barrier layer to form an isolation pillar, wherein the isolation pillar includes a first surface close to the substrate and a second surface away from the substrate, and the orthographic projection of the first surface is within the orthographic projection range of the second surface along the thickness direction of the substrate.

[0016] In one possible implementation, the step of forming a barrier layer between portions of the isolation pillar transition structure includes: A first barrier material layer is formed between the plurality of isolation pillar transition structures. The first barrier material layer includes at least one first barrier unit material layer. The first barrier unit material layer is disposed between two adjacent isolation pillar transition structures. The first barrier unit material layer covers the opposite sides of the two adjacent isolation pillar transition structures, the isolation area in the opening between the two adjacent isolation pillar transition structures, and partially covers the surface of the two adjacent isolation pillar transition structures away from the substrate. A second barrier layer is formed on the side of the first barrier material layer away from the substrate. A first groove is formed on the side of the first barrier unit material layer away from the substrate, and the first barrier material layer with the first groove forms the first barrier layer.

[0017] In one possible implementation, after forming the second barrier layer on the side of the first barrier material layer away from the substrate, the method further includes: forming a pixel definition layer on one side of the substrate and located in the display area, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion; the pixel definition layer also includes a plurality of second grooves, the orthographic projection of the plurality of second grooves on the substrate being located around the orthographic projection of the pixel opening on the substrate, and each of the second grooves being spaced apart from each other; wherein the first groove and the second groove are formed in the same process.

[0018] In summary, compared with the prior art, the display panel and its manufacturing method provided in this application provide a first barrier layer with a first groove and a second barrier layer with a first opening in the isolation area. By using the size difference between the first groove and the first opening, the common layer can be separated at the edge of the first opening of the second barrier layer during subsequent fabrication of the common layer. This can effectively prevent water vapor and oxygen from spreading from the opening area to the display area, thereby improving the reliability of the display panel. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is one of the structural schematic diagrams of a display panel provided in an embodiment of this application.

[0021] Figure 2 This is a second schematic diagram of the structure of a display panel provided in an embodiment of this application.

[0022] Figure 3 This is the third schematic diagram of the structure of a display panel provided in an embodiment of this application.

[0023] Figure 4 This is the fourth schematic diagram of the structure of a display panel provided in an embodiment of this application.

[0024] Figure 5 This is the fifth schematic diagram of the structure of a display panel provided in an embodiment of this application.

[0025] Figure 6 This is the sixth schematic diagram of a display panel provided in an embodiment of this application.

[0026] Figure 7 for Figure 5An enlarged view of the first region shown.

[0027] Figure 8 This is one of the flowcharts for a method of manufacturing a display panel provided in an embodiment of this application.

[0028] Figure 9 This is a second flowchart illustrating a method for manufacturing a display panel, as provided in an embodiment of this application.

[0029] Figure 10 for Figure 9 The preparation flow chart corresponding to step S021.

[0030] Figure 11 for Figure 9 The preparation process diagram corresponding to step S021.

[0031] Figure 12 for Figure 10 The process diagram for the part following step S0212.

[0032] Explanation of reference numerals: 10, Substrate; 101, Display area; 102, Isolation area; 103, Opening area; 11, Isolation pillar; 11a, First surface; 11b, Second surface; 111, First isolation portion; 112, Second isolation portion; 113, Third isolation portion; 11', Isolation pillar transition structure; 12, Barrier layer; 121, First barrier layer; 121a, First barrier sub-part; 1211a, Sub-groove; 121b, Second barrier sub-part; 1211b, Second opening; 121', First barrier material layer; 1211, Third... A blocking unit; 1211', first blocking unit material layer; 12111, first groove; 122, second blocking layer; 1221, second blocking unit; 12211, first opening; 13, isolation unit; 14, first electrode layer; 141, first electrode; 15, pixel definition layer; 151, pixel limiting part; 152, pixel opening; 153, second groove; 16, light-emitting functional layer; 17, second electrode layer; 18, photoresist layer; 181, first photoresist opening; 182, second photoresist opening; A1, first region. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0038] In the fabrication of OLED display panels, the design of the isolation zone between the aperture areas (such as camera holes and sensor holes) and the display area is one of the key factors affecting product reliability. External moisture and oxygen can easily penetrate into the display panel from the edges of the aperture areas, spreading along the light-emitting functional layer towards the display area, leading to corrosion of the light-emitting devices, the formation of black spots, or even complete failure. Especially in Tandem OLED devices, due to the high driving voltage, carriers in the common functional layer are prone to lateral drift, causing lateral leakage and color crosstalk between adjacent pixels, further exacerbating the difficulty of isolation zone design.

[0039] To address the aforementioned water and oxygen intrusion issues, existing technologies typically employ isolation pillar structures within the isolation zone and form a barrier layer pattern around these pillars using an additional photolithography process. However, this approach requires an additional masking process to protect the film layer in the display area during barrier layer pattern formation, which not only increases manufacturing costs but also extends the production cycle.

[0040] In view of this, this embodiment provides a display panel and its fabrication method, aiming to effectively solve the problems of water and oxygen intrusion and carrier lateral leakage without adding a masking process. Please refer to... Figure 1This embodiment provides a display panel. The display panel includes a display area 101, an opening area 103, and an isolation area 102 located between the display area 101 and the opening area 103. The isolation area 102 is at least partially surrounding the opening area 103. In this embodiment, the opening area 103 can be used to house functional components such as cameras and sensors to enable the display panel to take pictures or perform other sensing functions, thereby improving the screen-to-body ratio of the display panel. The isolation area 102, as a transition area between the opening area 103 and the display area 101, is mainly used to prevent water and oxygen from entering the display area 101 from the opening area 103.

[0041] The display panel includes a substrate 10 and a barrier layer 12. The barrier layer 12 includes a first barrier layer 121 and a second barrier layer 122 stacked sequentially in a direction away from the substrate 10. The first barrier layer 121 includes a first groove 12111, and the second barrier layer 122 includes at least one first opening 12211, which exposes a portion of the first groove 12111.

[0042] In this embodiment, by utilizing the size difference between the first groove 12111 and the first opening 12211, the common layer can be separated at the edge of the first opening 12211 of the second barrier layer 122 during subsequent fabrication of the common layer. This effectively prevents moisture and oxygen from spreading from the opening area 103 to the display area 101, thereby improving the reliability of the display panel.

[0043] Please see Figures 2 to 6 The display panel also includes a plurality of isolation pillars 11. A plurality of isolation pillars 11 are provided in the isolation area 102, and the isolation pillars 11 are arranged around the opening area 103. The isolation pillars 11 include a first surface 11a close to the substrate 10 and a second surface 11b away from the substrate 10, and in the thickness direction along the substrate 10, the orthographic projection of the first surface 11a is located within the orthographic projection range of the second surface 11b. A barrier layer 12 is provided between some of the isolation pillars 11. The barrier layer 12 includes a first barrier layer 121 and a second barrier layer 122 stacked sequentially along the direction away from the substrate 10. The first barrier layer 121 includes at least one first barrier unit 1211. The first barrier unit 1211 is disposed between two adjacent isolation pillars 11 and covers the opposite side surfaces and part of the top surface of the two adjacent isolation pillars 11. The first barrier unit 1211 includes at least one first groove 12111. The second barrier layer 122 includes at least one second barrier unit 1221. The second barrier unit 1221 is disposed on the side of the first barrier unit 1211 away from the substrate 10 and includes at least one first opening 12211. In the thickness direction along the substrate 10, the orthographic projection of the first opening 12211 is located within the orthographic projection range of the first groove 12111.

[0044] Because external moisture and oxygen can enter the display panel through the opening area 103, and the light-emitting functional layer and the second electrode layer that will be vapor-deposited across the entire surface of the display area 101 and the opening area 103 in subsequent processes will also extend into the opening area 103. In order to prevent moisture and oxygen from spreading from the opening area 103 to the light-emitting functional layer subsequently formed in the display area 101, and to prevent the second electrode layer subsequently vapor-deposited across the entire surface from forming a continuous lateral conductive path in the isolation area 102 (which would conduct electrostatic charges near the opening area 103 to the display area 101), an isolation area 102 is provided between the opening area 103 and the display area 101, and an isolation pillar 11 and a barrier layer 12 are provided in the isolation area 102.

[0045] In some embodiments, the cross-sectional shape of the isolation pillar 11 in the direction perpendicular to the substrate 10 is "I" or "T" shaped, and the recessed structure formed by the first opening 12211 in the barrier layer 12 exposing part of the first groove 12111 together constructs a multi-level physical barrier defense line within the isolation region 102. When the light-emitting functional layer and the second electrode layer are subsequently formed using a full-surface vapor deposition process, the aforementioned film layer will undergo multiple natural fractures as it climbs over the side of the isolation pillar 11 and the step at the junction of the first groove 12111 and the first opening 12211. After the light-emitting functional layer and the second electrode layer are isolated, the water vapor and oxygen entering from the opening region 102 can only spread along the light-emitting functional layer extending to the opening region 102 to the light-emitting functional layer located in the isolation region 102, and cannot continue to extend to the light-emitting functional layer located in the display region 101; at the same time, the electrostatic charge accumulated near the opening region 102 cannot propagate to the display region 101 along the continuous second electrode layer. Thus, the isolation column 11 and the barrier layer 12 work together to isolate water vapor and oxygen.

[0046] Specifically, the substrate 10 can provide buffering, protection, or support for the display panel. The substrate 10 can be a flexible substrate, made of materials such as polyimide (PI), polyethylene naphthalate (PEN), or polyethylene terephthalate (PET), or a mixture of these materials. The substrate 10 can also be a rigid substrate formed from materials such as glass. In some embodiments of this application, the substrate 10 may include a substrate, a driving circuit layer, and a planarization layer (not shown) stacked sequentially, wherein the driving circuit layer drives the light-emitting functional layer to emit light, and the planarization layer provides a flat surface.

[0047] Multiple isolation pillars 11 are disposed on one side of the substrate 10 and located in the isolation region 102. The isolation pillars 11 are disposed around the opening region 103. In this application, the isolation pillars 11 are used to physically isolate common layers such as light-emitting functional layers or second electrode layers that are subsequently deposited across the entire surface of the display panel, and at the same time serve as a physical barrier to prevent the lateral penetration of water and oxygen. Please continue reading Figures 2 to 6 In the thickness direction of the substrate 10, at least some of the isolation pillars 11 have an "I" or "T" shaped cross section. This special shape allows the isolation pillars 11 to form an "eaves" or "undercut" structure, thereby effectively interrupting the continuous film layer above.

[0048] In some embodiments, in a direction away from the substrate 10, the isolation pillar 11 includes a first isolation portion 111 and a second isolation portion 112 stacked sequentially. For example... Figure 4 As shown, the first isolation portion 111 is disposed close to the substrate 10, and the second isolation portion 112 is located on the side of the first isolation portion 111 away from the substrate 10. The edge of the second isolation portion 112 protrudes relative to the edge of the first isolation portion 111. In this embodiment, both the first isolation portion 111 and the second isolation portion 112 are made of conductive materials, such as metallic materials molybdenum (Mo), titanium (Ti), or aluminum (Al).

[0049] Optionally, the materials of the first isolation portion 111 and the second isolation portion 112 are different, and the etching rate of the material of the second isolation portion 112 is lower than the etching rate of the material of the first isolation portion 111. It is understood that the etching rate of the material of the second isolation portion 112 is lower than the etching rate of the material of the first isolation portion 111, as mentioned above, is provided that the same etching solution is used.

[0050] By setting a first isolation part 111 and a second isolation part 112 made of different materials, and the etching rate of the material of the second isolation part 112 is less than the etching rate of the material of the first isolation part 111, the isolation pillar 11 can be formed into a "T" shaped structure in the longitudinal section through the etching process.

[0051] For example, each side of the second isolation portion 112 protrudes outward uniformly by 1 µm to 4 µm relative to the first isolation portion 111. For example, it can be 1 µm, 2 µm, 3 µm or 4 µm.

[0052] Since different materials have different etching rates in the same etching solution, by setting the first isolation part 111 and the second isolation part 112 to be made of different materials, and the etching rate of the material of the second isolation part 112 is less than the etching rate of the material of the first isolation part 111, the required protrusion can be formed by using etching solution and controlling etching time when the isolation pillar 11 is manufactured.

[0053] For example, the first isolation portion 111 can be made of aluminum (Al), and the second isolation portion 112 can be made of molybdenum (Mo). Alternatively, the first isolation portion 111 can be made of aluminum (Al), and the second isolation portion 112 can be made of titanium (Ti). By selecting the above material combination, during wet etching, the etching rate of the aluminum (Al) layer is significantly faster than that of the titanium (Ti) layer or the molybdenum (Mo) layer, thereby forming a uniform lateral inward contraction at the aluminum layer location. This causes the edge of the second isolation portion 112 to protrude relative to the edge of the first isolation portion 111, thus forming a T-shaped cross-sectional structure. The protruding edge of this T-shaped structure can act as a physical "eaves," effectively interrupting the continuity of subsequent full-surface vapor-deposited common film layers (such as cathode layers).

[0054] Furthermore, in some other embodiments, the isolation pillar 11 includes a first isolation portion 111, a second isolation portion 112, and a third isolation portion 113 stacked sequentially in a direction away from the substrate 10. For example... Figure 2 and Figure 3 As shown, the third isolation portion 113 is disposed close to the substrate 10, the first isolation portion 111 is located on the side of the third isolation portion 113 away from the substrate 10, and the second isolation portion 112 is located on the side of the first isolation portion 111 away from the substrate 10. The edge of the first isolation portion 111 is recessed inward relative to the edges of the second isolation portion 112 and the third isolation portion 113. In this embodiment, the first isolation portion 111, the second isolation portion 112, and the third isolation portion 113 are all made of conductive materials, such as metallic materials molybdenum (Mo), titanium (Ti), or aluminum (Al).

[0055] Optionally, the second isolation portion 112 and the third isolation portion 113 are made of the same material, while the first isolation portion 111 is made of a different material than the second isolation portion 112 and the third isolation portion 113. The etching rate of the material of the first isolation portion 111 is greater than that of the materials of the second isolation portion 112 and the third isolation portion 113. This means that, compared to the above, the etching rate of the material of the first isolation portion 111 is greater than that of the materials of the second isolation portion 112 and the third isolation portion 113, provided that the same etching solution is used.

[0056] By setting a second isolation section 112 and a third isolation section 113 made of the same material, and a first isolation section 111 made of a different material than the second isolation section 112 and the third isolation section 113, the isolation pillar 11 can be formed into a structure with an "I" shaped longitudinal section by etching process.

[0057] For example, each side of the first isolation portion 111 is recessed inward by 1µm to 4µm relative to the second isolation portion 112 and the third isolation portion 113. For example, it can be 1µm, 2µm, 3µm or 4µm.

[0058] Since different materials have different etching rates in the same etching solution, by setting the second isolation section 112 and the third isolation section 113 to be made of the same material, and the first isolation section 111 to be made of a different material than the second isolation section 112 and the third isolation section 113, and the etching rate of the material of the first isolation section 111 is greater than the etching rate of the materials of the second isolation section 112 and the third isolation section 113, the required indentation can be formed by using etching solution and controlling etching time when manufacturing the isolation pillar 11.

[0059] For example, the second isolation portion 112 and the third isolation portion 113 can be made of titanium (Ti), and the first isolation portion 111 can be made of aluminum (Al).

[0060] Compared to the aforementioned "T"-shaped isolation pillars that only include a first isolation section 111 and a second isolation section 112, the "I"-shaped isolation pillar 11 of this embodiment has a two-part "eaves" structure, allowing the common film layer to undergo two physical fractures during the climbing process. Even if one fracture results in a weak connection due to process fluctuations, the other fracture can still effectively isolate the film, thus providing higher failure redundancy and isolation reliability. In contrast, the T-shaped isolation pillar relies on a single fracture, which carries the risk of leakage due to etching fluctuations.

[0061] Please continue reading. Figure 2 and Figure 3 A barrier layer 12 is disposed between a portion of the isolation pillars 11. The barrier layer 12 includes a first barrier layer 121 and a second barrier layer 122 sequentially stacked along a direction away from the substrate 10. The first barrier layer 121 includes at least one first barrier unit 1211. The first barrier unit 1211 is disposed between two adjacent isolation pillars 11 and covers the opposing sides of the two adjacent isolation pillars 11, the surface of the isolation region 102 within the opening between the two adjacent isolation pillars 11, and also partially covers the surfaces of the two adjacent isolation pillars 11 away from the substrate 10. The second barrier layer 122 includes at least one second barrier unit 1221. The second barrier unit 1221 is disposed on the side of the first barrier unit 1211 away from the substrate 10.

[0062] Specifically, the first blocking unit 1211 includes at least one first groove 12111. The second blocking unit 1221 includes at least one first opening 12211. The first opening 12211 exposes a portion of the first groove 12111. That is, in the thickness direction of the substrate 10, the orthographic projection of the first opening 12211 lies within the orthographic projection range of the first groove 12111. This "exposed" relationship is crucial for forming the undercut structure. The opening edge of the second blocking unit 1221 is recessed in the horizontal direction relative to the sidewall of the first groove 12111, that is, the boundary of the first opening 12211 lies within the boundary range of the first groove 12111. During subsequent deposition of common layers such as the second electrode layer, this recessed structure causes the common film layer to naturally break at the step edge, thereby forming a physical barrier.

[0063] It is understood that there can be multiple first openings 12211 and multiple first grooves 12111, with each first opening 12211 corresponding to a first groove 12111. Each additional first opening 12211 and its corresponding first groove 12111 is equivalent to adding a barrier formed by an inwardly recessed edge to the film layer stacking structure. When the common film layer climbs over the morphology defined by the isolation pillar 11 and the barrier layer 12, each combination of the first opening 12211 and the first groove 12111 will independently cause the common film layer to break once. Therefore, by setting multiple first openings 12211 and multiple first grooves 12111, multiple physical barriers can be formed within the limited isolation area 102 space. Even if one of the barriers fails to completely break due to process fluctuations, the remaining barriers can still effectively block the continuity of the common film layer, thereby further improving the barrier redundancy and long-term reliability of the display panel around the opening area 103.

[0064] See Figure 5 and Figure 7 In this embodiment, the display panel further includes: a first electrode layer 14, a pixel definition layer 15, a light-emitting functional layer 16, and a second electrode layer 17.

[0065] Specifically, a first electrode layer 14 is disposed on one side of the substrate 10 and located in the display area 101. The first electrode layer 14 includes a plurality of first electrodes 141 arranged in an array, which can serve as the anode of an organic light-emitting diode. A pixel definition layer 15 is disposed on one side of the substrate 10 and located in the display area 101. The pixel definition layer 15 includes a pixel defining portion 151 and a plurality of pixel openings 152 formed by the pixel defining portion 151 to define the light-emitting area of ​​each sub-pixel, and each first electrode 141 is exposed through the pixel opening 152. A light-emitting functional layer 16 includes at least an organic light-emitting material layer, is disposed on the side of the pixel definition layer 15 away from the substrate 10 and located in the display area 101 and the isolation area 102, and the light-emitting functional layer 16 is disconnected at least at the location of the first opening 12211. A second electrode layer 17 serves as a common layer and is disposed on the side of the light-emitting functional layer 16 away from the substrate 10, and the second electrode layer 17 is disconnected at least at the location of the first opening 12211. In some embodiments of this application, the second electrode layer 17 can serve as the cathode of an organic light-emitting diode.

[0066] See Figure 7 , Figure 7 for Figure 5 An enlarged view of the first region A1. When the second electrode layer 17 is vapor-deposited across the entire surface, due to the presence of the aforementioned isolation pillars 11 with "I" or "T" shaped cross-sections and the barrier layer 12 with a first groove 12111 and a first opening 12211 within the isolation region 102, the second electrode layer 17 will naturally fracture at the sidewalls of the isolation pillars 11 and the undercut structure of the barrier layer 12. If water or oxygen attempts to penetrate from the edge of the opening region 103 along the film layer to the display region 101, it must also cross the isolation structure formed by the isolation pillars 11 and the barrier layer 12, thus its path is blocked and greatly extended. As a result, the reliability of the display panel, especially its resistance to water and oxygen erosion and its resistance to electrostatic breakdown around the opening region 103, is significantly improved.

[0067] Furthermore, the pixel definition layer 15 also includes a plurality of second grooves 153, the orthographic projections of which onto the substrate 10 are located around the orthographic projection of the pixel opening 152 onto the substrate 10, and the second grooves 153 are spaced apart from each other. See also... Figure 5 The second groove 153 is located on the side of the pixel defining portion 151 away from the substrate 10, and extends recessed toward the substrate 10 along the thickness direction of the pixel defining portion 151. The depth of the second groove 153 in the direction perpendicular to the substrate 10 can be set according to the size of the pixel defining portion 151. Optionally, the depth of the second groove 153 can be a fraction of the thickness of the pixel defining layer 15. ~ .

[0068] In OLED display panels, the common functional layers such as the electron transport layer or charge generation layer in the light-emitting functional layer 16 are typically continuous structures across the entire surface. When charge carriers are transported in these common functional layers, driven by the horizontal electric field component, they easily drift laterally from the current pixel area into adjacent pixel areas and undergo unintended recombination with the light-emitting layers of those adjacent pixel areas, resulting in inter-pixel lateral leakage current and causing color crosstalk. In this embodiment, the second groove 153 effectively increases the physical path length that charge carriers (such as holes or electrons) must traverse during lateral transport, suppressing the phenomenon of charge carriers drifting along the common functional layers (such as the electron transport layer or charge generation layer) to adjacent pixel areas. This effectively eliminates inter-pixel lateral leakage current, avoids color crosstalk, and improves the contrast and color purity of the display panel.

[0069] Please see Figure 6 In this embodiment, along the thickness direction of the substrate 10, the orthographic projection of the second barrier layer 122 lies within the orthographic projection range of the first barrier layer 121. Along a direction away from the substrate 10, the first barrier layer 121 includes a first barrier sub-part 121a and a second barrier sub-part 121b stacked together. The second barrier sub-part 121b includes at least one second opening 1211b, which, together with the first barrier sub-part 121a, forms a first groove 12111. In a direction perpendicular to the substrate 10, the orthographic projection of the second barrier sub-part 121b lies within the orthographic projection range of the second barrier layer 122. Optionally, the first barrier sub-part 121a includes at least one sub-groove 1211a, which communicates with the second opening 1211b to form the first groove 12111.

[0070] In this embodiment, the orthographic projection of the second blocking portion 121b is located within the orthographic projection range of the second blocking layer 122 in the direction perpendicular to the substrate 10. That is, the edge of the second blocking portion 121b is recessed inward relative to the second blocking layer 122. Based on the above structure, this embodiment forms a three-layer partition structure in the isolation region 102. The first partition is formed at the "I"-shaped or "T"-shaped protruding edge of the isolation pillar 11, causing the common layer deposited by vapor deposition to break for the first time at this point. The second partition is formed at the recessed edge of the second blocking portion 121b relative to the second blocking layer 122, causing the common layer to break for the second time at this point. The third partition is formed at the position of the first opening 12211 of the second blocking layer 122. Since the edge of the first opening 12211 of the second blocking layer 122 is recessed in the horizontal direction relative to the sidewall of the first groove 12111, that is, the boundary of the first opening 12211 is located within the boundary range of the first groove 12111. During subsequent deposition of the common layer, this inward-shrinking structure causes the common film layer to naturally fracture at the step edge, thus forming a third fracture. The above three partitions are arranged sequentially along the vertical direction and work together to block the diffusion path of water vapor and oxygen from the opening area 103 to the display area 101.

[0071] Please see Figure 3 In this embodiment, the display panel includes multiple isolation units 13. Each isolation unit 13 includes two adjacent isolation pillars 11 and a first blocking unit 1211 and a second blocking unit 1221 disposed between the two adjacent isolation pillars 11. At least one isolation pillar 11 is disposed between two adjacent isolation units 13. That is, the isolation unit 13 can be regarded as a set of blocking structures, which rely on the sidewalls and top surfaces provided by the two isolation pillars 11 to enable the first blocking unit 1211 and the second blocking unit 1221 disposed therebetween to form an effective groove-opening recessed partition. If two isolation units 13 are arranged consecutively (i.e., two adjacent isolation units 13 share one isolation pillar 11), although there is a groove-opening recessed partition composed of multiple first grooves 12111 and multiple first openings 12211, the first blocking unit 1211 fills the gap between the two adjacent isolation pillars 11, which is equivalent to eliminating the physical separation formed by the "I"-shaped structure or "T"-shaped structure of the isolation pillars 11. Therefore, at least one isolation column 11 must be provided between two adjacent isolation units 13, so that in the isolation area there is not only a recessed partition with an inward opening, but also a physical separation formed by the "I" or "T" shaped structure of the isolation column 11. This allows each line of defense to independently cause the common membrane layer to break, thereby significantly improving the redundancy and reliability of the isolation.

[0072] Please see Figures 8 to 11Based on the same inventive concept, this application also provides a method for preparing a display panel, which is used to prepare the display panel described in any of the foregoing embodiments.

[0073] See Figure 8 In this embodiment, the display panel includes a display area 101, an opening area 103, and an isolation area 102 located between the display area 101 and the opening area 103, the isolation area 102 surrounding at least a portion of the opening area 103. The method includes the following steps: S01: Provide a substrate 10.

[0074] The substrate 10 can be a flexible substrate or a rigid substrate, selected according to product requirements. The substrate 10 may include a substrate, a driving circuit layer and a planarization layer stacked sequentially, wherein the driving circuit layer is used to drive the light-emitting functional layer 16 to emit light, and the planarization layer is used to provide a flat surface.

[0075] S02: A barrier layer 12 is formed on one side of the substrate 10 and in the isolation region 102. The barrier layer 12 includes a first barrier layer 121 and a second barrier layer 122 sequentially stacked in a direction away from the substrate 10. The first barrier layer 121 includes at least one first groove 12111, and the second barrier layer 122 includes at least one first opening 12211, which exposes a portion of the first groove 12111. In this embodiment, the first opening 12211 formed in the second barrier layer 122 exposes a portion of the first groove 12111. This "exposed" relationship is key to forming the undercut structure. The opening edge of the second barrier unit 1221 is recessed in the horizontal direction relative to the sidewall of the first groove 12111, that is, the boundary of the first opening 12211 is within the boundary range of the first groove 12111. During subsequent deposition of common layers such as the second electrode layer, this recessed structure causes the common film layer to naturally break at the step edge, thereby forming a physical barrier. It can effectively prevent moisture and oxygen from spreading from the opening area 103 to the display area 101, thus improving the reliability of the display panel.

[0076] Please see Figure 9 , Figure 9 This is a flowchart illustrating another method for fabricating a display panel according to an embodiment of this application. In this embodiment, step S02a is included before step S02: forming a plurality of isolation pillar transition structures on one side of the substrate and located in the isolation region, the isolation pillar transition structures surrounding the opening region.

[0077] Specifically, the process for forming the isolation pillar transition structure 11' includes: sequentially depositing a first conductive material layer, a second conductive material layer, and a third conductive material layer on a substrate 10, and then patterning the conductive material layers through an etching process to form the isolation pillar transition structure 11' with a predetermined shape and size. In particular, the etching rates of the first and third conductive material layers are lower than the etching rate of the second conductive material layer. This means that the etching rates of the materials of the first and third conductive material layers are lower than the etching rate of the material of the second conductive material layer, provided that the same etching solution is used. Optionally, the materials of the first and third conductive material layers are the same, while the materials of the second conductive material layer are different from those of the first and third conductive material layers. The isolation pillar transition structure 11' corresponds to the initial shape of the final isolation pillar 11, which is subsequently formed with protruding edges through further etching.

[0078] In this embodiment, step S02 further includes step S021: forming a barrier layer 12 between the partial isolation pillar transition structures 11'. The barrier layer 12 is disposed between the isolation pillar transition structures 11'. The first barrier layer 121 includes at least one first barrier unit 1211. The first barrier unit 1211 is disposed between two adjacent isolation pillar transition structures 11'. The first barrier unit 1211 covers the opposite sides of the two adjacent isolation pillar transition structures 11' and the isolation area 102 within the opening between the two adjacent isolation pillar transition structures 11', and partially covers... The transition structure 11' between two adjacent isolation pillars is away from the surface of the substrate 10; the second barrier layer 122 includes at least one second barrier unit 1221, which is disposed on the side of the first barrier unit 1211 away from the substrate 10; wherein the first barrier unit 1211 includes at least one first groove 12111, and the second barrier unit 1221 includes at least one first opening 12211, and the orthographic projection of the first opening 12211 is located within the orthographic projection range of the first groove 12111 along the thickness direction of the substrate 10.

[0079] Specifically, please refer to Figure 10 and Figure 11 , Figure 10 This is the process flow diagram corresponding to step S021. Figure 11 This is the fabrication process diagram corresponding to step S021. In this embodiment, the step of forming the barrier layer 12 between the partial isolation pillar transition structures 11' includes: S0211: A first barrier material layer 121' is formed between multiple isolation pillar transition structures 11'. The first barrier material layer 121' includes at least one first barrier unit material layer 1211'. The first barrier unit material layer 1211' is disposed between two adjacent isolation pillar transition structures 11'. The first barrier unit material layer 1211' covers the opposite sides of the two adjacent isolation pillar transition structures 11', the isolation area 102 in the opening between the two adjacent isolation pillar transition structures 11', and partially covers the surface of the two adjacent isolation pillar transition structures 11' away from the substrate 10.

[0080] Specifically, the first barrier material layer 121' is made of organic material, such as photosensitive polyimide or photosensitive acrylic resin. The first barrier material layer 121' can be formed by a coating process, in which organic material is uniformly coated on the opposite sides of two adjacent isolation pillar transition structures 11', the isolation area 102 in the opening between two adjacent isolation pillar transition structures 11', and part of the surface of two adjacent isolation pillar transition structures 11' away from the substrate 10.

[0081] S0212: A second barrier layer 122 is formed on the side of the first barrier material layer 121' away from the substrate 10.

[0082] Specifically, the second barrier layer 122 is made of inorganic materials, such as silicon nitride or silicon oxide. Because the second barrier layer 122 is inorganic, its tolerance to dry etching gases is significantly higher than that of the organic first barrier layer 121'. Therefore, in subsequent dry etching processes, the second barrier layer 122 can maintain its morphological integrity and be etched only slightly or not at all. The second barrier layer 122 can be directly deposited to form a structure with a first opening 12211. When fabricating the second barrier layer 122, a mask with a preset opening pattern can be used. Through deposition methods such as evaporation, sputtering, or chemical vapor deposition, under the cover of the mask, the second barrier layer material is selectively deposited on the side of the first barrier layer away from the substrate, thereby directly forming the second barrier unit 1221 with the first opening 12211 during the deposition process. The outline and size of the first opening 12211 of the second barrier layer 122 thus formed are directly determined by the opening pattern of the mask, eliminating the need for additional photolithography and etching processes to pattern the second barrier layer after deposition. This method avoids potential damage to the first barrier layer 121 or surrounding film layers caused by etching processes, while simplifying the process flow and reducing manufacturing costs.

[0083] S0213: A first groove 12111 is formed on the side of the first barrier unit material layer 1211' away from the substrate 10, and the first barrier material layer 121' with the first groove 12111 forms the first barrier layer 121.

[0084] Specifically, the first barrier material layer 121' is dry-etched to form a first barrier layer 121 with a first groove 12111. During the dry etching process, because the second barrier layer 122 (inorganic material) has strong resistance to etching gas, its opening edge remains intact, while the first barrier layer 121 (organic material) is highly sensitive to etching gas and is simultaneously etched by the etching gas in both the lateral and longitudinal directions. Due to the isotropic etching characteristics of the dry etching gas on organic materials, the etching gas simultaneously etches downwards and laterally at the edge of the first opening 12211, causing the first groove 12111 to form a laterally extended region below the first opening 12211 of the second barrier layer 122, that is, the opening size of the first groove 12111 is larger than the opening size of the first opening 12211 of the second barrier layer 122. This size difference causes the edge of the first groove 12111 to protrude to both sides relative to the edge of the first opening 12211 of the second barrier layer 122, forming an undercut structure.

[0085] In this application, after forming a barrier layer 12 on one side of the substrate 10 and in the isolation region 102, the application further includes step S03: etching the sidewall of the isolation pillar transition structure 11' not covered by the barrier layer 12 to form an isolation pillar 11. The isolation pillar 11 includes a first surface 11a close to the substrate 10 and a second surface 11b away from the substrate 10. In the thickness direction along the substrate 10, the orthographic projection of the first surface 11a is within the orthographic projection range of the second surface 11b.

[0086] Optionally, at least a portion of the isolation pillars 11 have an "I" or "T" shaped cross-sectional pattern along the thickness direction of the substrate 10.

[0087] Specifically, a wet etching process is used to laterally etch the isolation pillar transition structure 11'. Utilizing the difference in etching rates between different conductive material layers, one layer shrinks laterally relative to another, thus forming a protruding edge structure. When the isolation pillar transition structure 11' includes a first conductive material layer, a second conductive material layer, and a third conductive material layer sequentially stacked along a direction away from the substrate 10, and the first and third conductive material layers are titanium layers and the second conductive layer is an aluminum layer, the aluminum layer has a faster etching rate, resulting in more lateral corrosion during wet etching. This causes the etched aluminum layer to recede inward relative to the titanium layer. By precisely controlling the etching time, etching temperature, and etching solution ratio, the length of the protruding edge can be adjusted to be within an optimal range.

[0088] In this embodiment, the cross-sectional shape of the isolation pillar 11 in the direction perpendicular to the substrate 10 is "I" or "T" shaped, and the recessed structure formed by the first opening 12211 exposing part of the first groove 12111 in the barrier layer 12, together with the isolation pillar 11, constructs a multi-level physical barrier defense line within the isolation area 102. When the light-emitting functional layer 16 and the second electrode layer 17 are subsequently formed using a full-surface evaporation process, the aforementioned film layer will undergo multiple natural fractures as it climbs over the side of the isolation pillar 11 and the step at the junction of the first groove 12111 and the first opening 12211. After the light-emitting functional layer 16 and the second electrode layer 17 are isolated, the water vapor and oxygen entering from the opening region 102 can only spread along the light-emitting functional layer 16 extending to the opening region 102 to the light-emitting functional layer 16 located in the isolation region 102, and cannot continue to extend to the light-emitting functional layer 16 located in the display region 101; at the same time, the electrostatic charge accumulated near the opening region 102 cannot propagate to the display region 101 along the discontinuous second electrode layer 17. Thus, the isolation pillar 11 and the barrier layer 12 together play the role of isolating water vapor and oxygen.

[0089] See Figure 12 In some embodiments of this application, after forming the second barrier layer 122 on the side of the first barrier material layer 121' away from the substrate 10, the method further includes: forming a pixel definition layer 15 on one side of the substrate 10 and located in the display area 101. The pixel definition layer 15 includes a pixel defining portion 151 and a pixel opening 152 formed by the pixel defining portion 151. The pixel definition layer 15 also includes a plurality of second grooves 153. The orthographic projection of the plurality of second grooves 153 on the substrate 10 is located around the orthographic projection of the pixel opening 152 on the substrate 10, and the second grooves 153 are spaced apart from each other. The first groove 12111 and the second groove 153 are formed in the same process.

[0090] Specifically, the first groove 12111 and the second groove 153 can be formed simultaneously in the same process as follows. First, a photoresist layer 18 is coated on the pixel definition layer 15 and the isolation region 102. This photoresist layer 18 covers the pixel definition layer 15 of the display area 101, the isolation pillars 102 and the isolation units 13 of the isolation region 102, and fills the gap between two adjacent isolation pillars 102. Next, a patterned opening is formed on the photoresist layer, which includes a first photoresist opening 181 located in the display area 101 and a second photoresist opening 182 located in the isolation region 102. The orthographic projection of the first photoresist opening 181 located in the display area 101 onto the substrate 10 is located around the orthographic projection of the pixel opening 152 onto the substrate 10, and the first photoresist openings 181 located on different sides of the first electrode 141 are spaced apart from each other to define the position of the second groove 153. The orthographic projection of the second photoresist opening 182 located in the isolation region 102 onto the substrate 10 corresponds to the position of the first opening 12211 of the second barrier layer 122, and is used to expose the first opening 12211 and the first barrier material layer 121' below it.

[0091] Then, the pixel defining portion 151 exposed at the first photoresist opening 181 and the first barrier material layer 121' exposed through the second photoresist opening 182 are simultaneously dry etched. During the etching process, the etching gas etches the pixel defining portion 151 exposed in the display area 101 to form the second groove 153; on the other hand, the etching gas enters below through the second photoresist opening 182 and the first opening 12211 of the second barrier layer 122 to isotropically etch the first barrier material layer 121' to form the first groove 12111. Since the second barrier layer 122 is an inorganic material, it has strong resistance to dry etching gas and maintains stable morphology during the etching process. At this time, the photoresist layer 18 covering the surface of the pixel defining layer 15 of the display area 101 protects the film layers in the display area 101 (such as the first electrode 141 and the areas in the pixel defining layer 15 that do not need to be etched). The photoresist layer 18 is equivalent to a mask used in the prior art to protect the film layer of the display area 101 when forming the barrier layer pattern. However, this application integrates the first groove 12111 and the second groove 153 into the same process, so that the patterning of the barrier layer 12 of the isolation area 102, which originally required an additional mask process, is combined with the formation process of the second groove 153 of the display area 101 into one process. Thus, while forming the second groove 153, the etching of the first groove 12111 can be completed simultaneously without adding a mask.

[0092] For example, a second groove 153 can be formed by etching the portion of the pixel definition portion 151 exposed at the opening of the photoresist layer using gaseous plasma (e.g., O2 plasma), and a first groove 12111 can be formed by etching the first barrier unit material layer 1211' exposed at the first opening 12211.

[0093] This embodiment of the application simultaneously forms the first groove 12111 and the second groove 153 without requiring additional masking processes, reducing process steps and manufacturing costs. Simultaneously, it effectively solves the problems of water and oxygen intrusion and lateral carrier leakage, improving the reliability of the display panel.

[0094] In summary, the display panel and its fabrication method provided in this application include a display area, an aperture area, and an isolation area located between the two. A barrier layer is disposed in the isolation area, comprising a first barrier layer and a second barrier layer stacked sequentially along the direction away from the substrate. The first barrier layer has a first groove, and the second barrier layer has a first opening, with the first opening exposing a portion of the first groove. Since moisture and oxygen can easily penetrate from the aperture area, leading to device failure, the embodiments provided in this application, through the size difference between the first groove and the first opening, can isolate the common layer at the edge of the first opening of the second barrier layer during subsequent fabrication of the common layer. This effectively prevents moisture and oxygen from spreading from the aperture area to the display area, improving the reliability of the display panel. Furthermore, the embodiments of this application also provide a solution to the problem in the prior art where an additional mask process is required to protect the display area during the formation of the barrier layer pattern, increasing manufacturing costs and process complexity. While effectively preventing moisture intrusion and lateral carrier leakage, this solution also reduces one mask process, lowering the fabrication cost.

[0095] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0096] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: A display area, an opening area, and an isolation area, wherein the isolation area is located between the display area and the opening area, and at least partially surrounds the opening area; The display panel also includes: Substrate; A barrier layer is disposed in the isolation region, the barrier layer comprising a first barrier layer and a second barrier layer sequentially stacked along a direction away from the substrate. The first barrier layer includes at least one first groove, and the second barrier layer includes at least one first opening, the first opening exposing a portion of the first groove.

2. The display panel according to claim 1, characterized in that, The display panel also includes: Multiple isolation pillars are disposed on one side of the substrate and located in the isolation area, and the isolation pillars are disposed around the opening area; each isolation pillar includes a first surface close to the substrate and a second surface away from the substrate, and the orthographic projection of the first surface is within the orthographic projection range of the second surface along the thickness direction of the substrate. The barrier layer is disposed between some of the isolation pillars. The first barrier layer includes at least one first barrier unit, which is disposed between two adjacent isolation pillars. The first barrier unit covers the isolation area within the opening between the two adjacent isolation pillars and the opposite sides of the two adjacent isolation pillars, and partially covers the surfaces of the two adjacent isolation pillars away from the substrate. The second barrier layer includes at least one second barrier unit, which is disposed on the side of the first barrier unit away from the substrate. The first barrier unit includes at least one first groove, and the second barrier unit includes at least one first opening. The orthographic projection of the first opening is located within the orthographic projection range of the first groove along the thickness direction of the substrate.

3. The display panel according to claim 1, characterized in that, The display panel also includes: A first electrode layer is disposed on one side of the substrate and located in the display area, and the first electrode layer includes a plurality of first electrodes arranged in an array; A pixel definition layer is disposed on one side of the substrate and located in the display area. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. Each first electrode is exposed through the pixel opening. The pixel definition layer also includes a plurality of second grooves. The orthographic projection of the plurality of second grooves on the substrate is located around the orthographic projection of the pixel opening on the substrate, and each second groove is spaced apart from each other. A light-emitting functional layer is disposed on the side of the pixel definition layer away from the substrate and located in the display area and the isolation area, and the light-emitting functional layer is disconnected at least at the first opening position; The second electrode layer is disposed on the side of the light-emitting functional layer away from the substrate, and the second electrode layer is disconnected at least at the first opening position.

4. The display panel according to claim 1 or 2, characterized in that, Along the thickness direction of the substrate, the orthographic projection of the second barrier layer is located within the orthographic projection range of the first barrier layer; along the direction away from the substrate, the first barrier layer includes a first barrier sub-part and a second barrier sub-part stacked together, the second barrier sub-part including at least one second opening, the second opening and the first barrier sub-part surrounding to form the first groove; in the direction perpendicular to the substrate, the orthographic projection of the second barrier sub-part is located within the orthographic projection range of the second barrier layer. Preferably, the first blocking sub-part includes at least one sub-groove, which communicates with the second opening to form the first groove.

5. The display panel according to claim 2, characterized in that, The display panel includes multiple isolation units, each isolation unit including two adjacent isolation pillars and a first blocking unit and a second blocking unit disposed between the two adjacent isolation pillars, and at least one isolation pillar is disposed between two adjacent isolation units.

6. The display panel according to claim 2, characterized in that, Along a direction away from the substrate, the isolation pillar includes a first isolation portion and a second isolation portion stacked in sequence, the edge of the second isolation portion protruding relative to the edge of the first isolation portion, and both the first isolation portion and the second isolation portion are made of conductive materials; Preferably, the first isolation portion and the second isolation portion are made of different materials, and the etching rate of the material of the first isolation portion is greater than the etching rate of the material of the second isolation portion; Preferably, the isolation pillar further includes a third isolation portion located between the first isolation portion and the substrate, wherein the edge of the first isolation portion is recessed inward relative to the edges of the second isolation portion and the third isolation portion, and the materials of the first isolation portion, the second isolation portion and the third isolation portion are all conductive materials; Preferably, the second isolation portion and the third isolation portion are made of the same material, the first isolation portion is made of a different material than both the second and third isolation portions, and the etching rate of the material of the first isolation portion is greater than the etching rate of the materials of the second and third isolation portions.

7. A method for manufacturing a display panel, characterized in that, The display panel includes: a display area, an opening area, and an isolation area, wherein the isolation area is located between the display area and the opening area, and at least partially surrounds the opening area; the manufacturing method includes: Provide substrates; A barrier layer is formed on one side of the substrate and in the isolation region. The barrier layer includes a first barrier layer and a second barrier layer stacked sequentially in a direction away from the substrate. The first barrier layer includes at least one first groove, and the second barrier layer includes at least one first opening, the first opening exposing a portion of the first groove.

8. The preparation method according to claim 7, characterized in that, Before forming a barrier layer on one side of the substrate and in the isolation region, the method further includes: forming a plurality of isolation pillar transition structures on one side of the substrate and in the isolation region, the isolation pillar transition structures surrounding the opening region; The step of forming a barrier layer on one side of the substrate and in the isolation region includes: forming a barrier layer between a portion of the isolation pillar transition structures, the barrier layer being disposed between the isolation pillar transition structures, the first barrier layer including at least one first barrier unit, the first barrier unit being disposed between two adjacent isolation pillar transition structures, the first barrier unit covering the isolation region within the opening between the two adjacent isolation pillar transition structures on opposite sides of the two adjacent isolation pillar transition structures, and partially covering the surfaces of the two adjacent isolation pillar transition structures away from the substrate; the second barrier layer including at least one second barrier unit, the second barrier unit being disposed on the side of the first barrier unit away from the substrate; wherein, the first barrier unit includes at least one first groove, the second barrier unit includes at least one first opening, and the orthographic projection of the first opening is located within the orthographic projection range of the first groove along the thickness direction of the substrate; After forming a barrier layer on one side of the substrate and in the isolation region, the method further includes: etching the sidewall of the isolation pillar transition structure that is not covered by the barrier layer to form an isolation pillar, wherein the isolation pillar includes a first surface close to the substrate and a second surface away from the substrate, and the orthographic projection of the first surface is within the orthographic projection range of the second surface along the thickness direction of the substrate.

9. The preparation method according to claim 8, characterized in that, The step of forming a barrier layer between portions of the isolation pillar transition structure includes: A first barrier material layer is formed between the plurality of isolation pillar transition structures. The first barrier material layer includes at least one first barrier unit material layer. The first barrier unit material layer is disposed between two adjacent isolation pillar transition structures. The first barrier unit material layer covers the opposite sides of the two adjacent isolation pillar transition structures, the isolation area in the opening between the two adjacent isolation pillar transition structures, and partially covers the surface of the two adjacent isolation pillar transition structures away from the substrate. A second barrier layer is formed on the side of the first barrier material layer away from the substrate. A first groove is formed on the side of the first barrier unit material layer away from the substrate, and the first barrier material layer with the first groove forms the first barrier layer.

10. The preparation method according to claim 9, characterized in that, After forming the second barrier layer on the side of the first barrier material layer away from the substrate, the method further includes: forming a pixel definition layer on one side of the substrate and located in the display area, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion; the pixel definition layer also includes a plurality of second grooves, the orthographic projection of the plurality of second grooves on the substrate being located around the orthographic projection of the pixel opening on the substrate, and each second groove being spaced apart from each other; wherein the first groove and the second groove are formed in the same process.

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