A new modular directional perforation package and process

Abstract

The application discloses a novel modular directional perforation packaging device and process, relates to the field of semiconductor processing technology, and the perforation packaging device comprises a turret mechanism, a laser perforation assembly, a visual calibration assembly, a packaging assembly, a lifting base and a control system; when working, a worker controls the control system to drive the lifting base to drive a workpiece to ascend to a preset machining position; then the control system drives the turret mechanism to rotate, switches the visual calibration assembly to above the workpiece to perform calibration; after the calibration is completed, the turret mechanism is switched to the laser perforation assembly to perform directional perforation machining on the workpiece; after the perforation is completed, the turret mechanism is switched to the packaging assembly again to perform welding and packaging; and the lifting base vertically descends to complete discharging. The laser perforation assembly and the packaging assembly are used for perforating and packaging the workpiece to be machined, and the application has the effect of highly integrated process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, specifically a novel modular directional perforation packaging equipment and process. Background Technology

[0002] In the manufacturing process of microelectronic devices such as semiconductor chips and MEMS sensors, directional perforation and hermetic sealing are core processes to ensure device performance. Perforation packaging equipment is mainly used for precision micro-hole processing on the surface of wafers or sensor chips and subsequent sealing and packaging of cover plates. By effectively integrating multiple processes such as positioning and alignment, laser directional drilling and cover plate bonding and welding, the equipment can quickly complete directional perforation and cover plate packaging, providing reliable structural protection and environmental isolation for sensitive chips. It is widely applicable to the back-end production of micro sensors and advanced packaged devices.

[0003] However, traditional processing equipment often uses production lines composed of discrete equipment. The integration level of such production lines is generally low. Since the equipment in each process link can usually only be arranged linearly in a fixed order, the layout of the entire production line must be spread out. Compared with integrated equipment, discrete equipment occupies a lot of factory space. The low modularity of the entire production line makes the adjustment and expansion of the production line inefficient. Therefore, designing a highly integrated and modular directional perforation packaging equipment has become an urgent need to solve the current production pain points. Summary of the Invention

[0004] The purpose of this invention is to provide a novel modular directional perforation packaging device and process to solve the problem of low integration in existing perforation packaging devices.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a novel modular directional perforation packaging device, comprising a frame, a modular processing turret, a lifting base, and a control system, wherein the lifting base and the control system are both mounted on the frame, and the modular processing turret comprises a turret mechanism, a laser drilling assembly, a vision calibration assembly, and a packaging assembly; The turret mechanism is mounted on the frame and covers the lifting base. The laser drilling assembly includes an upper connecting plate, a lower connecting plate, hydraulic components, hinges, and anti-splash drilling components. The upper connecting plate is connected to the turret mechanism, and hinges are mounted on both the upper and lower connecting plates. The two ends of the hydraulic components are respectively hinged to the hinges on the upper and lower connecting plates. The anti-splash drilling components are located at the end of the lower connecting plate away from the upper connecting plate. The vision calibration component and the packaging component are circumferentially mounted on the turret mechanism. At the start of work, the operator places the workpiece on the lifting base and secures it. Then, the operator drives the lifting base to vertically raise the workpiece to a preset working height through the operation control system. The control system drives the turret mechanism on the modular machining turret to switch the vision calibration component to be directly above the workpiece to obtain the workpiece's positioning data.

[0006] After alignment, the turret mechanism rotates and switches to put the laser drilling component in the working position. The control system sends independent electrical control signals to multiple hydraulic components according to the preset orientation angle. The output ends of the hydraulic components extend or retract independently, driving the lower connecting plate to make high-precision multi-axial deflection movement. This allows the anti-splash drilling component located at the bottom of the lower connecting plate to tilt and adjust to the target orientation drilling angle. During drilling, the anti-splash drilling component performs in-situ suction and anti-splash treatment. After the drilling is completed, the turret mechanism rotates again, moving the encapsulation component above the drilling position. The cover plate is then attached to the drilling position and welded for sealing. After encapsulation, the lifting base descends vertically to complete all processing steps.

[0007] The hydraulic components are provided in at least three groups, which are symmetrically distributed in a ring between the upper and lower connecting plates. Each group of hydraulic components is electrically connected to the control system. The control system independently controls the extension and retraction length of each group of hydraulic components. During the attitude and angle adjustment process, the control system performs calculations according to the set angle and outputs differentiated drive signals to the at least three groups of symmetrically distributed hydraulic components. Since the two ends of the multiple hydraulic components are hinged to the upper and lower connecting plates respectively, when the multiple hydraulic components are independently controlled to produce different extension and retraction lengths, an asymmetrical thrust or pull force will be formed in the circumference of the lower connecting plate, thereby controlling the tilt and pitch angle of the lower connecting plate relative to the upper connecting plate, realizing multi-degree-of-freedom spatial flexible orientation of the processing angle.

[0008] The anti-splash drilling element includes a laser element, an outer suction cover, and an inner protective cover. The laser element is connected to the lower connecting plate, and both the outer suction cover and the inner protective cover are connected to the laser element. The outer suction cover and the inner protective cover together form an annular chip suction cavity. During laser drilling, the laser element installed at the lower connecting plate emits a processing beam. The beam passes coaxially through the bottom openings of the outer suction cover and the inner protective cover. The high-temperature molten material and microparticles generated by the laser ablation of the surface of the workpiece are confined within the annular chip suction cavity formed by the outer suction cover and the inner protective cover.

[0009] The anti-splash drilling element also includes a negative pressure interface and a negative pressure element. The negative pressure interface penetrates the outer suction cover, with one end connected to the annular chip suction cavity and the other end connected to the negative pressure element. Before the laser element is activated, the external negative pressure element is activated first, continuously sucking the annular chip suction cavity inside the anti-splash drilling element through the negative pressure interface. A strong airflow negative pressure is formed at the bottom opening of the outer suction cover. During the drilling process, when the splashes and dust are intercepted by the inner cover into the annular chip suction cavity, the powerful airflow negative pressure suction instantly and efficiently sucks these residues out of the processing area through the negative pressure interface, avoiding secondary pollution of the target material by ablation impurities and realizing real-time removal of debris and waste smoke.

[0010] The vision calibration component includes a vision detection element and a light source, which are circumferentially arranged on the turret mechanism. The vision detection element, the light source, and the packaging component are all electrically connected to the control system. During the loading and alignment stages, the light source on the turret mechanism emits illumination light to clearly illuminate the surface of the workpiece. The vision detection element captures alignment images in real time and electrically transmits the image signal to the control system. The control system performs image data calculations and synchronously outputs deviation correction commands to the turret mechanism, while providing a reference calibration for the subsequent placement operation of the packaging component.

[0011] The turret mechanism includes a turret body, a drive source, a rotating platform, and a turret door. The turret body is mounted on a frame, and the drive source is mounted on the turret body. The output end of the drive source passes through the turret body and connects to the rotating platform. The laser drilling component, visual calibration component, and packaging component are all mounted on the rotating platform. The turret door is rotatably connected to the turret door. The drive source is a drive motor. When a process step needs to be switched, the operator operates the control system to activate the drive source on the turret body. The output shaft of the drive source passes through the turret body to transmit power, causing the rotating platform to rotate angularly along the horizontal circumference. The rotating platform causes the circumferentially arranged laser drilling component, visual calibration component, and packaging component to rotate sequentially and align with the workstation below. In addition, when it is necessary to replace or repair a module, the operator can open the turret door rotatably connected to the turret body to perform in-situ adjustments and quick replacements inside the turret body.

[0012] The lifting base includes a lifting drive mechanism and a support platform. The lifting drive mechanism is mounted on the frame, and the output end of the lifting drive mechanism is equipped with a support platform. The upper surface of the support platform is equipped with a material storage suction cup. The lifting drive mechanism is a hydraulic cylinder. During the loading stage, the support platform is lowered to the bottom position. After the operator places the workpiece to be processed in, the material storage suction cup on the upper surface of the support platform activates pneumatic vacuum suction or electrostatic adsorption to lock the workpiece and prevent it from shifting during transportation or processing. Subsequently, the lifting drive mechanism drives the support platform to rise vertically, so that the surface of the workpiece is at the laser drilling focus height. After the drilling and bonding packaging are completed, the lifting drive mechanism drives the support platform to descend again, the material storage suction cup is released, and the operator unloads the completed workpiece.

[0013] A novel modular directional perforation packaging process includes the following specific steps: S1. Place the workpiece to be processed on the support platform and fix it in place; S2. The vision calibration component performs visual scanning and precise position correction on the workpiece to be processed. S3. The turret mechanism rotates, and the laser drilling component performs directional drilling. S4. The encapsulated components are eutectic welded or cured and sealed. S5. The lifting drive mechanism unloads and collects the packaged workpieces.

[0014] Step S2 includes the following specific steps: S201: The positional deviation fed back by the visual detection element of the control system is used to calculate the target elongation of multiple sets of hydraulic components. S202: Multiple hydraulic components extend and retract along their corresponding hinges, causing the lower connecting plate and anti-splash drilling components to deflect relative to the upper connecting plate, thus aligning the laser beam focusing axis with the design angle. Step S3 includes the following specific steps: S301: Before the injection hole, the negative pressure element applies high pressure to the inside of the annular dust suction chamber through the negative pressure interface, so that an upward annular suction airflow is generated at the bottom opening of the inner protective cover and the outer suction cover. S302: The laser element is activated and emits a laser beam, which passes through the inner protective cover and then tilts to irradiate the surface of the workpiece to perform directional ablation and perforation. S303: The high-temperature debris generated during the drilling process is physically blocked by the inner protective cover and is quickly sucked into the annular debris suction chamber under the action of the annular suction airflow, and finally discharged through the negative pressure interface.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention, through the cooperation of multiple sets of hydraulic components, hinges, and upper and lower connecting plates, enables the control system to output differentiated drive signals to at least three sets of ring-shaped hydraulic components according to the set angle during posture and angle adjustment. This controls the independent extension or retraction of multiple sets of hydraulic components, forming an asymmetrical thrust or pull force in the circumference of the lower connecting plate. By adjusting the tilt and pitch angle of the lower connecting plate relative to the upper connecting plate, flexible and high-precision orientation of the machining angle in a multi-degree-of-freedom space is achieved. This allows for efficient multi-axial inclined hole machining in a compact single-machine space, avoiding the cumulative error caused by frequent adjustments to the position of the workpiece.

[0016] 2. This invention, through the cooperation of a laser element, an annular chip suction cavity, and a negative pressure element, continuously draws the contents of the annular chip suction cavity during the laser perforation process. This removes the high-temperature molten material, micro-particle splashes, and waste fumes generated on the surface of the workpiece from the processing area through the negative pressure interface. This achieves a high degree of integration between directional perforation and chip removal within a coaxial structure. It eliminates the need for additional installation space for a chip suction device and allows for simultaneous chip recovery at the processing location. This prevents high-temperature chips from splashing outwards and burning the processing components or adhering to the surface of the workpiece, thus affecting processing accuracy. It also improves the working environment of the processing area. Attached Figure Description

[0017] Figure 1 This is an overall structural diagram of the present invention; Figure 2 This is an overall isometric view of the present invention; Figure 3 This is a diagram of the internal structure of the modular machining turret of the present invention; Figure 4 This is a structural diagram of the laser drilling component of the present invention; Figure 5 This is a structural diagram of the lifting base of the present invention; Figure 6 This is a cross-sectional view of the lifting base installation of the present invention; Figure 7 This is a cross-sectional view of the laser drilling assembly of the present invention; Figure 8 For the present invention Figure 7 A magnified view of a portion of region A in the middle.

[0018] In the diagram: 1. Frame; 2. Modular machining turret; 21. Turret mechanism; 211. Turret body; 212. Drive source; 213. Rotating platform; 214. Turret door; 22. Laser drilling assembly; 221. Upper connecting plate; 222. Lower connecting plate; 223. Hydraulic component; 224. Hinge; 225. Anti-splash drilling component; 2251. Laser component; 2252. Outer suction cover; 2253. Inner protective cover; 2255. Annular chip suction chamber; 2256. Negative pressure interface; 23. Vision calibration assembly; 231. Vision inspection component; 232. Light source; 24. Packaging assembly; 3. Lifting base; 31. Lifting drive mechanism; 32. Bearing platform; 33. Material suction cup; 4. Control system. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Specific Implementation Example 1: As shown in the example Figures 1-6 As shown, the present invention provides a technical solution: a novel modular directional perforation packaging device, including a frame 1, a modular processing turret 2, a lifting base 3, and a control system 4. The lifting base 3 and the control system 4 are both mounted on the frame 1. The modular processing turret 2 includes a turret mechanism 21, a laser drilling component 22, a vision calibration component 23, and a packaging component 24. The turret mechanism 21 is mounted on the frame 1 and covers the lifting base 3. The laser drilling assembly 22 includes an upper connecting plate 221, a lower connecting plate 222, a hydraulic element 223, a hinge 224, and an anti-splash drilling element 225. The upper connecting plate 221 is connected to the turret mechanism 21. Hinges 224 are mounted on both the upper connecting plate 221 and the lower connecting plate 222. The two ends of the hydraulic element 223 are respectively hinged to the hinges 224 on the upper connecting plate 221 and the lower connecting plate 222. The anti-splash drilling element 225 is mounted on... The lower connecting plate 222 is located away from the upper connecting plate 221. The vision calibration component 23 and the encapsulation component 24 are both circumferentially arranged on the turret mechanism 21. When the work starts, the operator places the workpiece to be processed on the lifting base 3 and fixes it. Then, the operator drives the lifting base 3 to lift the workpiece vertically to the preset working height by operating the control system 4. The control system 4 drives the turret mechanism 21 on the modular processing turret 2 to switch the vision calibration component 23 to be directly above the workpiece and obtain the workpiece's positioning data.

[0021] After alignment, the turret mechanism 21 rotates and switches, putting the laser drilling component 22 into the working position. The control system 4 sends independent electrical control signals to multiple hydraulic components 223 according to the preset orientation angle. The output ends of the hydraulic components 223 extend or retract independently, driving the lower connecting plate 222 to make high-precision multi-axial deflection movement. This causes the anti-splash drilling component 225 located at the bottom of the lower connecting plate 222 to tilt and adjust to the target orientation drilling angle. During drilling, the anti-splash drilling component 225 performs in-situ suction and anti-splash treatment. After the drilling is completed, the turret mechanism 21 rotates again, moving the encapsulation component 24 above the drilling position. The cover plate is then attached to the drilling position and welded for sealing. After encapsulation, the lifting base 3 descends vertically to complete all processing steps.

[0022] The hydraulic components 223 are provided in at least three groups, and the multiple groups of hydraulic components 223 are symmetrically distributed in a ring between the upper connecting plate 221 and the lower connecting plate 222. Each group of hydraulic components 223 is electrically connected to the control system 4. The control system 4 independently controls the extension and retraction length of each group of hydraulic components 223. During the attitude and angle adjustment process, the control system 4 performs calculations according to the set angle and outputs differentiated drive signals to the at least three groups of symmetrically distributed hydraulic components 223. Since the two ends of the multiple groups of hydraulic components 223 are respectively hinged to the upper connecting plate 221 and the lower connecting plate 222 through hinges 224, when the multiple groups of hydraulic components 223 are independently controlled to produce different extension and retraction lengths, an asymmetrical thrust or pull force will be formed in the circumference of the lower connecting plate 222, thereby controlling the tilt and pitch angle of the lower connecting plate 222 relative to the upper connecting plate 221, realizing multi-degree-of-freedom spatial flexible orientation of the processing angle.

[0023] The visual calibration component 23 includes a visual inspection element 231 and a light source 232. The visual inspection element 231 and the light source 232 are circumferentially arranged on the turret mechanism 21. The visual inspection element 231, the light source 232 and the packaging component 24 are all electrically connected to the control system 4. During the feeding and alignment stages, the light source 232 arranged on the turret mechanism 21 emits illumination light to clearly illuminate the surface of the workpiece to be processed. The visual inspection element 231 captures the alignment image in real time and electrically transmits the image signal to the control system 4. The control system 4 calculates the image data and synchronously outputs the deviation correction command to the turret mechanism 21, while providing a reference calibration for the subsequent placement operation of the packaging component 24.

[0024] The turret mechanism 21 includes a turret body 211, a drive source 212, a rotating platform 213, and a turret door 214. The turret body 211 is mounted on the frame 1, and the drive source 212 is mounted on the turret body 211. The output end of the drive source 212 passes through the turret body 211 and connects to the rotating platform 213. The laser drilling assembly 22, the vision calibration assembly 23, and the encapsulation assembly 24 are all mounted on the rotating platform 213. The turret door 214 is rotatably connected to the turret body 213. The drive source 212 is a drive motor. When a process step change is required, the operator... The operation control system 4 activates the drive source 212 on the tower body 211. The output shaft of the drive source 212 passes through the tower body 211 to transmit power, driving the rotating platform 213 to rotate in the horizontal circumferential direction. The rotating platform 213 drives the circumferentially arranged laser drilling component 22, vision calibration component 23 and packaging component 24 to rotate in sequence and align with the work station below. In addition, when it is necessary to replace or repair the module, the staff can open the tower door 214 which is rotatably connected to the tower body 211 to perform in-situ adjustment and quick replacement inside the tower body 211.

[0025] The lifting base 3 includes a lifting drive mechanism 31 and a support platform 32. The lifting drive mechanism 31 is mounted on the frame 1, and the output end of the lifting drive mechanism 31 is equipped with the support platform 32. The upper surface of the support platform 32 is equipped with a material storage suction cup 33. The lifting drive mechanism 31 is a hydraulic cylinder. During the loading stage, the support platform 32 is lowered to the bottom position. After the operator places the workpiece to be processed in, the material storage suction cup 33 on the upper surface of the support platform 32 is activated to perform pneumatic vacuum suction or electrostatic adsorption to lock the workpiece to be processed and prevent it from shifting in plane during transportation or processing. Subsequently, the lifting drive mechanism 31 drives the support platform 32 to rise vertically, so that the surface of the workpiece to be processed is at the laser drilling focus height. After the drilling and bonding packaging are completed, the lifting drive mechanism 31 drives the support platform 32 to fall again, the material storage suction cup 33 is released from fixation, and the operator unloads the processed workpiece.

[0026] Specific Implementation Example 2: As shown in the example Figures 7-8 As shown, an anti-splash drilling element 225, different from Embodiment 1, is provided. The difference is that this embodiment integrates drilling and residue collection into the same component. An annular chip suction cavity 2255 is integrated at the drilling end of the anti-splash drilling element 225. During drilling, the molten slag and splash debris generated by the laser head drilling at a preset angle will be sucked into the annular chip suction cavity 2255, preventing splash residue from adhering to the workpiece surface or the inside of the equipment. There is no need to add an additional residue cleaning step after the drilling process is completed. The overall structure has a higher degree of integration and is suitable for continuous batch processing needs.

[0027] The specific content is as follows: The anti-splash drilling element 225 includes a laser element 2251, an outer suction cover 2252, and an inner protective cover 2253. The laser element 2251 is connected to the lower connecting plate 222. The outer suction cover 2252 and the inner protective cover 2253 are both connected to the laser element 2251. The outer suction cover 2252 and the inner protective cover 2253 enclose each other to form an annular chip suction cavity 2255. When laser drilling is performed, the laser element 2251 installed at the lower connecting plate 222 emits a processing beam. The beam passes coaxially through the bottom opening of the outer suction cover 2252 and the inner protective cover 2253. The high-temperature melt and micro-particle splashes generated by the laser ablation of the surface of the workpiece are confined within the annular chip suction cavity 2255 formed by the outer suction cover 2252 and the inner protective cover 2253.

[0028] The anti-splash drilling element 225 also includes a negative pressure interface 2256 and a negative pressure element. The negative pressure interface 2256 penetrates the outer suction cover 2252. One end of the negative pressure interface 2256 is connected to the annular chip suction cavity 2255, and the other end of the negative pressure interface 2256 is connected to the negative pressure element. Before the laser element 2251 is activated, the external negative pressure element is activated first. The annular chip suction cavity 2255 inside the anti-splash drilling element 225 is continuously sucked through the negative pressure interface 2256. A strong airflow negative pressure is formed at the bottom opening of the outer suction cover 2252. During the drilling process, when the splashes and dust are intercepted by the inner protective cover 2253 into the annular chip suction cavity 2255, the strong airflow negative pressure suction instantly and efficiently sucks these residues out of the processing area through the negative pressure interface 2256, avoiding secondary pollution of the target material by ablation impurities and realizing real-time removal of debris and waste smoke.

[0029] A novel modular directional perforation packaging process includes the following specific steps: S1. Place the workpiece to be processed on the support platform and fix it in place; S2. The vision calibration component performs visual scanning and precise position correction on the workpiece to be processed. S3. The turret mechanism rotates, and the laser drilling component performs directional drilling. S4. The encapsulated components are eutectic welded or cured and sealed. S5. The lifting drive mechanism unloads and collects the packaged workpieces.

[0030] Step S2 includes the following specific steps: S201: The positional deviation fed back by the visual detection element of the control system is used to calculate the target elongation of multiple sets of hydraulic components. S202: Multiple hydraulic components extend and retract along their corresponding hinges, causing the lower connecting plate and anti-splash drilling components to deflect relative to the upper connecting plate, thus aligning the laser beam focusing axis with the design angle. Step S3 includes the following specific steps: S301: Before the injection hole, the negative pressure element applies high pressure to the inside of the annular dust suction chamber through the negative pressure interface, so that an upward annular suction airflow is generated at the bottom opening of the inner protective cover and the outer suction cover. S302: The laser element is activated and emits a laser beam, which passes through the inner protective cover and then tilts to irradiate the surface of the workpiece to perform directional ablation and perforation. S303: The high-temperature debris generated during the drilling process is physically blocked by the inner protective cover and is quickly sucked into the annular debris suction chamber under the action of the annular suction airflow, and finally discharged through the negative pressure interface.

[0031] Working principle of the invention: During the processing preparation stage, the staff controls the system 4 to drive the lifting mechanism 31 to lower the bearing platform 32 to the initial bottom position, open the tower body 211, and place the workpiece to be processed on the upper surface of the bearing platform 32. The material storage suction cup 33 on the upper surface of the bearing platform 32 then starts pneumatic vacuum suction or electrostatic adsorption to lock the workpiece to be processed.

[0032] The operator sends a command through the control system 4 to drive the lifting drive mechanism 31 to operate. The output end of the lifting drive mechanism 31 extends outward, causing the bearing platform 32 to lift the locked workpiece vertically until its surface reaches the preset working height.

[0033] The operator operates the control system 4 to control the drive source 212 to run. The output shaft of the drive source 212 transmits power to drive the rotating platform 213 to rotate, thereby switching the circumferentially set vision calibration component 23 and aligning it directly above the workpiece to be processed.

[0034] The light source 232 emits illumination light to clearly illuminate the surface of the workpiece. The vision inspection element 231 captures the alignment image in real time and transmits the electrical signal to the control system 4. The control system 4 outputs a deviation correction command to the turret mechanism 21 through image data calculation to achieve high-precision alignment detection. At the same time, it completes the reference calibration for the subsequent chip placement operation of the packaging component 24.

[0035] After the alignment calibration is completed, the control system 4 drives the rotating platform 213 to rotate again through the drive source 212, so that the laser drilling component 22 switches and aligns with the processing station below. The control system 4 calculates according to the preset orientation angle and sends independent electrical control signals to at least three sets of hydraulic components 223 that are symmetrically distributed in a ring. The output end of the hydraulic component 223 extends or retracts independently, forming an asymmetrical thrust or pull force in the circumference of the lower connecting plate 222, thereby controlling the tilt and pitch angle of the lower connecting plate 222 relative to the upper connecting plate 221, driving the lower connecting plate 222 to make high-precision multi-axial deflection movement, thereby tilting and adjusting the bottom anti-splash drilling component 225 to the target orientation drilling angle.

[0036] After the angle adjustment is completed, before the perforation work begins, the external negative pressure element is activated first. The negative pressure interface 2256 continuously sucks the annular chip suction chamber 2255 inside the anti-splash perforation element 225, forming a strong airflow negative pressure at the opening at the bottom of the outer suction cover 2252. Then, the laser element 2251 installed on the lower connecting plate 222 emits a processing beam. The beam passes coaxially through the bottom opening of the outer suction cover 2252 and the inner protective cover 2253, and is aimed at the target material on the surface of the workpiece.

[0037] When the laser performs directional drilling on the surface of the workpiece, the high-temperature molten material and microparticle splashes generated by ablation are blocked and intercepted by the inner shield 2253, which confines them within the annular chip suction cavity 2255 formed by the outer suction shield 2252 and the inner shield 2253.

[0038] Under the suction force of the strong negative pressure airflow flowing in the annular chip suction chamber 2255, the intercepted residues and splashed debris are instantly and efficiently sucked out of the processing area through the negative pressure interface 2256 that penetrates the outer suction cover 2252, avoiding secondary pollution of the target material by ablation impurities, and realizing real-time removal of debris and waste smoke and in-situ suction anti-splash treatment.

[0039] After the perforation process is completed, the control system 4 drives the rotating platform 213 to rotate again through the drive source 212, moving and positioning the encapsulation component 24 directly above the perforation position that has just been processed. The encapsulation component 24 then starts working, precisely fitting the encapsulation cover plate to the perforation position of the workpiece and performing welding sealing.

[0040] After the packaging process is completed, the control system 4 controls the lifting drive mechanism 31 to run, driving the bearing platform 32 to descend vertically and reset to the initial bottom position. At this time, the material storage suction cup 33 releases vacuum adsorption or electrostatic fixation, and the staff unloads the processed and packaged workpiece, completing the entire processing process of the equipment.

[0041] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A novel modular directional perforation packaging device, characterized in that: It includes a frame (1), a modular processing turret (2), a lifting base (3) and a control system (4). The lifting base (3) and the control system (4) are both mounted on the frame (1). The modular processing turret (2) includes a turret mechanism (21), a laser drilling assembly (22), a vision calibration assembly (23) and a packaging assembly (24). The turret mechanism (21) is mounted on the frame (1) and covers the lifting base (3). The laser drilling assembly (22) includes an upper connecting plate (221), a lower connecting plate (222), a hydraulic element (223), a hinge (224), and an anti-splash drilling element (225). The upper connecting plate (221) is connected to the turret mechanism (21). Both the upper connecting plate (221) and the lower connecting plate (222) are equipped with hinges (224). The two ends of the hydraulic element (223) are respectively hinged to the hinges (224) on the upper connecting plate (221) and the lower connecting plate (222). The anti-splash drilling element (225) is located at the end of the lower connecting plate (222) away from the upper connecting plate (221). The visual calibration assembly (23) and the packaging assembly (24) are both circumferentially mounted on the turret mechanism (21).

2. The novel modular directional perforation packaging device according to claim 1, characterized in that: The hydraulic component (223) is provided in at least three groups. The multiple groups of hydraulic components (223) are symmetrically distributed in a ring between the upper connecting plate (221) and the lower connecting plate (222). Each group of hydraulic components (223) is electrically connected to the control system (4). The control system (4) independently controls the extension and retraction length of each group of hydraulic components (223).

3. The novel modular directional perforation packaging device according to claim 2, characterized in that: The anti-splash drilling element (225) includes a laser element (2251), an outer suction cover (2252), and an inner protective cover (2253). The laser element (2251) is connected to the lower connecting plate (222). The outer suction cover (2252) and the inner protective cover (2253) are both connected to the laser element (2251). The outer suction cover (2252) and the inner protective cover (2253) enclose each other to form an annular chip suction cavity (2255).

4. The novel modular directional perforation packaging device according to claim 3, characterized in that: The anti-splash drilling element (225) also includes a negative pressure interface (2256) and a negative pressure element. The negative pressure interface (2256) penetrates the outer suction cover (2252). One end of the negative pressure interface (2256) is connected to the annular chip suction chamber (2255), and the other end of the negative pressure interface (2256) is connected to the negative pressure element.

5. A novel modular directional perforation packaging device according to claim 1, characterized in that: The visual calibration component (23) includes a visual detection element (231) and a light source (232). The visual detection element (231) and the light source (232) are circumferentially arranged on the turret mechanism (21). The visual detection element (231), the light source (232) and the encapsulation component (24) are all electrically connected to the control system (4).

6. The novel modular directional perforation packaging device according to claim 1, characterized in that: The turret mechanism (21) includes a turret body (211), a drive source (212), a rotating platform (213), and a turret door (214). The turret body (211) is mounted on the frame (1). The drive source (212) is mounted on the turret body (211). The output end of the drive source (212) passes through the turret body (211) and is connected to the rotating platform (213). The laser drilling component (22), the visual calibration component (23), and the packaging component (24) are all mounted on the rotating platform (213). The turret door (214) is rotatably connected to the turret door (214).

7. A novel modular directional perforation packaging device according to claim 1, characterized in that: The lifting base (3) includes a lifting drive mechanism (31) and a bearing platform (32). The lifting drive mechanism (31) is mounted on the frame (1). The output end of the lifting drive mechanism (31) is provided with a bearing platform (32). The upper surface of the bearing platform (32) is provided with a material suction cup (33).

8. A novel modular directional perforation packaging process, characterized in that: The novel modular directional perforation packaging equipment according to any one of claims 1-7 includes the following specific steps: S1. Place the workpiece to be processed on the support platform and fix it in place; S2. The vision calibration component performs visual scanning and precise position correction on the workpiece to be processed. S3. The turret mechanism rotates, and the laser drilling component performs directional drilling. S4. The encapsulated components are eutectic welded or cured and sealed. S5. The lifting drive mechanism unloads and collects the packaged workpieces.

9. A novel modular directional perforation encapsulation process according to claim 8, characterized in that: Step S2 includes the following specific steps: S201: The positional deviation fed back by the visual detection element of the control system is used to calculate the target elongation of multiple sets of hydraulic components. S202: Multiple hydraulic components extend and retract along their corresponding hinges, causing the lower connecting plate and anti-splash drilling components to deflect relative to the upper connecting plate, thus aligning the laser beam focusing axis with the design angle. Step S3 includes the following specific steps: S301: Before the injection hole, the negative pressure element applies high pressure to the inside of the annular dust suction chamber through the negative pressure interface, so that an upward annular suction airflow is generated at the bottom opening of the inner protective cover and the outer suction cover. S302: The laser element is activated and emits a laser beam, which passes through the inner protective cover and then tilts to irradiate the surface of the workpiece to perform directional ablation and perforation. S303: The high-temperature debris generated during the drilling process is physically blocked by the inner protective cover and is quickly sucked into the annular debris suction chamber under the action of the annular suction airflow, and finally discharged through the negative pressure interface.

Images