Uniform temperature water-cooled plate

Abstract

The application discloses a kind of even temperature water-cooled plate, including heat exchange plate, first cavity, second cavity and multiple through pipes.The radiating surface of heat exchange plate is densely covered with heat exchanger consisting of radiating fin arranged in radial.The first cavity and the second cavity are sequentially stacked on the same side of the heat exchange plate and are isolated from each other by cold-hot partition.The through pipe passes through the cold-hot partition and the second cavity, one end communicates with the first cavity, and the other end extends to the corresponding heat exchanger.Whether the first cavity or the second cavity is connected to the cooling fluid supply, the cooling fluid enters the heat exchanger through the through pipe, flows in and out in the direction perpendicular to the heat exchange plate, and is discharged after flowing into the other cavity in the reverse direction after heat exchange with the heat exchange plate, avoiding the upstream and downstream temperature difference formed by the long-distance flow of the cooling fluid in the plane direction, and achieving uniform temperature heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, specifically to a uniform temperature water-cooled plate, suitable for semiconductor digital chips or power chips and devices requiring high power density heat dissipation, such as radar, lasers, spaceborne computing and communication equipment, and space computing centers. Background Technology

[0002] With the continuous increase in the integration of semiconductor chips and the sustained rise in power density, efficient heat dissipation has become a key bottleneck restricting the performance and reliability of electronic devices. Water-cooled plates (liquid cooling plates), due to their excellent thermal conductivity, have become the mainstream solution for heat dissipation of high-power-density electronic devices.

[0003] Traditional water-cooled plates are constrained by the planar geometry of the heat source. The heat sink naturally aims to minimize thermal resistance by conforming to the heat source plane and using the shortest heat transfer path. Cooling water flows parallel to the heat source plane within the channels, exchanging heat with the metal interface of the heat source – intuitively the optimal solution. To achieve higher heat exchange efficiency, current technologies utilize the high thermal conductivity of the heat-conducting metal itself, maximizing the contact area between the liquid heat-conducting medium (such as water) and the heat-conducting surface. This is achieved by adding more heat-conducting fins and pillars, and miniaturizing the plate to further increase the surface area, significantly improving the heat conduction capacity of the water-cooled plate.

[0004] However, the flow path of the liquid heat transfer medium in existing water-cooled plates is almost entirely designed to be parallel to the heat dissipation surface, inherently limiting its topological structure to either entering from one end and exiting from the other, or entering from the middle and exiting from both ends. Even with serpentine bends, the flow resistance is significantly increased, and the one-end-in-one-out topology cannot be escaped. In other words, the flow path of the liquid heat transfer medium cannot escape the upstream-downstream structure, inevitably causing uneven temperature distribution with lower upstream temperatures and gradually increasing downstream temperatures, resulting in uneven temperature distribution within the water-cooled plate itself. Severe uneven temperature distribution can lead to uneven chip temperatures, generating excessive thermal deformation and thermal stress, jeopardizing the integrity of the chip's silicon structure and electrical connections. Furthermore, in the vacuum environment of space, due to the lack of air convection, the heat dissipation of electronic devices can only rely on heat conduction and thermal radiation. With the continuous growth in the demand for high computing power on spacecraft, the heat dissipation problem of high-power chips such as CPUs and GPUs in space applications has become a key bottleneck restricting the effective performance of spacecraft payloads. For space computing devices that rely on radiative heat dissipation, the higher the operating temperature of the heat sink, the higher its radiative heat dissipation efficiency—according to the Stefan-Boltzmann law, radiative heat dissipation power is proportional to the fourth power of temperature. However, the significant temperature difference between the upstream and downstream sides of traditional water-cooled plates due to the planar arrangement of the water channels results in severely uneven temperature distribution on the cold plate, making it difficult to increase the overall average operating temperature and limiting the effectiveness of radiative heat dissipation. Therefore, achieving uniform temperature dissipation of the cold plate is of significant engineering value for improving the heat dissipation capabilities of high-performance space computing devices.

[0005] Numerous domestic and international studies have attempted to improve the temperature uniformity of water-cooled plates, with the "jet impingement water-cooled plate" being the most relevant technical approach to this invention. However, analysis reveals that existing technical solutions all suffer from common inherent limitations, as follows:

[0006] Chinese patent CN119031670A (“A Petal-like Jet Impact Cold Plate Assembly and Jet Impact Heat Exchanger”, applicant: Xi’an University of Electronic Science and Technology et al., application date: September 2, 2024) discloses a cold plate design based on a biomimetic flow channel coupled with a jet impact flow channel, which improves temperature uniformity by optimizing the planar flow channel path. The essence of this solution is still to perform topology optimization of the flow channel in the plane. The cooling fluid still flows along the plane of the water-cooled plate, and the spatial relationship between the hot and cold fluids does not break out of the conventional thinking of planar water channel layout.

[0007] Chinese Patent ZL 202010022627.2 (“A Side-Flow Impact Microchannel Cold Plate and Electronic Equipment”, authorized, applicant: Xi’an Jiaotong University) discloses a side-flow impact microchannel cold plate structure, which is composed of multiple stacked single-layer jet structures arranged in a sequential array. Each layer can guide the cooling medium into the needle-fin microchannel through jet holes. Although this scheme adopts a multi-layer stacked structure and improves the temperature distribution to a certain extent, the jet structures of each layer are still arranged in a planar manner. The cooling medium still needs to flow along the planar direction within each layer. Only physical partitioning is achieved between the layers, without achieving spatial isolation and passage of hot and cold fluids in the direction perpendicular to the heat exchange surface.

[0008] Chinese patent CN121442637A (“Three-dimensional homogeneous liquid cooling plate and its manufacturing method, server heat dissipation system”, applicant: Chunjun New Materials (Shenzhen) Co., Ltd., application date: October 27, 2025) discloses a three-dimensional homogeneous liquid cooling plate. Its core is to increase the heat dissipation area by expanding the heat dissipation structure from a two-dimensional plane to a three-dimensional space. The flow of cooling fluid in the microchannel is still along the wall direction, and it does not involve the spatial crossing design of hot and cold fluids in the direction perpendicular to the heat exchange surface.

[0009] Chinese Patent CN118890871B (“A Flow Channel Separated Liquid Cooling Plate”, authorized, applicant: Guangdong Lanrui Technology Group Co., Ltd., application date: August 19, 2024) discloses a flow channel separated liquid cooling plate, which designs the flow path of the coolant within the cooling plate body as multiple independent flow channel bodies, each flow channel body being physically isolated by isolation ribs. However, each flow channel body is still a parallel waterway arranged in a planar manner, and the topological structure of the coolant flowing along the planar direction remains unchanged. Only physical partitioning of the flow channels is achieved between the independent flow channels, which is fundamentally different from the topological design of this invention, where “cooling fluid passes through the heat cavity via a heat-insulated through-tube.”

[0010] US Patent 8427832 (“Cold plate assemblies and power electronics modules”, patentee: Toyota Motor Engineering & Manufacturing North America, Inc., publication date: April 23, 2013) discloses a multi-layer cold plate assembly including an inlet manifold layer, a target heat transfer layer, a secondary heat transfer layer, and an outlet manifold layer, wherein an impingement jet nozzle is arranged through a central fluid outlet region. While this design improves temperature uniformity through its multi-layer structure and radial flow channel design, the coolant still flows in a planar direction within each layer—that is, the microchannels within each layer are arranged in a planar direction, and spatial isolation between the hot and cold fluids is not achieved in the direction perpendicular to the heat exchange surface.

[0011] Japanese Patent JPH05315489 (“Liquid Cooling Device for Electronic Devices”, Patentee: Fuji Electric Co., Ltd., Publication Date: November 26, 1993) describes a method where each semiconductor device mounted side-by-side on a wiring board is equipped with a refrigerant injection nozzle at a 1:1 ratio, and a separating member consisting of a metal heat transfer plate and an insulating diaphragm is inserted between the device and the nozzle. Although this solution achieves independent jet cooling for each device, the spatial relationship between the hot and cold fluids still follows a planar flow topology of “cold fluid → heat transfer plate → hot fluid”—that is, the liquid refrigerant is injected into the heat transfer plate and flows out along the surface of the heat transfer plate, which is fundamentally different from the spatial flow design of the hot and cold fluids in this invention.

[0012] Japanese Patent JP2001024126 (“Direct Expansion Cold Plate”, Patentee: Fuji Electric Co., Ltd., Publication Date: January 26, 2001) improves the uniformity of fluid distribution through collision and mixing within the manifold, but the coolant still flows along the plane of the cold plate through each flow path—that is, the coolant flows from the inlet manifold through each coolant flow path (along the plane) to the outlet manifold, and the spatial topology of the hot and cold fluids remains unchanged.

[0013] Taiwan patent CN214676302U (“Heat vapor chamber radiator with tapered water inlet design”, patentee: Chia Cheng Precision Machinery Co., Ltd., authorization announcement date: November 9, 2021) improves the fluid flow in the chamber through tapered water inlet design, but its core is still the optimization of the flow channel in the plane - the cooling fluid flows along the plane between the upper and lower regions of the chamber, and does not realize the spatial passage of hot and cold fluids in the direction perpendicular to the heat exchange surface.

[0014] US Patent US9736963B2 (Cold Plate Structure) discloses an integrated design of a cold plate as a structural component of an equipment, without addressing the spatial traversal topology of hot and cold fluids.

[0015] US Patent 10028410B2 (IBM) discloses a cooling scheme combining an inclined jet and finned channels, which enhances heat transfer by optimizing the jet angle and channel shape. Both the jet angle optimization and the finned channel arrangement are performed in a plane, without altering the planar flow topology of the hot and cold fluids.

[0016] In summary, a long-standing technical bias exists in this field: the cooling channels of a water-cooled plate should be arranged on the plane of the heat dissipation surface, with the spatial relationship between the hot and cold fluids being a two-dimensional topology of "cold fluid flowing in along the plane → heat exchange → flowing out along the plane." When faced with temperature uniformity issues, those skilled in the art typically optimize the flow channel layout within this two-dimensional plane—such as serpentine bends, biomimetic flow channels, distributors, multi-channel partitioning, etc.—rather than altering the spatial topology of the hot and cold fluids. However, as long as the fluid flows along a plane, an upstream-downstream relationship inevitably exists from the inlet to the outlet, inevitably resulting in a temperature difference. All known solutions in the prior art have failed to escape this fixed mindset regarding planar channel layout.

[0017] This invention proposes a novel design concept: reconstructing the spatial relationship between hot and cold fluids from a two-dimensional plane to a three-dimensional spatial flow—that is, the cooling fluid passes through the heat cavity via an insulated through-pipe in a direction perpendicular to the heat exchange surface, reaches the heat exchange zone to carry heat, and then flows back into the heat cavity. In this design, the cooling fluid no longer flows a long distance along the plane of the water-cooled plate, thus completely eliminating the upstream and downstream temperature difference of the water-cooled plate from a topological perspective. A search of domestic and foreign patent literature revealed no prior art document disclosing the above-mentioned combination of technical features of "cooling fluid passing through the heat cavity via an insulated through-pipe". Summary of the Invention

[0018] (a) Technical problems to be solved This invention aims to solve the problem of uneven temperature distribution between upstream and downstream of existing water-cooled plates due to the flow of liquid heat-conducting medium along a planar direction. It can also address uneven chip heating, thereby significantly reducing temperature unevenness. This requires a completely new approach, moving beyond the conventional thinking of arranging water channels on a plane, which seems to minimize thermal resistance and maximize heat carrying capacity.

[0019] In terms of spatial relationship, regardless of whether the first cavity is the cooling fluid supply cavity and the second cavity is the return cavity, or vice versa, the cooling fluid must pass through the other cavity (i.e., the cooling fluid passes through the hot cavity) to reach the heat exchange zone. The design of this invention is that the cooling fluid passes through the hot cavity through a large number of insulated through pipes, reaches the heat exchange zone, carries heat, and then flows back into the hot cavity before being discharged. This avoids the fluid flowing along the plane of the heat exchange plate and eliminates the significant temperature difference between the upstream and downstream sides of the water-cooled plate in the plane direction.

[0020] Therefore, the uniform temperature water-cooled plate of the present invention can achieve uniform heat dissipation regardless of whether it is connected in the forward or reverse direction—it is only necessary to connect the first or second interface to the cooling fluid supply, and the flow field topology structure during fluid heat exchange remains unchanged.

[0021] The uniform temperature water-cooled plate of the present invention specifically includes: A heat exchange plate having a heat absorption surface and a heat dissipation surface, wherein a plurality of heat exchangers are densely distributed on the heat dissipation surface, and each heat exchanger is composed of radially arranged heat dissipation fins. The first cavity and the second cavity are stacked sequentially on the same side (i.e., the heat dissipation side) of the heat exchange plate and isolated from each other by a hot and cold partition. The hot and cold partition is used to block the conduction of heat between the first cavity and the second cavity. The first cavity and the second cavity respectively have a first interface and a second interface that connect to the outside. Multiple through pipes, each of which passes through the hot and cold partition and the second cavity, with one end connected to the first cavity and the other end extending to the corresponding heat exchanger; When the first cavity is connected to a cooling fluid supply and the second cavity is connected to a cooling fluid return flow, the cooling fluid flows from the first cavity through each of the through pipes into each of the heat exchangers, exchanges heat with the heat exchange plates, and then flows back into the second cavity and is discharged. When the second cavity is connected to a cooling fluid supply and the first cavity is connected to a cooling fluid return flow, the cooling fluid flows from the second cavity through each of the through pipes into each of the heat exchangers, exchanges heat with the heat exchange plates, and then flows back into the first cavity and is discharged. The cooling fluid exchanges heat in the heat exchanger along a path perpendicular to the heat exchange plate, thereby avoiding the upstream and downstream temperature difference caused by the cooling fluid flowing a long distance along the plane of the heat exchange plate.

[0022] (III) Beneficial Effects Excellent temperature uniformity: This invention avoids long-distance flow of the cooling fluid along the plane of the water-cooled plate by vertically injecting the cooling fluid into the heat exchange zone and returning it in the opposite direction. This eliminates the upstream and downstream temperature difference along the plane of the water-cooled plate, achieving uniform heat dissipation. This characteristic is particularly valuable for space electronic devices and space computing devices that rely on radiation heat dissipation: the uniform temperature cold plate allows the entire heat dissipation surface to operate at a higher and more uniform temperature, thereby significantly improving radiation heat dissipation efficiency and effectively addressing the heat dissipation challenges of high-power chips in the vacuum environment of space. Compared with existing technologies such as CN121397965A and CN119031670A, this invention redefines the spatial relationship between hot and cold fluids at the fluid space topology level, rather than simply optimizing the planar flow channel layout.

[0023] Low flow resistance: This invention has no long and narrow water channels, and the overall water flow resistance is very low, which allows the water cooling system to operate under negative pressure below atmospheric pressure, completely avoiding the risk of damage to electronic equipment caused by possible leakage.

[0024] High adaptability: The heat exchangers densely packed on the heat exchange plate work independently. The heat dissipation capacity of each heat exchanger can be adjusted by adjusting the diameter of the through pipe or the size of the heat dissipation fins. It can handle both situations where the heat source has a uniform heat density and situations where the heat source has an uneven heat density.

[0025] Excellent thermal isolation: The thermal separator can be made of a poor conductor of heat or a hollow metal shell structure (with optional vacuuming), effectively preventing heat from being conducted from the hot cavity to the cold cavity. This is fundamentally different from the physical isolation scheme of the flow channel in CN118890871B—this invention achieves spatial separation of hot and cold fluids in a direction perpendicular to the heat exchange surface.

[0026] Flexible interface orientation: The uniform temperature water cooling plate of this invention can work normally whether it is connected in the forward or reverse direction, providing great flexibility for system integration.

[0027] Flexible operation: This invention can operate in either water-cooled or vapor-liquid two-phase mode, with the cooling fluid evaporating and absorbing heat on the heat exchanger fins and walls.

[0028] Good structural manufacturability: The heat dissipation fins can be processed by precision forging and forming flow channels at the same time, and the heat exchange plate with microtube structure can also be manufactured by additive 3D printing. Attached Figure Description

[0029] Figure 1 This is a cross-sectional axial view of the uniform temperature water-cooled plate of the present invention; Figure 2 for Figure 1 A magnified view of the middle section; Figure 3 This is a quarter-section axial side view of the heat exchanger plate; Figure 4 This is a cross-sectional view of the uniform temperature water-cooled plate of the present invention; Figure 5 This is a cross-sectional view of the heat-cooling partition; Figure 6 This is a cross-sectional view of a hollow thermal insulation plate. Figure 7 This is a partial enlarged cross-sectional view of the heat exchanger; Figure 8 This is a partial cross-sectional enlarged view of a microtube heat exchanger.

[0030] Explanation of reference numerals in the attached figures: 1—First interface; 2—First cavity; 3—Top cover; 4—Hot and cold baffle; 5—Through pipe; 6—Heat-conducting fins; 7—Heat exchange plate; 8—Second cavity; 9—Second interface; 10—Mounting hole; 11—Cold end shell; 12—Hot end shell; 13—Through pipe 5-port weld; 14—Hot and cold end shell weld; 15—Flow channel micro water pipe. Detailed Implementation

[0031] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0032] like Figure 1 As shown, the isometric view of the uniform temperature water-cooled plate of the present invention is cut in half, with the entire plate cut in one-quarter and the top cover cut in half. 1 is the first interface, 2 is the first cavity, 3 is the top cover, 4 is the hot and cold insulation plate, 5 is the through pipe, 6 is the heat-conducting fin, 7 is the heat exchange plate, 8 is the second cavity, 9 is the second interface, and 10 is the mounting hole.

[0033] The arrows in the diagram indicate the direction of fluid flow. The fluid (cooling water) flows into the first cavity 2 from the first interface 1, and then is sprayed into the heat exchanger composed of many radially arranged heat dissipation fins 6 through each through pipe 5. After that, it flows in the reverse direction into the second cavity 8. The fluid in the second cavity 8 flows out of the uniform temperature cold water plate of the present invention through the second interface 9, thus completing the heat exchange work.

[0034] like Figure 2 As shown, Figure 1 The enlarged view in the middle section clearly shows the structure of the heat exchanger, which consists of many radially arranged heat dissipation fins 6. The heat dissipation fins 6 in the figure are all drawn as straight blades, although they can also be curved blades (see [reference]). Figure 4 , Figure 7 Heat dissipation fins are arranged starting from the center of the outlet of the through pipe 5, which can increase the effective area of ​​the fins.

[0035] like Figure 3 The image shows a quarter-section axial view of the heat exchange plate, clearly revealing the densely packed, tiny heat exchangers on the plate. The heat exchangers, composed of radially arranged heat dissipation fins 6, are arranged in a tightly packed hexagonal pattern; however, they could also be arranged in a square, or the shape of the heat exchangers themselves does not necessarily have to be circular, such as square or hexagonal. The key is that the streamlined water channels allow the fluid, when injected vertically, to be redirected with minimal head loss and flow back into the second chamber 8.

[0036] The heat exchangers densely packed on the heat exchange plate 7 operate independently, making it very simple to adjust the heat dissipation capacity by changing the diameter of the through pipe 5. It can dissipate heat evenly when the heat source itself has a uniform heat density, or it can easily cope with uneven heat dissipation by adjusting the diameter of the through pipe 5 or the size of the heat dissipation fins 6 (i.e., the size of the micro heat sink).

[0037] Figure 3 The upper surface of the heat exchange plate 7 is drawn in a planar shape. When the heat dissipation fins 6 are processed by precision forging and forming the flow channels, the metal in that part will be squeezed and protrude from the plane, forming heat dissipation fins 6 with higher protrusions from the plane, which is acceptable and there is no need to specifically remove these protruding heat dissipation fins 6.

[0038] like Figure 4 The diagram shows a cross-sectional view of the uniform temperature water-cooled plate of the present invention, further detailing its internal structure. Its working principle is further explained using arrows to represent the cooling fluid flow field. Taking a case where the first cavity 2 is connected to the cooling fluid supply and the second cavity 8 is connected to the cooling fluid return flow: the cooling fluid flows into the first cavity 2 from the first interface 1, passes through the second cavity 8 insulatedly via each through-pipe 5, enters the heat exchanger, exchanges heat with the heat exchange plate 7, returns to the second cavity 8, and finally exits from the second interface 9. The fluid completes the process of entering and leaving the heat exchanger from the first cavity 2 without traversing a long water channel along the plane of the water-cooled plate, thus preventing the formation of an upstream and downstream temperature difference in the plane of the water-cooled plate.

[0039] When connected in the opposite direction—that is, the second cavity 8 is connected to the cooling fluid supply and the first cavity 2 is connected to the cooling fluid return—the cooling fluid flows into the second cavity 8 from the second interface 9, flows back into each heat exchanger through each through pipe 5, exchanges heat with the heat exchange plate 7, and then flows into the first cavity 2, finally exiting from the first interface 1. This reverse usage method also allows the cooling fluid to enter and exit the heat exchange zone in a direction perpendicular to the heat exchange plate, avoiding the upstream and downstream temperature difference formed by long-distance flow in the planar direction, thus achieving uniform heat dissipation.

[0040] It is worth emphasizing that, regardless of whether the connection is forward or reverse, the core technical feature of this invention—that the cooling fluid enters and exits the heat exchanger in a direction perpendicular to the heat exchange plate, and that the cooling fluid must pass through the heat chamber to reach the heat exchange zone—remains unchanged. The roles of the first and second chambers (cooling fluid supply chamber / return chamber) can be freely interchanged according to the actual pipeline layout requirements, which provides great flexibility for system integration. If temperature uniformity needs to be adjusted when used in reverse, it can be adjusted by changing the diameter of the through pipe 5, or by adding a flared end at the inlet of the through pipe 5 to reduce flow resistance.

[0041] This invention eliminates the long, narrow water channels found in traditional water-cooled plates, resulting in very low overall water flow resistance. This allows the water cooling system to operate under negative pressure below atmospheric pressure, completely avoiding the risk of damage to electronic equipment caused by potential leakage.

[0042] In addition, as can be seen from the structure, the uniform temperature water-cooled plate of the present invention is also applicable to the two-phase operation mode of vapor and liquid evaporation and heat absorption on the heat exchanger fins and wall surface by using a small liquid flow rate for fluid injection, and the evaporating liquid is not limited to water.

[0043] The cold plate in the diagram is drawn as a single unit. However, depending on the manufacturing process, it could also be assembled from several parts or have its outer shell welded together to achieve optimal watertightness. This is not only applicable to ground-based equipment but also meets the stringent requirements of space applications where the cooling medium must not leak or evaporate.

[0044] like Figure 5 The image shown is a cross-sectional view of the heat-cold separator 4. The heat-cold separator 4 can be made of a poor conductor of heat, such as ceramic, glass, or resin.

[0045] As a preferred implementation scheme, such as Figure 6 As shown, the hot and cold insulation plate 4 can adopt a hollow shell structure, where 11 is the cold end shell, 12 is the hot end shell, 13 is the weld at the end of the through pipe 5, and 14 is the weld between the cold and hot end shells. The cold end shell 11, formed by stamping and stretching metal material, is welded to the hot end shell 12 to form a sealed whole, utilizing the hollow air layer to prevent heat from being conducted from the second cavity 8 to the first cavity 2. This hollow shell structure has superior thermal insulation performance compared to solid insulation materials, and the metal shell structure has high strength, mature manufacturing process, and controllable cost.

[0046] Based on the aforementioned hollow shell structure, as a further optimized implementation scheme, internal vacuuming can be used to further improve the thermal insulation performance (the vacuuming nozzle is located in...). Figure 6 (Not shown in the diagram). However, it should be noted that vacuuming is not a necessary technical feature for achieving the purpose of this invention—even without vacuuming, the hollow air layer itself already possesses good thermal insulation capabilities; while vacuuming can further improve the thermal insulation effect, if water enters the vacuum chamber due to seal failure during long-term use, it may actually degrade the thermal insulation performance. Therefore, vacuuming should be considered an optional high-performance optimization solution, rather than a necessary technical feature of this invention. To maintain a long-term vacuum level, the vacuuming nozzle can be retained in the product, similar to the compressor in a refrigerator, for reuse during equipment maintenance.

[0047] If the heat exchange cooling plate of this invention is made of copper or a copper alloy, gold plating for corrosion protection is a valuable option. When manufactured using aluminum or aluminum alloys, anodizing or similar treatments can be employed.

[0048] like Figure 7 The image shown is a partial cross-sectional enlarged view of the heat exchanger, which further clearly reveals the structure of the curved heat dissipation fins 6, which begin to receive the sprayed coolant at the outlet of the through-pipe 5 and enter the heat exchange process.

[0049] like Figure 8 The image shown is a partial enlarged cross-sectional view of a microtube heat exchanger, which is formed by replacing the flow channels between the heat dissipation fins 6 in the heat exchanger with flow channel micro-water pipes 15. The flow channel micro-water pipes 15 can have a manifold structure to address the issue that the dense arrangement of flow channel micro-water pipes 15 near the outlet of the through pipe 5 would occupy too much of the physical space of the metal material of the heat exchange plate 7 due to congestion, thereby reducing the heat exchange capacity.

[0050] Figure 8 The micro-channel water pipe 15 shown is only a schematic diagram. Ideally, the spatial configuration of the micro-channel water pipe 15 should mimic the arteries of an animal, branching into smaller arteries, then into capillaries, and finally even capillaries. This would achieve a balance between the space occupied by the metal material of the heat exchange plate 7 and the space occupied by the micro-channel water pipe 15, resulting in better heat exchange capacity. With current technology, the only way to manufacture such a heat exchange plate 7 is through additive 3D printing.

[0051] The uniform temperature water-cooled plate of the present invention is drawn in a planar configuration in all the accompanying drawings for ease of description and clarity, but this does not mean that it is limited to a planar configuration. If the heat-generating element is of other geometric shapes, such as a cylinder or a sphere, and needs to dissipate heat, the heat exchange plate 7 can be designed in a corresponding cylindrical or spherical configuration, but the flow field topology during fluid heat exchange remains unchanged. Industrial applicability

[0052] The homogeneous water-cooled plate provided by this invention can be widely used for heat dissipation in high-power-density electronic devices such as semiconductor digital chips, power chips, radar, and lasers, demonstrating good industrial applicability and market prospects. In particular, in the vacuum environment of space, the homogeneous water-cooled plate of this invention eliminates the upstream and downstream temperature difference along a planar direction, achieving temperature uniformity on the heat dissipation surface. This allows radiative heat sinks to operate at a higher average temperature, thereby effectively improving radiative heat dissipation efficiency. This has significant engineering application value for high-computing power applications such as spaceborne high-performance computing and space data centers that rely on radiative heat dissipation.

Claims

1. A uniform temperature water-cooled plate, characterized in that, include: A heat exchange plate having a heat absorption surface and a heat dissipation surface, wherein multiple heat exchangers are densely distributed on the heat dissipation surface, and each heat exchanger is composed of radially arranged heat dissipation fins. The first cavity and the second cavity are stacked sequentially on the same side of the heat exchange plate and isolated from each other by a hot and cold partition. The hot and cold partition is used to block the conduction of heat between the first cavity and the second cavity. The first cavity and the second cavity respectively have a first interface and a second interface that connect to the outside. Multiple through pipes, each of which passes through the hot and cold partition and the second cavity, with one end connected to the first cavity and the other end extending to the corresponding heat exchanger; When the first cavity is connected to a cooling fluid supply and the second cavity is connected to a cooling fluid return flow, the cooling fluid flows from the first cavity through each of the through pipes into each of the heat exchangers, exchanges heat with the heat exchange plates, and then flows back into the second cavity and is discharged. When the second cavity is connected to a cooling fluid supply and the first cavity is connected to a cooling fluid return flow, the cooling fluid flows from the second cavity through each of the through pipes into each of the heat exchangers, exchanges heat with the heat exchange plates, and then flows back into the first cavity and is discharged. The cooling fluid exchanges heat in the heat exchanger along a path perpendicular to the heat exchange plate, thereby avoiding the upstream and downstream temperature difference caused by the cooling fluid flowing a long distance along the plane of the heat exchange plate.

2. The uniform temperature water-cooled plate according to claim 1, characterized in that, The portion of the through-pipe that passes through the hot and cold partition and the second cavity is provided with a heat insulation structure, or the entire through-pipe is made of heat insulation material, so as to keep the cooling fluid insulated from the fluid in the second cavity when it passes through the second cavity.

3. The uniform temperature water-cooled plate according to claim 1, characterized in that, The heat dissipation fins are straight blade-shaped or hook-shaped and are arranged starting from the center of the outlet of the through pipe; the heat exchangers are arranged in a hexagonal or square pattern and are circular, square or hexagonal in shape.

4. The uniform temperature water-cooled plate according to claim 1, characterized in that, The heat insulation barrier is made of a poor conductor of heat, including ceramics, glass, or resin.

5. The uniform temperature water-cooled plate according to claim 1, characterized in that, The hot and cold insulation plate is a hollow shell structure, which is formed by stamping and stretching metal materials and then welding them into a sealed whole.

6. The uniform temperature water-cooled plate according to claim 5, characterized in that, The hollow shell structure is internally evacuated.

7. The uniform temperature water-cooled plate according to claim 1, characterized in that, Each heat exchanger on the heat exchange plate operates independently, and the heat dissipation capacity of each heat exchanger can be adjusted by adjusting the diameter of the through pipe or the size of the heat dissipation fins.

8. The uniform temperature water-cooled plate according to claim 1, characterized in that, The flow channels between the heat dissipation fins are configured as flow channel micro-water pipes, and the flow channel micro-water pipes have a manifold structure.

9. The uniform temperature water-cooled plate according to any one of claims 1 to 8, characterized in that, The uniform temperature water-cooled plate adopts a single-phase liquid cooling or a two-phase vapor-liquid cooling mode.

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