A water-cooling heat dissipation device for power semiconductor devices

Abstract

The application discloses a water-cooling heat dissipation device for power semiconductor devices, and relates to the technical field of heat dissipation of power semiconductor devices, comprising a rack, a water-cooling heat dissipation mechanism and a feeding and discharging mechanism; the water-cooling heat dissipation mechanism comprises a first driving assembly and a cooling stamping assembly, and the cooling stamping assembly comprises a cooling plate with a cooling medium flow channel arranged in the cooling plate; the feeding and discharging mechanism is arranged below the water-cooling heat dissipation mechanism and comprises a conveying assembly, a second driving assembly and a jacking assembly; the conveying assembly comprises a first carrier, a second carrier, a first sliding rail and a second sliding rail; the second sliding rail is located on the inner side of the first sliding rail and has a lower height; the first carrier with a larger width is slidably arranged on the first sliding rail; the jacking assembly is slidably arranged on the second sliding rail and connected with the second carrier with a smaller width; the second carrier can pass below the first carrier without interfering with each other, so that double-station alternating operation is realized. The application has the advantages of compact structure, simultaneous heat dissipation, pressure maintenance, feeding and discharging, and high cooling efficiency.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation for power semiconductor devices, and in particular to a water-cooled heat dissipation device for power semiconductor devices. Background Technology

[0002] Power semiconductor devices generate conduction losses, switching losses, and reverse recovery losses during switching and conduction operations. These electrical energy losses are converted into heat and concentrated at the active junction of the chip. If the junction temperature exceeds the limit, it will lead to increased on-resistance, thermal runaway, package cracking, and even permanent burnout. Therefore, efficient and reliable heat dissipation and cooling are critical processes for ensuring device quality during the production and testing of power semiconductor devices.

[0003] Water-cooling solutions have been widely used for cooling power semiconductor devices. For example, a water-cooled plate is pressed down onto the device surface by a cylinder or electric device, and heat is carried away by circulating coolant, achieving contact conduction heat dissipation. However, existing water-cooling equipment generally adopts a single-station operation mode, that is, loading, cooling, and unloading operations are completed sequentially at the same station. Because the water-cooling process requires a certain pressure-holding contact time to ensure sufficient cooling, the loading and unloading channels of the equipment are occupied during this period. Operators or automated loading and unloading mechanisms must wait for the cooling process to be completed before unloading and reloading can be performed. This results in the equipment being in an idle state during the cooling and pressure-holding period, limiting the output per unit time.

[0004] To address the aforementioned issues, some equipment has adopted dual-station or multi-station layouts to improve cycle time. However, existing solutions still have significant shortcomings. To avoid motion interference between the two carrier plates during horizontal sliding, parallel dual-track layouts on the same layer typically require long avoidance strokes or complex track-changing mechanisms at both ends, resulting in a bulky and large-area machine that is difficult to adapt to compact production lines. Summary of the Invention

[0005] In order to improve the problem that existing power semiconductor device water cooling heat dissipation equipment is bulky and occupies a large area due to long avoidance stroke and complex track changing mechanism in dual-station layout, this application provides a power semiconductor device water cooling heat dissipation device.

[0006] This application provides a water-cooled heat dissipation device for power semiconductor devices, which adopts the following technical solution: A water-cooling heat dissipation device for power semiconductor devices, comprising: frame; A water-cooled heat dissipation mechanism includes a first driving component and a cooling stamping component. The cooling stamping component includes a cooling plate with a cooling medium flow channel inside. The first driving component is mounted on the frame and is used to drive the cooling plate to move in the vertical direction. The loading and unloading mechanism, located below the water-cooling heat dissipation mechanism, includes a transport component, a second drive component, and a lifting component. The transport component includes a first carrier, a second carrier, a first slide rail, and a second slide rail. The second slide rail is located inside the first slide rail, and the height of the first slide rail is higher than that of the second slide rail. The width of the first carrier is greater than that of the second carrier. Both the first carrier and the second carrier are used to carry power semiconductor devices. The first carrier is slidably mounted on the first slide rail, and the lifting component is slidably mounted on the second slide rail. The lifting end of the lifting component is connected to the second carrier. The second drive component is used to drive the first carrier and the lifting component to move horizontally.

[0007] By adopting the above technical solution, the first and second slide rails are configured as a double-layer track layout with different inner and outer sides and heights. The wider first carrier slides on the outer, higher first slide rail, while the narrower second carrier slides on the inner, lower second slide rail via a lifting assembly. Since the second slide rail is located inside the first slide rail and is at a lower height, the second carrier and its lifting assembly can pass under the first carrier. The horizontal movement paths of the two do not interfere with each other, eliminating the need for additional obstacle avoidance travel or complex track-changing mechanisms. This significantly reduces the horizontal size of the equipment, resulting in a compact structure, small footprint, and suitability for compact production lines. Simultaneously, while power semiconductor devices on one carrier are being cooled, another carrier can perform loading and unloading operations on the side, improving batch cooling efficiency.

[0008] Optionally, the cooling stamping assembly further includes a floating pressure plate, and a plurality of buffer units are connected between the floating pressure plate and the cooling plate; the first drive assembly includes a lifting source and a floating connector connected to the output end of the lifting source, and the floating connector is connected to the floating pressure plate.

[0009] By adopting the above technical solution, the riser drives the floating pressure plate through the floating joint, which in turn drives the cooling plate to move vertically to contact the surface of the power semiconductor device for heat dissipation. The floating joint can compensate for any slight eccentricity or angular deviation that may exist between the output end of the riser and the floating pressure plate, avoiding jamming and off-center wear caused by rigid connection. The buffer unit is connected between the floating pressure plate and the cooling plate, providing elastic overpressure buffer protection when the cooling plate presses down to contact the power semiconductor device, preventing damage to the power semiconductor device or the cooling plate due to excessive pressure, while ensuring uniform contact between the cooling plate and the device surface, thus improving the heat dissipation effect.

[0010] Optionally, the buffer unit includes a connecting rod and an elastic element. One end of the connecting rod passes through the floating pressure plate and is grounded to the floating pressure plate. The other end of the connecting rod is threaded to the cooling plate. The elastic element abuts between the floating pressure plate and the cooling plate and is sleeved on the outside of the connecting rod.

[0011] By adopting the above technical solution, one end of the connecting rod passes through the floating pressure plate and is grounded with the floating pressure rod, while the other end is threaded to the cooling plate, thereby achieving a reliable connection between the floating pressure plate and the cooling plate, and limiting the maximum separation distance between the cooling plate and the floating pressure plate. The elastic element is sleeved outside the connecting rod and abuts against the floating pressure plate and the cooling plate. When the cooling plate presses down to contact the power semiconductor device, the elastic element is compressed to absorb the excess downward pressure, thereby achieving overpressure buffer protection. The structure is simple and the buffering effect is reliable.

[0012] Optionally, the water-cooling heat dissipation mechanism further includes a first guide structure, which includes a first guide post and a first guide bushing. The first guide bushing is located above the floating pressure plate and fixed to the frame. The first guide post is vertically arranged, with one end fixed to the floating pressure plate and the other end passing through the first guide bushing.

[0013] By adopting the above technical solution, the first guide post and the first guide bushing cooperate to form a guide structure, which stably guides the lifting and lowering movement of the floating pressure plate and the cooling plate, prevents the cooling plate from tilting or shaking during the pressing process, ensures that the cooling plate is evenly attached to the surface of the power semiconductor device, and improves the uniformity of heat dissipation and the stability of the pressing action.

[0014] Optionally, the cooling plate includes a plate body, a cooling connector, and a drain plug, and the cooling medium flow channel is disposed in the plate body; the cooling medium flow channel includes a cooling channel and a connecting channel, and multiple cooling channels are spaced apart, and the connecting channel is connected to each of the cooling channels; the cooling connector is connected to one end of the cooling channel, and the drain plug can be detachably connected to both ends of the connecting channel.

[0015] By adopting the above technical solution, multiple spaced cooling channels combined with vertically arranged connecting channels enable the cooling medium to form a uniformly distributed cooling medium flow channel within the plate, improving the heat dissipation uniformity of the cooling plate. The cooling connector is connected to one end of the cooling channel, facilitating the connection of an external circulating coolant pipeline to achieve continuous circulation of the cooling medium. Drain plugs can be detached at both ends of the connecting channel, allowing for easy removal of the drain plugs during maintenance to clean and drain the inside of the cooling medium flow channel, keeping the flow channel unobstructed and ensuring long-term heat dissipation performance.

[0016] Optionally, the lifting assembly includes a horizontal sliding plate and a lifting source. The horizontal sliding plate is slidably disposed on the second slide rail, the lifting source is connected to the bottom of the horizontal sliding plate, and the lifting end of the lifting assembly is located on the lifting source.

[0017] By adopting the above technical solution, the horizontal slide plate slides along the second slide rail to realize the horizontal movement of the second carrier. The lifting source is connected to the bottom of the horizontal slide plate and the lifting end is connected to the second carrier. When the second carrier moves to the heat dissipation station, that is, below the cooling plate, the lifting source drives the second carrier to rise to a height equivalent to that of the first carrier, so that the cooling plate presses down to contact the power semiconductor device carried on the second carrier for heat dissipation.

[0018] Optionally, the loading and unloading mechanism further includes a second guide structure, which includes a second guide post and a second guide bushing; the second guide bushing is connected to the horizontal slide plate, the second guide post is vertically arranged, and one end of the second guide post passes through the second guide bushing and is fixed to the second carrier.

[0019] By adopting the above technical solution, the second guide column and the second guide bushing cooperate to form a guide structure, which guides the lifting and lowering movement of the second carrier relative to the horizontal sliding plate, prevents the second carrier from tilting or swaying during the lifting process, ensures that the second carrier remains horizontal after rising, and makes the power semiconductor devices carried on it fit flatly and in close contact with the cooling plate, thereby improving the uniformity of heat dissipation and the stability of the lifting action.

[0020] Optionally, the second drive component includes a drive source and a transmission structure. The output end of the drive source is connected to the first vehicle and is used to drive the first vehicle to slide along the first slide rail. The first vehicle is connected to the lifting component through the transmission structure and is used to drive the lifting component to slide in the opposite direction to the first vehicle along the second slide rail.

[0021] By adopting the above technical solution, a single drive source is used to drive the first carrier and the lifting assembly simultaneously. The synchronous reverse movement of the two is achieved through the transmission structure. That is, when the first carrier moves in one direction along the first slide rail, the lifting assembly carries the second carrier and moves in the opposite direction along the second slide rail, so that the first carrier and the second carrier always move in opposite directions without interference. A single drive source can realize the alternating switching of dual workstations, reduce the number of drive components, reduce costs and improve linkage reliability.

[0022] Optionally, the bottom of the first carrier is connected to a first connecting member, and one side of the lifting assembly is connected to a second connecting member; the transmission structure includes a transmission wheel and a synchronous belt, two transmission wheels are rotatably arranged on the frame, the synchronous belt is wrapped around the two transmission wheels, and the first connecting member and the second connecting member are both connected to the synchronous belt.

[0023] By adopting the above technical solution, the first connector and the second connector are respectively connected to different positions of the synchronous belt. Since the synchronous belt is wrapped around the two transmission wheels to form a loop, the two belt segments on the synchronous belt located between the two transmission wheels move in opposite directions. By connecting the first connector and the second connector to the belt segments with opposite directions of movement, the synchronous reverse movement of the first carrier and the lifting assembly can be achieved.

[0024] Optionally, multiple buffer units are provided, and the multiple buffer units are evenly distributed along the circumference of the floating pressure plate.

[0025] By adopting the above technical solution, multiple buffer units are evenly distributed along the circumference of the floating pressure plate, so that the buffer force on the cooling plate is uniform in all directions, avoiding the cooling plate from tilting due to uneven force during the pressing process, and ensuring that the cooling plate and the surface of the power semiconductor device are fully and uniformly bonded.

[0026] In summary, this application includes at least one of the following beneficial effects: 1. In this application, by setting the first slide rail and the second slide rail as a double-layer track layout with different inner and outer sides and different heights, the second carrier and its lifting components can pass under the first carrier without interfering with each other, without the need for additional avoidance stroke or complex track changing mechanism, significantly reducing the horizontal dimension of the equipment, making the whole machine compact and occupying a small area, while realizing the overlap of the time during heat dissipation and pressure holding with the loading and unloading operation, improving batch cooling efficiency. 2. In this application, the design of floating joint and buffer unit is used to realize deviation compensation and overvoltage buffer protection during the cooling plate pressing process, to prevent power semiconductor devices from being damaged by overvoltage, and at the same time to ensure uniform contact between the cooling plate and the device surface, thereby improving heat dissipation reliability. 3. The transmission structure consisting of a transmission wheel and a synchronous belt in this application enables the synchronous reverse movement of the first carrier and the lifting assembly with a single drive source, ensuring the synchronicity and accuracy of the alternating switching between the two workstations. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the water-cooled heat dissipation device for power semiconductor devices in Embodiment 1 of this application; Figure 2 This is a schematic diagram of the water-cooled heat dissipation mechanism in Embodiment 1 of this application; Figure 3 This is a schematic diagram of the internal flow channel structure of the cooling plate in Embodiment 1 of this application; Figure 4 This is a front view schematic diagram of the water-cooled heat dissipation device for power semiconductor devices in Embodiment 1 of this application; Figure 5This is a schematic diagram of the overall structure of the water-cooled heat dissipation device for power semiconductor devices in Embodiment 2 of this application.

[0028] Explanation of reference numerals in the attached drawings: 1. Frame; 11. Lower base; 12. Support column; 13. Mounting plate; 2. Water-cooled heat dissipation mechanism; 21. First drive assembly; 211. Lifting source; 212. Floating joint; 22. Cooling stamping assembly; 221. Cooling plate; 2211. Plate body; 2212. Cooling joint; 2213. Drain plug; 2214. Cooling channel; 2215. Connecting channel; 222. Floating pressure plate; 223. Buffer unit; 2231. Connecting rod; 2232. Elastic element; 23. First guide structure; 231. First guide column; 232. First guide bushing; 3. 31. Loading and unloading mechanism; 31. Transport component; 311. First carrier; 312. Second carrier; 313. First slide rail; 314. Second slide rail; 32. Second drive component; 321. Drive source; 322. Transmission structure; 3221. Transmission wheel; 3222. Synchronous belt; 323. First connector; 324. Second connector; 325. First drive unit; 326. Second drive unit; 33. Lifting component; 331. Horizontal slide plate; 332. Lifting source; 34. Second guide structure; 341. Second guide column; 342. Second guide bushing; 4. Power semiconductor device. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1 -Appendix Figure 5 This application will be described in further detail.

[0030] Example 1: Embodiment 1 of this application provides a water-cooled heat dissipation device for power semiconductor devices.

[0031] A water-cooling heat dissipation device for power semiconductor devices includes a frame 1, a water-cooling heat dissipation mechanism 2, and a loading / unloading mechanism 3. The water-cooling heat dissipation mechanism 2 is located on the upper part of the frame 1 and is used for contact water cooling of the power semiconductor device 4. The loading / unloading mechanism 3 is located below the water-cooling heat dissipation mechanism 2 and is used to transport the carrier carrying the power semiconductor device 4 to the heat dissipation station below the water-cooling heat dissipation mechanism 2, and to transport the cooled power semiconductor device 4 out of the heat dissipation station, realizing alternating operation of the two stations.

[0032] refer to Figure 1The frame 1 includes a lower base 11, support columns 12, and mounting plate 13. The lower base 11 is horizontally positioned, serving as the bottom base of the entire device. Two sets of support columns 12 are provided, each set containing two columns, located on opposite sides of the lower base 11. The lower ends of the support columns 12 are fixedly connected to the sides of the lower base 11 via connecting brackets, and the upper ends of the support columns 12 are fixedly connected to the mounting plate 13. The mounting plate 13 is horizontally positioned on top of the support columns 12 and is used to mount the first drive assembly 21 in the water-cooling heat dissipation mechanism 2. In other embodiments, the frame 1 may also adopt other forms such as an integrated frame structure or a profile splicing structure.

[0033] refer to Figure 1 and Figure 2 The water-cooled heat dissipation mechanism 2 includes a first driving component 21 and a cooling stamping component 22. The first driving component 21 is mounted on the frame 1 and is used to drive the cooling plate 221 in the cooling stamping component 22 to move in the vertical direction, so as to achieve the contact and separation of the cooling plate 221 with the surface of the power semiconductor device 4.

[0034] refer to Figure 1 and Figure 2 The cooling stamping assembly 22 includes a cooling plate 221 and a floating pressure plate 222. The cooling plate 221 has cooling medium channels machined within it for circulating coolant to remove heat conducted from the power semiconductor device 4 onto the cooling plate 221. The floating pressure plate 222 is positioned above the cooling plate 221, and several buffer units 223 connect the floating pressure plate 222 and the cooling plate 221. The buffer units 223 provide elastic overpressure buffer protection when the cooling plate 221 presses down on the power semiconductor device 4, preventing damage to the power semiconductor device 4 due to excessive pressure, while ensuring uniform contact between the cooling plate 221 and the surface of the power semiconductor device 4.

[0035] refer to Figure 2 In this embodiment, multiple buffer units 223 are provided, and the multiple buffer units 223 are evenly distributed along the circumference of the floating pressure plate 222. The floating pressure plate 222 is configured as a rectangular plate. In this embodiment, four buffer units 223 are provided, which are respectively arranged near the four apex corners of the floating pressure plate 222. This is beneficial to the balanced force on the cooling plate 221 and reduces the risk of tilting. In other embodiments, the number of buffer units 223 can also be two, three, six or more, and the distribution is not limited to a uniform circumferential distribution. They can also be arranged adaptively according to the shape and force characteristics of the cooling plate 221.

[0036] refer to Figure 2Each buffer unit 223 includes a connecting rod 2231 and an elastic element 2232. One end of the connecting rod 2231 passes through the floating pressure plate 222, and the other end is threaded to the cooling plate 221. Specifically, the connecting rod 2231 is a shouldered stud, the diameter of which is larger than the diameter of the hole on the floating pressure plate 222, so that the connecting rod 2231 will not fall out of the hole after passing through the floating pressure plate 222, and can slide along the axial direction of the hole. The elastic element 2232 is sleeved on the outside of the connecting rod 2231, one end of which abuts against the lower surface of the floating pressure plate 222, and the other end abuts against the upper surface of the cooling plate 221. In this embodiment, the elastic element 2232 is a compression spring. When the lifting source 211 drives the floating pressure plate 222 downward, the floating pressure plate 222 transmits the downward pressure to the cooling plate 221 through the elastic element 2232. When the cooling plate 221 continues to descend after pressing down and contacting the power semiconductor device 4, the elastic element 2232 is compressed to absorb the excess downward pressure, thus achieving overpressure buffer protection. In other embodiments, the elastic element 2232 can also be other elastic elements such as disc springs, elastic rubber pads, and polyurethane elastomers.

[0037] refer to Figure 2 The first drive assembly 21 includes a lifting source 211 and a floating joint 212. The lifting source 211 is fixedly mounted on the mounting plate 13 of the frame 1, with its output end facing downwards. In this embodiment, the lifting source 211 is a cylinder. The floating joint 212 is connected to the output end of the lifting source 211, and its lower end is connected to a floating pressure plate 222. The floating joint 212 can compensate for any slight eccentricity or angular deviation that may exist between the output end of the lifting source 211 and the floating pressure plate 222, preventing the floating pressure plate 222 from jamming or experiencing uneven wear due to installation errors during lifting. In other embodiments, the lifting source 211 can also be a hydraulic cylinder, an electric cylinder, an electric push rod, or other linear drive components.

[0038] refer to Figure 2The water-cooled heat dissipation mechanism 2 also includes a first guide structure 23. The first guide structure 23 guides the lifting and lowering movements of the floating pressure plate 222 and the cooling plate 221, preventing them from tilting or swaying during the pressing process. The first guide structure 23 includes a first guide post 231 and a first guide sleeve 232. The first guide sleeve 232 is located above the floating pressure plate 222 and is fixed to the mounting plate 13 of the frame 1. The first guide post 231 is vertically arranged, with its lower end fixed to the floating pressure plate 222 and its upper end passing through the first guide sleeve 232 and sliding along it. In this embodiment, the first guide sleeve 232 is a linear bearing, and the first guide post 231 is an optical axis that cooperates with the linear bearing to achieve a low-friction, high-precision guiding effect. Multiple sets of the first guide structure 23 are provided. In this embodiment, four sets of the first guide structure 23 are provided, evenly distributed around the periphery of the lifting source 211.

[0039] refer to Figure 2 and Figure 3 The cooling plate 221 includes a plate body 2211, a cooling joint 2212, and a drain plug 2213. Cooling medium channels are located inside the plate body 2211. The plate body 2211 is a metal plate with good thermal conductivity; in this embodiment, the plate body 2211 is made of copper or aluminum.

[0040] refer to Figure 3The cooling medium flow channel includes cooling channels 2214 and connecting channels 2215. Multiple cooling channels 2214 are spaced apart along the length of the plate 2211, penetrating the entire cooling plate 221, and are parallel to each other. Connecting channels 2215 are perpendicular to the cooling channels 2214 and communicate with each cooling channel 2214, allowing the cooling channels 2214 to communicate with each other through the connecting channels 2215, forming a grid-like flow channel layout to ensure uniform distribution and flow of the cooling medium within the plate 2211. Cooling connectors 2212 are connected to one end of the cooling channels 2214. Both the cooling connectors and the ports at one end of the cooling channels 2212 are used to connect to external circulating coolant pipelines. Two cooling connectors 2212 are provided for liquid inlet, and the coolant, after absorbing heat, is discharged from the port at one end of the cooling channels 2214. Both ends of the connecting channel 2215 are detachably connected to drain plugs 2213. Under normal operating conditions, the drain plugs 2213 seal the ports of the connecting channel 2215. During maintenance and cleaning, the drain plugs 2213 can be removed to open the ports of the connecting channel 2215, allowing for flushing and drainage of the flow channel to remove accumulated scale or impurities and maintain unobstructed flow. In this embodiment, the drain plugs 2213 are threaded to the ports of the connecting channel 2215. In other embodiments, the drain plugs 2213 can also be connected to the ports of the connecting channel 2215 using other detachable connection methods such as snap-fit ​​or quick-release couplings.

[0041] refer to Figure 1 and Figure 4 The loading and unloading mechanism 3 is located below the water-cooled heat dissipation mechanism 2 and includes a transport component 31, a second drive component 32, and a lifting component 33.

[0042] refer to Figure 1 The transport component 31 includes a first carrier 311, a second carrier 312, a first slide rail 313, and a second slide rail 314. Both the first slide rail 313 and the second slide rail 314 extend horizontally and are mounted on the frame 1. The second slide rail 314 is located inside the first slide rail 313, and the first slide rail 313 is at a higher height than the second slide rail 314, forming a double-layered track layout with different heights on the inner and outer sides. In this embodiment, the height difference between the first slide rail 313 and the second slide rail 314 is achieved through the structural design of the frame 1. Specifically, the lower base 11 includes two mounting platforms of different heights. The first slide rail 313 is mounted on the higher mounting platform, and the second slide rail 314 is mounted on the lower mounting platform. In this embodiment, there are two first slide rails 313, respectively located on the left and right outer edges of the frame 1; there are also two second slide rails 314, respectively located inside the two first slide rails 313, and the four slide rails are parallel to each other. Both the first slide rail 313 and the second slide rail 314 are linear guide rails.

[0043] refer to Figure 4 Both the first carrier 311 and the second carrier 312 are used to carry the power semiconductor device 4. The width of the first carrier 311 is greater than the width of the second carrier 312. The bottom of the first carrier 311 is slidably connected to the first slide rail 313 via a slider, and can slide back and forth in the horizontal direction along the first slide rail 313. The second carrier 312 is indirectly slidably disposed on the second slide rail 314 via a lifting assembly 33. Since the second slide rail 314 is located inside the first slide rail 313 and is lower in height, when the second carrier 312 is in the unlifted low position, the overall height of the second carrier 312 and the lifting assembly 33 is lower than that of the first carrier 311, and the second carrier 312 can pass under the first carrier 311 without motion interference.

[0044] refer to Figure 4 The lifting assembly 33 includes a horizontal sliding plate 331 and a lifting source 332. The bottom of the horizontal sliding plate 331 is slidably connected to the second slide rail 314 via a slider, and can reciprocate horizontally along the second slide rail 314. The lifting source 332 is connected to the bottom of the horizontal sliding plate 331, with its lifting end facing upwards and connected to the second carrier 312. In this embodiment, the lifting source 332 is a lifting cylinder. When the second carrier 312 moves along the second slide rail 314 to the heat dissipation position below the cooling plate 221, the lifting source 332 drives the second carrier 312 to rise, raising it to a height equivalent to that of the first carrier 311, so that the cooling plate 221 presses down to contact the power semiconductor device 4 carried on the second carrier 312 for heat dissipation. After heat dissipation is complete, the lifting source 332 drives the second carrier 312 to descend and reset to the low position. In other embodiments, the lifting source 332 may also employ other lifting drive components such as hydraulic cylinders, electric cylinders, and lead screw lifting platforms.

[0045] refer to Figure 4 The loading and unloading mechanism 3 also includes a second guide structure 34 for precisely guiding the lifting and lowering movement of the second carrier 312 relative to the horizontal slide plate 331. The second guide structure 34 includes a second guide post 341 and a second guide bushing 342. The second guide bushing 342 is connected to the horizontal slide plate 331. The second guide post 341 is vertically oriented, with its upper end extending through the second guide bushing 342 and fixed to the second carrier 312. The second guide post 341 can slide up and down along the second guide bushing 342. Multiple sets of the second guide structure 34 are provided; in this embodiment, four sets are provided, evenly distributed around the lifting source 332. In this embodiment, the second guide bushing 342 is a linear bearing, and the second guide post 341 is an optical axis that cooperates with the linear bearing.

[0046] refer to Figure 4The second drive assembly 32 is used to drive the first carrier 311 and the lifting assembly 33 to move horizontally, so that the carrier moves closer to or away from the cooling plate 221. In this embodiment, the second drive assembly 32 includes a drive source 321 and a transmission structure 322.

[0047] refer to Figure 4 The output end of the drive source 321 is connected to the first carrier 311 and is used to drive the first carrier 311 to slide along the first slide rail 313. In this embodiment, the drive source 321 is a transplanting cylinder, which is fixedly installed on the lower base 11. The piston rod of the transplanting cylinder is fixed to the lower base 11, and the cylinder body of the transplanting cylinder is connected to the first carrier 311 through a connecting plate. A first connecting member 323 is fixed to the bottom of the first carrier 311, and a second connecting member 324 is fixed to one side of the lifting assembly 33. The transmission structure 322 includes a transmission wheel 3221 and a synchronous belt 3222. Two transmission wheels 3221 are rotatably connected on the frame 1 through bearing seats. The two transmission wheels 3221 are arranged at intervals in the horizontal direction, and the shaft of each transmission wheel 3221 is vertically set, with its axis perpendicular to the length direction of the first slide rail 313. The synchronous belt 3222 is wound around the outside of the two transmission wheels 3221 to form a loop. The synchronous belt 3222 forms two segments with opposite relative motion directions between the two drive pulleys 3221. A first connector 323 is connected to one side of the synchronous belt 3222, and a second connector 324 is connected to the other side of the synchronous belt 3222, with the two segments moving in opposite directions. When the drive source 321 drives the first carrier 311 to move in one direction along the first slide rail 313, the first carrier 311 drives the synchronous belt 3222 to move via the first connector 323, while the other side of the synchronous belt 3222 moves in the opposite direction. This, in turn, drives the horizontal sliding plate 331 of the lifting assembly 33 to move in the opposite direction along the second slide rail 314 via the second connector 324, thereby achieving synchronous reverse motion of the first carrier 311 and the second carrier 312. In this embodiment, the drive pulley 3221 is a synchronous belt pulley, and both the first connector 323 and the second connector 324 adopt a fixed connection structure using a synchronous belt toothed pressure plate and bolts for locking. In other embodiments, the transmission structure 322 may also adopt other transmission methods that can achieve reverse linkage, such as a combination of sprockets and chains, or a combination of rope pulleys and wire ropes.

[0048] The implementation principle of a water-cooled heat dissipation device for a power semiconductor device in Embodiment 1 of this application is as follows: During operation, in the initial state, the first carrier 311 is located at the heat dissipation station below the cooling plate 221, and the second carrier 312 is located to one side of the heat dissipation station. An operator or automated loading / unloading mechanism places the power semiconductor device 4 to be cooled onto the first carrier 311. The lifting source 211 drives the floating pressure plate 222 downwards along the first guide structure 23, causing the cooling plate 221 to press down and adhere to the surface of the power semiconductor device 4 on the first carrier 311. The elastic element 2232 in the buffer unit 223 is compressed to provide overpressure buffer protection. Circulating coolant is introduced through the cooling connector 2212 into the cooling channel 2214 and connecting channel 2215 in the cooling medium flow channel, carrying away the heat conducted from the power semiconductor device 4 to the cooling plate 221, achieving uniform cooling.

[0049] While the power semiconductor device 4 on the first carrier 311 is being cooled and pressure maintained, the operator or automated loading and unloading mechanism loads the power semiconductor device 4 to be cooled onto the second carrier 312 at the loading and unloading station, so as to achieve time overlap between the cooling process and the loading and unloading process.

[0050] After the power semiconductor device 4 on the first carrier 311 has finished cooling, the lifting source 211 drives the cooling plate 221 to rise and reset, disengaging from the power semiconductor device 4. The driving source 321 drives the first carrier 311 to slide to one side along the first slide rail 313, leaving the heat dissipation station. At the same time, through the transmission structure 322, the horizontal slide plate 331 of the lifting assembly 33 carries the second carrier 312 to slide into the heat dissipation station in the opposite direction along the second slide rail 314.

[0051] After the second carrier 312 reaches the heat dissipation station, the lifting source 332 drives the second carrier 312 to rise along the second guide structure 34 to a height equivalent to that of the first carrier 311. The lifting source 211 then drives the cooling plate 221 to press down and adhere to the power semiconductor device 4 on the second carrier 312 for heat dissipation. During this period, operators or automated loading and unloading mechanisms unload and reload the first carrier 311 at the loading and unloading station. This alternating cycle enables continuous operation at two stations, significantly improving cooling efficiency.

[0052] Example 2: Embodiment 2 of this application provides a water-cooling heat dissipation device for power semiconductor devices.

[0053] The difference between Embodiment 2 and Embodiment 1 of this application is that the structure of the second drive assembly 32 is different. The first carrier 311 does not need to be provided with the first connector 323 at the bottom, the lifting assembly 33 does not need to be provided with the second connector 324 on one side, and the frame 1 does not need to be provided with the transmission wheel 3221 and the timing belt 3222.

[0054] refer to Figure 5In this embodiment, the second drive assembly 32 includes a first drive unit 325 and a second drive unit 326, replacing the combination of drive source 321 and transmission structure 322 in embodiment 1. The first drive unit 325 is used to drive the first carrier 311 to slide along the first slide rail 313. The second drive unit 326 is used to drive the lifting assembly 33 to slide along the second slide rail 314. The first drive unit 325 and the second drive unit 326 are controlled independently.

[0055] Both the first drive unit 325 and the second drive unit 326 can employ linear drive methods such as cylinders, electric cylinders, linear motors, or motor-screw-nut mechanisms. In this embodiment, both the first drive unit 325 and the second drive unit 326 can directly use the transplanting cylinder from Embodiment 1. The transplanting cylinder is fixedly connected to the lower base 11 via a support. The cylinder body of one transplanting cylinder is fixedly connected to the first carrier 311, and the cylinder body of the other transplanting cylinder is fixedly connected to the horizontal sliding plate 331.

[0056] The implementation principle of a water-cooled heat dissipation device for a power semiconductor device in Embodiment 2 of this application is as follows: During operation, while the power semiconductor device 4 on the first carrier 311 is cooling down, after the second carrier 312 has finished loading, there is no need to wait for the first carrier 311 to leave the heat dissipation station. The second driving unit 326 can be used to drive the second carrier 312 carrying the power semiconductor device 4 to move in advance to the heat dissipation station below the cooling plate 221 to wait. After the power semiconductor device 4 on the first carrier 311 has cooled down and the cooling plate 221 has risen away from the heat dissipation area, the first driving unit 325 drives the first carrier 311 to slide away from the heat dissipation station. At this time, the second carrier 312 is already in place below the heat dissipation station and can be immediately lifted to the heat dissipation height by the lifting source 332 for cooling treatment, further shortening the station alternation time. During the cooling and heat dissipation of the power semiconductor device 4 on the second carrier 312, the first carrier 311 can be moved to the side of the heat dissipation station after loading is completed and wait. After the second carrier 312 has finished heat dissipating and descended to reset, the first carrier 311 continues to move forward to the heat dissipation area for heat dissipation, further improving the cooling efficiency. The remaining structure and working principle are the same as in Embodiment 1, and will not be described again here.

[0057] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A water-cooled heat dissipation device for power semiconductor devices, characterized in that, include: Rack (1); The water-cooled heat dissipation mechanism (2) includes a first drive assembly (21) and a cooling stamping assembly (22). The cooling stamping assembly (22) includes a cooling plate (221). The cooling plate (221) has a cooling medium flow channel. The first drive assembly (21) is mounted on the frame (1) and is used to drive the cooling plate (221) to move in the vertical direction. The loading and unloading mechanism (3) is located below the water-cooled heat dissipation mechanism (2) and includes a transport component (31), a second drive component (32), and a lifting component (33). The transport component (31) includes a first carrier (311), a second carrier (312), a first slide rail (313), and a second slide rail (314). The second slide rail (314) is located inside the first slide rail (313), and the height of the first slide rail (313) is higher than that of the second slide rail (314). The width of the first carrier (311) is greater than that of the second slide rail (314). The second carrier (312) is used to carry power semiconductor devices (4). The first carrier (311) is slidably disposed on the first slide rail (313), and the lifting component (33) is slidably disposed on the second slide rail (314). The lifting end of the lifting component (33) is connected to the second carrier (312). The second drive component (32) is used to drive the first carrier (311) and the lifting component (33) to move in the horizontal direction.

2. The water-cooled heat dissipation device for power semiconductor devices according to claim 1, characterized in that, The cooling stamping assembly (22) also includes a floating pressure plate (222), and a plurality of buffer units (223) are connected between the floating pressure plate (222) and the cooling plate (221). The first drive assembly (21) includes a lifting source (211) and a floating connector (212) connected to the output end of the lifting source (211), the floating connector (212) being connected to the floating pressure plate (222).

3. The water-cooled heat dissipation device for power semiconductor devices according to claim 2, characterized in that, The buffer unit (223) includes a connecting rod (2231) and an elastic element (2232). One end of the connecting rod (2231) passes through the floating pressure plate (222) and is grounded to the floating pressure plate (222). The other end of the connecting rod (2231) is threaded to the cooling plate (221). The elastic element (2232) abuts between the floating pressure plate (222) and the cooling plate (221) and is sleeved on the outside of the connecting rod (2231).

4. The water-cooled heat dissipation device for power semiconductor devices according to claim 2, characterized in that, The water-cooled heat dissipation mechanism (2) further includes a first guide structure (23), which includes a first guide post (231) and a first guide bushing (232). The first guide bushing (232) is located above the floating pressure plate (222) and is fixed to the frame (1); The first guide post (231) is vertically arranged. One end of the first guide post (231) is fixed on the floating pressure plate (222), and the other end passes through the first guide bushing (232).

5. The water-cooled heat dissipation device for power semiconductor devices according to claim 1, characterized in that, The cooling plate (221) includes a plate body (2211), a cooling connector (2212), and a drain plug (2213), and the cooling medium flow channel is disposed in the plate body (2211); The cooling medium flow channel includes a cooling channel (2214) and a connecting channel (2215). Multiple cooling channels (2214) are arranged at intervals, and the connecting channel (2215) is connected to each of the cooling channels (2214). The cooling connector (2212) is connected to one end of the cooling channel (2214), and the drain plug (2213) can be detachably connected to both ends of the connecting channel (2215).

6. The water-cooled heat dissipation device for power semiconductor devices according to claim 1, characterized in that, The lifting assembly (33) includes a horizontal sliding plate (331) and a lifting source (332). The horizontal sliding plate (331) is slidably disposed on the second slide rail (314). The lifting source (332) is connected to the bottom of the horizontal sliding plate (331). The lifting end of the lifting assembly (33) is located on the lifting source (332).

7. A water-cooled heat dissipation device for power semiconductor devices according to claim 6, characterized in that, The loading and unloading mechanism (3) further includes a second guide structure (34), which includes a second guide post (341) and a second guide bushing (342). The second guide bushing (342) is connected to the horizontal slide plate (331), the second guide post (341) is vertically arranged, and one end of the second guide post (341) passes through the second guide bushing (342) and is fixed to the second carrier (312).

8. A water-cooled heat dissipation device for power semiconductor devices according to claim 1, characterized in that, The second drive component (32) includes a drive source (321) and a transmission structure (322). The output end of the drive source (321) is connected to the first vehicle (311) and is used to drive the first vehicle (311) to slide along the first slide rail (313); The first carrier (311) is connected to the lifting assembly (33) through the transmission structure (322) to drive the lifting assembly (33) to slide in the opposite direction to the first carrier (311) along the second slide rail (314).

9. A water-cooled heat dissipation device for power semiconductor devices according to claim 8, characterized in that, The first carrier (311) is connected to a first connector (323) at its bottom, and the lifting assembly (33) is connected to a second connector (324) on one side. The transmission structure (322) includes a transmission wheel (3221) and a timing belt (3222). Two transmission wheels (3221) are rotatably arranged on the frame (1). The timing belt (3222) is wound around the two transmission wheels (3221). The first connecting member (323) and the second connecting member (324) are both connected to the timing belt (3222).

10. A water-cooled heat dissipation device for power semiconductor devices according to claim 2, characterized in that, The above-mentioned buffer unit (223) is provided in multiple ways, and the multiple buffer units (223) are evenly distributed along the circumference of the floating pressure plate (222).

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