A multi-port vertical interconnect structure and method of interconnection

Abstract

The application discloses a multi-port vertical interconnection structure and an interconnection method, relates to the technical field of semiconductor packaging, and comprises a plastic encapsulation layer; a plurality of signal transmission units are arranged in the plastic encapsulation layer and are electrically connected with chip ports and circuit board ports and are used for transmitting signals; a plurality of shielding units are arranged in the plastic encapsulation layer and are arranged around the signal transmission units, the shielding units are arranged to be grounded, so that electromagnetic shielding is provided and a high-frequency signal backflow path is formed; the plurality of signal transmission units are arranged in an array mode in the plastic encapsulation layer, and at least part of the shielding units is shared between adjacent signal transmission units; at least part of the shielding units is shared between adjacent signal transmission units, the space occupation can be reduced, low-loss transmission of a single-column vertical transmission structure and high-density integration of a coaxial vertical transmission structure can be simultaneously considered.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a multi-port vertical interconnect structure and interconnection method. Background Technology

[0002] With the development of millimeter-wave communication and multi-channel heterogeneous integrated systems, the vertical interconnection of signals within the package places higher demands on the miniaturization, low loss, and high isolation performance of the structure. Fan-out wafer-level packaging (FOWLP) has become an important technology platform for realizing such interconnections due to its advantages such as high-density interconnection, thin package thickness, and low parasitic effects. In heterogeneous integrated systems, multiple channels of signals such as intermediate frequency and local oscillator signals need to be vertically transmitted between the chip and the printed circuit board (PCB) through the package, and the performance of its interconnection structure directly affects the overall system performance.

[0003] In existing technologies, although single-column vertical transmission structures have a smaller area, they are prone to significant parasitic effects, radiation leakage, and signal reflection at high frequencies, leading to increased insertion loss and inter-channel crosstalk, making it difficult to guarantee good return loss and channel isolation. Traditional quasi-coaxial vertical transmission structures improve electromagnetic performance by shielding the signal columns with independent grounding fences. However, when multi-port parallel transmission is required, configuring a complete grounding fence for each signal port significantly increases the overall area of ​​the interconnect structure, which is not conducive to the requirements of high-density, miniaturized packaging integration. Especially in the scenario of multi-channel intermediate frequency signal parallel transmission, existing technologies struggle to achieve structural miniaturization and good compatibility with FOWLP processes while maintaining low loss and high isolation performance.

[0004] Therefore, there is a need to provide a multi-port vertical interconnect structure and interconnection method that can achieve miniaturization and good compatibility with FOWLP technology while maintaining low loss and high isolation performance. Summary of the Invention

[0005] The main objective of this application is to provide a multi-port vertical interconnect structure and interconnection method, which aims to solve the technical problem that existing vertical transmission structures are difficult to miniaturize and achieve good compatibility with FOWLP technology while maintaining low loss and high isolation performance.

[0006] To achieve the above objectives, this application provides a multi-port vertical interconnect structure and interconnection method, including: Plastic sealant; Multiple signal transmission units are disposed within the plastic encapsulation layer and electrically connected to the chip port and the circuit board port for transmitting signals; Multiple shielding units are disposed within the plastic encapsulation layer and around the signal transmission unit. The shielding units are grounded to provide electromagnetic shielding and form a high-frequency signal return path. The signal transmission units are arranged in an array within the encapsulation layer, and adjacent signal transmission units share at least a portion of the shielding unit.

[0007] Optionally, the signal transmission unit includes a signal conduction post, and the shielding unit includes a plurality of grounding conduction posts, with the plurality of grounding conduction posts disposed around the signal conduction post.

[0008] Optionally, two adjacent signal conduction posts may share the grounding conduction post to form a continuous isolation wall.

[0009] Optionally, the signal conduction posts are arranged alternately within the encapsulation layer.

[0010] Optionally, the plurality of grounding conduction posts are arranged in a triangular structure, with two adjacent triangular structures sharing one side and forming a parallelogram structure, and two adjacent signal conduction posts located on the two base sides of the parallelogram structure.

[0011] Optionally, it also includes signal pads for connecting the signal conduction post and the chip port.

[0012] Optionally, an annular isolation gap is provided around the signal pad, and the grounding post is located outside the isolation gap.

[0013] Optionally, the system further includes multiple connection units, which are coaxially connected to the signal conduction post and the ground conduction post, respectively, and are electrically connected to the circuit board to form a transmission path.

[0014] Optionally, the encapsulation layer is filled with an insulating medium.

[0015] This application provides a multi-port TMV vertical interconnection method, characterized by comprising the following steps: Determine the target frequency band and the required number of channels for the signal to be transmitted; Based on the required number of channels, a multi-port vertical interconnect structure is formed by arranging multiple signal conduction pillars in an array and making them share adjacent ground conduction pillars. The multi-port vertical interconnect structure is integrated into a fan-out wafer-level package, and the vertical transition from the chip port through the redistribution layer and signal conduction pillars to the circuit board signal is completed.

[0016] The beneficial effects achievable by this application are as follows: When a signal is transmitted through a signal transmission unit, the electromagnetic shielding formed by multiple shielding units can effectively isolate the signal transmission path from the external environment. The shielding cavity can suppress the generation of higher-order modes and reduce the radiation of signal energy into the external space, thereby reducing transmission loss. In multi-channel transmission scenarios, the electromagnetic coupling between adjacent signal transmission units is also significantly weakened by the shielding units, thereby improving the isolation between channels, ensuring signal integrity and the system's anti-crosstalk capability, and enabling low-loss signal transmission and high-isolation multi-channel transmission. At the same time, adjacent signal transmission units share at least some shielding units, which can reduce the space occupation and simultaneously achieve both the low-loss transmission of a single-column vertical transmission structure and the high-density integration of a coaxial vertical transmission structure. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0018] Figure 1 This is a 3D split view of the intermediate frequency signal vertical interconnect array in a multi-port vertical interconnect structure according to an embodiment of this application; Figure 2 This is a top view of a multi-signal vertical interconnect array in a multi-port vertical interconnect structure according to an embodiment of this application; Figure 3 This is a schematic diagram of a TMV array, an intermediate frequency signal transmission structure in a multi-port vertical interconnect structure, according to an embodiment of this application. Figure 4 This is a schematic diagram showing the arrangement of two adjacent shielding units in a multi-port vertical interconnect structure according to an embodiment of this application; Figure 5 Simulation results of S-parameters for multi-signal coaxial transmission in a multi-port vertical interconnect structure and interconnection method according to an embodiment of this application; Figure 6 This application discloses multiple signal isolation parameters in a multi-port vertical interconnect structure and interconnect method.

[0019] Figure label: 1-Plastic encapsulation layer, 2-Signal conduction post, 3-Ground conduction post, 4-Connection unit, 5-Reworked signal line, 6-Isolation gap.

[0020] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0023] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0025] Example 1 See attached document Figures 1-6 This embodiment provides a multi-port vertical interconnect structure, including: Molding layer 1; Multiple signal transmission units are disposed within the molding layer 1 and electrically connected to the chip port and the circuit board port for transmitting signals; Multiple shielding units are disposed within the plastic encapsulation layer 1 and around the signal transmission unit. The shielding units are grounded to provide electromagnetic shielding and form a high-frequency signal return path. Multiple signal transmission units are arranged in an array within the encapsulation layer 1, and adjacent signal transmission units share at least a portion of the shielding unit.

[0026] In this embodiment, the molding layer 1 can be made of various insulating materials, such as epoxy resin, polyimide, or liquid crystal polymer. The molding layer 1 is formed through processes such as molding, lamination, or deposition, and its main function is to provide mechanical support and insulation protection for the internal signal conduction post 2 and grounding conduction post 3. For example, a conventional epoxy resin molding material can be used, and an encapsulation body with a specific thickness can be formed through injection molding.

[0027] By enabling adjacent signal transmission units to share a shielding unit, the structural redundancy of setting up a complete grounding fence for each signal channel is reduced. This significantly reduces the overall layout area of ​​the multi-port interconnect structure while maintaining effective electromagnetic shielding and a continuous return path, solving the problem of excessive area occupation when integrating multiple channels in a traditional coaxial structure.

[0028] Furthermore, the quasi-coaxial path formed by the shared shielding unit and the signal transmission unit constrains the electromagnetic field distribution, effectively reducing signal radiation leakage, impedance discontinuity, and electromagnetic field coupling between adjacent channels. This synergistically achieves the technical effects of structural miniaturization, low insertion loss, and high channel isolation.

[0029] By introducing shielding units and forming electromagnetic shielding from multiple units, the problem of easily exciting higher-order modes and generating significant radiation leakage is effectively solved. For example, in millimeter-wave signal transmission, traditional TMV structures face severe radiation leakage and crosstalk issues above 30 GHz. By constructing isolation around the signal transmission unit using multiple shielding units, the generation of higher-order modes and electromagnetic wave radiation can be significantly suppressed. Compared to existing vertical interconnects that lack effective shielding, this approach can more effectively confine signal energy within the transmission path, thereby significantly reducing transmission loss.

[0030] Furthermore, in multi-channel transmission scenarios, the shielding unit can provide independent electromagnetic isolation for each signal conduction post 2, which is in stark contrast to the severe electromagnetic coupling between adjacent TMVs in the prior art. By forming effective electromagnetic shielding, the isolation between channels can be significantly improved, ensuring independent transmission of multi-channel signals, thereby enhancing the system's anti-crosstalk capability.

[0031] As an optional implementation, the signal transmission unit includes a signal conduction post 2, and the shielding unit includes a plurality of grounding conduction posts 3, which are disposed around the signal conduction post 2.

[0032] In this embodiment, the signal conduction post 2 can be made of a highly conductive metal material such as copper, gold, or silver. It can be formed by drilling, filling with conductive material, or by processes such as photolithography and electroplating to form a vertical interconnect post. For example, through-holes can be pre-drilled in the molding compound 1, and then copper can be deposited inside the through-holes using an electroplating process to form a vertical conductive post for carrying millimeter-wave signals.

[0033] The grounding post 3 can use the same material and forming process as the signal post 2, for example, by drilling holes in the encapsulation layer 1 and filling them with conductive material. For example, multiple through holes can be drilled in the area around the signal post 2 and filled with conductive material to form multiple independent grounding posts.

[0034] Multiple grounding conductive posts 3 form a closed or semi-closed conductive cavity, thereby providing electromagnetic isolation to the internal signal conductive posts 2. For example, multiple grounding conductive posts 3 can be arranged in a circular or square array around the signal conductive posts 2 to form a preliminary shielding structure to block the intrusion of external electromagnetic waves or limit the radiation of internal signals.

[0035] Each signal conduction post 2 corresponds to a shielding unit. The signal conduction post 2 and the shielding unit can be manufactured independently and then integrated together through packaging technology, or multiple signal conduction posts 2 and ground conduction posts 3 can be formed simultaneously in the molding layer 1 through processes such as photolithography, etching, and filling during the same manufacturing process. Each signal conduction post 2 can be an independent TMV structure, while each shielding unit is formed around its corresponding TMV structure.

[0036] An array arrangement of multiple signal conduction pins 2 refers to the arrangement of multiple signal conduction pins 2 according to a predetermined geometric pattern. This array arrangement aims to achieve high-density integration and efficient space utilization. For example, rectangular array arrangements, such as 2×3, 3×3, or larger matrix forms, can be used to accommodate different numbers of signal channels; circular or fan-shaped array arrangements can also be used to adapt to specific system layouts or signal transmission paths. Furthermore, the array arrangement can also be non-uniform, with the density of the signal conduction pins 2 in different areas adjusted according to signal type or power requirements.

[0037] By arranging multiple signal conduction pillars 2 in an array, a unified signal transmission structure with multi-channel parallel transmission capability is formed. This array can function as a single interface, enabling simultaneous input or output of multiple signals. For example, the signal transmission array can connect to an external multi-channel RF front-end or baseband processing unit to achieve parallel data transmission; it can also serve as a high-speed multi-channel interconnect interface between chips or modules, supporting parallel data streams in the millimeter-wave band. Through array arrangement, beamforming or multiple-input multiple-output (MIMO) functions can also be implemented, improving the performance of the communication system.

[0038] As an optional implementation, multiple grounding conductive posts 3 are disposed around the signal conductive posts 2, and two adjacent signal conductive posts 2 share the grounding conductive posts 3 to form a continuous isolation wall.

[0039] In this embodiment, in the scenario of multi-channel transmission, each signal conduction post 2 is equipped with its own dedicated grounding conduction post 3. This can be achieved by independently setting a group of grounding conduction posts 3 around each signal conduction post 2 to form an independent shielding structure; or by arranging multiple signal conduction posts 2 in an array, and configuring the grounding conduction posts 3 around each or each group of signal conduction posts 2 according to the array layout to form a multi-channel isolated coaxial TMV basic unit.

[0040] Through the specific arrangement of the aforementioned grounding conductors 3, a physical or electromagnetic barrier is constructed between adjacent signal channels. This isolation wall can be formed by a close arrangement of multiple grounding conductors 3, and its main function is to block the electromagnetic coupling path between adjacent signal channels; alternatively, this isolation wall can also be achieved by setting a continuous array of grounding conductors 3 between the signal conductors 2, thereby physically and electrically isolating different channels.

[0041] Two adjacent shielding units refer to two shielding units that are spatially close to each other in a signal transmission array. These shielding units are typically used to protect their respective signal conduction pillars 2 from electromagnetic interference. For example, in a two-dimensional array, they can be horizontally adjacent, vertically adjacent, or diagonally adjacent unit groups.

[0042] Sharing a grounding post 3 means that two adjacent shielding units no longer have their own complete set of grounding posts 3 independently, but share some or all of the grounding posts 3 located between them. This can be achieved by merging the grounding posts 3 that originally belonged to two independent unit groups into a common conductor, or by designing a grounding post 3 to simultaneously serve as the boundary of two adjacent unit groups. In this embodiment, by sharing two copper posts on one side of a triangle, a physically and electrically continuous barrier is formed between adjacent shielding units, which can provide effective electromagnetic isolation.

[0043] When multiple signal conduction posts 2 and their corresponding shielding units are arranged closely in an array, if each shielding unit independently sets its grounding conduction post 3, there will be duplicate grounding conduction posts 3 or unnecessary gaps between adjacent unit groups. By sharing the grounding conduction post 3, for example, designing the grounding conduction post 3 located between two adjacent shielding units to serve both unit groups simultaneously, redundant structures can be effectively eliminated, and the continuity of shielding can be ensured. This allows the originally independent shielding boundaries to be integrated, thereby forming a physically and electrically seamless shielding cavity or isolation wall in the entire array. For example, in multi-channel signal transmission scenarios, the shared grounding conduction post 3 can serve as a common isolation wall between different signal channels, effectively suppressing crosstalk between channels while reducing the complexity of the overall structure and the amount of material used.

[0044] As an optional implementation, multiple signal conduction posts 2 are arranged alternately within the encapsulation layer 1.

[0045] In this embodiment, the staggered arrangement of the signal conduction posts 2 can save more space and make the internal layout more compact.

[0046] As an optional implementation, multiple grounding conductive posts 3 are arranged in a triangular structure, with two adjacent triangular structures sharing one side and forming a parallelogram structure, and two adjacent signal conductive posts 2 located on the two base sides of the parallelogram structure.

[0047] In this embodiment, the grounding conductors 3 are arranged in a triangular pattern. Three grounding conductors 3 can be provided, and the three grounding conductors 3 can be distributed at the three vertices of the triangular structure. Two adjacent triangular structures form a parallelogram structure. The signal conductor 2 is located at the center point of the two base sides of the parallelogram structure. The grounding conductors 3 form a corner isolation wall relative to the signal conductor 2. The corner of this corner isolation wall can be an acute angle, a right angle, or an obtuse angle. For example, when it is a right angle, the corner isolation wall is L-shaped, which can isolate adjacent signal transmission channels.

[0048] By arranging the grounding conductive posts 3 in a triangular pattern to isolate the signal conductive posts 2, a compact and efficient electromagnetic shielding cavity or isolation wall is constructed. This specific geometric configuration, compared to other numbers or arrangements, more effectively confines the electromagnetic field around the signal conductive posts 2, thereby significantly reducing electromagnetic coupling between adjacent signal channels, i.e., reducing crosstalk. In multi-channel millimeter-wave transmission scenarios, this triangularly arranged isolation wall provides an independent, highly isolated transmission environment for each signal channel, ensuring the signal maintains its integrity as it passes through the encapsulation layer 1, avoiding signal attenuation or distortion caused by inter-channel interference. In this way, the structure effectively solves the problem of insufficient signal isolation in high-density integration while achieving multi-channel signal transmission.

[0049] The following is an explanation of a specific implementation method. Both the signal conduction post 2 and the grounding conduction post 3 are signal TMV copper posts with a diameter of 0.11mm. The center-to-center distance between the grounding conduction post 3 and the signal conduction post 2 is 0.4mm. Considering the characteristics of the intermediate frequency signal, which has a lower frequency and slightly lower shielding requirements but high requirements for multi-channel isolation, three grounding copper posts can form an effective shield, while saving space and facilitating dense arrangement of multiple channels.

[0050] As an optional implementation, a signal pad is also included, which is used to connect the signal conduction post 2 and the chip port.

[0051] In this embodiment, each of the upper and lower ends of the signal conduction post 2 is connected to a signal pad with a diameter of 0.15mm, which serves as a signal interface and is connected to the port of the chip. When used as a single-channel coaxial TMV basic unit, the upper and lower ends of the ground conduction posts 3 around the signal conduction post 2 are interconnected through RDL layer metal wiring to form a continuous ring ground plane. When used as a multi-channel isolated coaxial TMV basic unit, the upper and lower ends of the ground conduction posts 3 are interconnected through RDL layer metal wiring to form a corner-shaped ground isolation wall.

[0052] As an optional implementation, an annular isolation gap is provided around the signal pad, and the grounding post 3 is located on the outside of the isolation gap.

[0053] In this embodiment, the shared grounding conductor 3, together with its outer annular isolation gap and signal pad, forms a physically continuous isolation wall (corner-type isolation wall), which effectively blocks electromagnetic field coupling between adjacent signal channels, thereby ensuring high isolation while achieving miniaturization.

[0054] As a specific implementation method, parameters such as the center-to-center spacing *l* of adjacent signal conduction posts 2, the diameter *d* of the signal conduction posts 2, the radius *r* of the signal pads, and the width *sh* of the annular isolation gap need to be jointly optimized based on the target operating frequency band and the target characteristic impedance to meet the requirements of low insertion loss and high return loss. For example, for intermediate frequency signal transmission, these parameters can be adjusted to match the characteristic impedance of the vertical transmission path with the chip port and PCB port, and three-dimensional electromagnetic simulation can be used to verify that the insertion loss is less than 0.3 dB and the return loss is better than 15 dB in the target frequency band (such as DC to several GHz).

[0055] With the above configuration, the grounding conductor 3 forms a "shared isolation wall" between two adjacent signal conductors 2, rather than setting up a complete grounding fence for each signal conductor 2 separately. This compact layout (such as a triangular arrangement combined with an interlaced array) significantly reduces the total number and area occupied by the grounding conductors 3, increasing the layout density. On the other hand, the shared grounding conductor 3, together with its outer annular isolation gap and signal pad, constitutes a physically continuous isolation wall (L-shaped isolation wall), effectively blocking electromagnetic field coupling between adjacent signal channels, thus ensuring high isolation while achieving miniaturization.

[0056] As a specific implementation method, parameters such as the center-to-center spacing *l* of adjacent signal conduction posts 2, the diameter *d* of the signal conduction posts 2, the radius *r* of the signal pads, and the width *sh* of the annular isolation gap need to be jointly optimized based on the target operating frequency band and the target characteristic impedance to meet the requirements of low insertion loss and high return loss. For example, for intermediate frequency signal transmission, these parameters can be adjusted to match the characteristic impedance of the vertical transmission path with the chip port and PCB port, and three-dimensional electromagnetic simulation can be used to verify that the insertion loss is less than 0.3 dB and the return loss is better than 15 dB in the target frequency band (such as DC to several GHz).

[0057] As an optional implementation, it also includes multiple connection units 4, which are coaxially connected to the signal conduction post 2 and the ground conduction post 3 respectively, and the connection units 4 are connected to the circuit board to form a transmission path.

[0058] In this embodiment, the connection unit 4 is coaxially connected to the signal conduction post 2 and the ground conduction post 3, and is connected to the circuit board to form a complete vertical transmission path. As a specific implementation, the connection unit 4 can be a BGA solder ball; the connection unit 4 corresponding to the signal conduction post 2 is a signal solder ball, and the connection unit 4 corresponding to the ground conduction post 3 is a ground solder ball. The signal solder ball and ground solder ball arrays are soldered and fixed to the corresponding pads on the PCB, connecting the vertical interconnect structure to the underlying circuit board and ensuring the continuity of the signal path and the ground return path.

[0059] As an optional implementation, the encapsulation layer 1 is filled with an insulating medium.

[0060] In this embodiment, the insulating medium refers to a material with high resistivity and low dielectric loss. Its main function is to prevent current from passing through under the influence of an electric field and to provide electrical isolation. In this application, the insulating medium is used to fill the interior of the molding compound 1 to ensure good electrical insulation between the signal conduction post 2 and the grounding conduction post 3, as well as between them and the external environment. The dielectric constant and dielectric loss of the insulating medium are key parameters affecting the transmission performance of millimeter-wave signals. The insulating medium is epoxy resin with a dielectric constant of 4.2. In other embodiments, polyimide or liquid crystal polymer (LCP) can also be used. These materials typically have lower dielectric constants and dielectric losses, making them suitable for high-frequency applications. Furthermore, the insulating medium can also be a polymer composite material filled with ceramic particles. By adjusting the type and content of the ceramic particles, the dielectric properties and coefficient of thermal expansion can be further optimized to meet specific application requirements.

[0061] In practical applications, such as heterogeneous integrated receiver modules, the upper layer of this multi-port vertical interconnect structure is connected to the intermediate frequency or local oscillator port of the chip via redistribution layer signal lines 5 (RDL), while the lower layer is connected to the PCB board via connection units. Signals originate from the chip port, pass through signal pads to signal conduction posts 2, and vertically pass through the molding compound 1, finally reaching the corresponding port on the PCB board. Throughout the path, the shared grounding conduction posts 3 simultaneously provide a high-frequency return path and electromagnetic shielding for adjacent signal conduction posts 2, ensuring that the signal energy is primarily confined within their respective quasi-coaxial transmission paths, thus achieving low-loss, high-isolation vertical transmission.

[0062] In some alternative implementations, this multi-port TMV vertical interconnect structure is not only suitable for multi-port parallel transmission of intermediate frequency signals, but also, by adapting its parameters (such as d, l, r, sh), for coaxial vertical transmission of single-channel local oscillator signals with higher shielding requirements. The specific number and arrangement of the grounding conductors 3 are not limited to the aforementioned equidistant surrounding array or triangular arrangement; other forms of adjustment can be made according to specific isolation requirements and layout constraints, as long as the principle that adjacent signal transmission units can share some shielding units is met. During design, initial parameters are typically determined first based on the target frequency band, number of channels, and FOWLP process capabilities. Then, insertion loss, return loss, and channel isolation are jointly optimized through three-dimensional electromagnetic modeling and simulation. Finally, the optimized basic units are expanded in an array to the target number of ports. (Refer to...) Figures 5-6 The simulation results can be used as verification to ensure that performance indicators such as channel isolation greater than 30 dB are achieved in the target frequency band.

[0063] Example 2 This application also provides an interconnection method based on a multi-port TMV vertical interconnection structure, including the following steps: Step S1: Determine the target frequency band and the required number of channels for the signal to be transmitted; Step S2: Based on the required number of channels, multiple signal conduction posts 2 are arranged in an array and share adjacent grounding conduction posts 3 to form a multi-port vertical interconnect structure. Step S3: Integrate the multi-port vertical interconnect structure into a fan-out wafer-level package and complete the vertical transition from the chip port through the redistribution layer and signal conduction post 2 to the circuit board signal; perform three-dimensional electromagnetic simulation or testing on the multi-port vertical interconnect structure using simulation equipment or testing instruments to verify its insertion loss, return loss and channel isolation performance in the target frequency band.

[0064] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A multi-port vertical interconnect structure, comprising: Molding layer; Multiple signal transmission units are disposed within the plastic encapsulation layer and electrically connected to the chip port and the circuit board port for transmitting signals; Multiple shielding units are disposed within the plastic encapsulation layer and around the signal transmission unit. The shielding units are grounded to provide electromagnetic shielding and form a high-frequency signal return path. The signal transmission units are arranged in an array within the encapsulation layer, and adjacent signal transmission units share at least a portion of the shielding unit.

2. The multi-port vertical interconnect structure as described in claim 1, characterized in that, The signal transmission unit includes a signal conduction post, and the shielding unit includes multiple grounding conduction posts, which are disposed around the signal conduction post.

3. A multi-port vertical interconnect structure as described in claim 2, characterized in that, Two adjacent signal conduction posts share the grounding conduction post to form a continuous isolation wall.

4. A multi-port vertical interconnect structure as described in claim 3, characterized in that, Multiple signal conduction posts are arranged alternately within the encapsulation layer.

5. A multi-port vertical interconnect structure as described in claim 4, characterized in that, The multiple grounding conduction posts are arranged in a triangular structure, with two adjacent triangular structures sharing one side and forming a parallelogram structure. Two adjacent signal conduction posts are located on the two base sides of the parallelogram structure.

6. A multi-port vertical interconnect structure as described in claim 1, characterized in that, It also includes signal pads for connecting the signal conduction posts and chip ports.

7. A multi-port vertical interconnect structure as described in claim 6, characterized in that, The signal pad has an annular isolation gap around its periphery, and the grounding post is located on the outside of the isolation gap.

8. A multi-port vertical interconnect structure as described in claim 2, characterized in that, It also includes multiple connection units, which are coaxially connected to the signal conduction post and the ground conduction post, respectively, and are electrically connected to the circuit board to form a transmission path.

9. A multi-port vertical interconnect structure as described in claim 1, characterized in that, The encapsulation layer is filled with an insulating medium.

10. An interconnection method based on the multi-port TMV vertical interconnection structure of claim 5, characterized in that, Includes the following steps: Determine the target frequency band and the required number of channels for the signal to be transmitted; Based on the required number of channels, multiple signal conduction pillars are arranged in an array using manufacturing equipment, and they share adjacent grounding conduction pillars to form a multi-port vertical interconnect structure. The multi-port TMV vertical interconnect structure is integrated into a fan-out wafer-level package, and the vertical transition from the chip port through the redistribution layer and signal conduction pillars to the circuit board signal is completed.

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