Package structure and manufacturing method thereof

Abstract

The application provides a packaging structure and a manufacturing method thereof. The packaging structure comprises a circuit layer having a first surface, the first surface comprising a first connecting area and a second connecting area; a first chip disposed on the first connecting area; a first adhesive layer disposed on the second connecting area; a space support disposed on the second connecting area through the first adhesive layer; and a first mold layer covering the first chip and covering at least part of the first connecting area, the first mold layer having a first side surface facing the space support, a gap between the first side surface and a second side surface of the space support facing the first mold layer, and a microstructure at one end of the first side surface close to the circuit layer. When the packaging structure is connected to a substrate, the space support supports the circuit layer, thereby avoiding warping.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, specifically to a packaging structure and a method for manufacturing the packaging structure. Background Technology

[0002] In the FOMCM (Fan-Out Multi-Chip Module) architecture, two or more chips are often arranged side by side. For example, an AP (Application Processor) chip and a DRAM (Dynamic Random Access Memory) chip are arranged side by side.

[0003] In many cases, it is necessary to first package one chip, such as the AP chip, and reserve space for another chip, such as DRAM. Within this reserved space, the connection points of the FOMCM wiring layer are exposed. Before placing the DRAM, the FOMCM structure with the AP chip and the reserved space is mounted onto the substrate.

[0004] However, during the mounting process, the reserved space can cause the wiring layer to warp, which in turn prevents some solder balls on the lower surface of the wiring layer from fully contacting the substrate, resulting in poor soldering or even failure.

[0005] Furthermore, structurally, the reserved space area for placing DRAM in the wiring layer of the FOMCM needs to be designed to be relatively thin. However, the different materials in the FOMCM structure have different coefficients of thermal expansion, which makes warping more severe. Summary of the Invention

[0006] Firstly, this application provides a packaging structure comprising: A circuit layer having a first surface, the first surface including a first connection region and a second connection region; The first chip is located in the first connection area; A first adhesive layer is disposed in the second connection area; The spacer support is disposed in the second connection area via a first adhesive layer; A first mold cover layer encapsulates the first chip and covers at least a portion of the first connection area. The first mold cover layer has a first side facing the occupant support, and there is a gap between the first side and a second side of the occupant support facing the first mold cover layer. The first side has a microstructure at one end near the circuit layer.

[0007] In some alternative implementations, the microstructure is constrained by a first adhesive layer to form a first molding material adjacent to the first surface.

[0008] Accordingly, the microstructure includes groove structures; At least one side of the first adhesive layer protrudes from the second side of the spacer support on the side facing the first mold sealing layer, forming a protrusion; The first side of the first mold cover has a groove structure formed at the end near the circuit layer, corresponding to the protrusion.

[0009] In some alternative implementations, a through-slit is formed between the first side and the second side of the opposing occupier support. The dividing gap extends downward from the opening between the upper surface of the first mold seal layer and the upper surface of the spacer support to the protrusion of the first adhesive layer.

[0010] In some alternative implementations, the protrusion includes: The first part, at least within the groove structure; The second part is located at one end of the split gap near the circuit layer; The upper surface of the second part is flush with the upper surface of the first part, or lower than the upper surface of the first part in the direction away from the circuit layer.

[0011] In some alternative implementations, the first side of the first mold seal is inclined toward the side away from the occupier support; The dividing gap extends slopingly towards the side away from the occupying support; The first side of the first mold seal is parallel to the direction of extension of the dividing gap.

[0012] In some alternative implementations, the first side of the first molded layer is perpendicular to the upper surface of the circuit layer; The dividing gap extends in a direction perpendicular to the upper surface of the circuit layer.

[0013] In some alternative embodiments, a second adhesive layer is filled between the first side of the first mold seal and the second side of the opposing spacer support, the second adhesive layer being bonded to both the first side of the first mold seal and the second side of the spacer support.

[0014] In some alternative embodiments, the second adhesive layer extends downward from the opening between the upper surface of the first mold seal layer and the upper surface of the spacer support, and extends to and is bonded to the protrusion of the first adhesive layer.

[0015] In some alternative implementations, the microstructure includes a right-angled structure; The protrusion is square-column shaped; The first side of the first mold cover has a right-angle structure at the end near the circuit layer. The right-angle structure is perpendicular to the upper surface of the circuit layer and is provided corresponding to the square column protrusion. The second adhesive layer contacts and connects with the prismatic protrusion.

[0016] In some alternative implementations, the microstructure includes an arc-shaped slope structure, with the protrusions being upwardly curved. The first side of the first mold sealing layer forms an arc-shaped slope structure at the end near the line layer. The arc-shaped slope structure is an arc-shaped transition surface that extends continuously along the first side of the first mold sealing layer. The arc-shaped slope structure is set corresponding to the upward-curving protrusion. The second adhesive layer contacts and connects with the upward-curved protrusion.

[0017] In some alternative implementations, the microstructure includes a ramp structure, with the protrusions forming an upward-sloping surface; The first side of the first mold sealing layer forms a slope structure at the end near the line layer. The slope structure is a transition slope that extends continuously along the first side of the first mold sealing layer. The slope structure is provided corresponding to the protrusion of the upturned slope. The second adhesive layer contacts and connects with the protrusion of the upturned slope.

[0018] Secondly, another packaging structure provided in this application includes: A circuit layer having a first surface, the first surface including a first connection region and a second connection region; The first chip is located in the first connection area; The second chip is located in the second connection area; A first encapsulation layer covers the first chip and at least a portion of the first connection area. The first encapsulation layer has a first side facing the second chip, and the first side has a microstructure at one end near the circuit layer.

[0019] In some alternative implementations, the microstructure includes a groove structure; The first side of the first mold sealing layer has a groove structure at the end near the circuit layer; At least a portion of the first adhesive layer is disposed in the groove structure; The first adhesive layer is the same as the first adhesive layer in the encapsulation structure of any of the preceding items.

[0020] In some alternative implementations, the packaging structure further includes a second molding layer that encapsulates the second chip, covers the second connection area, and the sides of the first molding layer.

[0021] In some alternative embodiments, the second molded layer abuts against the first molded layer and fills the microstructure at the bottom of the first molded layer, the microstructure being the same as the microstructure in the encapsulation structure of any of the preceding embodiments.

[0022] Thirdly, this application provides a method for manufacturing a packaging structure, comprising: A first chip is disposed in a first connection area on a first surface of the circuit layer, and a first adhesive layer is disposed in a second connection area on the first surface. The second connection area is bonded to one side surface of the first adhesive layer, and a spacer support is bonded to the other side surface. The molding process forms a first molding layer that covers the first chip, a portion of the first adhesive layer, and at least a portion of the first connection area, thereby obtaining a package structure. The packaging structure is mounted onto the substrate; The first adhesive layer is debonded to remove the placeholder support.

[0023] In some alternative embodiments, a first adhesive layer and a spacer support are disposed in the second connection region of the first surface, including: By pressing down, at least one side of the first adhesive layer is squeezed out of the side of the occupier to form a protrusion.

[0024] In some alternative embodiments, molding is used to form a first molding layer covering the first chip, a portion of the first adhesive layer, and at least a portion of the first connection region, resulting in a package structure including: A first molding layer is formed to encapsulate the first chip and the protrusion, and to cover at least a portion of the first connection area. The protrusion restricts the formation of a microstructure on the side of the first molding layer near the circuit layer along the first surface of the first molding material, thereby obtaining a package structure as described in any of the preceding descriptions.

[0025] In some alternative embodiments, after the protrusion restricts the formation of a microjunction of the first molding material adjacent to the first surface at one end of the first molding layer near the circuit layer, the method further includes: With the second side of the spacer support covered by the first mold seal, a dividing slit is cut into the second side of the spacer support, and a first side opposite to the second side and spaced apart by the dividing slit is formed in the first mold seal.

[0026] In some alternative embodiments, debonding of the first adhesive layer includes: With a gap between the first and second sides, remove the spacer support with the first adhesive layer. In the case where there is a second adhesive layer between the first side and the second side, or in the case where there is a dividing gap between the first side and the second side, if the material of the spacer support is glass, the adhesive layer is debonded using a laser. If the spacer support is made of metal, the upper surface of the spacer support is heated, and the heat is transferred to the adhesive layer through the metal spacer support to de-adhesive.

[0027] To address the technical problem of poor soldering caused by wiring layer warpage during FOMCM manufacturing, the packaging structure provided in this application incorporates a first adhesive layer and a spacer support in the second connection area of ​​the wiring layer. The spacer support provides stable support when the packaging structure is mounted to the substrate, effectively suppressing warpage of the wiring layer due to lack of support, avoiding poor solder ball contact, cold solder joints, and open circuits, significantly improving soldering yield and structural reliability. The first adhesive layer restricts the formation of microstructures at the bottom of the first molding layer during molding, enhancing the bonding stability of the molding layer and preventing material displacement and delamination.

[0028] The process of first forming the first mold, removing the spacer support, setting the second chip, and then performing a second mold can ensure structural rigidity and make room for the second chip installation in the future. It takes into account both process stability and the needs of multi-chip integration. At the same time, the microstructure can also make the subsequent second mold layer fit and position better, improving the overall packaging structure's tightness and interface bonding strength. Attached Figure Description

[0029] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the longitudinal cross-sectional structure of the existing packaging structure 100; Figure 2A-1 This is a schematic diagram of the longitudinal cross-sectional structure of the packaging structure 200A according to an embodiment of this application; Figure 2A-2 This is a schematic cross-sectional view of a packaging structure 200A with a semi-cylindrical groove according to an embodiment of this application; Figure 2A-3 This is a longitudinal cross-sectional schematic diagram of a packaging structure 200A with a square column-shaped groove according to an embodiment of this application; Figure 2A-4 This is a schematic diagram of the longitudinal cross-sectional structure of a packaging structure 200A with an inclined dividing gap according to an embodiment of this application; Figure 2A-5 This is based on one embodiment of the present application. Figure 2A-2 and Figure 2A-3 A top view of the 200A packaging structure; Figure 2B-1 This is a schematic diagram of the longitudinal cross-sectional structure of a packaging structure 200B with a right-angled structure according to an embodiment of this application; Figure 2B-2 This is a schematic diagram of the longitudinal cross-sectional structure of an encapsulation structure 200B with an arc-shaped slope structure according to an embodiment of this application; Figure 2B-3This is a schematic diagram of the longitudinal cross-sectional structure of a packaging structure 200B with a ramp structure according to an embodiment of this application; Figure 2B-4 This is based on one embodiment of the present application. Figure 2B-1 , Figure 2B-2 and Figure 2B-3 A top view of the 200B packaging structure; Figure 3A Based on an embodiment of this application Figure 2A-1 The packaging structure is 200A or Figure 2B-1 A schematic diagram of the longitudinal cross-sectional structure of the encapsulation structure 300A formed by the encapsulation structure 200B; Figure 3B Based on an embodiment of this application Figure 2A-2 A schematic diagram of the cross-sectional structure of the packaging structure 300B formed by the packaging structure 200A; Figure 3C Based on an embodiment of this application Figure 2A-3 A schematic diagram of the longitudinal cross-sectional structure formed by the 200A packaging structure; Figure 3D Based on an embodiment of this application Figure 2B-2 A schematic diagram of the longitudinal cross-sectional structure of the encapsulation structure 300D formed by the encapsulation structure 200B; Figure 3E Based on an embodiment of this application Figure 2B-3 A schematic diagram of the longitudinal cross-sectional structure of the encapsulation structure 300E formed by the encapsulation structure 200B; Figures 4A to 4H This is a schematic diagram of the manufacturing steps of the packaging structure 200A according to an embodiment of this application; Figures 5A to 5D This is a schematic diagram of the manufacturing steps of the packaging structure 300A according to an embodiment of this application.

[0030] Explanation of reference numerals / symbols in the attached diagram: 100: Package structure; 101: Circuit layer; 102: First chip; 103: First molding layer; 104: Reserved space; 105: Connection point; 106: Solder ball; 107: Substrate; 108: Second chip.

[0031] 200A: Package structure; 200B: Package structure; 201: Circuit layer; 202: First chip; 203: First molding layer; 204: Dividing gap; 205: Connection point; 206: Solder ball; 207: Substrate; 208: Second chip; 209: Second molding layer; 210: Placeholder support; 211: First adhesive layer; 2111: Protrusion; 2112: Adhesive part; 212: Second adhesive layer; 213: Third molding layer.

[0032] 300A: Package structure; 300B: Package structure; 300C: Package structure; 300D: Package structure; 300E: Package structure.

[0033] 401: Carrier plate; 402: Fixing layer. Detailed Implementation

[0034] The specific embodiments of this application will be described below with reference to the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by this application and the resulting technical effects through the content described herein. It is understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not intended to limit the invention. Furthermore, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0035] It should be readily understood that the meanings of “on,” “above,” and “on top of” in this application should be interpreted in the broadest sense, such that “on” means not only “directly on something,” but also “on something” including intermediate components or layers existing between the two.

[0036] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship of one element or component to another element or component shown in the accompanying drawings. In addition to the orientations described in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90° or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0037] As used herein, the term "layer" refers to a portion of material comprising a region of a certain thickness. A layer may extend over the entirety of an underlying or upper layer structure, or may have a extent smaller than that of the underlying or upper layer structure. Furthermore, a layer may be a region of a homogeneous or heterogeneous continuous structure with a thickness less than that of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure, or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically, and / or along a tapered surface. A substrate may be a single layer, which may include one or more layers, and / or may have one or more layers on, above, and / or below it. A single layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0038] As used herein, the term "substrate" refers to the material on which subsequent material layers are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned or may remain unpatterned. Furthermore, the substrate may comprise a wide variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of a non-conductive material, such as glass, plastic, or sapphire wafers. Further alternatively, the substrate may have semiconductor devices or circuits formed therein.

[0039] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art in understanding and reading the content described in the specification, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effects and objectives of this application, should still fall within the scope of the technical content disclosed in this application. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0040] As used herein, the terms “substantially,” “materially,” “approximately,” and “about” are used to indicate and explain minor variations. For example, when used in conjunction with numerical values, the above terms may refer to a range of variation less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another embodiment, the thickness of a film or layer being “substantially uniform” may refer to the average thickness of the film or layer being less than or equal to ±10% of the standard deviation, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces that are within 50 μm along the same plane (such as within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane). If, for example, two components overlap or overlap within 200 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm, then the two components can be considered "substantially aligned". If the angle between two surfaces or components is, for example, 90° ± 10° (such as ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°), then the two surfaces or components can be considered "substantially perpendicular". When used in conjunction with an event or situation, the terms "substantially," "substantially," "approximately," and "about" can refer to the exact occurrence of the event or situation as well as the very close approximation of the event or situation.

[0041] It should also be noted that the longitudinal section corresponding to the embodiment of this application can be the section corresponding to the front view direction, the transverse section can be the section corresponding to the right view direction, and the horizontal section can be the section corresponding to the top view direction.

[0042] Furthermore, where there is no conflict, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0043] As described in the background section, the relevant packaging structures are still difficult to meet the needs of actual semiconductor packaging.

[0044] Figure 1 An existing packaging structure 100 is shown. For example... Figure 1As shown, the package structure 100 is a FOMCM (Fan-Out Multi-Chip Module) structure. The package structure 100 includes: a circuit layer 101 of the FOMCM structure, a first chip 102, a first module layer 103, a connection point 105, and solder balls 106.

[0045] The upper surface of the circuit layer 101 includes a first connection area and a second connection area. One or more connection points 105 are respectively provided in the first connection area and the second connection area. Each connection point 105 can be, for example, a pad.

[0046] Furthermore, a first chip 102 is disposed on the first connection area, and the first chip 102 is molded using a molding material to form a first molding layer 103 covering the first chip 102.

[0047] Since the second connection area is usually used for the second chip 108 which is subsequently placed next to the first chip 102, when molding the first chip 102, it is necessary to reserve space in the second connection area for placing the second chip 108, i.e., reserved space 104, so that the second chip 108 can be placed next to the first chip 102.

[0048] It can be seen that within the reserved space 104, the connection point 105 in the second connection area is exposed within the reserved space 104.

[0049] Before placing the second chip 108 within the aforementioned packaging structure 100, it is typically necessary to first mount the active surface of the substrate 107.

[0050] The substrate 107 can be, for example, a PCB board, which can refer to a printed circuit board or a package substrate.

[0051] However, because the circuit layer 101 in the second connection area, i.e., the reserved space 104, of the package structure 100 lacks corresponding molding material support, the structural strength of this area is low, and the thermal expansion coefficients of the various structures in the circuit layer 101 differ. Therefore, when affected by temperature during the mounting process, the circuit layer 101 in this area is prone to warping, especially during high-temperature reflow soldering of the package structure and subsequent processes, where uneven warping is more likely to occur, particularly at the location of the circuit layer 101 corresponding to the second connection area, and at the boundary between the first connection area and the second connection area. Figure 1 The warping is more severe at the point where the dotted circle is drawn. Furthermore, the warping is further aggravated by the poor rigidity and soft structure of the circuit layer 101.

[0052] Consequently, the solder balls 106 below this position cannot be properly soldered to the active surface of the substrate 107. For example, some solder balls 106 on the lower surface of the circuit layer 101 cannot make full contact with the corresponding soldering points on the substrate 107, which eventually leads to poor soldering, cold solder joints, misalignment and other defects, and may even cause the entire package structure to fail.

[0053] refer to Figure 2A-1 , Figure 2A-1 This is a longitudinal cross-sectional view of a packaging structure 200A according to an embodiment of this application. Figure 2A-1 As shown, the packaging structure 200A of this application is a fan-out structure, including: a circuit layer 201, a first chip 202, a first molding layer 203, a connection point 205, a first adhesive layer 211, a spacer support 210, and solder balls 206.

[0054] The first surface of the circuit layer 201 includes a first connection area and a second connection area. One or more connection points 205 are respectively provided in the first connection area and the second connection area. Each connection point 205 may be, for example, a pad.

[0055] Furthermore, a first chip 202 is disposed on the first connection area, and the first chip 202 is molded using a first molding material, thereby forming a first molding layer 203 covering the first chip 202.

[0056] The first chip 202 can be, for example, an AP chip (Application Processor chip).

[0057] Since the second connection area is usually used to subsequently set up a second chip 208 that is parallel to the first chip 202, when molding the first chip 202, it is necessary to reserve space in the second connection area for placing the second chip 208, i.e., reserve space, so that the second chip 208 can be placed side by side with the first chip 202.

[0058] Specifically, such as Figure 2A-1 As shown, the first mold sealing layer 203 covers the sides and bottom of the first chip 202 and covers all or part of the first connection area.

[0059] Furthermore, a first adhesive layer 211 is provided in the second connection area, wherein the first adhesive layer 211 has a certain elasticity and can cover each connection point 205 in the second connection area.

[0060] Accordingly, the spacer support 210 can be bonded to the surface of the first adhesive layer 211 that is away from the circuit layer.

[0061] The material of the spacer support 210 can be a material with high rigidity and low coefficient of thermal expansion, such as glass, metal, or the same material as the first mold sealing layer 203.

[0062] Based on this, the occupant support 210 can consistently provide support to the circuit layer 201 corresponding to the second connection area during temperature changes, improving the structural strength of the circuit layer 201 portion corresponding to the second connection area, dispersing stress, and suppressing warping deformation of the circuit layer 201 in the second connection area during reflow soldering. Furthermore, in suppressing warping deformation in this area, it also avoids warping at the boundary between the first and second connection areas. Figure 2A-1 The area circled in the middle of the dashed line shows warping.

[0063] This ensures that each solder ball 206 on the lower surface of the circuit layer 201 can fully fit the soldering points of the substrate 207 during subsequent mounting with the substrate 207, thus avoiding soldering defects.

[0064] Furthermore, since the placeholder support 210 is only set in the second connection area through the first adhesive layer 211, when the second chip 208 needs to be installed later, the placeholder support 210 can be easily removed after the first adhesive layer 211 is de-adhesived, without damaging the circuit layer 201 and the connection point 205 of the second connection area, and without affecting the subsequent mounting of the second chip 208.

[0065] exist Figure 2A-1 In this process, since the spacer support 210 needs to provide overall support for the second connection area, the size of the spacer support 210 is matched with the size of the second connection area, and it can completely cover all the connection points 205 in the second connection area to ensure the effect of suppressing warping.

[0066] In this embodiment, among the various sides of the first mold sealing layer 203, the side facing the occupant support 210 can be designated as the first side, and among the various sides of the occupant support 210, the side facing the first mold sealing layer 203 can be designated as the second side. The first mold sealing layer 203 may have one or more first sides, and each first side is opposite to one side of the occupant support 210.

[0067] Furthermore, since in the manufacturing process, a placeholder support 210 is often first set in the circuit layer 201, and then the first mold sealing layer 203 is set, the first mold sealing layer 203, in addition to covering the first chip 202 and the first connection area, will also cover the second side of the placeholder support 210. Since the spacer support 210 needs to be removed later to make room for the second chip 208, a gap can be formed between the first side of the first molded layer 203 and the second side of the spacer support. This prevents the first molded material from directly covering the second side of the spacer support 210 in the package structure 200A, which would otherwise cause the spacer support 210 to be tightly attached to the first molded layer 203 and difficult to remove.

[0068] Specifically, such as Figure 2A-1 As shown, after the first mold sealing layer 203 covers the second side, a dividing gap 204 can be cut at the fitting position of the first side and the second side to form the first side of the first mold sealing layer 203, and a gap is formed between the first side and the second side of the occupier support 210.

[0069] Furthermore, during the manufacturing process, when the first mold sealing layer 203 covers the second side, the second side and the side of the first adhesive layer 211 near the first mold sealing layer will restrict the flow of the first sealing material along the first surface. That is, the specific shape and size of the second side of the occupier 210 and the side of the first adhesive layer 211 near the first mold sealing layer directly affect the first side corresponding to the first mold sealing layer 203.

[0070] The first adhesive layer 211 directly restricts the shape of each corresponding first side, i.e., the end near the circuit layer 201. In this embodiment, the structure formed by the first adhesive layer 211 at the end of the first side near the circuit layer 201 can be regarded as the microstructure of the first side.

[0071] In some cases, the area covered by the first adhesive layer 211 may be the same as the area covered by the placeholder support 210; in other cases, since downward pressure needs to be applied to the placeholder support 210 when bonding it, one or more sides of the first adhesive layer 211 facing the first mold seal layer may overflow the second side and / or other sides of the placeholder support 210, thereby causing the area covered by the first adhesive layer 211 to be larger than the area covered by the placeholder support 210.

[0072] Where the area covered by the first adhesive layer 211 is the same as the area covered by the spacer support 210, the microstructure can be as follows: Figure 2A-1The vertical structure shown by the dotted circle is specifically such that the second side of the occupier 210 is flush with the side of the first adhesive layer 211, and the side of the first adhesive layer 211 does not overflow, so that the first side corresponding to the second side of the occupier 210 also remains flat and planar. Furthermore, when the second side of the occupier 210 is flush with the side of the first adhesive layer 211 and substantially perpendicular to the first surface of the circuit layer 201, the first side opposite to it is also substantially perpendicular to the first surface of the circuit layer 201.

[0073] In this context, "substantial perpendicularity" includes both strict geometric perpendicularity and substantial perpendicularity, which means that manufacturing tolerances or minor deviations that are acceptable to those skilled in the art and do not affect the perpendicular function between the two are allowed, such as ±5 degrees or ±10 degrees. The specific deviations can be determined based on the accompanying drawings and embodiments.

[0074] In this case, the dividing gap 204 can extend downward from the opening between the upper surface of the first mold sealing layer 203 and the upper surface of the occupant support 210, that is, the opening between the surface of the first mold sealing layer 203 away from the circuit layer and the surface of the occupant support 210 away from the circuit layer extends downward until it extends to the first surface of the circuit layer 201.

[0075] When the area covered by the first adhesive layer 211 is larger than the area covered by the spacer support 210, the downward pressing of the spacer support 210 causes the first adhesive layer 211 to form a protrusion 2111 protruding from the side of the spacer support 210 and an adhesive portion 2112 covered by the spacer support 210. When the first mold sealing layer 203 is set, the protrusion 2111 restricts the shape of the end of the first side near the circuit layer 201, forming a microstructure with an opening facing the first adhesive layer 211, i.e., a groove structure, and the protrusion 2111 is embedded in the groove structure of the first mold sealing layer 203.

[0076] Specifically, refer to Figure 2A-2 and Figure 2A-3 , Figure 2A-2 This is a schematic cross-sectional view of a packaging structure 200A with a semi-cylindrical groove according to an embodiment of this application. Figure 2A-3 This is a longitudinal cross-sectional schematic diagram of a packaging structure 200A with a square columnar groove according to an embodiment of this application, as shown below. Figure 2A-2 and Figure 2A-3 As shown, the protrusion 2111 can be a grooved semi-cylinder, and its longitudinal section is as follows: Figure 2A-2 The semicircle shown; or, the protrusion 2111 can also be a grooved square column, with a longitudinal section as shown. Figure 2A-3 The rectangle shown.

[0077] Accordingly, based on the covering of the protrusion 2111 by the first molding material, when the protrusion 2111 is a grooved semi-cylindrical shape, the microstructure of the first side surface is a semi-cylindrical groove that matches the protrusion 2111, and its longitudinal section is as follows. Figure 2A-2 The concave semicircle shown; when the protrusion 2111 is a grooved square column, the microstructure of the first side surface is a square column groove that matches the protrusion 2111, and its longitudinal section is as shown. Figure 2A-3 The concave rectangle shown.

[0078] exist Figure 2A-2 and Figure 2A-3 In the example of the protrusion 2111 shown, the dividing slit 204 can be as follows: Figure 2A-2 and Figure 2A-3 As shown, the protrusion 2111 is cut from the upper surface of the first mold sealing layer 203 along the first side and the second side of the spacer support 210, and part of the protrusion 2111 is cut off, leaving part of the protrusion 2111, so that the longitudinal section of the protrusion 2111 forms a concave shape. Alternatively, in other cases, the protrusion 2111 can be cut from the upper surface of the first mold sealing layer 203 along the first side and the side of the spacer support 210 to the surface of the protrusion 2111 away from the circuit layer 210, i.e., the upper surface, while retaining the entire first adhesive layer 211.

[0079] When the area covered by the first adhesive layer 211 is larger than the area covered by the spacer support 210, and a dividing gap 204 is cut out, refer to Figure 2A-5 , Figure 2A-5 This is based on one embodiment of the present application. Figure 2A-2 and Figure 2A-3 The top view of the 200A packaging structure is shown in the diagram. The top view of the 200A packaging structure can be seen as follows: Figure 2A-5 Any one of the 16 structures shown.

[0080] exist Figure 2A-5 In the process, the protrusions 2111 formed by compression can be distributed on the bottom of the four sides of the occupier 210, or they can be distributed only on the bottom of any one or more sides of the occupier 210, and... Figure 2A-5 In the top view, the width of the protrusions 2111 of various top-view structures can be the same or different. Even in a single top-view structure, the width of the protrusions 2111 at the bottom of the multiple sides of the occupier 210 can be the same or different.

[0081] Furthermore, based on Figure 2A-2 and Figure 2A-3 The dividing slit 204 cut out in the middle divides the aforementioned protrusion 2111 into a first part and a second part.

[0082] The first part is the portion embedded in the groove structure, and the second part is the remaining portion of the protrusion 2111, that is, the portion located at one end of the dividing gap near the circuit layer. When part of the protrusion 2111 is cut off and the remaining portion is retained, the upper surface of the second part is lower than the upper surface of the first part, forming a groove with an opening facing the dividing gap 204, i.e., a grooved semi-cylindrical shape and a grooved square prism shape. Their longitudinal cross-sectional views are as follows: Figure 2A-2 and Figure 2A-3 The concave shape shown.

[0083] Therefore, by cutting off part of the protrusion 2111 and retaining part of the protrusion 2111, it can be ensured that the first adhesive layer 211 will not be completely cut off, thus avoiding the first adhesive layer 211 from breaking and remaining on the surface of the circuit layer 201, which would make it difficult to remove the first adhesive layer 211 embedded in the groove structure. The retained part of the first adhesive layer 211 can also play a protective role on the surface of the circuit layer 201.

[0084] Both types of protrusions 2111 mentioned above can form a mutually interlocking structure between the first mold sealing layer 203 and the first adhesive layer 211, effectively preventing the mold sealing material from overflowing during filling, and also improving the structural stability between the first mold sealing layer 203 and the spacer support 210, avoiding support offset caused by shaking during the manufacturing process.

[0085] In addition, the protrusions 2111 of various shapes, the embedded part of which is the first part 2111, can form a stable engagement with the groove of the first mold sealing layer 203. The position of the first mold sealing layer 203 can be restricted without additional limiting structures, so as to prevent the displacement of the first mold sealing layer 203 caused by the flow of other mold sealing materials during the subsequent molding process.

[0086] In some cases, the dividing gap 204 can also be slanted.

[0087] Specifically, refer to Figure 2A-4 , Figure 2A-4 This is a schematic diagram of the longitudinal cross-sectional structure of a packaging structure 200A with an inclined dividing gap 204 according to an embodiment of this application, as shown below. Figure 2A-4 As shown, when cutting the dividing gap 204, it can be cut at a certain angle away from the occupying support member 210, thereby forming a structure in which the dividing gap 204 is inclined in the direction away from the occupying support member 210.

[0088] Furthermore, based on the tilt angle of the dividing slit 204, the first side formed by the cutting also tilts accordingly toward the direction away from the occupier support 210.

[0089] Since the first side is formed by cutting, the slope of the first side is substantially the same as the slope of the dividing gap 204.

[0090] The phrase "similar slope" means that the tilt angle of the first side and the tilt angle of the dividing gap 204 do not need to be strictly limited to a certain precise value. Instead, they can cover a reasonable deviation range that is basically the same as that value and can achieve the same function and effect.

[0091] In some cases, the second side of the spacer support 210 can be cut to form an inclined shape, and the slope is substantially the same as that of the first side; in other cases, the spacer support 210 may itself have a second side with a substantially the same slope.

[0092] In other cases, where the spacer support 210 is cubic, a portion of the first mold sealing layer 203 can be separated from the spacer support 210 to the same side when cutting the dividing gap 204. For example, in Figure 2A-4 In the middle, the dashed triangle adjacent to the dividing gap 204 can also be the first mold sealing layer 203. When cutting out the dividing gap 204, the first mold sealing layer 203 of this triangle is separated from the other parts of the first mold sealing layer 203 by means of oblique cutting, and the first mold sealing layer 203 of this triangle is separated from the placeholder support 210 to the same side of the dividing gap 204, so that the first mold sealing layer 203 of this triangle can be removed together when the placeholder support 210 is removed.

[0093] exist Figure 2A-4 In the example of the inclined slit 204, the protrusion 2111 and the corresponding microstructure can be Figure 2A-4 The grooved semi-cylindrical shape shown in the figure and the matching semi-cylindrical groove can also be a grooved square column shape and the matching square column groove.

[0094] Based on this, by setting the corresponding microstructure in the packaging structure 200A, the structural stability between the first molding layer 203 and the placeholder support 210 can be guaranteed, avoiding positional displacement during the molding process. It also makes it easier to remove the placeholder support 210 without leaving excess material that would affect the subsequent mounting of the second chip 208. Overall, this improves the yield and reliability of the packaging structure, effectively suppresses warping deformation during reflow soldering, solves the problem of poor soldering, and does not affect the subsequent multi-chip parallel packaging process.

[0095] In some alternative implementations, refer to Figure 2B-1 , Figure 2B-1 This is a longitudinal cross-sectional view of the packaging structure 200B according to an embodiment of this application. Figure 2B-1As shown, the packaging structure 200B of this application is also a fan-out structure, including: a circuit layer 201, a first chip 202, a first molding layer 203, a connection point 205, a first adhesive layer 211, a spacer support 210, solder balls 206, and a second adhesive layer 212.

[0096] The difference between the encapsulation structure 200B and the encapsulation structure 200A is that a second adhesive layer 212 is provided between the first side of the first mold sealing layer 203 and the second side of its opposite occupier support 210. This second adhesive layer 212 replaces the dividing gap 204 to separate the first side and the second side.

[0097] The second adhesive layer 212 is substantially perpendicular to the circuit layer 201. One side of the second adhesive layer 212 is attached to the first side surface, and the other side is attached to the second side surface of the spacer support 210. The second adhesive layer 212 extends from the upper surface of the first chip 202 and the upper surface of the spacer support 210 to the first adhesive layer 211. When the first molding material covers the side of the second adhesive layer 212 away from the spacer support 210, the flow of the first molding material is restricted to form the first side surface of the first molding layer 203.

[0098] Specifically, the bottom end of the second adhesive layer 212 near the circuit layer 201 is connected to the protrusion 2111 of the first adhesive layer 211, thereby... Figure 2B-1 In the longitudinal section, the first adhesive layer 211 and the second adhesive layer 212 form a right-angled section.

[0099] Based on the different shapes of the protrusions 2111, different cross-sectional shapes can be formed at the bends of the right-angled cross-sections after being connected to the second adhesive layer 212, which restricts the formation of different microstructures at the end of the first side closest to the circuit layer.

[0100] Specifically, in some cases, such as Figure 2B-1 As shown, the protrusion 2111 can be a square column with a rectangular longitudinal section. Figure 2B-1 In the longitudinal cross-sectional structural diagram, the upper surface of the protrusion 2111 is connected to the bottom edge of the second adhesive layer 212 near the circuit layer, the lower surface is bonded to the circuit layer 201, and the side is covered by the first mold sealing layer 203. When the protrusion 2111 is connected to the second adhesive layer 212, the side of the protrusion 2111 is flush with the side of the second adhesive layer 212, so that the microstructure of the first side is a right-angle structure, that is, the first side can extend vertically from the top to the first side, and the first side as a whole is substantially perpendicular to the upper surface of the circuit layer 201.

[0101] In other cases, such as Figure 2B-2 As shown, the protrusion 2111 can be an upward-curving arc shape, and its longitudinal section is an arc-shaped surface protruding towards the first mold sealing layer 203. Figure 2B-2In the longitudinal cross-sectional structural diagram, the upturned end face of the protrusion 2111 connects to the bottom edge of the second adhesive layer 212 near the circuit layer. The arc surface is covered by the first mold sealing layer 203. When the protrusion 2111 is covered by the first mold sealing layer 203, the arc surface of the protrusion 2111 restricts the microstructure of the first side surface to form an arc-shaped slope structure that matches the arc surface. Its longitudinal cross-sectional structure is as follows: Figure 2B-2 The arc-shaped transition surface shown extends continuously along the first side of the first mold sealing layer 203 toward the second connection area.

[0102] In this case, the cube base edge of the occupier 210 that is covered by the protrusion 2111 can be as follows: Figure 2B-2 The longitudinal section shown is an arc-shaped bottom edge that matches the protrusion 2111.

[0103] In other cases, such as Figure 2B-3 As shown, the protrusion 2111 can be an upward-curved slope, and its longitudinal section is a plane inclined towards the first mold sealing layer 203. Figure 2B-3 In the longitudinal cross-sectional view, the upturned end face of the protrusion 2111 connects to the bottom edge of the second adhesive layer 212 near the circuit layer. The inclined surface is covered by the first mold sealing layer 203. When the protrusion 2111 is covered by the first mold sealing layer 203, the inclined surface of the protrusion 2111 restricts the microstructure of the first side surface to form a slope structure that matches the inclined surface. Its longitudinal cross-sectional structure is as follows: Figure 2B-3 The transition slope shown extends continuously along the first side of the first mold sealing layer 203 toward the second connection area.

[0104] In this case, the cube base edge of the occupier 210 that is covered by the protrusion 2111 can be as follows: Figure 2B-3 The longitudinal section shown is a sloping chamfered bottom edge that matches the protrusion 2111.

[0105] Based on this, the second adhesive layer 212 can be pre-attached to the second side of the spacer support 210 during the manufacturing process, and then the entire assembly can be bonded and fixed to the second connection area of ​​the circuit layer 201 using the first adhesive layer 211. Afterwards, the first molding layer 203 can be molded. After molding, the second adhesive layer 212 naturally separates the first side of the first molding layer 203 from the second side of the spacer support 210. (Refer to...) Figure 2B-4 , Figure 2B-4 This is based on one embodiment of the present application. Figure 2B-1 , Figure 2B-2 and Figure 2B-3The top view of the encapsulation structure 200B shows that the second adhesive layer 212 can completely separate the first mold sealing layer 203 and the spacer support 210. This means that when removing the spacer support 210, there is no need to cut the dividing gap 204. The first adhesive layer 211 and the second adhesive layer 212 can be directly de-adheded, and the spacer support 210 and the adhesive layer can be removed as a whole. There is no problem of the mold sealing material being tightly attached to the spacer support 210 and difficult to separate.

[0106] In some alternative implementations, refer to Figure 3A , Figure 3A Based on an embodiment of this application Figure 2A-1 The packaging structure is 200A or Figure 2B-1 A schematic diagram of the longitudinal cross-sectional structure of the packaging structure 300A formed by the packaging structure 200B. (See diagram below.) Figure 3A As shown, the packaging structure 300A of this application is also a fan-out structure, including: a circuit layer 201, a first chip 202, a first molding layer 203, a connection point 205, a first adhesive layer 211, a spacer support 210, solder balls 206, a second chip 208, a second molding layer 209, and a substrate 207.

[0107] In the 300A package structure Figure 2A-1 The packaging structure is 200A or Figure 2B-1 The package structure 200B is connected to the active surface of the substrate 207 via solder balls 206 below. Figure 2A-1 The packaging structure is 200A or Figure 2B-1 The package structure 200B has a spacer support 210. Therefore, during the process of connecting the package structure 200A or package structure 200B with spacer support 210 to the substrate 207, the spacer support 210 can support the circuit layer 201 and disperse warping stress, so as to avoid severe warping of the circuit layer 201, which would lead to problems such as inaccurate soldering point alignment, poor soldering, and open circuit during the connection with the substrate 207.

[0108] Furthermore, by removing Figure 2A-1 The spacer support 210 and the first adhesive layer 211 in the encapsulation structure 200A, or, removing Figure 2B-1 The packaging structure 200B includes a spacer support 210, a first adhesive layer 211, and a second adhesive layer 212, thereby forming a reserved space for placing the second chip 208, and exposing the second connection area of ​​the circuit layer 201 and the connection point 205 on its surface within the reserved space.

[0109] Accordingly, the second chip 208 can be mounted in the second connection area and electrically connected to the circuit layer 201 through the connection point 205.

[0110] Furthermore, the second molding material is used to cover the second chip 208 and the second connection area with the second molding layer 209 to form the second molding layer 209.

[0111] The first side surface and its microstructure of the first mold sealing layer 203 restrict the second mold sealing material to form the third side surface of the second mold sealing layer 209, which is correspondingly and relatively attached to the first side surface.

[0112] Specifically, the microstructure of the first side of the first molding material is as follows: Figure 2A-1 The packaging structure is 200A or Figure 2B-1 In the case of the right-angle structure in the packaging structure 200B, that is, when the first side is a flat plane that is substantially perpendicular to the circuit layer 201, the third side of the second mold sealing layer 209 that is attached to the first side also forms a matching flat plane and is substantially perpendicular to the circuit layer 201.

[0113] In some alternative implementations, refer to Figure 3B , Figure 3B According to one embodiment of this application Figure 2A-2 A schematic diagram of the longitudinal cross-sectional structure of the packaging structure 300B formed by the packaging structure 200A. (See attached diagram.) Figure 3B As shown, the difference between the packaging structure 300B of this application and the packaging structure 300A described above is that, due to Figure 2A-2 The first adhesive layer 211 of the intermediate packaging structure 200A has a grooved semi-cylindrical protrusion 2111, which makes... Figure 2A-2 The microstructure of the encapsulation structure 200A is a semi-cylindrical groove that matches the protrusion 2111. Therefore, the third side of the second mold sealing layer 209, which is attached to the first side, forms a semi-cylindrical side protrusion that is embedded in the semi-cylindrical groove.

[0114] In some alternative implementations, refer to Figure 3C , Figure 3C According to one embodiment of this application Figure 2A-3 A schematic diagram of the longitudinal cross-sectional structure of the packaging structure 300C formed by the packaging structure 200A. (See diagram below.) Figure 3C As shown, the difference between the packaging structure 300C of this application and the packaging structure 300A described above is that, due to Figure 2A-3 The first adhesive layer 211 of the encapsulation structure 200A has a grooved square column protrusion 2111, which makes... Figure 2A-3 The microstructure of the encapsulation structure 200A is a square column-shaped groove that matches the protrusion 2111. Therefore, the end of the third side of the second mold sealing layer 209 that is attached to the first side is also formed into a square column-shaped side protrusion that is embedded in the square column-shaped groove.

[0115] In some alternative implementations, refer to Figure 3D , Figure 3D According to one embodiment of this application Figure 2B-2 A schematic diagram of the longitudinal cross-sectional structure of the encapsulation structure 300D formed by the encapsulation structure 200B. (See attached diagram.) Figure 3D As shown, the difference between the packaging structure 300D of this application and the packaging structure 300A described above is that, due to... Figure 2B-2 The protrusion 2111 of the first adhesive layer 211 of the encapsulation structure 200B forms an upward-curved arc shape, making Figure 2B-2 The microstructure of the encapsulation structure 200B is an arc-shaped slope structure that matches the protrusion 2111. Therefore, the third side of the second mold sealing layer 209, which is attached to the first side, also has an upward arc shape at the end near the circuit layer 201 and is embedded in the arc-shaped slope structure.

[0116] In some alternative implementations, refer to Figure 3E , Figure 3E According to one embodiment of this application Figure 2B-3 A schematic diagram of the longitudinal cross-sectional structure of the packaging structure 300E formed by the packaging structure 200B. (See attached diagram.) Figure 3E As shown, the difference between the packaging structure 300E of this application and the packaging structure 300A described above is that, due to Figure 2B-3 The protrusion 2111 of the first adhesive layer 211 of the encapsulation structure 200B forms an upward-curved slope, so that Figure 2B-3 The microstructure of the encapsulation structure 200B is a ramp structure that matches the protrusion 2111. Therefore, the third side of the second mold sealing layer 209, which is attached to the first side, also has an upward-curved slope at the end near the circuit layer 201 and is embedded in the ramp structure.

[0117] It should be noted that, in Figure 2A-2 and Figure 2A-3 The 200A packaging structure, and Figure 2B-2 and Figure 2B-3 In the encapsulation structure 200B, due to the presence of microstructures, when the first adhesive layer 211 is removed, a portion of the first adhesive layer 211 embedded in the microstructure can be retained. This allows the second mold sealing layer 209 and the first mold sealing layer 203 to be bonded together at the microstructure by retaining the portion of the first adhesive layer 211 after the second mold sealing layer 209 is set.

[0118] Based on this, package structures 300A, 300B, 300C, 300D, and 300E are partially embedded in the first molded layer 203 via the second molded layer 209. This allows the microstructures of the second molded layer 209 and the first molded layer 203 to form a stable interlocking structure. The position of the second molded layer 209 can be limited without additional limiting structures, improving the bonding strength between the two layers. This effectively prevents displacement and delamination of the second molded layer 209 during subsequent molding and soldering processes, further enhancing the overall structural stability and reliability of the multi-chip co-location structure.

[0119] refer to Figures 4A to 4H , Figures 4A to 4H This is a schematic diagram illustrating the manufacturing steps of a packaging structure 200A according to an embodiment of this application. Figures 4A to 4H As shown, its manufacturing process includes the following steps: Step 401: A first chip 202 is disposed in the first connection area of ​​the first surface of the circuit layer 213, and a first adhesive layer 211 is disposed in the second connection area of ​​the first surface.

[0120] In this step, a carrier board 401 and a circuit layer 201 can be prepared in advance, and a fixing layer 402 can be set on the carrier board 401.

[0121] The circuit layer 201 has multiple connection points 205 on both sides of its surface.

[0122] Furthermore, one side surface of the circuit layer 201 can be fixed to the fixing layer 402 to obtain, as shown below. Figure 4A The structure shown.

[0123] Based on the obtained Figure 4A The structure shown allows for the covering of a third mold sealing layer 213 on the other side surface of the circuit layer 201, thereby achieving the following... Figure 4B The structure shown.

[0124] Based on the obtained Figure 4B The structure shown allows for the removal of the fixing layer 402 and carrier board 401 attached to the circuit layer 201, exposing multiple connection points 205 on that side surface.

[0125] Furthermore, the circuit layer 201 covered with the third mold sealing layer 213 is flipped so that the side surface exposing the connection point 205 faces upward, and this side surface is used as the first surface.

[0126] Based on this, a first chip 202 can be disposed on the first surface of the circuit layer 201 where the connection point 205 is exposed.

[0127] Specifically, the first surface of the line layer 201 is divided into a first connection area and a second connection area, each with a plurality of connection points 205.

[0128] The first chip 202 can be soldered to the first connection area of ​​the circuit layer 201 by soldering, and a first adhesive layer 211 is provided in the second connection area.

[0129] Step 402: Press down and bond the spacer support 210 to the first adhesive layer.

[0130] In this step, for the first adhesive layer 211 provided in the second connection area, one side surface of the first adhesive layer 211 is bonded to the second connection area, and the other side surface of the first adhesive layer 211 away from the circuit layer is bonded to the placeholder support 210.

[0131] In some scenarios, at least one side of the first adhesive layer 211 can be pressed out of the side of the spacer support 210 by pressing down the spacer support 210, forming a protrusion 2111.

[0132] Specifically, during the process of bonding the spacer support 210 to the first adhesive layer 211, a downward pressure can be applied to the spacer support 210 toward the first adhesive layer 211, thereby firmly bonding the spacer support 210 to the first adhesive layer 211.

[0133] Furthermore, by applying downward pressure, the first adhesive layer 211 overflows from the side of the spacer support 210, forming a protrusion 2111 with a predetermined shape, resulting in... Figure 4C The structure shown.

[0134] The overflowing first adhesive layer 211 can be modified into a preset shape, such as a square column or a semi-cylindrical shape, so as to restrict the flow of the first molding layer 203 along the first surface to form a microstructure of the corresponding shape during the subsequent molding process.

[0135] In other cases, the side of the spacer support 210 may also be pre-attached with a second adhesive layer 212. Figure 4C (not shown), so that after the occupant support 210 is bonded to the first adhesive layer 211 and downward pressure is applied, the bottom of the second adhesive layer 212 on the side is connected to the protrusion 2111 formed by the overflow of the first adhesive layer 211, and the longitudinal cross sections of the first adhesive layer 211 and the second adhesive layer 212 are formed into right angles.

[0136] Step 402, molding is performed to form a first molding layer 203 covering the first chip 202, a portion of the first adhesive layer 211, and at least a portion of the first connection area and protrusion 2111, to obtain a package structure 200A or a package structure 200B.

[0137] In this step, based on the results obtained in step 402 above... Figure 4C The structure shown involves filling a first molding material around the first chip 202 using a molding process. The first molding material can cover the first chip 202 and the first connection area. At the same time, the first molding material also covers the side of the spacer support 210 and part of the first adhesive layer 211, such as the protrusion 2111 of the first adhesive layer 211.

[0138] The side of the spacer support 210 covered by the first mold sealing material is the second side.

[0139] In other cases, a second adhesive layer 212 is bonded to the second side of the spacer support 210 ( Figure 4C (Not shown), then the first molding material, while covering the first chip 202 and the first connection area, also covers the side of the second adhesive layer 212 away from the occupying support 210 and covers the protrusion 2111 of the first adhesive layer 211, thereby obtaining the following... Figure 2B-1 , Figure 2B-2 or Figure 2B-3 The package structure shown is 200B.

[0140] Based on this, by restricting the flow of the first molding material along the first surface by the protrusion 2111, a microstructure can be formed on the side of the first molding layer 203 near the end of the circuit layer 201.

[0141] Specifically, the protrusion 2111 of the first adhesive layer 211 restricts the shape of the first molding material, thereby allowing a microstructure matching the protrusion 2111 to be formed on the first side opposite the spacer support 210 after the first molding layer 203 has been cured, resulting in... Figure 4D The structure shown includes a microstructure that is the aforementioned concave semi-cylindrical groove structure, concave square column groove, concave arc-shaped slope structure or ramp structure, with the protrusion 2111 embedded in the microstructure.

[0142] Furthermore, based on the obtained Figure 4D The structure shown can be flipped so that the third mold sealing layer 213 faces upward.

[0143] Furthermore, the portion of the third mold cover 213 covering the connection point 205 can be removed, exposing each connection point 205, resulting in the following: Figure 4E The structure shown.

[0144] Based on this, solder balls 206 can be connected to each exposed connection point 205, and then flipped over to obtain the following result: Figure 4F The structure shown.

[0145] The solder balls 206 can be used to mount the package structure 300A, package structure 300B, package structure 300C, package structure 300E or package structure 300F onto the active surface of the substrate 207 in subsequent manufacturing.

[0146] Based on this, a dividing gap 204 can be cut between the first chip 202 and the spacer support 210.

[0147] Specifically, the cutting can be performed according to specific needs. For example, by making a vertical cut and removing the protrusion 2111, the circuit layer 201 can be exposed, resulting in... Figure 2A-1 The package structure 200A shown is obtained by vertical cutting, removing part of the protrusion 2111, and retaining part of the protrusion 2111 covering the circuit layer 201, as shown. Figure 2A-2 or Figure 2A-3 The package structure 200A shown is obtained by obliquely cutting towards the first chip 202, removing part of the protrusion 2111, and retaining part of the protrusion 2111 covering the circuit layer 201, as shown. Figure 2A-4 The package structure shown is 200A.

[0148] It should be noted that each package structure 200A or package structure 200B can be manufactured separately through steps 401 and 402, or multiple package structures 200A or multiple package structures 200B can be manufactured together as a whole, and after completing steps 401 and 402, the whole is divided into individual package structures 200A or package structures 200B.

[0149] Specifically, after multiple package structures 200A or multiple package structures 200B are manufactured as a whole through steps 401 and 402, the following can be obtained: Figure 4G The top view of the structure is shown.

[0150] Figure 4G This is a top view of a structure after a first mold cover 203 is set together as a whole for multiple encapsulation structures 200A or multiple encapsulation structures 200B according to an embodiment of this application. It includes 16 identical units, each of which can be an encapsulation structure 200B or an encapsulation structure 200A that has not yet been cut with dividing gaps 204.

[0151] Based on this, it can be done in Figure 4G Cut along the dotted line as shown to obtain Figure 4H The 16 individual package structures 200B shown, or 16 package structures 200A that have not yet been cut with dividing slits 204.

[0152] refer to Figures 5A to 5C , Figures 5A to 5C This is a schematic diagram illustrating the manufacturing steps of a packaging structure 300A according to an embodiment of this application. Figures 5A to 5C As shown, its manufacturing process includes the following steps: Step 501: Mount the package structure onto the substrate 207.

[0153] The substrate 207 can be, for example, a PCB board, which can refer to a printed circuit board or a package substrate.

[0154] The packaging structure can be either the packaging structure 200A or the packaging structure 200B described above.

[0155] In this step, with Figure 2A-1 Taking the package structure 200A shown as an example, when mounting the package structure 200A onto the substrate 207, the package structure 200A can be soldered to the active surface of the substrate 207 using solder balls 206, resulting in the following... Figure 5A The structure shown.

[0156] During this process, since the package structure 200A has a spacer support 210, the spacer support 210 can disperse the warping stress of the circuit layer 201 during the reflow soldering of the solder ball 206, effectively suppressing the warping deformation of the circuit layer 201, thereby avoiding the problem of poor soldering.

[0157] Step 502: De-adhesive is applied to the first adhesive layer to remove the spacer support 210.

[0158] In this step, based on Figure 5A The encapsulation structure 200A shown, mounted on the substrate 207, has a dividing slit 204 cut out. Since the second side of the spacer support 210 does not contact the first side of the first molding layer 203, the spacer support 210 and the first adhesive layer 211 can be directly removed, exposing the connection point 205 in the second connection area, resulting in... Figure 5B The structure shown.

[0159] In other cases, a second adhesive layer 212 is bonded between the second side of the spacer support 210 and the first side of the first mold sealing layer 203. Figure 5B (Not shown) When removing the adhesive, both the first adhesive layer 211 and the second adhesive layer 212 need to be removed. However, the second adhesive layer 212 is bonded to the first side of the first mold sealing layer 203, so it is difficult to pull it out directly during the removal process. In this case, the corresponding removal method can be adopted according to the different materials of the spacer support 210.

[0160] Furthermore, in cases where only the first adhesive layer 211 is provided without the second adhesive layer 212... Figure 5B Alternatively, depending on the different materials of the spacer support 210, a corresponding de-adhesion method can be adopted.

[0161] For example, when the spacer support 210 is made of glass, since light can penetrate the glass and irradiate the first adhesive layer 211 and the second adhesive layer 212, the adhesive can be removed by laser irradiation or UV (ultraviolet) irradiation of the first adhesive layer 211 and the second adhesive layer 212.

[0162] Alternatively, if the spacer support 210 is made of metal, heat can be quickly transferred to the first adhesive layer 211 and the second adhesive layer 212 through the metal material. Therefore, the first adhesive layer 211 and the second adhesive layer 212 can be debonded by heating the upper surface of the spacer support 210 through heat transfer.

[0163] In some cases, after removing the placeholder support 210 in step 502, step 503 can be performed to place the second chip 208 in the second connection area.

[0164] In this step, based on the results obtained in step 501 above... Figure 5B The structure shown allows for the placement of a second chip 208 within the exposed second connection area.

[0165] Specifically, the second chip 208 can be connected to the connection point 205 in the second connection area by means of, for example, soldering, to obtain, as shown below. Figure 5C The structure shown.

[0166] Step 504: Molding is performed to form a second molding layer 209 that encapsulates the second chip 208 and covers the second connection area and the side of the first molding layer 203, resulting in a package structure 300A.

[0167] In this step, based on the results obtained in step 502 above... Figure 5C The structure shown allows for the installation of a second mold sealing layer 209.

[0168] Specifically, a second molding material can be filled in using a molding process. This second molding material can cover the second chip 208 and the second connection area. Simultaneously, the second molding material also covers the first side of the first molding layer 203, resulting in the following: Figure 5D The package structure shown is 300A.

[0169] In other cases, when the first side has a concave microstructure near the circuit layer end ( Figure 5C(Not shown), for example, when the aforementioned concave semi-cylindrical groove, concave square prism groove, concave arc-shaped slope structure or ramp structure is used, during the molding process, the microstructure on the first side near the circuit layer will naturally limit the flow of the second molding material along the circuit layer. The second molding material can fill into the concave semi-cylindrical groove, concave square prism groove, concave arc-shaped slope structure or ramp structure. After the second molding material is cured, a second molding layer 209 is formed. The third side of the second molding layer 209 opposite to the first molding layer 203 can fit with the first side of the first molding layer 203 and be embedded in the microstructure, so that the second molding layer 209 and the first molding layer 203 form a mutually interlocking structure, which can fix the position of the second molding layer 209, resulting in a packaging structure 300B, packaging structure 300C, packaging structure 300D or packaging structure 300E. Figure 5D (Not shown).

[0170] Although this application has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not limiting of this application. It will be readily understood by those skilled in the art that various changes can be made and equivalent elements can be substituted within embodiments without departing from the true spirit and scope of this application as defined by the appended claims. Illustrations may not be drawn to scale. Differences may exist between the technical representation in this application and actual implementation due to variables in the manufacturing process, etc. Other embodiments of this application may exist that are not specifically described. The description and illustrations should be considered illustrative rather than restrictive. Modifications can be made to adapt particular circumstances, materials, composition, methods, or processes to the objectives, spirit, and scope of this application. All such modifications fall within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit this application.

Claims

1. A packaging structure, characterized in that, include: A circuit layer having a first surface, the first surface including a first connection region and a second connection region; A first chip is disposed in the first connection area; A first adhesive layer is disposed in the second connection area; The spacer support is disposed in the second connection area via the first adhesive layer; A first molding layer encapsulates the first chip and covers at least a portion of the first connection area. The first molding layer has a first side facing the placeholder support, and there is a gap between the first side and a second side of the placeholder support facing the first molding layer. The first side has a microstructure at one end near the circuit layer.

2. The packaging structure according to claim 1, characterized in that, The microstructure is formed by a first molding material adjacent to the first surface, confined by the first adhesive layer; The microstructure includes a groove structure; At least one side of the first adhesive layer protrudes from the second side of the spacer support on the side facing the first molding layer, forming a protrusion. The first side of the first molded layer forms the groove structure at the end near the circuit layer corresponding to the protrusion.

3. The packaging structure according to claim 2, characterized in that, A through-slit is formed between the first side and the second side of the opposite occupier support. The dividing gap extends downward from the opening between the upper surface of the first molding layer and the upper surface of the occupier support to the protrusion of the first adhesive layer.

4. The packaging structure according to claim 3, characterized in that, The protrusion includes: The first part is located at least within the groove structure; The second part is located at one end of the dividing gap near the circuit layer; The upper surface of the second part is flush with the upper surface of the first part, or is lower than the upper surface of the first part in a direction away from the circuit layer.

5. The packaging structure according to claim 3, characterized in that, The first side of the first mold sealing layer is inclined toward the side away from the occupying support; The dividing gap extends obliquely toward the side away from the occupier support; The first side of the first molded layer is parallel to the extension direction of the dividing gap.

6. The packaging structure according to claim 4, characterized in that, The first side of the first molded layer is perpendicular to the upper surface of the circuit layer; The dividing gap extends in a direction perpendicular to the upper surface of the circuit layer.

7. The packaging structure according to claim 2, characterized in that, A second adhesive layer is filled between the first side of the first molded layer and the second side of the opposite spacer support member, and the second adhesive layer is simultaneously bonded to the first side of the first molded layer and the second side of the spacer support member.

8. The packaging structure according to claim 7, characterized in that, The second adhesive layer extends downward from the opening between the upper surface of the first molding layer and the upper surface of the spacer support, and extends to the protrusion of the first adhesive layer and is bonded to the protrusion.

9. The packaging structure according to claim 8, characterized in that, The microstructure includes a right-angled structure; The protrusion is in the shape of a square column; The first side of the first mold sealing layer forms the right-angle structure at one end near the circuit layer. The right-angle structure is perpendicular to the upper surface of the circuit layer and is provided corresponding to the prism-shaped protrusion. The second adhesive layer contacts and connects with the prismatic protrusion.

10. The packaging structure according to claim 8, characterized in that, The microstructure includes an arc-shaped slope structure, and the protrusion is an upward-curving arc shape; The first side of the first mold sealing layer forms the arc-shaped slope structure at one end near the line layer. The arc-shaped slope structure is an arc-shaped transition surface that extends continuously along the first side of the first mold sealing layer. The arc-shaped slope structure is provided corresponding to the upward-curving protrusion. The second adhesive layer contacts and connects with the upward-curved protrusion.

11. The packaging structure according to claim 8, characterized in that, The microstructure includes a ramp structure, and the protrusion has an upward-curving slope. The first side of the first mold sealing layer forms the ramp structure at one end near the circuit layer. The ramp structure is a transition ramp that extends continuously along the first side of the first mold sealing layer. The ramp structure is provided corresponding to the protrusion of the upturned ramp. The second adhesive layer contacts and connects with the protrusion of the upturned slope.

12. A packaging structure, characterized in that, include: A circuit layer having a first surface, the first surface including a first connection region and a second connection region; A first chip is disposed in the first connection area; The second chip is disposed in the second connection area; A first molding layer encapsulates the first chip and covers at least a portion of the first connection area. The first molding layer has a first side facing the second chip, and the first side has a microstructure at one end near the circuit layer.

13. The packaging structure according to claim 12, characterized in that, The microstructure includes a groove structure; The first side of the first molded layer forms the groove structure at one end near the circuit layer; At least a portion of the first adhesive layer is disposed in the groove structure; The first adhesive layer is the same as the first adhesive layer in the encapsulation structure according to any one of claims 1-11.

14. The packaging structure according to claim 12, characterized in that, The packaging structure further includes a second molding layer, which covers the second chip, the second connection area, and the side of the first molding layer.

15. The packaging structure according to claim 13, characterized in that, The second molding layer abuts against the first molding layer and fills the microstructure at the bottom of the first molding layer, the microstructure being identical to the microstructure in the packaging structure according to any one of claims 1-11.

16. A method for manufacturing a packaging structure, characterized in that, include: A first chip is disposed in a first connection area on a first surface of the circuit layer, and a first adhesive layer is disposed in a second connection area on the first surface. The second connection area is bonded to one side surface of the first adhesive layer, and a spacer support is bonded to the other side surface. The first molding layer is formed to cover the first chip, a portion of the first adhesive layer, and at least a portion of the first connection area, thereby obtaining a package structure. The encapsulation structure is attached to the substrate; The first adhesive layer is debonded to remove the placeholder support.

17. The method for manufacturing the packaging structure according to claim 16, characterized in that, The provision of a first adhesive layer and a spacer support in the second connection area of ​​the first surface includes: By pressing down on the spacer support, at least one side of the first adhesive layer is squeezed out of the side of the spacer support to form a protrusion.

18. The method for manufacturing the packaging structure according to claim 17, characterized in that, The molding process forms a first molding layer that covers the first chip, a portion of the first adhesive layer, and at least a portion of the first connection area, resulting in a package structure, including: A first molding layer is formed to encapsulate the first chip and the protrusion, and to cover at least a portion of the first connection area. The protrusion restricts the formation of a microstructure on the side of the first molding layer near the circuit layer by a first molding material adjacent to the first surface, thereby obtaining the packaging structure as described in any one of claims 1-11.

19. The method for manufacturing the packaging structure according to claim 18, characterized in that, After the protrusion restricts the formation of a microstructure by the first molding material adjacent to the first surface at one end of the side of the first molding layer near the circuit layer, the method further includes: With the second side of the spacer support covered by the first mold sealing layer, a dividing gap is cut into the second side of the spacer support, and a first side opposite to the second side and spaced apart by the dividing gap is formed in the first mold sealing layer.

20. The method for manufacturing the packaging structure according to claim 19, characterized in that, The process of debonding the first adhesive layer includes: With the dividing gap between the first side and the second side, remove the spacer support with the first adhesive layer; In the case where there is a second adhesive layer between the first side and the second side, or in the case where there is a dividing gap between the first side and the second side, if the material of the spacer support is glass, the adhesive layer is debonded using a laser. If the spacer support is made of metal, heating the upper surface of the spacer support will transfer the heat to the adhesive layer through the metal spacer support to de-adhesive.

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