Spraying mechanism, resin molding device, and method for manufacturing resin molded product

Abstract

The present application can simply and surely spray a release agent to both or one of an upper die and a lower die while improving the releasability of a molding die having the upper die and the lower die, and is a spraying mechanism 20 that sprays a release agent to both or one of an upper die 171 and a lower die 172 of a mold opening, which includes a release agent spraying section 20S that atomizes and sprays a release agent in a liquid state, and a spraying direction changing mechanism 20T that blows air to the misty release agent sprayed from the release agent spraying section 20S to change the spraying direction of the misty release agent.

Description

Technical Field

[0001] This invention relates to a spraying mechanism, a resin molding apparatus, and a method for manufacturing resin molded articles. Background Technology

[0002] Previously, as shown in Patent Document 1, in resin molding apparatus, in order to make it easier for the molded article after resin molding to be released from the resin molding die, it has been considered to spray a release agent onto the cleaned resin molding die, i.e., the lower mold.

[0003] In the resin molding apparatus, the lower mold of the resin molding die has a cavity, and a release agent is supplied to the mold surface of the lower mold through a micro-mist supply unit. Moreover, the mist nozzles of the micro-mist supply unit are arranged so that the release agent can be sprayed onto the entire mold surface when the micro-mist supply unit moves back and forth within the resin molding die.

[0004] However, the aforementioned micro-mist supply section forms a mist spray nozzle at a position opposite to the mold surface of the lower mold, and cannot supply release agent to the mold surface of the upper mold. Furthermore, when supplying release agent to the mold surface of the upper mold, in addition to the micro-mist supply section supplying release agent to the mold surface of the lower mold, a separate micro-mist supply section is needed to supply release agent to the mold surface of the upper mold, which may lead to a more complex device structure and potentially result in a larger device size.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2010-253849 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] Therefore, the present invention was made to solve the above-mentioned problems. Its main objective is to improve the release properties of a molding die having an upper mold and a lower mold, while being able to easily and reliably spray a release agent onto both or one of the upper mold and the lower mold.

[0010] Technical means to solve the problem

[0011] In other words, the spraying mechanism according to the present invention is a spraying mechanism for spraying release agent on both or one of the upper mold and lower mold of the mold opening, characterized in that it includes: a release agent spraying section for atomizing and spraying liquid release agent, and a spraying direction changing mechanism for blowing gas on the atomized release agent sprayed from the release agent spraying section to change the spraying direction of the atomized release agent.

[0012] The effects of the invention

[0013] With this invention, it is possible to improve the release properties of a molding die having an upper and a lower die while simply and reliably spraying a release agent onto either or both of the upper and lower dies. Attached Figure Description

[0014] [ Figure 1 [Illustrated plan view showing the configuration of a resin molding apparatus according to an embodiment of the present invention.]

[0015] [ Figure 2 [Illustrated diagram] is a schematic view of the molding die, first movable body, second movable body and their surrounding structures in the same embodiment, viewed from the X direction.

[0016] [ Figure 3 [Illustrated diagram] is a schematic view from the X direction showing the cable drag chains connected to each moving body of the same embodiment and their surrounding structures.

[0017] [ Figure 4 [This is a schematic diagram showing the detailed configuration of the spraying mechanism of the same embodiment (the state of spraying a mist of release agent onto the lower mold).]

[0018] [ Figure 5 [This is a schematic diagram showing the detailed configuration of the spraying mechanism of the same embodiment (the state of spraying a mist of release agent onto the upper mold).]

[0019] [ Figure 6 [This is a schematic diagram showing the detailed configuration of the spray mechanism of the same embodiment (in the state of replenishing release agent).]

[0020] [ Figure 7 [A] is a diagram showing (a) the nozzle unit and the moving part of the nozzle unit in the spraying mechanism of the same embodiment.

[0021] [ Figure 8 [This is a diagram showing the release agent detection unit and the judgment unit of the same embodiment.]

[0022] [ Figure 9 [ ] is a diagram showing the spraying action on the forming mold in the same embodiment.

[0023] [ Figure 10 [ ] is a schematic diagram showing (a) ultraviolet irradiation and (b) spraying of release agent in a resin molding article manufacturing method of the same embodiment.

[0024] [ Figure 11 [This is a schematic diagram showing (c) the loading of the molding object / resin material and (d) resin molding (mold closing) in a resin molding method according to the same embodiment.]

[0025] [ Figure 12 [ ] is a schematic diagram showing (e) the removal of the resin molded article and (f) cleaning by brush in a resin molded article manufacturing method of the same embodiment. Detailed Implementation

[0026] Next, examples will be given to further illustrate the technology according to the present invention. However, the present invention is not limited to the following technologies.

[0027] According to the present invention, a spraying mechanism is a spraying mechanism for spraying a release agent onto either or both of an upper mold and a lower mold, characterized in that it includes a release agent spraying section for atomizing and spraying liquid release agent; and a spray direction changing mechanism for blowing air onto the atomized release agent sprayed from the release agent spraying section to change the spraying direction of the atomized release agent.

[0028] Such a spraying mechanism can spray the release agent onto both the upper and lower molds, or one of them, thus improving the release properties of the resin molded product while suppressing contamination of the molding die caused by resin molding. As a result, the quality of the resin molded product can be improved.

[0029] Furthermore, by blowing air onto the atomized release agent sprayed from the release agent spray nozzle, the spray direction of the atomized release agent is changed, thus allowing the release agent to be sprayed onto both or one of the upper and lower molds simply and reliably. Here, because the air is blown onto the atomized release agent, the atomized release agent more easily penetrates the recesses on the upper or lower mold surface caused by surface roughness, thereby improving the release properties of the upper or lower mold surface. Specifically, by allowing the release agent to penetrate the recesses caused by surface roughness, the anchoring effect caused by the recesses can be reduced, decreasing adhesion and improving release properties.

[0030] Furthermore, there is no need to set up separate release agent spray sections for spraying the upper mold and the lower mold; a common release agent spray section can be used, thus preventing the spray mechanism from becoming too large.

[0031] According to the spray mechanism of the present invention, in addition to the configuration of the above-described technology 1, the spray direction changing mechanism has a first gas nozzle that blows the mist-like release agent downward and a second gas nozzle that blows the mist-like release agent upward. It is preferable to change the spray direction of the mist-like release agent by switching between spraying from the first gas nozzle and the second gas nozzle and stopping the spraying.

[0032] With this configuration, the spray direction can be easily switched between upward and downward simply by switching the spray from the first gas nozzle and the second gas nozzle. Furthermore, by employing this configuration that switches between the first and second gas nozzles, the conditions for spraying release agent onto the upward mold and onto the downward mold can be individually adjusted by modifying the spray volume from each gas nozzle. Additionally, when a release film is provided on the upper mold, the configuration can be easily changed to spray release agent only onto the downward mold.

[0033] According to the spray mechanism of the present invention, except for the configuration of the above-described technology 2, the spray direction changing mechanism preferably moves the first gas nozzle and the second gas nozzle individually relative to the release agent spray section, moves the nozzle that sprays gas in each gas nozzle to the front of the spray side of the release agent spray section, and moves the nozzle that does not spray gas in each gas nozzle to a retreat position away from the front of the spray side of the release agent spray section.

[0034] With this configuration, when gas is sprayed through one gas nozzle, the other gas nozzle can be positioned so as not to obstruct the spray direction based on the spray from the first gas nozzle. This ensures that the atomized release agent is reliably sprayed onto the surface of the molding die. For example, when gas is sprayed through the first gas nozzle, the first gas nozzle is positioned in front of the spray side of the release agent spray section, and the second gas nozzle is positioned in a recessed position away from the spray side of the release agent spray section. Furthermore, when gas is sprayed through the second gas nozzle, the second gas nozzle is positioned in front of the spray side of the release agent spray section, and the first gas nozzle is positioned in a recessed position away from the spray side of the release agent spray section.

[0035] According to the spray mechanism of the present invention, except for any of the configurations of the above-described techniques 1 to 3, the release agent spraying unit is preferably a single device that sprays the release agent by ultrasonic atomization.

[0036] With this configuration, a small amount of release agent can be sprayed evenly using an ultrasonic atomization spray section. Furthermore, the configuration of the release agent spray section can be simplified and miniaturized.

[0037] According to the spray mechanism of the present invention 5, in addition to any of the configurations of the above-described techniques 1 to 4, the release agent spraying unit has a spray nozzle for spraying the release agent and a release agent supply unit for supplying the release agent to the spray nozzle. The release agent supply unit has a supply pipe connected to the spray nozzle and a syringe part connected to the supply pipe and containing the release agent, which is preferred.

[0038] With this configuration, since the release agent supply section uses a syringe section, a continuous release agent supply without pulsation can be achieved, and a stable spray of the release agent can be produced.

[0039] Here, when the release agent spray unit has a single configuration (a configuration with a single spray nozzle), the supply pipe and syringe section can be reduced, thereby lowering the cost of release agent spray units using nozzles with expensive ultrasonic vibrators. Furthermore, only one system is needed to adjust the release agent spray unit, simplifying the adjustment process. On the other hand, when the release agent spray unit has multiple configurations (a configuration with multiple spray nozzles), the release agent spraying processing time can be shortened, and the drive shaft for moving the spray nozzles does not need to be moved during release agent spraying.

[0040] According to the spray mechanism of the present invention, in addition to the configuration of the above-described technology 5, the release agent supply unit has a replenishment tube connected to the middle of the supply tube via a switching valve, and a storage container connected to the replenishment tube and storing the release agent. It is preferable that the release agent is replenished to the syringe unit from the storage container via the replenishment tube by performing an aspiration action through the syringe unit.

[0041] With this configuration, release agent can be replenished to the syringe section, thus enabling continuous release agent supply and stable spraying of atomized release agent.

[0042] According to the spray mechanism of the present invention 7, in addition to any of the configurations of techniques 1 to 6 described above, it further includes a release agent detection unit for detecting the mist-like release agent sprayed from the release agent spray section, and a judgment unit for determining the spray state of the mist-like release agent based on the detection signal of the release agent detection unit, which is preferred.

[0043] With this configuration, since it is possible to determine whether the mist-like release agent is stable, after determining that the mist-like release agent is stable, the spray direction of the mist-like release agent can be changed by spraying air into the mist-like release agent, thereby spraying a stable mist-like release agent into the molding die.

[0044] According to the spray mechanism of the present invention 8, in addition to any of the configurations of the above-described techniques 1 to 7, it further includes a release agent recovery unit disposed in front of the spray side of the release agent spray section for recovering the mist-like release agent sprayed from the release agent spray section. The release agent recovery unit has a recess for containing the liquefied release agent, and the bottom surface of the recess is formed with an suction port, which is preferred.

[0045] This configuration prevents the release agent mist sprayed in front of the spray mechanism from scattering and causing pollution due to the spray direction changing mechanism failing to change the spray direction. This is particularly effective during the period from the start of spraying to the stabilization of the release agent mist. Furthermore, liquefied release agent contained in the recess can be recovered from the suction port. Additionally, even if there is no liquefied release agent in the recess, the mist-like release agent can still be recovered from the suction port.

[0046] Furthermore, the release agent receiving section may also function as a cover covering the nozzle portion of the spray nozzle. In this case, the release agent receiving section is configured to move between a state covering the nozzle portion of the spray nozzle and a state moving forward from the nozzle portion of the spray nozzle and leaving the nozzle portion of the spray nozzle.

[0047] With this configuration, when the release agent is not being sprayed from the nozzle, the release agent receiving section is positioned to cover the front end of the nozzle, preventing the release agent components from vaporizing, drying, and deteriorating. Furthermore, when the release agent is being sprayed from the nozzle, the release agent receiving section moves forward from the front end of the nozzle towards the spray side, positioning it away from the front end of the nozzle. Specifically, a sealing member, such as a rubber gasket, is provided at the portion of the release agent receiving section that contacts the nozzle. By pressing the sealing member against the nozzle, airtightness is maintained, thus preventing vaporization, drying, and deterioration.

[0048] According to the present invention, the resin molding apparatus is a resin molding apparatus that uses a molding die having an upper mold and a lower mold to perform resin molding on a molding object. The resin molding apparatus is characterized by including a spraying mechanism configured according to any one of the above-described techniques 1 to 8, wherein the spraying mechanism sprays a release agent onto both or one of the upper mold and the lower mold that are in the mold opening process.

[0049] In this type of resin molding apparatus, a release agent is sprayed onto both the upper and lower molds before the workpiece is brought in, thus improving the release properties of the resin molded product and suppressing contamination of the molding die caused by resin molding. As a result, the quality of the resin molded product can be improved.

[0050] According to the resin molding apparatus of the present invention 10, in addition to the configuration of the above-described technology 9, it is preferable to further include an irradiation unit for irradiating ultraviolet light onto both or one of the upper mold and the lower mold, and after irradiating ultraviolet light onto both or one of the upper mold and the lower mold by the irradiation unit, a release agent is sprayed onto both or one of the upper mold and the lower mold by the spraying mechanism.

[0051] When ultraviolet light is irradiated onto either the upper or lower mold to remove dirt adhering to it, the release properties of the mold are significantly reduced due to the UV radiation. Therefore, the release properties of the upper or lower mold can be restored by spraying a release agent after UV irradiation.

[0052] Furthermore, the method for manufacturing a resin molded article according to technology 11 of the present invention is a method for manufacturing a resin molded article using the resin molding apparatus of technology 9 or technology 10 described above. The method for manufacturing a resin molded article is characterized in that, before the object to be molded is transferred in, a release agent is sprayed onto the upper mold and the lower mold that are open, and the object to be molded is transferred into the upper mold and the lower mold that have been sprayed with the release agent for resin molding.

[0053] In this method of manufacturing resin molded articles, a release agent is sprayed onto the upper and lower molds before the workpiece is placed in the mold. This improves the release properties of the resin molded articles and suppresses contamination of the molding molds caused by resin molding. As a result, the quality of the resin molded articles can be improved.

[0054] <An embodiment of the present invention>

[0055] Hereinafter, an embodiment of the resin molding apparatus according to the present invention will be described with reference to the accompanying drawings. Furthermore, for the purposes of ease of understanding, any of the following figures have been appropriately omitted or exaggerated schematically drawn. The same reference numerals are used to denote the same constituent elements, and descriptions have been appropriately omitted.

[0056] <Overall Structure of Resin Molding Apparatus 100>

[0057] The resin molding apparatus 100 of this embodiment is an apparatus for resin molding a molded object W to which electronic components (not shown) are attached by means of transfer molding of resin material J.

[0058] Here, the object to be molded, W, can be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a wiring board, a lead frame, etc., regardless of whether it has wiring. Furthermore, the resin material J used for resin molding is, for example, a composite material containing a thermosetting resin, and the resin material J can be in granular, powdered, liquid, flake, or tablet form. In addition, the electronic components (not shown) attached to the surface of the object to be molded, W, are, for example, bare chips, resistors, capacitors, or at least one of these electronic components encapsulated in resin.

[0059] Specifically, the resin molding apparatus 100, such as Figure 1 As shown, the assembly includes, as constituent elements, a supply module 100A for supplying the molded object W (hereinafter referred to as "molded object W") and resin material J before molding, a molding module 100B having a molding die 17 for resin molding, and a storage module 100C for housing the molded object W (hereinafter referred to as "resin molded article P") after molding. Furthermore, the supply module 100A, molding module 100B, and storage module 100C are detachable from each other relative to the other constituent elements and are interchangeable. This embodiment has a configuration with two molding modules 100B, but the number of each constituent element can be increased or decreased, for example, by having one or three or more molding modules 100B.

[0060] The operation control of the resin molding apparatus 100, which includes modules 100A to 100C, shown below, is performed, for example, by a control unit CTL provided in the supply module 100A. The control unit CTL has, for example, a processing element such as a central processing unit (CPU), and performs operation control by executing a program stored in a storage unit (not shown). The control unit CTL may also be provided in other modules 100B or 100C besides the supply module 100A. Furthermore, the control unit CTL may have multiple processing elements. In this case, the processing elements of the control unit CTL can be arranged in at least two of the modules 100A to 100C.

[0061] The supply module 100A is used to supply the molding object W to the molding module 100B, and simultaneously supply the resin material J to the molding module 100B. Specifically, the supply module 100A includes: a molding object supply section 11 for supplying the molding object W, a molding object placement section 12 for transferring the molding object W, a resin material storage section 13 for storing the resin material J, a resin material arranging section 14 for arranging the resin material J, and a loading section 15 (hereinafter referred to as "loader 15") for moving the molding object W from the molding object placement section 12 to the molding module 100B and moving the resin material J from the resin material arranging section 14 into the resin molding module B. Here, the loader 15 can move at least in the X and Y directions via the transport moving mechanism 16.

[0062] Two molding modules 100B are used to resin mold the object to be molded, W, using resin material J transported by the loader 15. Each molding module 100B is equipped with a molding die 17 forming a cavity C for filling with resin material J, and a mold closing mechanism (not shown) for closing the molding die 17. In this embodiment, the molding dies 17 provided in the two molding modules 100B are arranged in a row along the X direction.

[0063] The molding die 17 has an upper die 171 and a lower die 172 arranged opposite to each other. A recess constituting the cavity C is formed in either or both of the upper die 171 and the lower die 172. Furthermore, a sump 17a for receiving resin material J is formed in the lower die 172. Additionally, a resin channel (not shown) is formed in either the upper die 171 or the lower die 172, connecting the sump 17a to the cavity C. A vent (not shown) is also formed on the side of the upper die 171 opposite to the sump 17a.

[0064] Then, with the upper mold 171 and lower mold 172 closed by the mold closing mechanism, molten resin material J is extruded from the material tank 17a through a plunger (not shown), and the molten resin material J is injected into the cavity C through the aforementioned resin channel. Next, the electronic component of the molded object W housed in the cavity C is resin encapsulated.

[0065] A ceramic layer comprising yttrium oxide, nitrogen, and a Group 4A element is formed on the surfaces of the upper mold 171 and the lower mold 172. Here, the surfaces of the upper mold 171 and the lower mold 172 refer to the faces of the upper mold 171 and the lower mold 172 facing each other (the upper mold 171 is the lower surface, and the lower mold 172 is the upper surface). This results in excellent release properties and low adhesion (fouling resistance) on the surfaces of the upper mold 171 and the lower mold 172. Furthermore, at least one element selected from the group consisting of titanium (Ti), zirconium (Zr), hafnium (Hf), and uranium (Rf) can be used as the Group 4A element.

[0066] Storage module 100C Figure 1 As shown, the device includes a storage section 18 for storing resin molded articles P, and a delivery section 19 (hereinafter referred to as "unloading machine 19") for receiving resin molded articles P from molding module 100B and transferring them to the storage section 18. Here, the resin molded article P stored in the storage section 18 can be removed from outside the device. Furthermore, the unloading machine 19 can move at least in the X and Y directions via a conveying moving mechanism 16. In this embodiment, the loader 15 and the unloading machine 19 can move via a common conveying moving mechanism 16. This conveying moving mechanism 16 is provided along the arrangement direction (X direction) of the plurality of molding dies 17, and in this embodiment, it is provided on one side, i.e., the rear side, of the molding die 17.

[0067] <Automatic cleaning function of resin molding apparatus 100>

[0068] The resin molding apparatus 100 of this embodiment has the function of automatically cleaning the upper mold 171 and the lower mold 172. The various parts that perform the automatic cleaning function, as shown below, are modularized, and the cleaning module can be configured to be detachable from each module 100A to 100C. Furthermore, when the cleaning module is configured to be detachable, the control unit of the cleaning module can be located inside or outside the cleaning module.

[0069] Specifically, the resin molding apparatus 100, such as Figure 1 and Figure 2 As shown, it includes a spraying mechanism 20 for spraying release agent onto the upper mold 171 and the lower mold 172, an irradiation section 21 for irradiating the upper mold 171 and the lower mold 172 with ultraviolet light, and a cleaning section 22 for cleaning the upper mold 171 and the lower mold 172 with a brush 221.

[0070] The spraying mechanism 20 is a device for spraying release agent onto the surfaces of the upper mold 171 and the lower mold 172. This spraying mechanism 20 is primarily used to reduce contamination caused by resin molding on the inner surfaces of the recesses of the upper mold 171 (which form cavity C) and / or the inner surfaces of the recesses of the lower mold 172 (which form cavity C). Furthermore, the spraying mechanism 20 restores the release properties of the upper mold 171 and the lower mold 172 by spraying the release agent after ultraviolet irradiation, as described later.

[0071] Here, as a release agent, a fluorinated coating liquid or an oil-based release agent that is liquid at room temperature can be used. Furthermore, the fluorinated coating liquid, for example, has three structures: a fluorinated polymer portion with release properties, a functional group portion that adheres to the mold surface, and a bonding portion connecting these portions; it is a solution of a reactive fluorinated compound dissolved in a volatile fluorinated solvent. In addition, the oil-based release agent is, for example, a silicone flow agent, a halogen-free and anhydrous substance with a viscosity of 100 mPa·s (cP) or less.

[0072] Specifically, the spray mechanism 20, such as Figure 1 and Figure 2 As shown, the device includes a spray nozzle 20a for spraying release agent and a release agent supply section 20b for supplying release agent to the spray nozzle 20a. The spray mechanism 20 of this embodiment sprays release agent onto the surfaces of the upper mold 171 and the lower mold 172 via a shared spray nozzle 20a. This spray mechanism 20 sprays release agent onto the surfaces of the upper mold 171 and the lower mold 172 when it enters the space between the opening molds. This spray mechanism 20 is mounted on a first moving body 23 that moves via a processing moving mechanism 25, which will be described later. The specific structure of the spray mechanism 20 will be detailed later.

[0073] The irradiation unit 21 is a device for irradiating the surfaces of the upper mold 171 and the lower mold 172 with ultraviolet light to remove dirt adhering to these surfaces. Here, the dirt adhering to the surfaces is mainly the wax-based substance contained in the resin. This irradiation unit 21 is mainly used to vaporize and remove the wax-based dirt adhering to the inner surface of the recessed portion of the upper mold 171 (which forms cavity C) and / or the inner surface of the recessed portion of the lower mold 172 (which forms cavity C).

[0074] Specifically, the irradiation section 21, as Figure 1 and Figure 2As shown, the device includes an upper mold irradiation section 21a that irradiates the surface of the upper mold 171 with ultraviolet light, and a lower mold irradiation section 21b that irradiates the surface of the lower mold 172 with ultraviolet light. Furthermore, a gas ejection section (not shown) is provided adjacent to each irradiation section 21a and 21b. This prevents adhesion by ejecting a gas (e.g., air) to prevent the resin from vaporizing due to ultraviolet light irradiation. The upper mold irradiation section 21a has multiple ultraviolet light-emitting diodes (LEDs) arranged in a planar shape, and the lower mold irradiation section 21b has multiple ultraviolet LEDs arranged in a planar shape. The ultraviolet LEDs are, for example, devices that emit ultraviolet light with wavelengths below 400 nm. When the irradiation section 21 enters between the upper mold 171 and the lower mold 172 during mold opening, the upper mold irradiation section 21a irradiates ultraviolet light towards the surface of the upper mold 171, and the lower mold irradiation section 21b irradiates ultraviolet light towards the surface of the lower mold 172. The irradiation part 21 is provided on the first movable body 23 on which the spray mechanism 20 is provided. That is, the spray mechanism 20 and the irradiation part 21 are provided on the common first movable body 23. Here, it is possible to provide the spray nozzle 20a of the spray mechanism 20 at the front end of the first movable body 23, provide the upper mold irradiation part 21a on the upper surface of the first movable body 23, and provide the lower mold irradiation part 21b on the lower surface of the first movable body 23.

[0075] The cleaning unit 22 is a device for cleaning the surfaces of the upper mold 171 and the lower mold 172 using a brush 221. This cleaning unit 22 is mainly used to remove resin adhering to the surfaces of the upper mold 171 and the lower mold 172 and to the vent holes.

[0076] Specifically, such as Figure 1 and Figure 2 As shown, the cleaning unit 22 includes an upper mold cleaning unit 22a for cleaning the surface of the upper mold 171 using a brush 221, and a lower mold cleaning unit 22b for cleaning the surface of the lower mold 172 using a brush 221. Furthermore, the cleaning unit 22 includes a dust collection mechanism (not shown) for collecting the resin removed by the brush 221. This cleaning unit 22 cleans the surfaces of the upper mold 171 and the lower mold 172 using the brush 221 when the upper mold 171 and lower mold 172 are being opened. This cleaning unit 22 is mounted on a second moving body 24, which is different from the first moving body 23, which is equipped with the spray mechanism 20 and the irradiation unit 21. The second moving body 24 is moved by a processing moving mechanism 25, described later.

[0077] Then, as Figure 1 and Figure 2As shown, the spray mechanism 20, irradiation section 21, and cleaning section 22 described above are configured to enter the space between the upper mold 171 and the lower mold 172 from the other side, i.e., the front side, of the forming mold 17. Furthermore, the first moving body 23, which is provided with the spray mechanism 20 and the irradiation section 21, and the second moving body 24, which is provided with the cleaning section 22, are configured to be able to move independently.

[0078] Specifically, the resin molding apparatus 100, such as Figure 1 and Figure 2 As shown, a processing moving mechanism 25 includes a spraying mechanism 20, an irradiation section 21, and a cleaning section 22 that move along the arrangement direction (X direction) of the plurality of forming molds 17. This processing moving mechanism 25 is provided on the front side of the plurality of forming molds 17. Additionally, as described above, a conveying moving mechanism 16 for the mobile loader 15 and unloader 19 is provided on the rear side of the plurality of forming molds 17 (see reference). Figure 1 ).

[0079] Processing moving mechanism 25, etc. Figure 2 As shown, a first processing moving part 25a has a first moving body 23 that is movable along the arrangement direction (X direction) and has a first moving body 23 that is movable along the arrangement direction (X direction) and a second processing moving part 25b has a second moving body 24 that is movable along the arrangement direction (X direction) and has a second moving body 24 that is movable along the arrangement direction (X direction). Here, the first processing moving part 25a is located below the second processing moving part 25b.

[0080] like Figure 2 As shown, the first processing moving part 25a has an X-direction guide rail 25a1 disposed in front of the forming mold 17 along the X-direction, and a drive part (not shown) for moving the first moving body 23 along the X-direction guide rail 25a1. Alternatively, the drive part could be configured as a motor and idler belt. The spraying mechanism 20 and the irradiation part 21 are moved to each forming mold 17 by the first moving body 23 moving along the X-direction guide rail 25a1. Furthermore, a Z-direction moving part 26 is provided between the X-direction guide rail 25a1 and the first moving body 23 to move the first moving body 23 in the vertical direction (Z-direction). The Z-direction moving part 26 moves along the X-direction guide rail 25a1 and has a Z-direction guide rail 261 disposed along the Z-direction, a Z-direction slider 262 sliding on the Z-direction guide rail 261, and a drive part (not shown) for moving the Z-direction slider 262 along the Z-direction guide rail 261. Furthermore, the first moving body 23 has a Y-direction moving part 27 for moving forward and backward relative to the forming mold 17 in the front-back direction (Y direction).

[0081] Here, the Y-direction moving part 27 uses a rack and pinion mechanism, having racks 27a and 28, a gear 27b meshing with the racks 27a and 28, and a motor (not shown) that rotates the gear 27b. The rack 27a is fixed to the Z-direction slider 262 of the Z-direction moving part 26. Furthermore, the rack 28 is provided on the forming mold 17 or its peripheral components. The gear 27b is provided on the first moving body 23. Additionally, the first moving body 23 is provided with support rollers 27c and 27d, such as cam followers, to support the weight of the first moving body 23 relative to the racks 27a and 28. These support rollers 27c and 27d contact the upper surfaces of the racks 27a and 28.

[0082] Then, along the X-direction guide rail 25a1, the first moving body 23 moves together with the Z-direction moving part 26 in the X-direction, while the Z-direction moving part 26 moves the first moving body 23 and the rack 27a in the Z-direction, moving the first moving body 23 to the front of the forming mold 17. At this time, the rack 28 and rack 27a are close to each other and aligned in a straight line. In this state, the motor rotates the gear 27b, which advances on the rack 27a and rack 28, and the first moving body 23 enters between the upper mold 171 and the lower mold 172. During this entry, the rack meshing with the gear 27b switches from rack 27a to rack 28. In addition, the support rollers 27c and 27d also transfer from rack 27a to rack 28. In other words, the first moving body 23 is designed to move forward and backward between the upper mold 171 and the lower mold 172 on its own, eliminating the need for a drive mechanism for forward and backward movement on the first processing moving part 25a, thus reducing the floor space required. In addition, floor area refers to the area occupied by the resin molding device on the floor when the resin molding device is installed.

[0083] like Figure 2As shown, the second processing moving part 25b has an X-direction guide rail 25b1 disposed in front of the forming mold 17 along the X-direction, and a drive part (not shown) for moving the second moving body 24 along the X-direction guide rail 25b1. Furthermore, the drive part could be a structure using a motor and idler belt, for example. By moving the second moving body 24 along the X-direction guide rail 25b1, the cleaning part 22 can move to each forming mold 17. Additionally, a Z-direction moving part 29 is provided between the X-direction guide rail 25b1 and the second moving body 24 to move the second moving body 24 in the vertical direction (Z-direction). Furthermore, the Z-direction moving part 29 has a Z-direction slider 292 that moves along the X-direction guide rail 25b1, a Z-direction guide rail 291 disposed along the Z-direction, and slides on the Z-direction guide rail 291, and a drive part (not shown) for moving the Z-direction slider 292 along the Z-direction guide rail 291. Furthermore, the second moving body 24 has a Y-direction moving part 30 for moving forward and backward relative to the forming mold 17 in the front-back direction (Y direction).

[0084] Here, the Y-direction moving part 30 is a device using a rack and pinion mechanism, having racks 30a and 28, a gear 30b meshing with the racks 30a and 28, and a motor (not shown) that rotates the gear 30b. The rack 30a is fixed to the Z-direction slider 292 of the Z-direction moving part 29. Additionally, the rack 28 is provided on the forming mold 17 or its peripheral components. The gear 30b is provided on the second moving body 24. Furthermore, the second moving body 24 is provided with support rollers 30c and 30d, such as cam followers, to support the weight of the second moving body 23 relative to the racks 30a and 28. The support rollers 30c and 30d contact the upper surfaces of the racks 30a and 28.

[0085] Then, along the X-direction guide rail 25b1, the Z-direction moving part 29 and the second moving body 24 move together in the X-direction. Simultaneously, the Z-direction moving part 29 moves the second moving body 24 and the rack 30a in the Z-direction, moving the second moving body 24 to the front of the forming mold 17. At this point, the rack 28 and rack 30a are close to each other and aligned in a straight line. In this state, the motor rotates the gear 30b, which advances on the racks 28 and 30a, causing the second moving body 24 to enter between the upper mold 171 and the lower mold 172. During this entry process, the rack meshing with the gear 30b switches from rack 30a to rack 28. Additionally, the support rollers 30c and 30d also transfer from rack 30a to rack 30a. In other words, the second moving body 24 is designed to move forward and backward between the upper mold 171 and the lower mold 172 on its own, eliminating the need for a drive mechanism for forward and backward movement on the second processing moving part 25b, thus reducing the footprint.

[0086] In addition, such as Figure 1 As shown, the processing moving mechanism 25 can move the spraying mechanism 20, the irradiation section 21, and the cleaning section 22 along the arrangement direction (X direction) to a retracted position EP that is further outward than the plurality of molding dies 17. In this embodiment, the retracted position EP is set on the side closer to the supply module 100A than the molding die 17. Specifically, the first processing moving part 25a of the processing moving mechanism 25 extends in front of the supply module 100A. Then, by moving the first moving body 23 to the retracted position EP, the first processing moving part 25a can move the spraying mechanism 20 and the irradiation section 21 to the retracted position EP. In addition, the second processing moving part 25b of the processing moving mechanism 25 extends in front of the supply module 100A. Then, by moving the second moving body 24 to the retracted position EP, the second processing moving part 25b can move the cleaning section 22 to the retracted position EP.

[0087] In this embodiment, when the spraying mechanism 20, the irradiation section 21, and the cleaning section 22 are moved to the retracted position EP by the processing moving mechanism 25, the opening and closing sections 31 corresponding to each molding die 17 can be opened. Here, the opening and closing sections 31 are provided on the front side of the device, such as... Figure 1 and Figure 3 As shown, the housing 33 is provided on the front surface of the receiving and processing moving mechanism 25, each moving body 23, 24, and the cable drag chains 32a, 32b connected to each moving body 23, 24. In this embodiment, the opening and closing part 31 is constructed using a shutter cover. The shutter cover can be a structure that can be opened and closed manually, or it can be a structure that is automatically opened and closed using an actuator such as a rodless cylinder.

[0088] Cable drag chains 32a and 32b are configured to move along the X direction together with each of the moving bodies 23 and 24, and to deform as each of the moving bodies 23 and 24 moves in the Y direction. Furthermore, at the device-side end (the end opposite to the moving body) of cable drag chains 32a and 32b, another cable drag chain (not shown) is connected, which is also deformable as cable drag chains 32a and 32b move in the X direction.

[0089] Furthermore, the cable drag chain 32a of the first moving body 23 and the cable drag chain 32b of the second moving body 24 are configured to not interfere with each other. Specifically, as follows: Figure 3 As shown, when viewed from the X direction, the cable chain 32b of the second moving body 24, which moves upward, is disposed inside the cable chain 32a of the first moving body 23, which moves downward. Each cable chain 32a, 32b extends upward from each moving body 23, 24 and is disposed along the front and upper surfaces of the device body. Alternatively, each cable chain 32a, 32b may not be disposed along the upper surface of the device body.

[0090] <Specific Composition of Spray Mechanism 20>

[0091] Next, refer to Figures 4-8 The specific composition of the spray mechanism 20 is explained. Additionally, in... Figures 4-6 The description of the first moving body 23 and other components is omitted.

[0092] Spray mechanism 20 Figures 4-6 As shown, the device includes a release agent spraying section 20S that atomizes and sprays liquid release agent, and a spray direction changing mechanism 20T that blows gas toward the atomized release agent sprayed from the release agent spraying section 20S to change the spray direction of the atomized release agent. The spraying mechanism 20 of this embodiment can switch the direction of the release agent sprayed from the spray nozzle 20a toward the surface of the upper mold 171 (see reference). Figure 5 ) and the direction toward the surface of the lower mold 172 (refer to Figure 4 ).

[0093] The release agent spraying unit 20S is a single device that sprays release agent by ultrasonic atomization. The release agent spraying unit 20S has a spray nozzle 20a for spraying release agent and a release agent supply unit 20b for supplying release agent to the spray nozzle 20a.

[0094] The spray nozzle 20a is a nozzle with an ultrasonic vibrator. Specifically, the spray nozzle 20a has a nozzle portion 20a1 with multiple outlets for release agent flow formed on its front end face, and an ultrasonic vibrator 20a2 that vibrates the front end face of the nozzle portion 20a1. In this spray nozzle 20a, the release agent flows out to the front end face undergoing ultrasonic vibration, thereby breaking the surface tension and spraying out a mist of release agent. However, the spray nozzle 20a is not limited to the above configuration as long as it is configured to spray a mist of release agent.

[0095] The spray nozzle 20a is configured such that its spray direction (central axis) is parallel to the surface of the upper mold 171 (or lower mold 172). Specifically, the spray nozzle 20a is configured at the front end of the first moving body 23 such that its spray direction (central axis) is toward the entry direction (Y direction) of the first moving body 23 into the forming mold 17.

[0096] The release agent supply unit 20b has a supply tube 20b1 connected to the spray nozzle 20a, and an syringe unit 20b2 connected to the supply tube 20b1 and containing the release agent. Both the supply tube 20b1 and the syringe unit 20b2 are provided on the first moving body 23.

[0097] The syringe unit 20b2 is a pulsation-free pump. The syringe unit 20b2 includes a syringe 201 that contains release agent and a plunger 202 that extrudes the release agent contained in the syringe 201. The plunger 202 is driven by an actuator (not shown). The position of the plunger 202 can be detected by a position sensor (not shown). Then, by detecting the position of the plunger 202, a release agent replenishment operation is performed on the syringe 201 when the remaining amount of release agent in the syringe 201 becomes less than a predetermined amount. Furthermore, the release agent replenishment operation on the syringe 201 can be performed at appropriately set times, such as at the end of each release agent spraying operation onto the molding die 17.

[0098] Here, the release agent supply unit 20b, in order to replenish the release agent to the syringe 201, includes a supply tube 20b4 connected to the supply tube 20b1 via a switching unit 20b3, and a storage container 20b5 connected to the supply tube 20b4 and storing the release agent. The switching unit 20b3 is, for example, a three-way solenoid valve, controlled by the control unit CTL.

[0099] When the release agent supply section 20b supplies release agent to the spray nozzle 20a, such as Figure 4 and Figure 5As shown, with the syringe section 20b2 and the spray nozzle 20a connected via the switching section 20b3, the plunger 202 of the syringe section 20b2 is pressed in. That is, the syringe section 20b2 performs an ejection action, spraying a mist of release agent from the spray nozzle 20a.

[0100] On the other hand, when the release agent supply section 20b replenishes the release agent to the syringe section 20b2, such as Figure 6 As shown, with the syringe section 20b2 and the storage container 20b5 connected via the switching unit 20b3, the plunger 202 of the syringe section 20b2 is pulled back. That is, the syringe section 20b2 performs a suction action, supplying release agent from the storage container 20b5 to the syringe section 20b2 via the supply pipe 20b4. Furthermore, when the syringe section 20b2 performs a suction action, the atmospheric vent 20b6 provided on the storage container 20b5 is opened to the atmosphere. Additionally, an air filter is provided in the atmospheric vent 20b6 to prevent foreign matter from entering the storage container 20b5. Moreover, since air may be mixed in when supplying release agent to the syringe section 20b2, an air expulsion action is performed by repeating the ejection and suction actions of the syringe section 20b2 a predetermined number of times while the syringe section 20b2 and the storage container 20b5 are connected.

[0101] Furthermore, in this embodiment, a sensor (not shown) is provided to measure the remaining amount of release agent in the storage container 20b5. When the remaining amount measured by the sensor is lower than a predetermined amount, the control unit CTL can output a notification signal. The predetermined amount is, for example, the amount of release agent sprayed onto the upper mold 171 and the lower mold 172 in one pass. By outputting a notification signal from the control unit CTL, the user or an automated guided vehicle (AGV) can replace the storage container 20b5.

[0102] The spray direction changing mechanism 20T is, for example Figures 4-6 As shown, a mechanism for changing the spray direction of a mist of release agent sprayed from the spray nozzle 20a along the plane of the upper mold 171 (or lower mold 172). Specifically, the spray direction changing mechanism 20T has a first gas nozzle 20c that blows the mist of release agent downwards and a second gas nozzle 20d that blows the mist of release agent upwards.

[0103] The first gas nozzle 20c is used to spray a mist of release agent onto the surface of the lower mold 172, and is positioned above the spray nozzle 20a at the front end of the first moving body 23. The first gas nozzle 20c bends downward at approximately 90 degrees from the spray direction of the mist of release agent sprayed from the spray nozzle 20a. In this way, the mist of release agent is sprayed vertically onto the surface of the lower mold 172 from above. The first gas nozzle 20c is connected to a compressed air source (not shown) and is an air nozzle that supplies compressed air.

[0104] The second gas nozzle 20d is used to spray a mist of release agent onto the surface of the upper mold 171, and is positioned below the spray nozzle 20a at the front end of the first moving body 23. The second gas nozzle 20d bends upward at approximately 90 degrees from the spray direction of the mist of release agent sprayed from the spray nozzle 20a. In this way, the mist of release agent is sprayed vertically onto the surface of the upper mold 171 from below. The second gas nozzle 20d is connected to a compressed air source (not shown) and is an air nozzle that supplies compressed air. Alternatively, the compressed air source may be shared by the first gas nozzle 20c and the second gas nozzle 20d.

[0105] Then, the spray direction changing mechanism 20T changes the spray direction of the atomized release agent by switching the spray from the first gas nozzle 20c and the second gas nozzle 20d and stopping the spray. The spray direction changing mechanism 20T of this embodiment has a first on / off valve 20e provided in a first flow path connecting the first gas nozzle 20c and the compressed air source, and a second on / off valve 20f provided in a second flow path connecting the second gas nozzle 20d and the compressed air source. Furthermore, the first on / off valve 20e and the second on / off valve 20f can also be configured as a single three-way valve.

[0106] In this structure, by opening the first on / off valve 20e and closing the second on / off valve 20f, gas is injected from the first gas nozzle 20c, and gas injection from the second gas nozzle 20d is stopped. In this way, the spray direction of the atomized release agent becomes directed towards the surface of the lower mold 172 (see reference). Figure 4 Additionally, by closing the first on / off valve 20e and opening the second on / off valve 20f, gas injection from the first gas nozzle 20c is stopped, and gas injection from the second gas nozzle 20d is initiated. In this way, the spray direction of the atomized release agent becomes directed towards the surface of the upper mold 171 (see reference). Figure 5 ).

[0107] In addition, the spray direction changing mechanism 20T, such as Figure 4 and Figure 5As shown, the first gas nozzle 20c and the second gas nozzle 20d can be moved individually relative to the spray nozzle 20a. Specifically, the spray direction changing mechanism 20T has a first nozzle moving part 20g that moves the first gas nozzle 20c relative to the spray nozzle 20a, and a second nozzle moving part 20h that moves the second gas nozzle 20d relative to the spray nozzle 20a.

[0108] Each nozzle moving part 20g and 20h is a structure that allows each gas nozzle 20c and 20d to move relative to the spray nozzle 20a in the front-back direction (Y direction). Furthermore, each nozzle moving part 20g and 20h can be constructed using an actuator such as a cylinder or an electromagnet.

[0109] Then, the spray direction changing mechanism 20T moves the nozzles of each gas nozzle 20c and 20d that spray gas to the front of the spray nozzle 20a on the spray side. Specifically, the spray direction changing mechanism 20T moves the spray openings of the gas nozzles 20c and 20d that spray gas to the front end face of the nozzle section 20a1. On the other hand, the spray direction changing mechanism 20T moves the nozzles of each gas nozzle 20c and 20d that do not spray gas to a retracted position away from the front of the spray nozzle 20a on the spray side. Specifically, the spray direction changing mechanism 20T moves the gas nozzles 20c and 20d that do not spray gas to the rear of the front end face of the nozzle section 20a1 (towards the first moving body 23). Then, after moving one gas nozzle 20c or 20d to the front of the spray nozzle 20a on the spray side and moving the other gas nozzle 20c or 20d to the retracted position, the spray direction changing mechanism 20T begins to spray gas from one of the gas nozzles 20c or 20d.

[0110] In addition, such as Figure 7 As shown, in the spray mechanism 20, the nozzle unit 20U, which includes a spray nozzle 20a, a first gas nozzle 20c, and a second gas nozzle 20d, is configured to be movable in the left-right direction (X direction) at the front end of the first moving body 23. Furthermore, in Figure 7 The description of the structure of the first gas nozzle 20c and the second gas nozzle 20d is omitted. Specifically, the nozzle unit 20U is movable by a nozzle unit moving part 231 provided on the first moving body 23. Furthermore, the nozzle unit moving part 231 has a guide rail that guides the nozzle unit 20U along the X direction at the front end of the first moving body 23, and a drive part that moves the nozzle unit 20U on the guide rail.

[0111] In addition, such as Figure 8As shown, the nozzle unit 20U may further include a release agent detection unit 20i for detecting the atomized release agent sprayed from the spray nozzle 20a, and a determination unit for determining the spray state of the atomized release agent based on the detection signal from the release agent detection unit 20i. Furthermore, in Figure 8 The description of the structure of the first gas nozzle 20c and the second gas nozzle 20d is omitted. Here, as the release agent detection unit 20i, an optical sensor can be used, for example; in this embodiment, a limited reflective optical sensor is used. The release agent detection unit 20i has a light-emitting unit 20i1 and a light-receiving unit 20i2. The release agent detection unit 20i is disposed between the spray nozzle 20a and the gas nozzles 20c and 20d in the vertical direction (Z direction), and is disposed to the side of the spray nozzle 20a and the gas nozzles 20c and 20d in the horizontal direction (X direction). Here, the light-emitting unit 20i1 is disposed between the spray nozzle 20a and the second gas nozzle 20d in the vertical direction (Z direction). The light-receiving unit 20i2 is disposed between the spray nozzle 20a and the first gas nozzle 20c in the vertical direction (Z direction).

[0112] Furthermore, the arrangement of the light-emitting part 20i1 and the light-receiving part 20i2 is only necessary to detect the atomized release agent sprayed from the spray nozzle 20a, and either the light-emitting part 20i1 or the light-receiving part 20i2 can be positioned on the upper side. In addition, the light-emitting part 20i1 and the light-receiving part 20i2 can be arranged not only along the vertical direction, but also along a direction different from the vertical direction, such as the horizontal direction. Moreover, the light-emitting part 20i1 and the light-receiving part 20i2 only need to be arranged such that the optical axis of the light emitted from the light-emitting part 20i1 and the optical axis of the light detected by the light-receiving part 20i2 intersect in front of the spray nozzle 20a, for example, in a V-shape. Furthermore, the light-emitting part 20i1 and the light-receiving part 20i2, which are defined as a reflective optical sensor for the release agent detection part 20i, can also be separate independent units.

[0113] The release agent detection unit 20i displays a detection signal indicating whether it has detected a mist of release agent. Furthermore, the determination unit may be configured as a control unit (CTL). The release agent detection unit 20i repeatedly outputs detection signals, and the determination unit, based on these repeated signals, determines whether the spray state of the mist of release agent is stable. Then, if the determination unit determines that the spray state of the mist of release agent is stable, gas is sprayed from gas nozzles 20c and 20d, and release agent is sprayed onto the upper mold 171 or lower mold 172.

[0114] Furthermore, the spraying mechanism 20 of this embodiment is as follows: Figures 4-6 , Figure 8As shown, it also includes a release agent recovery unit 20j, which recovers the atomized release agent sprayed from the release agent spraying unit 20S. Furthermore, the release agent recovery unit 20j is provided on the first moving body 23.

[0115] like Figure 8 As shown, the release agent recovery unit 20j recovers the atomized release agent that was sprayed in front of the release agent spraying unit 20S without having its spray direction changed by the spray direction changing mechanism 20T. The release agent recovery unit 20j is located in front of the spray nozzle 20a of the release agent spraying unit 20S on the spray side. Specifically, the release agent recovery unit 20j is positioned in front of the spray nozzle 20a on the spray side, so as not to obstruct the atomized release agent whose spray direction is changed by the spray direction changing mechanism 20T (see reference). Figure 4 and Figure 5 In other words, the release agent recovery unit 20j is located further away from the front end of the spray nozzle 20a than the positions of the first gas nozzle 20c and the second gas nozzle 20d.

[0116] Furthermore, the release agent recovery unit 20j is positioned opposite to the spray direction (central axis) of the spray nozzle 20a. Specifically, the release agent recovery unit 20j is as follows: Figures 4-6 , Figure 8 As shown, a recess 20k is provided to contain liquefied release agent, and a suction port 20l is formed on the bottom surface of the recess 20k. In this embodiment, the release agent recovery section 20j has a counter wall opposite to the spray nozzle 20a, and a side peripheral wall surrounding the counter wall. Then, the recess 20k is provided at the lower part of the release agent recovery section 20j. The suction port 20l is connected to a suction tube 20m, which is suctioned by a suction mechanism (not shown), such as a vacuum jet. Thus, the release agent contained in the recess 20k can be suctioned through the suction tube 20m and returned to, for example, a storage container 20b5. In addition, before returning to the storage container 20b5, an air-liquid separator (not shown) can be used to remove air mixed in with the release agent.

[0117] During the period from the start of release agent spraying from spray nozzle 20a to the stabilization of the release agent mist, gas jetting from gas nozzles 20c and 20d is stopped. In this state, the release agent mist sprayed from spray nozzle 20a is recovered by release agent recovery unit 20j (see reference). Figure 8 Furthermore, suction from the suction port 20l can begin after a predetermined time has elapsed since the release agent spraying begins, or it can continue continuously during the period between the start of release agent spraying and the stabilization of the mist-like release agent. Additionally, suction from the suction port 20l can be repeated at predetermined intervals.

[0118] In addition, the release agent recovery section 20j, such as Figure 6The configuration shown can also function as a cover for the nozzle portion 20a1 covering the spray nozzle 20a. In this case, the release agent recovery unit 20j is configured to be able to cover the nozzle portion 20a1 of the spray nozzle 20a (see reference). Figure 6 ), and the state in which the nozzle portion 20a1 of the spray nozzle 20a moves forward toward the spray side and leaves the spray nozzle 20a (refer to Figure 4 , Figure 5 and Figure 8 The release agent recovery section 20j (specifically, the opening including the side wall) is provided with a sealing member (not shown), such as a rubber gasket, which is in close contact with the nozzle section 20a1 of the spray nozzle 20a.

[0119] In this configuration, when the release agent is not sprayed from the spray nozzle 20a, the release agent recovery unit 20j is in a state covering the nozzle section 20a1 of the spray nozzle 20a. In this case, by maintaining airtightness through the sealing member, vaporization, drying, and deterioration of the release agent components can be prevented. Furthermore, when the release agent is sprayed from the spray nozzle 20a, the release agent recovery unit 20j moves forward from the nozzle section 20a1 of the spray nozzle 20a towards the spray side, and is in a state away from the nozzle section 20a1 of the spray nozzle 20a.

[0120] <The spraying action of the release agent using the spraying mechanism 20>

[0121] Then, as Figure 9 As shown in (a) and (b), in conjunction with the movement of the first moving body 23 between the upper mold 171 and the lower mold 172 along the Y direction, the nozzle unit moving part 231 causes the nozzle unit 20U to reciprocate in the X direction. As a result, a mist of release agent can be sprayed onto the entire surface of the upper mold 171 or the lower mold 172.

[0122] When spraying release agent onto the surface of the lower mold 172, the release agent is sprayed in a mist form from the spray nozzle 20a, and gas is ejected from the first gas nozzle 20c (refer to...). Figure 4 The nozzle unit 20U is fixed at a predetermined position on the first moving body 23, while the first moving body 23 is moved in the front-back direction (Y direction) between the upper mold 171 and the lower mold 172 (refer to...). Figure 9(a) Thus, a linear spray (first column of spray) is performed on the surface of the lower mold 172 along the Y direction. Then, after the first column of spraying is completed, the nozzle unit 20U is moved relative to the first moving body 23 by a predetermined amount in the left-right direction (X direction) (pitch feed in the X direction), changing the predetermined position of the fixed first moving body 23. Afterwards, the first moving body 23 is moved in the front-back direction (Y direction) between the upper mold 171 and the lower mold 172. By repeating this one column of spraying action along the Y direction, release agent is sprayed onto the entire surface of the lower mold 172 (see reference). Figure 9 (a) The spraying action of the release agent on the entire surface of the lower mold 172 can be performed more than twice as needed.

[0123] When spraying release agent onto the surface of the upper mold 171, the release agent is sprayed in a mist form from the spray nozzle 20a, and gas is ejected from the second gas nozzle 20d (refer to...). Figure 5 Similar to spraying release agent onto the lower mold 172, the release agent is sprayed onto the entire surface of the upper mold 171 by repeating a series of spraying actions. This spraying action onto the entire surface of the upper mold 171 can be performed more than twice as needed. Furthermore, during the spraying action using the spraying mechanism 20, it is advisable to close the shielding plate (not shown) surrounding the molding die 17 to prevent the mist-like release agent from scattering to the outside. Additionally, after the spraying action using the spraying mechanism 20 is completed, it is advisable to collect dust in the space between the upper mold 171 and the lower mold 172 before proceeding to the next process (the transfer of the molded object and resin material).

[0124] In addition, such as Figure 9 As shown in (b), release agent can also be sprayed onto the entire surface of the upper mold 171 or lower mold 172 by repeating a series of spraying actions along the X direction. In this case, while fixing the first moving body 23 in a predetermined position, the nozzle unit 20U is moved relative to the first moving body 23 in the X direction, and a straight spray (the first series of sprays) is performed on the surface of the upper mold 171 or lower mold 172 along the X direction. Then, when this first series of sprays ends, the first moving body 23 is moved relative to the lower mold 172 in the front-back direction (Y direction) by a predetermined amount (pitch feed in the Y direction), changing the predetermined position of fixing the first moving body 23. After that, the nozzle unit 20U is moved relative to the first moving body 23 in the left-right direction (X direction). By repeating this series of spraying actions along the X direction, release agent is sprayed onto the entire surface of the upper mold 171 or lower mold 172.

[0125] During the aforementioned interval feeding period (between one spray and the next), the spraying from each gas nozzle 20c, 20d can be temporarily stopped. At this time, the release agent recovery section 20j provided in front of the spray side of the spray nozzle 20a can prevent the mist-like release agent sprayed from the spray nozzle 20a from scattering to the outside.

[0126] Furthermore, a droplet receiving section (not shown) may be provided below the spray nozzle 20a in the standby position or below the spray nozzle 20a that is performing pitch feeding. Alternatively, the nozzle section 20a1 of the spray nozzle 20a in the standby position or the spray nozzle 20a that is performing pitch feeding may be blocked by, for example, a rubber cap or a release agent recovery section 20j.

[0127] <Method for manufacturing resin molded article P>

[0128] Next, refer to Figures 10-12 This section explains the operation of the resin molding apparatus 100 of this embodiment and the method for manufacturing the resin molded article P. Furthermore, the following operations are performed by controlling each part, for example, through a control unit CTL provided in the supply module 100A.

[0129] After starting the resin molding device, before the object to be molded, W, and the resin material, J, are moved into the molding die, as follows: Figure 10 As shown in (a), ultraviolet light is irradiated by the irradiation unit 21. Specifically, the first moving body 23 moves to the front of the molding die 17, which is in the open state before resin molding. In this embodiment, the height position of the first moving body 23 when moving left and right (X direction) is set. When moving left and right (X direction), it first moves to the set height position in the vertical direction (Z direction) and then moves left and right (X direction). Then, the first moving body 23 enters from the front between the upper mold 171 and the lower mold 172. During the movement of the first moving body 23 between the upper mold 171 and the lower mold 172, the irradiation unit 21 irradiates ultraviolet light onto the surface of the upper mold 171 and the surface of the lower mold 172.

[0130] Then, after the ultraviolet irradiation of the irradiation section 21 ends, continuously, as... Figure 10 As shown in (b), release agent is sprayed onto the upper mold 171 and lower mold 172 during mold opening. Additionally, Figure 10(b) illustrates the state of spraying release agent onto the lower mold 172. Specifically, the first moving body 23 enters from the front between the upper mold 171 and the lower mold 172. During the movement of the first moving body 23 between the upper mold 171 and the lower mold 172, the spraying mechanism 20 sprays release agent onto the surfaces of the upper mold 171 and the lower mold 172. In addition, the ceramic layers on the surfaces of the upper mold 171 and the lower mold 172 are textured (with minute bumps and depressions). By spraying the release agent, the release agent is supplied into the depressions of the texture. As a result, the anchoring effect produced by the depressions of the ceramic layer texture can be reduced, adhesion can be reduced, and release properties can be improved. In this embodiment, as described above in <Spraying Action of Release Agent Using Spraying Mechanism 20>, the release agent is sprayed onto the surface of the lower mold 172 using spray nozzle 20a and the first gas nozzle 20c, and then the release agent is sprayed onto the surface of the upper mold 171 using spray nozzle 20a and the second gas nozzle 20d. Alternatively, the release agent can be sprayed in either the upper mold 171 or the lower mold 172 first.

[0131] After the spraying mechanism 20 (first moving body 23) retracts from between the upper mold 171 and the lower mold 172 and moves forward, as follows: Figure 11 As shown in (c), the loader 15 moves the molded object W and the resin material J from the rear into the space between the upper mold 171 and the lower mold 172. Here, after the release agent is sprayed, before the molded object W and the resin material J are moved in, the air in the space between the upper mold 171 and the lower mold 172 is discharged through a dust collection section (not shown) to remove the mist-like release agent.

[0132] In addition, Figure 11 In (c), when the molded object W and resin material J are being transported in, the first moving body 23 and the second moving body 24 are descending (the second moving body 24 is located in front of the upper mold 171 and the lower mold 172). However, after the molded object W and resin material J are transported in, the first moving body 23 and the second moving body 24 may also descend, or at the latest before the unloading machine 19 enters and removes the resin molded article P, the first moving body 23 and the second moving body 24 may descend.

[0133] Then, as Figure 11 As shown in (d), the upper mold 171 and lower mold 172, into which the object to be molded W and the resin material J have been placed, are closed by the mold closing mechanism to perform resin molding on the object to be molded W.

[0134] After the resin is molded, when the mold closing mechanism opens the upper mold 171 and the lower mold 172, as follows: Figure 12As shown in (e), the unloading machine 19 enters from the rear between the upper mold 171 and the lower mold 172 of the mold opening and removes the resin molded article P. At this time, the second moving body 24 moves to the front of the molding die 17. In this embodiment, the height position of the second moving body 24 when moving left and right (X direction) has been set. When moving left and right (X direction), it will first move to the set height position in the vertical direction (Z direction) (different from the height position of the first moving body 23), and then move left and right (X direction).

[0135] The unloading machine 19 retracts from between the upper mold 171 and the lower mold 172 at the same time as or after retracting, such as Figure 12 As shown in (e), the second moving body 24 enters from the front between the upper mold 171 and the lower mold 172. As the second moving body 24 moves between the upper mold 171 and the lower mold 172, the cleaning part 22 cleans the surface of the upper mold 171 and the surface of the lower mold 172 by means of the brush 221.

[0136] Afterwards, the next resin molding operation is performed a predetermined number of times (loading of the molding object / resin material → resin molding (mold closing) → unloading of the resin molded product → cleaning by brush). Here, the predetermined number of times is 2 or more, for example, 300 times. After performing the predetermined number of resin molding operations, ultraviolet irradiation and release agent spraying are performed continuously again. Thus, in the resin molding apparatus 100 of this embodiment, cleaning by the brush of the cleaning unit 22 is performed after each resin molding. Furthermore, ultraviolet irradiation by the irradiation unit 21 and release agent spraying by the spraying mechanism 20 are performed after a predetermined number of resin molding operations (for example, 300 times). In addition, since the resin material J contains wax that functions as a release agent, it is not necessary to spray the release agent by the spraying mechanism 20 after each resin molding.

[0137] <Effects of this implementation method>

[0138] According to the resin molding apparatus 100 of this embodiment, since release agent is sprayed on both the upper mold 171 and the lower mold 172, the release properties of the resin molded article P can be improved, while suppressing contamination of the molding die 17 caused by resin molding. As a result, the quality of the resin molded article P can be improved. Furthermore, since the spray direction of the atomized release agent sprayed from the release agent spraying section 20S is changed by blowing air, the release agent can be sprayed onto both the upper mold 171 and the lower mold 172 simply and reliably. Here, since the atomized release agent is blown air, the atomized release agent becomes more likely to enter the recesses caused by surface roughness on the surface of the upper mold 171 or the lower mold 172, which can improve the release properties of the surface of the upper mold 171 or the lower mold 172. In addition, it is not necessary to set up separate release agent spraying sections for the upper mold 171 and the lower mold, and a common release agent spraying section 20S can be used, thus preventing the spraying mechanism 20 from becoming too large.

[0139] <Other variations and implementations>

[0140] Furthermore, the present invention is not limited to the embodiments described herein.

[0141] For example, the spraying mechanism 20 may be configured to spray the release agent only onto one of the upper mold 171 and the lower mold 172. Alternatively, the spraying mechanism 20 may, for example, switch the mold spraying the release agent between the upper mold 171 and the lower mold 172 during each predetermined number of resin molding cycles.

[0142] The irradiation unit 21 can be configured to irradiate only one of the upper mold 171 and the lower mold 172 with ultraviolet light. Alternatively, the irradiation unit 21 can, for example, switch the mold irradiated with ultraviolet light between the upper mold 171 and the lower mold 172 during each predetermined number of resin molding cycles.

[0143] The cleaning unit 22 can be configured to clean only one of the upper mold 171 and the lower mold 172 using the brush 221. Alternatively, the cleaning unit 22 can, for example, switch the mold cleaned by the brush 221 between the upper mold 171 and the lower mold 172 each time resin molding is performed. In the case of switching between the upper mold 171 and the lower mold 172, the cleaning unit 22 can be moved up and down using a vertical drive mechanism (not shown) to ensure that the cleaning unit 22 only contacts the side of the mold to be cleaned. Furthermore, the cleaning unit 22 can be configured to be cleaned with the brush 221 only after a predetermined number of resin molding cycles, in addition to being configured to be cleaned with the brush 221 for each resin molding cycle.

[0144] In the described embodiment, the spray mechanism 20 and the irradiation unit 21 are arranged on a first moving body, but the spray mechanism 20 and the irradiation unit 21 can also be arranged on different moving bodies. Alternatively, the spray mechanism 20, the irradiation unit 21, and the cleaning unit 22 can be arranged on a single moving body. Furthermore, the spray mechanism 20 and the cleaning unit 22 can be arranged on a single moving body, or the irradiation unit 21 and the cleaning unit 22 can be arranged on a single moving body.

[0145] In the embodiment described above, the processing moving mechanism 25 has a structure with a first processing moving part 25a and a second processing moving part 25b, but it can also be configured to move the first moving body 23 and the second moving body 24 by means of a single processing moving part.

[0146] In the embodiment described above, the loader 15 and the unloader 19 are able to move via a common conveying mechanism 16, but the loader 15 and the unloader 19 may also be configured to move via different conveying mechanisms.

[0147] Regarding the movement of each gas nozzle 20c and 20d, it is acceptable as long as it can be moved to a position away from the spray nozzle 20a on the spray side. It is not limited to moving in a straight line along the Y direction as described in the embodiment. It can also be moving in a straight line along the X direction or rotating.

[0148] The release agent supply unit 20b in the described embodiment is structured using syringe unit 20b2, but it can also be structured using a non-pulsating pump such as a hose pump or a flow pump.

[0149] The embodiments described herein are resin molding apparatuses for resin molding by transfer molding, but they can also be applied to resin molding apparatuses for resin molding by compression molding.

[0150] Furthermore, the present invention is not limited to the described embodiments, and it goes without saying that various modifications can be made without departing from its spirit.

[0151] Industrial utilization potential

[0152] This invention enables the simple and reliable spraying of release agent onto both or one of the upper and lower molds while improving the release properties of a forming mold having an upper and lower mold.

[0153] Explanation of icon numbers

[0154] 100: Resin molding device

[0155] W: The object to be molded before molding

[0156] P: The molded object (resin molded product) after molding.

[0157] 171: Upper mold

[0158] 172: Lower mold

[0159] 20: Spraying mechanism

[0160] 20S: Release agent spray section

[0161] 20a: Spray nozzle

[0162] 20b: Release agent supply section

[0163] 20b1: Supply Management

[0164] 20b2: Syringe section

[0165] 20b3: Switching valve

[0166] 20b4: Supply pipe

[0167] 20b5: Storage containers

[0168] 20T: Spray Direction Changing Mechanism

[0169] 20c: First gas nozzle

[0170] 20d: Second gas nozzle

[0171] 20i: Release Agent Testing Department

[0172] CTL: Control Unit (Decision Unit)

[0173] 21: Irradiation Department

Claims

1. A spraying mechanism for spraying a release agent onto either or both of an upper mold and a lower mold of a split mold, the spraying mechanism comprising: The release agent spraying unit atomizes and sprays the liquid release agent; and The spray direction changing mechanism blows air onto the mist-like release agent sprayed from the release agent spray section to change the spray direction of the mist-like release agent.

2. The spraying mechanism according to claim 1, wherein the spray direction changing mechanism comprises: A first gas nozzle blows air downwards onto the mist-like release agent; and The second gas nozzle blows the mist-like release agent upwards. The spray direction of the atomized release agent is changed by switching the spray from the first gas nozzle and the second gas nozzle and stopping the spray.

3. The spraying mechanism according to claim 2, wherein the spray direction changing mechanism moves the first gas nozzle and the second gas nozzle individually relative to the release agent spray section. Move the nozzles that spray gas from each of the gas nozzles to the front of the spray side of the release agent spray section. Move the nozzles that do not spray gas from each of the gas nozzles to a retreating position in front of the spray side away from the release agent spray section.

4. The spraying mechanism according to any one of claims 1 to 3, wherein the release agent spraying unit is a single device for spraying release agent by ultrasonic atomization.

5. The spraying mechanism according to any one of claims 1 to 4, wherein the release agent spraying section comprises: The spray nozzle sprays the release agent; and The release agent supply unit supplies the release agent to the spray nozzle. The release agent supply section has: The supply pipe is connected to the spray nozzle; and The syringe section is connected to the supply tube and contains the release agent.

6. The spraying mechanism according to claim 5, wherein the release agent supply unit comprises: The supply pipe is connected to the middle of the supply pipe via a switching valve; and Storage container, connected to the supply tube and storing the release agent. The release agent is supplied to the syringe via the supply tube through the storage container by a suction action.

7. The spraying mechanism according to any one of claims 1 to 6, further comprising: The release agent detection unit detects the mist-like release agent sprayed from the release agent spraying unit; as well as The judgment unit determines the spray state of the mist-like release agent based on the detection signal from the release agent detection unit.

8. The spraying mechanism according to any one of claims 1 to 7, further comprising: A release agent recovery unit is provided in front of the spray side of the release agent spray unit to recover the mist-like release agent sprayed from the release agent spray unit. The release agent recovery section has a recess for containing liquefied release agent. The bottom surface of the recess has an suction port.

9. A resin molding apparatus, which uses a molding die having an upper mold and a lower mold to perform resin molding on an object to be molded, the resin molding apparatus comprising: The spraying mechanism according to any one of claims 1 to 8 sprays a release agent onto both or one of the upper mold and the lower mold that are being opened.

10. The resin molding apparatus according to claim 9, further comprising: The irradiation section irradiates ultraviolet light onto either or both of the upper and lower molds during the mold opening process. After the upper mold and one of the lower molds are irradiated with ultraviolet light by the irradiation unit, a release agent is sprayed onto the upper mold and one of the lower molds by the spraying mechanism.

11. A method for manufacturing a resin molded article, comprising a method for manufacturing a resin molded article using the resin molding apparatus as described in claim 9 or 10, wherein in the method for manufacturing the resin molded article, Before the object to be molded is moved in, a release agent is sprayed onto the upper and lower molds during the mold opening process. The object to be molded before molding is moved into the upper mold and the lower mold sprayed with the release agent and then resin molded.

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