Photonics integrated circuit for co-packaged optical modules with detachable fiber array socket alignment device and method

Abstract

The present invention relates to a detachable fiber array socket alignment device for a photonic integrated circuit of a co-packaged optical module. The socket is fixed to an upper surface of the photonic integrated circuit by an epoxy resin, and the fiber array is detachably seated on a convex-concave portion of an upper surface of the socket. The device includes a jig that fixes the photonic integrated circuit, a holder that holds a fiber unit, a moving module that moves the holder along three axes, and a socket fixing unit that is located above the socket and is vertically movable. The socket fixing unit applies an upward pulling force to the socket to hold the socket until the socket is fixed to the photonic integrated circuit by the epoxy resin, thereby bringing the socket into close contact with the fiber array and suppressing movement of the socket in a direction parallel to the upper surface during fine alignment after the epoxy resin is applied.

Description

Technical Field

[0001] This invention relates to an active alignment technique for aligning a receptacle used in a fixed co-packaged optical (CPO) module for use in a detachable fiber array (FA). More specifically, it relates to a technique that, when fixing the receptacle to a photonic integrated circuit with epoxy resin, prevents the receptacle from deviating from its target position during active alignment after the application of epoxy resin, while completely preventing interference between the epoxy resin and the fixing device due to fixing the receptacle. Background Technology

[0002] Co-packaged optics (CPO) is a technology that integrates optical and electronic components into a single package to improve data transmission efficiency. By combining an application-specific integrated circuit (ASIC) for switches and an optical engine on a single substrate, CPO aims to shorten electrical signal transmission distances and increase bandwidth density and power efficiency.

[0003] CPO is expected to be applied in fields that require high-capacity data transmission, such as data centers, high-performance computing, and artificial intelligence, and its importance is expected to become even more prominent as data transmission requirements increase in the future.

[0004] By integrating optical components with electronic integrated circuits (ICs) in the same package, CPOs minimize power consumption by reducing the need for long-distance electrical connections. Furthermore, the elimination of electrical signal conversion reduces latency, making CPOs highly useful in applications where real-time data processing is critical, and improving space efficiency by eliminating the need for bulky and complex external optical modules.

[0005] The fiber optic array (FA), a core component of this CPO, can experience reduced transmission efficiency not only due to installation problems such as misalignment, but also due to fiber damage during installation, physical damage to the fiber array caused by external environmental factors (such as vibration, heat, and humidity) during operation, fiber wear, contamination, or quality degradation, as well as performance degradation or malfunctions caused by environmental conditions. This can lead to data transmission loss and signal distortion.

[0006] In this context, to achieve simple CPO maintenance by replacing only the FA, a CPO module using a detachable fiber array capable of replacing the FA has recently been provided. In this technology, a socket with the FA mounted and secured is attached to a photonic integrated circuit, allowing for the replacement of only the FA within the CPO through a process of attaching or removing the FA from the socket.

[0007] In these types of products, accurately securing the socket to the precise location on the photonic integrated circuit during initial assembly is crucial. In the prior art, an optical fiber unit is prepared in which the FA (fiber optic connector) is positioned on a socket with an embossed (rough) portion on its upper surface. The optical fiber units are then moved together to perform pre-alignment (dry alignment) on the upper surface of the photonic integrated circuit. After pre-alignment, the optical fiber units are moved upwards, and epoxy resin for securing the socket is applied to the corresponding location, bringing the optical fiber units into contact with the epoxy resin for re-alignment. The epoxy resin is then cured to secure the socket to the photonic integrated circuit.

[0008] In this situation, when the fiber unit is positioned on the epoxy resin for realignment, the holding force between the socket and the FA is relatively weak, leading to problems such as socket misalignment or gaps forming between the socket and the FA during fine alignment after epoxy resin application. Therefore, a technique is needed to securely fix the socket to the FA. However, when using a clamp or similar device to hold the socket in place, the sides of the socket must be clamped. In this case, the epoxy resin in contact with the bottom of the socket comes into contact with the clamp holding the socket and cures together with the clamp during curing. Summary of the Invention

[0009] The technical problem this invention aims to solve is to provide a relatively stable fixation of the socket to the fiber array without using a socket clamp when positioning the fiber element on epoxy resin for realignment. This prevents socket misalignment or gaps between the socket and the fiber array due to weak fixing force during fine alignment after epoxy resin application. Therefore, stable fixation of the socket can be achieved from pre-alignment to epoxy resin curing, thereby improving the production yield of co-packaged optics (CPO) modules.

[0010] To solve the above-mentioned technical problems, the present invention adopts the following technical solution. According to one embodiment of the present invention, a detachable fiber array socket alignment device for a photonic integrated circuit of a CPO module is provided, wherein the socket is configured to be fixed to the upper surface of the photonic integrated circuit by epoxy resin, and the fiber array is detachably mounted on the socket such that the movement of the fiber array during mounting is restricted by the irregularities formed on the upper surface of the socket. The device includes: a clamp configured to fix the photonic integrated circuit; a holder configured to hold the fiber units of the fiber array mounted on the socket; a moving module configured to move the holder along three axes; and a socket fixing unit configured to be disposed above the socket and in a region adjacent to the holder, and to move vertically. The socket fixing unit is further configured to apply an upward pulling force to the socket to contact and hold the socket until the socket is fixed to the photonic integrated circuit by the epoxy resin, such that the socket is in close contact with and fixed to the fiber array, and suppresses movement of the socket in a direction parallel to the upper surface of the photonic integrated circuit during fine alignment after the application of the epoxy resin.

[0011] In some embodiments, the socket fixing unit may include: a contact unit configured to contact the upper surface of the socket and apply the upward pulling force to the socket; and a unit moving module configured to move the contact unit vertically.

[0012] In some embodiments, the socket may be formed of a material that can be attracted by magnetic force, and the contact unit may include a columnar magnet.

[0013] In some embodiments, the contact unit may be a permanent magnet.

[0014] In some embodiments, the contact unit may be an electromagnet, and the power supply to the electromagnet is controlled such that a magnetic force is generated when the electromagnet contacts the socket.

[0015] In some embodiments, the contact unit may be arranged in an area that avoids the clamping point of the clamp relative to the fiber unit, so as to contact the upper surface of the socket in an area other than the clamping point.

[0016] In some embodiments, the contact units may be multiple, and the multiple contact units may be arranged to contact the upper surface of the socket at multiple points that are at least symmetrical to each other with respect to the center of the socket.

[0017] According to another embodiment of the present invention, a method for aligning a socket using the device is provided, the method comprising: fixing the photonic integrated circuit to the clamp; preparing an optical fiber unit of the optical fiber array mounted on the socket; moving the optical fiber unit, held by the clamp and held by the socket fixing unit, to the upper surface of the photonic integrated circuit, and pre-aligning the position of the optical fiber unit on the upper surface of the photonic integrated circuit; after completing the pre-alignment, moving the optical fiber unit upward by the clamp while maintaining the position of the optical fiber unit in a direction parallel to the upper surface of the photonic integrated circuit. The epoxy resin is applied and fixed; after the epoxy resin is applied, the fiber unit is moved downward by the clamp while keeping the fiber unit fixed in a direction parallel to the upper surface of the photonic integrated circuit, so that the fiber unit and the epoxy resin are bonded to each other at the pre-aligned position, and the fiber unit is re-aligned via the clamp in a direction parallel to the upper surface of the photonic integrated circuit; the epoxy resin is cured; and after the epoxy resin is cured, the socket fixing unit is removed from the socket, and the fiber array is removed from the socket using the clamp.

[0018] The beneficial effects of the present invention are as follows. According to one embodiment of the present invention, by applying a vertical external force from a socket fixing unit that provides magnetic force from the upper surface of the socket, which is formed of a material that can be magnetically attracted, during the period from the pre-alignment step until the epoxy resin cures and the socket is completely fixed in the accurate position to the photonic integrated circuit, the contact force between the fiber array and the socket with the concave and convex portions is enhanced, completely preventing misalignment of the socket during the pre-alignment and re-alignment after the application of epoxy resin, while completely preventing epoxy resin from adhering to the socket fixing unit used to fix the socket and curing therewith.

[0019] According to another embodiment of the present invention, the reduced production yield of CPO modules caused by socket misalignment and epoxy resin curing problems can be significantly improved. Attached Figure Description

[0020] Figure 1 This is an inverted perspective view showing the structure of the socket fixing unit of the photonic integrated circuit alignment device for a CPO module according to an embodiment of the present invention.

[0021] Figure 2 It includes Figure 1 An inverted perspective view of region A, showing a detachable fiber array socket alignment device for a CPO module photonic integrated circuit according to an embodiment of the present invention.

[0022] Figure 3This is a side view showing the state in which the optical fiber unit is mounted on a photonic integrated circuit according to an embodiment of the present invention.

[0023] Figure 4 This is a rear view showing the structure of the socket fixing unit according to an embodiment of the present invention.

[0024] Figure 5 This is an inverted front view showing the structure of the socket fixing unit according to an embodiment of the present invention.

[0025] Figure 6 This is an inverted side view illustrating the function of the socket fixing unit according to an embodiment of the present invention.

[0026] Figure 7 This is a schematic diagram showing the state in which the socket is fixed to the socket fixing unit according to an embodiment of the present invention.

[0027] Figure 8 This is a schematic diagram illustrating examples of the shape of a socket fixing unit according to various embodiments of the present invention. Detailed Implementation

[0028] Various embodiments and / or aspects are disclosed below with reference to the accompanying drawings. In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of one or more aspects. However, it will be apparent to those skilled in the art that such aspects can be implemented without these specific details. The following description and drawings illustrate certain illustrative aspects of one or more aspects in detail. However, these aspects indicate only a few of the various ways in which the principles of the various aspects can be employed, and the description is intended to include all such aspects and their equivalents.

[0029] As used herein, terms such as “example,” “aspect,” “illustration,” and “description” should not be construed as indicating that any aspect or design described is preferred or more advantageous than other aspects or designs.

[0030] Furthermore, the terms “comprising” and / or “including” indicate the presence of the stated features and / or components, but do not exclude the presence or addition of one or more other features, components, and / or combinations thereof.

[0031] Furthermore, terms containing ordinal numbers such as "first" and "second" may be used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another. For example, without departing from the scope of the invention, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. The term "and / or" includes any and all combinations of a plurality of associated listed items, or any one of a plurality of associated listed items.

[0032] Furthermore, unless otherwise defined, all terms used in the embodiments of this invention, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant technical context, and should not be interpreted as having an idealized or overly formalized meaning unless explicitly defined in the embodiments of this invention.

[0033] Figure 1 This is an inverted perspective view showing the structure of the socket fixing unit of the detachable fiber array socket alignment device for a CPO module according to an embodiment of the present invention; Figure 2 It includes Figure 1 An inverted perspective view of the photonic integrated circuit alignment device for the CPO module according to an embodiment of the present invention in region A; Figure 3 This is a side view showing the state in which the optical fiber unit is mounted on a photonic integrated circuit according to an embodiment of the present invention; Figure 4 This is a rear view showing the structure of the socket fixing unit according to an embodiment of the present invention; Figure 5 This is an inverted front view showing the structure of the socket fixing unit according to an embodiment of the present invention; Figure 6 This is an inverted side view illustrating the function of the socket fixing unit according to an embodiment of the present invention; Figure 7 This is a schematic diagram showing the state in which the socket is fixed to the socket fixing unit according to an embodiment of the present invention; and Figure 8 This is a schematic diagram illustrating examples of the shape of a socket fixing unit according to various embodiments of the present invention.

[0034] In the following description, it should be understood that, in order to facilitate the description of the function of the various components of the present invention, some components may be omitted, or the size of some components may be exaggerated or reduced. Such illustrations do not limit the technical features and scope of protection of the present invention.

[0035] Furthermore, in the following description, multiple accompanying drawings may be used to describe individual technical features or components constituting the present invention.

[0036] Referring to the accompanying drawings, the detachable fiber array socket alignment device for photonic integrated circuits of the CPO module according to an embodiment of the present invention (hereinafter referred to as "the alignment device of the present invention") includes a clamp 10, a holder 20, a moving module 30, and a socket fixing unit 40.

[0037] In the following description, since the clamp 10, the gripper 20 and the moving module 30 are components of a conventional alignment device, their detailed descriptions will be omitted.

[0038] like Figure 3As shown, the clamp 10 is a component disposed in a certain station of the alignment device for fixing the photonic integrated circuit 110, and can be formed or mounted on the base of the alignment device, on which the illustrated movable module 30 is mounted. The clamp 10 can be configured as a clamp-like structure formed on the base, a modular structure capable of size adjustment or position adjustment of the retaining structure, or a component capable of being mounted on the base.

[0039] In this invention, as described above, the CPO includes the following structure: a socket 102 is fixed to the upper surface of a photonic integrated circuit 110 by an epoxy resin 103, and a fiber array 101 is detachably mounted on the socket 102, such that movement during mounting is restricted by irregularities formed on the upper surface of the socket 102. Specifically, the CPO described herein refers to a fiber array (FA) detachable CPO, wherein the fiber array 101 can be detached from the fixing structure between the socket 102 and the photonic integrated circuit 110. The alignment device of this invention relates to an apparatus for aligning a socket 102 relative to a photonic integrated circuit 110 in the aforementioned FA detachable CPO, and a clamp 10 is a component configured to fix the photonic integrated circuit 110 in the aforementioned structure for alignment with the socket 102.

[0040] like Figure 1 As shown, the clamp 20 includes a fixed protruding clamp 21 and a cylinder-moving clamp 22, and also includes a vacuum (pneumatic) clamp, such that, according to the movement of the cylinder-moving clamp 22 and the operation of the vacuum clamp, as... Figure 1 The optical fiber array 101 shown is used for clamping. In this invention, it should be understood that... Figure 1 In the illustration, the vacuum clamp is arranged inside the main body so as to clamp the fiber array 101 by vacuum adsorption inside the main body where the fixed protrusion clamp 21 is positioned.

[0041] When supplying fiber optic units 100 mounted on the socket 102 are used for alignment of the socket 102, the fiber optic array 101 can be provided. As described above, Figure 3 and Figure 7 As shown, with the fiber array 101 mounted on the uneven portion formed on the upper surface of the socket 102, the socket 102 is held and tightly contacted by the mounting force on the uneven portion and the adsorption force of the vacuum clamp, etc., thereby providing the socket 102 and the fiber array 101 as a fiber unit 100.

[0042] The moving module 30 is configured to move the clamp 20 along three axes to move the fiber optic unit 100 fixed to the clamp 20, thereby enabling the alignment of the socket 102, the transfer of the fiber optic unit 100, and the final separation of the fiber optic array 101. In this invention, for example, the x-axis and y-axis refer to directions parallel to the base on which the clamp 10 is mounted, and the z-axis refers to a vertical (up-down) direction perpendicular to the base on which the clamp 10 is mounted. That is, in the accompanying drawings and the following description, the terms "up-down" or "vertical" will be understood as referring to a direction perpendicular to the base on which the clamp 10 is mounted, i.e., the height direction.

[0043] The moving module 30 can be configured as a three-axis moving module and a three-axis rotating module to achieve parallel two-axis movement and rotation during the alignment of the socket 102. In the following description, the alignment of the socket 102 should be understood as achieving the alignment of the socket 102 relative to the photonic integrated circuit 110 by the two-axis movement, rotation, etc., of the clamp 20 that fixes the entire fiber unit 100.

[0044] like Figures 1 to 8 As shown, the socket fixing unit 40 is arranged above the socket 102 and in the region adjacent to the clamp 20, and is configured to move vertically. The socket fixing unit 40 is configured to apply an upward pulling force to the socket 102 to contact and hold the socket 102 until the socket 102 is fixed to the photonic integrated circuit 110 by the epoxy resin 103, such that the socket 102 is in close contact with and fixed to the fiber array 101, while suppressing the movement of the socket 102 relative to the photonic integrated circuit 110 in a direction parallel to the upper surface of the photonic integrated circuit 110 during the fine alignment performed after the application of the epoxy resin 103.

[0045] Specifically, in this invention, as described above, in order to fix the socket 102 to the photonic integrated circuit 110, the socket 102 is moved upward after pre-alignment is performed, and then moved downward along an axis after epoxy resin 103 is applied so as to contact the epoxy resin 103 applied to the target position of the photonic integrated circuit 110, and then positioned at the target position to be finally fixed by re-alignment, and then fixed by curing epoxy resin 103.

[0046] In this situation, if a clamp or similar device, such as clamp 20, is used to hold the socket 102 in place, a portion of the epoxy resin 103 may be squeezed out from both sides of the socket 102 during the aforementioned process due to the compression of the epoxy resin 103. In this case, contact between the clamp and the epoxy resin is unavoidable, which may result in localized slippage due to pressure and misalignment between the socket 102 and the epoxy resin. Specifically, since the epoxy resin must be cured while the clamp holds the socket 102, the epoxy resin in contact with the clamp may solidify together with the clamp during curing, leading to damage to the fiber optic unit 100 when it is subsequently separated from the clamp.

[0047] To solve the above problems, the main technical feature of the present invention is that the socket fixing unit 40 moves vertically to fix the socket 102 while only contacting the upper part of the socket 102 (more precisely, the upper surface of the socket 102).

[0048] Therefore, in various embodiments of the present invention, such as Figure 2 As shown, the socket fixing unit 40 may include a contact unit 41 and a unit moving module 42. For example... Figure 2 , Figures 4 to 8 As shown, the contact unit 41 is a component that contacts the upper surface of the socket 102 and applies a force to pull the socket 102 upward, and the unit moving module 42 includes a cylinder moving module, etc., and performs the function of moving the contact unit 41 along the vertical direction d1.

[0049] The socket 102 is typically formed of a magnetically attractive material that responds to magnetic forces (e.g., a ferromagnetic material). Therefore, when the upper surface of the socket 102 is contacted, the contact unit 41 is preferably formed of a columnar magnet to apply an upward pulling force to the socket 102.

[0050] In this case, in one embodiment of the invention, the contact unit 41 is formed of a permanent magnet such that when the contact unit 41 moves downward through the unit moving module 42 and approaches the socket 102, it naturally applies an upward pulling force to the socket 102.

[0051] In another embodiment of the invention, in order to control the pulling force, the contact unit 41 may be configured as an electromagnet controlled by the alignment device of the invention, wherein the power supply is controlled such that a magnetic force is generated when the contact unit 41 contacts the socket 102.

[0052] Therefore, by employing a structure that can apply an upward pulling force to the socket 102 when contacting the upper surface of the socket 102 in even a very narrow area using a magnet or the like, instead of using a clamp or the like to hold the socket 102, the conventional problems associated with holding the socket 102 can be completely solved. Furthermore, in the conventional case where no unit for fixing the socket 102 is provided, when pre-alignment (dry alignment) is performed on the upper surface of the photonic integrated circuit 110, the fiber optic unit 100 is moved upward at the pre-alignment position, epoxy resin for fixing the socket 102 is applied to the corresponding position, the fiber optic unit 100 contacts the epoxy resin, re-alignment is performed, and then the epoxy resin is cured to fix the socket 102 to the photonic integrated circuit 110, the problem of socket 102 misalignment caused by insufficient fixing force between the socket 102 and the fiber array 101 can also be completely solved.

[0053] Meanwhile, as shown in the above figures, the socket fixing unit 40 or more specifically the contact unit 41 is configured to be movable in the vertical direction d1 and to contact and hold the socket 102 on the upper surface of the socket 102 to provide an upward pull without interference from the clamp 20.

[0054] Therefore, as shown in the accompanying drawings, the contact unit 41 is preferably installed in a region that avoids the clamping point of the clamp 20 relative to the fiber optic unit 100, so as to contact the upper surface of the socket 102 in a region other than the clamping point of the clamp 20 relative to the fiber optic unit 100.

[0055] Therefore, we can provide, for example Figure 8 The arrangement structure shown. For example, it can be as follows: Figure 8 As shown in (a), multiple cylinders are arranged as contact units 41, or they can be arranged as follows: Figure 8 (b) shows a contact unit 41-1 configured as a straight bar or a U-shaped bar.

[0056] Furthermore, as can be seen from the attached figures, the pulling force generated by the magnetic force should be applied symmetrically relative to the socket 102. This is because if the pulling force generated by the magnetic force is asymmetrical with respect to the center of the socket 102, the socket 102 will be tilted and pulled due to the asymmetrical pulling force.

[0057] Therefore, the plurality of contact units 41 are preferably arranged to contact the upper surface of the socket 102 at a plurality of points symmetrical to each other with respect to at least the center of the socket 102. In the example shown in the figures, it can be seen that the plurality of columnar contact units 41 are arranged equidistantly and symmetrically with respect to the center of the socket 102.

[0058] The specific process of aligning the photonic integrated circuit 110 with the socket 102 based on the above structure will be described below. First, in order to perform alignment, the first step of fixing the photonic integrated circuit 110 to the fixture 10 is performed. Afterwards, as... Figure 7 As shown, the second step of preparing the fiber array 101 to be mounted on the fiber unit 100 in the socket 102 is performed.

[0059] When the second step is performed and the fiber optic unit 100 is ready to be moved, the clamp 20 moves via the moving module 30 to the biaxial coordinate position where the fiber optic unit 100 is prepared. Thereafter, the clamp 20 moves downward with the cylinder-moving clamp 22 open, and clamps the fiber optic unit 100 using both the cylinder-moving clamp 22 and the vacuum clamp. After or simultaneously with clamping the fiber optic unit 100 using the cylinder-moving clamp 22 and the vacuum clamp, the socket fixing unit 40 is also actuated, causing the contact unit 41 to contact the upper surface of the socket 102 to apply a pulling force, such as... Figure 6 As shown.

[0060] With the fiber optic unit 100 and the socket 102 respectively held by the clamp 20 and held by the socket fixing unit 40, the third step is performed: under the control of the moving module 30, the fiber optic unit 100 is moved to a position adjacent to the upper surface of the photonic integrated circuit 110, and then its position on the upper surface is pre-aligned (dry alignment) in the biaxial direction.

[0061] When the initial fixing point is determined through the third step, the pre-alignment is completed. In this state, the fourth step is performed, in which the fiber unit 100 is moved upward in the vertical direction d1 by means of the clamp 20 and the socket fixing unit 40 while maintaining the state of being restricted to movement in the biaxial direction (i.e., the direction parallel to the photonic integrated circuit 110 at the fixing point), and then epoxy resin 103 for fixing is applied.

[0062] Subsequently, the fifth step is performed. While maintaining the position fixed in the direction parallel to the upper surface of the photonic integrated circuit 110, the fiber unit 100 is moved downward in the vertical direction d1 by the clamp 20 and the moving module 30, so that the fiber unit 100 is bonded to the epoxy resin 103 at the pre-aligned position. Then, the fiber unit 100 is re-aligned in the biaxial direction parallel to the upper surface of the photonic integrated circuit 110 via the clamp 20 and the moving module 30.

[0063] Next, the sixth step of curing the epoxy resin 103 is performed. When the epoxy resin 103 has cured, the control socket fixing unit 40 is removed from the socket 102. This can be achieved, for example, by moving the contact unit 41 upward, or by de-energizing the electromagnet to eliminate the magnetic force and moving the contact unit 41 upward in the case of an electromagnet. Then, the seventh step is performed, using the clamp 20 to space the fiber array 101 upward from the socket 102 and remove it, thereby completing the process of fixing the socket 102 in a state of alignment with the photonic integrated circuit 110.

[0064] Although the invention has been described with reference to limited embodiments and accompanying drawings, those skilled in the art will understand that various modifications and variations can be made based on the above description. Terms such as “comprising,” “including,” or “having” used above mean that corresponding components may be present, and should therefore be interpreted as including rather than excluding other components. Furthermore, the scope of protection of this invention should be determined by the appended claims, and all technical ideas within their equivalents should be interpreted as being included within the scope of protection of this invention.

Claims

1. A detachable fiber array socket alignment device for a photonic integrated circuit with a co-packaged optical module, the socket being configured to be fixed to the upper surface of the photonic integrated circuit by epoxy resin, and the fiber array being detachably mounted on the socket such that the movement of the fiber array during mounting is restricted by a concave-convex portion formed on the upper surface of the socket, characterized in that, include: A fixture configured to hold the photonic integrated circuit; A clamp configured to hold the fiber optic units of the fiber array mounted on the socket; A moving module configured to move the gripper along three axes; as well as A socket fixing unit, disposed above the socket and in a region adjacent to the clamp, and configured to move vertically, is configured to apply an upward pulling force to the socket to contact and hold the socket until the socket is fixed to the photonic integrated circuit by the epoxy resin, such that the socket is in close contact with and fixed to the fiber array, and suppresses movement of the socket in a direction parallel to the upper surface of the photonic integrated circuit during fine alignment performed after the application of the epoxy resin.

2. The apparatus according to claim 1, characterized in that, The socket fixing unit includes: A contact unit configured to contact the upper surface of the socket and apply the upward pulling force to the socket; and A unit moving module configured to move the contact unit vertically.

3. The apparatus according to claim 2, characterized in that, The socket is formed of a material that can be attracted by magnetic force, and the contact unit includes a columnar magnet.

4. The apparatus according to claim 3, characterized in that, The contact unit is a permanent magnet.

5. The apparatus according to claim 3, characterized in that, The contact unit is an electromagnet, and the power supply to the electromagnet is controlled so that a magnetic force is generated when the electromagnet contacts the socket.

6. The apparatus according to claim 2, characterized in that, The contact unit is arranged in an area that avoids the clamping point of the clamp relative to the optical fiber unit, so as to contact the upper surface of the socket in an area other than the clamping point.

7. The apparatus according to claim 6, characterized in that, The contact units are configured as a plurality of units, and the plurality of contact units are arranged to contact the upper surface of the socket at a plurality of points symmetrical to each other with respect to at least the center of the socket.

8. A method for aligning a detachable fiber optic array socket using the apparatus according to any one of claims 1 to 7, characterized in that, include: The photonic integrated circuit is fixed to the fixture; Prepare the fiber optic units for the fiber optic array to be mounted on the socket; The optical fiber unit, held by the clamp and held by the socket fixing unit, is moved to the upper surface of the photonic integrated circuit and the position of the optical fiber unit on the upper surface of the photonic integrated circuit is pre-aligned. After the pre-alignment is completed, the fiber unit is moved upward by the clamp while keeping the fiber unit in a fixed position in a direction parallel to the upper surface of the photonic integrated circuit, and the epoxy resin is applied. After the epoxy resin is applied, the fiber unit is moved downward by the clamp while keeping the fiber unit fixed in a direction parallel to the upper surface of the photonic integrated circuit, so that the fiber unit and the epoxy resin are bonded to each other at the pre-aligned position, and the fiber unit is re-aligned in a direction parallel to the upper surface of the photonic integrated circuit via the clamp. Curing the epoxy resin; as well as After the epoxy resin has cured, the socket fixing unit is removed from the socket, and the fiber array is removed from the socket using the clamp.

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