Electronic product assembly

Abstract

The present invention relates to an electronic product assembly including: an electrostatic module including a substrate having a plurality of first holes formed therein and including a plurality of bus bars attached to one surface of the substrate, the electrostatic module being formed by stacking the substrate and the bus bars in one direction; a management module disposed to face the substrate in a direction opposite to the plurality of bus bars; and a relay module including a pair of connection terminals inserted into the first holes and a connection portion connected with the management module or the electrostatic module, wherein the plurality of bus bars are spaced apart from each other on one side of the substrate, the bus bars include second holes formed at positions corresponding to the first holes, the relay module includes an insulating member disposed between adjacent bus bars and between the pair of connection terminals, and the substrate includes a slit between at least one pair of adjacent first holes, the connection terminals being inserted into the slit.

Description

Technical Field

[0001] This invention relates to an electronic product component. Background Technology

[0002] Unlike technologies that use power sources such as gasoline to generate power for vehicles, the use of electric vehicles that use electricity to obtain driving power has been growing recently.

[0003] Therefore, electric vehicles must be equipped with a battery pack for storing electricity, and electric vehicles can also be equipped with a battery management system (BMS) and a coupling module to distribute the power generated from the battery pack according to the intended use, thereby allowing the power of the battery pack to be distributed according to the intended use.

[0004] However, when transmitting high power (e.g., power with a current of 500A or greater), there are the following disadvantages: the size of the busbar used to transmit power increases, the size of the junction box in which the BMS is installed also increases due to the increase in the size of the busbar, and multiple wire harnesses are required to electrically connect the components to each other.

[0005] In particular, when using multiple wiring harnesses, connections may loosen due to reduced tightness of bolted assemblies, and their securing requires a high degree of precision proportional to the complexity. Therefore, connection issues in the circuitry and busbars of electric vehicles are problems that must be addressed, as even small problems can lead to serious accidents.

[0006] Therefore, there is a need for a method that can solve and simplify the complex connection structure of wire harnesses while increasing the integration density of junction boxes required to transmit high ampere currents. Summary of the Invention

[0007] Technical issues

[0008] The present invention is proposed to solve the aforementioned problems of the related art, and aims to solve the problems caused by wire harness breakage or complexity due to complex wiring connections while transmitting relatively high power.

[0009] The objectives of this invention are not limited to those described above, and other objectives not mentioned herein will be clearly understood by those skilled in the art from the following description.

[0010] Technical solution

[0011] To achieve the above objectives, an electronic product component according to an embodiment of the present invention includes: an electrostatic module including a substrate having a plurality of first holes formed therein and a plurality of busbars attached to a surface of the substrate, wherein the electrostatic module is formed by stacking the substrate and the busbars in one direction; a management module disposed on a side opposite to the plurality of busbars to face the substrate; and a relay module including a pair of connection terminals inserted into the first holes and a connection portion connected to the management module or the electrostatic module, wherein the plurality of busbars are arranged to be spaced apart from each other on one side of the substrate, the busbars include second holes formed at positions corresponding to the first holes, the relay module includes insulating members disposed between adjacent busbars and between the pair of connection terminals, and the substrate includes a slit located between at least a pair of adjacent first holes, into which the connection terminals are inserted.

[0012] Here, the relay module can be positioned between the electrostatic module and the management module, the connection terminal can be positioned facing the electrostatic module, and the connection part can be positioned facing the management module.

[0013] Additionally, the connection may include a connection portion protruding toward the management module or the electrostatic module, and the management module or the electrostatic module may include a through hole through which the connection portion passes.

[0014] Additionally, the electronic component may also include a connector, with a connection portion passing through a through-hole disposed in the connector, and the connector is configured such that a management module or an electrostatic module is inserted between the connector and the relay module.

[0015] Meanwhile, at least some of the plurality of busbars can be disposed on the same surface.

[0016] Additionally, each of the busbars may include one or more regions in a first direction, wherein the lengths of the one or more regions in a second direction may be different from each other, the first direction may extend from one side of the substrate toward its facing side, and the second direction may be perpendicular to the first direction and may extend from the other side of the substrate toward its facing side.

[0017] Additionally, the plurality of busbars can be divided into: a plurality of first terminal portions, each of the plurality of first terminal portions including an extension portion, the extension portion not overlapping the substrate in a third direction perpendicular to the first direction and the second direction; and a plurality of second terminal portions, the plurality of second terminal portions overlapping the substrate in a third direction.

[0018] Here, the extension may extend in a direction away from the substrate, and at least one cross-sectional area of ​​the extension, taken in a direction perpendicular to the extension direction of the extensions of the plurality of first terminal portions that are different from each other, may be different.

[0019] Meanwhile, the multiple busbars can have different shapes from each other.

[0020] In addition, the separation distance between adjacent busbars can be in the range of 5mm to 7mm.

[0021] Here, the diameter of each of the plurality of first holes may be larger than the diameter of each of the plurality of second holes.

[0022] Meanwhile, each of the plurality of second holes may include: a first region, configured to be adjacent to the first hole; and a second region, configured to be relatively farther away from the first hole than the first region, and the diameter of the first region may be smaller than the diameter of the second region.

[0023] Additionally, an insertion hole can be provided in the connection terminal for the thread of the bolt member to be inserted therein. The thread of the bolt member can pass through the first region and can be inserted into the insertion hole, and the head of the bolt member can be located in the second region.

[0024] Here, the height of the second region in the third direction from the electrostatic module toward the management module can be greater than the height of the head of the bolt component in the third direction.

[0025] In addition, the thickness of the substrate in the third direction from the electrostatic module to the management module can be less than the thickness of the busbar in the third direction.

[0026] Additionally, the electronic product component may also include a connection module, which is disposed between the electrostatic module and the management module, and is electrically connected to the electrostatic module and the management module.

[0027] In addition, the electronic product component may also include a frame module disposed between the electrostatic module and the management module, the frame module having multiple relay modules disposed therein, and the frame module being configured to separate the multiple relay modules.

[0028] The substrate may include a sensor section and a conductive section. The sensor section is disposed on another surface of the substrate and includes a plurality of first sensors configured to sense the voltage of a bus and a plurality of second sensors configured to sense the temperature of the bus. The conductive section connects the bus to the other surface of the substrate. The substrate may also include at least one conductive layer and a third hole connecting the conductive layer to the bus. The first sensors can be connected to the bus through the conductive section and a circuit pattern disposed on the substrate, and the second sensors can be connected to the bus through the third hole.

[0029] One end of the third hole can be closed by the busbar, and the other end can be closed by the second sensor, and a heat-conducting component can be disposed inside the third hole.

[0030] The conductive portion may include: a first portion disposed on another surface of the substrate; a second portion extending from the first portion and disposed along the inner surface of the first hole; and a third portion connected to the second portion and in contact with the busbar.

[0031] One or more conductive layers can be connected to the busbar through a third hole or through the second and third portions.

[0032] The electronic product component may also include a shunt section disposed on another surface of the substrate and connecting one busbar to another busbar.

[0033] The shunt section can be electrically connected to the substrate, and one of the second sensors can be configured to be adjacent to the shunt section to measure the temperature of the shunt section.

[0034] The slit may not overlap with the busbar in a third direction perpendicular to the first and second directions.

[0035] The connecting terminal that electrically connects adjacent busbars to each other can be inserted into the first hole, and the length of the first hole in a third direction perpendicular to the first and second directions can be less than or equal to the length of the connecting terminal.

[0036] At least a portion of the extension may be disposed on the same surface as the second terminal portion, and the area of ​​the first terminal portion that overlaps with the substrate in the third direction and the second terminal portion may be disposed on the same surface.

[0037] At least one of the plurality of first holes may have a different shape.

[0038] Beneficial effects

[0039] The electronic product components according to embodiments of the present invention for solving the above-mentioned problems can provide the following effects: while transmitting relatively high power, they solve the problems caused by wire harness breakage or complexity due to complex wiring connections.

[0040] In addition, although it is difficult to automate the process of establishing high-power transmission connections using wire harnesses, the present invention also offers advantages in terms of process automation.

[0041] The effects of this invention are not limited to those described above, and those skilled in the art will clearly understand from the claims other effects not mentioned herein.

[0042] Furthermore, the effects of the present invention can be described in more detail in the detailed description, and need not be limited to those set forth above. Attached Figure Description

[0043] The following detailed description of the foregoing invention and exemplary embodiments of this application will be better understood when read in conjunction with the accompanying drawings.

[0044] Exemplary embodiments are shown in the accompanying drawings for the purpose of illustrating the present invention.

[0045] However, it should be understood that this application is not limited to the precise arrangement and means shown.

[0046] Figure 1 This is a view used to describe an overall electronic product assembly according to an embodiment of the present invention.

[0047] Figure 2 This is a view used to describe an electrostatic module of an electronic product component according to an embodiment of the present invention.

[0048] Figure 3 This is a view used to describe the busbars of an electronic product component according to an embodiment of the present invention.

[0049] Figure 4 This is a view used to describe an extension of an electronic product component according to an embodiment of the present invention.

[0050] Figure 5 This is a view used to describe the first and second holes of an electronic product assembly according to an embodiment of the present invention.

[0051] Figure 6 This is a view used to describe the state in which the bolt head is disposed in the second hole of an electronic product assembly according to an embodiment of the present invention.

[0052] Figure 7 This is a view used to describe the state in which a relay module of an electronic product component is connected according to an embodiment of the present invention.

[0053] Figure 8 This is a view used to describe the separation distance in an electronic product assembly according to an embodiment of the present invention.

[0054] Figure 9 This is a view used to describe the conductive portion and the second sensor of an electronic product assembly according to an embodiment of the present invention.

[0055] Figure 10 This is a view used to describe a shunt section of an electronic product component according to an embodiment of the present invention.

[0056] Figure 11 This is a view used to describe a circuit pattern and a first sensor of an electronic product component according to an embodiment of the present invention.

[0057] Figure 12 This is a view used to describe a relay module of an electronic product component according to an embodiment of the present invention.

[0058] Figure 13 This is a view used to describe a connector module of an electronic product component according to an embodiment of the present invention.

[0059] Figure 14 This is a view used to describe the connection module of an electronic product component according to an embodiment of the present invention.

[0060] Figure 15 This is a view used to describe a frame module of an electronic product component according to an embodiment of the present invention.

[0061] Figure 16 This is a view used to describe the interior of a frame module of an electronic product component according to an embodiment of the present invention.

[0062] Figure 17 This is a comparative view of the first leg and the second leg of an electronic product assembly according to an embodiment of the present invention.

[0063] Figure 18 This is a view comparing the cross-sectional areas of multiple extensions of an electronic product component according to an embodiment of the present invention.

[0064] Figure 19 This is a view used to describe the state of the second leg located in the mounting portion of an electronic product assembly according to an embodiment of the present invention.

[0065] Figure 20 This is a view showing an electronic product component connected to a cooling plate according to an embodiment of the present invention.

[0066] Figure 21 This is a view used to describe the busbars in a state where an electronic product component is connected to a cooling plate according to an embodiment of the present invention. Detailed Implementation

[0067] While the invention is readily adaptable to various modifications and alternatives, specific embodiments thereof are illustrated by way of example in the accompanying drawings and will be described in detail herein. However, it should be understood that the invention is not intended to be limited to the specific forms disclosed; rather, it is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Furthermore, in describing the invention, detailed descriptions of prior art will be omitted where it is determined that such detailed descriptions may obscure the gist of the invention.

[0068] The terms "first," "second," etc., can be used to describe various components, but these components should not be limited to the terms mentioned above. These terms are only used to distinguish one component from another.

[0069] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood in this application that the terms “comprising,” “including,” “containing,” and / or “comprising” as used herein specify the presence of stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0070] Furthermore, throughout the specification, the term "connection" can mean not only that two or more components are directly connected to each other, but also that two or more components are indirectly connected to each other through another component, physically or electrically connected to each other, or integrally formed with each other, although they may be referred to by different names depending on their location or function.

[0071] Furthermore, when a component is described as being formed "above" or "below" another component, the terms "above" or "below" include cases where the two components are in direct contact with each other and cases where one or more components are (indirectly) disposed between the two components. Additionally, when a component is described as being disposed "above or below" another component, such a description can include cases where the component is disposed on the upper or lower side relative to the other component.

[0072] In the following description, exemplary embodiments of the invention will be illustrated with reference to the accompanying drawings, in which the objectives of the invention may be specifically achieved.

[0073] First, in describing the substrate module and electronic product assembly 10 according to an embodiment of the present invention, it can be described that the electronic product assembly 10 according to an embodiment of the present invention can be provided therein.

[0074] Here, the electronic product assembly 10, in which the electronic component module is disposed according to an embodiment of the present invention, may include an electronic product module, and the electronic product module may include a substrate module 100 and a relay module 300.

[0075] More specifically, such as Figure 1 As shown, the electronic product component 10 may include a baseboard module 100, a management module 200, a relay module 300, a connection module 400, a frame module 500, and a housing 600. In this case, the baseboard module 100 may be arranged in the form of multiple buses 120 attached to one surface of the baseboard 110. The multiple buses 120 can be connected via connection terminals 310 provided in the relay module 300, so that power on one side can be transmitted to the other side or can be split. Power can be split or transmitted by the management module 200, which is positioned opposite the baseboard module 100.

[0076] Specifically, in the electronic product assembly 10 according to an embodiment of the present invention, power supplied from the battery can be transmitted through the baseboard module 100 and can be selectively branched by a relay module 300 that connects multiple buses 120 to each other. A management module 200 can be connected to the baseboard module 100 via the relay module 300 or a connection module 400, and can control the power flow in or transmitted through the baseboard module 100. Here, the management module 200 may be a battery management system (BMS).

[0077] In addition, in the electronic product component 10 according to an embodiment of the present invention, the management module 200, the frame module 500, the relay module 300 and the connection module 400 can be disposed inside the housing 600, the housing being open in one direction, and the opening of the housing 600 being closed by the cooling plate 20.

[0078] This arrangement improves space utilization by using minimal space for each component. Furthermore, since multiple busbars 120 are connected via relay modules 300, which are directly connected to the management module 200, and the baseboard module 100 is connected to the management module 200 via a connection module 400, the electronic component 10 can have the advantage of not requiring multiple wiring harnesses.

[0079] Furthermore, due to the connection characteristics of wire harnesses, a structure is typically required to fasten the wire harness to the end of the busbar 120 using bolts and nuts. However, since the electronic product assembly 10 according to an embodiment of the present invention does not use multiple wire harnesses, the problems associated with wire harness connection structures can be solved. At the same time, the channels of the multiple busbars 120 that are separated from each other can be simplified, thereby providing the advantage of connecting wire harnesses by reducing the number of channels.

[0080] In particular, the electronic component 10 according to an embodiment of the invention can transmit high power. Here, high power requires high current density because the electronic component 10 transmits power with a current of 300A or 500A or greater, rather than a general current of approximately 0A to 10A. To meet this requirement, the size of the bus 120, and therefore the size of the electronic component 10, is increased. Thus, the above arrangement and structure can increase integration density, thereby ensuring space efficiency.

[0081] The foregoing description is provided for an electronic product assembly 10 in which a substrate module 100 according to an embodiment of the present invention is applied, and only one embodiment is shown. Therefore, the present invention is not necessarily limited to the above-described arrangement, structure, and function.

[0082] Furthermore, before providing a detailed description of the present invention, each direction can be defined as follows. Regarding the substrate 110 of the substrate module 100, when the direction from one side of the substrate 110 toward the facing side is defined as the first direction, the direction from the other side of the substrate 110 toward the facing side and perpendicular to the first direction can be defined as the second direction.

[0083] Here, "one side" refers to any one of a plurality of sides disposed along the periphery of the substrate 110, and "side opposite to one side" refers to the side facing that side. In the present invention Figure 1 In this context, the first direction is defined as both the direction from the lower left to the upper right and the direction from the upper right to the lower left. However, the first direction can alternatively be defined as both the direction from the upper left to the lower right and the direction from the lower right to the upper left.

[0084] However, in the detailed description of the present invention, for ease of understanding, the first direction will be defined as the direction from one side toward the facing side, specifically, referring to... Figure 1 From the lower left to the upper right.

[0085] In addition, the second direction can refer to the direction from a side other than the side that overlaps with the first direction toward the side opposite to that other side, and the second direction and the first direction can be perpendicular to each other.

[0086] Specifically, refer to Figure 1 The second direction can include both the direction from the upper left to the lower right and the direction from the lower right to the upper left.

[0087] Additionally, the third direction can refer to a direction perpendicular to the first and second directions. In a three-axis coordinate system, the first, second, and third directions can be perpendicular to each other and referenced. Figure 1 The third direction can include both the direction from top to bottom and the direction from bottom to top.

[0088] In this context, in the detailed description of the invention, when referring to a particular direction, unless the direction is described as extending from one specific component toward another, the direction may include two directions along corresponding axes. When a direction can be understood from the positional relationships illustrated, the direction may represent a direction according to the illustration. Based on the foregoing, when describing an electronic component module for high power transmission according to an embodiment of the invention, reference may be made to... Figures 2 to 19 .

[0089] More specifically, Figure 2 This is a view used to describe an electrostatic module of an electronic product component according to an embodiment of the present invention. Figure 3 This is a view used to describe the busbars of an electronic product component according to an embodiment of the present invention. Figure 4 This is a view used to describe an extension of an electronic product component according to an embodiment of the present invention. Figure 5 This is a view used to describe the first and second holes of an electronic product assembly according to an embodiment of the present invention. Figure 6 This is a view used to describe the state in which the bolt head is disposed in the second hole of an electronic product assembly according to an embodiment of the present invention. Figure 7 This is a view used to describe the state in which a relay module of an electronic product component according to an embodiment of the present invention is connected. Figure 8 This is a view used to describe the separation distance in an electronic product assembly according to an embodiment of the present invention. Figure 9 This is a view used to describe the conductive portion and the second sensor of an electronic product assembly according to an embodiment of the present invention. Figure 10 This is a view used to describe a shunt section of an electronic product component according to an embodiment of the present invention. Figure 11 This is a view used to describe a circuit pattern and a first sensor of an electronic product component according to an embodiment of the present invention. Figure 12 This is a view used to describe a relay module of an electronic product component according to an embodiment of the present invention. Figure 13 This is a view used to describe a connector module of an electronic product component according to an embodiment of the present invention. Figure 14 This is a view used to describe the connection module of an electronic product component according to an embodiment of the present invention. Figure 15 This is a view used to describe a frame module of an electronic product component according to an embodiment of the present invention. Figure 16 This is a view illustrating the interior of a frame module of an electronic product component according to an embodiment of the present invention. Figure 17 These are comparative views of the first leg and the second leg of an electronic product assembly according to an embodiment of the present invention. Figure 18 These are views comparing the cross-sectional areas of multiple extensions of an electronic product assembly according to an embodiment of the present invention. Figure 19 This is a view used to describe the state of the second leg located in the mounting portion of an electronic product assembly according to an embodiment of the present invention.

[0090] First, such as Figure 2 As shown, an electronic component module according to an embodiment of the present invention may include: a substrate 110 including a plurality of first holes 111; and a plurality of busbars 120 disposed on a surface of the substrate 110 and including second holes 121 formed at positions corresponding to the first holes 111.

[0091] Additionally, the electronic component module according to an embodiment of the present invention may further include: a sensor section disposed on another surface of the substrate 110, and including a plurality of first sensors 141 configured to sense the voltage of the bus 120 and a second sensor 142 configured to sense the temperature of the bus 120; and a conductive section 150 connecting the bus 120 to the other surface of the substrate 110. In this case, the sensor section and the conductive section 150 will be described in more detail with reference to the accompanying drawings described below.

[0092] Here, multiple busbars 120 can be disposed on one side of the substrate 110, while being spaced apart from each other, and each busbar 120 may include at least two second holes 121.

[0093] Additionally, although the description will refer to the accompanying drawings below, the substrate 110 may include a slit 113 into which an insulating member 320 for preventing interference between adjacent busbars 120 is inserted, and the slit 113 may be provided between at least a pair of adjacent first holes 111. That is, the slit 113 may be provided between a pair of adjacent first holes 111, and at least one slit 113 may be provided.

[0094] In this configuration, the first hole 111 and the second hole 121 can be arranged to overlap each other in the third direction, and the slit 113 can be arranged not to overlap with the busbar 120 in the third direction. This can be because the insulating member 320 is inserted into the slit 113 and positioned between the spaced-apart busbars 120.

[0095] Here, the insulating member 320 may be part of the relay module 300 and may be a protruding portion of the relay module 300. When the protruding portion of the relay module 300 is inserted into the slit 113 and the relay module 300 is disposed on the substrate module 100, the relay module 300 may be guided.

[0096] For example, when connecting the relay module 300 to the substrate 110, the insulating member 320 can be inserted into the slit 113 to guide the position and connection of the relay module 300, such that the connection terminal 310 is located in the appropriate position in the adjacent first hole 111.

[0097] In addition, although in Figure 2 The substrate 110 and busbar 120 are shown as separate from each other, but the substrate 110 and busbar 120 are shown separately for ease of description of the respective components. The substrate 110 and busbar 120 may be stacked on top of each other and arranged as a single body, and the busbar 120 and substrate 110 may be connected to each other for electrical connection.

[0098] Additionally, the diversion section 170 may be disposed on one side of the other surface of the substrate 110, and the opposite ends of each diversion section 170 may be configured to overlap with the first hole 111 and the second hole 121 in a third direction. The diversion section 170 will be described in more detail with reference to the accompanying drawings described below.

[0099] At the same time, Figure 3 In the diagram, substrate 110 is indicated by dashed lines to specifically compare busbar 120 and substrate 110 according to an embodiment of the invention. Reference Figure 3 The busbar 120 according to an embodiment of the present invention will now be described in more detail. The busbar 120 of the present invention can be divided into a plurality of first terminal portions 122 and a plurality of second terminal portions 124, portions of the plurality of first terminal portions overlapping the substrate 110 in a third direction, and portions of the plurality of second terminal portions overlapping the substrate 110 in a third direction.

[0100] Here, each of the first terminal portions 122 may include: a body that overlaps with the substrate 110 in the third direction; and an extension 123 that extends from the body toward the outside of the substrate 110 and does not overlap with the substrate 110 in the third direction. Each of the second terminal portions 124 may not include the extension 123, and the entire area of ​​the second terminal portion 124 may overlap with the substrate 110 in the third direction.

[0101] In addition, according to embodiments of the present invention, the substrate 110 and the busbar 120 can be configured such that one surface of the substrate 110 and one surface of each busbar 120 are in close contact with each other, and the plurality of busbars 120 can have different shapes from each other.

[0102] Additionally, there may be at least one region in which the first hole 111 and the second hole 121 overlap each other in a third direction, and specifically in which no slit 113 is formed between adjacent first holes 111. A shunt 170 (which is a resistor connected in parallel for current measurement or current shunting) may be provided at the first hole 111 in which no slit 113 is formed.

[0103] Additionally, the first hole 111, which is disposed adjacent to the vertex of the substrate 110, can provide space for connection to the frame module 500, and the frame module 500, the busbar 120 and the substrate 110 can be connected together by bolt members.

[0104] In addition, such as Figure 3As shown, at least one of the plurality of first holes 111 may have different shapes. This may be because the first holes 111 with different shapes do not contact the conductive part 150. In other words, the conductive part 150 may not be provided in at least one of the plurality of first holes 111, and the conductive part 150 may be provided in the first holes 111 other than the at least one first hole 111 in which the conductive part 150 is not provided.

[0105] At the same time, refer to Figure 4 The busbar 120 according to an embodiment of the present invention is described in detail below. Figure 4 As shown, the first terminal portion 122 includes an extension portion 123, and specifically, it may include at least one extension portion 123.

[0106] Furthermore, since the first hole 111 is formed in the substrate 110 and the second hole 121 is formed in the busbar 120, the connection terminal 310 of the relay module 300 needs to contact the busbar 120. Therefore, the first diameter L1, which is the diameter of the first hole 111, can be larger than the second diameter L2, which is the diameter of the second hole 121.

[0107] Furthermore, the power supplied from the battery is shunted and transmitted by the management module 200 as needed, and the amount of power transmitted can vary depending on the required capacity (i.e., the required current density). Therefore, the extension 123 can have different widths.

[0108] Specifically, when one extension 123 is defined as a first extension 123a and the other extension 123 is defined as a second extension 123b, the first width A1 of the first extension 123a in the second direction may be different from the second width A2 of the second extension 123b in the second direction.

[0109] As described above, the extension 123 can transmit power from the battery to the interior of the electronic component 10, and can also transmit power delivered to the interior of the electronic component 10 to power-requiring components of the electric vehicle. Therefore, the second hole 121 can be provided at the end of each extension 123.

[0110] Additionally, the busbar 120 may include one or more regions in the first direction, said one or more regions having different widths in the second direction. More specifically, as Figure 8As shown, when a portion is considered as the first region 122a, the first region 122a may correspond to a region having a width in the second direction, and when another portion is considered as the second region 122b, the second region 122b may correspond to a region having a different width in the second direction. Since the first region 122a and the second region 122b are arranged in the first direction, as described above, the busbar 120 may include one or more portions having different lengths in the second direction.

[0111] Meanwhile, according to an embodiment of the present invention, the second hole 121 may include a first region 121a disposed adjacent to the first hole 111 in a third direction and a second region 121b disposed further away from the first hole 111 in a third direction than the first region 121a. The first region 121a may be disposed between the first hole 111 and the second region 121b.

[0112] Here, the first hole 111 can be the space in which the connection terminal 310 in the relay module 300 is inserted, the first region 121a can be the space in which the bolt body of the bolt member inserted from one side of the substrate 110 is located, and the second region 121b can be the space in which the bolt head of the bolt member is located.

[0113] Additionally, in the third direction, the busbar 120 can be configured such that the upper end of the first region 121a formed therein is exposed through the first hole 111. The upper end can be exposed in the third direction through the first hole 111, allowing the connection terminal 310 of the relay module 300 to contact the busbar 120 to move electricity.

[0114] In this case, such as Figure 3 As shown, the first thickness T1 of the substrate 110 in the third direction can be less than the second thickness T2 of the busbar 120 in the third direction. This is because, due to the characteristics of the embodiments of the present invention used for transmitting high power, it is necessary to increase the area of ​​the busbar 120 to increase the current density. To effectively achieve this requirement, the thickness of the busbar 120 in the third direction can be increased to effectively ensure the area required for the current density of transmitting high power.

[0115] In other words, to drive operating units that perform specific operations and functions, there exists a certain amount of current that needs to be transmitted per unit time. In other words, the current flow per unit area needs to meet minimum requirements. Therefore, to ensure that the current density (current flow per unit area) meets the standards suitable for high power transmission, the second thickness T2 of bus 120 in the third direction can be increased to ensure sufficient current per unit area.

[0116] Since the value of current density is obtained by dividing the current by the unit area, and thus the value of current is obtained by multiplying the current density by the unit area, in order to transmit sufficiently high power, it is necessary to ensure a sufficient cross-sectional area through which the current flows, i.e., the cross-sectional area of ​​bus 120. For this purpose, the second thickness T2 of bus 120 in the third direction can be relatively larger than the first thickness T1 of substrate 110.

[0117] Meanwhile, as described above, the second hole 121 may include a first region 121a and a second region 121b, and in the third direction, the first region 121a may be configured to be relatively adjacent to the first hole 111, and the second region 121b may be configured to be relatively farther away from the first hole 111 than the first region 121a.

[0118] Additionally, as described above, the first region 121a can define the space in which the bolt body of the bolt member is inserted, the connecting terminal 310 can contact the upper end of the busbar 120 in which the first region 121a is formed, and the bolt body can pass through the first region 121a and be inserted into the connecting terminal 310.

[0119] Furthermore, the first region 121a can be located between the first hole 111 and the second region 121b. Since the bolt body is located in the first region 121a and the bolt head is located in the second region 121b, the first region 121a can have a smaller diameter than the second region 121b. Specifically, the first diameter L1 of the first hole 111 can be larger than both the second diameter L2 of the first region 121a and the third diameter L3 of the second region 121b.

[0120] In other words, among the first diameter L1 of the first hole 111, the second diameter L2 of the first region 121a, and the third diameter L3 of the second region 121b, the first diameter L1 can be the largest, the second diameter L2 can be the smallest, and the third diameter L3 can have a length between the first diameter L1 and the second diameter L2.

[0121] Therefore, since the second diameter L2 is smaller than the first diameter L1, the upper end of the busbar 120 can be exposed in the third direction through the first hole 111, and the exposed upper end can easily contact the connection terminal 310 provided in the relay module 300.

[0122] In addition, such as Figure 9As shown, the bolt body can be inserted through the first region 121a and the first hole 111, and the bolt head can be disposed in the second hole 121. The height of the bolt head in the third direction can be less than the height of the second region 121b in the third direction. Specifically, the first height T3 of the second region 121b in the third direction can be greater than the second height T4 of the bolt head in the third direction, so that the bolt head does not protrude from the interior of the second region 121b in the third direction.

[0123] This is because when the substrate 110 is disposed on one side surface of the busbar 120 and the separate cooling plate 20 is disposed on its other side surface, the cooling plate 20 needs to be in direct contact with the busbar 120 to dissipate the heat generated by the busbar 120. When the bolt head protrudes, the cooling plate 20 may not be able to make proper contact with the busbar 120, which may lead to heat-related problems. Since the first height T3 of the second region 121b according to an embodiment of the invention is greater than the second height T4 of the bolt head, the bolt head does not protrude, thereby allowing the busbar 120 and the cooling plate 20 to be in close contact with each other.

[0124] In other words, one side surface of the busbar 120 can be in close contact with the substrate 110, and without considering the cooling plate 20, the busbar 120 can be configured such that its other side surface is exposed in a third-order upward direction away from the substrate 110. Therefore, the other side surface can effectively be in close contact with the cooling plate 20 or a separate component.

[0125] At the same time, such as Figure 10 As shown, the relay module 300 can be disposed on the other side of the substrate 110, and with the connection terminal 310 inserted into the first hole 111, the fourth height T6 of the connection terminal 310 in the third direction can be greater than the third height T5 of the first hole 111 in the third direction. This may be because the connection terminal 310 must contact the bus 120 to allow power to move.

[0126] In other words, the first thickness T1 of the substrate 110 of the present invention can be equal to the third height T5 of the first hole 111, the first thickness T1 can be less than the fourth height T6 of the connecting terminal 310, and the third height T5 can be less than the fourth height T6. Therefore, the connecting terminal 310 can easily pass through the first hole 111 and can contact the busbar 120.

[0127] In addition, as described above, since the second height T4 of the bolt head in the third direction is less than the first height T3 of the second region 121b in the third direction, the bolt head will not protrude outward, and the bolt body can pass through the first region 121a and can be inserted and fixed into the interior of the connecting terminal 310.

[0128] In addition, as described above, the insulating member 320 disposed between adjacent busbars 120 can be inserted into the slit 113, and the slit 113 can be disposed in the gap space 130.

[0129] Therefore, in the electronic component module according to an embodiment of the present invention, multiple busbars 120 can be arranged on the same surface, thereby allowing for efficient use of space. Furthermore, since the multiple busbars 120 are connected to each other via connection terminals 310 of the relay module 300, a large number of wiring harnesses are not required. Thus, the complexity associated with wiring harness connections can be reduced, and the manufacturing process can be simplified.

[0130] More specifically, the plurality of busbars 120 may be divided into a plurality of first terminal portions 122 and a plurality of second terminal portions 124. Each of the plurality of first terminal portions 122 may include at least one extension 123. At least a portion of each extension 123 may be disposed on the same surface as the body of the plurality of first terminal portions 122 and second terminal portions 124, and the second terminal portions 124 may be disposed on the same surface as the first terminal portions 122.

[0131] At the same time, such as Figure 8 As shown, the slit 113 can be disposed between adjacent busbars 120 or between adjacent first holes 111. The slit 113 can be configured not to overlap with the busbars 120 in the third direction, and adjacent busbars 120 can be spaced apart by a separation distance L4.

[0132] Here, the separation distance L4 between adjacent busbars 120 can be 5 mm or more, preferably 6 mm or more, and considering the size of the substrate 110, it can preferably be in the range of 5 mm to 7 mm.

[0133] Furthermore, the width of the gap 130 between adjacent busbars 120 (i.e., the separation distance L4) can be greater than the width of the slit 113. Specifically, the separation distance L4 between adjacent busbars 120 spaced apart in the first or second direction can be greater than the width of the slit 113 in the direction in which the adjacent busbars 120 are spaced apart from each other.

[0134] This is because when the separation distance L4 is less than 5 mm, adjacent busbars 120 may interfere with each other, while when the separation distance L4 is greater than 7 mm, the area of ​​the substrate 110 increases and the size of the electrostatic module 100 increases, thereby reducing space efficiency. Therefore, the separation distance L4 is preferably in the range of 5 mm to 7 mm, and more preferably 6 mm.

[0135] At the same time, refer to Figures 9 to 11The sensor section according to an embodiment of the present invention is described as follows: as described above, the sensor section may include a first sensor 141 configured to sense voltage and a second sensor 142 configured to sense temperature, and the conductive section 150 may include a first portion 151, a second portion 152 and a third portion 153.

[0136] Here, the second sensor 142, configured to sense temperature, can be connected to the busbar 120 via a third hole 114 formed through the substrate 110 in a third-direction upward direction. One end of the third hole 114 can be closed by the busbar 120, and the other end can be closed by the second sensor 142. A heat-conducting member can be disposed within the third hole 114, allowing the temperature of the busbar 120 to be easily transferred to the second sensor 142 through the heat-conducting member.

[0137] In other words, since the third hole 114 has a shape in which one end is closed by the busbar 120 and the other end is closed by the second sensor 142, the third hole 114 is not formed to be exposed to the outside, but is formed inside the substrate 110. Therefore, heat from the heat-conducting component can be prevented from escaping to the outside, thereby preventing a decrease in the temperature value measured by the second sensor 142 and the resulting error.

[0138] For example, when the third hole 114 is shaped to expose the outside, heat from the heat-conducting member can be transferred to the outside, and the heat transferred through the heat-conducting member can dissipate to the outside. Therefore, the heat transferred by the heat-conducting member may be significantly less than the heat received from the bus 120, and the temperature of the bus 120 measured by the second sensor 142 may be relatively lower than the actual temperature of the bus 120. Therefore, it may be impossible to properly implement controls for cooling the bus 120.

[0139] Therefore, one end of the third hole 114 can be closed by the busbar 120, and the other end can be closed by the second sensor 142. A heat-conducting member can be disposed in the third hole 114, such that the busbar 120 and the second sensor 142 are in contact with each other through the heat-conducting member, thereby allowing for more efficient sensing of the temperature of the busbar 120.

[0140] Meanwhile, the substrate 110 may be a printed circuit board (PCB) in which multiple layers are stacked, and may include at least one conductive layer 112. Here, the conductive layer 112 may be a layer formed of a conductive material. Although various materials may be used depending on design requirements, the conductive layer 112 according to an embodiment of the present invention may be formed as a copper layer.

[0141] Additionally, the conductive layer 112 and the busbar 120 can be spaced apart from each other in the third direction by layers formed of insulating material instead of conductive material. This arrangement can prevent power transmitted through the busbar 120 from being directly transmitted to the conductive layer 112, but the invention is not limited to this.

[0142] Meanwhile, the conductive portion 150 can be disposed on another surface of the substrate 110 and can have a shape extending around the outer periphery of the first hole 111. More specifically, the first portion 151 can be disposed on another surface of the substrate 110 with a diameter larger than the diameter of the first hole 111, the second portion 152 can be disposed along the inner surface of the first hole 111, and the third portion 153 can be disposed on the upper end of the busbar 120.

[0143] Here, the second portion 152 can be disposed between the first portion 151 and the third portion 153. When the first hole 111 is viewed from a third-party perspective, the conductive portion 150 can be a circular shape with a diameter, and can also be an annular shape with a hole formed inward from the end of the third portion 153. In this case, depending on the conditions, the third portion 153 can contact the connecting terminal 310.

[0144] In addition, the first part 151, the second part 152 and the third part 153 of the conductive part 150 can all be formed of conductive material and can be formed as a relatively thin coating.

[0145] Here, when the second portion 152 is not covering the inner surface of the first hole 111, the inner surface of the first hole 111 can remain exposed towards the center of the first hole 111. When the second portion 152 covers the inner surface of the first hole 111, the conductive layer 112 can contact the second portion 152 and can be electrically connected to the bus 120 through the second portion 152 and the third portion 153, so that power from the bus 120 can be transmitted to the conductive layer 112.

[0146] Furthermore, although this will be described in more detail with reference to the accompanying drawings, the circuit pattern 160 for moving electricity can be provided on the other surface of the substrate 110 on which the first sensor 141 is provided, that is, referring to... Figure 4 The circuit pattern 160 is disposed on the upper side of the substrate 110. The circuit pattern 160 can contact the first portion 151, and the power from the bus 120 can be transmitted to the circuit pattern 160 through the conductive portion 150, so that the first sensor 141 can measure the voltage of the bus 120.

[0147] Meanwhile, the second portion 152 can be disposed on the entire inner surface of the first hole 111, and the third portion 153 can be applied to part or all of the upper surface of the busbar 120. In addition, the first portion 151 can be disposed in a circular shape on the portion adjacent to the first hole 111, the diameter of which is a predetermined amount larger than the first diameter L1 of the first hole 111.

[0148] As described above, the first portion 151 of the conductive portion 150 allows power from the bus 120 to be transmitted to the first sensor 141 through the circuit pattern 160, the second portion 152 allows power from the bus 120 to be transmitted to the conductive layer 112 of the substrate 110, and the third portion 153 allows power from the bus 120 to be transmitted to the second portion 152 or the connection terminal 310.

[0149] At the same time, refer to Figure 2 and Figure 10 According to an embodiment of the present invention, a plurality of flow dividers 170 may be disposed on one side of the substrate 110 and may be configured to overlap each other in a first direction. Here, since the first direction is selectively defined as one of the directions in the detailed description of the present invention, a pair of flow dividers 170 may be disposed so that they overlap each other in either the first direction or the second direction.

[0150] In addition, similar to the sensor section, the diversion section 170 can be provided on the upper surface of the substrate 110, that is, on another surface of the substrate 110. The diversion section 170 may include a placement section 171 that overlaps with the first hole 111 in a third direction, and the placement section 171 may have a relatively small diameter.

[0151] Additionally, the shunt 170 may include: a pair of bodies, each having a mounting portion 171 formed therein, such that the first hole 111 and the mounting portion 171 are arranged to overlap each other; and a resistive member disposed between the pair of bodies and configured to provide resistance. The resistive member may be formed of a manganese-based material, but the invention is not limited thereto.

[0152] Additionally, at least one solder portion 180 may be disposed around the periphery of the current shunt portion 170 to electrically connect the current shunt portion 170 to the substrate 110. The solder portion 180 may electrically connect the current shunt portion 170 to the upper surface of the substrate 110 and may be connected to the first sensor 141 or the second sensor 142 via a separate circuit pattern 160 on the substrate 110.

[0153] Meanwhile, at least one second sensor 142 according to an embodiment of the present invention may be configured to be adjacent to the shunt section 170, and more specifically, to be adjacent to the resistive member of the shunt section 170, thereby sensing the temperature generated at the resistive member.

[0154] This is because the power transmitted from one end of the shunt 170 toward the other end passes through the resistive member, and heat is generated as the current flows through the resistive path due to the resistance of the resistive member. Therefore, the second sensor 142 can preferably be positioned adjacent to the resistive member.

[0155] At the same time, refer to Figure 11 To describe the first sensor 141 and circuit pattern 160 described above, the first region 121a of bus 120 can be exposed in the third direction through the first hole 111, as shown. Figure 11 As shown. The first portion 151 of the conductive part 150 may be disposed around the outer periphery of the first hole, at a predetermined distance from the outer periphery of the first hole 111.

[0156] In addition, although the conductive part 150 and the busbar 120 are in Figure 11 The portions are shown separately for ease of understanding, but the third portion 153 may cover the upper surface of the busbar 120, that is, cover the upper end of the busbar 120 exposed in the third direction through the first hole 111. Therefore, when viewed from above, only the conductive portion 150 may be visible.

[0157] Additionally, one end of the circuit pattern 160 can be connected to a portion of the conductive part 150, and the other end can be connected to the first sensor 141. Therefore, the first sensor 141 can sense the voltage of the bus 120 through the circuit pattern 160.

[0158] Furthermore, the structure including circuit pattern 160 and the first sensor 141 can be applied only to one of a pair of adjacent first holes 111 in which a slit 113 is provided. This is because the shunt 170 is connected in parallel with the ammeter to extend the ammeter's measurement range. Therefore, the voltage of the shunt 170 can be transmitted to the first sensor 141 via the substrate 110 and solder section 180 through the conductive layer 112 instead of through circuit pattern 160.

[0159] In other words, the conductive portion 150 and the circuit pattern 160 can be associated with one of a pair of adjacent first holes 111 in which the insulating member 320 and the connecting terminal 310 are provided. The conductive portion 150 can be connected to the first sensor 141 via the circuit pattern 160.

[0160] However, the foregoing description of the shunt 170 is merely an illustration of one embodiment of the present invention. The voltage of the shunt 170 is not necessarily transmitted to the first sensor 141 through the conductive layer 112, but can be transmitted through the circuit pattern 160. Therefore, the present invention is not limited to the above configuration.

[0161] At the same time, such as Figure 12 and Figure 13 As shown, the relay module 300 may include a connection terminal 310, an insulating member 320, and a connection portion 330.

[0162] Here, the connecting terminal 310 can be inserted into the first hole 111 and contact the conductive part 150 or the busbar 120. The insulating member 320 can be inserted into the slit 113 and is disposed in the spacing space 130 between adjacent busbars 120. The insulating member 320 can protrude relatively further toward the busbar 120 than the connecting terminal 310.

[0163] This is because, when the connecting terminal 310 is inserted into the first hole 111 and contacts the conductive part 150 or the bus 120 to transmit and shunt power, the insulating member 320 is located between adjacent bus 120s and it is necessary to minimize the electrical influence between adjacent bus 120s. Therefore, the insulating member 320 can be configured to protrude relatively further than the connecting terminal 310 so as to be positioned relative to the lower end of the adjacent bus 120.

[0164] Additionally, the connection portion 330 may be disposed on the periphery of the relay module 300 and adjacent to the electrostatic module 100 or the management module 200. The connection portion 330 may include a terminal pin 331 that inserts through an adjacent one of the electrostatic module 100 and the management module 200.

[0165] In other words, the relay module 300 can be connected to the electrostatic module 100 via the connection terminal 310. When the relay module 300 is only connected to the electrostatic module 100, the connection portion 330 can be positioned adjacent to the electrostatic module 100. When the relay module 300 is connected to both the electrostatic module 100 and the management module 200, the connection portion 330 can be positioned in the direction toward the management module 200.

[0166] Specifically, such as Figure 13 As shown, the electrostatic module 100 and the management module 200 that are connected to the connection part 330 may include a through hole through which terminal pins 331 pass. The terminal pins 331 passing through the through hole can be connected to the electrostatic module 100 or the management module 200 via the connector module 700.

[0167] In this context, for ease of understanding, the following description will be limited to the management module 200. However, this limitation is merely to avoid confusion that may arise from describing both the electrostatic module 100 and the management module 200, and the relevant configuration is not necessarily provided only in the management module 200. When a through-hole is provided in the electrostatic module 100, similar to slit 113, the through-hole may be configured to overlap with the spacer space 130 in the third direction, and the connector module 700 may be provided in the spacer space 130.

[0168] As described above, when a through-hole is formed in the management module 200, the connecting portion 330 can be provided at the upper end of the relay module 300, and the connecting terminal 310 and the insulating member 320 can be provided at the lower end of the relay module 300. The connecting terminal 310 and the insulating member 320 can be arranged to face the direction opposite to the connecting portion 330.

[0169] Alternatively, when terminal pin 331 is inserted through the through-hole of management module 200, terminal pin 331 can be inserted into connector module 700. Connector module 700 can transmit information or power received from terminal pin 331 to a separate electronic component module via a wiring harness. Alternatively, connector module 700 can be electrically connected to management module 200, which contacts both ends of connector module 700, and information and power can be directly transmitted to management module 200.

[0170] In addition, such as Figure 1 As shown, the relay module 300 can be disposed between the management module 200 and the electrostatic module 100, and the opposite ends of the relay module 300 can be configured to face the management module 200 and the electrostatic module 100 respectively.

[0171] At the same time, such as Figure 14 As shown, the electronic component module according to an embodiment of the present invention may include a connection module 400. The connection module 400 may be disposed between the management module 200 and the electrostatic module 100, and may be configured to overlap with the relay module 300 in a second direction or a first direction, and one end of the connection module 400 may contact the electrostatic module 100 in a third direction and the other end of the connection module 400 in a third direction.

[0172] Here, the connection module 400 may include a connection frame 410, a connection line 420, and a connector 430. The connection frame 410 may include an internal space in which the connection line 420 is disposed, and may be configured such that one side is open. When the housing 600 is connected, this open side may be closed by the inner wall of the housing 600.

[0173] In addition, the fixing part for fixing the connecting line 420 can be provided at the opposite end of the connecting frame 410, and the multiple connecting lines 420 can be arranged in the first direction or the second direction.

[0174] Additionally, connectors 430 can be respectively disposed at opposite outer ends of the connecting frame 410. One end or the other end of each connecting wire 420 in a third-direction orientation can be disposed inside the connector 430. The connector 430 can electrically connect the connecting wire 420 to the electrostatic module 100 or to the management module 200.

[0175] In other words, when the connection part 330 is configured to face the management module 200, the management module 200 and the electrostatic module 100 can be electrically connected to each other through the relay module 300 and the connection module 400. Depending on the specific situation, even if the connection module 400 fails, the electrical connection can be maintained through the relay module 300.

[0176] At the same time, refer to Figure 15 and Figure 16 To describe the frame module 500 according to an embodiment of the present invention, such as Figure 15 and Figure 16 As shown, the frame module 500 may include a cover 510, a leg 520, a partition 530, and a terminal slot 540.

[0177] Here, the cover portion 510 can contact the management module 200 and can be disposed between the relay module 300 and the management module 200. In addition, a terminal slot 540 for the aforementioned terminal pin 331 to pass through can be formed in the cover portion 510, and the terminal slot 540 and the through hole can be configured to overlap each other in the third direction.

[0178] In this case, the through hole can have a width relatively smaller than the width of the terminal slot 540. This may be because a portion of the connecting portion 330 is inserted into the terminal slot 540, but the invention is not necessarily limited to this.

[0179] Additionally, the relay module 300 and the connection module 400 can be housed within the frame module 500, and the relay module 300 can be housed within the frame module 500. Figure 16 In each partition space 531 divided by the partition 530 shown.

[0180] Here, the partition 530 can be provided in the form of a partition wall protruding from the cover 510 toward the electrostatic module 100, and a portion of the partition 530 can be configured to contact a portion of the relay module 300. Therefore, the relay module 300 can be fixed in the partition space 531, thereby preventing the relay module 300 from shaking during connection.

[0181] Additionally, at least two support legs 520 may be provided in the frame module 500, and the end of each support leg 520 may be inserted into the first hole 111 or the mounting portion 171.

[0182] Specifically, such as Figure 17As shown, the support leg 520 can be divided into a first support leg 521 and a second support leg 522. The first support leg 521 and the second support leg 522 can be arranged to be spaced apart from each other in a first direction or a second direction, and a plurality of relay modules 300 can be arranged between the first support leg 521 and the second support leg 522.

[0183] In this configuration, the first leg 521 can be inserted into the first hole 111, and the second leg 522 can be inserted into the mounting portion 171. Since the second leg 522 is inserted into the mounting portion 171 provided in the diversion portion 170, the second leg 522 can have a relatively shorter length than the first leg 521 in the third direction.

[0184] That is, the first leg 521 and the second leg 522 can have a length difference 524 as shown in the figure, and the length difference 524 can be the length from the bottom surface of the first hole 111 or the upper end surface of the busbar 120 to the bottom surface of the mounting part 171 in a third direction.

[0185] However, since the second leg 522 is inserted into the housing portion 171 instead of the first hole 111, and the housing portion 171 has a relatively smaller diameter than the first hole 111, the second leg 522 may include an insertion portion 523 protruding toward the electrostatic module 100 for insertion into the housing portion 171. The insertion portion 523 may protrude in a stepped manner from the end of the second leg 522.

[0186] At the same time, such as Figure 18 As shown, the multiple extensions 123 can have different cross-sectional areas.

[0187] Specifically, Figure 18 A cross-section of the extension 123 as seen from the left is shown, the cross-section referring to... Figure 4 Cut off from the top to the bottom. For example... Figure 18 As shown, one or more of the extensions 123 may have different areas from each other. This may be because the first width A1 of the first extension 123a and the second width A2 of the second extension 123b are different from each other.

[0188] More specifically, in order to efficiently transfer power from the battery, the current flow per unit time needs to be constant, and the current flow may vary depending on each component that consumes power. The current flow per unit time (in other words, the current density) needs to meet at least a predetermined level.

[0189] Therefore, according to an embodiment of the present invention, the second thickness T2 of the busbar 120 in the third direction can be greater than the first thickness T1 of the substrate 110 in the third direction. When the plurality of extensions 123 are arbitrarily classified as first extension 123a, second extension 123b, and third extension 123c, as... Figure 8 As shown, the first extension 123a may require a relatively low current density, and therefore may have a relatively small cross-sectional area compared to the second extension 123b and the third extension 123c. Since the second extension 123b may require a relatively high current density compared to the first extension 123a and the third extension 123c, the second extension 123b may have a large cross-sectional area.

[0190] Therefore, one or more of the plurality of extensions 123 according to the invention may have different cross-sectional areas.

[0191] At the same time, such as Figure 19 As shown, when the insertion part 523 is inserted into the placement part 171 of the diversion part 170, the bolt body can be inserted and fixed to the interior of the second leg 522. Threads can be formed on the outer surface of the bolt body, and corresponding threads can be formed on the inner surface of the second leg 522, so that the bolt body can be fixed to the second leg 522.

[0192] In this case, such as Figure 19 As shown, the diverter 170 can be positioned such that the insertion part 523 is inserted into the placement part 171. The surface of the diverter 170 opposite to the surface on which the insertion part 523 is placed can be formed to protrude so as to be inserted into the first hole 111.

[0193] Since a portion of the diverter 170 protrudes in this manner and is inserted into the first hole 111, the diverter 170 will not separate from the first hole 111 even when the bolt assembly becomes loose.

[0194] You can refer to this. Figure 20 and Figure 21 The following describes the application and examples of the electronic component module according to the embodiments of the present invention described above.

[0195] Specifically, Figure 20 This is a view illustrating the connection between an electronic component and a cooling plate according to an embodiment of the present invention. Figure 21 This is a view used to describe the busbars in a state where an electronic product component is connected to a cooling plate according to an embodiment of the present invention.

[0196] First, such as Figure 20As shown, with the electrostatic module 100, management module 200, relay module 300, connection module 400, frame module 500, connector module 700 and housing 600 connected together, the electronic product component 10 according to an embodiment of the present invention can be connected to the cooling plate 20 that is in contact with the electrostatic module 100.

[0197] Here, the cooling plate 20 may include an inlet and an outlet through which coolant is introduced and discharged, and a channel for coolant to move through may be formed inside the cooling plate 20.

[0198] Additionally, when the cooling plate 20 is provided, a terminal to be inserted into the second hole 121 of the extension 123 can be provided on one surface of the cooling plate 20 facing the electrostatic module 100. The number of second holes 121 in the extension 123 can correspond to the number of terminals.

[0199] In this arrangement, such as Figure 21 As shown, since the busbar 120 of the electrostatic module 100 is exposed on the bottom surface in a third-direction orientation, the busbar 120 can directly contact the cooling plate 20. Therefore, cooling air from the cooling plate 20 can be effectively transferred to the busbar 120, thereby effectively reducing the heat generated by the busbar 120.

[0200] Furthermore, as described above, the bolt head disposed in the second region 121b can be disposed only inside the second region 121b and will not protrude from the second region 121b in the third direction. Therefore, the bolt head will not contact one surface of the cooling plate 20, thereby solving the problem that the busbar 120 is lifted away from or separated from the cooling plate 20 due to the protrusion height of the bolt head.

[0201] In summary, in the electronic component module according to an embodiment of the present invention, the first terminal portion 122 and the second terminal portion 124 can be disposed on the same surface, and at least a portion of the extension portion 123 can be disposed on the same surface as the first terminal portion 122 and the second terminal portion 124. Furthermore, a plurality of busbars 120 can be arranged spaced apart from each other and can be connected to each other via connection terminals 310 inserted into the first hole 111, thereby providing the advantage of not requiring complex wiring harness connections.

[0202] Furthermore, since the substrate 110 and the busbar 120 are stacked in one direction, that is, stacked upwards in the third direction as described in the detailed description of the invention, one surface of the busbar 120 can be exposed and positioned to face the cooling plate 20. Therefore, the cooling air from the cooling plate 20 can be effectively transferred to the busbar 120.

[0203] In addition, by arranging the complex wire harnesses and the busbars 120 that originally required a three-dimensional arrangement on the same plane, the number of wire harnesses can be significantly reduced, and the space inefficiency caused by the three-dimensional arrangement of the busbars 120 can be effectively reduced.

[0204] While exemplary embodiments of the invention have been described above, it will be apparent to those skilled in the art that the invention may be practiced in other specific forms without departing from the spirit or scope thereof.

[0205] Therefore, the above embodiments are to be considered illustrative rather than restrictive, and the invention is not limited to the foregoing description, but can be modified within the scope of the appended claims and their equivalents.

Claims

1. An electronic product component, comprising: An electrostatic module includes a substrate having a plurality of first holes formed therein and a plurality of busbars attached to a surface of the substrate, and the electrostatic module is formed by stacking the substrate and the busbars in one direction; The management module is disposed on the side opposite to the plurality of busbars so as to face the substrate; as well as The relay module includes a pair of connection terminals inserted into the first hole and a connection portion connected to the management module or the electrostatic module. The plurality of busbars are arranged to be spaced apart from each other on one side of the substrate. The busbar includes a second hole formed at a position corresponding to the first hole. The relay module includes insulating components disposed between adjacent busbars and between the pair of connection terminals, and The substrate includes a slit located between at least a pair of adjacent first holes, into which the connecting terminal is inserted.

2. The electronic product component according to claim 1, wherein, The relay module is disposed between the electrostatic module and the management module. The connection terminal is configured to face the electrostatic module, and The connecting part is configured to face the management module.

3. The electronic product component according to claim 2, wherein, The connection includes a connection portion protruding toward the management module or the electrostatic module, and The management module or the electrostatic module includes a through hole, through which the connection portion passes.

4. The electronic product component of claim 3 further includes a connector, wherein the connection portion passing through the through hole is disposed in the connector, and the connector is configured such that the management module or the electrostatic module is inserted between the connector and the relay module.

5. The electronic product component according to claim 1, wherein, Each of the busbars includes one or more regions in a first direction, wherein the lengths of the one or more regions in a second direction are different from each other, the first direction extends from one side of the substrate toward its facing side, and the second direction is perpendicular to the first direction and extends from the other side of the substrate toward its facing side.

6. The electronic product component according to claim 5, wherein, The multiple busbars are divided into: A plurality of first terminal portions, each first terminal portion including an extension portion, the extension portion not overlapping the substrate in a third direction perpendicular to the first direction and the second direction; as well as A plurality of second terminal portions overlap the substrate in the third direction.

7. The electronic product component according to claim 6, wherein, The extension extends in a direction away from the substrate, and At least one cross-sectional area of ​​the plurality of extensions, taken in a direction perpendicular to the extension direction of the extensions of the plurality of first terminal portions that are different from each other, is different.

8. The electronic product component according to claim 1, wherein, Each of the second holes includes: The first region is configured to be adjacent to the first hole; and The second region is positioned further away from the first hole than the first region, and The diameter of the first region is smaller than the diameter of the second region.

9. The electronic product component according to claim 8, wherein, An insertion hole is provided in the connecting terminal, and the thread of the bolt component is inserted into the insertion hole. The thread of the bolt member passes through the first region and is inserted into the insertion hole, and The head of the bolt component is located in the second region.

10. The electronic product component according to claim 1, wherein, The thickness of the substrate in the third direction from the electrostatic module toward the management module is less than the thickness of the busbar in the third direction.

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