Sensor, preparation method, detection device and detection system

Abstract

The application relates to the technical field of biosensors, in particular to a sensor, a preparation method, a detection device and a detection system. The sensor comprises a connecting part, the connecting part comprises a substrate and a first electrode structure, the substrate has a first surface; the first electrode structure comprises a first electrode layer and a first insulating layer, wherein the first electrode layer is stacked on the first surface in the thickness direction of the substrate, and at least part of the first insulating layer is stacked on the first electrode layer in the thickness direction of the substrate; the first electrode layer has a plurality of first holes, the first insulating layer has a plurality of second holes, the second holes penetrate through the first insulating layer, and at least part of the first holes and at least part of the second holes are communicated. When the connecting part is bonded with a shell, glue can enter the first holes and the second holes, and the force generated by the shrinkage of the glue in the first holes and the second holes can reduce the cracking risk of the connecting part, ensure the integrity of the structure of the connecting part, and improve the reliability of the working of the sensor.

Description

Technical Field

[0001] This application relates to the field of biosensor technology, and in particular to a sensor, preparation method, detection device and detection system. Background Technology

[0002] A biosensor is a system that can detect biological substances and convert their concentration into an electrical signal. Among them, glucose sensors can detect the glucose concentration in the tissue fluid or blood of an organism and are widely used because they can conveniently obtain the blood glucose level in an organism.

[0003] Currently, implantable glucose sensors generally possess excellent flexibility, biocompatibility, and comfortable wear. They can be implanted into the body with assistive devices and achieve continuous monitoring for more than 14 days. Implantable glucose sensors typically consist of multilayered materials; for example, they can be based on a flexible polymer substrate, with multiple layers of conductive electrodes and insulating dielectrics printed on it, and then assembled layer by layer to form a multilayered stacked structure. However, because implantable glucose sensors are usually multilayered stacked structures with distinct interfaces between layers, the stacked structure has poor resistance to deformation under external forces, making it prone to problems such as interlayer misalignment, cracking, and intralayer bending fractures. This affects the current response of the entire sensor system, leading to a decrease in the sensor's operational reliability. Summary of the Invention

[0004] This application provides a sensor, a preparation method, a detection device, and a detection system. By providing a communicating hole in the electrode structure of the connector, when the connector is bonded to the housing, the adhesive can enter the hole. The force generated by the curing of the adhesive in the hole can balance the force generated by the curing of the adhesive on the outside of the connector, thus preventing the stacked structure of the connector from cracking.

[0005] A first aspect provides a sensor including a connector, the connector comprising: a substrate having a first surface; a first electrode structure including a first electrode layer and a first insulating layer, wherein the first electrode layer is stacked on the first surface along the thickness direction of the substrate, and at least a portion of the first insulating layer is stacked on the first electrode layer along the thickness direction of the substrate; the first electrode layer has a plurality of first holes, and the first insulating layer has a plurality of second holes, the second holes penetrating the first insulating layer, and at least a portion of the first holes communicating with at least a portion of the second holes.

[0006] In this embodiment, the second hole penetrates the first insulating layer, and the first hole and the second hole are connected. When the connector is bonded to the housing, the adhesive enters the first hole and the second hole. The curing and shrinkage of the adhesive between the connector and the housing will exert a tensile force away from the connector on the connector. Meanwhile, the curing and shrinkage of the adhesive in the first hole and the second hole will generate a shrinkage force towards the connector. The shrinkage force towards the connector will balance part or all of the tensile force away from the connector, thereby eliminating or reducing the external force on the internal stacked structure of the connector, thereby reducing the internal stress of the internal stacked structure of the connector, avoiding cracking of the stacked structure caused by the shrinkage of the adhesive on the outside of the connector, ensuring the integrity of the connector structure, improving the waterproof effect of the sensor (e.g., IPX8 waterproof rating), and improving the reliability of the sensor operation.

[0007] The first electrode layer includes multiple electrode stripes, which are arranged at intervals with multiple first holes to form a mesh structure; the first insulating layer includes multiple insulating stripes, which are arranged at intervals with multiple second holes to form a mesh structure.

[0008] In the above implementation, the electrode stripes and the first hole are arranged at intervals to form a mesh structure, and the insulating stripes and the second hole are arranged at intervals to form a mesh structure. This can disperse the intralayer stress of the first electrode layer and the first insulating layer and avoid structural damage caused by stress concentration.

[0009] In some possible implementations of the first aspect, the projection of each electrode stripe onto the substrate lies within the projection of an insulating stripe onto the substrate.

[0010] In the above implementation, the projection of the electrode stripes onto the substrate can be located within the projection of the insulating stripes onto the substrate, or they can coincide with the projection of the insulating stripes onto the substrate. That is, each electrode stripe corresponds to one insulating stripe, and the outline size of the electrode stripe is less than or equal to the size of the insulating stripe. In this way, the insulating isolation effect of the first insulating layer on the first electrode layer can be ensured.

[0011] In some possible implementations of the first aspect, each insulating stripe includes a first portion stacked on the electrode stripe and a second portion located on both sides of the electrode stripe, the first portion and the second portion being integrally connected.

[0012] In the above implementation, the insulating stripes can also cover the electrode stripes. That is, except for the electrode stripes that are in contact with the first surface, the rest of the electrode stripes are wrapped by the insulating stripes. The insulating stripes and the electrode stripes form a whole, which can improve the bonding strength between the first insulating layer and the first electrode layer, prevent the first electrode structure from cracking, and improve the bending resistance of the sensor.

[0013] In some possible implementations of the first aspect, the width of the electrode stripes is 20 μm-300 μm; and / or, the width of the insulating stripes is 20 μm-300 μm.

[0014] In the above implementation, a width of 20μm-300μm for the electrode stripes ensures the conductivity and structural strength of the first electrode layer. Similarly, a width of 20μm-300μm for the insulating stripes ensures the isolation and structural strength of the first insulating layer. It can be understood that the widths of the electrode stripes and the insulating stripes can be the same or different.

[0015] In some possible implementations of the first aspect, the first hole is a regular polygonal hole with a side length of 5μm-100μm; or, the first hole is a circular hole with a diameter of 5μm-100μm.

[0016] In the above implementation, when the first hole is a regular polygonal hole, the side length of the regular polygon is 5μm-100μm, or when the first hole is a circular hole, the diameter of the circle is 5μm-100μm, which can avoid the decrease in the strength of the first electrode layer structure caused by the size of the first hole being too large.

[0017] In some possible implementations of the first aspect, the substrate further has a second surface opposite to the first surface; the connecting portion further includes a second electrode structure and a third electrode structure, the second electrode structure including a second electrode layer and a second insulating layer, and the third electrode structure including a third electrode layer and a third insulating layer; the second electrode layer is stacked on the second surface along the thickness direction of the substrate, and at least a portion of the second insulating layer is stacked on the second electrode layer along the thickness direction of the substrate; the third electrode layer is stacked on the second insulating layer along the thickness direction of the substrate, and at least a portion of the third insulating layer is stacked on the third electrode layer along the thickness direction of the substrate; the second electrode layer has a plurality of third holes, the second insulating layer has a plurality of fourth holes penetrating the second insulating layer, the third electrode layer has a plurality of fifth holes penetrating the third electrode layer, and the third insulating layer has a plurality of sixth holes penetrating the third insulating layer, and at least a portion of the third holes, at least a portion of the fourth holes, at least a portion of the fifth holes, and at least a portion of the sixth holes are connected.

[0018] In the above implementation, by setting interconnected third, fourth, fifth, and sixth holes, when the connecting part is bonded to the housing, the adhesive will enter the third, fourth, fifth, and sixth holes. The curing and shrinkage of the adhesive between the connecting part and the housing will exert a tensile force away from the connecting part. Meanwhile, the curing and shrinkage of the adhesive in the third, fourth, fifth, and sixth holes will generate a shrinkage force towards the connecting part. The shrinkage force towards the connecting part will balance part or all of the tensile force away from the connecting part, thereby eliminating or reducing the external force on the internal stacked structure of the connecting part, thereby reducing the internal stress of the internal stacked structure of the connecting part, avoiding cracking of the stacked structure caused by the shrinkage of the adhesive on the outside of the connecting part, ensuring the integrity of the connecting part structure, improving the waterproof effect of the sensor, and improving the reliability of the sensor operation.

[0019] In some possible implementations of the first aspect, the connecting portion is provided with multiple through holes penetrating the first electrode structure, the substrate, the second electrode structure, and the third electrode structure.

[0020] In the above implementation, by setting multiple through holes in the connecting part, the amount of glue entering the connecting part is increased because the through holes can hold glue, thereby further reducing the external force on the internal stacked structure of the connecting part.

[0021] In some possible implementations of the first aspect, the projection of the through hole onto the substrate at least partially coincides with the projection of the second hole onto the substrate; and / or, the projection of the through hole onto the substrate at least partially coincides with the projection of the sixth hole onto the substrate.

[0022] In the above implementation, the projection of the through hole on the substrate at least partially coincides with the projection of the second hole and / or the sixth hole on the substrate. That is, the location of the through hole can be the location of the hole in the electrode structure. This can increase the amount of adhesive entering the connector while avoiding the decrease in the structural strength of the connector caused by the through hole.

[0023] In some possible implementations of the first aspect, the substrate material includes at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), or polyimide (PI).

[0024] In the above implementation, the substrate can be made of flexible materials such as polyethylene terephthalate, polyethylene naphthalate, polycarbonate, or polyimide, thereby making the connection part flexible and improving the wearing comfort of the sensor.

[0025] In some possible implementations of the first aspect, the material of the first electrode layer includes carbon; and / or, the material of the first insulating layer includes at least one of an acrylic acid compound and an ultraviolet photoinitiator.

[0026] In the above implementation, the material of the first electrode layer includes carbon, which can reduce the cost of the sensor. The material of the first insulating layer includes acrylic compounds and ultraviolet photoinitiators, which can make the sensor have good biocompatibility. Furthermore, the first insulating layer can be cured by ultraviolet light irradiation during processing, simplifying the processing technology of the first insulating layer and reducing the processing cost of the sensor.

[0027] In some possible implementations of the first aspect, the thickness of the substrate is 10 μm-200 μm; the thickness of the first electrode layer is 5 μm-20 μm; and the thickness of the first insulating layer is 5 μm-40 μm.

[0028] In the above implementation, the thickness of the substrate, the thickness of the first electrode layer, and the thickness of the first insulating layer can be selected according to actual needs, thereby improving the flexibility of sensor structure design.

[0029] In some possible implementations of the first aspect, the water droplet angle of the first surface is 20-40°; and / or, the water droplet angle of the second surface is 20-40°.

[0030] In the above implementation, the water droplet angle of the first surface and / or the second surface is 20-40°, which can improve the bonding strength between the first electrode layer and the second electrode layer and the substrate, making the multi-layer stacked structure of the connection part less prone to cracking and improving the reliability of the sensor.

[0031] In some possible implementations of the first aspect, the first hole and the second hole are used to fill the glue.

[0032] In the above implementation, the first hole and the second hole are used to fill the glue. The force generated by the curing and shrinkage of the glue in the first hole and the second hole can balance the force generated by the curing of the glue on the outside of the joint, thus preventing the stacked structure of the joint from cracking.

[0033] In some possible implementations of the first aspect, through holes are used to fill adhesive.

[0034] In the above implementation, the through hole is used to fill the glue. The force generated by the curing and shrinkage of the glue in the through hole can balance the force generated by the curing of the glue on the outside of the joint, thus preventing the stacked structure of the joint from cracking.

[0035] In some possible implementations of the first aspect, the adhesive contains an anti-shrinkage material.

[0036] In the above implementation method, the adhesive contains anti-shrinkage materials, which can reduce the shrinkage rate of the adhesive during curing, thereby reducing the force exerted on the joint by the adhesive during curing.

[0037] In some possible implementations of the first aspect, the anti-shrinkage material includes at least one of calcium carbonate, talc, and mica powder.

[0038] In the above implementation method, the anti-shrinkage material can be calcium carbonate, talc powder, or mica powder, thereby reducing the cost of the adhesive.

[0039] In some possible implementations of the first aspect, the proportion of anti-shrinkage material is 10%-25%.

[0040] In the above implementation method, the proportion of anti-shrinkage material is 10%-25%, which can reduce the shrinkage rate of the adhesive while ensuring the bonding effect of the adhesive.

[0041] Secondly, embodiments of this application provide a method for fabricating a sensor. The sensor includes a connecting portion, which includes a substrate and a first electrode structure. The first electrode structure includes a first electrode layer and a first insulating layer. The method includes: providing a substrate having a first surface; laying a grid-like electrode slurry on the first surface; performing a first curing treatment on the electrode slurry under a first curing condition; laying a grid-like insulating slurry on the electrode slurry after the first curing treatment; and performing a second curing treatment on the insulating slurry under a second curing condition to obtain a first electrode layer and a first insulating layer at least partially stacked on the first electrode layer. The first electrode layer has a plurality of first holes, and the first insulating layer has a plurality of second holes, the second holes penetrating the first insulating layer, and at least a portion of the first holes communicating with at least a portion of the second holes.

[0042] In this embodiment of the application, the above methods can simplify the sensor manufacturing process, improve the sensor manufacturing efficiency, and reduce the sensor processing cost.

[0043] In some possible implementations of the second aspect, the electrode slurry includes carbon slurry and insulating slurry (also referred to as insulating oil); the electrode slurry is subjected to a first curing treatment under a first curing condition, including: the electrode slurry is subjected to a first curing treatment under the first curing condition so that the carbon slurry in the electrode slurry is completely cured and the insulating slurry in the electrode slurry is initially cured; the insulating slurry is subjected to a second curing treatment under a second curing condition to obtain a first electrode layer and a first insulating layer at least partially laminated on the first electrode layer, including: the insulating slurry is subjected to a second curing treatment under the second curing condition so that the insulating slurry in the electrode slurry is completely cured to obtain the first electrode layer, and the insulating slurry laid on the electrode slurry is completely cured to obtain a first insulating layer at least partially laminated on the first electrode layer.

[0044] In the above implementation, when the electrode paste includes an insulating paste, the insulating paste in the electrode paste is not completely cured during the first curing treatment. After the insulating paste is printed on the electrode paste after the first curing treatment, the insulating paste in the electrode paste and the insulating paste laid on the electrode paste are cured simultaneously through the second curing treatment. This can improve the bonding strength between the first electrode layer and the first insulating layer formed after curing, thereby making it less prone to cracking between the first electrode layer and the first insulating layer.

[0045] In some possible implementations of the second aspect, the electrode paste also includes a diluent, wherein the proportion of carbon paste in the electrode paste is 98%-99.5%, the proportion of insulating paste in the electrode paste is 0-1.5%, and the proportion of diluent in the electrode paste is 0-0.5%.

[0046] In the above implementation method, by mixing carbon paste with insulating paste monomers and diluent in a certain proportion and then performing a curing treatment, the bonding strength between the first insulating layer and the first electrode layer can be improved while ensuring that the conductivity of the cured first electrode layer is not affected.

[0047] In some possible implementations of the second aspect, the carbon paste composition includes 10%-20% graphite, 10%-20% carbon black, resin, and 50%-70% solvent.

[0048] In the above implementation, graphite itself has good conductivity, while carbon black has even higher conductivity and stability. In the carbon paste, the combination of graphite and carbon black can form a continuous conductive network, improving the conductivity of the carbon paste. The resin acts as a binder in the carbon paste, binding conductive particles such as graphite and carbon black together to form a uniform conductive film. Simultaneously, the resin also improves the adhesion between the carbon paste and the substrate, allowing the carbon paste to better adhere to the substrate surface. The solvent reduces the viscosity of the carbon paste, making it easier to coat.

[0049] In some possible implementations of the second aspect, the first curing condition is curing at 100℃-150℃ for 10min-30min; the second curing condition is ultraviolet irradiation with a preset energy under a protective atmosphere.

[0050] In the above implementation, the first curing condition can cross-link the resin, and the second curing condition can cure the insulating slurry, thereby obtaining a first electrode layer and a first insulating layer with a certain structural strength.

[0051] In some possible implementations of the second aspect, before laying the grid-like electrode paste on the first surface, the method further includes: performing a surface modification treatment on the first surface to increase the surface energy of the first surface.

[0052] In the above implementation, by performing surface modification treatment on the first surface, the surface energy of the first surface can be increased, the bonding strength between the first electrode layer and the first surface can be improved, and the first electrode layer and the first surface are less prone to cracking.

[0053] Thirdly, embodiments of this application provide a detection device, including a housing and a sensor as provided in the first aspect, wherein a connecting portion of the sensor is bonded to the housing.

[0054] Fourthly, embodiments of this application provide a detection system, including a detection device and an electronic device as described in the third aspect, wherein the detection device and the electronic device are communicatively connected.

[0055] The beneficial effects of the third and fourth aspects can be found in the beneficial effects achievable by any implementation of the first aspect, and will not be repeated here. Attached Figure Description

[0056] Figure 1A According to some embodiments of this application, an exemplary application scenario of a detection system is shown;

[0057] Figure 1B According to some embodiments of this application, the structure of a detection device is shown;

[0058] Figure 1C A schematic diagram of the sensor structure is shown;

[0059] Figure 1D According to some embodiments of this application, a cross-sectional structural schematic diagram of a connecting part is shown;

[0060] Figure 2A According to some embodiments of this application, a schematic diagram of the structure of a sensor is shown;

[0061] Figure 2B According to some embodiments of this application, a structural schematic diagram of a connecting portion is shown;

[0062] Figure 2C According to some embodiments of this application, a schematic diagram of the structure of a first electrode layer is shown;

[0063] Figure 2D According to some embodiments of this application, a schematic diagram of the structure of a first insulating layer is shown;

[0064] Figure 2E According to some embodiments of this application, a schematic diagram of a stacked structure of a first electrode structure and a substrate is shown;

[0065] Figure 2F According to some embodiments of this application, a schematic diagram of another stacked structure of the first electrode structure and the substrate is shown;

[0066] Figure 2G According to some embodiments of this application, a schematic diagram of interlayer forces after an electrode structure is subjected to external force is shown;

[0067] Figure 2H According to some embodiments of this application, a schematic diagram of interlayer forces after an electrode structure is subjected to external force is shown;

[0068] Figure 2I According to some embodiments of this application, a schematic diagram of force analysis of a connection part is shown;

[0069] Figure 3 According to some embodiments of this application, a schematic diagram of another connecting portion is shown;

[0070] Figure 4 According to some embodiments of this application, a bottom view structural schematic diagram of a connecting part is shown;

[0071] Figure 5 According to some embodiments of this application, a bottom view structural schematic diagram of another connecting part is shown;

[0072] Figure 6 According to some embodiments of this application, a schematic flowchart of a method for fabricating a sensor is shown. Detailed Implementation

[0073] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0074] The detection system provided in this application embodiment may include a detection device 100 and an electronic device 200. The detection device 100 can communicate with the electronic device 200 through a wired communication link (e.g., optical fiber, twisted pair, etc.) or a wireless communication link (e.g., Bluetooth, near field communication (NFC), etc.).

[0075] Electronic device 200 can be a mobile phone, smart TV, wearable device, tablet computer, desktop computer, laptop computer, virtual reality (VR) device, augmented reality (AR) device, terminal in industrial control, terminal in self-driving, terminal in remote medical surgery, terminal in smart grid, terminal in transportation safety, terminal in smart city, terminal in smart home, etc. This application does not limit the specific form of electronic device 200.

[0076] For example, the wearable device in the embodiments of this application can be a wired headphone, a wireless headphone (e.g., a TWS Bluetooth headphone, a neckband Bluetooth headphone, or a headband Bluetooth headphone), a smartwatch, a smart bracelet, smart glasses, a smart ankle bracelet, a smart ring, a smart necklace, an augmented reality (AR) device, a virtual reality (VR) device, etc. This application does not impose any special restrictions on the specific form of the wearable device.

[0077] The detection device 100 provided in this application embodiment is used to detect and quantify a variety of substances, including but not limited to acetylcholine, amylase, bilirubin, cholesterol, human chorionic gonadotropin, creatine kinase (e.g., CK-MB), creatine, deoxyribonucleic acid (DNA), ribonucleic acid (RNA), fructosamine, glucose, glutamine, hormones, ketones (e.g., ketone bodies), lactate, oxygen, peroxides, prostate-specific antigen, prothrombin, thyroid-stimulating hormone, and troponin. It can also determine the concentration of drugs, which may be, but are not limited to, antibiotics (e.g., gentamicin, vancomycin, etc.), digoxin, anesthetics, theophylline, and warfarin.

[0078] The detection device 100 can send the detection results to the electronic device 200 via a communication link for data display or analysis. For example, the detection device 100 can be connected to an electronic device 200 with a display screen, such as a mobile phone or a watch. By sending the detection results to the electronic device 200, the electronic device 200 can display the detection results or an analysis report based on the detection results.

[0079] The following uses an electronic device 200 as a watch and a detection device 100 for detecting glucose as an example to introduce the technical solution provided in the embodiments of this application.

[0080] Figure 1A An exemplary application scenario of a detection system is shown, such as Figure 1A As shown, the scenario includes a detection device 100 and a watch. The watch can establish a communication connection with the detection device 100 and display the results from the detection device 100 on its screen, or display health analysis reports, health suggestions, etc., based on the detection results. Taking blood glucose concentration as an example, an application (APP) with blood glucose measurement function can be installed on the watch, such as a sports and health app or a blood glucose monitoring application provided by a third-party platform.

[0081] Continue to refer to Figure 1A Users can wear the detection device 100 on certain parts of their body, such as... Figure 1A The upper arm shown, or areas with abundant subcutaneous fat tissue such as the user's abdomen, are suitable for implantation of the sensor 100a in the detection device 100, and are convenient and discreet to wear; therefore, no restrictions are imposed. After the sensor 100a probe is implanted into the user's skin, the detection device 100 can detect glucose molecules in the tissue fluid and generate an electrical signal. The electrical signal generated by the detection device 100 can be transmitted to the watch as a result of measuring blood glucose concentration. After receiving the detection result sent by the detection device 100, the sports and health apps installed on the watch can display the detection result, or display blood glucose measurement results, health analysis reports, health suggestions, etc., determined based on the detection result analysis; therefore, no restrictions are imposed.

[0082] The detection device 100 provided in this application is described below with reference to the accompanying drawings.

[0083] Figure 1B The structure of a detection device 100 is shown, with reference to Figure 1B The detection device 100 may include a housing 100b and a sensor 100a. The housing 100b is used to mount and fix the sensor 100a and can protect the sensor 100a.

[0084] For example, Figure 1C The structure of a sensor 100a is shown, with reference to Figure 1CThe sensor 100a may include an implantation portion 110, a cantilever portion 140, a connecting portion 130, and an interface portion 120. In the figure, the X direction can be the length direction of the connecting portion 130 in the sensor 100a, and the Y direction can be the width direction of the connecting portion 130. The implantation portion 110 is the electrochemical functional region in the sensor 100a. The implantation portion 110 can be implanted into a target monitoring location of a biological body (e.g., a fat-rich area of ​​the arm or the skin of the abdomen). The implantation portion 110 can detect the glucose concentration in tissue fluid based on electrochemical principles to achieve the detection of blood glucose concentration in the biological body. One end of the implantation portion 110 along its length direction can be connected to the cantilever portion 140. Optionally, the implantation portion 110 and the cantilever portion 140 can be integrally connected or detachably connected; this embodiment does not limit this. In some embodiments, the sensor 100a may not include the implantation portion 110, that is, the implantation portion 110 can be a separate component, which can be connected to the cantilever portion 140 during use. The cantilever portion 140 serves as a connecting bridge between the implantation portion 110 and the external structure (i.e., the non-implantable structure) of the sensor 100a, and assists in fixing the implantation portion 110. After the implantation portion 110 is implanted into the body, it can maintain a relatively fixed position and orientation, preventing the implantation portion 110 from shaking or shifting and affecting detection. The connecting portion 130 is used to connect the cantilever portion 140 and the interface portion 120, and the connecting portion 130 can achieve connection with the housing 100b. For example, the connecting portion 130 can be connected to the housing 100b by dispensing adhesive to form a sealed interface, ensuring the sensor's waterproof and vapor-proof performance. The interface portion 120 is used to connect a signal processing module (not shown in the figure). The signal processing module can be a microcontroller, digital signal processor (DSP), etc. The electrical signal generated after the implantation portion 110 detects glucose can be transmitted to the signal processing module for processing through the interface portion 120. The sensor 100a is connected to the hardware PCB through a connector to realize the reception and processing of electrical signals. The sidewall of the interface portion 120 can also be connected and fixed to the housing 100b. As an example, the housing 100b may be provided with a snap-fit ​​structure (e.g., a slot), in which the sidewall of the interface portion 120 can snap into the snap-fit ​​structure.

[0085] Both the cantilever portion 140 and the connecting portion 130 are multi-layered stacked structures. Taking the connecting portion 130 as an example, the connecting portion 130 may include a counter electrode structure (as an example of a first electrode structure), a working electrode structure (as an example of a second electrode structure), and a reference electrode structure (as an example of a third electrode structure). Specifically, Figure 1D A cross-sectional structure of a connecting portion 130 is shown. In the figure, the Z direction can be the thickness direction of the connecting portion 130. (Reference) Figure 1DThe connecting portion 130 may include a substrate 131, which has a first surface and a second surface opposite to each other along the thickness direction. A counter electrode structure is disposed on the first surface, and a working electrode structure and a reference electrode structure are disposed on the second surface. The first electrode structure may include a first electrode layer 132 and a first insulating layer 133. The first electrode layer 132 is stacked along the thickness direction on the first surface, and the first insulating layer 133 is stacked along the thickness direction on the surface of the first electrode layer 132 opposite to the substrate 131. The second electrode structure includes a second electrode layer 134 and a second insulating layer 135. The third electrode structure includes a third electrode layer 136 and a third insulating layer 137. The second electrode layer 134, the second insulating layer 135, the third electrode layer 136, and the third insulating layer 137 are stacked sequentially along the thickness direction, wherein the second electrode layer 134 is stacked along the thickness direction on the second surface.

[0086] refer to Figure 1D As shown, the distinct interfaces between layers in the aforementioned multi-layered stacked structure result in poor resistance to deformation under external forces, making it prone to problems such as interlayer misalignment, cracking, and intralayer bending fracture. Furthermore, the connecting portion 130 is often fixed to the housing 100b by adhesive bonding. For example, the connecting portion 130 and the housing 100b are fixed by dispensing adhesive, forming a sealed interface between them. However, when the connecting portion 130 is bonded to the housing 100b using adhesive 100c, the curing shrinkage of the adhesive 100c generates significant internal stress at the layered interface of the connecting portion 130. This internal stress can cause fine cracks and defects in the electrode layer, forming delamination cracking sites, affecting the current transmission from the implanted portion 110 to the interface portion 120, thereby reducing the operational reliability of the sensor 100a.

[0087] In view of this, this application provides a sensor 100a, which includes a connecting portion 130. The connecting portion 130 includes a substrate 131 and a first electrode structure. The substrate 131 has a first surface. The first electrode structure includes a first electrode layer 132 and a first insulating layer 133. The first electrode layer 132 is stacked on the first surface along the thickness direction of the substrate. At least a portion of the first insulating layer 133 is stacked on the first electrode layer 132 along the thickness direction of the substrate. The first electrode layer 132 has a plurality of first holes 132a. The first insulating layer 133 has a plurality of second holes 133a. The second holes 133a penetrate the first insulating layer, and at least a portion of the first holes 132a communicates with at least a portion of the second holes 133a. Thus, when the connecting portion 130 is bonded to the housing 100b, adhesive 100c can enter the holes to balance the force generated by the curing shrinkage of the adhesive 100c on the outside of the connecting portion 130, thereby reducing the internal stress at the layer interface and preventing cracking of the stacked structure of the connecting portion 130.

[0088] It is understandable that when the connecting part 130 is bonded to the housing 100b, the adhesive 100c will enter the first hole 132a and the second hole 133a. The curing and shrinkage of the adhesive 100c between the connecting part 130 and the housing 100b will exert a tensile force on the connecting part 130 away from the connecting part 130. Meanwhile, the curing and shrinkage of the adhesive 100c in the first hole 132a and the second hole 133a will generate a shrinkage force towards the connecting part 130. The shrinkage force towards the connecting part 130 will balance part or all of the tensile force away from the connecting part 130, thereby eliminating or reducing the external force on the internal stacked structure of the connecting part 130, thereby reducing the internal stress of the internal stacked structure of the connecting part 130, avoiding the cracking of the stacked structure of the connecting part 130 caused by the shrinkage of the outer adhesive 100c, ensuring the integrity of the connecting part 130 structure, improving the waterproof effect of the sensor 100a, and improving the reliability of the sensor 100a.

[0089] Figure 2A The structure of a sensor 100a is shown, with reference to Figure 2A The sensor 100a includes a connecting part 130, which has multiple small holes (i.e., a first hole 132a and a second hole 133a that are connected). The small holes can hold glue 100c. The force generated by the curing and shrinkage of the glue 100c in the small holes can balance the force generated by the curing and shrinkage of the glue 100c outside the connecting part 130, thereby reducing the internal stress inside the connecting part 130, preventing the stacked structure at the connecting part 130 from cracking under stress, ensuring the integrity of the connecting part 130 structure, and improving the reliability of the sensor 100a.

[0090] Specifically, Figure 2B A structure of a connecting part 130 is shown, with reference to Figure 2B The connecting portion 130 includes a substrate 131 and a first electrode structure, a second electrode structure, and a third electrode structure. The substrate 131 has a first surface and a second surface that are opposite to each other along its thickness direction (i.e., the Z direction). The first electrode structure is stacked on the first surface along the Z direction, the second electrode structure is stacked on the second surface along the Z direction, and the third electrode structure is stacked on the surface of the second electrode structure that is opposite to the substrate 131.

[0091] The substrate 131 provides support for the electrode structure and isolates different electrode structures. Optionally, the substrate 131 can be a flexible substrate. The flexible substrate allows the connector 130 to be flexible and bendable, thereby improving the wearing comfort of the sensor 100a. The material of the substrate 131 can be a flexible thin film material; optionally, the material of the substrate 131 includes, but is not limited to, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, or polyimide. The thickness of the substrate 131 is 10 μm-200 μm.

[0092] refer to Figure 2B As shown, the first electrode structure includes a first electrode layer 132 and a first insulating layer 133. The first electrode layer 132 is stacked along the Z direction on a first surface, and the first insulating layer 133 is stacked along the Z direction on the surface of the first electrode layer 132 facing away from the substrate 131. The first electrode layer 132 has a plurality of first holes 132a, and the first insulating layer 133 has a plurality of second holes 133a. At least some of the first holes 132a are connected to at least some of the second holes 133a.

[0093] It is understood that the first hole 132a may or may not penetrate the first electrode layer 132. The second hole 133a may penetrate the first insulating layer 133. "At least some of the first holes 132a are connected to at least some of the second holes 133a" means that some of the first holes 132a are connected to some or all of the second holes 133a, and all of the first holes 132a are connected to some or all of the second holes 133a. The number of first holes 132a and the number of second holes 133a may be the same or different. For example, the first electrode layer 132 may have 10 first holes 132a, and the first insulating layer 133 may have 12 second holes 133a; the 10 first holes 132a may be connected to the 10 second holes 133a. Alternatively, 8 first holes 132a may be connected to 8 second holes 133a. The connection between the first hole 132a and the second hole 133a means that for any pair of connected first holes 132a and second holes 133a, the projection of the first hole 132a onto the substrate 131 and the projection of the second hole 133a onto the substrate 131 at least partially overlap.

[0094] The first surface can be a surface that has undergone surface modification treatment. Optionally, the surface modification treatment of the first surface includes, but is not limited to, plasma treatment, ultrasonic cleaning, or chemical treatment. Optionally, the water droplet angle of the first surface after surface modification treatment is 20°-40°, for example, 30°, 32°, etc. By performing surface modification treatment on the first surface, the surface energy of the first surface can be increased, the bonding strength between the first electrode layer 132 and the first surface can be improved, and the first electrode layer 132 and the first surface are less prone to cracking.

[0095] The first electrode layer 132 can be the counter electrode in the sensor 100a. The first electrode layer 132 is made of a conductive material. Optionally, the material of the first electrode layer 132 can be carbon, or metals such as copper, aluminum, silver, titanium, molybdenum, gold, platinum, tungsten, and nickel, or alloys containing the above metals. The thickness of the first electrode layer 132 can be 5μm-20μm.

[0096] The first electrode layer 132 has a mesh structure. Specifically, the first electrode layer 132 includes multiple electrode stripes 132b, which are arranged alternately with multiple first holes 132a to form a mesh structure. In other words, the multiple electrode stripes 132b are arranged in a crisscross pattern to form multiple first holes 132a. Optionally, the shape of the first hole 132a can be circular, elliptical, polygonal, etc.

[0097] As an example, Figure 2C A structure of a first electrode layer 132 is shown, with reference to Figure 2C The first electrode layer 132 may include a plurality of electrode stripes 132b spaced apart along a first direction (e.g., the X direction) and a plurality of electrode stripes 132b spaced apart along a second direction (e.g., the Y direction). Any electrode stripe 132b arranged along the first direction may intersect with some or all of the electrode stripes 132b arranged along the second direction. Similarly, any electrode stripe 132b arranged along the second direction may intersect with some or all of the electrode stripes 132b arranged along the first direction. Thus, the electrode stripes 132b arranged along the first direction and the electrode stripes 132b arranged along the second direction can form a plurality of first holes 132a.

[0098] Figure 2C In the structure of the first electrode layer 132 shown, the first direction and the second direction can be perpendicular or intersecting. In some embodiments, the first direction and the second direction can have other angles, such as a 45° angle. It is understood that the arrangement of the electrode stripes 132b in the first electrode layer 132 is related to the shape of the first hole 132a. Different shapes of first holes 132a correspond to different arrangements of the electrode stripes 132b. Therefore, the arrangement of the electrode stripes 132b in the first electrode layer 132 can be designed according to the shape of the first hole 132a. In practical applications, the first electrode layer 132 can be printed on the first surface using a first grid-like template.

[0099] The shapes of the multiple first holes 132a can be the same or different. The dimensions of the first holes 132a can be designed according to their shapes. For example, when the first hole 132a is a regular polygonal hole, the side length of the regular polygonal hole is 5μm-100μm. As another example, when the first hole 132a is a circular hole, the diameter of the circular hole is 5μm-100μm.

[0100] The material of the first insulating layer 133 is used to protect the first electrode layer 132. The material of the first insulating layer 133 is an insulating material, such as an acrylic compound, an ultraviolet (UV) photoinitiator, etc. The thickness of the first insulating layer 133 can be 5μm-40μm.

[0101] The first insulating layer 133 also has a mesh structure. Specifically, the first insulating layer 133 includes multiple insulating stripes 133b, which are arranged alternately with multiple second holes 133a to form a mesh structure. In other words, the multiple insulating stripes 133b are arranged in a crisscross pattern to form multiple second holes 133a. Optionally, the shape of the second holes 133a can be circular, elliptical, polygonal, etc.

[0102] As an example, Figure 2D A structure of a first insulating layer 133 is shown, with reference to Figure 2D The first insulating layer 133 may include a plurality of insulating stripes 133b spaced apart along a first direction (e.g., the X direction) and a plurality of insulating stripes 133b spaced apart along a second direction (e.g., the Y direction). Any insulating stripe 133b arranged along the first direction may intersect with some or all of the insulating stripes 133b arranged along the second direction. Similarly, any insulating stripe 133b arranged along the second direction may intersect with some or all of the insulating stripes 133b arranged along the first direction. Thus, the insulating stripes 133b arranged along the first direction and the insulating stripes 133b arranged along the second direction can form a plurality of second holes 133a.

[0103] Figure 2D In the structure of the first insulating layer 133 shown, the first direction and the second direction can be perpendicular or intersecting. In some embodiments, the first direction and the second direction can have other angles, such as a 45° angle. It can be understood that the arrangement of the insulating stripes 133b in the first insulating layer 133 is related to the shape of the second hole 133a. Different shapes of second holes 133a correspond to different arrangements of the insulating stripes 133b. Therefore, the arrangement of the insulating stripes 133b in the first insulating layer 133 can be designed according to the shape of the second hole 133a. In practical applications, the first insulating layer 133 can be printed on the first electrode layer 132 using a second mesh template. Optionally, the second mesh template is the same as the first mesh template, so that the same first mesh structure and second mesh structure can be printed, and along the Z direction, each first hole 132a corresponds to one second hole 133a.

[0104] The shapes of the multiple second holes 133a can be the same or different. The dimensions of the second holes 133a can be designed according to their shapes. For example, when the second hole 133a is a regular polygonal hole, the side length of the regular polygonal hole is 5μm-100μm. As another example, when the second hole 133a is a circular hole, the diameter of the circular hole is 5μm-100μm.

[0105] The electrode stripes 132b in the first electrode layer 132 and the insulating stripes 133b in the first insulating layer 133 can correspond one-to-one. For example, Figure 2E A stacked structure of a first electrode structure and a substrate 131 is shown, with reference to... Figure 2E Along the Z-direction, each insulating stripe 133b in the first insulating layer 133 is located on an electrode stripe 132b. The projection of each electrode stripe 132b onto the substrate 131 lies within the projection of an insulating stripe 133b onto the substrate 131. Optionally, the projected area of ​​each electrode stripe 132b onto the substrate 131 may be smaller than the projected area of ​​its corresponding insulating stripe 133b onto the substrate 131. In some embodiments, the projected area of ​​each electrode stripe 132b onto the substrate 131 may coincide with the projected area of ​​its corresponding insulating stripe 133b onto the substrate 131. Optionally, the width of the electrode stripe 132b is 20μm-300μm, and the width of the insulating stripe 133b is 20μm-300μm. The width of the insulating stripe 133b may be greater than or equal to the width of the electrode stripe 132b.

[0106] In some embodiments, the insulating stripe 133b may cover the surface of the electrode stripe 132b that does not contact the substrate 131, thereby improving the bonding strength between the first electrode layer 132 and the first insulating layer 133. Specifically, Figure 2F Another stacked structure of the first electrode structure and the substrate 131 is shown, referenced. Figure 2F Each insulating stripe 133b may include a first portion 133c stacked on the electrode stripe 132b and a second portion 133d located on both sides of the electrode stripe 132b. Optionally, the first portion 133c and the second portion 133d may be integrally connected.

[0107] The insulating stripe 133b covers the electrode stripe 132b, which can improve the bonding strength between different layer interfaces, thereby reducing the risk of delamination, cracking and other problems in multilayer stacked structures. Figure 2G and Figure 2H The diagram illustrates the interlayer forces of two electrode structures after being subjected to external forces. Figure 2G correspond Figure 2E The stacked structure shown, Figure 2H correspond Figure 2F The stacking structure shown is for your reference. Figure 2G and Figure 2H , Figure 2E The stacked structure shown can be equivalent to a laminated beam. When subjected to an external force F, the interlayer force τ can cause interlayer slippage, cracking, or intralayer bending fracture. Interfaces with weaker bonding in the stacked structure, such as the substrate 131 and electrode stripe 132b, as well as electrode stripe 132b itself, are prone to failure due to their poor strength. Figure 2H In the stacked structure shown, the interfacial bonding force between the substrate 131 and the electrode stripe 132b can be converted into a combined bonding force between the substrate 131, the electrode stripe 132b, and the insulating medium. When subjected to external compressive force F (or tensile force), shear force or peeling force will be generated between the layers. Originally, the interface between the substrate 131 and the electrode stripe 132b is a weak interface. By covering the electrode stripe 132b with an insulating medium (i.e., the second part 133d), the interfacial bonding force between the insulating medium and the substrate 131 is strengthened, thereby improving the bonding force at the interface of the substrate 131. In addition, the insulating medium wraps around the electrode stripe 132b, increasing the strength of the electrode stripe 132b body and preventing it from breaking due to insufficient body strength. Thus, both the connecting part 130 and the cantilever part 140 can improve their bending resistance, reduce the cracking risk of the multilayer stacked structure, and improve the structural strength and reliability of the sensor 100a.

[0108] The first hole 132a is connected to the second hole 133a, allowing the glue 100c to enter the first hole 132a and the second hole 133a. Figure 2I A force analysis diagram of a connecting part 130 is shown, with reference to... Figure 2I When the connecting part 130 is bonded to the housing 100b, during the curing and shrinkage process of the adhesive 100c, the outer side of the first electrode structure (i.e., the side facing away from the first surface) will be subjected to a resultant force F1 generated by the adhesive shrinkage. At the same time, the adhesive 100c that has entered the connecting part, such as the adhesive 100c that has entered the first hole 132a, the second hole 133a, etc., will generate lateral shrinkage resultant forces F2 and F3. F2 and F3 can offset part of F1, thereby reducing the tensile stress on the stacked structure and reducing the risk of cracking of the multilayer stacked structure.

[0109] It is understood that the first hole 132a and the second hole 133a are used to fill adhesive 100c. To reduce the stress caused by the curing shrinkage of adhesive 100c, anti-shrinkage materials, such as calcium carbonate, talc, and mica powder, can be added to adhesive 100c to reduce its curing shrinkage rate, thereby reducing the stress generated by the curing shrinkage. Optionally, the proportion of anti-shrinkage material in adhesive 100c is 10%-25%.

[0110] As an example, typically in medical applications, adhesive 100c can be a modified acrylic resin containing a UV photoinitiator. By adding anti-shrinkage materials (such as calcium carbonate, talc, mica powder, etc.) to adhesive 100c, the effect of adhesive 100c shrinkage on the joint 130 can be reduced.

[0111] Please continue to refer to this. Figure 2BThe second electrode structure includes a second electrode layer 134 and a second insulating layer 135, and the third electrode structure includes a third electrode layer 136 and a third insulating layer 137. The second electrode layer 134 can serve as the working electrode of the sensor 100a, and the third electrode layer 136 can serve as the reference electrode of the sensor 100a. The second electrode layer 134, the second insulating layer 135, the third electrode layer 136, and the third insulating layer 137 are stacked sequentially along the Z direction, wherein the second electrode layer 134 is stacked along the Z direction on the second surface.

[0112] Optionally, the second surface can be a surface that has undergone surface modification treatment. Optionally, the surface modification treatment of the second surface includes, but is not limited to, plasma treatment, ultrasonic cleaning, or chemical treatment. Optionally, the water droplet angle of the surface-modified second surface is 20°-40°, for example, 30°, 32°, etc. By performing surface modification treatment on the second surface, the surface energy of the second surface can be increased, the bonding strength between the second electrode layer 134 and the second surface can be improved, and cracking between the second electrode layer 134 and the second surface is less likely.

[0113] The second electrode layer 134, the second insulating layer 135, the third electrode layer 136, and the third insulating layer 137 can all be mesh structures. The second electrode layer 134 has a plurality of third holes 134a, the second insulating layer 135 has a plurality of fourth holes 135a, the third electrode layer 136 has a plurality of fifth holes 136a, and the third insulating layer 137 has a plurality of sixth holes 137a. At least some of the third holes 134a, at least some of the fourth holes 135a, at least some of the fifth holes 136a, and at least some of the sixth holes 137a are connected.

[0114] The structures of the second electrode layer 134 and the second insulating layer 135 can be referred to the specific embodiments of the first electrode layer 132 and the first insulating layer 133. Similarly, the structures of the third electrode layer 136 and the third insulating layer 137 can be referred to the specific embodiments of the first electrode layer 132 and the first insulating layer 133, and will not be repeated here.

[0115] In some embodiments, the second electrode layer 134, the second insulating layer 135, the third electrode layer 136, and the third insulating layer 137 can be planar stacked structures. Since the first electrode structure has a communicating first hole 132a and a second hole 133a, when the connecting portion 130 is bonded to the housing 100b, the adhesive 100c can enter the first hole 132a and the second hole 133a, thereby reducing the tensile stress on the stacked structure and lowering the risk of cracking in the multilayer stacked structure. In other embodiments, the first electrode layer 132 and the first insulating layer 133 can also be planar stacked structures, and the second electrode layer 134, the second insulating layer 135, the third electrode layer 136, and the third insulating layer 137 can all be mesh structures.

[0116] Figure 3 Another structure of the connecting part 130 is shown, which is similar to... Figure 2B The connection part 130 shown is different, Figure 3 In the connecting portion 130 shown, each first hole 132a is aligned with a second hole 133a, and similarly, each third hole 134a is aligned with a fourth hole 135a, a fifth hole 136a, and a sixth hole 137a. That is, the projection of the first hole 132a onto the substrate 131 coincides with the projection of its corresponding second hole 133a onto the substrate 131. The projection of the fourth hole 135a onto the substrate 131 coincides with the projections of the fifth hole 136a and its corresponding sixth hole 137a onto the substrate 131.

[0117] By employing the above methods, the adhesive 100c can more easily penetrate into the holes, increasing the amount of adhesive 100c in the holes, thereby further reducing the impact of the curing shrinkage of the adhesive 100c on the outside of the connector 130 on the connector 130. Furthermore, the same control process can be used to form the first electrode layer 132, the first insulating layer 133, the second electrode layer 134, the second insulating layer 135, the third electrode layer 136, and the third insulating layer 137, for example, by using the same screen printing plate, thereby reducing the processing difficulty of the connector 130.

[0118] Figure 4 A bottom view of the structure of the connecting part 130 is shown, with reference to Figure 4 The connecting part 130 is also provided with a plurality of through holes 138 penetrating the first electrode structure, the substrate 131, the second electrode structure and the third electrode structure. The through holes 138 can be used to fill the adhesive 100c. The adhesive 100c in the through holes 138 can also provide a shrinkage force in the opposite direction, thereby further reducing the impact of the curing shrinkage of the adhesive 100c on the connecting part 130.

[0119] Specifically, refer to Figure 4As shown, through holes 138 can be provided on insulating stripes 133b and / or electrode stripes 132b. That is, through holes 138 do not coincide with the first hole 132a, the second hole 133a, the third hole 134a, the fourth hole 135a, the fifth hole 136a, and / or the sixth hole 137a. By providing through holes 138 on insulating stripes 133b and / or electrode stripes 132b, the number of pores inside the connector 130 is increased, allowing more adhesive 100c to enter the connector 130. It can be understood that as the amount of adhesive entering the connector 130 increases, the shrinkage force (e.g., F2 and F3) generated by the adhesive 100c inside the connector 130 during the adhesive 100c curing process is greater, thus more effectively offsetting the force (e.g., F1) generated by the shrinkage of the adhesive 100c outside the connector 130, making the stacked structure less prone to cracking.

[0120] Understandable. Figure 4 The circumferential dimension of the electrode structure shown can be smaller than the circumferential dimension of the substrate 131. In some embodiments, the circumferential dimension of the electrode structure can also be equal to the circumferential dimension of the substrate 131. Taking the first electrode layer 132 in the first electrode structure as an example, the edge of the first electrode layer 132 can be aligned with the edge of the substrate 131, or it can have a certain distance between them.

[0121] Optionally, the through hole 138 can be circular, elliptical, or polygonal. The dimensions of the through hole 138 can be designed according to its shape. For example, when the through hole 138 is a regular polygonal hole, the side length of the through hole 138 can be 0.05mm-0.5mm. Similarly, when the through hole 138 is a circular hole, the diameter of the through hole 138 is 0.05mm-0.5mm.

[0122] Figure 5 Another bottom view of the connection 130 is shown, and... Figure 4 The connection part 130 shown is different, Figure 5 In the connecting part 130 shown, the position of the through hole 138 overlaps with the grid holes (the first hole 132a, the second hole 133a, the third hole 134a, the fourth hole 135a, the fifth hole 136a, and the sixth hole 137a can all be regarded as grid holes).

[0123] refer to Figure 5 As shown, the first hole 132a penetrates the first electrode layer 132, the third hole 134a penetrates the second electrode layer 134, and a plurality of seventh holes are provided in the substrate 131. The first hole 132a, the second hole 133a, the third hole 134a, the fourth hole 135a, the fifth hole 136a, the sixth hole 137a and the seventh hole are connected to form a through hole 138.

[0124] In addition, with Figure 4 Compared to the connecting part 130 shown, Figure 5 The connecting part 130 shown is provided with a seventh hole that connects the first hole 132a, the second hole 133a, the third hole 134a, the fourth hole 135a, the fifth hole 136a and the sixth hole 137a, which greatly reduces the number of holes (including through holes 138 and mesh holes), thereby avoiding the decrease in structural strength of the connecting part 130 due to too many holes.

[0125] refer to Figure 5 As shown, the projection of through hole 138 on substrate 131 at least partially coincides with the projection of second hole 133a on substrate 131, and / or, the projection of through hole 138 on substrate 131 at least partially coincides with the projection of first hole 132a on substrate 131, and / or, the projection of through hole 138 on substrate 131 at least partially coincides with the projection of sixth hole 137a on substrate 131, and / or, the projection of through hole 138 on substrate 131 at least partially coincides with the projection of fifth hole 136a on substrate 131, and / or, the projection of through hole 138 on substrate 131 at least partially coincides with the projection of fourth hole 135a on substrate 131, and / or, the projection of through hole 138 on substrate 131 at least partially coincides with the projection of third hole 134a on substrate 131. By placing the through-hole 138 at the location of the mesh hole, damage to the electrode structure during the formation of the through-hole 138 (i.e., drilling) can be reduced, thereby ensuring the integrity of the electrode structure and improving the reliability of the sensor 100a.

[0126] This application embodiment also provides a method for fabricating a sensor 100a, wherein the sensor 100a may include a connecting portion 130, the connecting portion 130 includes a substrate 131 and a first electrode structure, the first electrode structure includes a first electrode layer 132 and a first insulating layer 133. Figure 6 A flowchart of a method for fabricating a sensor 100a is shown, with reference to... Figure 6 The preparation method includes:

[0127] S601: Provide a substrate 131 having a first surface.

[0128] The substrate 131 can be a flexible substrate, such as polyethylene terephthalate, polyimide substrate 131, etc. The substrate 131 has a first surface and a second surface, wherein a first electrode structure can be formed on the first surface, and a second electrode structure and a third electrode structure can be formed on the second surface.

[0129] Before forming the first electrode structure on the first surface, the first surface can be modified to increase its surface energy. Similarly, before forming the second electrode structure on the second surface, the second surface can also be modified to increase its surface energy. In practical applications, after obtaining the substrate 131, the first and second surfaces of the substrate 131 can be modified separately before fabricating the first, second, and third electrode structures.

[0130] Surface modification treatments for the first and / or second surfaces can include methods such as plasma treatment, ultrasonic cleaning, or chemical treatment. As an example, nitrogen vacuum plasma can be used to clean the first and / or second surfaces to increase their surface energy. Optionally, the plasma cleaning power is 200W-500W, and the water droplet angle on the first and / or second surfaces after plasma cleaning is 20°-40°.

[0131] S602: A grid-like electrode paste is laid on the first surface.

[0132] When forming the first electrode structure on the first surface, a grid-like electrode paste can be first laid on the first surface. Optionally, laying the grid-like electrode paste on the first surface includes, but is not limited to, spraying, printing, and dripping. As an example, a grid-like screen is used to print the grid-like electrode paste on the first surface. In some embodiments, before printing the electrode paste on the first surface, the electrode paste can be homogenized, and the printing viscosity of the homogenized electrode paste is 50 Pa·s-100 Pa·s.

[0133] The mesh-like electrode paste has first mesh pores, which can optionally be circular, elliptical, polygonal, or the like. After the electrode paste has cured, the first mesh pores can form first pores 132a.

[0134] In some embodiments, the second electrode structure and the third electrode structure may be formed first on the second surface, and then the first electrode structure may be formed on the first surface. That is, the embodiments of this application do not limit the order in which the electrode structures are formed.

[0135] S603: The electrode paste is subjected to a first curing treatment under the first curing conditions.

[0136] The electrode paste can be a carbon paste. Optionally, the carbon paste composition includes 10%-20% graphite, 10%-20% carbon black, 10%-30% resin, and 50%-70% solvent. The resin acts as a binder to bond conductive fillers such as graphite and carbon black together, ensuring good contact between the conductive filler particles after the carbon paste has cured or dried. The solvent is used to dissolve the resin and conductive filler. Optionally, the solvent can be ethylene glycol diacetate and / or 2-(2-ethoxyethoxy)ethyl acetate. In some embodiments, the carbon paste may include 30%-40% ethylene glycol diacetate and 20%-30% 2-(2-ethoxyethoxy)ethyl acetate. The first curing treatment can be a high-temperature curing treatment, where the first curing conditions allow the resin to crosslink and cure. Optionally, the first curing conditions can be curing at 100°C-150°C for 10-30 minutes. That is, the electrode slurry is cured at 100℃-150℃ for 10min-30min to solidify the carbon slurry and form the first electrode layer 132.

[0137] In some embodiments, the electrode paste may include a carbon paste and an insulating paste. The insulating paste may be a UV-based paste; for example, it may include an acrylic compound and a UV photoinitiator. A first curing treatment of the electrode paste under a first curing condition may include: performing a first curing treatment on the electrode paste under the first curing condition to completely cure the carbon paste in the electrode paste and to initially cure the insulating paste in the electrode paste. In this embodiment, since the electrode paste contains insulating paste, under the first curing condition, for example at 100°C-150°C, curing for 10-30 minutes can completely cure the carbon paste in the electrode paste, while the insulating paste in the electrode paste is in a preliminary cured state, i.e., the insulating paste is not completely cured. Subsequently, after laying a mesh-like insulating paste on the electrode paste after the first curing treatment, a second curing treatment under a second curing condition can completely cure the insulating paste in the electrode paste, and the insulating paste laid on the electrode paste will also be completely cured. Since the electrode slurry contains a certain proportion of insulating slurry, and the insulating slurry in the electrode slurry is cured together with the insulating slurry laid on the electrode slurry, the bonding strength between the first electrode layer 132 and the first insulating layer 133 formed after curing can be improved, thereby making it less prone to cracking between the first electrode layer 132 and the first insulating layer 133.

[0138] When the electrode paste may include carbon paste and insulating paste, a diluent may be used to dilute the carbon paste and insulating paste. Optionally, the solvent in the carbon paste may be used as the diluent. The proportion of carbon paste in the electrode paste is 98%-99.5%, the proportion of insulating paste is 0-1.5%, and the proportion of diluent is 0-0.5%. By blending the carbon paste, insulating paste monomers, and diluent in a certain proportion and then performing a curing treatment, the bonding strength between the first insulating layer 133 and the first electrode layer 132 can be improved while ensuring that the conductivity of the cured first electrode layer 132 is not affected.

[0139] S604: A grid-like insulating slurry is laid on the electrode slurry after the first curing treatment.

[0140] After the electrode paste undergoes a first curing treatment, a grid-like insulating paste can be laid on the cured electrode paste. Optionally, laying the grid-like electrode paste on the cured electrode paste includes, but is not limited to, spraying, printing, and drip coating. As an example, a grid-like insulating paste is printed on the cured electrode paste using a gridded screen. Optionally, the composition of the insulating paste can be the same as that of the insulating paste in the electrode paste.

[0141] In some embodiments, in addition to contacting the electrode paste, the insulating slurry can also penetrate into the first mesh pores and coat the sides of the electrode paste, so that after curing, the insulating slurry can form a first portion stacked on the electrode stripes and a second portion located on both sides of the electrode stripes (refer to 2F). The mesh-like insulating slurry has second mesh pores, which can optionally be circular, elliptical, polygonal, etc. After the insulating slurry cures, the second mesh pores can form second holes 133a.

[0142] S605: Under the second curing condition, the insulating slurry is subjected to a second curing treatment to obtain a first electrode layer 132 and a first insulating layer 133 at least partially stacked on the first electrode layer 132, wherein the first electrode layer 132 has a plurality of first holes 132a, the first insulating layer 133 has a plurality of second holes 133a, the second holes 133a penetrate the first insulating layer 133, and at least a portion of the first holes 132a communicates with at least a portion of the second holes 133a.

[0143] The second curing treatment can be UV curing, and the second curing conditions can be ultraviolet irradiation with a preset energy under a protective atmosphere. The protective atmosphere can be a nitrogen atmosphere or an inert gas atmosphere. The preset energy can be 500 mJ / cm². 2 -1500mJ / cm 2The second curing condition is used to allow the insulating slurry to cure completely, thereby obtaining the first electrode layer 132 and the first insulating layer 133 at least partially laminated on the first electrode layer 132.

[0144] As an optional implementation, without the inclusion of an insulating paste in the electrode paste, UV curing is performed under nitrogen protection at a curing energy of 1000 mJ / cm². 2 .

[0145] As another alternative implementation, when the electrode slurry includes an insulating slurry, the insulating slurry is subjected to a second curing treatment under a second curing condition, so that the insulating slurry in the electrode slurry is cured to obtain a first electrode layer 132, and the insulating slurry laid on the electrode slurry is cured to obtain a first insulating layer 133 at least partially laminated on the first electrode layer 132.

[0146] In other words, when the electrode paste includes an insulating paste, the insulating paste in the electrode paste is not completely cured during the first curing treatment of the electrode paste. After the insulating paste is printed on the electrode paste after the first curing treatment, UV curing is used to cure both the insulating paste in the electrode paste and the insulating paste laid on the electrode paste at the same time, which can enhance the bonding force of the interface between the first electrode layer 132 and the first insulating layer 133.

[0147] By sequentially laying a grid-like electrode paste and an insulating paste on a first surface and then curing the electrode paste and the insulating paste, a first electrode layer 132 containing grid holes (e.g., multiple first holes 132a) and a first insulating layer 133 containing grid holes (e.g., multiple second holes 133a) can be obtained. The grid holes in the first electrode layer 132 are partially or completely connected to the grid holes in the first insulating layer 133. When adhesive is applied to the dispensing area (i.e., the area where the connector 130 is bonded to the housing 100b), the adhesive can penetrate into the grid holes. During the curing and shrinkage process, the adhesive in the grid holes can provide a reverse shrinkage force relative to the shrinkage force generated by the shrinkage of the adhesive outside the connector 130. In this way, the tensile stress on the laminated structure caused by the shrinkage force of the adhesive outside the connector 130 is reduced, thereby avoiding cracking of the laminated structure and improving the reliability of the sensor.

[0148] After forming the first electrode structure on the first surface, a second electrode structure and a third electrode structure can be formed on the second surface. The second electrode structure may include a second electrode layer 134 and a second insulating layer 135, and the third electrode structure may include a third electrode layer 136 and a third insulating layer 137.

[0149] The second electrode layer 134 is formed on the second surface, and the second insulating layer 135 is at least partially formed on the second electrode layer 134. The formation methods of the second electrode layer 134 and the second insulating layer 135 can be referred to the formation methods of the first electrode layer 132 and the first insulating layer 133, and will not be repeated here.

[0150] When forming the third electrode structure, a grid-like electrode paste can be first laid on the second insulating layer 135, and then the electrode paste is subjected to a first curing treatment under a first curing condition. The second insulating layer 135 has spaced fourth holes 135a and insulating stripes 133b, and the electrode paste laid on the second insulating layer 135 can contact the insulating stripes 133b in the second insulating layer 135. The electrode paste laid on the second insulating layer 135 has fifth grid holes, which can optionally be circular, elliptical, polygonal, etc. After the insulating paste is cured, the fifth grid holes are used to form fifth holes 136a. When forming the third insulating layer 137, a grid-like insulating paste can be first laid on the electrode paste after the first curing treatment, and then the insulating paste is subjected to a second curing treatment under a second curing condition to obtain the third electrode structure. The specific implementation methods of the electrode paste, insulating paste, first curing treatment and second curing treatment can be referred to the description in sections S603 to S605 above, and will not be repeated here.

[0151] The second electrode structure formed on the second surface and the third electrode structure formed on the second electrode structure can be obtained by the above method. The second electrode layer 134 has a plurality of third holes 134a, the second insulating layer 135 has a plurality of fourth holes 135a penetrating the second insulating layer 135, the third electrode layer 136 has a plurality of fifth holes 136a penetrating the third electrode layer 136, and the third insulating layer 137 has a plurality of sixth holes 137a penetrating the third insulating layer 137. At least some of the third holes 134a, at least some of the fourth holes 135a, at least some of the fifth holes 136a, and at least some of the sixth holes 137a are connected.

[0152] In some embodiments, when forming the second electrode structure and the third electrode structure, the second electrode layer 134 can be first printed in a grid pattern on the second surface, followed by the second insulating layer 135, then the third electrode layer 136, and finally the third insulating layer 137. When printing the second insulating layer 135, the insulating paste can penetrate and encapsulate the electrode stripes 132b in the second electrode layer 134. When printing the third electrode layer 136, the electrode paste can penetrate and encapsulate the insulating stripes 133b in the second insulating layer 135. When printing the third insulating layer 137, the insulating paste can penetrate and encapsulate the electrode stripes 132b in the third electrode layer 136. In this way, the electrode stripes 132b and insulating stripes 133b can be progressively encapsulated, i.e., electrode stripes 132b-insulating stripes 133b-electrode stripes 132b-insulating stripes 133b will mutually penetrate and encapsulate each other, ultimately leaving pores on the second surface of the substrate 131 after curing.

[0153] After forming the first electrode structure, the second electrode structure, and the third electrode structure on the substrate 131, a plurality of through holes 138 penetrating the first electrode structure, the substrate 131, the second electrode structure, and the third electrode structure can be formed in the connecting portion 130. For example, the plurality of through holes 138 penetrating the first electrode structure, the substrate 131, the second electrode structure, and the third electrode structure can be formed by laser cutting, die cutting, or other methods. The location of the through holes 138 can be the location of the electrode stripe 132b and the insulating stripe 133b, or the location of the first hole 132a, the second hole 133a, the third hole 134a, the fourth hole 135a, the fifth hole 136a, and / or the sixth hole 137a.

[0154] It is understood that when the connecting part 130 is bonded to the housing 100b, since the first hole 132a and the second hole 133a are connected, the adhesive 100c can enter the first hole 132a and the second hole 133a. The third hole 134a, the fourth hole 135a, the fifth hole 136a and the sixth hole 137a are connected, and the adhesive 100c can enter the third hole 134a, the fourth hole 135a, the fifth hole 136a and the sixth hole 137a. At the same time, the adhesive 100c can also enter the through hole 138. When the adhesive 100c entering these holes cures, it can provide a force in the opposite direction to the tensile force on the surface of the connecting part 130, thereby reducing the impact of the shrinkage stress of the adhesive 100c on the stacked structure of the connecting part 130.

[0155] Based on the above description, an exemplary embodiment of a method for manufacturing a sensor 100a is described below.

[0156] As an optional implementation, substrate 131 can be made of polyethylene terephthalate. One side (i.e., the first surface) of substrate 131 is first cleaned with nitrogen vacuum plasma. The plasma cleaning power can be 200W-500W, and the water droplet angle after plasma cleaning can be 20°-40°. Then, carbon paste for the first electrode is printed using a gridded screen. The carbon paste can be homogenized before printing, and the viscosity after homogenization is 50Pa·s-100Pa·s. After printing, it is placed in an infrared sintering curing oven for curing treatment, and then a gridded insulating medium, i.e., the first insulating layer 133, is printed. UV curing is performed under nitrogen protection, and the curing energy is 500mJ / cm. 2 -1500mJ / cm 2 The thickness of the first electrode layer 132 is 5μm-20μm, and the thickness of the first insulating layer 133 is 5μm-40μm.

[0157] The other side of the substrate 131 (i.e., the second surface) is also cleaned using nitrogen vacuum plasma, resulting in a water droplet angle of 20°-40°. Then, carbon paste for the second electrode layer 134 is printed using a grid pattern, followed by curing in an infrared sintering furnace. The resulting second electrode layer 134 has a thickness of 5μm-20μm. Next, a second insulating layer 135 is formed using a grid pattern, also with a thickness of 5μm-40μm. Then, a third electrode layer 136 is formed using a grid pattern, with a thickness of 5μm-20μm. Finally, a third insulating layer 137 is formed using a grid pattern, with a thickness of 5μm-40μm. In this way, the electrode layers and insulating layers interpenetrate and encapsulate each other, ultimately forming pores on the second surface after curing.

[0158] After obtaining the above stacked structure, laser equipment can be used to cut and punch holes in the stacked structure to form an array of 138 circular through holes. The diameter of the circular through holes 138 in the array of 138 circular through holes can be 0.05-0.5mm.

[0159] The stacked structure obtained in the above embodiment can be bonded to the housing 100b to obtain the detection device 100. Optionally, a UV-type low-shrinkage adhesive 100c can be used to assemble the sensor 100a to the housing 100b. During the curing process of the adhesive 100c, curing can be carried out by UV irradiation, and the curing energy of the adhesive 100c can be 500mJ / cm². 2 -1500mJ / cm 2 .

[0160] Through the above implementation methods, the interfacial bonding force of the stacked structure in sensor 100a and the strength of the electrode layer can be enhanced. Adhesive 100c penetrating into the meshed pores can increase the bonding area of ​​the stacked layers while reducing shrinkage stress. After forming through-holes 138 in the stacked structure, the adhesive 100c in the meshed pores and through-holes 138 can provide a reverse shrinkage force, thereby reducing the impact of adhesive 100c on the interface of the stacked structure.

[0161] As another embodiment, the substrate 131 can be made of polyimide to improve its flexibility. Furthermore, the adhesive 100c may contain mica powder with anti-shrinkage properties. Other specific implementations are the same as those described above.

[0162] Through the above implementation methods, the flexibility of the stacked structure in sensor 100a can be improved, and the interfacial bonding force of the stacked structure can be enhanced. In addition, the addition of anti-shrinkage mica powder to adhesive 100c can reduce the shrinkage rate of adhesive 100c, thereby reducing the stress exerted on the stacked structure by the curing shrinkage of adhesive 100c.

[0163] In the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0164] In the embodiments of this application, it should be understood that the directional terms mentioned, such as "up", "down", "left", "right", "inner", "outer", etc., are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0165] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0166] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0167] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0168] In the embodiments of this application, it should be noted that the descriptions of "vertical" and "parallel" respectively indicate approximately vertical and approximately parallel within a certain error range. This error range can be a range with a deviation angle of less than or equal to 5°, 8° or 10° relative to absolute verticality and absolute parallelism, respectively, and is not specifically limited here.

[0169] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A sensor, characterized in that, Includes a connecting portion, the connecting portion comprising: A substrate having a first surface; A first electrode structure includes a first electrode layer and a first insulating layer, wherein the first electrode layer is stacked on the first surface along the thickness direction of the substrate, and at least a portion of the first insulating layer is stacked on the first electrode layer along the thickness direction of the substrate; the first electrode layer has a plurality of first holes, and the first insulating layer has a plurality of second holes, the second holes penetrating the first insulating layer, and at least a portion of the first holes communicating with at least a portion of the second holes.

2. The sensor according to claim 1, characterized in that, The first electrode layer includes multiple electrode stripes, and the multiple electrode stripes are arranged at intervals with the multiple first holes to form a mesh structure; The first insulating layer includes a plurality of insulating stripes, which are arranged at intervals with a plurality of second holes to form a mesh structure.

3. The sensor according to claim 2, characterized in that, The projection of each of the electrode stripes onto the substrate lies within the projection of one of the insulating stripes onto the substrate.

4. The sensor according to claim 3, characterized in that, Each of the insulating stripes includes a first portion stacked on the electrode stripe and a second portion located on both sides of the electrode stripe, the first portion and the second portion being integrally connected.

5. The sensor according to claim 3, characterized in that, The width of the electrode stripes is 20μm-300μm; and / or, the width of the insulating stripes is 20μm-300μm.

6. The sensor according to any one of claims 1-5, characterized in that, The first hole is a regular polygonal hole with a side length of 5μm-100μm; or, the first hole is a circular hole with a diameter of 5μm-100μm.

7. The sensor according to any one of claims 1-6, characterized in that, The substrate also has a second surface opposite to the first surface; The connecting portion further includes a second electrode structure and a third electrode structure. The second electrode structure includes a second electrode layer and a second insulating layer, and the third electrode structure includes a third electrode layer and a third insulating layer. The second electrode layer is stacked on the second surface along the thickness direction of the substrate, and at least a portion of the second insulating layer is stacked on the second electrode layer along the thickness direction of the substrate. The third electrode layer is stacked on the second insulating layer along the thickness direction of the substrate, and at least a portion of the third insulating layer is stacked on the third electrode layer along the thickness direction of the substrate. The second electrode layer has a plurality of third holes, the second insulating layer has a plurality of fourth holes penetrating the second insulating layer, the third electrode layer has a plurality of fifth holes penetrating the third electrode layer, and the third insulating layer has a plurality of sixth holes penetrating the third insulating layer, and at least a portion of the third holes, at least a portion of the fourth holes, at least a portion of the fifth holes, and at least a portion of the sixth holes are connected.

8. The sensor according to claim 7, characterized in that, The connecting portion is provided with multiple through holes that penetrate the first electrode structure, the substrate, the second electrode structure, and the third electrode structure.

9. The sensor according to claim 8, characterized in that, The projection of the through hole on the substrate at least partially coincides with the projection of the second hole on the substrate; and / or, the projection of the through hole on the substrate at least partially coincides with the projection of the sixth hole on the substrate.

10. The sensor according to any one of claims 1-9, characterized in that, The substrate material includes at least one of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, or polyimide.

11. The sensor according to any one of claims 1-9, characterized in that, The material of the first electrode layer includes carbon; and / or, the material of the first insulating layer includes at least one of an acrylic compound and an ultraviolet photoinitiator.

12. The sensor according to any one of claims 1-9, characterized in that, The thickness of the substrate is 10μm-200μm; the thickness of the first electrode layer is 5μm-20μm; and the thickness of the first insulating layer is 5μm-40μm.

13. The sensor according to claim 7, characterized in that, The water droplet angle of the first surface is 20-40°; and / or, the water droplet angle of the second surface is 20-40°.

14. The sensor according to any one of claims 1-13, characterized in that, The first hole and the second hole are used to fill glue.

15. The sensor according to claim 8, characterized in that, The through-hole is used to fill the glue.

16. The sensor according to claim 14 or 15, characterized in that, The adhesive contains an anti-shrinkage material.

17. The sensor according to claim 16, characterized in that, The anti-shrinkage material includes at least one of calcium carbonate, talc, and mica powder.

18. The sensor according to claim 16, characterized in that, The anti-shrinkage material has a component ratio of 10%-25%.

19. A method for manufacturing a sensor, characterized in that, The sensor includes a connector, the connector including a substrate and a first electrode structure, the first electrode structure including a first electrode layer and a first insulating layer; the method includes: A substrate is provided, the substrate having a first surface; A grid-like electrode paste is laid on the first surface; The electrode paste is subjected to a first curing treatment under the first curing conditions; A grid-like insulating slurry is laid on the electrode slurry after the first curing treatment; The insulating slurry is subjected to a second curing treatment under a second curing condition to obtain the first electrode layer and the first insulating layer at least partially stacked on the first electrode layer; wherein the first electrode layer has a plurality of first holes and the first insulating layer has a plurality of second holes, the second holes penetrating the first insulating layer, and at least a portion of the first holes are in communication with at least a portion of the second holes.

20. The preparation method according to claim 19, characterized in that, The electrode paste includes carbon paste and insulating paste; the first curing treatment of the electrode paste under the first curing condition includes: The electrode paste is subjected to a first curing treatment under the first curing conditions, so that the carbon paste in the electrode paste is completely cured and the insulating paste in the electrode paste is initially cured. The second curing treatment of the insulating slurry under the second curing condition yields the first electrode layer and at least a portion of the first insulating layer laminated on the first electrode layer, including: The insulating slurry is subjected to a second curing treatment under a second curing condition, so that the insulating slurry in the electrode slurry is cured to obtain the first electrode layer, and the insulating slurry laid on the electrode slurry is cured to obtain the first insulating layer that is at least partially stacked on the first electrode layer.

21. The preparation method according to claim 20, characterized in that, The electrode paste also includes a diluent. The proportion of carbon paste in the electrode paste is 98%-99.5%, the proportion of insulating paste in the electrode paste is 0-1.5%, and the proportion of diluent in the electrode paste is 0-0.5%.

22. The preparation method according to claim 20 or 21, characterized in that, The carbon paste comprises 10%-20% graphite, 10%-20% carbon black, resin, and 50%-70% solvent.

23. The preparation method according to any one of claims 19-22, characterized in that, The first curing condition is at 100℃-150℃ for 10min-30min; The second curing condition is to use ultraviolet light with a preset energy under a protective atmosphere.

24. The preparation method according to claim 19, characterized in that, Before laying the mesh-like electrode paste on the first surface, the method further includes: The first surface is subjected to surface modification treatment to improve its surface energy.

25. A detection device, characterized in that, It includes a housing and a sensor as described in any one of claims 1-18, wherein the connecting portion of the sensor is bonded to the housing.

26. A detection system, characterized in that, It includes the detection device and electronic device as described in claim 25, wherein the detection device is communicatively connected to the electronic device.

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