CT detector module, signal processing method, system, and electronic device

Abstract

The application discloses a CT detector module, a signal processing method, a system and electronic equipment. The module comprises a plurality of detector units, each of which comprises a scintillator, a photodiode and a flexible circuit board. The plurality of detector units are arranged in multiple columns, adjacent first and second columns of detector units are oppositely arranged, the flexible circuit board of the first column of detector units is bent in a first direction, the flexible circuit board of the second column of detector units is bent in a second direction opposite to the first direction, and there is a physical gap between the bent roots of the flexible circuit boards of the adjacent columns of detector units. The arrangement mode makes the flexible circuit board bent away from the surface of the scintillator and the photodiode, avoids scratching damage and improves the reliability of the detector module. The signal processing method performs a row-by-row horizontal mirror flipping operation on projection data collected by the oppositely arranged detector units, splices the projection data in a physical position index sequence and generates complete data which is spatially continuous.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and more specifically, to a CT detector module, signal processing method, system, and electronic device. Background Technology

[0002] This section provides only background information relevant to this disclosure and is not necessarily prior art.

[0003] In computed tomography (CT) equipment, detector modules are arranged in multiple rows along the circumference of the gantry. Each detector unit includes a scintillator, a photodiode, and a flexible circuit board, with the photodiode mounted on the flexible circuit board. During the assembly and use of the detector modules, the flexible circuit board needs to be led out from the end of the detector unit for connection to subsequent signal processing circuitry.

[0004] Throughout the long history of CT detector development, the flexible circuit boards of all detector units have generally adopted a "comb-like" arrangement with unidirectional bending, meaning all flexible boards bend and extend in the same direction. As the number of detector rows increased to 256 and 512, the number of modules surged, and the design gaps drastically decreased. With extremely small gaps between modules, the flexible boards of adjacent modules are prone to rubbing against each other at the bend roots during assembly, leading to broken copper wires, worn insulation layers, and even short circuits or signal noise. Furthermore, the confined operating space during assembly makes the flexible boards susceptible to collisions with the edges of the scintillator or the ceramic substrate, causing mechanical damage. To achieve optimal detector performance, the detector installation position often needs to be adjusted multiple times, requiring repeated assembly during debugging, which easily damages the flexible boards.

[0005] To alleviate the above problems, existing technologies typically employ methods such as increasing the strength of the flexible board or adding a protective coating. However, these methods significantly increase manufacturing costs and process complexity, and it is difficult to completely avoid scratches, so there is still a risk of damage. Summary of the Invention

[0006] The purpose of this application is to provide a CT detector module to solve the problem that the flexible circuit board of a multi-row detector unit may scratch the scintillator or photodiode after bending.

[0007] To achieve the above objectives, a first aspect of this application provides a CT detector module, comprising: Multiple detector units, each detector unit including a scintillator, a photodiode and a flexible circuit board, wherein the photodiode is mounted on the flexible circuit board, and the length and width of the scintillator in the horizontal direction are both greater than the length and width of the photodiode in the horizontal direction; The multiple detector units are arranged in multiple columns, with the first column of detector units and the second column of detector units placed opposite each other. The flexible circuit board of the first column of detector units is bent in a first direction, and the flexible circuit board of the second column of detector units is bent in a second direction opposite to the first direction. There is a physical gap between the roots of the bends of the flexible circuit boards of the adjacent columns of detector units. A ceramic reinforcing plate is fixed on the flexible circuit board. The flexible circuit board is bent from the end of the ceramic reinforcing plate. The sum of the thickness of the flexible circuit board after bending and the width of the ceramic reinforcing plate is less than the width of the scintillator.

[0008] According to a CT detector module provided in this application, the relative placement is as follows: in the first column of detector units, the center line of the photodiode and the flexible circuit board connected thereto is located on the first side of the center line of the scintillator; in the second column of detector units, the center line of the photodiode and the flexible circuit board connected thereto is located on the second side of the center line of the scintillator; the first column of detector units and the second column of detector units are arranged in a back-to-back mirror symmetrical arrangement.

[0009] According to a CT detector module provided in this application, the end of the ceramic reinforcing plate extends to form a rounded chamfer structure.

[0010] According to the CT detector module provided in this application, the CT detector module further includes a mounting base, a pressure plate, and a mounting plate. The mounting base includes a first extension arm, a second extension arm, a first sidewall, a second sidewall, and a bottom wall. The first extension arm, the first sidewall, the bottom wall, the second sidewall, and the second extension arm are sequentially connected, and adjacent components are perpendicular to each other at the connection point. The mounting plate is respectively disposed on the first extension arm and the second extension arm. The first sidewall, the second sidewall, and the bottom wall form a recessed guide groove. The guide groove is configured to guide the flexible circuit boards of the first and second rows of detector units to bend along paths in opposite directions. The pressure plate is configured to cooperate with the mounting plate to fix the bending start portion of the flexible circuit board from both sides of the flexible circuit board. After bending, the flexible circuit board runs along the first sidewall or the second sidewall and passes through the bottom wall.

[0011] Secondly, embodiments of this application provide a signal processing method for a CT detector module, applied to a CT detector module, wherein multiple detector units in the CT detector module are arranged in multiple columns, with adjacent first and second columns of detector units placed opposite each other, the flexible circuit boards of the first column of detector units being bent in a first direction, and the flexible circuit boards of the second column of detector units being bent in a second direction opposite to the first direction, characterized in that the method includes: Acquire the first raw projection data output by the first column detector unit and the second raw projection data output by the second column detector unit; The spatial orientation of the second column of detector units is identified as a horizontal mirror image of the first column of detector units. Perform a line-by-line horizontal mirroring flip operation on the second original projection data; The flipped second original projection data and the first original projection data are spliced ​​together according to the physical position index order of each detector unit in the circumferential direction of the CT detector module to generate complete data.

[0012] According to a CT detector module signal processing method provided in this application, the spatial orientation of the second column of detector units is identified by the level of a preset orientation indicator pin.

[0013] According to a CT detector module signal processing method provided in this application, the line-by-line horizontal mirror flipping operation is as follows: The pixel data sequence [p1, p2, ..., p] of the second original projection data is... n The order of ] is reversed to [p n , ...,p2,p1).

[0014] Thirdly, embodiments of this application provide a signal processing system for performing the method as described in the second aspect and any implementation thereof, including: The orientation recognition module is configured to identify that the spatial orientation of the second column of detector units is a horizontal mirror image of the first column of detector units. The data processing module is configured to perform a row-by-row horizontal mirroring flip operation on the second original projection data output by the second column detector unit, and then splice the flipped second original projection data with the first original projection data output by the first column detector unit according to the physical position index order of each detector unit in the circumferential direction of the CT detector module to generate a complete data frame.

[0015] Fourthly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executed, implements the method as described in the second aspect and any of its implementations.

[0016] The technical solution provided in this application has at least the following beneficial effects: By placing adjacent first and second column detector units opposite each other, the flexible circuit boards of the first column detector units are bent in a first direction, and the flexible circuit boards of the second column detector units are bent in the opposite second direction, forming a physical gap between the roots of the bends in the flexible circuit boards of adjacent columns. Due to the reverse bending, the bent portions of the flexible circuit boards are away from the surfaces of the scintillator and photodiode. The physical gap provides space for the bending deformation of the flexible circuit boards, preventing them from scratching the sensitive surfaces of the scintillator or photodiode when the equipment vibrates or temperature changes, thus improving the reliability and lifespan of the detector module. Simultaneously, since no additional protective covers or complex protective structures are required, the structural design of the detector module is simplified, reducing manufacturing costs.

[0017] Furthermore, the reverse bending arrangement causes the two rows of flexible circuit boards to bend in opposite directions. During module assembly and multiple disassembly and debugging processes, the bending roots of the flexible circuit boards do not interfere with each other, the operating space is more open, and the assembly difficulty and the risk of damage during debugging are further reduced. Attached Figure Description

[0018] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application. In the drawings: Figure 1 This is a structural diagram of the detector unit provided in the embodiments of this application.

[0019] Figure 2 This is a structural diagram of the CT detector module provided in the embodiments of this application.

[0020] Figure 3 This is a flowchart of the signal processing method for the CT detector module provided in the embodiments of this application.

[0021] Reference numerals: 1. Scintillator; 2. Photodiode; 3. Flexible circuit board; 4. Reinforcing plate; 6. Pressure plate; 7. Mounting plate; 51. First extension arm; 52. First sidewall; 53. Bottom wall; 54. Second sidewall; 55. Second extension arm; 56. Guide groove. Detailed Implementation

[0022] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0023] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0024] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0025] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0026] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linked," and "socketing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] Please refer to Figure 1 and Figure 2 This application provides a CT detector module, which includes multiple detector units. Each detector unit includes a scintillator 1, a photodiode 2, and a flexible circuit board 3.

[0028] In this application, the flexible circuit board 3 is a circuit board made with flexible copper-clad laminate as the substrate, possessing the characteristics of being bendable and foldable. The flexible circuit board 3 uses polyimide or polyester as the substrate, with a thickness typically ranging from 0.1 mm to 0.3 mm. The photodiode 2 is mounted on the flexible circuit board 3 and is used to convert the optical signal converted by the scintillator 1 into an electrical signal. The size of the scintillator 1 is larger than the size of the photodiode 2, such that a portion of the scintillator 1 area above the photodiode 2 is not covered by the photodiode 2.

[0029] The size of scintillator 1 is larger than that of photodiode 2. The first dimension of scintillator 1 includes a length x0 and a width y0 in the horizontal direction. The second dimension of photodiode 2 has a length x1 and a width y1 in the horizontal direction. The reinforcing plate 4 has a width y2 in the horizontal direction. Here, x0 is greater than x1, y0 is greater than y1, and the difference is between 50um and 150um. Photodiode 2 is made of silicon wafer material that is extremely easy to damage and crack. Scintillator 1 has higher hardness. The first dimension being larger than the second dimension can protect photodiode 2 from impact damage.

[0030] Multiple detector units are arranged in multiple columns, distributed along the circumference of the CT equipment gantry. In this application, "multiple columns" means at least two columns of detector units arranged along the circumference. In this embodiment, adjacent first and second columns of detector units are placed opposite each other.

[0031] "Relative placement" refers to a spatially symmetrical or approximately symmetrical arrangement of the first and second rows of detector units. In one embodiment of this application, the first and second rows of detector units are arranged back-to-back in a mirror-symmetrical manner. Specifically, in the first row of detector units, the center line of the photodiode 2 and its connected flexible circuit board 3 is located on the first side of the center line of the scintillator 1; in the second row of detector units, the center line of the photodiode 2 and its connected flexible circuit board 3 is located on the second side of the center line of the scintillator 1, with the first and second sides being opposite.

[0032] In other embodiments of this application, the first and second rows of detector units may also be arranged asymmetrically back-to-back. For example, the dimensions of the first and second rows of detector units may differ, but their flexible circuit boards 3 may still be bent in opposite directions. Alternatively, the positions of the first and second rows of detector units may be offset in the circumferential direction, but their flexible circuit boards 3 may be bent in opposite directions. As long as the condition of "the flexible circuit boards 3 of adjacent detector units bend in opposite directions" is met, it falls within the protection scope of "relative placement" of this application.

[0033] Please refer to Figure 2The flexible circuit board 3 of the first column of detector units is bent in a first direction, and the flexible circuit board 3 of the second column of detector units is bent in a second direction opposite to the first direction. Since the two adjacent columns of detector units are placed opposite each other, their flexible circuit boards 3 are bent in opposite directions, and there is a physical gap between the roots of the bends of the flexible circuit boards 3 of the adjacent columns of detector units.

[0034] "Bending" refers to the process of bending the flexible circuit board 3 from the end of the detector unit to one side. In this embodiment, the bending angle is 90 degrees to 180 degrees, and the bending radius is 3 to 10 times the thickness of the flexible circuit board 3 to ensure that the flexible circuit board 3 does not break at the bending point. The bending position is located between the end of the detector unit and the edge of the scintillator 1, so that the bent flexible circuit board 3 extends downward along the side of the detector unit.

[0035] "Physical gap" refers to the spatial distance between the bent roots of the flexible circuit boards 3 of two adjacent detector units. In this embodiment, the width of the physical gap is 1mm to 5mm, preferably 2mm to 3mm. This physical gap provides space for the bending deformation of the flexible circuit board 3, keeping the bent flexible circuit board 3 away from the sensitive surfaces of the scintillator 1 and the photodiode 2. When the device vibrates or the temperature changes, causing the flexible circuit board 3 to undergo slight displacement, the physical gap can accommodate this displacement, preventing the flexible circuit board 3 from scratching the scintillator 1 or the photodiode 2.

[0036] In one embodiment of this application, a reinforcing plate 4 is fixed to the flexible circuit board 3. The reinforcing plate 4 is a rigid or semi-rigid plate used to provide local rigid support for the flexible circuit board 3. In this embodiment, the reinforcing plate 4 is made of ceramic material with a thickness of 0.3 mm to 0.8 mm. In other embodiments, the reinforcing plate 4 may also be made of FR-4, metal, or other rigid materials, as long as it can provide sufficient rigid support for the flexible circuit board 3.

[0037] The flexible circuit board 3 bends from the end of the reinforcing plate 4. The reinforcing plate 4 provides rigid support for the flexible circuit board 3, fixing the bending position at the end of the reinforcing plate 4 and preventing the bending position from shifting. The end of the reinforcing plate 4 extends to form a rounded chamfer structure with a radius of 0.5mm to 2mm, which allows the flexible circuit board 3 to smoothly transition at the bend, reducing stress concentration and preventing the flexible circuit board 3 from breaking at the bend.

[0038] In one specific embodiment, the sum of the thickness of the flexible circuit board 3 after bending and the width y2 of the reinforcing plate 4 is less than the width y0 of the scintillator 1. This dimensional constraint ensures that the bent flexible circuit board 3 does not exceed the coverage area of ​​the scintillator 1, further preventing interference between the flexible circuit board 3 and adjacent detector units.

[0039] Please refer to Figure 2In another embodiment of this application, the CT detector module further includes a mounting base, a pressure plate 6, and a mounting plate 7. The mounting base includes a first extension arm 51, a second extension arm 55, a first side wall 52, a second side wall 54, and a bottom wall 53. The first extension arm 51, the first side wall 52, the bottom wall 53, the second side wall 54, and the second extension arm 55 are connected sequentially, and adjacent components are perpendicular to each other at the connection point, forming a U-shaped groove structure. The mounting plate 7 is respectively disposed on the first extension arm 51 and the second extension arm 55.

[0040] The first sidewall 52, the second sidewall 54, and the bottom wall 53 form a recessed guide groove 56. The guide groove 56 is configured to guide the flexible circuit boards 3 of the first and second detector units to bend along paths in opposite directions. The pressure plate 6 is configured to cooperate with the mounting plate 7 to fix the starting portion of the bend of the flexible circuit board 3 from both sides, preventing the flexible circuit board 3 from loosening at the starting position of the bend. After bending, the flexible circuit board 3 runs along the first sidewall 52 or the second sidewall 54 and passes through the bottom wall 53 to achieve connection with subsequent signal processing circuitry.

[0041] Please refer to Figure 3 This application also provides a signal processing method for a CT detector module. The method is applied to a CT detector module in which multiple detector units are arranged in multiple columns. Adjacent first and second columns of detector units are placed opposite each other. The flexible circuit boards of the first column of detector units are bent in a first direction, and the flexible circuit boards of the second column of detector units are bent in a second direction opposite to the first direction. There is a physical gap between the roots of the bends in the flexible circuit boards of adjacent columns of detector units. The method includes the following steps: The first raw projection data output by the first column of detector units and the second raw projection data output by the second column of detector units are acquired. Since the first column of detector units and the second column of detector units are placed opposite each other, their flexible circuit boards 3 are bent in opposite directions, resulting in the detector pixels of the two columns of detector units being arranged in opposite order in physical space.

[0042] The spatial orientation of the second column of detector units is identified as a horizontal mirror image of the first column. "Identifying spatial orientation" refers to determining the installation direction of the detector units to ascertain whether the projected data they acquire requires flip correction.

[0043] In one embodiment of this application, the orientation is identified by the level of a preset orientation indicator pin. For example, the orientation indicator pin of the first column of detector units outputs a high level, and the orientation indicator pin of the second column of detector units outputs a low level. The spatial orientation of the detector units is determined by the difference in the level.

[0044] In other embodiments of this application, identification can also be achieved through software configuration registers. For example, during detector unit initialization, specific bits in the configuration register can be used to identify the installation orientation of the detector unit. Alternatively, identification can be achieved through address encoding in the communication protocol, with detector units installed in different orientations assigned different addresses. Any method that can distinguish the spatial orientation of the detector unit falls within the scope of protection for "identification" in this application.

[0045] Perform a line-by-line horizontal mirror flip operation on the second original projection data. Specifically, flip the pixel data sequence [p1, p2, ..., p] of the second original projection data. n The order of ] is reversed to [p n [p1, ..., p2, p1]. This operation makes the pixel spatial order of the second raw projection data consistent with the physical spatial arrangement order of the detector pixels of the first column detector unit.

[0046] The flipped second original projection data and the first original projection data are then stitched together according to the physical position index order of each detector unit in the circumferential direction of the CT detector module to generate complete data. In the stitched data frame, the projection data of all detector units are arranged in order of their actual physical positions on the circumference, forming spatially continuous complete data.

[0047] By using the above signal processing method, the projection data collected by the reverse-arranged detector units are flipped and corrected, so that the projection data of all detector units are spatially continuous and consistent, ensuring that the subsequent image reconstruction algorithm can correctly process the data.

[0048] This application also provides a signal processing system for executing the above-described CT detector module signal processing method. The system includes a orientation recognition module and a data processing module.

[0049] The orientation recognition module is configured to identify the spatial orientation of the second column of detector units as a horizontal mirror image of the first column of detector units. The orientation recognition module can be any of the following: field-programmable gate array, application-specific integrated circuit, or microcontroller.

[0050] The data processing module is configured to perform a row-by-row horizontal mirroring flip operation on the second original projection data output by the second column detector unit, and then splice the flipped second original projection data with the first original projection data output by the first column detector unit according to the physical position index order of each detector unit in the circumferential direction of the CT detector module to generate a complete data frame.

[0051] In one specific embodiment, the data processing module includes a dual-port random access memory (DRAM) and address control logic. One port of the DRAM is used to write second raw projection data, and the other port is used to read the flipped data in reverse address order. The address control logic, according to the address reversal rule, writes data to addresses p1, p2, ..., p... n The corresponding read address is changed to p n p1, ..., p2, p1, to achieve horizontal mirror flipping of pixel data.

[0052] This application also provides an electronic device, including a processor and a memory. The memory stores a computer program, and the processor executes the computer program to implement the methods of any of the above embodiments. The processor may be a general-purpose processor, a digital signal processor, an application-specific integrated circuit, a field-programmable gate array, or other programmable logic devices. The memory may include volatile memory and non-volatile memory for storing computer programs and data.

[0053] It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases the steps shown or described may be executed in a different order than that shown here.

[0054] Obviously, those skilled in the art should understand that the various units or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. Optionally, they can be implemented using computer-executable program code, thereby storing them in a storage device for execution by a computing device, or fabricating them separately as individual integrated circuit modules, or fabricating multiple modules or steps into a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0055] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A CT detector module, characterized in that, include: Multiple detector units, each detector unit including a scintillator, a photodiode and a flexible circuit board, wherein the photodiode is mounted on the flexible circuit board, and the length and width of the scintillator in the horizontal direction are both greater than the length and width of the photodiode in the horizontal direction; The multiple detector units are arranged in multiple columns, with the first column of detector units and the second column of detector units placed opposite each other. The flexible circuit board of the first column of detector units is bent in a first direction, and the flexible circuit board of the second column of detector units is bent in a second direction opposite to the first direction. There is a physical gap between the roots of the bends of the flexible circuit boards of the adjacent columns of detector units. A ceramic reinforcing plate is fixed on the flexible circuit board. The flexible circuit board is bent from the end of the ceramic reinforcing plate. The sum of the thickness of the flexible circuit board after bending and the width of the ceramic reinforcing plate is less than the width of the scintillator.

2. The CT detector module according to claim 1, characterized in that, The relative placement is as follows: in the first column of detector units, the center line of the photodiode and the flexible circuit board connected to it is located on the first side of the center line of the scintillator; in the second column of detector units, the center line of the photodiode and the flexible circuit board connected to it is located on the second side of the center line of the scintillator; the first column of detector units and the second column of detector units are arranged in a back-to-back mirror symmetrical arrangement.

3. The CT detector module according to claim 1, characterized in that, The ceramic reinforcing plate extends to form a rounded chamfered structure at its end.

4. The CT detector module according to claim 1, characterized in that, The CT detector module further includes a mounting base, a pressure plate, and a mounting plate. The mounting base includes a first extension arm, a second extension arm, a first sidewall, a second sidewall, and a bottom wall. The first extension arm, the first sidewall, the bottom wall, the second sidewall, and the second extension arm are connected sequentially, and adjacent components are perpendicular to each other at the connection point. The mounting plate is respectively disposed on the first extension arm and the second extension arm. The first sidewall, the second sidewall, and the bottom wall form a recessed guide groove. The guide groove is configured to guide the flexible circuit boards of the first and second rows of detector units to bend along paths in opposite directions. The pressure plate is configured to cooperate with the mounting plate to fix the bending start portion of the flexible circuit board from both sides of the flexible circuit board. After bending, the flexible circuit board runs along the first sidewall or the second sidewall and passes through the bottom wall.

5. A signal processing method for a CT detector module, applied to a CT detector module, wherein multiple detector units in the CT detector module are arranged in multiple columns, with adjacent first and second columns of detector units placed opposite each other, the flexible circuit boards of the first column of detector units being bent in a first direction, and the flexible circuit boards of the second column of detector units being bent in a second direction opposite to the first direction, characterized in that, The method includes: Acquire the first raw projection data output by the first column detector unit and the second raw projection data output by the second column detector unit; The spatial orientation of the second column of detector units is identified as a horizontal mirror image of the first column of detector units. Perform a line-by-line horizontal mirroring flip operation on the second original projection data; The flipped second original projection data and the first original projection data are spliced ​​together according to the physical position index order of each detector unit in the circumferential direction of the CT detector module to generate complete data.

6. The CT detector module signal processing method according to claim 5, characterized in that, The spatial orientation of the second column of detector units is identified by the level of the preset orientation indicator pin.

7. The CT detector module signal processing method according to claim 5, characterized in that, The row-by-row horizontal mirroring flip operation is as follows: The pixel data sequence [p1, p2, ..., p] of the second original projection data is transformed into the pixel data sequence [p1, p2, ..., p...]. n The order of ] is reversed to [p n ,...,p2, p1).

8. A signal processing system, characterized in that, The signal processing method for the CT detector module according to any one of claims 5 to 7 includes: The orientation recognition module is configured to identify that the spatial orientation of the second column of detector units is a horizontal mirror image of the first column of detector units. The data processing module is configured to perform a row-by-row horizontal mirroring flip operation on the second original projection data output by the second column detector unit, and then splice the flipped second original projection data with the first original projection data output by the first column detector unit according to the physical position index order of each detector unit in the circumferential direction of the CT detector module to generate a complete data frame.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the CT detector module signal processing method according to any one of claims 5 to 7.

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