Wafer surface cleaning device

Abstract

The application relates to the field of semiconductor manufacturing, and discloses a wafer surface cleaning device which comprises a support column, a support arm and a cleaning box. A transmission box is arranged on the top of the cleaning box, a plurality of support shafts are arranged on the top of the transmission box, a wafer is placed on the top of the support shaft, a rotating disc is rotatably arranged on the side of the support arm, a rotating shaft is rotatably arranged on the side of the rotating disc, and a cleaning roller is fixedly arranged on the outer surface of the rotating shaft. The device utilizes the rotating shaft and gear two arranged eccentrically on the bottom of the inner side of the rotating disc to realize the function that the rotating shaft, the cleaning roller and the brush rotate into the placing cavity. Gear one and gear two are utilized to drive the rotating shaft to rotate by the motor three, meanwhile, when the rotating shaft and the brush enter the bottom of the placing cavity, the clamping plate arranged on the bottom of the placing cavity and the rotating brush produce mechanical interference, and the impurities remaining on the end and the inner side of the brush are removed in the process that the two produce rigid collision, so that the self-cleaning function of the brush is realized.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a wafer surface cleaning apparatus. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. After slicing, the wafer undergoes photolithography, etching, and cleaning to create recessed circuit structures on its surface. Wafer cleaning primarily targets photoresist residue and reactive materials remaining on the surface after etching. The quality of cleaning directly determines wafer yield; even tiny impurities can cause short circuits or open circuits in the chip circuitry, making it a crucial and indispensable step in semiconductor back-end processes.

[0003] In existing technologies, wafer cleaning primarily relies on spraying deionized water onto the wafer surface. A support platform supports the wafer and rotates it. A rotating roller (with brushes on its surface) positioned above the wafer then approaches the wafer surface to brush away impurities that cannot be naturally washed away by the cleaning solution. However, during the cleaning process, varying degrees of impurities remain at the tips of the brushes. Since it is impossible to rinse the brushes near the wafer surface with high-pressure cleaning solution, impurities tend to accumulate at the brush tips. Repeated use can cause secondary contamination of the wafer, scratching the delicate nanoscale circuit patterns and affecting the subsequent wafer surface cleaning effect. Therefore, this technological bottleneck urgently needs to be addressed. Summary of the Invention

[0004] This application proposes a wafer surface cleaning device with the advantage of high cleaning efficiency, which solves the problems in the prior art.

[0005] To achieve the above objectives, this application adopts the following technical solution: a wafer surface cleaning device, comprising a support column, a support arm, and a cleaning tank. A transmission box is installed on the top of the cleaning tank, and multiple sets of support shafts are provided on the top of the transmission box. A wafer is placed on the top of the support shaft. A rotating disk is rotatably installed on the side of the support arm, and a rotating shaft is rotatably installed on the side of the rotating disk. A cleaning roller is fixedly sleeved on the outer surface of the rotating shaft, and multiple sets of brushes are provided on the outer surface of the cleaning roller. A connecting plate is installed on the side of the support arm, and a cleaning groove is fixedly connected to the inner side of the connecting plate. A placement cavity is opened inside the cleaning groove, and two sets of fitting grooves are opened on the surface of the cleaning groove, extending along the axial direction of the rotating disk. A clamping plate is fixedly connected to the bottom of the placement cavity, and multiple sets of clamping slots are opened on the top of the clamping plate. This application addresses the technical shortcomings of existing wafer cleaning equipment, such as the brushes easily accumulating impurities, causing secondary contamination of wafers with repeated use, and scratching the nanoscale circuit patterns on wafers. Through structural innovation, it realizes the combined rotation-revolution motion of the brush and the in-situ self-cleaning function of the brush, effectively improving the quality of wafer cleaning and the practicality of the equipment.

[0006] This device features a rotating shaft, cleaning roller, and brushes that can rotate and revolve synchronously. A second motor drives the rotating disk to revolve, switching the brushes between the wafer cleaning station and the self-cleaning station. A third motor, through gear meshing, drives the rotating shaft, cleaning roller, and brushes to rotate. On one hand, the rotating brushes, in conjunction with the deionized water sprayed from the nozzle, scrape away residual impurities such as photoresist and etching reactants from the rotating wafer surface. The centrifugal force generated by the wafer's rotation removes these impurities along with the cleaning medium, ensuring a good basic cleaning effect. On the other hand, the brushes can revolve with the rotating disk and enter the placement chamber inside the cleaning tank to complete the self-cleaning operation.

[0007] The cleaning tank provides an independent, self-cleaning space for the brushes, preventing impurities and mixed cleaning fluid from splashing onto the wafer surface during the brush cleaning process. A retaining plate and slot are located at the bottom of the placement chamber. During brush rotation, mechanical interference and rigid collisions with the retaining plate dislodge and scrape off impurities stuck to the brush tips and crevices. The slot also combs the brushes, further removing residual dirt hidden inside. The cleaning tank is equipped with a replenishment pipe to continuously supply fresh cleaning fluid, and overflow channels on both sides of the tank allow dirty liquid mixed with brush impurities to overflow and drain promptly, achieving dynamic replenishment of the cleaning fluid, maintaining the cleanliness of the cleaning medium inside the tank, and ensuring continuous and reliable brush self-cleaning.

[0008] This device eliminates the need for an additional independent brush disassembly and cleaning mechanism. The brushes can perform online self-cleaning within the equipment, eliminating the need for brush disassembly and maintenance. This reduces equipment downtime and labor costs, eliminating the risk of secondary wafer contamination from the brushes at the source, reducing short circuits and open circuits in chip circuits, and improving wafer processing yield. The entire system is highly integrated, with convenient station switching and reliable motion mechanism coordination. It balances wafer cleaning efficiency and brush self-cleaning capabilities, and is adaptable to the continuous operation requirements of semiconductor production lines. Suitable for semiconductor wafer cleaning processes, it has good practical application value and promising prospects for widespread adoption.

[0009] Preferably, a motor is installed inside the support column, the output shaft of the motor is fixedly connected to the bottom of the support arm, a motor is installed inside the support arm, the output shaft of the motor is fixedly connected to the rotating disk, a motor is installed inside the rotating disk, and a gear is fixedly connected to one end of the rotating shaft, which meshes with the gear.

[0010] Preferably, a replenishment pipe is fixedly connected to the outside of the cleaning tank, the inner cavity of the cleaning tank is filled with cleaning fluid, and the rotating shaft and cleaning roller can rotate around the axis of the rotating disk to enter the placement cavity.

[0011] Preferably, a nozzle is connected to the back of the cleaning chamber, and the tip of the nozzle is tilted towards the upper surface of the wafer.

[0012] Preferably, the liquid level of the cleaning fluid is lower than the bottom of the adapter tank, and overflow channels are provided on both sides of the cleaning tank at the bottom of the adapter tank.

[0013] Preferably, the length of the cleaning roller is greater than the diameter of the wafer, and the cleaning roller is located directly above the diameter of the wafer.

[0014] Preferably, both the rotating shaft and the second gear are eccentrically positioned at the bottom of the inner cavity of the rotating disk, and the diameter of the second gear is greater than the diameter of the first gear.

[0015] Preferably, the inner side of the adapter groove is an arc-shaped structure coaxially distributed with the rotating disk, and the rotating shaft slides and adapts to the inside of the adapter groove.

[0016] The beneficial effects of this invention are as follows: 1. This device has been redesigned to significantly improve the cleaning efficiency of the brushes and further enhance the cleaning quality. To achieve this, the device is designed so that the rotating shaft, cleaning roller, and brush can rotate and revolve synchronously. Combined with independently set cleaning grooves, the brushes are cleaned in an isolated manner. A second motor is connected to a rotating disk, which revolves under the drive of the second motor. A rotating shaft and a second gear, eccentrically positioned at the bottom inner side of the rotating disk, allow the rotating shaft, cleaning roller, and brushes to rotate into the placement chamber. Gears one and two drive the rotating shaft to rotate using a third motor. Simultaneously, as the shaft and brush enter the bottom of the placement chamber, a clamping plate at the bottom of the chamber mechanically interferes with the rotating brush, removing residual impurities from the brush tips and inner sides during the rigid collision process, thus achieving a self-cleaning function for the brushes.

[0017] 2. Then, to prevent impurities and cleaning fluid mixed with cleaning impurities from falling onto the wafer surface during self-cleaning, the length of the cleaning tank is designed to be greater than the length of the wafer and the cleaning chamber. This ensures that the overflow channels on both sides of the cleaning tank are far away from the transmission box and the edge of the wafer, preventing secondary contamination of the cleaned wafer. Multiple slots on the top of the card plate allow some brushes to pass through the slots, dispersing the brushes and further cleaning the impurities remaining on the inside of the brushes. New cleaning fluid is continuously introduced into the placement chamber through the replenishment pipe, and the cleaning fluid mixed with the cleaning impurities from the brushes is continuously discharged through the overflow channels on both sides of the cleaning tank, realizing the cleaning fluid renewal function. This ensures the cleaning ability of the brushes and effectively improves the practicality of the device. Attached Figure Description

[0018] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.

[0019] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein: Figure 1 This is a front view diagram of the overall structure of the present invention; Figure 2 This is a side view of the overall structure of the present invention; Figure 3 This is a three-dimensional schematic diagram of the overall structure of the present invention; Figure 4 This is a side sectional view of the rotating shaft, cleaning roller, brush, and cleaning groove of the present invention; Figure 5 For the present invention Figure 4 Enlarged schematic diagram of the structure at point A; Figure 6 This is a schematic diagram showing the separation of the rotating shaft, cleaning roller, brush, connecting plate, and cleaning groove of the present invention; Figure 7 This is a side cross-sectional view of the rotating shaft, cleaning roller, brush, and cleaning groove of the present invention. Figure 2 ; Figure 8 For the present invention Figure 7 Enlarged schematic diagram of the structure at point B; Figure 9 This is a cross-sectional view of the shaft, cleaning roller, brush, and cleaning groove of the present invention.

[0020] The components are as follows: 1. Support column; 2. Support arm; 3. Rotary disk; 4. Rotating shaft; 5. Cleaning roller; 6. Brush; 7. Cleaning box; 8. Transmission box; 9. Support shaft; 10. Wafer; 11. Nozzle; 12. Connecting plate; 13. Cleaning groove; 14. Placement cavity; 15. Adaptor groove; 16. Supplement pipe; 17. Motor 1; 18. Motor 2; 19. Motor 3; 20. Gear 1; 21. Gear 2; 22. Card plate; 23. Card slot. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] Please see Figures 1-9This embodiment discloses a wafer surface cleaning device, including a support column 1, a support arm 2 and a cleaning box 7. A transmission box 8 is installed on the top of the cleaning box 7. Multiple sets of support shafts 9 are provided on the top of the transmission box 8. A wafer 10 is placed on the top of the support shafts 9. A rotating disk 3 is rotatably installed on the side of the support arm 2. A rotating shaft 4 is rotatably installed on the side of the rotating disk 3. A cleaning roller 5 is fixedly sleeved on the outer surface of the rotating shaft 4. Multiple sets of brushes 6 are provided on the outer surface of the cleaning roller 5. A connecting plate 12 is installed on the side of the support arm 2. A cleaning groove 13 is fixedly connected to the inner side of the connecting plate 12. A placement cavity 14 is opened inside the cleaning groove 13. Two sets of fitting grooves 15 are opened on the surface of the cleaning groove 13, which penetrate along the axial direction of the rotating disk 3. A clamping plate 22 is fixedly connected to the bottom of the placement cavity 14. Multiple sets of clamping slots 23 are opened on the top of the clamping plate 22. This device has been redesigned to significantly improve the cleaning efficiency of the brush 6 and further enhance the cleaning quality. To achieve this, the device is designed so that the rotating shaft 4, cleaning roller 5, and brush 6 can rotate and revolve synchronously. It works in conjunction with the independently set cleaning groove 13 to perform isolated cleaning of the brush 6. A rotating disk 3 is connected to a motor 2 18, which drives the rotating disk 3 to revolve. The rotating shaft 4 and gear 2 21, which are eccentrically set at the bottom of the inner side of the rotating disk 3, enable the rotating shaft 4, cleaning roller 5, and brush 6 to rotate into the placement cavity 14. The rotating shaft 4 is driven to rotate by the motor 3 19 using gear 1 20 and gear 2 21. At the same time, when the rotating shaft 4 and brush 6 enter the bottom of the placement cavity 14, the clamping plate 22 set at the bottom of the placement cavity 14 mechanically interferes with the rotating brush 6. During the rigid collision between the two, the impurities remaining at the end and inside of the brush 6 are removed, thus realizing the self-cleaning function of the brush 6.

[0023] Then, to prevent impurities and cleaning fluid mixed with cleaning impurities from falling onto the surface of the wafer 10 during the self-cleaning process of the brush 6, the length of the cleaning tank 13 is designed to be greater than the length of the wafer 10 and the cleaning tank 7. This keeps the overflow channels on both sides of the cleaning tank 13 away from the transmission box 8 and the edge of the wafer 10, preventing secondary contamination of the cleaned wafer 10. Multiple sets of slots 23 are opened on the top of the card plate 22, allowing some of the brushes 6 to pass through the slots 23 and disperse the brushes 6, further cleaning the impurities remaining on the inside of the brushes 6. New cleaning fluid is continuously introduced into the placement chamber 14 through the replenishment pipe 16, and the cleaning fluid mixed with the impurities of the brushes 6 is continuously discharged through the overflow channels on both sides of the cleaning tank 13, realizing the cleaning fluid renewal function, thereby ensuring the cleaning ability of the brushes 6 and effectively improving the practicality of the device.

[0024] In this embodiment, a motor 17 is installed inside the support column 1. The output shaft of the motor 17 is fixedly connected to the bottom of the support arm 2. A motor 28 is installed inside the support arm 2. The output shaft of the motor 28 is fixedly connected to the rotating disk 3. A motor 39 is installed inside the rotating disk 3. A gear 21 located inside the rotating disk 3 is fixedly connected to one end of the rotating shaft 4. Gear 1 20 meshes with gear 2 21. like Figures 1-5 As shown, the support column 1 provides rotational support for the support arm 2, enabling the support arm 2 to rotate around the axis of the support column 1 under the drive of motor 17, thereby realizing the horizontal transfer function of the brush 6. Motor 18 is used to drive the rotating disk 3 and the brush 6 to rotate around the axis of the rotating disk 3, enabling the rotating shaft 4, the cleaning roller 5 and the brush 6 to work and switch between self-cleaning positions. The rotating shaft 4 is connected to the gear 21 through gear 20 and achieves self-rotation, thus completing the scraping and cleaning of the surface of the wafer 10.

[0025] In this embodiment, a replenishment pipe 16 is fixedly connected to the outside of the cleaning tank 13, and the inner cavity of the cleaning tank 13 is filled with cleaning fluid. The rotating shaft 4 and the cleaning roller 5 can rotate around the axis of the rotating disk 3 and enter the placement cavity 14. like Figures 1-6 As shown, the replenishment pipe 16 is installed on the top outside the cleaning tank 13. It can supply cleaning fluid into the placement cavity 14 and continuously soak and clean the brush 6 that enters the placement cavity 14. The brush 6 is cleaned in conjunction with the rotation of the rotating shaft 4, the cleaning roller 5 and the brush 6.

[0026] In this embodiment, a nozzle 11 is connected to the back of the cleaning tank 7, and the top of the nozzle 11 is tilted towards the upper surface of the wafer 10. like Figure 2 As shown, the cleaning tank 7 has a built-in pump component for pumping deionized water into the wafer 10 along the nozzle 11. The nozzle 11, with its top opening tilted towards the upper surface of the wafer 10, is responsible for continuously delivering deionized water into the surface of the wafer 10. At this time, the rotating wafer 10 will clean the impurities and reaction residues on its surface under the action of the deionized water, and the centrifugal force generated by the rotation of the wafer 10 will throw the deionized water away.

[0027] In this embodiment, the liquid level of the cleaning fluid is lower than the bottom of the adapter tank 15, and overflow grooves located at the bottom of the adapter tank 15 are provided on both sides of the cleaning tank 13. like Figures 2-9 As shown, the liquid level of the cleaning fluid is lower than the bottom of the adapter tank 15. The bottom opening of the adapter tank 15 is provided with an overflow channel. When too much cleaning fluid enters the placement chamber 14, it will be discharged along the overflow channel. This not only refreshes the cleaning fluid and maintains its purity, but also discharges the cleaning fluid mixed with impurities from the cleaning brush 6 from the placement chamber 14.

[0028] In this embodiment, the length of the cleaning roller 5 is greater than the diameter of the wafer 10, and the cleaning roller 5 is located directly above the diameter of the wafer 10. like Figures 1-9 As shown, the cleaning roller 5 needs to cover the upper surface of the wafer 10, and its length must be greater than the diameter of the wafer 10. So that when the cleaning roller 5 rotates and comes into contact with the wafer 10 which is also rotating, it can effectively clean the photoresist and other impurities remaining on the surface of the wafer 10.

[0029] In this embodiment, both the rotating shaft 4 and the second gear 21 are eccentrically positioned at the bottom of the inner cavity of the rotating disk 3, and the diameter of the second gear 21 is greater than the diameter of the first gear 20. like Figures 1-9 As shown, the rotating shaft 4 and gear 21 are both eccentrically positioned at the bottom of the inner cavity of the rotating disk 3. On one hand, the motor 319 drives gear 120 and gear 21 to rotate the rotating shaft 4, cleaning roller 5 and brush 6 to achieve the cleaning function on the upper surface of the wafer 10. On the other hand, the motor 218 drives the rotating disk 3 to rotate as a whole, and drives the rotating shaft 4, cleaning roller 5 and brush 6 to revolve and enter the placement cavity 14 to complete the self-cleaning.

[0030] In this embodiment, the inner side of the adapter groove 15 is an arc-shaped structure coaxially distributed with the rotating disk 3, and the rotating shaft 4 slides and adapts to the inside of the adapter groove 15. like Figures 1-9 As shown, the arc structure of the adapter groove 15 allows the rotating shaft 4 to rotate through, and it fits and abuts against the bottom of the adapter groove 15 when the rotating shaft 4 enters it. The front opening of the cleaning groove 13 can accommodate the rotating shaft 4, the cleaning roller 5 and the brush 6 to enter the inner cavity of the placement cavity 14 simultaneously, and complete the self-cleaning preparation work of the brush 6.

[0031] Working principle: When this device is in operation, firstly, the motor 17 is started, which drives the support arm 2 to rotate 90° clockwise around the axis of the support column 1, thereby driving the rotating disk 3, connecting plate 12, cleaning groove 13, rotating shaft 4, cleaning roller 5 and brush 6 to make way for the wafer 10. Then, the robotic arm places the wafer 10 on the four sets of support shafts 9. Then, the control motor 17 reverses and drives the rotating disk 3, connecting plate 12, cleaning tank 13, rotating shaft 4, cleaning roller 5 and brush 6 to reset the wafer 10. At this time, the rotating shaft 4, cleaning roller 5 and brush 6 are directly above the diameter of the wafer 10. The deionized water in the cleaning tank 7 is sprayed obliquely onto the upper surface of the wafer 10 through the spray pipe 11. The support shaft 9 is started and drives the wafer 10 to rotate. The deionized water cleans the surface of the wafer 10 and throws the impurities away under the centrifugal force generated by the rotation of the wafer 10. The motor 3 19 is started and drives the rotating shaft 4, cleaning roller 5 and brush 6 to rotate through gear 1 20 and gear 2 21. The upper surface of the wafer 10 is scraped synchronously to remove the impurities remaining on the surface of the wafer 10 and they are removed by the centrifugal force generated by the rotation of the deionized water and the wafer 10. Finally, when it is necessary to clean the brush 6, motor 18 can be started, which will drive the rotating disk 3 and the rotating shaft 4 to rotate 270° counterclockwise around the axis of the rotating disk 3, so that the rotating shaft 4, the cleaning roller 5 and the brush 6 enter the placement cavity 14, as shown. Figures 7-9 As shown, at this time, the motor 19 is started, and the rotating shaft 4, cleaning roller 5 and brush 6 are rotated in any direction through gear 20 and gear 21. At this time, the brush 6 is soaked and cleaned by the cleaning liquid in the placement chamber 14. The rotating cleaning roller 5 will cause the brush 6 to mechanically interfere with the clamping plate 22. The end of the brush 6 and the clamping plate 22 will have a rigid collision, thereby cleaning the residual impurities at the end of the brush 6. The cleaning liquid is continuously replenished through the replenishment pipe 16. The cleaning liquid carries the impurities and overflows to the outside along the overflow grooves on both sides of the cleaning tank 13.

[0032] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A wafer surface cleaning apparatus, comprising a support column (1), a support arm (2), and a cleaning tank (7), wherein a transmission box (8) is mounted on the top of the cleaning tank (7), and a plurality of support shafts (9) are provided on the top of the transmission box (8), and a wafer (10) is placed on the top of the support shafts (9), characterized in that, A rotating disk (3) is rotatably mounted on the side of the support arm (2), and a rotating shaft (4) is rotatably mounted on the side of the rotating disk (3). A cleaning roller (5) is fixedly sleeved on the outer surface of the rotating shaft (4). Multiple sets of brushes (6) are provided on the outer surface of the cleaning roller (5). A connecting plate (12) is mounted on the side of the support arm (2). A cleaning groove (13) is fixedly connected to the inner side of the connecting plate (12). A placement cavity (14) is opened inside the cleaning groove (13). Two sets of fitting grooves (15) are opened on the surface of the cleaning groove (13) and pass through the axial direction of the rotating disk (3). A card plate (22) is fixedly connected to the bottom of the placement cavity (14). Multiple sets of card slots (23) are opened on the top of the card plate (22).

2. The wafer surface cleaning apparatus according to claim 1, characterized in that, The support column (1) is equipped with a motor 1 (17), the output shaft of the motor 1 (17) is fixedly connected to the bottom of the support arm (2), the support arm (2) is equipped with a motor 2 (18), the output shaft of the motor 2 (18) is fixedly connected to the rotating disk (3), the rotating disk (3) is equipped with a motor 3 (19), one end of the rotating shaft (4) is fixedly connected to a gear 2 (21) located inside the rotating disk (3), and the gear 1 (20) meshes with the gear 2 (21).

3. The wafer surface cleaning apparatus according to claim 2, characterized in that, A replenishment pipe (16) is fixedly connected to the outside of the cleaning tank (13). The inner cavity of the cleaning tank (13) is filled with cleaning fluid. The rotating shaft (4) and the cleaning roller (5) can rotate around the axis of the rotating disk (3) and enter the placement cavity (14).

4. The wafer surface cleaning apparatus according to claim 3, characterized in that, The back of the cleaning tank (7) is connected to a nozzle (11), the top of which is tilted toward the upper surface of the wafer (10).

5. A wafer surface cleaning apparatus according to claim 4, characterized in that, The liquid level of the cleaning fluid is lower than the bottom of the adapter tank (15), and overflow tanks located at the bottom of the adapter tank (15) are provided on both sides of the cleaning tank (13).

6. The wafer surface cleaning apparatus according to claim 5, characterized in that, The length of the cleaning roller (5) is greater than the diameter of the wafer (10), and the cleaning roller (5) is located directly above the diameter of the wafer (10).

7. A wafer surface cleaning apparatus according to claim 6, characterized in that, The rotating shaft (4) and the second gear (21) are both eccentrically positioned at the bottom of the inner cavity of the rotating disk (3), and the diameter of the second gear (21) is greater than the diameter of the first gear (20).

8. A wafer surface cleaning apparatus according to claim 7, characterized in that, The inner side of the adapter groove (15) is an arc-shaped structure coaxially distributed with the rotating disk (3), and the rotating shaft (4) slides and adapts to the inside of the adapter groove (15).

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