Cleaning liquid removal device and method of removing cleaning liquid using the same

Abstract

The present invention relates to a cleaning solution removing apparatus and a cleaning solution removing method using the same. The cleaning solution removing apparatus according to the present invention includes a first bracket, a pair of first nozzles fixed to the first bracket so as to be reciprocally movable in a horizontal direction parallel to the first bracket and spraying air, a pair of suctioners fixed to the first bracket so as to be reciprocally movable in the horizontal direction, a second bracket facing the first bracket in a direction crossing the horizontal direction, a pair of second nozzles fixed to the second bracket so as to be reciprocally movable in the horizontal direction and spraying air, and a pair of heaters fixed to the second bracket so as to be reciprocally movable in the horizontal direction and using an induction heating method.

Description

Technical Field

[0001] This invention relates to a cleaning fluid removal apparatus and a cleaning fluid removal method using the same. More specifically, this invention relates to a cleaning fluid removal apparatus for removing cleaning fluid remaining in a mask used during the manufacturing process of a display device, and a cleaning fluid removal method using the same. Background Technology

[0002] A display device is a device for displaying images to provide visual information to a user. An organic light-emitting display device (OLED) may include a light-emitting element comprising an anode electrode, a light-emitting layer, and a cathode electrode. To form the light-emitting layer, a mask such as a fine metal mask can be used. A thin film with a desired pattern can be formed on a substrate using a deposition process utilizing the mask.

[0003] During the deposition process, deposited material may also be deposited onto the mask. After the deposition process, the mask can be cleaned using a cleaning process. For example, this can be done by spraying a cleaning solution onto the mask surface or by immersing the mask in a cleaning solution.

[0004] If a deposition process is performed with cleaning solution remaining on the mask surface after the cleaning process, various problems may occur. Therefore, in order to consistently maintain the quality of the deposition process, it is particularly important to effectively remove the cleaning solution remaining on the mask surface (i.e., residual cleaning solution). Summary of the Invention

[0005] One object of the present invention is to provide a cleaning fluid removal device for removing cleaning fluid remaining on the surface of a mask after cleaning the mask.

[0006] Another object of the present invention is to provide a cleaning fluid removal method using the cleaning fluid removal device.

[0007] However, the purpose of this invention is not limited to the above-described purpose, and it can be expanded in various ways without departing from the spirit and scope of this invention.

[0008] To achieve the aforementioned objective of the present invention, a cleaning fluid removal device according to an embodiment of the present invention may include: a first support; a pair of first nozzles reciprocally fixed to the first support in a horizontal direction parallel to the first support and spraying air; a pair of suction devices reciprocally fixed to the first support in the horizontal direction; a second support facing the first support in a direction intersecting the horizontal direction; a pair of second nozzles reciprocally fixed to the second support in the horizontal direction and spraying air; and a pair of heaters reciprocally fixed to the second support in the horizontal direction and utilizing induction heating.

[0009] In one embodiment, the cleaning fluid removal device may further include: a vortex tube connected to the pair of first nozzles and the pair of second nozzles. The vortex tube may include: an inlet for receiving compressed air; a pipe communicating with the inlet and forming a high-speed vortex within its internal space; a first outlet communicating with the pipe and discharging first air separated from the high-speed vortex; and a second outlet communicating with the pipe and discharging second air separated from the high-speed vortex and having a temperature different from the first air.

[0010] In one embodiment, the temperature of the first air may be greater than the temperature of the second air.

[0011] In one embodiment, the first support and the second support can be arranged facing each other with the mask having undergone the cleaning process placed between them.

[0012] In one embodiment, the pair of heaters can heat the mask to a temperature above the temperature at which the residual cleaning fluid on the mask evaporates, and the pair of suction devices can draw in the residual cleaning fluid and discharge it to the outside.

[0013] In one embodiment, the horizontal direction may be defined by a first direction and a second direction, the first support and the second support may face each other in a third direction intersecting the first direction and the second direction, and the pair of first nozzles, the pair of suction devices, the pair of second nozzles and the pair of heaters may move closer to or further away from each other as they move in the horizontal direction.

[0014] In one embodiment, when the pair of first nozzles and the pair of second nozzles are close to each other, first air can be sprayed; when the pair of first nozzles and the pair of second nozzles are far apart from each other, second air with a temperature different from that of the first air can be sprayed.

[0015] To achieve the aforementioned objective of the present invention, a cleaning fluid removal device according to an embodiment of the present invention may include: a first support; a first nozzle, which is reciprocally fixed to the first support in a horizontal direction parallel to the first support and sprays air; a suction device, which is reciprocally fixed to the first support in the horizontal direction and moves together with the first nozzle; a second support, which faces the first support in a direction intersecting the horizontal direction; a second nozzle, which is reciprocally fixed to the second support in the horizontal direction and sprays air; and a heater, which is reciprocally fixed to the second support in the horizontal direction and moves together with the second nozzle.

[0016] In one embodiment, the cleaning fluid removal device may further include: a vortex tube connected to the first nozzle and the second nozzle. The vortex tube may include: an inlet for compressed air to flow in; a pipe communicating with the inlet and forming a high-speed vortex in its internal space; a first outlet communicating with the pipe and discharging first air separated from the high-speed vortex; and a second outlet communicating with the pipe and discharging second air separated from the high-speed vortex and having a temperature different from that of the first air.

[0017] In one embodiment, the temperature of the first air may be greater than the temperature of the second air.

[0018] In one embodiment, the first support and the second support can be arranged facing each other with the mask for completing the cleaning process placed between them.

[0019] In one embodiment, the heater can heat the mask to a temperature above the temperature at which the residual cleaning fluid on the mask evaporates, and the suction device can draw in the residual cleaning fluid and discharge it to the outside.

[0020] In one embodiment, the first nozzle, the suction device, the second nozzle, and the heater may be arranged as a pair spaced apart from each other.

[0021] In one embodiment, the horizontal direction may be defined by a first direction and a second direction, the first support and the second support may face each other in a third direction intersecting the first direction and the second direction, and a pair of first nozzles, a pair of suction devices, a pair of second nozzles and a pair of heaters may move closer to or further away from each other as they move in the horizontal direction.

[0022] In one embodiment, when a pair of first nozzles and a pair of second nozzles are close to each other, first air can be sprayed; when a pair of first nozzles and a pair of second nozzles are far apart from each other, second air with a temperature different from that of the first air can be sprayed.

[0023] In one embodiment, the heater may utilize induction heating.

[0024] To achieve the aforementioned objective of the present invention, a cleaning fluid removal method according to an embodiment of the present invention may include the following steps: spraying a first air having a first temperature onto the object being treated along a fourth direction toward the center of the object being treated at the lower and upper parts of the object being treated; simultaneously spraying the first air from the lower part of the object being treated while inductively heating the object being treated along the fourth direction at the lower part of the object being treated; simultaneously spraying the first air onto the object being treated while drawing in residual cleaning fluid evaporated from the object being treated along the fourth direction at the upper part of the object being treated and discharging it; and spraying a second air having a second temperature different from the first temperature onto the object being treated at the lower and upper parts of the object being treated along a fifth direction away from the center of the object being treated along the fifth direction.

[0025] In one embodiment, the object to be processed may be a mask used in a cleaning process to remove deposited material.

[0026] In one embodiment, the first temperature may be greater than the second temperature.

[0027] In one embodiment, a pair of first nozzles that spray the first air or the second air onto the object being treated from the upper part and a pair of suction devices that draw in and expel evaporated residual cleaning liquid can move together, and a pair of second nozzles that spray the first air or the second air onto the object being treated from the lower part and a pair of heaters that induction heat the object being treated can also move together, and the pair of first nozzles, the pair of suction devices, the pair of second nozzles and the pair of heaters can move closer to or further away from each other as they move.

[0028] The cleaning fluid removal device according to an embodiment of the present invention can be arranged in the material flow line. Accordingly, the cycle time of the cleaning device for the object to be processed (e.g., a mask) can be maintained without changing the cycle time. By additionally removing the cleaning fluid remaining on the object to be processed in the material flow line, deposition efficiency can be improved and deposition quality can be maintained uniformly.

[0029] The heater included in the cleaning fluid removal device can utilize induction heating. Therefore, the heating / cooling time can be relatively fast.

[0030] The heater included in the cleaning fluid removal device is movable. Therefore, it can accommodate objects of various sizes that require processing.

[0031] The cleaning fluid removal device may include a vortex tube. The vortex tube opens its slits by supplying hot air to the object being treated, thereby further promoting the evaporation of the residual cleaning fluid. Furthermore, the vortex tube cools the object being treated to room temperature by supplying cold air to it.

[0032] The vortex tube can supply air to the object being processed from both the top and bottom. The air supplied from the top and bottom forms a flow path, which can further promote the evaporation of the residual cleaning solution.

[0033] The cleaning fluid removal device may include a suction device. The suction device can discharge the residual cleaning fluid, which has been removed from the object being treated by air, to the outside. This prevents the residual cleaning fluid from being dispersed by the air.

[0034] However, the effects of the present invention are not limited to those described above, and various extensions can be made without departing from the spirit and scope of the present invention. Attached Figure Description

[0035] Figure 1 This is an exploded perspective view showing an example of a mask assembly that is a processing object of a cleaning fluid removal apparatus according to an embodiment of the present invention.

[0036] Figure 2 It is used for explanation Figure 1 A three-dimensional view of the mask assembly.

[0037] Figure 3 It is a section along line I-I' Figure 2 A cross-sectional view of the mask assembly.

[0038] Figure 4 It is shown in magnification Figure 3 A cross-sectional view of region A.

[0039] Figure 5 This is a cross-sectional view illustrating a cleaning fluid removal device according to an embodiment of the present invention.

[0040] Figure 6 yes Figure 5 A plan view of the cleaning fluid removal device.

[0041] Figure 7yes Figure 5 The back view of the cleaning fluid removal device.

[0042] Figure 8 It is shown and included Figure 5 A cross-sectional view of the vortex tube connected to the nozzle in the cleaning fluid removal device.

[0043] Figure 9 It is used to illustrate the use Figure 5 A sequence diagram of the cleaning fluid removal method of the cleaning fluid removal device.

[0044] Figure 10 and Figure 11 It is used for explanation Figure 9 A diagram illustrating the cleaning solution removal method.

[0045] Explanation of reference numerals in the attached figures: P1: First support; NZ1: First nozzle SU: A pair of suction devices; P2: Second support. NZ2: Second nozzle; HE: Heater VT: Vortex tube; MA: Mask DR1: First direction; DR2: Second direction DR3: Third-party Detailed Implementation

[0046] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same constituent elements in the drawings, and repeated descriptions of the same constituent elements will be omitted.

[0047] Figure 1 This is an exploded perspective view showing an example of a mask assembly as a processing object of a cleaning fluid removal apparatus according to an embodiment of the present invention. Figure 2 It is used for explanation Figure 1 A three-dimensional view of the mask assembly. Figure 3 It is a section along line I-I' Figure 2 A cross-sectional view of the mask assembly. Figure 4 It is shown in magnification Figure 3 A cross-sectional view of region A.

[0048] Reference Figures 1 to 3 The mask assembly MKA may include a mask frame MF, a first rod ST1, a second rod ST2, and a mask MK.

[0049] In one embodiment, the horizontal direction may be defined by a first direction DR1 and a second direction DR2. For example, the first direction DR1 and the second direction DR2 may intersect each other. For example, the first direction DR1 and the second direction DR2 may be perpendicular to each other. For example, a third direction DR3 may intersect the horizontal direction. For example, the third direction DR3 may be perpendicular to the horizontal direction.

[0050] The mask frame MF can define a frame opening MF-OP. For example, the mask frame MF can have a quadrilateral shape on a plane that defines a rectangular opening (i.e., the frame opening MF-OP), but the invention is not limited thereto. The shape of the mask frame MF and the shape of the frame opening MF-OP can be varied according to embodiments.

[0051] The mask frame MF can comprise a material with high rigidity. For example, the mask frame MF can comprise stainless steel, Invar, nickel, cobalt, etc. They can be used alone or in combination with each other. However, the invention is not limited thereto.

[0052] The first rod ST1 can be arranged on the mask frame MF. The first rod ST1 can overlap with the frame opening MF-OP in a plane. For example, the first rod ST1 can extend along the second direction DR2 and cross the frame opening MF-OP in a plane. A portion of the first rod ST1 can overlap with the frame opening MF-OP in a plane, and another portion of the first rod ST1 can be separated from the frame opening MF-OP in a plane.

[0053] The first rod ST1 may be attached (or bonded) to the mask frame MF. In one embodiment, the first rod ST1 may be attached (or bonded) to the mask frame MF by a welding process, but the invention is not limited thereto. Multiple first rods ST1 may be arranged along a first direction DR1. For example, the number of first rods ST1 may be four. However, the invention is not limited thereto. For example, the number of first rods ST1 may be three or less or five or more.

[0054] The second rod ST2 can be disposed on the mask frame MF. The second rod ST2 can overlap with the frame opening MF-OP in a plane. For example, the second rod ST2 can extend along the first direction DR1 and cross the frame opening MF-OP in a plane. A portion of the second rod ST2 can overlap with the frame opening MF-OP in a plane, and another portion of the second rod ST2 can be spaced apart from the frame opening MF-OP in a plane. The second rod ST2 can be attached to (or bonded to) the mask frame MF.

[0055] The second rod ST2 can be attached (or bonded) to the mask frame MF by welding, but the invention is not limited thereto. Multiple second rods ST2 can be arranged along the second direction DR2. For example, the number of second rods ST2 can be three. However, the invention is not limited thereto. For example, the number of second rods ST2 can be two or less or four or more.

[0056] In one embodiment, the second rod ST2 may be disposed on the first rod ST1. For example, the second rod ST2 may contact the upper surface of the first rod ST1 at the point where the first rod ST1 and the second rod ST2 intersect each other in a plane.

[0057] However, the present invention is not limited thereto, and the arrangement relationship of the first rod ST1 and the second rod ST2 can be varied according to the embodiments. For example, the first rod ST1 can also be arranged on the second rod ST2. In this case, the first rod ST1 can contact the upper surface of the second rod ST2 at the point where the first rod ST1 and the second rod ST2 intersect each other in the plane.

[0058] The first rod ST1 and the second rod ST2 can be arranged between the mask frame MF and the mask MK to prevent the mask MK from sagging due to gravity in the frame opening MF-OP of the mask frame MF.

[0059] Each of the first rod ST1 and the second rod ST2 may include aluminum, but the invention is not limited thereto.

[0060] The mask MK can be disposed on the second rod ST2. The mask MK can be attached (or bonded) to the mask frame MF. In one embodiment, the mask MK can be attached (or bonded) to the mask frame MF by a welding process, but the invention is not limited thereto.

[0061] In one embodiment, the mask MK may include an active region AA and an inactive region NA. The active region AA may overlap with the frame opening MF-OP in a plane. The active region AA may be spaced apart from the first rod ST1 in a plane. The active region AA may be spaced apart from the second rod ST2 in a plane. The inactive region NA may surround the active region AA. The inactive region NA may overlap with both the first rod ST1 and the second rod ST2 in a plane.

[0062] A mask opening MK-OP can be defined within the active region AA of the mask MK. For example, the mask opening MK-OP can have various shapes and arrangements depending on the pixels. The mask opening MK-OP can be located only within the active region AA, and not within the inactive region NA. For example, the mask opening MK-OP can overlap with the frame opening MF-OP in a plane, and be separated from the first rod ST1 and the second rod ST2 in a plane.

[0063] Multiple masks MK can be arranged along the first direction DR1. For example, the number of masks MK can be five. However, the invention is not limited thereto. For example, the number of masks MK can be four or less or six or more.

[0064] In one embodiment, the mask MK may be a fine metal mask, but the invention is not limited thereto. The mask MK may include Invar steel, but the invention is not limited thereto.

[0065] For example, a deposition apparatus may include a vacuum chamber, a deposition source for supplying evaporated / vaporized material to a substrate, and a mask assembly MKA for guiding the material evaporated from the deposition source. The substrate may be arranged spaced apart from the deposition source. The mask assembly MKA may be located between the substrate and the deposition source.

[0066] In the deposition process using the aforementioned deposition equipment, a deposition material (e.g., including organic materials) can be deposited on the substrate via a mask assembly MKA. Accordingly, a deposition layer (e.g., a light-emitting layer included in an organic light-emitting display device) can be formed on the substrate, but the invention is not limited thereto. For example, the deposition material may also include inorganic materials. The deposition material can be provided on the substrate through the frame opening MF-OP and the mask opening MK-OP. In this case, the deposition material can also be deposited on the mask assembly MKA (contaminant).

[0067] Further reference Figure 4 The mask MK can be attached (or bonded) to the mask frame MF via the bonding portion AP. As mentioned above, the mask MK can be attached (or bonded) to the mask frame MF via a welding process. The bonding portion AP can be the part of the mask MK that is attached (or bonded) to the mask frame MF via a welding process. For example, the bonding portion AP can connect the mask MK and the mask frame MF to each other.

[0068] When the mask MK is attached to the mask frame MF using the aforementioned welding process, portions may be formed where the mask MK and the mask frame MF are not bonded to each other. For example, portions of the mask MK that are not welded to the mask frame MF may be formed. For example, gaps SL may be formed as portions where the mask MK and the mask frame MF are not bonded to each other.

[0069] Using a mask assembly (MKA) that includes the aforementioned contaminants in a new deposition process may degrade the quality of the deposition process. For example, the luminescent layer may be formed differently than intended. In this case, problems such as reduced luminous efficiency or color mixing may occur.

[0070] To maintain uniform deposition quality, the mask assembly MKA is cleaned after the deposition process is completed and before being introduced into a new deposition process (cleaning process). For example, a cleaning solution can be sprayed onto the mask assembly MKA or the mask assembly MKA can be immersed in a cleaning solution. The cleaning solution may include, for example, NMB (narrow mask cleaner or nano mask cleaner). The NMB can remove residual deposits from the mask assembly MKA. For example, the residual deposits can be effectively decomposed or dissolved using chemical substances. Alternatively, the residual deposits can be physically decomposed using ultrasonic technology (which uses high-frequency vibration to separate the residual deposits from the mask assembly MKA) or nanobubble technology (which uses surface tension).

[0071] After the cleaning process, the cleaning solution can be dried and removed (drying process). After the drying process, the cleaning solution may remain on the mask assembly MKA (incomplete drying). For example, the cleaning solution may remain on the surface of the mask MK, the surface of the mask frame MF, the surface of the first rod ST1, the surface of the second rod ST2, etc. (residual cleaning solution). In particular, excessive cleaning solution may remain in the gap SL. Furthermore, gaps may also be formed at the intersection of the first rod ST1 and the second rod ST2 in the plane, and excessive cleaning solution may remain in these gaps.

[0072] Using a mask assembly (MKA) that includes the residual cleaning fluid in the new deposition process may reduce the efficiency of the deposition process. The deposition process can be performed under vacuum (low pressure). However, in the presence of the residual cleaning fluid, the process of reducing the internal pressure of the chamber to the vacuum (low pressure) state may take a long time (co-deposition). Since the deposited material is also evaporated / vaporized during the co-deposition time, material waste (the deposited material) may also increase with the increase of the co-deposition time.

[0073] Furthermore, using a mask assembly MKA containing the residual cleaning solution in a new deposition process may also degrade the quality of the deposition process (e.g., reduce device lifetime). For example, device lifetime can correspond to brightness. Brightness is highest at 100%, and lower numbers may appear darker. When using a mask assembly MKA without residual NMB, the device lifetime may reach approximately 90% after approximately 20,000 hours. However, when using a mask assembly MKA with residual NMB, the device lifetime may only reach 90% after approximately 15,000 hours.

[0074] To improve deposition efficiency and maintain uniform deposition quality, an additional drying process can be performed after the washing and drying processes. A cleaning fluid removal apparatus according to an embodiment of the present invention (e.g., [insert apparatus name here]) is used for this additional drying process. Figure 5 The cleaning fluid removal device 1) and the cleaning fluid removal method using it (refer to Figure 10 and Figure 11 (This will be discussed later in the text.)

[0075] Figure 5 This is a cross-sectional view illustrating a cleaning fluid removal device according to an embodiment of the present invention. Figure 6 yes Figure 5 A plan view of the cleaning fluid removal device. Figure 7 yes Figure 5 The back view of the cleaning fluid removal device. Figure 8 It is shown and included Figure 5 A cross-sectional view of the vortex tube connected to the nozzle in the cleaning fluid removal device.

[0076] Reference Figure 5 , Figure 6 and Figure 7 According to an embodiment of the present invention, the cleaning fluid removal device 1 can be a device capable of effectively removing cleaning fluid residue on the surface of the object being processed.

[0077] According to one embodiment, the cleaning fluid removal device 1 may include a first unit M1 and a second unit M2. For example, the first unit M1 may be arranged on the second unit M2. The second unit M2 may be spaced apart from the first unit M1 on a third-direction DR3. In one embodiment, the object to be processed (e.g., Figure 1 The mask assembly (MKA) can be arranged between the first unit M1 and the second unit M2.

[0078] For example, the first unit M1 can be a pair. For example, the first unit M1 can include a first-1 unit M11 and a first-2 unit M12. The first-1 unit M11 and the first-2 unit M12 can face each other. For example, the first-1 unit M11 and the first-2 unit M12 can face each other in a first direction DR1. However, the invention is not limited thereto. For example, the first-1 unit M11 and the first-2 unit M12 can also face each other in a second direction DR2.

[0079] In one embodiment, the first unit M1 may include a first support P1, a first vortex tube, a first nozzle NZ1, and a suction device SU.

[0080] For example, the first support P1 may be a structure in which linear drive devices (e.g., a first linear motor (LM) extending along a first direction DR1 and a second linear motor (LM) extending along a second direction DR2) are stacked on a frame. The first unit M1 may be movably fixed to the first support P1. For example, the first unit M1 may be movable along the guide of the linear motor (LM). However, the invention is not limited thereto.

[0081] In one embodiment, the first nozzle NZ1 can be movably fixed to the first bracket P1. The first nozzle NZ1 can reciprocate in a horizontal direction parallel to the first bracket P1. For example, the horizontal direction can be defined by a first direction DR1 and a second direction DR2.

[0082] In one embodiment, the first nozzle NZ1 can be a pair. For example, the first nozzle NZ1 can include a first-1 nozzle NZ11 and a first-2 nozzle NZ12. The first-1 nozzle NZ11 and the first-2 nozzle NZ12 can have a shape extending in a straight line and can face each other. For example, the first-1 nozzle NZ11 and the first-2 nozzle NZ12 can have a shape extending along a first direction DR1 and can face each other in a second direction DR2. However, the invention is not limited thereto. For example, the first-1 nozzle NZ11 and the first-2 nozzle NZ12 can have a shape extending along the second direction DR2 and can face each other in the first direction DR1.

[0083] For example, nozzle 1-1 NZ11 may include nozzle 1-1-1 NZ111 and nozzle 1-1-2 NZ112. The first suction device SU1, described later, may be located between nozzle 1-1-1 NZ111 and nozzle 1-1-2 NZ112. Nozzle 1-2 NZ12 may include nozzle 1-2-1 NZ121 and nozzle 1-2-2 NZ122. The second suction device SU2, described later, may be located between nozzle 1-2-1 NZ121 and nozzle 1-2-2 NZ122.

[0084] In one embodiment, the first nozzle NZ1 can inject air. The first nozzle NZ1 can inject first air having a first temperature or second air having a second temperature different from the first temperature. In one embodiment, the temperature of the first air can be greater than the temperature of the second air. The first air can be relatively hot air, and the second air can be relatively cold air.

[0085] In one embodiment, the suction device SU can be movably fixed to the first support P1. The suction device SU can reciprocate in the horizontal direction. In one embodiment, the suction device SU can move together with the first nozzle NZ1.

[0086] In one embodiment, the suction devices SU can be a pair. For example, the suction devices SU can include a first suction device SU1 and a second suction device SU2. The first suction device SU1 and the second suction device SU2 can have a shape extending in a straight line and can face each other. For example, the first suction device SU1 and the second suction device SU2 can have a shape extending along a first direction DR1 and can face each other in a second direction DR2. However, the invention is not limited thereto. For example, the first suction device SU1 and the second suction device SU2 can have a shape extending along the second direction DR2 and can face each other in the first direction DR1.

[0087] In one embodiment, the suction device SU can draw in the residual cleaning fluid from the object being treated and discharge it to the outside. If the air is sprayed from a pair of first nozzles NZ1 and a pair of second nozzles NZ2, the residual cleaning fluid may be scattered. To prevent this, the suction device SU can simultaneously draw in and remove the residual cleaning fluid that has detached from the object being treated while the air is being sprayed.

[0088] In one embodiment, the suction device SU may be arranged at an angle relative to the horizontal direction. For example, the suction device SU may be tilted toward the center CE of the object being processed (e.g., mask MA), or it may be tilted toward the outer contour surrounding the center CE of the mask MA.

[0089] In one embodiment, the second unit M2 may include a second support P2, a second vortex tube, a second nozzle NZ2, and a heater HE.

[0090] In one embodiment, the second support P2 may face the first support P1 in a direction intersecting the horizontal direction. In one embodiment, the first support P1 and the second support P2 may face each other in a third direction DR3. In one embodiment, the first support P1 and the second support P2 may be arranged facing each other with the mask MA, which completes the cleaning process, placed between them.

[0091] For example, the second support P2 can be a structure of stacked linear drive devices (e.g., a third linear motor (LM) extending along the first direction DR1 and a fourth linear motor (LM) extending along the second direction DR2). The second unit M2 can be movably fixed to the second support P2. For example, the second unit M2 can move along the guide of the linear motor (LM). However, the invention is not limited thereto.

[0092] The second support P2 may comprise a material with high rigidity. For example, the second support P2 may comprise stainless steel, Invar, nickel, cobalt, etc. They may be used individually or in combination with each other. However, the invention is not limited thereto.

[0093] In one embodiment, the second nozzle NZ2 is movably fixed to the second bracket P2. The second nozzle NZ2 can reciprocate in the horizontal direction parallel to the second bracket P2. The second nozzle NZ2 can face the first nozzle NZ1 in the third direction DR3.

[0094] In one embodiment, the second nozzle NZ2 can be a pair. For example, the second nozzle NZ2 can include a second-1 nozzle NZ21 and a second-2 nozzle NZ22. The second-1 nozzle NZ21 and the second-2 nozzle NZ22 can have a shape extending in a straight line and can face each other. For example, the second-1 nozzle NZ21 and the second-2 nozzle NZ22 can have a shape extending along a first direction DR1 and can face each other in a second direction DR2. However, the invention is not limited thereto. For example, the second-1 nozzle NZ21 and the second-2 nozzle NZ22 can have a shape extending along the second direction DR2 and can face each other in the first direction DR1.

[0095] For example, nozzle 2-1 NZ21 may include nozzle 2-1-1 NZ211 and nozzle 2-1-2 NZ212. The first heater HE1, described later, may be located between nozzle 2-1-1 NZ211 and nozzle 2-1-2 NZ212. Nozzle 2-2 NZ22 may include nozzle 2-2-1 NZ221 and nozzle 2-2-2 NZ222. The second heater HE2, described later, may be located between nozzle 2-2-1 NZ221 and nozzle 2-2-2 NZ222.

[0096] In one embodiment, the second nozzle NZ2 can inject air. The second nozzle NZ2 can inject first air having a first temperature or second air having a second temperature different from the first temperature. In one embodiment, the temperature of the first air can be greater than the temperature of the second air. The first air can be relatively hot air, and the second air can be relatively cold air.

[0097] The temperature of the first air ejected from the second nozzle NZ2 may be the same as or different from the temperature of the first air ejected from the first nozzle NZ1. The temperature of the second air ejected from the second nozzle NZ2 may be the same as or different from the temperature of the second air ejected from the first nozzle NZ1. The first air refers to relatively hot air, and the second air refers to relatively cold air.

[0098] In one embodiment, the heater HE can be movably fixed to the second bracket P2. The heater HE can reciprocate in the horizontal direction. In one embodiment, the heater HE can move together with the second nozzle NZ2.

[0099] In one embodiment, the heaters HE can be a pair. For example, the heaters HE can include a first heater HE1 and a second heater HE2. The first heater HE1 and the second heater HE2 can have a straight-line shape and can face each other. For example, the first heater HE1 and the second heater HE2 can have a shape extending along a first direction DR1 and can face each other in a second direction DR2. However, the invention is not limited thereto. For example, the first heater HE1 and the second heater HE2 can have a shape extending along the second direction DR2 and can face each other in the first direction DR1.

[0100] For example, a pair of heaters HE can be arranged inside the first support P1. In one embodiment, the pair of heaters HE can extend along the edge of the first support P1 in a plane.

[0101] In one embodiment, a pair of heaters HE may surround a pair of first nozzles NZ1 in a plane. For example, a pair of heaters HE may have a quadrilateral ring shape surrounding a pair of first nozzles NZ1, but the invention is not limited thereto.

[0102] In one embodiment, a pair of heaters HE can heat the object (e.g., the mask) to a temperature above that would cause the residual cleaning fluid on the object to evaporate.

[0103] In one embodiment, the pair of heaters HE can utilize induction heating. As a type of direct heating, induction heating allows for rapid heating / cooling. This enables the rapid evaporation of the residual cleaning fluid.

[0104] For example, a pair of heaters HE may include a coil housing and an induction coil. For example, the coil housing may have a quadrilateral ring shape. The induction coil may be housed within the coil housing. For example, the induction coil may be arranged within the coil housing and have a ring shape in a plane, but the invention is not limited thereto.

[0105] If a high-frequency induced current flows in an induction coil, a high-frequency magnetic field can be generated around the induction coil. For example, the strength of the magnetic field formed around the induction coil can vary with the strength and direction of the induced current flowing in the induction coil. As the strength of the magnetic field formed around the induction coil changes, an induced current can be generated within the mask assembly, which is a conductor. In this case, Joule heating can occur due to the resistance of the mask assembly, and the mask assembly can be heated (or dried).

[0106] For example, a pair of heaters HE can be spaced approximately tens of millimeters (mm) from the object being processed. However, the gap between the pair of heaters HE and the object being processed can vary depending on the output of the pair of heaters HE. For example, the gap can increase as the output of the pair of heaters HE increases.

[0107] In one embodiment, the object to be processed may be a mask MA (e.g., referring to a cleaning process that removes deposited material). Figure 1 The mask assembly MKA. The mask MA can be arranged on the mask support MSU and between the first unit M1 and the second unit M2.

[0108] For example, the mask MA can move to a storage device after sequentially passing through a deposition device, a cleaning device, and a material flow line. After passing through the cleaning device (after the drying process), residual cleaning fluid may remain in the mask MA. As described above, the mask MA can be constructed by welding mask sheets MS (e.g., with the mask frame MF) to the mask frame MF. Figure 1 (MK correspondence) to form (omitted) Figure 1 (ST1, ST2).

[0109] In one embodiment, the cleaning fluid removal device 1 can be located in the material flow line. The cleaning fluid removal device 1 can be located adjacent to the discharge port of the cleaning equipment in the material flow line. The cleaning fluid removal device 1 can remove the residual cleaning fluid. Since the cleaning fluid removal device 1 is included in the material flow line, compared to adding a pressure reducing (vacuum) device or adding a drying area to the cleaning equipment, the cleaning fluid removal device 1 can minimize the layout space and reduce costs, and can eliminate the need for additional cycle time other than the cleaner's takt time.

[0110] The second unit M2 may be located below the mask MA and configured to heat the mask MA, thereby evaporating the residual cleaning fluid from the mask MA. Located in the material flow line, the second unit M2 may include an induction heating heater HE for rapid heating.

[0111] The first unit M1 can be located above the mask MA, and can draw in the evaporated residual cleaning liquid and discharge it to the outside.

[0112] The air ejected from the first unit M1 and the air ejected from the second unit M2 can make the object being processed (e.g., Figure 1 The slits in the mask assembly (MKA) are opened. This helps to remove the residual cleaning fluid from the slits more effectively.

[0113] Furthermore, the air ejected from the first unit M1 and the air ejected from the second unit M2 can be configured to form vortices. These vortices increase air circulation on the surface of the residual cleaning liquid and remove stagnant air that hinders evaporation, thereby further promoting the evaporation of the residual cleaning liquid. With the occurrence of vortices, fresh air is continuously supplied while air moves rapidly across the surface of the residual cleaning liquid, and evaporated water vapor diffuses rapidly into the air, thus creating more space on the surface of the residual cleaning liquid and further promoting evaporation. Furthermore, the stagnant air may include saturated water vapor, and the vortex promotes the movement of this stagnant air, thereby further promoting evaporation. Additionally, the vortex promotes heat exchange between the liquid and gas, more efficiently supplying the energy required for the evaporation of the residual cleaning liquid. Accordingly, evaporation can be further promoted.

[0114] The first unit M1 and the second unit M2 can be configured to be movable. Accordingly, they can be used with processing objects of various sizes (e.g., Figure 1 The size of the gap in the mask assembly MKA corresponds to that of the mask assembly MKA.

[0115] For example, nozzle NZ11 and first suction SU1 can move a first forward movement distance L1 along a first direction DR1, and nozzle NZ12 and second suction SU2 can move a second forward movement distance L2 in the opposite direction of the first direction DR1. Accordingly, nozzle NZ11 and first suction SU1 and nozzle NZ12 and second suction SU2 can be adjacent to the center CE of the object being processed. During the movement of nozzle NZ11 and first suction SU1 and nozzle NZ12 and second suction SU2 toward the center CE of the object being processed, nozzle NZ11 and nozzle NZ12 can spray relatively hot air toward the object being processed.

[0116] For example, nozzle 2-1 NZ21 and first heater HE1 can move a third forward movement distance L3 along the first direction DR1, and nozzle 2-2 NZ22 and second heater HE2 can move a fourth forward movement distance L4 in the opposite direction of the first direction DR1. Accordingly, nozzle 2-1 NZ21 and first heater HE1 and nozzle 2-2 NZ22 and second heater HE2 can be adjacent to the center CE of the object being processed. During the movement of nozzle 2-1 NZ21 and first heater HE1 and nozzle 2-2 NZ22 and second heater HE2 toward the center CE of the object being processed, nozzle 2-1 NZ21 and nozzle 2-2 NZ22 can spray relatively cool air toward the object being processed.

[0117] Further reference Figure 8 In one embodiment, the cleaning fluid removal device 1 may further include a vortex tube VT. For example, the first unit M1 may further include a first vortex tube. The second unit M2 may further include a second vortex tube. For example, the vortex tube VT may be connected to a pair of first nozzles NZ1 and a pair of second nozzles NZ2. In one embodiment, the vortex tube VT may include a first vortex tube connected to a pair of first nozzles NZ1 and a second vortex tube connected to a pair of second nozzles NZ2.

[0118] In one embodiment, the vortex tube VT (the first vortex tube and the second vortex tube) may include an inlet AI, a tube VS, an air circulation space CT, a valve VL, a first outlet OL1, and a second outlet OL2.

[0119] In one embodiment, compressed air can flow into pipe VS through inlet AI.

[0120] In one embodiment, pipe VS can be connected to inlet AI. If the compressed air flows into pipe VS, a high-speed vortex can be generated in the internal space of pipe VS. The vortex can cross the air circulation space CT and reach valve VL.

[0121] In one embodiment, the first outlet OL1 may be connected to the pipe VS. If the valve VL is opened, first air can be released to the outside of the vortex tube VT through the first outlet OL1. The first air can be separated from the high-speed vortex and has a first temperature.

[0122] In one embodiment, the second outlet OL2 may be connected to the pipe VS. Air not released to the outside of the vortex tube VT may change direction and traverse the air circulation space CT and the pipe VS to reach the second outlet OL2. Second air can be discharged through the second outlet OL2. This second air can be separated from the high-speed vortex and has a second temperature different from the first temperature.

[0123] In one embodiment, the first temperature of the first air can be greater than the second temperature of the second air. For example, the first temperature can be above about 50°C and below about 70°C. The second temperature can be above about -50°C and below about -10°C. Relatively hot air can be released to the outside of the vortex tube VT through the first outlet OL1, and relatively cold air can be released to the outside of the vortex tube VT through the second outlet OL2.

[0124] For example, if the first temperature of the first air is less than about 50 degrees Celsius or the second temperature of the second air is more than about -10 degrees Celsius, the tact time can be increased. The first temperature of the first air may require a long time to open the gap. And, for the second temperature of the second air, it may require a long time to cool to room temperature.

[0125] Additionally, if the first temperature of the first air exceeds approximately 70 degrees Celsius or the second temperature of the second air is below approximately -50 degrees Celsius, the object to be processed (e.g., Figure 1 The mask assembly (MKA) may deform.

[0126] In one embodiment, a pair of first nozzles NZ1 may be connected to a vortex tube VT. For example, the pair of first nozzles NZ1 may be connected to a first outlet OL1. Accordingly, the first air having the first temperature discharged through the first outlet OL1 can be directed towards the object being processed (e.g., Figure 1 The mask assembly (MKA) is discharged. Therefore, the mask assembly (MKA) can be heated (or dried).

[0127] After the cleaning fluid remaining in the mask assembly MKA is removed by heating (or drying) the mask assembly MKA, a pair of first nozzles NZ1 can be separated from the first outlet OL1.

[0128] After the pair of first nozzles NZ1 separate from the first outlet OL1, the pair of first nozzles NZ1 can be connected to the second outlet OL2. Accordingly, the second air discharged through the second outlet OL2 can be discharged towards the mask assembly MKA through the pair of first nozzles NZ1. Accordingly, the temperature of the mask assembly MKA can be changed to the temperature before it was heated (or dried) by the cleaning fluid removal device 1 (e.g., the ambient temperature).

[0129] A pair of first nozzles NZ1 may be connected to a vortex tube VT (e.g., the first vortex tube), but the invention is not limited thereto. A pair of first nozzles NZ1 may also be connected to multiple vortex tubes VT.

[0130] In one embodiment, a pair of second nozzles NZ2 may be connected to the vortex tube VT. For example, the pair of second nozzles NZ2 may be connected to the first outlet OL1. Accordingly, the first air discharged through the first outlet OL1 can be discharged towards the mask assembly MKA through the pair of second nozzles NZ2. Therefore, the mask assembly MKA can be heated (or dried).

[0131] After the cleaning fluid remaining in the mask assembly MKA is removed by heating (or drying) the mask assembly MKA, a pair of second nozzles NZ2 can be separated from the first outlet OL1.

[0132] After the pair of second nozzles NZ2 separate from the first outlet OL1, the pair of second nozzles NZ2 can be connected to the second outlet OL2. Accordingly, air with the second temperature discharged through the second outlet OL2 can be discharged towards the mask assembly MKA through the pair of second nozzles NZ2. Accordingly, the temperature of the mask assembly MKA can be changed to its temperature before being heated (or dried) by the cleaning fluid removal device 1. In one embodiment, the pair of second nozzles NZ2 can be connected to a vortex tube VT, but the invention is not limited thereto. The pair of second nozzles NZ2 can also be connected to multiple vortex tubes VT.

[0133] In one embodiment, the vortex tube VT connected to a pair of first nozzles NZ1 and the vortex tube VT connected to a pair of second nozzles NZ2 may represent the same vortex tube, but the invention is not limited thereto. The vortex tube VT connected to the pair of first nozzles NZ1 (the first vortex tube) may also be a separate component that is distinct from the vortex tube VT connected to the pair of second nozzles NZ2 (the second vortex tube).

[0134] Since the cleaning fluid removal device 1 includes a vortex tube VT, it is not necessary to separately include a device for providing hot air (to promote the evaporation of the residual cleaning fluid) and a device for providing cold air (to cool the object being treated). That is, hot air can be provided to the object being treated using a single vortex tube VT, or cold air can be provided to the object being treated. Compared to including both devices for providing hot air and devices for providing cold air, using the vortex tube VT can minimize the layout space and reduce costs.

[0135] Figure 9 It is used to illustrate the use Figure 5 A sequence diagram of the cleaning fluid removal method of the cleaning fluid removal device. Figure 10 and Figure 11 It is used for explanation Figure 9 A diagram illustrating the cleaning solution removal method.

[0136] In the following text, references will be omitted or simplified. Figures 1 to 4 The aforementioned mask components and reference Figures 5 to 8 The description of the aforementioned cleaning fluid removal device is repeated.

[0137] Reference Figure 9 , Figure 10 and Figure 11 According to an embodiment of the present invention, the cleaning fluid drying method 2 can perform the cleaning fluid removal process including the following steps: First air with a first temperature can be sprayed onto the object being processed along a fourth direction DR4 toward the center CE of the object being processed (S100). In one embodiment, the object being processed can be a mask (e.g., a mask MA arranged on a mask support MSU and including a mask frame MF and a mask sheet MS) for completing a cleaning process of removing deposited material. While spraying the first air from the lower part of the object being processed, the object being processed can be induction heated along the fourth direction DR4 at the lower part of the object being processed (S200). While spraying the first air onto the object being processed, residual cleaning fluid evaporated from the object being processed can be drawn into and discharged along the fourth direction DR4 at the upper part of the object being processed (S300). Second air with a second temperature different from the first temperature can be sprayed onto the object being processed along a fifth direction DR5 away from the center CE of the object being processed (S400). In one embodiment, the first temperature is greater than the second temperature.

[0138] In one embodiment, a pair of first nozzles NZ1 that spray the first air or the second air onto the object being treated from above, and a pair of suction devices SU that suck in and expel the residual cleaning fluid, can move together. Furthermore, a pair of second nozzles NZ2 that spray the first air or the second air onto the object being treated from below, and a pair of heaters HE that induction heat the object being treated, can also move together. Moreover, the pair of first nozzles NZ1, the pair of suction devices SU, the pair of second nozzles NZ2, and the pair of heaters HE can move closer to or further away from each other during this movement.

[0139] For example, the first unit M1 may include a first unit M11 and a first unit M12. The first unit M11 and the first unit M12 may be movably coupled to the first support P1.

[0140] Unit M11 may include a first nozzle NZ111, a second nozzle NZ112 (the first nozzle NZ11 in a pair of first nozzles NZ1), and a first suction device SU1. For example, the first nozzle NZ111 and the second nozzle NZ112 may surround the first suction device SU1.

[0141] Unit M12 may include nozzle NZ121 (first-2-1), nozzle NZ122 (first-2 nozzle NZ12 of a pair of first nozzles NZ1), and a second suction device SU2. For example, nozzle NZ121 and nozzle NZ122 may surround the second suction device SU2.

[0142] Unit M21 may include nozzle NZ211 (2-1-1), nozzle NZ212 (2-1-2 of a pair of second nozzles NZ2), and a first heater HE1. For example, nozzle NZ211 and nozzle NZ212 may surround the first heater HE1.

[0143] Unit M22 may include nozzle NZ221 (2-2-1), nozzle NZ222 (2-2-2 of a pair of second nozzles NZ2), and a second heater HE2. For example, nozzle NZ221 (2-2-1) and nozzle NZ222 (2-2-2) may surround the second heater HE2.

[0144] For example, such as Figure 10 As shown, a pair of first nozzles NZ1, a pair of suction devices SU, a pair of second nozzles NZ2, and a pair of heaters HE can remove the residual cleaning fluid while they are close to each other (S100, S200, S300).

[0145] And, as Figure 11 As shown, a pair of first nozzles NZ1, a pair of suction devices SU, a pair of second nozzles NZ2, and a pair of heaters HE can cool the object being processed to room temperature while moving away from each other (S400). However, the present invention is not limited thereto.

[0146] The first unit M1 and the second unit M2 can be configured to be movable. Accordingly, they can be used with processing objects of various sizes (e.g., Figure 1 The size of the gap in the mask assembly MKA corresponds to that of the mask assembly MKA.

[0147] For example, the first nozzle NZ11 and the first suction device SU1 (included in the first unit M11 of the first unit M1) can move a first positive movement distance L1 along the first direction DR1, and the first nozzle NZ12 and the second suction device SU2 (included in the first unit M11 of the first unit M1) can move a second positive movement distance L2 in the opposite direction of the first direction DR1. Accordingly, the first nozzle NZ11 and the first suction device SU1 (included in the first unit M11 of the first unit M1) and the first nozzle NZ12 and the second suction device SU2 (included in the first unit M11 of the first unit M1) can be adjacent to the center CE of the object being processed.

[0148] During the movement of nozzle 1-1 NZ11 and first suction SU1 and nozzle 1-2 NZ12 and second suction SU2 toward the center CE of the object being processed, nozzle 1-1 NZ11 and nozzle 1-2 NZ12 may spray relatively hot air toward the object being processed.

[0149] For example, nozzle 2-1 NZ21 and first heater HE1 can move a third forward movement distance L3 along the first direction DR1, and nozzle 2-2 NZ22 and second heater HE2 can move a fourth forward movement distance L4 in the opposite direction of the first direction DR1. Accordingly, nozzle 2-1 NZ21 and first heater HE1 and nozzle 2-2 NZ22 and second heater HE2 can be adjacent to the center CE of the object being processed.

[0150] exist Figure 10 In this context, the direction in which the first-1 unit M11 and the first-2 unit M12 approach each other, that is, the direction toward the center CE of the object being processed, is called the fourth direction DR4.

[0151] For example, the first nozzle NZ11 and the first suction device SU1 (included in the first unit M11 of the first unit M1) can move a first reverse movement distance L1' in the opposite direction to the first direction DR1, and the first nozzle NZ12 and the second suction device SU2 (included in the first unit M11 of the first unit M1) can move a second reverse movement distance L2' in the first direction DR1. Accordingly, the first nozzle NZ11 and the first suction device SU1 (included in the first unit M11 of the first unit M1) and the first nozzle NZ12 and the second suction device SU2 (included in the first unit M11 of the first unit M1) can be adjacent to the center CE of the object being processed, away from it.

[0152] During the movement of nozzle 2-1 NZ21 and first heater HE1 and nozzle 2-2 NZ22 and second heater HE2 away from the center CE of the object being processed, nozzle 2-1 NZ21 and nozzle 2-2 NZ22 may spray relatively cold air onto the object being processed.

[0153] For example, nozzle 2-1 NZ21 and first heater HE1 can move a third reverse movement distance L3' in the opposite direction to the first direction DR1, and nozzle 2-2 NZ22 and second heater HE2 can move a fourth reverse movement distance L4' in the first direction DR1. Accordingly, nozzle 2-1 NZ21 and first heater HE1 and nozzle 2-2 NZ22 and second heater HE2 can be moved away from the center CE of the object being processed.

[0154] exist Figure 11 In this context, the direction in which the second-1 unit M21 and the second-2 unit M22 move away from each other, that is, the direction away from the center CE of the object being processed, is called the fifth direction DR5.

[0155] The above description illustrates a scenario where the upper module 100, including units 1-1 M11 and 1-2 M12, and the lower module 200, including units 2-1 M21 and 2-2 M22, move toward the center CE of the object being processed, and then move in a direction away from the center CE of the object being processed. However, the invention is not limited to this. The upper module 100 and the lower module 200 may also move in a direction away from the center CE of the object being processed (e.g., the fifth direction DR5), and then move toward the center CE of the object being processed (e.g., the fourth direction DR4).

[0156] Furthermore, the cleaning fluid removal process can be performed more than once. For example, after completing the cleaning fluid removal process, the surface of the object to be treated can be inspected (inspection process). If residual cleaning fluid is detected on the surface of the object to be treated, the cleaning fluid removal process can be performed again.

[0157] The above description refers to exemplary embodiments of the present invention. However, it will be understood by those skilled in the art that various modifications and alterations can be made to the present invention without departing from the spirit and scope of the invention as set forth in the claims.

[0158] Industrial availability This invention can be applied to cleaning fluid removal apparatuses and methods thereof. For example, this invention can be applied to cleaning fluid removal apparatuses and methods thereof used for drying masks used in the formation of high-resolution smartphones, portable phones, smart tablets, smartwatches, tablet PCs, vehicle navigation systems, televisions, computer monitors, laptops, etc.

Claims

1. A cleaning fluid removal device, comprising: First support; A pair of first nozzles are fixed to the first bracket in a horizontal direction parallel to the first bracket and can reciprocate, and spray air; A pair of suction devices are fixed to the first bracket, which is reciprocatingly movable in the horizontal direction; The second support is opposite to the first support in a direction that intersects the horizontal direction; A pair of second nozzles, reciprocally fixed to the second bracket in the horizontal direction, and jetting air; and A pair of heaters are fixed to the second bracket in a reciprocating manner in the horizontal direction and utilize induction heating.

2. The cleaning fluid removal device as described in claim 1, characterized in that, Also includes: The vortex tube is connected to the pair of first nozzles and the pair of second nozzles. The vortex tube includes: The inlet is used to allow compressed air to flow in; The tube is connected to the inlet and forms a high-speed vortex in the internal space; A first outlet is connected to the pipe and discharges the first air separated from the high-speed vortex; and The second outlet is connected to the pipe and discharges second air that has a different temperature from the first air, separated from the high-speed vortex.

3. The cleaning fluid removal device as described in claim 2, characterized in that, The temperature of the first air is greater than the temperature of the second air.

4. The cleaning fluid removal device as described in claim 1, characterized in that, The first support and the second support are arranged facing each other, with the mask that has completed the cleaning process placed between them.

5. The cleaning fluid removal device as described in claim 4, characterized in that, The pair of heaters heat the mask to a temperature above the temperature at which the residual cleaning fluid on the mask evaporates. The pair of suction devices draw in the residual cleaning fluid and discharge it to the outside.

6. The cleaning fluid removal device as described in claim 1, characterized in that, The horizontal direction is defined by a first direction and a second direction. The first bracket and the second bracket face each other in a third direction that intersects the first direction and the second direction. The pair of first nozzles, the pair of suction devices, the pair of second nozzles, and the pair of heaters move closer to or further away from each other as they move in the horizontal direction.

7. The cleaning fluid removal device as described in claim 6, characterized in that, When the pair of first nozzles and the pair of second nozzles are close to each other, a first air is injected. When the pair of first nozzles and the pair of second nozzles are far apart from each other, a second air with a temperature different from that of the first air is sprayed.

8. A cleaning fluid removal device, comprising: First support; The first nozzle is fixed to the first bracket in a horizontal direction parallel to the first bracket and can reciprocate, and sprays air. The suction device is fixed to the first bracket in a reciprocating manner in the horizontal direction and moves together with the first nozzle; The second support is opposite to the first support in a direction that intersects the horizontal direction; The second nozzle is fixed to the second bracket and is reciprocally movable in the horizontal direction, and sprays air; as well as The heater is fixed to the second bracket in a reciprocating manner in the horizontal direction and moves together with the second nozzle.

9. The cleaning fluid removal device as described in claim 8, characterized in that, Also includes: The vortex tube is connected to both the first nozzle and the second nozzle. The vortex tube includes: The inlet is used to allow compressed air to flow in; The tube is connected to the inlet and forms a high-speed vortex in the internal space; A first outlet is connected to the pipe and discharges the first air separated from the high-speed vortex; and The second outlet is connected to the pipe and discharges second air that has a different temperature from the first air, separated from the high-speed vortex.

10. The cleaning fluid removal device as described in claim 9, characterized in that, The temperature of the first air is greater than the temperature of the second air.

11. The cleaning fluid removal device as described in claim 8, characterized in that, The first support and the second support are arranged facing each other so that the mask for completing the cleaning process is placed between them.

12. The cleaning fluid removal device as described in claim 11, characterized in that, The heater heats the mask to a temperature above the temperature at which the residual cleaning fluid on the mask evaporates. The suction device draws in the residual cleaning fluid and discharges it to the outside.

13. The cleaning fluid removal device as described in claim 8, characterized in that, The first nozzle, the suction device, the second nozzle, and the heater are arranged as a pair that are spaced apart from each other.

14. The cleaning fluid removal device as described in claim 13, characterized in that, The horizontal direction is defined by a first direction and a second direction. The first bracket and the second bracket face each other in a third direction that intersects the first direction and the second direction. The pair of first nozzles, the pair of suction devices, the pair of second nozzles, and the pair of heaters move closer to or further away from each other as they move in the horizontal direction.

15. The cleaning fluid removal device as described in claim 14, characterized in that, With the first nozzle and the second nozzle close to each other, a first air is injected. With the pair of first nozzles and the pair of second nozzles far apart from each other, a second air with a temperature different from that of the first air is sprayed.

16. The cleaning fluid removal device as described in claim 8, characterized in that, The heater utilizes induction heating.

17. A method for removing cleaning fluid, comprising the following steps: A first air having a first temperature is sprayed toward the object being processed along a fourth direction toward the center of the object being processed, both at the lower and upper parts of the object being processed. While the first air is injected from the lower part of the object being processed, the lower part of the object being processed is induction heated along the fourth direction. While spraying the first air toward the object to be treated, residual cleaning liquid evaporated from the object to be treated is drawn in along the fourth direction at the upper part of the object to be treated and discharged. as well as A second air having a second temperature different from the first temperature is sprayed onto the object being processed from the lower and upper parts along a fifth direction away from the center of the object being processed.

18. The cleaning fluid removal method as described in claim 17, characterized in that, The object being processed is a mask used in the cleaning process to remove deposited material.

19. The cleaning fluid removal method as described in claim 17, characterized in that, The first temperature is greater than the second temperature.

20. The cleaning fluid removal method as described in claim 17, characterized in that, A pair of first nozzles that spray the first or second air onto the object being treated from above, and a pair of suction devices that draw in and expel the evaporated residual cleaning fluid, move together. A pair of second nozzles that spray the first or second air into the object being processed from its lower part, and a pair of heaters that induction heat the object being processed, also move together. The pair of first nozzles, the pair of suction devices, the pair of second nozzles, and the pair of heaters move closer to or further away from each other as the movement occurs.

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