PI film micro-liquid supply corrosion removal equipment

Abstract

The present application relates to touch screen production automation equipment technical field, especially to a kind of PI film trace liquid supply corrosion removal equipment, including the cleaning platform for carrying glass substrate, for forming relative motion movement mechanism, PI cleaning execution module, dustless cloth conveying module and trace liquid supply module.Trace liquid supply module adopts ceramic valve core trace injection pump;PI cleaning execution module is equipped with ceramic cleaning head and cleaning pressure adjustment assembly, the bottom of ceramic cleaning head is equipped with liquid outlet and the transverse drainage groove being communicated with liquid outlet;Dustless cloth is tensioned between ceramic cleaning head and glass substrate.ACF removing agent is infiltrated into dustless cloth after being quantitatively supplied and horizontally dispersed, and PI insulating film in FPC binding area is removed under the reciprocating friction effect of stable pressure.The equipment can also be provided with automatic cloth changing, visual inspection and anti-dripping structure to improve batch cleaning consistency.

Description

[Technical Field] This invention relates to the field of automated equipment technology for touch screen production, and in particular to a micro-liquid supply corrosion removal device for PI film. [Background Technology] Projected capacitive touchscreens typically have TX electrodes, RX electrodes, and ITO electrodes bonded to PADs that connect to an external flexible circuit board formed on the surface of a glass substrate. To meet the insulation, protection, or graphic fabrication requirements in the front-end manufacturing process, the electrode bonding areas may be covered with a PI insulating film.

[0001] Before the FPC and glass substrate are thermo-bonded using an anisotropic conductive film (ACF), a stable conductive connection needs to be established between the corresponding conductive terminals on the FPC and the ITO electrodes on the glass substrate. If the PI insulating film on the bonding pad surface is not sufficiently removed, the PI material will form an insulating barrier, making it difficult for the conductive particles inside the ACF to form a reliable electrical connection between the FPC terminals and the ITO electrodes. This can easily lead to abnormal contact resistance, partial open circuits, or abnormal touch signals. Therefore, removing the PI insulating film is an important pretreatment step before FPC bonding.

[0002] Existing technologies related to this field have proposed solutions from different perspectives, such as ACF cleaning, PI film peeling, and automatic wiping of glass substrates.

[0003] For example, Chinese invention patent applications CN114472368A (publication number CN202110644350.1) disclose a method and apparatus for cleaning residual adhesive. This method targets ACF residual adhesive in the LCD electrode area, softening the adhesive through heating and then wiping it off using a wiping device soaked in an alcohol solution. This solution primarily addresses the problem of cleaning residual ACF adhesive after it has already bonded.

[0004] Chinese invention patent applications with publication number CN101870932A and application number CN201010198837.3 disclose an anisotropic conductive adhesive film remover, which softens or removes ACF through a specific solvent system, indicating that using chemical removers in conjunction with subsequent mechanical cleaning is a feasible treatment method in the manufacturing and rework process of display modules.

[0005] Chinese invention patent applications CN109240536A and CN201810940454.5 disclose a method for manufacturing a touch screen or display with a PI substrate. This method uses a die to form a slit, and then allows a polar liquid to enter between the PI film and the glass substrate to achieve interface separation between the PI film and the glass substrate. It solves the problem of peeling a large area PI substrate from the carrier glass.

[0006] In addition, authorization announcement number CN209753622U and application number CN201920287411.1 disclose an automatic cleaning device for substrate panels, which uses unwinding and rewinding wiping materials and a cleaning liquid supply mechanism to automatically wet and dry wipe the surface of substrates such as glass.

[0007] The aforementioned technologies involve ACF removal liquid, residual adhesive wiping, PI film peeling, or automatic glass surface wiping, but the following practical mass production problems still exist for the local PI insulating film removal process before FPC bonding of touch screen glass substrates.

[0008] The ACF remover used in practice is highly corrosive and prone to crystallization during transport, shutdown, or localized evaporation. Existing equipment using peristaltic or diaphragm pumps for liquid supply is prone to pulsation, supply fluctuations, and dripping under micro-liter single-use conditions, making it difficult to simultaneously control the degree of PI corrosion and the amount of residual solvent. While traditional cleaning heads made of materials like PP and PTFE can achieve a certain level of chemical corrosion resistance, long-term contact with the remover and chemical crystals can still cause wear at the outlet and friction points, affecting the discharge state and cleaning consistency. If the solution is only dripped onto the lint-free cloth from a single point, it can easily concentrate in localized areas. With a supply volume of only micro-liters, insufficient local dosage can lead to PI film residue, while excessive local dosage increases the risk of remover residue and adverse effects on other areas of the substrate. PI film removal is not simply a process of soaking in the solution; it requires a proper combination of chemical action and mechanical friction. If the frictional pressure, reciprocating motion, cleanliness of the lint-free cloth, and liquid supply cannot be kept stable, significant differences in cleanliness may still occur between different glass substrates, even when using the same cleaning agent. After the cleaning head stops, residual cleaning agent in the outlet channel may drip, contaminating the cleaning platform or the glass substrates awaiting processing. Relying solely on manual visual inspection makes it difficult to consistently identify localized residues in the PI film, hindering the formation of continuous automated production. [Summary of the Invention] To overcome the above problems, this invention proposes a micro-liquid supply corrosion removal device for PI membranes that can effectively solve the above problems.

[0009] The present invention provides a technical solution to solve the above-mentioned technical problems: a PI film micro-liquid supply corrosion removal device is provided for removing the PI insulating film covering the electrode bonding area of ​​the glass substrate before hot pressing bonding of the touch screen glass substrate and the flexible circuit board FPC, including a cleaning platform, a motion mechanism, a PI cleaning execution module, a dust-free cloth conveying module and a micro-liquid supply module. The cleaning platform is used to support and fix the glass substrate, and the motion mechanism is used to make the PI cleaning execution module and the cleaning platform move relative to each other in the horizontal direction. The PI cleaning execution module includes a lifting mechanism, a cleaning pressure adjustment component, and a ceramic cleaning head. The ceramic cleaning head is located at the lower part of the lifting mechanism. The bottom of the ceramic cleaning head is provided with a liquid outlet. The inside of the ceramic cleaning head is provided with a drain groove that communicates with the liquid outlet. The drain groove extends laterally along the ceramic cleaning head, and the liquid outlet is located in the middle of the drain groove. The micro-liquid supply module includes a ceramic valve core micro-injection pump and a removal liquid solvent pipeline. The ceramic valve core of the ceramic valve core micro-injection pump and the flow-through components inside the pump that come into contact with the ACF removal agent are made of ceramic material. The ceramic valve core micro-injection pump is connected to the outlet of the ceramic cleaning head through the removal liquid solvent pipeline. The cleanroom cloth conveying module is used to tension the cleanroom cloth working section between the ceramic cleaning head and the glass substrate, so that the ACF removal agent discharged through the ceramic cleaning head can wet the cleanroom cloth working section. The cleaning pressure adjustment component is driven by the ceramic cleaning head, so that the ceramic cleaning head applies a stable cleaning pressure to the electrode bonding area of ​​the glass substrate through the clean cloth working section. The motion mechanism enables the ceramic cleaning head and the glass substrate to reciprocate relative to each other while maintaining a stable cleaning pressure. Thus, the ceramic valve core micro-injection pump, the ceramic cleaning head with a transverse drainage groove, and the cleaning pressure adjustment assembly form a mutually cooperating cleaning structure, which is used to impregnate the lint-free cloth after the ACF remover is supplied in a micro-quantitative manner and dispersed laterally, and remove the PI insulating film under the reciprocating friction action of constant contact pressure.

[0010] Preferably, the ceramic cleaning head is integrally sintered from engineering ceramics, and the liquid outlet and drain groove are formed on the ceramic working structure of the ceramic cleaning head.

[0011] Preferably, the drain trough extends in a direction corresponding to the width of the working section of the lint-free cloth, the outlet is located in the middle of the length of the drain trough, and the drain trough extends to both sides from the location of the outlet.

[0012] Preferably, the ceramic valve core of the ceramic valve core micro-injection pump and the flow-through components inside the pump that are in direct contact with the ACF remover together constitute a corrosion-resistant and wear-resistant micro-liquid supply passage.

[0013] Preferably, one end of the solvent removal pipeline is connected to the output end of the ceramic valve core micro-injection pump, and the other end is connected to the outlet of the ceramic cleaning head, forming a liquid supply path from the ceramic valve core micro-injection pump to the ceramic cleaning head.

[0014] Preferably, the cleanroom cloth working section is located between the bottom of the ceramic cleaning head and the glass substrate supported by the cleaning platform, and the drain trough is arranged opposite to the cleanroom cloth working section.

[0015] Preferably, the lifting mechanism is a PI cleaning Z-axis, and the cleaning pressure adjustment component includes a constant pressure cylinder, which is connected to the ceramic cleaning head and is configured to cooperate with the PI cleaning Z-axis.

[0016] Preferably, the motion mechanism includes a PI cleaning X-axis and a platform Y-axis. The PI cleaning X-axis adopts a servo drive structure and drives the PI cleaning execution module to move in the horizontal direction. The platform Y-axis drives the cleaning platform to move in a horizontal direction different from that of the PI cleaning X-axis.

[0017] Preferably, the device further includes an anti-drip cleaning mechanism, which is located in the standby position of the ceramic cleaning head and has a waste liquid receiving cavity with an opening facing the standby position.

[0018] Preferably, the device further includes a vision inspection module, which includes a high-resolution industrial camera and a ring light source. The imaging area of ​​the industrial camera and the illumination area of ​​the ring light source correspond to the detection position of the electrode bonding area of ​​the glass substrate.

[0019] Preferably, the cleanroom cloth conveying module includes a cleanroom cloth feeding roll, a cleanroom cloth receiving roll, a cleanroom cloth left clamp, and a cleanroom cloth right clamp. A cleanroom cloth cleaning working area is formed between the cleanroom cloth left clamp and the cleanroom cloth right clamp. The bottom of the ceramic cleaning head, the liquid outlet, and the liquid drain are all corresponding to the cleanroom cloth cleaning working area.

[0020] Preferably, the vision inspection module has a detection position for accommodating the glass substrate after PI film cleaning, and the high-resolution industrial camera and ring light source are positioned toward the detection position.

[0021] Compared with existing technologies, the core technical effect of this invention stems from the synergistic effect of ceramic micro-liquid supply, lateral liquid equalization, and constant-pressure reciprocating friction. The ceramic valve core micro-injection pump, as the ACF remover supply device, can control the single supply volume to 10μL±2μL, matching the supply of micro-removal agent to the local cleaning area of ​​the PI membrane, reducing PI membrane residue caused by insufficient solution and solvent residue caused by excessive solution. The ceramic valve core and flow components are made of ceramic, which helps improve corrosion resistance when in long-term contact with corrosive ACF removers and reduces the impact of solution crystallization and wear on the stability of the supply. The ceramic cleaning head adopts an engineering ceramic structure, which can adapt to the frictional conditions caused by corrosive solutions and solution crystal particles, reducing the impact of wear on the working surface of the cleaning head on the cleaning effect. By cooperating with the central liquid outlet and the transverse drainage channel, a limited amount of liquid solution is dispersed along the width direction before entering the cleanroom cloth, reducing localized liquid shortages or concentrations. Furthermore, the cleaning pressure adjustment component, in conjunction with relative reciprocating motion, ensures that the uniformly wetted cleanroom cloth rubs the PI film under stable contact pressure, thus continuously coupling the chemical action of the liquid solution with constant-pressure mechanical friction, improving the consistency of PI film removal between different glass substrates. The cleanroom cloth winding structure allows the used cloth segment to automatically leave the cleaning area, reducing the possibility of PI residue and crystal particles being carried into the next glass substrate. The anti-drip cleaning mechanism can handle residual drips generated by the ceramic cleaning head during standby. The visual inspection module can identify obvious PI film residue before subsequent ACF hot-press bonding. These auxiliary structures improve the stability and detectability of the equipment during continuous mass production without altering the core cleaning coordination relationship. [Attached Image Description] Figure 1 This is a schematic diagram of the overall structure of the PI membrane micro-liquid supply corrosion removal device of the present invention.

[0022] Figure 2 This is a schematic diagram of the assembly structure of the PI cleaning execution module and the micro-liquid supply module of the present invention.

[0023] Figure 3 This is a schematic diagram of the structure of the ceramic cleaning head of the present invention.

[0024] Figure 4 This is a schematic diagram of the structure of the cleanroom cloth conveying module of the present invention.

Detailed Implementation Methods

[0025] It should be noted that in the embodiments of the present invention, all directional indications (such as up, down, left, right, front, back, etc.) are limited to relative positions on the specified view, rather than absolute positions.

[0026] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] like Figure 1 As shown, this embodiment provides a PI film micro-liquid supply corrosion removal device, which is used to automatically remove the PI insulating protective film in the ITO electrode bonding area before the FPC hot-press bonding of the capacitive touch screen glass substrate.

[0028] The entire device is mounted on a frame.

[0029] Cleaning platform 1 is installed within the working area of ​​the equipment frame. A vacuum adsorption area is formed on cleaning platform 1. After the glass substrate to be processed enters cleaning platform 1, it is held in place by vacuum adsorption.

[0030] When fixing the glass substrate, the ITO electrode bonding area that needs to be FPC bonded is positioned so that it can be contacted by the ceramic cleaning head 7.

[0031] The PI cleaning X-axis 2 is positioned within the cleaning execution area, and the platform Y-axis 3 is connected to the cleaning platform 1 or a corresponding movable support structure. The PI cleaning X-axis 2 and the platform Y-axis 3 form two mutually cooperating horizontal motion axes.

[0032] Through the PI cleaning X-axis 2 and platform Y-axis 3 movements, the ceramic cleaning head 7 can accurately move to different bonding areas of the glass substrate and can form a reciprocating relative motion between the ceramic cleaning head 7 and the glass substrate.

[0033] The PI cleaning Z-axis 4 is mounted on the corresponding moving structure of the PI cleaning X-axis 2. The ceramic cleaning head 7 is mounted on the lower part of the PI cleaning Z-axis 4.

[0034] The PI cleaning Z-axis 4 has a lifting position and a cleaning position. In the lifting position, the ceramic cleaning head 7 is separated from the glass substrate to facilitate glass substrate transport, cloth replacement, or standby operation; in the cleaning position, the ceramic cleaning head 7 presses down the lint-free cloth roll 6 to bring the lint-free cloth into contact with the PI insulating film on the glass substrate.

[0035] The cleaning pressure adjustment component 10 is configured to cooperate with the PI cleaning Z-axis 4. In this embodiment, the cleaning pressure can be applied to the ceramic cleaning head 7 by constant pressure pneumatic drive, so that the contact pressure of the lint-free cloth on the glass substrate remains stable during the reciprocating motion of the ceramic cleaning head 7.

[0036] like Figure 2 and Figure 3 As shown, the ceramic cleaning head 7 is integrally sintered from engineering ceramics.

[0037] The reason for using a ceramic structure is that the ceramic cleaning head 7 needs to be in contact with the ACF remover for a long time, and also needs to withstand the friction generated by the lint-free cloth and the crystallized particles of the solution.

[0038] The working end of the ceramic cleaning head 7 forms a liquid outlet 13 and a drain trough 14.

[0039] The drain tank 14 extends laterally along the ceramic cleaning head 7, and the outlet 13 is located in the middle of the drain tank 14.

[0040] The ceramic valve core micro-injection pump 5 is connected to the outlet 13 via the solvent removal line 9.

[0041] The ceramic valve core micro-injection pump 5 has a valve core and flow-through components that are in direct contact with the ACF remover, all made of ceramic material.

[0042] After the equipment starts a cleaning program, the ceramic valve core micro-injection pump 5 performs a quantitative liquid supply action, delivering the ACF remover to the remover solvent line 9.

[0043] In this embodiment, the target liquid supply volume corresponding to a single cleaning trigger is set to 10 μL, and the normal allowable fluctuation is controlled within ±2 μL.

[0044] After the liquid enters the drain tank 14 from the outlet 13, it does not directly and centrally soak a single area of ​​the clean cloth, but spreads from the middle of the drain tank 14 to the left and right sides of the drain tank 14.

[0045] When the ceramic cleaning head 7 descends and brings the lint-free cloth into contact with the glass substrate, the ACF remover that has spread along the drain trough 14 further enters the gaps between the lint-free cloth fibers, thereby forming a more uniform liquid wetting band in the corresponding bonding area.

[0046] like Figure 4 As shown, the cleanroom cloth conveying module includes a cleanroom cloth unloading roll 12, a cleanroom cloth receiving roll 11, a cleanroom cloth left clamp 15, and a cleanroom cloth right clamp 16.

[0047] Cleanroom wipe roll 6 is installed on cleanroom wipe unloading roll 12.

[0048] Cleanroom wipe roll 6 is drawn out from cleanroom wipe unloading roll 12, passes under ceramic cleaning head 7, and finally connects to cleanroom wipe take-up roll 11.

[0049] The left clip 15 and the right clip 16 of the lint-free cloth are respectively set on both sides of the working area of ​​the ceramic cleaning head 7 to keep the lint-free cloth located below the ceramic cleaning head 7 taut and flat.

[0050] During cleaning, the left clip 15 and the right clip 16 of the cleanroom cloth work together to keep the cleanroom cloth in a stable position.

[0051] After cleaning, the PI cleaning Z-axis 4 lifts the ceramic cleaning head 7, separating it from the glass substrate.

[0052] Subsequently, the cleanroom cloth conveying module performs a cloth changing action, moving the cloth section that has been in contact with the PI film and ACF remover toward the cleanroom cloth take-up roll 11, and allowing the unused cloth section to enter below the ceramic cleaning head 7.

[0053] For continuous mass production processes, the cleanroom wipe working area is updated after each glass substrate cleaning process is completed, so that the next cleaning corresponds to the unused cleanroom wipe area.

[0054] After the glass substrate to be processed is fixed, the PI cleaning X-axis 2 and the platform Y-axis 3 move to align the ceramic cleaning head 7 with the FPC bonding area that needs to be processed.

[0055] The cleanroom cloth delivery module first ensures that there is a clean cleanroom cloth under the ceramic cleaning head 7.

[0056] The ceramic valve core micro-injection pump 5 is started, delivering 10μL±2μL of ACF remover to the ceramic cleaning head 7 through the remover solvent line 9.

[0057] ACF remover is discharged from outlet 13 and enters drainage tank 14, where it disperses to the left and right sides and then soaks the lint-free cloth.

[0058] PI then cleans the Z-axis and descends.

[0059] The cleaning pressure adjustment component 10 enables the ceramic cleaning head 7 to apply stable pressure to the PI film area of ​​the glass substrate through a lint-free cloth.

[0060] While maintaining contact pressure, at least one of the PI cleaning X-axis 2 and platform Y-axis 3 performs a preset reciprocating motion.

[0061] In this process, the ACF remover first or continuously chemically reacts with the PI insulating film, causing changes on the surface of the PI film or in the area bonded to the substrate that are suitable for mechanical removal.

[0062] At the same time, the lint-free cloth rubs against the PI film under the pressure of the ceramic cleaning head 7 and the relative motion in the XY direction.

[0063] Therefore, in this embodiment, a ceramic valve core micro-injection pump 5 is used to deliver a micro-quantitative amount of ACF removal agent. The liquid outlet 13 in the middle of the ceramic cleaning head 7 and the transverse drainage groove 14 are used to disperse the liquid along the width of the cleanroom cloth. The cleaning pressure adjustment component 10 maintains a stable contact pressure during the reciprocating relative motion, so that the chemical action of the liquid and the constant pressure mechanical friction of the cleanroom cloth are continuously combined to complete the removal of the PI film.

[0064] After completing the prescribed reciprocating cleaning cycle, the PI cleaning X-axis 2 stops cleaning, and the PI cleaning Z-axis 4 rises.

[0065] The cleanroom cloth conveyor module moves the cleanroom cloth roll 6, collects the used cleanroom cloth portion into the cleanroom cloth take-up roll 11, and moves the new cleanroom cloth area below the ceramic cleaning head 7.

[0066] After the PI film is cleaned, the glass substrate is transferred to the visual inspection position.

[0067] In the vision inspection module, a ring light source illuminates the FPC bonding area, and a high-resolution industrial camera captures images of the bonding area.

[0068] First, determine the testing area based on the specifications of the glass substrate product.

[0069] The detection area should at least cover the ITO electrode bonding area where the PI film removal is being performed.

[0070] Subsequently, grayscale features are obtained from the image within the detection area.

[0071] In the actual testing process, the grayscale characteristics of the current glass substrate testing area are compared with the preset reference grayscale characteristics or preset judgment conditions.

[0072] When there are no abnormal grayscale areas exceeding the preset allowable range within the detection area, the cleaning result is output as qualified.

[0073] When an abnormal area corresponding to the residual characteristics of the PI film is present in the detection area and meets the preset judgment conditions, the cleaning failure result is output.

[0074] The above detection process can be achieved by using image region determination, grayscale feature acquisition, and threshold comparison, without being limited to specific code or software language.

[0075] After the cleaning or inspection procedure is completed, if the ceramic cleaning head 7 does not perform the next cleaning for the time being, the PI cleaning Z-axis 4 will be raised first.

[0076] The PI cleaning X-axis 2 moves the ceramic cleaning head 7 to the position of the anti-drip cleaning mechanism 8.

[0077] The anti-drip cleaning mechanism 8 has a waste liquid receiving cavity located below the ceramic cleaning head 7.

[0078] If a small amount of ACF remover remains in the solvent line 9, outlet 13, or drain tank 14, the drips generated during standby will be collected by the waste liquid receiving chamber and will not drip directly onto the cleaning platform 1 or the glass substrate.

[0079] This avoids random dripping during equipment downtime from becoming a source of contamination for the next glass substrate.

[0080] The complete PI membrane removal process in this embodiment is as follows.

[0081] S1, the glass substrate enters the cleaning platform 1, is fixed by vacuum adsorption, and the electrode bonding area that needs to be FPC bonded is oriented toward the ceramic cleaning head 7.

[0082] S2, the cleanroom cloth unloading roll 12 releases the cleanroom cloth, and the cleanroom cloth left clamp 15 and cleanroom cloth right clamp 16 tighten the cleanroom cloth roll 6 to make the cleanroom cloth working surface flat.

[0083] S3, the ceramic valve core micro-injection pump 5 outputs ACF remover at a single supply volume of 10μL±2μL.

[0084] ACF remover enters the ceramic cleaning head 7 through the solvent line 9, flows out from the outlet 13 located in the middle of the drain tank 14, and spreads to the left and right sides along the drain tank 14, thereby soaking the cleanroom cloth working area.

[0085] S4, PI cleaning Z-axis 4 descends, cleaning pressure adjustment component 10 causes the lint-free cloth to adhere to the PI insulating film area of ​​the glass substrate at the set pressure.

[0086] The PI cleaning X-axis 2 and platform Y-axis 3 follow a preset motion trajectory to make the ceramic cleaning head 7 reciprocate with the glass substrate.

[0087] Under the combined action of the chemical action of the ACF remover and the mechanical friction of the lint-free cloth, the PI insulating film gradually detaches from the ITO electrode bonding area.

[0088] S5, after reaching the preset cleaning stroke, PI cleaning Z-axis 4 is raised.

[0089] The cleanroom wipe take-up roll 11 moves to collect the used wipes and the cleanroom wipe unloading roll 12 releases new wipes so that the next cleaning corresponds to the cleanroom wipe area.

[0090] S6, the glass substrate is transported to the vision inspection position.

[0091] An industrial camera captures images of the bonded area, identifies the presence of PI film residue based on the grayscale characteristics of the detection area, and outputs a result indicating whether the cleaning is qualified or unqualified.

[0092] S7, when the ceramic cleaning head 7 stops performing immediate cleaning, move the ceramic cleaning head 7 above the anti-drip cleaning mechanism 8 so that the residual liquid enters the waste liquid receiving cavity.

[0093] For products that require integrated FPC bonding on different bonding surfaces or in different bonding areas of the glass substrate, the above-mentioned PI film removal process can be performed on each bonding area separately.

[0094] After cleaning and visual inspection of one area to be bonded are completed, the next area to be bonded on the glass substrate is brought into the cleaning position in coordination with the whole line conveying system. Then, the same micro-liquid supply, uniform distribution of solution, constant pressure friction, automatic cloth changing and visual inspection process is carried out.

[0095] This allows different FPC bonding areas to use uniform pretreatment conditions, providing a clean electrode bonding surface with the PI film removed for subsequent ACF attachment and FPC hot-press bonding.

[0096] This invention is not limited to the specific embodiments described above. Without departing from the technical concept of this invention, those skilled in the art can make adaptive adjustments to the motion mechanism stroke, cleaning speed, cleanroom cloth replacement length, and visual inspection area based on the glass substrate size, FPC bonding area size, PI film condition, and production cycle time. As long as the above adjustments maintain the coordination between the ceramic micro-liquid supply, the liquid outlet in the middle of the ceramic cleaning head and the lateral liquid equalization, and the constant pressure reciprocating friction of the cleanroom cloth, they can all be considered specific implementations of the technical solution of this invention; the automatic cloth changing, anti-drip, and visual inspection structures can be configured according to production line requirements.

[0097] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any modifications, equivalent substitutions and improvements made within the concept of the present invention should be included within the patent protection scope of the present invention.

Claims

1. A micro-liquid supply corrosion removal device for PI film, used to remove the PI insulating film covering the electrode bonding area of ​​the glass substrate before hot-press bonding of the touch screen glass substrate and the flexible circuit board (FPC), characterized in that, It includes a cleaning platform for supporting and fixing a glass substrate, a motion mechanism for making the cleaning execution end move horizontally relative to the cleaning platform, a PI cleaning execution module, a cleanroom cloth delivery module, and a micro-liquid supply module; The PI cleaning execution module includes a lifting mechanism, a cleaning pressure adjustment component, and a ceramic cleaning head. The ceramic cleaning head is located at the lower part of the lifting mechanism. The bottom of the ceramic cleaning head is provided with a liquid outlet. The interior of the ceramic cleaning head is provided with a drain groove that communicates with the liquid outlet. The drain groove extends laterally along the ceramic cleaning head, and the liquid outlet is located in the middle of the drain groove. The micro-liquid supply module includes a ceramic valve core micro-injection pump and a removal liquid solvent pipeline. The ceramic valve core of the ceramic valve core micro-injection pump and the flow-through components inside the pump that come into contact with the ACF removal agent are made of ceramic material. The ceramic valve core micro-injection pump is connected to the outlet of the ceramic cleaning head through the removal liquid solvent pipeline. The cleanroom cloth conveying module is used to tension the cleanroom cloth working section between the ceramic cleaning head and the glass substrate, so that the ACF removal agent discharged through the ceramic cleaning head can wet the cleanroom cloth working section. The cleaning pressure adjustment component is driven by the ceramic cleaning head to apply a stable cleaning pressure to the electrode bonding area of ​​the glass substrate via the cleanroom cloth working section. The motion mechanism is used to enable the ceramic cleaning head and the glass substrate to reciprocate relative to each other while maintaining the stable cleaning pressure. The ceramic valve core micro-injection pump, the ceramic cleaning head with the transverse drainage groove, and the cleaning pressure adjustment component work together to allow the ACF remover to be supplied in small amounts and dispersed laterally to saturate the cleanroom cloth working section, and remove the PI insulating film under the reciprocating friction of stable pressure.

2. The PI membrane micro-supply corrosion removal device according to claim 1, characterized in that, The ceramic cleaning head is integrally sintered from engineering ceramics, and the liquid outlet and drain groove are formed on the ceramic working structure of the ceramic cleaning head.

3. The PI membrane micro-supply corrosion removal device according to claim 1, characterized in that, The drain trough extends in a direction corresponding to the width of the working section of the lint-free cloth, and the outlet is located in the middle of the length of the drain trough. The drain trough extends to both sides from the location of the outlet.

4. The PI membrane micro-supply corrosion removal device according to claim 1, characterized in that, The ceramic valve core of the ceramic valve core micro-injection pump and the flow-through components inside the pump that are in direct contact with the ACF remover together constitute a corrosion-resistant and wear-resistant micro-liquid supply passage.

5. The PI membrane micro-supply corrosion removal device according to claim 1, characterized in that, One end of the solvent removal pipeline is connected to the output end of the ceramic valve core micro-injection pump, and the other end is connected to the outlet of the ceramic cleaning head, forming a liquid supply path from the ceramic valve core micro-injection pump to the ceramic cleaning head.

6. The PI membrane micro-liquid supply corrosion removal device according to claim 1, characterized in that, The cleanroom cloth conveying module includes a cleanroom cloth feed roll, a cleanroom cloth take-up roll, a cleanroom cloth left clamp, and a cleanroom cloth right clamp. The cleanroom cloth is drawn out from the cleanroom cloth feed roll and extends to the cleanroom cloth take-up roll. The cleanroom cloth left clamp and cleanroom cloth right clamp are located on both sides of the ceramic cleaning head and tension the working section of the cleanroom cloth.

7. The PI membrane micro-supply corrosion removal device according to claim 1, characterized in that, The lifting mechanism is a PI cleaning Z-axis, and the cleaning pressure adjustment component includes a constant pressure cylinder. The constant pressure cylinder is connected to the ceramic cleaning head and is configured to cooperate with the PI cleaning Z-axis.

8. The PI membrane micro-liquid supply corrosion removal device according to claim 1, characterized in that, The motion mechanism includes a PI cleaning X-axis and a platform Y-axis. The PI cleaning X-axis adopts a servo drive structure and drives the PI cleaning execution module to move in the horizontal direction. The platform Y-axis drives the cleaning platform to move in a horizontal direction different from that of the PI cleaning X-axis.

9. The PI membrane micro-liquid supply corrosion removal device according to claim 1, characterized in that, It also includes a drip-proof cleaning mechanism, which is located in the standby position of the ceramic cleaning head and has a waste liquid receiving cavity with an opening facing the standby position.

10. The PI membrane micro-liquid supply corrosion removal device according to claim 1, characterized in that, It also includes a vision inspection module, which includes a high-resolution industrial camera and a ring light source. The imaging area of ​​the industrial camera and the illumination area of ​​the ring light source correspond to the detection position of the electrode bonding area of ​​the glass substrate.

Images