A spot welding device for electronic chip processing

Abstract

The application relates to the technical field of electronic chip, in particular to a spot welding device for electronic chip processing, which comprises a processing table and a welding assembly arranged above the processing table, two conveying assemblies are symmetrically arranged in the middle of the processing table, and a plurality of placing grooves for placing electronic chips are arranged between the conveying assemblies; an adsorption assembly is arranged between the two conveying assemblies, the adsorption assembly is arranged in the middle of the processing table, the adsorption assembly comprises an adsorption seat, a plurality of adsorption holes are formed in the adsorption seat; a lifting structure is arranged between the adsorption seat and the conveying assembly, the lifting structure is used for driving the adsorption seat to move up and down; four clamping assemblies are symmetrically arranged on the two sides of the adsorption seat, the clamping assemblies are used for clamping and fixing the electronic chips in the process of moving the adsorption seat up and down, and the application converts the adsorption lifting main movement into a lateral adaptive clamping movement in a pure mechanical linkage mode, and the cooperation of the fixing actions is realized.

Description

Technical Field

[0001] This invention relates to the field of electronic chip technology, and in particular to a spot welding apparatus for electronic chip processing. Background Technology

[0002] Spot welding is a key process in chip packaging, wire bonding, sensor manufacturing and other processes. As chips become smaller, denser and more heterogeneous, the requirements for the precision, reliability, adaptability and intelligence of spot welding technology will only become higher and higher.

[0003] CN220127799U discloses a spot welding device for microelectronic chip processing, including a moving bracket with a welding unit on top. The welding unit contains a heating block, and multiple sets of sliding grooves are provided on the sides of the welding rod and the heating block. The heating block in the welding unit is connected to a circuit. A heat-conducting rod is embedded in the sliding groove on the side of the heating block and is in close contact with the heating block. The heating block heats the heat-conducting rod, and the heat is transferred to the welding head through the heat-conducting rod, causing the welding head to heat up and start working. A sliding push block is connected to the top of the side of the heat-conducting rod. By moving the sliding push block, the heat-conducting rod is moved. A retraction spring pulls the heat-conducting rod, and when the heat-conducting rod is retracted, it is automatically stored inside the welding unit. By replacing different welding rods, the device can prevent the welding material adhering to the welding rod from mixing.

[0004] Because electronic chips are small in size, they cannot be rigidly clamped during welding. Therefore, they are usually fixed by negative pressure adsorption. During adsorption, in order to ensure that the adsorption device fits tightly with the end of the electronic chip, a motor drive is usually selected. However, during the process of the adsorption device rising to fit the bottom of the chip, the chip is prone to lateral displacement or tipping due to airflow impact or uneven contact, which affects the welding accuracy and may even lead to chip scrap in severe cases. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of the prior art by providing a spot welding device for electronic chip processing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A spot welding device for electronic chip processing includes: a processing table and welding components mounted on the processing table. Two conveying components are symmetrically arranged in the middle of the processing table, and multiple placement slots for placing electronic chips are arranged between the conveying components. An adsorption assembly is provided between the two conveying components. The adsorption assembly is located in the middle of the processing table. The adsorption assembly includes an adsorption seat with multiple adsorption holes for adsorbing and fixing electronic chips from the bottom. A lifting structure is provided between the adsorption seat and the conveying component, and the lifting structure is used to drive the adsorption seat to move up and down. Four clamping components are symmetrically arranged on both sides of the adsorption seat. The clamping components are used to clamp and fix the electronic chip during the upward movement of the adsorption seat. The clamping components include a limiting tube, an elastic tube, a connecting telescopic block, and a clamping block. The limiting tube is fixedly connected to the side of the adsorption seat. The elastic tube is slidably disposed inside the limiting tube by a pulling component. The connecting telescopic block is fixedly connected to the outer end of the elastic tube. The clamping block is fixedly connected to the end of the connecting telescopic block away from the elastic tube.

[0007] Preferably, the welding assembly includes a movable frame and a welding end, the movable frame being fixedly mounted on the processing table, and the welding end being mounted on the movable frame for welding electronic chips.

[0008] Preferably, the conveying assembly includes a drive motor, two drive shafts and a transmission belt. The two drive shafts are symmetrically arranged at both ends on the same side of the processing table. The drive motor is fixedly connected to the drive shafts, and the transmission belt is limited and sleeved between the two drive shafts.

[0009] Preferably, the adsorption assembly further includes a base plate, a mounting frame, a limiting rod, and multiple spring tubes. The mounting frame is fixedly connected to the middle of the processing table, the base plate is fixedly connected to the middle of the mounting frame, the multiple spring tubes are fixedly connected to the four corners of the mounting frame, the limiting rod is fixedly connected to the middle of the mounting frame, and the adsorption seat is fixedly connected to the upper ends of the spring tubes and the limiting rod.

[0010] Preferably, the lifting structure includes two lifting blocks, multiple connecting strips, and multiple lifting bars. The two lifting blocks are symmetrically fixedly connected to both sides of the adsorption seat, the multiple connecting strips are fixedly connected below the transmission belt and located in the middle of the placement groove, and the multiple lifting bars are fixedly connected to the bottom of the connecting strips.

[0011] Preferably, the lifting block is rectangular with the smaller bottom side facing downwards, the lifting strip has a triangular cross-section and its tip is fixedly connected to the lifting block, and the lifting strip will drive the lifting block to move up and down as it moves with the transmission belt.

[0012] Preferably, the limiting tube has a polygonal opening in the middle, and the elastic tube is a polygonal tube corresponding to the polygonal opening. The limiting tube is used to restrict the directional movement of the elastic tube. The connecting telescopic block is vertically fixedly connected to the elastic tube so that after the elastic tube is completely inside the limiting tube, the connecting telescopic block remains in a vertical state.

[0013] Preferably, the bottom of the adsorption seat has an air extraction space, and an air outlet and an air inlet are fixedly connected to both sides respectively. Multiple adsorption holes are connected to the air extraction space, and multiple curved connecting channels are provided on the side of the adsorption seat. The two openings of the connecting channels are respectively located on the side of the limiting tube and the bottom surface of the adsorption seat.

[0014] Preferably, the pulling assembly includes multiple limiting wheels, a pulling tube, and a fixing tube. The multiple limiting wheels are respectively fixedly connected to the upper surface of the base plate and the bottom surface of the adsorption seat. The fixing tube is fixedly connected to the bottom surface of the adsorption seat and communicates with the air extraction space. One end of the pulling tube is fixedly connected to the bottom of the fixing tube, and the other end passes through the connecting channel and is fixedly connected to the elastic tube.

[0015] Preferably, the clamping block is provided with a plurality of elastic strips in the middle, and the side of the clamping block away from the limiting tube is provided with a plurality of air inlets communicating with the elastic tube, the air inlets being used to absorb welding waste gas.

[0016] Compared with the prior art, the beneficial effects of the present invention are: When the adsorption seat rises under the action of the lifting structure, the pulling component forces the elastic tube, which was originally located outside the limiting tube, to move inward. This causes the connecting telescopic block and the clamping block to deflect and move inward into the elastic tube, so that the clamping block gradually changes from a horizontal state to a vertical state, and fixes the electronic chip from the side. This achieves synchronous clamping during the rising process. The present invention uses a purely mechanical linkage method to transform the main motion of adsorption and lifting into a lateral adaptive clamping motion, thus achieving the coordination of the fixing action. The lifting assembly enables fully mechanized synchronous drive, with the lifting and lowering of the adsorption base synchronized with the chip transfer rhythm. No additional sensors, controllers, or drive components are required, resulting in a simple structure, extremely high reliability, and a low failure rate. It directly utilizes the existing power of the transfer system, saving energy and reducing moving parts. This ensures that the adsorption base rises precisely when the chip arrives at the soldering station. To ensure that the elastic tube can only deflect in a predetermined direction, both the limiting tube and the elastic tube are set as polygons, thereby ensuring that the movement trajectory of the clamping block is accurate and that there is no rotation or swaying, thus ensuring that the clamping block clamps and limits the side of the electronic chip. The pulling component converts the relative displacement between the adsorption base and the base plate into a clamping force. When the adsorption base rises, the limiting wheels fixed to the bottom surface of the adsorption base and the base plate tighten and stretch the pulling tube. This tension is transmitted to the elastic tube through the connecting channel, thereby pulling the elastic tube to move and changing the clamping block from an inclined state to a vertical state. When the adsorption base descends, the pulling tube relaxes, and the elastic tube moves to the outside of the limiting tube under the gravity of the clamping block, thereby causing the clamping block to automatically leave the chip, realizing synchronous release during the descent process. An elastic strip is provided on the inner side to provide a flexible contact surface, which can adapt to chips of different thicknesses and buffer the clamping force to prevent damage caused by over-clamping due to dimensional tolerances or accidents; an air inlet is provided that communicates with the inner cavity of the elastic tube, so that an external air extraction system can be connected during welding to absorb harmful welding exhaust gases. Attached Figure Description

[0017] Figure 1 This is a side view of a spot welding device for electronic chip processing proposed in this invention. Figure 2 This is a front structural schematic diagram of a spot welding device for electronic chip processing proposed in this invention; Figure 3 This is a schematic diagram of the transfer component structure of a spot welding device for electronic chip processing proposed in this invention; Figure 4 This is a schematic diagram of the lifting structure of a spot welding device for electronic chip processing proposed in this invention; Figure 5 This is a schematic diagram of the adsorption component structure of a spot welding device for electronic chip processing proposed in this invention; Figure 6 This is a schematic diagram of the middle structure of the adsorption component of a spot welding device for electronic chip processing proposed in this invention; Figure 7 This is a schematic diagram of the cross-sectional structure of the adsorption component of a spot welding device for electronic chip processing proposed in this invention; Figure 8 This is a schematic diagram of the clamping component structure of a spot welding device for electronic chip processing proposed in this invention; Figure 9 This is a front view of the clamping assembly of a spot welding device for electronic chip processing proposed in this invention. Figure 10 This is a schematic diagram showing the state changes of the clamping components in a spot welding device for electronic chip processing proposed in this invention.

[0018] In the diagram: 1. Processing table; 2. Welding assembly; 21. Moving frame; 22. Welding end; 3. Conveying assembly; 31. Drive motor; 32. Drive shaft; 33. Transmission belt; 4. Adsorption assembly; 41. Adsorption seat; 42. Base plate; 43. Mounting frame; 44. Limiting rod; 45. Bourdon tube; 5. Lifting structure; 51. Lifting block; 52. Connecting strip; 53. Lifting bar; 6. Clamping assembly; 61. Limiting tube; 62. Elastic tube; 63. Connecting telescopic block; 64. Clamping block; 7. Pulling assembly; 71. Limiting wheel; 72. Pulling tube; 73. Fixing tube; 8. Air inlet. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] The terms used in this invention, such as "upper," "lower," "left," "right," "middle," and "one," are merely for clarity of description and are not intended to limit the scope of the invention. Any changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0021] Reference Figures 1-10 A spot welding device for electronic chip processing includes: a processing table 1 and a welding assembly 2 mounted on the processing table 1. Two conveying assemblies 3 are symmetrically arranged in the middle of the processing table 1, and a plurality of placement slots for placing electronic chips are arranged between the conveying assemblies 3. An adsorption component 4 is provided between the two conveying components 3. The adsorption component 4 is located in the middle of the processing table 1. The adsorption component 4 includes an adsorption seat 41 with multiple adsorption holes for adsorbing and fixing electronic chips from the bottom. A lifting structure 5 is provided between the adsorption seat 41 and the conveying component 3, and the lifting structure 5 is used to drive the adsorption seat 41 to move up and down. Four clamping components 6 are symmetrically arranged on both sides of the adsorption seat 41. The clamping components 6 are used to clamp and fix the electronic chip during the upward movement of the adsorption seat 41. The clamping components 6 include a limiting tube 61, an elastic tube 62, a connecting telescopic block 63, and a clamping block 64. The limiting tube 61 is fixedly connected to the side of the adsorption seat 41. The elastic tube 62 is slidably disposed inside the limiting tube 61 by a pulling component 7. The connecting telescopic block 63 is fixedly connected to the outer end of the elastic tube 62. The clamping block 64 is fixedly connected to the end of the connecting telescopic block 63 away from the elastic tube 62.

[0022] In the embodiments of the above technical solution, the adsorption force of the adsorption seat 41 on the chip is gradually established during the rising process. Before it is fully attached, there is a risk of the chip being displaced.

[0023] When the adsorption seat 41 rises under the action of the lifting structure 5, the pulling component 7 forces the elastic tube 62, which was originally located outside the limiting tube 61, to move inward. This causes the connecting telescopic block 63 and the clamping block 64 to deflect and move towards the chip inside the elastic tube 62, so that the clamping block 64 gradually changes from a horizontal state to a vertical state, and fixes the electronic chip from the side, achieving synchronous clamping during the rising process.

[0024] Before the adsorption force is fully established, the lateral clamping of this invention begins to work, gently constraining the chip in the correct position, achieving a stable transition from delivery to fixation. In a purely mechanical linkage manner, the main motion of adsorption lifting is transformed into lateral adaptive clamping motion, realizing the coordination of fixing actions.

[0025] The preferred technical solution in this embodiment is: Reference Figures 1-4 The welding assembly 2 includes a movable frame 21 and a welding end 22. The movable frame 21 is fixedly mounted on the processing table 1, and the welding end 22 is mounted on the movable frame 21 for welding electronic chips.

[0026] The welding end 22 is mounted on a multi-axis movable frame 21, which is typically driven by a precision guide rail and a servo motor, enabling precise positioning in the X, Y, Z, and even more directions.

[0027] The transmission assembly 3 includes a drive motor 31, two drive shafts 32 and a transmission belt 33. The two drive shafts 32 are symmetrically arranged at both ends on the same side of the processing table 1. The drive motor 31 is fixedly connected to the drive shafts 32, and the transmission belt 33 is limited and sleeved between the two drive shafts 32.

[0028] In automated spot welding, chips need to be continuously, smoothly and accurately transported to the welding station. Traditional manual loading and unloading is inefficient and prone to chip damage or positional deviation due to improper operation. When using a conveyor belt for transport, the chips may slide or flip on the belt, affecting the positioning accuracy.

[0029] This device adopts a symmetrically arranged dual conveyor belt structure. A series of equidistant placement slots are set between the two conveyor belts. The shape of each placement slot is adapted to the chip carrier or the chip itself, which plays a limiting role. The drive motor 31 drives the transmission belt 33 to move synchronously through the drive shaft 32 to ensure smooth conveying.

[0030] It realizes automated, assembly-line conveying of electronic chips, greatly improving production efficiency. The placement slot performs initial positioning of the chips to prevent them from moving laterally or rotating during the conveying process, laying the foundation for subsequent precise positioning. The dual conveyor belt design ensures conveying stability and avoids jamming or skewing that may be caused by unilateral transmission.

[0031] Reference Figures 5-7 The adsorption assembly 4 also includes a base plate 42, a mounting frame 43, a limiting rod 44, and multiple spring tubes 45. The mounting frame 43 is fixedly connected to the middle of the processing table 1, the base plate 42 is fixedly connected to the middle of the mounting frame 43, the multiple spring tubes 45 are fixedly connected to the four corners of the mounting frame 43, the limiting rod 44 is fixedly connected to the middle of the mounting frame 43, and the adsorption seat 41 is fixedly connected to the upper end of the spring tubes 45 and the limiting rod 44.

[0032] Electronic chips are fragile, and traditional mechanical clamps are prone to stress concentration or surface scratches. Although negative pressure adsorption can avoid contact damage, if the adsorption force is not established in time or is uneven when the adsorption seat 41 moves to adhere to the bottom surface of the chip, the chip may shift due to airflow or contact collision.

[0033] The adsorption base 41 has a sealed air extraction space inside. A negative pressure is generated by an external vacuum system (connecting the air outlet and air inlet). The negative pressure acts on the bottom of the chip through multiple evenly distributed adsorption holes. The adsorption base 41 is supported on the mounting bracket 43 by multiple spring tubes 45. The spring tubes 45 provide the initial reset elastic force. The limiting rod 44 ensures that the adsorption base 41 only moves vertically up and down, avoiding swaying.

[0034] Reference Figure 4 The lifting structure 5 includes two lifting blocks 51, multiple connecting strips 52 and multiple lifting strips 53. The two lifting blocks 51 are symmetrically fixedly connected to both sides of the adsorption seat 41. The multiple connecting strips 52 are fixedly connected to the bottom of the transmission belt 33 and located in the middle of the placement groove. The multiple lifting strips 53 are fixedly connected to the bottom of the connecting strips 52. The lifting block 51 is rectangular with the smaller bottom side facing downwards. The lifting strip 53 has a triangular cross-section and its tip is fixedly connected to the lifting block 51. The lifting strip 53 will drive the lifting block 51 to move up and down as it moves with the transmission belt 33.

[0035] Since the adsorption seat 41 needs to be driven to rise and fall to actively adhere to the chip, using an independent motor or cylinder would increase the system complexity, cost, and control difficulty, and would also make it difficult to achieve precise synchronization with the continuously running conveying action.

[0036] The lifting power source is combined with the transmission component 3. A connecting strip 52 and a lifting strip 53 are fixed below the transmission belt 33. The tip of the lifting strip 53 is designed as a triangle. When the lifting strip 53 moves with the belt to contact the lifting blocks 51 (sloping design) on both sides of the adsorption seat 41, the horizontal movement of the belt is converted into the vertical upward movement of the lifting blocks 51 through the wedge action of the sloping surfaces, thereby lifting the adsorption seat 41. After the spot welding is completed and the highest point is passed, the lifting strip 53 disengages from the lifting blocks 51, and the adsorption seat 41 automatically descends and resets under the action of the spring tube 45.

[0037] The lifting assembly enables fully mechanized synchronous drive, and the lifting and lowering of the adsorption seat 41 is synchronized with the chip transfer rhythm. No additional sensors, controllers or drive components are required. The structure is simple, highly reliable and has a low failure rate. It directly utilizes the existing power of the transfer system, saving energy and reducing moving parts. It ensures that the adsorption seat 41 rises precisely when the chip arrives at the soldering station.

[0038] The connecting strip 52 and the lifting strip 53 are detachably connected and fixed by screws or buckles. The factory can be equipped with a variety of lifting strip 53 modules with different spacings, which can be quickly replaced according to the production plan to realize the step adjustment of the production cycle.

[0039] Reference Figures 7-9 The limiting tube 61 has a polygonal opening in the middle, and the elastic tube 62 is a polygonal tube corresponding to the polygonal opening. The limiting tube 61 is used to restrict the directional movement of the elastic tube 62. The connecting telescopic block 63 is vertically fixedly connected to the elastic tube 62 so that after the elastic tube 62 is completely inserted into the limiting tube 61, the connecting telescopic block 63 remains in a vertical state. The bottom of the adsorption seat 41 is provided with an air extraction space, and an air outlet and an air inlet are fixedly connected to both sides respectively. Multiple adsorption holes are connected to the air extraction space. Multiple curved connecting channels are provided on the side of the adsorption seat 41. The two openings of the connecting channels are respectively located on the side of the limiting tube 61 and the bottom surface of the adsorption seat 41.

[0040] To ensure that the elastic tube 62 can only deflect in a predetermined direction, both the limiting tube 61 and the elastic tube 62 are set as polygons, thereby ensuring that the movement trajectory of the clamping block 64 is accurate and that there is no rotation or swaying, thus ensuring that the clamping block 64 clamps and limits the side of the electronic chip.

[0041] The elastic tube 62 is made of materials such as silicone rubber and thermoplastic polyurethane, whose elastic modulus can be precisely controlled and which have good fatigue life.

[0042] Reference Figures 8-9 The pulling component 7 includes multiple limiting wheels 71, a pulling tube 72, and a fixing tube 73. The multiple limiting wheels 71 are respectively fixedly connected to the upper surface of the base plate 42 and the bottom surface of the adsorption seat 41. The fixing tube 73 is fixedly connected to the bottom surface of the adsorption seat 41 and communicates with the air extraction space. One end of the pulling tube 72 is fixedly connected to the bottom of the fixing tube 73, and the other end passes through the connecting channel and is fixedly connected to the elastic tube 62.

[0043] The pulling component 7 can convert the relative displacement between the adsorption seat 41 and the base plate 42 into a force for controlling the clamping. When the adsorption seat 41 rises, the limiting wheel 71 fixed on the bottom surface of the adsorption seat 41 and the base plate 42 will tighten and stretch the pulling tube 72. This tension is transmitted to the elastic tube 62 through the connecting channel, thereby pulling the elastic tube 62 to move and completing the change of the clamping block 64 from an inclined state to a vertical state. When the adsorption seat 41 descends, the pulling tube 72 relaxes, and the elastic tube 62 moves to the outside of the limiting tube 61 under the gravity of the clamping block 64, thereby driving the clamping block 64 to automatically leave the chip, realizing synchronous release during the descent process.

[0044] At the same time, the position of the limiting wheel 71 and the length of the connecting telescopic block 63 can be adjusted according to the size and thickness of the electronic chip being clamped, so as to effectively clamp and fix electronic chips of different specifications.

[0045] Reference Figure 9 The clamping block 64 has multiple elastic strips in the middle, and multiple air inlets 8 connected to the elastic tube 62 are opened on the side of the clamping block 64 away from the limiting tube 61. The air inlets 8 are used to absorb welding waste gas.

[0046] An elastic strip is provided on the inner side to provide a flexible contact surface, which can adapt to chips of different thicknesses and buffer the clamping force to prevent damage caused by over-clamping due to dimensional tolerances or accidents; an air inlet 8 is provided that communicates with the inner cavity of the elastic tube 62, so that an external air extraction system can be connected during welding to absorb harmful welding waste gas.

[0047] While ensuring the clamping effect, the clamping component 6 also has the function of fume absorption without affecting the spot welding work, thus optimizing the working environment. Similarly, a corresponding exhaust gas filtration and collection treatment device can be set inside the exhaust space to improve the efficiency of exhaust gas treatment.

[0048] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A spot welding apparatus for electronic chip processing, comprising: The processing table and the welding assembly mounted on the processing table are characterized in that two conveying assemblies are symmetrically arranged in the middle of the processing table, the conveying assemblies include a transmission belt, and a plurality of placement slots for placing electronic chips are arranged between the conveying assemblies. An adsorption assembly is provided between the two conveying components. The adsorption assembly is located in the middle of the processing table. The adsorption assembly includes an adsorption seat and a base plate. The adsorption seat has multiple adsorption holes for adsorbing and fixing electronic chips from the bottom. The bottom of the adsorption seat has an air extraction space. A lifting structure is provided between the adsorption seat and the conveying component, and the lifting structure is used to drive the adsorption seat to move up and down. The lifting structure includes two lifting blocks, multiple connecting strips, and multiple lifting bars. The two lifting blocks are symmetrically fixedly connected to both sides of the adsorption seat. The multiple connecting strips are fixedly connected below the transmission belt and located in the middle of the placement groove. The multiple lifting bars are fixedly connected to the bottom of the connecting strips. Four clamping components are symmetrically arranged on both sides of the adsorption seat. The clamping components are used to clamp and fix the electronic chip during the upward movement of the adsorption seat. The clamping components include a limiting tube, an elastic tube, a connecting telescopic block and a clamping block. The limiting tube is fixedly connected to the side of the adsorption seat. The elastic tube is slidably disposed inside the limiting tube by a pulling component. The connecting telescopic block is fixedly connected to the outer end of the elastic tube. The clamping block is fixedly connected to the end of the connecting telescopic block away from the elastic tube. The limiting tube has a polygonal opening in the middle, and the elastic tube is a polygonal tube corresponding to the polygonal opening. The limiting tube is used to restrict the directional movement of the elastic tube. The pulling assembly includes multiple limiting wheels, a pulling tube, and a fixing tube. The multiple limiting wheels are respectively fixedly connected to the upper surface of the base plate and the bottom surface of the adsorption seat, making the pulling tube wavy. The fixing tube is fixedly connected to the bottom surface of the adsorption seat and communicates with the air extraction space. One end of the pulling tube is fixedly connected to the bottom of the fixing tube, and the other end passes through the connecting channel and is fixedly connected to the elastic tube.

2. The spot welding device for electronic chip processing according to claim 1, characterized in that, The welding assembly includes a movable frame and a welding end. The movable frame is fixedly mounted on the processing table, and the welding end is mounted on the movable frame for welding electronic chips.

3. The spot welding device for electronic chip processing according to claim 1, characterized in that, The transmission assembly also includes a drive motor and two drive shafts. The two drive shafts are symmetrically arranged at both ends on the same side of the processing table. The drive motor is fixedly connected to the drive shafts, and the transmission belt is limited and sleeved between the two drive shafts.

4. The spot welding apparatus for electronic chip processing according to claim 3, characterized in that, The adsorption assembly also includes a mounting frame, a limiting rod, and multiple spring tubes. The mounting frame is fixedly connected to the middle of the processing table, the base plate is fixedly connected to the middle of the mounting frame, the multiple spring tubes are fixedly connected to the four corners of the mounting frame, the limiting rod is fixedly connected to the middle of the mounting frame, and the adsorption seat is fixedly connected to the upper ends of the spring tubes and the limiting rod.

5. The spot welding apparatus for electronic chip processing according to claim 4, characterized in that, The lifting block is rectangular with the smaller bottom side facing downwards. The lifting bar has a triangular cross-section and its tip is fixedly connected to the lifting block. The lifting bar will drive the lifting block to move up and down as it moves with the transmission belt.

6. The spot welding apparatus for electronic chip processing according to claim 5, characterized in that, The connecting telescopic block is vertically fixed to the elastic tube, so that after the elastic tube is fully inserted into the limiting tube, the connecting telescopic block remains in a vertical state.

7. The spot welding apparatus for electronic chip processing according to claim 6, characterized in that, The bottom two sides of the adsorption seat are respectively fixedly connected to an air outlet and an air inlet. Multiple adsorption holes are connected to the air extraction space. Multiple curved connecting channels are opened on the side of the adsorption seat. The two openings of the connecting channels are respectively located on the side of the limiting tube and the bottom surface of the adsorption seat.

8. The spot welding apparatus for electronic chip processing according to claim 1, characterized in that, The clamping block has multiple elastic strips in the middle, and multiple air inlets connected to the elastic strips are opened on the side of the clamping block away from the limiting tube. The air inlets are used to absorb welding waste gas.

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