Laser processing control method, device and storage medium based on motion platform

Abstract

The application discloses a kind of laser processing control method, equipment and storage medium based on motion platform, belong to laser processing technical field.The method includes: obtaining global processing track, and global processing track is decomposed into the motion component of motion platform and the scanning component of galvanometer, target displacement of motion platform is determined according to motion component, and target deflection angle of galvanometer is determined through kinematics model according to scanning component, target displacement and target deflection angle are respectively issued to motion platform and galvanometer, to drive motion platform and galvanometer relative movement based on global processing track.The application makes laser focal point continuously move along whole global track by driving motion platform and galvanometer relative movement based on global processing track, eliminates the splicing error accumulated due to repeated positioning, to ensure the processing precision of large-format workpiece in whole-format range.

Description

Technical Field

[0001] This application relates to the field of laser thermal processing technology, and in particular to a laser processing control method, equipment and storage medium based on a motion platform. Background Technology

[0002] In related technologies, laser processing of large-format workpieces typically employs a segmented static processing method. This involves dividing the large-format workpiece into multiple processing blocks, keeping the galvanometer fixed, and completing the processing of the current block within its effective scanning range. After completing one block, the motion platform moves the workpiece or galvanometer stepwise to the corresponding position of the next block. After repositioning, the galvanometer processes that block, and the above process is repeated until all blocks are processed. The processing results of each block are then stitched together to cover the entire large-format workpiece.

[0003] In the segmented static machining process, each machining block is processed separately and then spliced ​​together. The relative positional relationship between adjacent blocks depends entirely on the repeatability accuracy of the motion platform. As the motion platform moves the workpiece from one block to the next, each repositioning introduces a positioning error. With the increase in the number of machining blocks, these positioning errors accumulate. This accumulation of positioning errors causes misalignment of the machining trajectories of adjacent blocks at the splicing boundary, leading to deterioration in machining quality at the splicing boundary and a significant decrease in the overall machining accuracy of large-format workpieces.

[0004] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Summary of the Invention

[0005] The main objective of this application is to provide a laser processing control method, equipment, and storage medium based on a motion platform, which aims to solve the technical problem that the accumulation of positioning errors in the laser processing of large-format workpieces causes misalignment of the processing trajectories of adjacent blocks at the splicing boundary, resulting in a significant decrease in the overall processing accuracy of large-format workpieces.

[0006] To achieve the above objectives, this application provides a laser processing control method based on a motion platform, the method comprising the following steps: The global machining trajectory is acquired and decomposed into the motion component of the motion platform and the scanning component of the galvanometer. The target displacement of the motion platform is determined based on the motion components, and the target deflection angle of the galvanometer is determined by the kinematic model based on the scanning components. The target displacement and the target deflection angle are respectively sent to the motion platform and the galvanometer to drive the motion platform and the galvanometer to move relative to each other based on the global machining trajectory.

[0007] In one embodiment, the step of acquiring the global machining trajectory and decomposing the global machining trajectory into motion components of the motion platform and scanning components of the galvanometer includes: The global processing trajectory is decomposed by frequency to obtain motion components of different frequencies; Motion components with frequencies lower than a preset frequency threshold are defined as the motion components. Motion components with frequencies not lower than the preset frequency threshold are identified as the scanning components.

[0008] In one embodiment, before the steps of determining the target displacement of the motion platform based on the motion components and determining the target deflection angle of the galvanometer based on the scanning components using a kinematic model, the method further includes: Calibrate the installation offset of the galvanometer relative to the motion platform; Calibrate the focal length of the galvanometer; Based on the installation offset and the focal length, the kinematic model is established, which characterizes the mapping relationship between the displacement of the motion platform and the galvanometer deflection angle to the global position of the laser focus.

[0009] In one embodiment, the step of establishing the kinematic model based on the installation offset and the focal length, wherein the kinematic model characterizes the mapping relationship between the displacement of the motion platform and the galvanometer deflection angle to the global position of the laser focus, includes: Based on the galvanometer deflection angle and the focal length, determine the focal displacement corresponding to the galvanometer deflection angle; The global position of the laser focus is obtained by summing the focal displacement, the installation offset, and the motion platform displacement. The kinematic model is defined by the correspondence between the global position of the laser focus, the displacement of the motion platform, and the deflection angle of the galvanometer.

[0010] In one embodiment, the steps of determining the target displacement of the motion platform based on the motion components and determining the target deflection angle of the galvanometer using a kinematic model based on the scanning components include: Obtain the global motion velocity corresponding to the global processing trajectory; Construct an optimization problem with the objective of minimizing the weighted sum of squares of the velocity and acceleration of the motion platform; The optimization problem is solved with constraints that the galvanometer speed is equal to the difference between the global motion speed and the motion platform speed, and that the motion platform speed and the galvanometer speed do not exceed preset upper limits, to obtain the motion platform speed and the galvanometer speed. The target displacement and the target deflection angle are determined based on the speed of the motion platform and the speed of the galvanometer.

[0011] In one embodiment, the step of determining the target displacement and the target deflection angle based on the motion platform speed and the galvanometer speed includes: Obtain the radius of curvature of the global machining trajectory at the current interpolation point; The interpolation period is adjusted based on the ratio of the radius of curvature to the preset curvature threshold. The target displacement and the target deflection angle are determined based on the adjusted interpolation period, the speed of the motion platform, and the speed of the galvanometer.

[0012] In one embodiment, after the step of sending the target displacement and the target deflection angle to the motion platform and the galvanometer respectively to drive the motion platform and the galvanometer to move relative to each other based on the global machining trajectory, the method further includes: Obtain the actual displacement of the motion platform and the actual deflection angle of the galvanometer; Calculate the displacement deviation between the actual displacement and the target displacement, and the angular deviation between the actual deflection angle and the target deflection angle; A compensation amount is generated based on the displacement deviation and the angular deviation, and the compensation amount is sent to the motion platform and the galvanometer for correction.

[0013] In one embodiment, the step of acquiring the global machining trajectory and decomposing the global machining trajectory into motion components of the motion platform and scanning components of the galvanometer includes: The global machining trajectory is divided into multiple blocks according to the scanning range of the galvanometer, and an overlapping area is reserved between adjacent blocks; Load the processing data of the current block into the first buffer, and preload the processing data of the next block into the second buffer while processing the current block; When the current block is completed, the data reading is switched from the first buffer to the second buffer.

[0014] In addition, to achieve the above objectives, this application also provides a laser processing control device based on a motion platform, the device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the laser processing control method based on the motion platform as described above.

[0015] In addition, to achieve the above objectives, this application also provides a storage medium, which is a computer-readable storage medium, and stores a computer program thereon. When the computer program is executed by a processor, it implements the steps of the laser processing control method based on a motion platform as described above.

[0016] One or more technical solutions proposed in this application have at least the following technical effects: This application acquires the global machining trajectory and decomposes it into motion components of the motion platform and scanning components of the galvanometer. This allows the entire machining path of a large-format workpiece to be uniformly incorporated into a continuous trajectory planning range. The target displacement of the motion platform is determined based on the motion components, and the target deflection angle of the galvanometer is determined based on the scanning components through a kinematic model. This enables the macroscopic feed and microscopic scan to be respectively calculated into mutually matched control commands. The target displacement and target deflection angle are then sent to the motion platform and the galvanometer, driving them to move relative to each other based on the global machining trajectory. This allows the laser focus to move continuously along the entire global trajectory. Since the machining process is completed continuously by the motion platform and the galvanometer in collaboration, the repetitive positioning links between adjacent blocks are eliminated, and the splicing errors accumulated due to repetitive positioning also disappear. The entire machining path is always continuously generated based on a unified global trajectory, thereby ensuring the machining accuracy of large-format workpieces across the entire area. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart illustrating the first embodiment of the laser processing control method based on a motion platform according to this application; Figure 2 This is a flowchart illustrating the second embodiment of the laser processing control method based on a motion platform according to this application; Figure 3 This is a flowchart illustrating the third embodiment of the laser processing control method based on a motion platform according to this application; Figure 4 This is a schematic diagram of the structure of a motion platform-based laser processing control device in the hardware operating environment of the embodiments of this application.

[0020] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0022] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0023] The main solution of this application embodiment is: to obtain the global machining trajectory and decompose the global machining trajectory into the motion component of the motion platform and the scanning component of the galvanometer, to determine the target displacement of the motion platform based on the motion component, and to determine the target deflection angle of the galvanometer based on the scanning component through the kinematic model, and to send the target displacement and the target deflection angle to the motion platform and the galvanometer respectively, so as to drive the motion platform and the galvanometer to move relative to each other based on the global machining trajectory.

[0024] In the laser processing of large-format workpieces, during the segmented static processing, each processing block is processed separately and then spliced ​​together. The relative positional relationship between adjacent blocks depends entirely on the repeatability accuracy of the motion platform. Each repositioning during the movement of the workpiece from one block to the next introduces a positioning error. As the number of processing blocks increases, these positioning errors accumulate. This accumulation causes misalignment of the processing trajectories of adjacent blocks at the splicing boundary, resulting in deterioration in processing quality at the boundary and a significant decrease in the overall processing accuracy of the large-format workpiece.

[0025] This application acquires the global machining trajectory and decomposes it into motion components of the motion platform and scanning components of the galvanometer. This allows the entire machining path of a large-format workpiece to be uniformly incorporated into a continuous trajectory planning range. The target displacement of the motion platform is determined based on the motion components, and the target deflection angle of the galvanometer is determined based on the scanning components through a kinematic model. This enables the macroscopic feed and microscopic scan to be respectively calculated into mutually matched control commands. The target displacement and target deflection angle are then sent to the motion platform and the galvanometer, driving them to move relative to each other based on the global machining trajectory. This allows the laser focus to move continuously along the entire global trajectory. Since the machining process is completed continuously by the motion platform and the galvanometer in collaboration, the repetitive positioning links between adjacent blocks are eliminated, and the splicing errors accumulated due to repetitive positioning also disappear. The entire machining path is always continuously generated based on a unified global trajectory, thereby ensuring the machining accuracy of large-format workpieces across the entire area.

[0026] To better understand the above technical solutions, exemplary embodiments of this application will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of this application and to fully convey the scope of this application to those skilled in the art.

[0027] It should be noted that the executing entity in this embodiment can be a laser processing device, or a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, or mobile phone, or an electronic device capable of the above functions, a laser processing control device based on a motion platform, etc. This embodiment does not specifically limit it. The following uses a laser processing device as an example to describe this embodiment and the following embodiments.

[0028] Based on this, embodiments of this application provide a laser processing control method based on a motion platform, referring to... Figure 1 , Figure 1 This is a flowchart illustrating the first embodiment of the laser processing control method based on a motion platform according to this application.

[0029] In this embodiment, the laser processing control method based on a motion platform includes steps S10 to S30: Step S10: Obtain the global machining trajectory and decompose the global machining trajectory into the motion component of the motion platform and the scanning component of the galvanometer; In this embodiment, the laser processing equipment acquires the global processing trajectory and decomposes it into the motion component of the motion platform and the scanning component of the galvanometer. The global processing trajectory refers to the continuous path formed by connecting all target position points that the laser focus needs to sequentially traverse in a global coordinate system covering the entire large-format workpiece. It corresponds to global trajectory planning technology, which plans the complete processing path of the workpiece to be processed into a continuous coordinate sequence in a unified global coordinate system, thus ensuring that the entire path is geometrically continuous and without any discontinuities. The motion component refers to the portion of the motion separated from the global processing trajectory and suitable for being carried by the motion platform. The motion platform adopts a macroscopic feed method of two-axis translation driven by a high-precision linear motor, characterized by large stroke, good rigidity, and stable low-speed operation. Therefore, the motion component corresponds to the macroscopic motion in the trajectory that has a large stroke, slow change, and low frequency. The scanning component refers to the part of the motion that is separated from the global machining trajectory and is suitable for being carried by the galvanometer. The galvanometer uses a high-speed deflecting mirror to change the laser emission angle for micro-scanning, which has the characteristics of small inertia, fast response and high bandwidth. Therefore, the scanning component corresponds to the micro-motion in the trajectory that has a small stroke, drastic changes and high frequency.

[0030] It should be noted that the laser processing equipment decomposes the entire global processing trajectory into motion components carried by the motion platform and scanning components carried by the galvanometer. This allows the motion platform and galvanometer to each handle motion components that match their own dynamic characteristics, thus overcoming the limitations of a single galvanometer scanning area for large-format processing and avoiding splicing errors and seam quality degradation caused by segmented splicing. Based on a unified kinematic model, the laser processing equipment converts the motion components into the target displacement of the motion platform and the scanning components into the target deflection angle of the galvanometer. This ensures that the two actuators each receive control commands that match their own kinematic characteristics, thereby achieving analytical coordination between the macroscopic feed of the motion platform and the microscopic scanning of the galvanometer, ensuring that the laser focus can move continuously and accurately along the global processing trajectory.

[0031] Specifically, the laser processing equipment reads a pre-planned global processing trajectory from a data source storing large-format processing graphic data. This trajectory is presented as a continuous coordinate sequence in a global coordinate system. Reading the complete trajectory ensures that subsequent decomposition does not lose the overall geometric continuity of the trajectory due to block division. The laser processing equipment performs frequency domain analysis on the global processing trajectory, transforming the spatial coordinates of the trajectory with arc length to the frequency domain to obtain motion components of different frequencies in the trajectory. The principle of frequency domain analysis is that the low-frequency, large-stroke characteristics of the motion platform and the high-frequency, small-stroke characteristics of the galvanometer can be clearly distinguished in the frequency domain. The laser processing equipment segments the frequency domain analysis results according to a preset frequency threshold, identifying motion components with frequencies below the preset threshold as motion components and motion components with frequencies above the preset frequency threshold as scanning components. The principle of segmentation is that the frequency threshold corresponds to the boundary of the dynamic bandwidth of the motion platform and the galvanometer. The large-stroke, low-frequency motion below the threshold is carried by the motion platform, while the small-stroke, high-frequency motion above the threshold is carried by the galvanometer.

[0032] As an optional implementation, the laser processing equipment uses frequency domain filtering to separate motion components and scanning components. The equipment applies a low-pass filter to the global processing trajectory, removing high-frequency components and retaining low-frequency components, which are then identified as motion components. Subsequently, a high-pass filter is applied to the global processing trajectory, removing low-frequency components and retaining high-frequency components, which are then identified as scanning components. The global processing trajectory can be viewed as a superposition of low-frequency macroscopic contours and high-frequency microscopic details. These two types of components are complementary in the frequency domain, and their superposition can completely reconstruct the original trajectory. The laser processing equipment first determines a preset frequency threshold as the cutoff frequency of the filter and designs corresponding low-pass and high-pass filters. It then performs convolution operations on the trajectory coordinate sequence point by point to obtain two mutually orthogonal motion component sequences.

[0033] As an alternative implementation, the laser processing equipment employs a combination of spatial segmentation and double-buffer preloading to divide the motion and scanning components. The laser processing equipment divides the global processing trajectory into multiple continuous blocks according to the effective scanning range of the galvanometer, reserving overlapping areas between adjacent blocks. The processing data corresponding to the current block is then loaded into the first buffer, and while processing the current block, the processing data for the next block is preloaded into the second buffer. When the current block is completed, data reading switches from the first buffer to the second buffer. In this case, large-format processed graphics have a large data volume; segmenting according to the galvanometer scanning range matches the working range of the galvanometer, making the data volume of each block controllable. Double-buffer preloading ensures seamless data reading between adjacent blocks.

[0034] Step S20: Determine the target displacement of the motion platform based on the motion components, and determine the target deflection angle of the galvanometer based on the scanning components using the kinematic model; In this embodiment, the laser processing equipment determines the target displacement of the motion platform based on the motion components and determines the target deflection angle of the galvanometer based on the scanning components using a kinematic model. The target displacement refers to the position increment that the motion platform should reach within a control cycle. It corresponds to the motion platform trajectory interpolation technique, which discretizes the motion components according to the control cycle and calculates the feed increment of each axis of the motion platform cycle by cycle. The target deflection angle refers to the angle value that the dual-axis reflector of the galvanometer should deflect within a control cycle. It corresponds to the galvanometer angle calculation technique, which converts the scanning components into angle commands for the two deflection axes of the galvanometer. The kinematic model refers to the mathematical model characterizing the mapping relationship between the motion platform displacement, the galvanometer deflection angle, and the global position of the laser focus. It corresponds to the unified kinematic modeling technique for the motion platform and the galvanometer, which unifies the translation of the motion platform and the focus displacement caused by the galvanometer deflection into the global coordinate system through coordinate transformation.

[0035] Specifically, the laser processing equipment first calibrates the installation offset of the galvanometer relative to the motion platform and the focal length of the galvanometer. The installation offset represents the fixed position of the galvanometer scanning center in the coordinate system of the motion platform, and the focal length represents the proportional relationship between the galvanometer field lens and the focal displacement. The purpose of calibration is to provide accurate parameters for the kinematic model. Based on the calibrated installation offset and focal length, the laser processing equipment establishes a mapping relationship between the motion platform displacement, the galvanometer deflection angle, and the global position of the laser focal point. The global position of the laser focal point can be expressed as the vector sum of the motion platform displacement, the galvanometer installation offset, and the focal displacement caused by the galvanometer deflection. Based on the motion component, the laser processing equipment determines the feed amount of the motion component within the current control cycle as the target displacement of the motion platform. This motion component represents the macroscopic motion that should be borne by the motion platform. Based on the scanning component, the laser processing equipment inversely solves the target deflection angle of the galvanometer through the inverse operation of the kinematic model. The principle is that the scanning component represents the small-amplitude, high-frequency displacement of the focal point in the global coordinate system, and the kinematic model is needed to inversely calculate the focal displacement into the galvanometer deflection angle command.

[0036] As an optional implementation, the laser processing equipment determines the target deflection angle by calibrating the installation offset and focal length and establishing a kinematic model. The laser processing equipment calibrates the installation offset of the galvanometer relative to the motion platform. This installation offset is obtained by having the motion platform drive the galvanometer to align with multiple known marker points in the global coordinate system, recording the corresponding platform coordinates, and solving for the coordinates of the galvanometer scanning center. Subsequently, the laser processing equipment calibrates the focal length of the galvanometer. The focal length is obtained by having the galvanometer strike the focal point on a calibration plate at multiple known deflection angles and measuring the ratio of the focal displacement to the tangent of the deflection angle. After obtaining the installation offset and focal length, the laser processing equipment determines the focal displacement corresponding to the galvanometer deflection angle based on the galvanometer deflection angle and focal length. This focal displacement is equal to the product of the focal length and the tangent of the deflection angle. The focal displacement is then summed with the installation offset and the motion platform displacement to obtain the global position of the laser focal point. The correspondence between the global position of the laser focal point, the motion platform displacement, and the galvanometer deflection angle is defined as the kinematic model.

[0037] As an alternative implementation, the laser processing equipment determines the target displacement and target deflection angle by combining speed allocation optimization with adaptive interpolation cycle. The laser processing equipment acquires the global motion velocity corresponding to the global processing trajectory and constructs an optimization problem with the objective of minimizing the weighted sum of the motion platform velocity and acceleration. Constraints are set on the mirror velocity being equal to the difference between the global motion velocity and the motion platform velocity, and the motion platform velocity and mirror velocity not exceeding preset upper limits. Solving this optimization problem yields the motion platform velocity and mirror velocity. The laser processing equipment determines the target displacement and target deflection angle based on the motion platform velocity and mirror velocity. During the determination process, the radius of curvature of the global processing trajectory at the current interpolation point is acquired. The interpolation cycle is adjusted according to the ratio of the radius of curvature to a preset curvature threshold. The interpolation cycle is shortened at sharp bends with smaller radii of curvature and kept longer at straight sections with larger radii of curvature. Finally, the target displacement and target deflection angle are determined based on the adjusted interpolation cycle, the motion platform velocity, and the mirror velocity.

[0038] Step S30: Send the target displacement and target deflection angle to the motion platform and the galvanometer respectively, so as to drive the motion platform and the galvanometer to move relative to each other based on the global machining trajectory.

[0039] In this embodiment, the laser processing equipment sends the target displacement and target deflection angle to the motion platform and galvanometer, respectively, driving the motion platform and galvanometer to move relative to each other based on the global processing trajectory. Relative movement refers to the motion platform and galvanometer moving independently within the same control cycle. The motions of the two are superimposed in space to synthesize the continuous movement of the laser focus along the global processing trajectory. This corresponds to the platform-galvanometer coordinated motion technology, where the superposition of their motion vectors ensures that the laser focus always follows the global processing trajectory.

[0040] Specifically, the laser processing equipment sends the target displacement to the servo driver of the motion platform via a communication interface. The servo driver then drives the linear motor to perform feed, converting the numerical displacement command into the actual mechanical motion of the motion platform. The laser processing equipment also sends the target deflection angle to the galvanometer driver via the communication interface. The galvanometer driver then drives the reflector to deflect, converting the numerical angle command into the actual deflection of the galvanometer. Since the global position of the laser focus is equal to the sum of the motion platform displacement and the focus displacement caused by the galvanometer deflection, the motion platform and the galvanometer execute their respective commands synchronously within the same control cycle. The motion platform generates macroscopic displacement, and the galvanometer generates microscopic focus deflection. The superposition of these components causes the laser focus to move relatively along the global processing trajectory.

[0041] As an optional implementation, the laser processing equipment uses an open-loop direct command method to drive relative movement. In each control cycle, the laser processing equipment directly sends the target displacement to the motion platform servo driver and the target deflection angle to the galvanometer driver. The motion platform and galvanometer move according to the received commands. Where the positioning accuracy of the motion platform and galvanometer is high and external disturbances are minimal, open-loop commands are sufficient to ensure the focal point moves along the trajectory; direct command reduces signal processing steps and shortens the control cycle.

[0042] As an alternative implementation, the laser processing equipment employs a closed-loop feedback compensation method to drive relative movement. After transmitting the target displacement and target deflection angle, the laser processing equipment acquires the actual displacement of the motion platform and the actual deflection angle of the galvanometer. The actual displacement of the motion platform is measured by a grating ruler or laser interferometer, and the actual deflection angle of the galvanometer is measured by a galvanometer sensor. Subsequently, the laser processing equipment calculates the displacement deviation between the actual displacement and the target displacement, as well as the angular deviation between the actual deflection angle and the target deflection angle. Based on these displacement and angular deviations, a compensation amount is generated and transmitted to the motion platform and galvanometer for correction. It should be noted that the motion platform and galvanometer are subject to disturbances such as friction, inertia, and thermal deformation during execution. These disturbances can be eliminated by measuring the actual quantities and providing feedback compensation.

[0043] In this embodiment, the laser processing equipment sends the target displacement and target deflection angle to the motion platform and galvanometer respectively, so as to drive them to move relative to each other based on the global processing trajectory. The execution deviation is eliminated through closed-loop compensation, so that the laser focus moves continuously and accurately along the trajectory on the large-format workpiece. This enables one-time continuous processing under the coordinated action of the motion platform and galvanometer, eliminating block splicing errors and joint quality deterioration.

[0044] This embodiment of the application acquires the global machining trajectory and decomposes it into motion components of the motion platform and scanning components of the galvanometer. This allows the entire machining path of a large-format workpiece to be uniformly incorporated into a continuous trajectory planning range. The target displacement of the motion platform is determined based on the motion components, and the target deflection angle of the galvanometer is determined based on the scanning components through a kinematic model. This enables the macroscopic feed and microscopic scan to be respectively calculated into mutually matched control commands. The target displacement and target deflection angle are then sent to the motion platform and the galvanometer, driving them to move relative to each other based on the global machining trajectory. This allows the laser focus to move continuously along the entire global trajectory. Since the machining process is completed continuously by the motion platform and the galvanometer in collaboration, the repetitive positioning links between adjacent blocks are eliminated, and the splicing errors accumulated due to repetitive positioning also disappear. The entire machining path is always continuously generated based on a unified global trajectory, thereby ensuring the machining accuracy of the large-format workpiece within the entire area.

[0045] Based on the same inventive concept, this application also provides a second embodiment, referring to... Figure 2 , Figure 2 This is a flowchart illustrating the second embodiment of the laser processing control method based on a motion platform according to this application.

[0046] In this embodiment, the laser processing control method based on the motion platform further includes steps S11 to S13: Step S11: Calibrate the installation offset of the galvanometer relative to the motion platform; Step S12: Calibrate the focal length of the galvanometer; Step S13: Establish a kinematic model based on the installation offset and focal length.

[0047] In this embodiment, the laser processing equipment calibrates the installation offset of the galvanometer relative to the motion platform, calibrates the focal length of the galvanometer, and establishes a kinematic model based on the installation offset and focal length. This kinematic model characterizes the mapping relationship between the displacement of the motion platform and the galvanometer deflection angle to the global position of the laser focus. The installation offset refers to the fixed spatial position of the galvanometer scanning center in the motion platform coordinate system. It corresponds to the installation geometry of the galvanometer relative to the motion platform and characterizes the translation between the origin of the galvanometer coordinate system and the origin of the motion platform coordinate system. The focal length refers to the proportional constant that converts the galvanometer deflection angle into the laser focus displacement. It corresponds to the geometric relationship of galvanometer optical imaging and characterizes the focal displacement per unit deflection angle. The kinematic model is an analytical expression that uniformly maps the translational motion of the motion platform and the deflection motion of the galvanometer to the global position of the laser focus. It corresponds to the unified kinematic modeling technology for multiple actuators, which associates the motion quantities of two actuators under the same global coordinate reference through coordinate transformation.

[0048] Specifically, the laser processing equipment first calibrates the installation offset of the galvanometer relative to the motion platform. During calibration, the motion platform drives the galvanometer to sequentially align with multiple known marker points in the global coordinate system. The coordinates of the motion platform corresponding to each marker point are recorded, and the position of the galvanometer scanning center in the motion platform coordinate system is calculated based on the geometric relationship between the galvanometer scanning center and the marker points, thus obtaining the installation offset. Next, the laser processing equipment calibrates the focal length of the galvanometer. During calibration, the galvanometer strikes a laser focus on the calibration plane with multiple known deflection angles. The ratio between the displacement of each focus and the corresponding tangent of the deflection angle is measured, thus obtaining the focal length. After obtaining the installation offset and focal length, the laser processing equipment establishes a kinematic model. Based on the galvanometer deflection angle and focal length, the focal displacement corresponding to the galvanometer deflection angle is determined. The focal displacement is equal to the product of the focal length and the tangent of the deflection angle. The focal displacement is then summed with the installation offset and the motion platform displacement to obtain the global position of the laser focus. The correspondence between the global position of the laser focus and the motion platform displacement and galvanometer deflection angle is defined as the kinematic model. The purpose of calibrating the installation offset is to determine the fixed geometric position of the galvanometer relative to the motion platform. The purpose of calibrating the focal length is to determine the conversion coefficient between the deflection angle and the focal displacement. The purpose of vector summation is to unify the macroscopic translation, fixed installation offset and microscopic focal displacement under the same global coordinate reference to ensure the accuracy of the kinematic model.

[0049] This application provides accurate parameters and a clear analytical form for the conversion of motion platform displacement and galvanometer deflection angle to the global position of laser focus, ensuring the accuracy of subsequent calculation of target deflection angle based on scanning components, thereby improving the global positioning accuracy of laser focus on large-format workpieces.

[0050] Since the system described in Embodiment 2 of this application is a system used to implement the method of Embodiment 1 of this application, those skilled in the art can understand the specific structure and variations of the system based on the method described in Embodiment 1 of this application, and therefore will not be described again here. All systems used in the method of Embodiment 1 of this application fall within the scope of protection of this application.

[0051] Based on the same inventive concept, this application also provides a third embodiment, referring to... Figure 3 , Figure 3 This is a flowchart illustrating the third embodiment of the laser processing control method based on a motion platform according to this application.

[0052] In this embodiment, the laser processing control method based on the motion platform further includes steps S40~S60: Step S40: Obtain the actual displacement of the motion platform and the actual deflection angle of the galvanometer; Step S50: Calculate the displacement deviation between the actual displacement and the target displacement, and the deflection angle deviation between the actual deflection angle and the target deflection angle; Step S60: Generate compensation amount based on displacement deviation and angular deviation, and send the compensation amount to the motion platform and galvanometer for correction.

[0053] In this embodiment, the laser processing equipment acquires the actual displacement of the motion platform and the actual deflection angle of the galvanometer, calculates the displacement deviation between the actual displacement and the target displacement, and the angular deviation between the actual deflection angle and the target deflection angle, generates a compensation amount based on the displacement deviation and angular deviation, and sends the compensation amount to the motion platform and galvanometer for correction. The actual displacement refers to the actual feed amount of the motion platform within the control cycle, and the actual deflection angle refers to the actual deflection amount of the galvanometer within the control cycle; both are acquired in real time by a measuring device. The displacement deviation refers to the difference between the actual displacement and the target displacement, and the angular deviation refers to the difference between the actual deflection angle and the target deflection angle; both together characterize the degree of deviation between the actual movement and the commanded movement of the actuator. The compensation amount refers to the correction amount calculated based on the deviation and used to correct the movement of the actuator. It corresponds to closed-loop feedback control technology, which forms a control closed loop through measurement feedback to eliminate execution deviations.

[0054] Specifically, after the laser processing equipment sends out the target displacement and target deflection angle, it collects the actual displacement of the motion platform using a grating ruler or laser interferometer, and the actual deflection angle of the galvanometer using an angle sensor. The purpose of collecting these actual quantities is to obtain the true motion state of the actuator. Subsequently, the laser processing equipment subtracts the target displacement from the actual displacement to obtain the displacement deviation, and subtracts the target deflection angle from the actual deflection angle to obtain the deflection angle deviation. This difference operation quantifies the magnitude and direction of the execution deviation. The laser processing equipment generates compensation amounts based on the displacement and deflection angle deviations. The generation of these compensation amounts uses a feedback control law; the larger the deviation, the larger the compensation amount, and the compensation direction is opposite to the deviation direction. The compensation amount is then sent to the motion platform servo driver and the galvanometer driver. In the next control cycle, the compensation amount is superimposed on the commands for correction, gradually converging the actual motion of the motion platform and the galvanometer to the target motion. The closed-loop compensation eliminates execution deviations caused by disturbances such as friction, inertia, and thermal deformation, ensuring that the actual position of the laser focus always conforms to the global processing trajectory.

[0055] This embodiment, based on the aforementioned method of sending out target displacement and target deflection angle and driving relative movement, further defines the closed-loop correction method after sending out the data. By collecting actual displacement and actual deflection angle and calculating the deviation to generate compensation, a dual closed-loop compensation is formed for the motion platform and the galvanometer, thereby eliminating disturbance errors during execution, ensuring the global positioning accuracy of the laser focus in large-format continuous processing, and further suppressing the deterioration of processing quality at the splicing boundary.

[0056] Since the system described in Embodiment 3 of this application is a system used to implement the method of Embodiment 1 of this application, those skilled in the art can understand the specific structure and variations of the system based on the method described in Embodiment 1 of this application, and therefore will not be described again here. All systems used in the method of Embodiment 1 of this application fall within the scope of protection of this application.

[0057] This application provides a laser processing control device based on a motion platform. The device includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the laser processing control method based on the motion platform described in Embodiment 1 above.

[0058] The following is for reference. Figure 4 This document illustrates a structural schematic diagram of a motion-platform-based laser processing control device suitable for implementing embodiments of this application. The motion-platform-based laser processing control device in the embodiments of this application may include, but is not limited to, mobile terminals such as mobile phones, laptops, digital radio receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Description), PMPs (Portable Media Players), and in-vehicle terminals (e.g., in-vehicle navigation terminals), as well as fixed terminals such as digital TVs and desktop computers. Figure 4 The laser processing control device based on a motion platform shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0059] like Figure 4As shown, the motion platform-based laser processing control device may include a processing unit 1001 (e.g., a core processor, graphics processor, etc.), which can perform various appropriate actions and processes according to programs stored in read-only memory (ROM) 1002 or programs loaded from storage device 1003 into random access memory (RAM) 1004. The random access memory 1004 also stores various programs and data required for the operation of the motion platform-based laser processing control device. The processing unit 1001, ROM 1002, and RAM 1004 are interconnected via a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems can be connected to I / O interface 1006: input devices 1007 including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices 1008 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 1003 including, for example, magnetic tapes, hard disks, etc.; and communication devices 1009. Communication device 1009 allows the motion platform-based laser processing control equipment to exchange data wirelessly or via wired communication with other devices. Although the figure shows a motion platform-based laser processing control equipment with various systems, it should be understood that it is not required to implement or possess all the systems shown. More or fewer systems can be implemented alternatively.

[0060] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from read-only memory 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0061] The laser processing control equipment based on a motion platform provided in this application, employing the laser processing control method based on a motion platform as described in the above embodiments, can solve the technical problem that the accumulation of positioning errors in the laser processing of large-format workpieces causes misalignment of the processing trajectories of adjacent blocks at the splicing boundary, resulting in a significant decrease in the overall processing accuracy of large-format workpieces. Compared with the prior art, the beneficial effects of the laser processing control equipment based on a motion platform provided in this application are the same as those of the laser processing control method based on a motion platform provided in the above embodiments, and other technical features of this laser processing control equipment based on a motion platform are the same as those disclosed in the previous embodiment method, and will not be repeated here.

[0062] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0063] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0064] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to execute the laser processing control method based on a motion platform in the above embodiments.

[0065] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, radio frequency (RF), etc., or any suitable combination thereof.

[0066] The aforementioned computer-readable storage medium may be included in a motion-platform-based laser processing control device; or it may exist independently and not assembled into a motion-platform-based laser processing control device.

[0067] The aforementioned computer-readable storage medium carries one or more programs. When the aforementioned one or more programs are executed by the laser processing control device based on the motion platform, the laser processing control device based on the motion platform: acquires the global processing trajectory, decomposes the global processing trajectory into the motion component of the motion platform and the scanning component of the galvanometer, determines the target displacement of the motion platform based on the motion component, and determines the target deflection angle of the galvanometer based on the scanning component through a kinematic model, and sends the target displacement and the target deflection angle to the motion platform and the galvanometer respectively, so as to drive the motion platform and the galvanometer to move relative to each other based on the global processing trajectory.

[0068] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0069] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation that may be implemented in systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0070] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0071] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the aforementioned laser processing control method based on a motion platform. This solves the technical problem that the accumulation of positioning errors in laser processing of large-format workpieces causes misalignment of the processing trajectories of adjacent blocks at the splicing boundary, resulting in a significant decrease in the overall processing accuracy of large-format workpieces. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the laser processing control method based on a motion platform provided in the above embodiments, and will not be repeated here.

[0072] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A laser processing control method based on a motion platform, characterized in that, The method includes the following steps: The global machining trajectory is acquired and decomposed into the motion component of the motion platform and the scanning component of the galvanometer. The target displacement of the motion platform is determined based on the motion components, and the target deflection angle of the galvanometer is determined by the kinematic model based on the scanning components. The target displacement and the target deflection angle are respectively sent to the motion platform and the galvanometer to drive the motion platform and the galvanometer to move relative to each other based on the global machining trajectory.

2. The laser processing control method based on a motion platform as described in claim 1, characterized in that, The step of acquiring the global machining trajectory and decomposing the global machining trajectory into motion components of the motion platform and scanning components of the galvanometer includes: The global processing trajectory is decomposed by frequency to obtain motion components of different frequencies; Motion components with frequencies lower than a preset frequency threshold are defined as the motion components. Motion components with frequencies not lower than the preset frequency threshold are identified as the scanning components.

3. The laser processing control method based on a motion platform as described in claim 1, characterized in that, Before the steps of determining the target displacement of the motion platform based on the motion components and determining the target deflection angle of the galvanometer based on the scanning components using a kinematic model, the method further includes: Calibrate the installation offset of the galvanometer relative to the motion platform; Calibrate the focal length of the galvanometer; Based on the installation offset and the focal length, the kinematic model is established, which characterizes the mapping relationship between the displacement of the motion platform and the galvanometer deflection angle to the global position of the laser focus.

4. The laser processing control method based on a motion platform as described in claim 3, characterized in that, The step of establishing the kinematic model based on the installation offset and the focal length, wherein the kinematic model characterizes the mapping relationship between the displacement of the motion platform and the galvanometer deflection angle to the global position of the laser focus, includes: Based on the galvanometer deflection angle and the focal length, determine the focal displacement corresponding to the galvanometer deflection angle; The global position of the laser focus is obtained by summing the focal displacement, the installation offset, and the motion platform displacement. The kinematic model is defined by the correspondence between the global position of the laser focus, the displacement of the motion platform, and the deflection angle of the galvanometer.

5. The laser processing control method based on a motion platform as described in claim 1, characterized in that, The steps of determining the target displacement of the motion platform based on the motion components and determining the target deflection angle of the galvanometer based on the scanning components using a kinematic model include: Obtain the global motion velocity corresponding to the global processing trajectory; Construct an optimization problem with the objective of minimizing the weighted sum of squares of the velocity and acceleration of the motion platform; The optimization problem is solved with the constraints that the galvanometer speed is equal to the difference between the global motion speed and the motion platform speed, and that the motion platform speed and the galvanometer speed do not exceed preset upper limits, to obtain the motion platform speed and the galvanometer speed. The target displacement and the target deflection angle are determined based on the speed of the motion platform and the speed of the galvanometer.

6. The laser processing control method based on a motion platform as described in claim 5, characterized in that, The step of determining the target displacement and the target deflection angle based on the motion platform speed and the galvanometer speed includes: Obtain the radius of curvature of the global machining trajectory at the current interpolation point; The interpolation period is adjusted based on the ratio of the radius of curvature to the preset curvature threshold. The target displacement and the target deflection angle are determined based on the adjusted interpolation period, the speed of the motion platform, and the speed of the galvanometer.

7. The laser processing control method based on a motion platform as described in claim 1, characterized in that, After the step of sending the target displacement and the target deflection angle to the motion platform and the galvanometer respectively to drive the motion platform and the galvanometer to move relative to each other based on the global machining trajectory, the method further includes: Obtain the actual displacement of the motion platform and the actual deflection angle of the galvanometer; Calculate the displacement deviation between the actual displacement and the target displacement, and the angular deviation between the actual deflection angle and the target deflection angle; A compensation amount is generated based on the displacement deviation and the angular deviation, and the compensation amount is sent to the motion platform and the galvanometer for correction.

8. The laser processing control method based on a motion platform as described in claim 1, characterized in that, The step of acquiring the global machining trajectory and decomposing the global machining trajectory into motion components of the motion platform and scanning components of the galvanometer includes: The global machining trajectory is divided into multiple blocks according to the scanning range of the galvanometer, and an overlapping area is reserved between adjacent blocks; Load the processing data of the current block into the first buffer, and preload the processing data of the next block into the second buffer while processing the current block; When the current block is completed, the data reading is switched from the first buffer to the second buffer.

9. A laser processing control device based on a motion platform, characterized in that, The device includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the laser processing control method based on a motion platform as described in any one of claims 1 to 8.

10. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, it implements the steps of the laser processing control method based on a motion platform as described in any one of claims 1 to 8.

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