Lighting device, laser processing apparatus, and laser processing apparatus monitoring method

CN122913701APending Publication Date: 2026-10-16DELTA ELECTRONICS (JIANGSU) LTD
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Patent Information

Application Number
CN202510405540.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-01
Publication Date
2026-10-16

AI Technical Summary

Technical Problem

激光焊接对于材料品质、激光热输入、焊接位置、环境气流等因素都相当敏感,并且有严格的边界限制,因此,品质控制问题已成为阻碍激光焊接技术实现更广泛应用的关键技术障碍

Benefits of technology

[0016]On the one hand, the light-collecting device disclosed herein is provided with a second light inlet, which can collect and guide the second light emitted from an external light source toward the welding platform. At this time, the light-collecting device can collect the light, and by monitoring and analyzing the light, the welding platform can be monitored before welding begins.

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Abstract

The disclosure provides a light collecting device, a laser processing device and a laser processing device monitoring method. The light collecting device comprises a first light inlet, a second light inlet, a first light outlet and a second light outlet. The first light inlet is used to collect first light from a welding platform. The second light inlet is used to collect second light from an external light source. The first light outlet is used to collect third light. The second light outlet is used to collect fourth light. The light collecting device is used to divide the first light into the third light and the fourth light, and guide the second light to the first light inlet to be emitted. The second light is emitted to the welding platform along the first light inlet. The first light comprises at least part of the second light reflected by the welding platform.
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Description

Technical Field

[0001] This disclosure relates to the field of laser processing equipment technology, and in particular to a light-collecting device, laser processing equipment, and a method for monitoring laser processing equipment. Background Technology

[0002] With continuous technological innovation, laser welding is being applied in more fields, such as, but not limited to, copper wire welding in automotive motor stators. Laser welding is highly sensitive to factors such as material quality, laser heat input, welding position, and ambient airflow, and has strict boundary limitations. Therefore, quality control has become a key technical obstacle hindering the wider application of laser welding technology.

[0003] To ensure the quality of laser welding, current mainstream quality assurance solutions include those using image sensors (such as infrared cameras, high-speed cameras, and X-ray imaging devices). However, the initial cost of these image sensors is high, often exceeding their value in quality monitoring. Another solution is noise monitoring, which, while relatively inexpensive, is susceptible to signal interference from the factory environment, affecting the sensitivity and accuracy of monitoring. Therefore, a new laser welding quality monitoring device and method are urgently needed. Summary of the Invention

[0004] A primary objective of this disclosure is to overcome at least one of the deficiencies of the prior art described above and to provide a light-collecting device.

[0005] To achieve the above objectives, the present disclosure adopts the following technical solution:

[0006] According to one aspect of this disclosure, a light-collecting device is provided, comprising: a first light inlet for collecting a first light beam from a welding platform; a second light inlet for collecting a second light beam from an external light source; a first light-collecting port for collecting a third light beam; and a second light-collecting port for collecting a fourth light beam. The light-collecting device is used to split the first light beam into the third light beam and the fourth light beam, and to guide the second light beam to the first light inlet for emission, wherein the second light beam is emitted along the first light inlet toward the welding platform; wherein the first light beam includes at least a portion of the second light beam reflected back from the welding platform.

[0007] Another primary objective of this disclosure is to overcome at least one of the deficiencies of the prior art described above and to provide a laser processing device.

[0008] To achieve the above objectives, the present disclosure adopts the following technical solution:

[0009] According to another aspect of this disclosure, a laser processing apparatus is provided, comprising: a welding platform for performing welding work; a laser processing head for emitting laser light toward the welding platform; a light-collecting device for collecting a first light reflected from the welding platform and dividing the first light into a third light and a fourth light; an external light source for emitting a second light toward the welding platform; wherein the first light includes at least a portion of the second light reflected back from the welding platform; and a monitoring device for monitoring welding quality based on the third light and the fourth light.

[0010] Another major objective of this disclosure is to overcome at least one of the deficiencies of the prior art and to provide a method for monitoring laser processing equipment.

[0011] To achieve the above objectives, the present disclosure adopts the following technical solution:

[0012] According to another aspect of this disclosure, a method for monitoring laser processing equipment is provided, comprising: providing the laser processing equipment disclosed herein; before the laser is emitted, turning on the external light source so that the second light beam is directed toward the welding platform; collecting the third light beam and obtaining a first signal value; after the laser is emitted, collecting the third light beam and obtaining a second signal value, collecting the fourth light beam and obtaining a third signal value; obtaining a fourth signal value based on the difference between the first signal value and the second signal value; comparing the first signal value, the third signal value, and the fourth signal value with corresponding preset first standard value, second standard value, and third standard value to determine whether the welding quality meets the standards.

[0013] As can be seen from the above technical solutions, the advantages and positive effects of the light-collecting device, laser processing equipment, and laser processing equipment monitoring method proposed in this disclosure are as follows:

[0014] The light-collecting device disclosed herein includes a first light inlet, a second light inlet, a first light-collecting port, and a second light-collecting port; the first light inlet is used to collect a first light beam from a welding platform; the second light inlet is used to collect a second light beam from an external light source; the first light-collecting port is used to collect a third light beam; the second light-collecting port is used to collect a fourth light beam; the light-collecting device is used to split the first light beam into a third light beam and a fourth light beam, and guide the second light beam to the first light inlet for emission, the second light beam being emitted along the first light inlet towards the welding platform; wherein, the first light beam includes at least a portion of the second light beam reflected back from the welding platform.

[0015] Through the above design, this disclosure has the following beneficial effects:

[0016] On the one hand, the light-collecting device disclosed herein is provided with a second light inlet, which can collect and guide the second light emitted from an external light source toward the welding platform. At this time, the light-collecting device can collect the light, and by monitoring and analyzing the light, the welding platform can be monitored before welding begins.

[0017] On the other hand, two light-collecting ports can be used to collect and monitor signals corresponding to three different light sources, which simplifies the structure and reduces costs. Attached Figure Description

[0018] The various objectives, features, and advantages of this disclosure will become more apparent from the following detailed description of preferred embodiments of the disclosure taken in conjunction with the accompanying drawings. The drawings are merely illustrative illustrations of the disclosure and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar parts. Wherein:

[0019] Figure 1 This is a schematic diagram of the component arrangement of the lighting device;

[0020] Figure 2 This is a schematic diagram of the exterior of the lighting device;

[0021] Figure 3 This is a system schematic diagram of a laser processing equipment.

[0022] The annotations in the attached figures are explained as follows:

[0023] 1101. First optical inlet;

[0024] 1102. Second optical inlet;

[0025] 1103. First skylight;

[0026] 1104. Second skylight;

[0027] 111. First beam splitter module;

[0028] 112. First photoelectric conversion module;

[0029] 113. Second photoelectric conversion module;

[0030] 114. First filter module;

[0031] 115. Second filter module;

[0032] 116. Second beam splitter module;

[0033] 120. External light source;

[0034] 130. Optical path calibration module;

[0035] 140. Focusing Module;

[0036] 210. First ray;

[0037] 211. First sub-ray;

[0038] 212. Second sub-ray;

[0039] 220. Second ray;

[0040] 230. The third ray;

[0041] 240. The fourth ray;

[0042] 300. Telescopic sleeve;

[0043] 500. Laser system;

[0044] 510.Laser light outlet. Detailed Implementation

[0045] Typical embodiments embodying the features and advantages of this disclosure will be described in detail in the following description. It should be understood that this disclosure can have various variations in different embodiments without departing from the scope of this disclosure, and the descriptions and drawings therein are illustrative in nature and not intended to limit this disclosure.

[0046] In the following description of various exemplary embodiments of this disclosure, reference is made to the accompanying drawings, which form part of this disclosure, and which illustrate by way of example different exemplary structures, systems, and steps that can implement various aspects of this disclosure. It should be understood that other specific embodiments of the components, structures, exemplary devices, systems, and steps may be used, and structural and functional modifications may be made without departing from the scope of this disclosure. Furthermore, while the terms “above,” “between,” “within,” etc., may be used in this specification to describe different exemplary features and elements of this disclosure, these terms are used herein only for convenience, such as the orientation according to the examples described in the accompanying drawings. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of the structure to fall within the scope of this disclosure.

[0047] When monitoring the processing quality, i.e. the welding quality, of laser processing equipment, the collected light generally includes three types: welding platform reflected light, plasma plume emitted light, and molten metal pool emitted light. The three types of light correspond to different wavelength ranges. Among them, plasma plume refers to the phenomenon of atomic ionization of the material of the workpiece to be welded at the high temperature of welding. For the convenience of subsequent description, welding platform reflected light is called the first band light, plasma plume emitted light is called the second band light, and molten metal pool emitted light is called the third band light.

[0048] In the monitoring device of traditional laser processing equipment, the light of the above three wavelengths is mixed together. In order to monitor the three wavelengths, a light-collecting device is required to collect the light from the welding platform and decompose the light of the three different wavelengths through optical means. Then, the first wavelength light, the second wavelength light and the third wavelength light are sampled and monitored through three light-collecting ports respectively.

[0049] To reduce the number of components in the light-collecting device and simplify its structure, this disclosure proposes a new light-collecting device that can collect and monitor three types of light through two light-collecting ports. Figure 1 A schematic diagram of the component arrangement of the light-collecting device 110 is shown in the figure; Figure 2 The above-mentioned drawings represent a schematic diagram of the appearance of the light-collecting device 110. The types, arrangements, and functional relationships of the main components of the light-collecting device 110 disclosed herein will be described in detail below with reference to the accompanying drawings.

[0050] like Figures 1 to 2 As shown, in one embodiment of this disclosure, the light-collecting device 110 includes a first light inlet 1101, a second light inlet 1102, a first light-collecting port 1103, and a second light-collecting port 1104. The first light inlet 1101 is used to collect a first light ray 210 from a welding platform, the second light inlet 1102 is used to collect a second light ray 220 from an external light source, the first light-collecting port is used to collect a third light ray 230, and the second light-collecting port 1104 is used to collect a fourth light ray 240. Based on this, the light-collecting device 110 of this disclosure is used to split the first light ray 210 into a third light ray 230 and a fourth light ray 240, and guide the second light ray 220 to the first light inlet 1101 for emission. The second light ray 220 is emitted along the first light inlet 1101 towards the welding platform. The first light ray 210 includes at least a portion of the second light ray 220 reflected back from the welding platform.

[0051] Before welding begins, the first light ray 210 only includes the portion of the second light ray 220 reflected back by the welding platform. After passing through the light-collecting device 110, the third light ray 230 is collected. At this time, the third light ray 230 only includes the first band light. After welding begins, the first light ray 210 includes the first band light, the second band light, and the third band light. After passing through the light-collecting device 110, the third light ray 230 and the fourth light ray 240 are collected. The third light ray 230 includes the first band light and the second band light, and the fourth light ray 240 includes the third band light.

[0052] The above design can achieve the following beneficial effects:

[0053] On the one hand, traditional equipment cannot collect any light before welding begins because there is no light shining on the welding platform. On the other hand, the light-collecting device disclosed herein is provided with a second light inlet 1102, which can collect and guide the second light 220 emitted by an external light source 120 to the welding platform. At this time, the light-collecting device 110 can collect the third light 230, which only includes the first wavelength light. By monitoring and analyzing the first wavelength light, the flatness of the welding platform can be monitored before welding begins.

[0054] On the other hand, since the intensity of the first band light remains almost constant before and during welding, it can be regarded as a constant. Before welding begins, since the third light ray 230 collected by the first light-collecting port 1103 only includes the first band light, the first signal value corresponding to the first band light can be obtained by monitoring. After welding begins, the third light ray 230 collected by the first light-collecting port 1103 is the superposition of the first band light and the second band light. The corresponding second signal value can be obtained by monitoring. The second signal value can be obtained by subtracting the second signal value from the first signal value. Thus, the collection and monitoring of the first band light and the second band light can be achieved using a single light-collecting port.

[0055] like Figure 1 As shown, in one embodiment of this disclosure, a first light-collecting port 1103 is provided with a first photoelectric conversion module 112, and a second light-collecting port 1104 is provided with a second photoelectric conversion module 113. The first photoelectric conversion module 112 can convert light with wavelengths in the range of λ1 to λ2 into electrical signals, and the second photoelectric conversion module 113 can convert light with wavelengths in the range of λ3 to λ4 into electrical signals. The wavelength range of the third light ray 230 is λ1 to λ2, and the wavelength range of the fourth light ray 240 is λ3 to λ4. Therefore, the first photoelectric module 112 can convert the third light ray 230 into an electrical signal, and the second photoelectric module 113 can convert the fourth light ray 240 into an electrical signal. The upper limit of the wavelength range of the third light ray 230 is less than or equal to the lower limit of the wavelength range of the fourth light ray 240, i.e., λ2 ≤ λ3. The second light 220 emitted by the external light source 120 is guided by the light collection device 110 and directed toward the welding platform of the laser processing equipment. The wavelength of the second light 220 (e.g., λ5) is less than or equal to the upper limit of the wavelength range of the third light 230, i.e., λ5≤λ2.

[0056] In one embodiment of this disclosure, the wavelength of the first band light is typically 1080 nm, and the wavelength range of the second band light is typically 400 nm to 700 nm. Therefore, the wavelength range of the third light 230 that the first light-collecting port 1103 can collect is preset to 200 nm to 1200 nm, i.e., λ1 = 200 nm and λ2 = 1200 nm. In order to monitor the flatness of the welding platform before welding and improve the monitoring accuracy of the second band light by the first light-collecting port 1103 during welding, the wavelength of the second light 220 emitted by the external device 120 is adjusted to be close to the wavelength of the first band light. For example, the wavelength λ5 of the second light 220 can be 1080 nm.

[0057] In one embodiment of this disclosure, the wavelength of the third band light is typically 1200nm to 1700nm. Therefore, the wavelength range of the fourth light ray 240 that the second light-collecting port 1104 can collect is preset to 1200nm to 1700nm, i.e., λ3 = 1200nm and λ4 = 1700nm.

[0058] In conclusion, Figure 1 The three different line types of arrows represent different rays: solid line represents the first ray (21°), dotted line represents the second ray (22°), dashed line represents the third ray (23°), and double dotted line represents the fourth ray (24°).

[0059] like Figure 1 As shown, in one embodiment of this disclosure, the light-collecting device 110 may further include a first beam-splitting module 111, which is used to split the first light ray 210 into a first sub-ray 211 and a second sub-ray 212. The direction of the first sub-ray 211 is perpendicular to the direction of the second sub-ray 212. The first sub-ray 211 includes the aforementioned third light ray 230, and the second sub-ray 212 includes the aforementioned fourth light ray 240. For example, the first beam-splitting module 111 may include a beam splitter, which is arranged at a 45° angle relative to the optical path of the first light ray 210 so that the direction of the first sub-ray 211 is perpendicular to the direction of the second sub-ray 212. Through the above design, this disclosure makes the optical path arrangement in the light-collecting device 110 more reasonable, and reduces the difficulty of arranging related optical devices to achieve the above optical path form, thus reducing space occupation.

[0060] like Figure 1As shown, in one embodiment of this disclosure, the light-collecting device 110 further includes a first filter module 114, which is disposed between the first light-collecting port 1103 and the first beam-splitting module 111, for filtering the first sub-ray beam 211 to obtain the third ray beam 230. Through the above design, this disclosure can utilize the first filter module 114 to filter the first sub-ray beam 211, allowing only the third ray beam 230 with a wavelength range of 200nm to 1200nm to pass through, thereby improving the sampling accuracy of the first photoelectric conversion module 112.

[0061] In one embodiment of this disclosure, the first filter module 114 may include a plano-convex lens.

[0062] like Figure 1 As shown, in one embodiment of this disclosure, the light-collecting device 110 further includes a second filter module 115, which is disposed between the second light-collecting port 1104 and the first beam splitting module 111. The second filter module allows only the fourth light ray 240 with a wavelength range of 1200nm to 1700nm to pass through, thereby improving the accuracy of the second photoelectric conversion module 113.

[0063] In one embodiment of this disclosure, the second filter module 115 may include a plano-convex lens.

[0064] like Figure 1 As shown, in one embodiment of this disclosure, the direction in which the second light ray 220 enters the light-collecting device 110 is perpendicular to the direction of the fourth light ray 240. Through the above design, the second light inlet 1102 can be designed on the side of the light-collecting device 110, thereby making full use of the space in the height direction of the light-collecting device 110.

[0065] In one embodiment of this disclosure, the light-collecting device 110 further includes a second beam-splitting module 116, which is disposed between the first beam-splitting module 111 and the second light-collecting port 1104, and is used to adjust the optical path of the second light ray 220. The second light ray 220 is emitted from the second light inlet 1102 towards the second beam-splitting module 116. The second beam-splitting module 116 is used to direct the second light ray 220 towards the first beam-splitting module 111, thereby enabling the second light ray 220 to exit from the first light inlet 1101 in the opposite direction to the first light ray 210 and be guided to the welding platform. In some embodiments, the external light source 120 may also adopt other optical path arrangements without the need for the second beam-splitting module 116. For example, the light emission direction of the external light source 120, i.e., the direction of the second light ray 220, may also be parallel to the direction of the fourth light ray 240, in which case the second light ray 220 emitted from the external light source 120 can directly reach the first beam-splitting module 111.

[0066] like Figure 1 As shown, in one embodiment of this disclosure, the second beam splitter 116 is a dichroic mirror, such as a multi-band dichroic mirror. This dichroic mirror is arranged at a 45° angle relative to the direction in which the second ray 220 enters the second light inlet 1102, causing the direction of the second ray 220 to rotate 90 degrees and be directed towards the first beam splitter 111. This dichroic mirror can also filter the second sub-ray 212, such as... Figure 1 As shown, the dichroic mirror only allows the fourth ray 240 with a wavelength range of 1700nm to pass through. Thus, while adjusting the direction of the second ray 220, it can also filter the light, further improving the sampling accuracy of the second photoelectric conversion module 113.

[0067] like Figure 1 and Figure 2 As shown, in one embodiment of this disclosure, the light-collecting device 110 may further include an optical path calibration module 130, which is used to guide the first light ray 210 toward the first beam splitter 111. Through the above design, this disclosure can utilize the optical path calibration module 130 to achieve the optical path calibration function for the first light ray 210.

[0068] In one embodiment of this disclosure, the optical path calibration module 130 may include a coated mirror. For example, the mirror surface of the coated mirror may be arranged at a 45° angle.

[0069] like Figure 3 As shown, in one embodiment of this disclosure, the light-collecting device 110 may further include a focusing module 140. Figure 1 (Not shown in the image), the focusing module 140 is located between the optical path calibration module 130 and the first beam splitting module 111. Through the above design, this disclosure can realize the function of focusing light using the focusing module 140.

[0070] like Figures 1 to 2 As shown, in one embodiment of this disclosure, the light-collecting device 110 may further include a telescopic sleeve 300. One end of the telescopic sleeve 300 is connected to the light-collecting device 110 (e.g., connected to the first light inlet 1101), and the other end is connected to a laser processing device (e.g., connected to the laser output port 510 of the laser system 500). Additionally, a focusing lens, specifically an aspherical focusing lens, may be provided in the telescopic sleeve 300. Through the above design, this disclosure enables the telescopic sleeve 300 to achieve compatible installation of the light-collecting device 110 (specifically, the light-collecting device 110) with various laser processing equipment, thereby expanding the application scope of this disclosure.

[0071] It should be noted that the daylighting devices shown in the accompanying drawings and described in this specification are merely a few examples among many daylighting devices from which the principles of this disclosure can be employed. It should be clearly understood that the principles of this disclosure are by no means limited to any detail or component of the daylighting devices shown in the accompanying drawings or described in this specification.

[0072] Based on the above detailed description of several exemplary embodiments of the light-collecting device proposed in this disclosure, the following will be used in conjunction with... Figure 3 An exemplary embodiment of the laser processing equipment proposed in this disclosure will be described.

[0073] like Figure 3 As shown, in one embodiment of this disclosure, the laser processing equipment includes a welding platform, a laser processing head, a light-collecting device, an external light source, and a monitoring device. The welding platform is used to perform welding operations. The laser processing head is used to emit a laser beam onto the welding platform. The light-collecting device is used to collect a first light beam 210 reflected from the welding platform and divide the first light beam 210 into a third light beam 230 and a fourth light beam 240. The external light source is used to emit a second light beam 220 onto the welding platform. The first light beam 210 includes at least a portion of the second light beam 220 reflected back from the welding platform. The monitoring device is used to monitor the welding quality based on the third light beam 230 and the fourth light beam 240.

[0074] like Figure 3 As shown, in the laser processing equipment proposed in this disclosure, the external light source 120 can be located anywhere, as long as the second light 220 emitted by the external light source 120 can be directed to the welding platform, and the portion of the second light 220 reflected by the welding platform can be collected by the first light inlet 1101 of the light collection device 110.

[0075] To improve the integration of laser processing equipment, the second beam 220 can also be directed into the light-collecting device 110 and then guided by the light-collecting device 110 to the welding platform. For example, in one embodiment of this disclosure, the light-collecting device is the light-collecting device proposed in this disclosure and described in any of the above embodiments.

[0076] It should be noted that the laser processing apparatus shown in the accompanying drawings and described in this specification are merely a few examples among many laser processing apparatuses capable of employing the principles of this disclosure. It should be clearly understood that the principles of this disclosure are by no means limited to any detail or component of the laser processing apparatus shown in the accompanying drawings or described in this specification.

[0077] Based on the above detailed description of several exemplary embodiments of the laser processing equipment proposed in this disclosure, an exemplary embodiment of the laser processing equipment monitoring method proposed in this disclosure will be described below.

[0078] In one embodiment of this disclosure, the laser processing equipment monitoring method proposed in this disclosure includes:

[0079] Provide a laser processing device that has been disclosed and described in detail in the above embodiments;

[0080] Before the laser is emitted, the external light source is turned on so that the second beam 220 is directed toward the welding platform;

[0081] The third ray 230 is collected, and the first signal value is obtained;

[0082] After the laser is emitted, the third ray 230 is collected and the second signal value is obtained; the fourth ray 240 is collected and the third signal value is obtained.

[0083] A fourth signal value is obtained based on the difference between the first signal value and the second signal value;

[0084] The first, third, and fourth signal values ​​are compared one by one with the corresponding preset first, second, and third standard values ​​to determine whether the welding quality meets the standards.

[0085] In one embodiment of this disclosure, the first signal value corresponds to the data of the first band light obtained by sampling, the second signal value corresponds to the data of the superposition of the first band light and the second band light obtained by sampling during the welding process, the third signal value corresponds to the data of the fourth band light obtained by sampling, and the fourth signal value corresponds to the data of the second band light obtained after data processing.

[0086] Using the above method, it is possible to obtain signal values ​​corresponding to three different wavelengths of light with only two light-collecting ports, thereby enabling the monitoring of laser processing equipment.

[0087] The first standard value, the second standard value, and the third standard value refer to the data corresponding to the first band optical signal, the second band optical signal, and the third band optical signal obtained by the sampling device when the welding quality meets the standard. Therefore, by comparing the real-time acquired first signal, second signal, and third signal with the corresponding first standard value, second standard value, and third standard value, it can be determined whether the welding quality meets the standard.

[0088] It should be noted that the laser processing equipment monitoring methods shown in the accompanying drawings and described in this specification are merely a few examples of many monitoring methods that can employ the principles of this disclosure. It should be clearly understood that the principles of this disclosure are by no means limited to any detail or step of the laser processing equipment monitoring methods shown in the accompanying drawings or described in this specification.

[0089] The foregoing has described and / or illustrated exemplary embodiments of the light-collecting device, laser processing equipment, and laser processing equipment monitoring method disclosed herein. However, the embodiments of this disclosure are not limited to the specific embodiments described herein; rather, components and / or steps of each embodiment may be used independently and separately from other components and / or steps described herein. Each component and / or step of one embodiment may also be used in combination with other components and / or steps of other embodiments. In describing the elements / components / etc. described and / or illustrated herein, the terms “a,” “an,” and “the above” are used to indicate the presence of one or more elements / components / etc. The terms “comprising,” “including,” and “having” are used to indicate an open-ended inclusion and mean that additional elements / components / etc. may exist in addition to those listed. Furthermore, the terms “first” and “second” in the claims and specification are used only as illustrative marks and are not intended to limit the numerical scope of the subject matter.

[0090] Although the light-collecting device, laser processing equipment, and laser processing equipment monitoring method disclosed herein have been described with respect to different specific embodiments, those skilled in the art will recognize that modifications may be made to the implementation of this disclosure within the spirit and scope of the claims.

Claims

1. A light-collecting device, characterized in that, include: The first light inlet is used to collect the first light beam from a welding platform; The second light inlet is used to collect a second light beam from an external light source; The first light-collecting opening is used to collect the third light beam; as well as The second light-collecting port is used to collect the fourth light beam; The light-collecting device is used to divide the first light beam into the third light beam and the fourth light beam, and guide the second light beam to the first light inlet for emission, the second light beam being emitted along the first light inlet towards the welding platform; wherein, the first light beam includes at least a portion of the second light beam reflected back by the welding platform.

2. The light-collecting device according to claim 1, characterized in that, The first light-collecting port is equipped with a first photoelectric conversion module, and the second light-collecting port is equipped with a second photoelectric conversion module; wherein, the upper limit of the wavelength range of the third light is less than or equal to the lower limit of the wavelength range of the fourth light; and the wavelength of the second light is less than or equal to the upper limit of the wavelength range of the third light.

3. The light-collecting device according to claim 2, characterized in that: The wavelength range of the third ray is 200nm to 1200nm; and / or The wavelength range of the fourth ray is 1200nm to 1700nm.

4. The light-collecting device according to claim 1, characterized in that, Also includes: A first beam splitting module is used to split the first light ray into a first sub-ray and a second sub-ray. The direction of the first sub-ray is perpendicular to the direction of the second sub-ray. The first sub-ray includes the third light ray, and the second sub-ray includes the fourth light ray.

5. The light-collecting device according to claim 4, characterized in that, Also includes: A first light-filtering module is disposed between the first light-collecting port and the first light-splitting module, and is used to filter the first sub-ray beam and obtain the third ray beam.

6. The light-collecting device according to claim 5, characterized in that, The first filter module includes a plano-convex lens.

7. The light-collecting device according to claim 4, characterized in that, Also includes: The second filter module is located between the second light-collecting port and the first beam-splitting module, and is used to filter the second sub-ray beam to obtain the fourth ray beam.

8. The light-collecting device according to claim 7, characterized in that, The second filter module includes a plano-convex lens.

9. The light-collecting device according to any one of claims 4 to 8, characterized in that, The direction in which the second ray enters the light-collecting device is perpendicular to the direction of the second sub-ray.

10. The light-collecting device according to claim 9, characterized in that, Also includes: The second beam splitting module is located between the first beam splitting module and the second light-collecting port; The second light beam is directed from the second light inlet to the second beam splitter, and the second beam splitter is used to direct the second light beam to the first beam splitter.

11. The light-collecting device according to any one of claims 2 to 8, characterized in that, The light-collecting device also includes an optical path calibration module, which is used to guide the first light beam toward the first beam-splitting module.

12. The light-collecting device according to claim 11, characterized in that, The optical path calibration module includes a coated reflector.

13. The light-collecting device according to claim 11, characterized in that, The light-collecting device also includes a focusing module, which is located between the optical path calibration module and the first beam-splitting module.

14. The light-collecting device according to any one of claims 2 to 8, characterized in that, Also includes: The telescopic sleeve has one end connected to the first light inlet and the other end connected to a laser processing device.

15. A laser processing device, characterized in that, include: A welding platform used to perform welding work; A laser processing head is used to emit a laser beam onto the welding platform; A light-collecting device is used to collect the first light reflected from the welding platform and divide the first light into a third light and a fourth light; An external light source is used to emit a second beam of light onto the welding platform; Wherein, the first light ray includes at least a portion of the second light ray reflected back by the welding platform; A monitoring device for monitoring welding quality based on the third and fourth light rays.

16. The laser processing equipment according to claim 15, characterized in that, The light-collecting device is the light-collecting device according to any one of claims 1 to 14.

17. A method for monitoring laser processing equipment, characterized in that, include: Provide a laser processing apparatus as described in claim 15; Before the laser beam is emitted, the external light source is turned on so that the second beam is directed toward the welding platform; The third ray is collected, and a first signal value is obtained; After the laser beam is emitted, the third beam is collected to obtain a second signal value, and the fourth beam is collected to obtain a third signal value. A fourth signal value is obtained based on the difference between the first signal value and the second signal value; The first signal value, the third signal value, and the fourth signal value are compared one by one with the corresponding preset first standard value, second standard value, and third standard value to determine whether the welding quality meets the standard.