Semiconductor refrigeration piece laser wire welding positioning device

Abstract

The application discloses a semiconductor refrigeration piece laser wire welding positioning device, and aims to provide a semiconductor refrigeration piece laser wire welding positioning device which can effectively position and fix a semiconductor refrigeration piece and a wire, thereby solving the problem that the semiconductor refrigeration piece and the wire are prone to displacement in a welding process, and the welding quality of the wire and the semiconductor refrigeration piece is affected. It comprises a base, a refrigeration piece positioning groove arranged on the base, a locking bolt threadedly connected on the base and located above a groove opening of the refrigeration piece positioning groove, and a wire positioning mechanism comprising a wire positioning through groove arranged on the base and located on one side of the refrigeration piece positioning groove, one end of the wire positioning through groove being communicated with the refrigeration piece positioning groove, and a wire pressing piece for pressing the wire in the wire positioning through groove.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cooling chip manufacturing technology, and specifically to a laser wire bonding positioning device for semiconductor cooling chips. Background Technology

[0002] A semiconductor cooling chip is a type of ceramic chip consisting of two square copper-clad ceramic (DBC) sheets, with hundreds of semiconductor chips arrayed in the middle. The space between the two ceramic sheets is typically less than 2 mm. During wire bonding, the wire end is inserted into this narrow space and then welded to the electrical connection point of the semiconductor cooling chip using a laser. For example, Chinese Patent Publication No. CN209282236U, entitled "48V Semiconductor Cooling Chip," includes an upper insulating heat-conducting plate and a lower insulating heat-conducting plate; a PN couple with positive and negative leads, fixedly positioned between the upper and lower insulating heat-conducting plates; and the PN couple includes P-type and N-type semiconductor elements.

[0003] Current thermoelectric coolers have flexible wires and a small space between the upper and lower ceramic plates. Manual placement and soldering of the wires cannot guarantee the accuracy and consistency of the wire position. Furthermore, the thermoelectric cooler and the wires are prone to displacement during the soldering process, affecting the soldering quality. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor cooling chip laser wire bonding positioning device that can effectively position and fix the semiconductor cooling chip and the wire, thereby solving the problem that the semiconductor cooling chip and the wire are prone to displacement during the welding process, which affects the welding quality of the wire and the semiconductor cooling chip.

[0005] The technical solution of this invention is: A positioning device for laser wire bonding of semiconductor cooling chips, comprising: Base; A positioning groove for the cooling chip is provided on the base; The locking bolt is threaded onto the base and is located above the slot of the cooling chip positioning groove. The conductor positioning mechanism includes: A wire positioning groove is provided on the base and located on one side of the cooling chip positioning groove, with one end of the wire positioning groove connected to the cooling chip positioning groove; The wire clamping component presses the wire firmly into the wire positioning slot. The specific use of a semiconductor cooling chip laser wire bonding positioning device according to this solution is as follows. Position the thermoelectric cooler in the thermoelectric cooler positioning groove; then tighten the locking bolts to press the thermoelectric cooler into place and lock it in the thermoelectric cooler positioning groove. Position the wire in the wire positioning slot, with the soldered end of the wire extending into the designated position between the upper and lower ceramic plates of the semiconductor refrigeration chip; then press the wire firmly into the wire positioning slot using the wire clamping component. Next, laser welding is used to weld the welding end of the wire to the electrical connection part of the thermoelectric cooler. This solution provides a thermoelectric cooler laser wire bonding positioning device that can effectively position and fix the thermoelectric cooler and the wire, thereby solving the problem that the thermoelectric cooler and the wire are prone to displacement during the welding process, affecting the welding quality.

[0006] Preferably, the wire positioning mechanism further includes a first elastic element. The wire pressing element is rotatably mounted on the base. The first elastic element drives the wire pressing element to rotate upwards, thereby pressing the wire firmly into the wire positioning slot. Thus, after the wire is positioned in the wire positioning slot, the first elastic element can automatically drive the wire pressing element to rotate upwards, thereby pressing the wire firmly into the wire positioning slot. This method is convenient to operate and can reliably and stably press the wire into the wire positioning slot.

[0007] Preferably, the wire positioning mechanism further includes a clamping mechanism, wherein the wire clamping member is rotatably mounted on the base and can rotate to above the opening of the wire positioning through groove; The clamping mechanism corresponds to the wire clamping component and includes: Rotate the knob to rotate the base; The clamping cam is fixed on the rotating knob; When the wire clamping component rotates to the top of the wire positioning slot, the rotating knob drives the clamping cam to rotate, causing the clamping cam to press against the top of the clamping ramp. Thus, after the wire is positioned in the wire positioning slot, the wire clamping component is manually rotated upwards to the top of the slot; then, the rotating knob drives the clamping cam to rotate, causing the clamping cam to press against the top of the clamping ramp, pressing the wire clamping component downwards, thereby clamping the wire firmly within the wire positioning slot.

[0008] Preferably, the device also includes a supporting base plate and a second elastic element. One side of the cooling chip positioning groove is open. The supporting base plate is rotatably mounted on the bottom of the cooling chip positioning groove, and its rotation axis is located at the opening on one side of the groove. The second elastic element drives the supporting base plate to rotate upwards, blocking one end of the wire positioning channel. When the supporting base plate abuts against the bottom surface of the cooling chip positioning groove, it releases the blockage on one end of the wire positioning channel. In practical applications of the semiconductor cooling chip laser wire bonding positioning device, when the semiconductor cooling chip is positioned in the cooling chip positioning groove, the operator needs to tighten the locking bolt to lock the semiconductor cooling chip in the groove. However, during operation, due to unfamiliarity with the procedure or carelessness, the operator may forget to tighten the locking bolt after the semiconductor cooling chip is positioned in the groove, failing to lock the semiconductor cooling chip in place. This can cause displacement of the semiconductor cooling chip during subsequent operations, affecting the welding quality between the wire and the semiconductor cooling chip. To address this issue, this solution incorporates a support base plate and a second elastic element. Specifically, after the thermoelectric cooler is placed into the cooler positioning slot, it rests on the support base plate. At this point, the second elastic element drives the support base plate to rotate upwards, blocking one end of the wire positioning slot. Next, the operator manually tightens the locking bolts, pressing the thermoelectric cooler downwards and causing the support base plate to rotate omnidirectionally until it rests against the bottom surface of the cooler positioning slot, thus locking the thermoelectric cooler within the slot. At this point, the support base plate releases its obstruction of one end of the wire positioning slot (i.e., the support base plate is positioned below one end of the wire positioning slot). Afterwards, once the wire is positioned within the wire positioning slot, the welding end of the wire can extend into a designated position between the upper and lower ceramic plates of the thermoelectric cooler without affecting the welding of the wire's welding end to the electrical connection point of the thermoelectric cooler. If, after the thermoelectric cooler is positioned in the cooling chip positioning slot, the operator forgets to tighten the locking bolt, the second elastic element drives the support base plate to rotate upwards, causing one side of the support base plate to block one end of the wire positioning slot. Subsequently, after the wire is positioned in the wire positioning slot, the welding end of the wire will be unable to extend between the upper and lower ceramic plates of the thermoelectric cooler. This forces the operator to follow the standard procedure and tighten the locking bolt. The tightening bolt presses the thermoelectric cooler downwards and causes the support base plate to rotate omnidirectionally until it rests against the bottom surface of the cooling chip positioning slot, thus locking the thermoelectric cooler in place. In this way, without affecting the operator's ability to follow the standard procedure, it effectively solves the problem of the thermoelectric cooler shifting during subsequent operations due to the operator forgetting to tighten the locking bolt, thus affecting the welding quality between the wire and the thermoelectric cooler.

[0009] Preferably, the base is also provided with a limiting part. When the second elastic element drives the support base plate to rotate upward and abut against the limiting part, one side of the support base plate blocks one end of the wire positioning groove.

[0010] Preferably, the wire clamping component also includes an insulating plate. When the thermoelectric cooler is positioned in the cooler positioning groove, the wire is positioned in the wire positioning slot, and the wire clamping component presses the wire tightly within the wire positioning slot, a portion of the insulating plate extends between the two ceramic plates of the thermoelectric cooler, blocking the insulating sheath of the wire extending between the two ceramic plates. Since the laser may ablate the rubber sheath of the wire during laser wire bonding, this solution provides an insulating plate on the wire clamping component. When the thermoelectric cooler is positioned in the cooler positioning groove, the wire is positioned in the wire positioning slot, and the wire clamping component presses the wire tightly within the wire positioning slot, a portion of the insulating plate extends between the two ceramic plates of the thermoelectric cooler, blocking the insulating sheath of the wire extending between the two ceramic plates. Thus, during laser wire bonding, the insulating sheath of the wire is blocked by the insulating plate, effectively preventing laser ablation of the rubber sheath.

[0011] Preferably, the side of the cooling chip positioning groove is provided with a welding port for laser to pass through.

[0012] Preferably, there are two wire positioning slots, and the two wire positioning slots are parallel, with each wire clamp corresponding to a different wire positioning slot. A semiconductor cooling chip typically includes two wires; the semiconductor cooling chip laser wire bonding positioning device of this solution can position two wires at once, thereby improving welding efficiency.

[0013] Preferably, the base is fixedly installed with the opening of the cooling chip positioning groove facing upwards, and the opening of the wire positioning through groove also facing upwards. This solution is applicable to implementations where both sides of the base have laser welding heads. After the semiconductor cooling chip and the wire are positioned in the semiconductor cooling chip laser wire bonding positioning device, lasers are emitted from the laser welding heads on both sides of the base to simultaneously weld the two wires of the semiconductor cooling chip, further improving welding efficiency.

[0014] Preferably, the system also includes a frame and a motor. The base is rotatably mounted on the frame via a rotating shaft, and the motor drives the base to rotate. The wire positioning slots are parallel to the rotating shaft, and two wire positioning slots are symmetrically distributed on both sides of the rotating shaft. This solution is applicable to implementations where only one side of the base has a laser welding head. After the thermoelectric cooler and the wire are positioned in the thermoelectric cooler laser wire bonding positioning device, the laser welding head emits a laser to weld a wire of the thermoelectric cooler on one side of the thermoelectric cooler laser wire bonding positioning device. Then, the motor drives the base to rotate 180 degrees, thereby causing the thermoelectric cooler laser wire bonding positioning device and the thermoelectric cooler and the wire on it to rotate 180 degrees. Then, the laser welding head emits a laser to weld a wire of the thermoelectric cooler on the other side of the thermoelectric cooler laser wire bonding positioning device.

[0015] The beneficial effects of this invention are: Firstly, the refrigeration chip is positioned in the refrigeration chip positioning groove and locked in place by locking bolts; the wire is positioned in the wire positioning groove and pressed in place by the wire clamping component; thus, the refrigeration chip and the wire are effectively positioned and fixed, and then laser welding is performed, thereby solving the problem that the refrigeration chip and the wire are prone to displacement during the welding process, which affects the welding quality of the wire and the refrigeration chip.

[0016] Secondly, during laser wire bonding, the isolation sheet can be used to shield the wires, effectively preventing the laser from ablating the sheath rubber.

[0017] Third, the semiconductor cooling chip laser wire bonding positioning device can position two wires at once, thereby improving welding efficiency. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural schematic diagram of a semiconductor cooling chip laser wire bonding positioning device according to the present invention.

[0019] Figure 2 yes Figure 1 A magnified view of a portion of point A in the middle.

[0020] Figure 3 This is a partial structural schematic diagram of a semiconductor cooling chip laser wire bonding positioning device in a certain state according to a specific embodiment five of the present invention.

[0021] Figure 4 This is a partial structural schematic diagram of another state of a semiconductor cooling chip laser wire bonding positioning device according to a specific embodiment five of the present invention.

[0022] In the picture: Base 1; Cooling chip positioning groove 2, welding port 2.1; Locking bolt 3; Wire positioning slot 4; Wire clamping component 5, clamping bevel 5.1; Clamping mechanism 6, rotating knob 6.1, clamping cam 6.2; Semiconductor cooling chip 7; Wire 8; Isolation plate 9; Support base plate 10. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Specific Implementation Example 1, such as Figure 1 , Figure 2 As shown, a semiconductor cooling chip laser wire bonding positioning device includes a base 1, a cooling chip positioning groove 2, a locking bolt 3, and a wire positioning mechanism.

[0024] The cooling chip positioning groove 2 is provided on the base 1. The locking bolt 3 is used to lock the semiconductor cooling chip 7 into the cooling chip positioning groove 2. The locking bolt 3 is threaded to the base 1 and is located above the groove opening of the cooling chip positioning groove 2.

[0025] The wire positioning mechanism includes a wire positioning slot 4 and a wire clamping member 5. The wire positioning slot 4 is located on the base 1 and is situated on one side of the cooling chip positioning slot 2. One end of the wire positioning slot 4 is connected to the cooling chip positioning slot 2. The wire clamping member 5 is used to press the wire tightly within the wire positioning slot 4.

[0026] The specific use of the semiconductor cooling chip laser wire bonding positioning device in this embodiment is as follows. Position the thermoelectric cooler 7 in the thermoelectric cooler positioning groove 2; then tighten the locking bolt 3 to press the thermoelectric cooler 7 into the thermoelectric cooler positioning groove 2.

[0027] The wire 8 is positioned in the wire positioning groove 4, and the soldering end of the wire 8 extends into the designated position between the upper and lower ceramic plates of the semiconductor cooling chip 7; then the wire is pressed into the wire positioning groove 4 by the wire clamping member 5.

[0028] Next, laser welding is used to weld the welding end of the wire 8 to the electrical connection part of the thermoelectric cooler 7. This embodiment of a thermoelectric cooler laser wire bonding positioning device can effectively position and fix the thermoelectric cooler 7 and the wire, thereby solving the problem that the thermoelectric cooler 7 and the wire are prone to displacement during the welding process, affecting the welding quality of the wire and the thermoelectric cooler 7.

[0029] Next, loosen the locking bolt 3, loosen the wire clamp 5, and remove the semiconductor cooling chip 7 and wire 8 that are welded together.

[0030] Specific embodiment two, such as Figure 1 , Figure 2 As shown, a semiconductor cooling chip laser wire bonding positioning device includes a base 1, a cooling chip positioning groove 2, a locking bolt 3, and a wire positioning mechanism.

[0031] A cooling chip positioning groove 2 is provided on the base 1. A locking bolt 3 is used to lock the semiconductor cooling chip 7 into the cooling chip positioning groove 2. In this embodiment, the openings of the cooling chip positioning groove 2 are upward-facing. A welding port 2.1 for laser transmission is provided on the side of the cooling chip positioning groove 2. The locking bolt 3 is threadedly connected to the base 1 and is located above the opening of the cooling chip positioning groove 2.

[0032] The wire positioning mechanism includes a wire positioning slot 4 and a wire clamping member 5. The wire positioning slot 4 is disposed on the base 1 and is located on one side of the cooling chip positioning slot 2. One end of the wire positioning slot 4 is connected to the cooling chip positioning slot 2. In this embodiment, the slot openings of the wire positioning slot 4 are distributed upwards.

[0033] The wire clamping element 5 is used to press the wire 8 into the wire positioning slot 4. Specifically, In one embodiment of this invention, the wire positioning mechanism further includes a first elastic element. The wire clamping element 5 is rotatably mounted on the base 1. The first elastic element drives the wire clamping element 5 to rotate upwards, pressing the wire firmly within the wire positioning slot 4. The first elastic element is a torsion spring, a spring sheet, or a tension spring. Thus, after the wire is positioned within the wire positioning slot 4, the first elastic element automatically drives the wire clamping element 5 to rotate upwards, thereby pressing the wire firmly within the wire positioning slot 4. This operation is convenient and reliably presses the wire firmly within the wire positioning slot 4. After the semiconductor cooling chip 7 is soldered to the wire, the wire clamping element 5 can be manually opened to remove the wire.

[0034] In the second implementation of this embodiment, such as Figure 1 , Figure 2As shown, the wire positioning mechanism also includes a clamping mechanism 6. The wire clamping member 5 is rotatably mounted on the base 1, and can rotate to above the opening of the wire positioning through groove 4. A clamping inclined surface 5.1 is provided on one side of the wire clamping member 5. The clamping mechanism 6 corresponds one-to-one with the wire clamping member 5. The clamping mechanism 6 includes a rotating knob 6.1 and a clamping cam 6.2. The rotating knob 6.1 is rotatably mounted on the base 1. The clamping cam 6.2 is fixed to the rotating knob 6.1. The rotating knob 6.1 can drive the clamping cam 6.2 to rotate to above the opening of the wire positioning through groove 4. When the wire clamping member 5 rotates to above the opening of the wire positioning through groove 4, the side of the clamping inclined surface 5.1 of the wire clamping member 5 near the clamping cam 6.2 tilts downwards, and the rotating knob 6.1 can drive the clamping cam 6.2 to rotate, so that the clamping cam 6.2 presses against the upper part of the clamping inclined surface 5.1. Thus, after the wire is positioned within the wire positioning slot 4, the wire clamping member 5 is manually rotated upwards until it is above the opening of the wire positioning slot 4. Next, the knob 6.1 is rotated to drive the clamping cam 6.2 to rotate, causing the clamping cam 6.2 to press against the clamping inclined surface 5.1, pressing the wire clamping member 5 downwards, thereby clamping the wire within the wire positioning slot 4. Once the semiconductor cooling chip 7 is soldered to the wire, the knob 6.1 is rotated to drive the clamping cam 6.2 to rotate, separating the clamping cam 6.2 from the wire clamping member 5. The wire clamping member 5 can then be manually pried open to remove the wire.

[0035] The specific use of the semiconductor cooling chip laser wire bonding positioning device in this embodiment is as follows. Position the thermoelectric cooler 7 in the thermoelectric cooler positioning groove 2; then tighten the locking bolt 3 to press the thermoelectric cooler 7 into the thermoelectric cooler positioning groove 2.

[0036] The wire 8 is positioned in the wire positioning groove 4, and the soldering end of the wire 8 extends into the designated position between the upper and lower ceramic plates of the semiconductor cooling chip 7; then the wire 8 is pressed into the wire positioning groove 4 by the wire clamping member 5.

[0037] Next, laser welding is performed, with the laser passing through welding port 2.1 to weld the welding end of the wire 8 to the electrical connection part of the thermoelectric cooler 7. This embodiment of a thermoelectric cooler laser wire bonding positioning device can effectively position and fix the thermoelectric cooler 7 and the wire, thereby solving the problem that the thermoelectric cooler 7 and the wire are prone to displacement during the welding process, affecting the welding quality of the wire and the thermoelectric cooler 7.

[0038] Next, loosen the locking bolt 3, loosen the wire clamp 5, and remove the semiconductor cooling chip 7 and wire 8 that are welded together.

[0039] Furthermore, such as Figure 1As shown, the wire clamping component 5 is also provided with an insulating plate 9. When the thermoelectric cooler 7 is positioned in the thermoelectric cooler positioning groove 2, the wire is positioned in the wire positioning through groove 4, and the wire clamping component 5 presses the wire tightly in the wire positioning through groove 4, a portion of the insulating plate 9 extends between the two ceramic plates of the thermoelectric cooler 7 and blocks the insulating sheath of the wire extending between the two ceramic plates of the thermoelectric cooler 7. Since the laser may ablate the rubber sheath of the wire during laser wire bonding, this solution provides an insulating plate 9 on the wire clamping component 5. When the thermoelectric cooler 7 is positioned in the thermoelectric cooler positioning groove 2, the wire is positioned in the wire positioning through groove 4, and the wire clamping component 5 presses the wire tightly in the wire positioning through groove 4, a portion of the insulating plate 9 extends between the two ceramic plates of the thermoelectric cooler 7 and blocks the insulating sheath of the wire extending between the two ceramic plates of the thermoelectric cooler 7. In this way, during laser wire bonding, the insulating sheath of the wire is blocked by the insulating plate 9, which can effectively prevent the laser from ablating the rubber sheath.

[0040] In this specific embodiment, the remaining structure is the same as in specific embodiment one or specific embodiment two, except that... In this embodiment, as Figure 1 As shown, there are two wire positioning slots 4, and the two wire positioning slots 4 are parallel. The wire clamping component 5 corresponds one-to-one with the wire positioning slot 4. The semiconductor cooling chip 7 generally includes two wires 8. The semiconductor cooling chip laser wire bonding positioning device of this embodiment can position two wires 8 at one time, thereby improving the welding efficiency.

[0041] In this embodiment, the base 1 is fixedly installed. The opening of the cooling chip positioning groove 2 faces upward. The opening of the wire positioning through groove 4 faces upward. Welding ports 2.1 for laser transmission are provided on both opposite sides of the cooling chip positioning groove 2.

[0042] The semiconductor cooling chip laser wire bonding positioning device of this embodiment is applicable to implementations where both sides of the base 1 have laser welding heads. Specifically, after the semiconductor cooling chip 7 and the wires are positioned in the semiconductor cooling chip laser wire bonding positioning device, lasers are emitted from the laser welding heads on both sides of the base 1 to simultaneously weld the two wires of the semiconductor cooling chip 7, thereby further improving welding efficiency.

[0043] In this specific embodiment four, the remaining structure is the same as in specific embodiment one or specific embodiment two, except that... In this embodiment, as Figure 1 As shown, there are two wire positioning slots 4, and the two wire positioning slots 4 are parallel. The wire clamping component 5 corresponds one-to-one with the wire positioning slot 4. The semiconductor cooling chip 7 generally includes two wires 8. The semiconductor cooling chip laser wire bonding positioning device of this embodiment can position two wires 8 at one time, thereby improving the welding efficiency.

[0044] In this embodiment, a semiconductor cooling chip laser wire bonding positioning device further includes a frame and a motor. A base 1 is rotatably mounted on the frame via a rotating shaft, and the motor drives the base 1 to rotate. Wire positioning channels are parallel to the rotating shaft, and two wire positioning channel slots 4 are symmetrically distributed on both sides of the rotating shaft. Welding openings 2.1 for laser transmission are provided on opposite sides of the cooling chip positioning slot 2.

[0045] This embodiment of a semiconductor cooling chip laser wire bonding positioning device is applicable to implementations where only one side of the base 1 has a laser welding head. Specifically, after the semiconductor cooling chip 7 and the wire are positioned in the semiconductor cooling chip laser wire bonding positioning device, the laser welding head emits a laser to weld one wire of the semiconductor cooling chip 7 on one side of the semiconductor cooling chip laser wire bonding positioning device; then, the motor drives the base 1 to rotate 180 degrees, thereby causing the semiconductor cooling chip laser wire bonding positioning device and the semiconductor cooling chip 7 and the wire thereon to rotate 180 degrees, and then, the laser welding head emits a laser to weld one wire of the semiconductor cooling chip 7 on the other side of the semiconductor cooling chip laser wire bonding positioning device.

[0046] In one embodiment of this invention, the rotation axis of the base 1 is horizontally distributed. In this embodiment, the laser emitted by the laser welding head can be emitted horizontally or vertically from top to bottom. The following description uses the example of the laser welding head emitting a vertical laser from top to bottom. After the thermoelectric cooler 7 and the wire are positioned in the thermoelectric cooler laser wire bonding positioning device, the motor drives the base 1 to rotate, so that the welding part of the thermoelectric cooler 7 and one wire in the thermoelectric cooler laser wire bonding positioning device faces upward. Then, the laser welding head emits a laser from top to bottom to weld the thermoelectric cooler 7 and one wire. Next, the motor drives the base 1 to rotate 180 degrees, thereby causing the thermoelectric cooler laser wire bonding positioning device and the thermoelectric cooler 7 and the wire on it to rotate 180 degrees, so that the welding part of the thermoelectric cooler 7 and another wire in the thermoelectric cooler laser wire bonding positioning device faces upward. Then, the laser welding head emits a laser from top to bottom to weld the thermoelectric cooler 7 and another wire.

[0047] In another embodiment of this invention, the rotating shaft of the base 1 is vertically distributed. In this embodiment, the opening of the cooling chip positioning groove 2 faces upward. The opening of the wire positioning through groove 4 also faces upward. Welding ports 2.1 for laser passage are provided on both opposite sides of the cooling chip positioning groove 2. In this embodiment, the laser emitted by the laser welding head is horizontally emitted.

[0048] In this specific embodiment five, the remaining structure is the same as in specific embodiment one, two, three, or four, except that... like Figure 3 , Figure 4 As shown, a semiconductor cooling chip laser bonding wire positioning device further includes a support base plate 10 and a second elastic member. One side of the cooling chip positioning groove 2 is open. Figure 3 For example, the left side of the cooling chip positioning groove 2 is open, and one end of the wire positioning through groove 4 is connected to the right side wall of the cooling chip positioning groove 2.

[0049] The support base plate 10 is located inside the cooling chip positioning groove 2. The support base plate 10 is rotatably mounted on the bottom of the cooling chip positioning groove 2, and the rotation axis of the support base plate 10 is located at one side opening of the cooling chip positioning groove 2.

[0050] like Figure 3 As shown, the second elastic element drives the support base plate 10 to rotate upward and blocks one end of the wire positioning slot 4.

[0051] like Figure 4 As shown, when the support base plate 10 abuts against the bottom surface of the cooling chip positioning groove 2, the support base plate 10 releases its obstruction of one end of the wire positioning groove 4.

[0052] In this embodiment, the base 1 is also provided with a limiting part. The limiting part is used to limit the upward rotation angle of the support base plate 10. When the second elastic member drives the support base plate 10 to rotate upward and abut against the limiting part, one side of the support base plate 10 blocks one end of the wire positioning groove 4.

[0053] In the practical application of the semiconductor cooling chip laser wire bonding positioning device, when the semiconductor cooling chip 7 is positioned in the cooling chip positioning groove 2, the operator needs to tighten the locking bolt 3 to lock the semiconductor cooling chip 7 in the cooling chip positioning groove 2. However, during the operation, due to unfamiliarity with the operation procedure or carelessness, the operator may forget to tighten the locking bolt 3 after the semiconductor cooling chip 7 is positioned in the cooling chip positioning groove 2, thus failing to lock the semiconductor cooling chip 7 in the cooling chip positioning groove 2. This causes the semiconductor cooling chip 7 to shift during subsequent operations, affecting the welding quality between the wire and the semiconductor cooling chip 7. To solve this problem, this embodiment provides a supporting base plate 10 and a second elastic element. The specific use of a semiconductor cooling chip laser wire bonding positioning device in this embodiment is as follows. First, the thermoelectric cooler 7 is positioned in the thermoelectric cooler positioning groove 2. After the thermoelectric cooler 7 is placed in the thermoelectric cooler positioning groove 2, the thermoelectric cooler 7 is supported on the support base plate 10. At this time, the second elastic element drives the support base plate 10 to rotate upward and blocks one end of the wire positioning through groove 4.

[0054] Second, the operator manually tightens the locking bolt 3, pressing the semiconductor cooling chip 7 downwards with the locking bolt 3, and causing the support base plate 10 to rotate in all directions until the support base plate 10 abuts against the bottom surface of the cooling chip positioning groove 2, thereby locking the semiconductor cooling chip 7 into the cooling chip positioning groove 2; at this time, the support base plate 10 releases its obstruction of one end of the wire positioning through groove 4 (that is, the support base plate 10 is located below one end of the wire positioning through groove 4).

[0055] Third, the wire 8 is positioned in the wire positioning groove 4, and the soldering end of the wire 8 extends into the designated position between the upper and lower ceramic plates of the semiconductor cooling chip 7; then the wire 8 is pressed into the wire positioning groove 4 by the wire clamping member 5.

[0056] Fourth, the welding end of the wire 8 is welded to the electrical connection part of the semiconductor cooling chip 7 by laser welding.

[0057] In this embodiment of a semiconductor cooling chip laser wire bonding positioning device, if the operator forgets to tighten the locking bolt 3 during the second step, the second elastic element drives the support base plate 10 to rotate upward, causing one side of the support base plate 10 to block one end of the wire positioning groove 4. Then, during the third step, after the wire is positioned in the wire positioning groove 4, because the second elastic element drove the support base plate 10 to rotate upward and blocked one end of the wire positioning groove 4 in the first step, the welding end of the wire will not be able to extend between the upper and lower ceramic plates of the semiconductor cooling chip 7. Thus, the third step of "extending the welding end of the wire into the designated position between the upper and lower ceramic plates of the semiconductor cooling chip 7" cannot be completed, forcing the operator to follow the standard procedure, complete the second step, tighten the locking bolt 3, press the semiconductor cooling chip 7 downward with the locking bolt 3, and drive the support base plate 10 to rotate omnidirectionally until the support base plate 10 abuts against the bottom surface of the cooling chip positioning groove 2, thereby locking the semiconductor cooling chip 7 into the cooling chip positioning groove 2. Therefore, the semiconductor cooling chip laser wire bonding positioning device of this embodiment can effectively solve the problem that the semiconductor cooling chip 7 is displaced during subsequent operations and affects the welding quality between the wire and the semiconductor cooling chip 7, without affecting the operator's operation according to the standard procedure. This is because the operator forgets to tighten the locking bolt 3 and fails to lock the semiconductor cooling chip 7 into the cooling chip positioning groove 2.

[0058] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications, alterations, and equivalent transformations made to the above embodiments based on the technical essence of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A positioning device for laser wire bonding of a semiconductor refrigeration chip, characterized in that, include: Base; A positioning groove for the cooling chip is provided on the base; The locking bolt is threaded onto the base and is located above the slot of the cooling chip positioning groove. The conductor positioning mechanism includes: A wire positioning groove is provided on the base and located on one side of the cooling chip positioning groove, with one end of the wire positioning groove connected to the cooling chip positioning groove; The wire clamping component presses the wire tightly into the wire positioning groove.

2. The semiconductor cooling chip laser wire bonding positioning device according to claim 1, characterized in that, The wire positioning mechanism also includes a first elastic element. The wire pressing element is rotatably mounted on the base. The first elastic element drives the wire pressing element to rotate upward so as to press the wire tightly in the wire positioning through groove.

3. The semiconductor cooling chip laser wire bonding positioning device according to claim 1, characterized in that, The wire positioning mechanism also includes a clamping mechanism. The wire clamping member is rotatably mounted on the base and can rotate to the top of the slot of the wire positioning through groove. A clamping inclined surface is provided on one side of the wire clamping member. The clamping mechanism corresponds to the wire clamping component and includes: Rotate the knob to rotate the base; The clamping cam is fixed on the rotating knob; When the wire clamping component rotates to the top of the slot of the wire positioning groove, the rotating knob drives the clamping cam to rotate, so that the clamping cam presses against the top of the clamping slope.

4. A semiconductor cooling chip laser wire bonding positioning device according to claim 1, 2, or 3, characterized in that, It also includes a supporting base plate and a second elastic element. One side of the cooling chip positioning groove is open. The supporting base plate is rotatably disposed at the bottom of the cooling chip positioning groove, and the rotation axis of the supporting base plate is located at the opening on one side of the cooling chip positioning groove. The second elastic element drives the supporting base plate to rotate upward and blocks one end of the wire positioning through groove. When the supporting base plate abuts against the bottom surface of the cooling chip positioning groove, the supporting base plate releases the blockage of one end of the wire positioning through groove.

5. The semiconductor cooling chip laser wire bonding positioning device according to claim 4, characterized in that, The base is also provided with a limiting part. When the second elastic element drives the support base plate to rotate upward and abut against the limiting part, one side of the support base plate blocks one end of the wire positioning groove.

6. A semiconductor cooling chip laser wire bonding positioning device according to claim 1, 2, or 3, characterized in that, The wire clamping component is also provided with an insulating plate. When the thermoelectric cooler is positioned in the cooler positioning groove, the wire is positioned in the wire positioning through groove, and the wire clamping component presses the wire tightly in the wire positioning through groove, a part of the insulating plate extends between the two ceramic plates of the thermoelectric cooler and blocks the insulating sheath of the wire extending between the two ceramic plates of the thermoelectric cooler.

7. A semiconductor cooling chip laser wire bonding positioning device according to claim 1, 2, or 3, characterized in that, The side of the positioning groove for the cooling chip is provided with a welding port for laser to pass through.

8. A semiconductor cooling chip laser wire bonding positioning device according to claim 1, 2, or 3, characterized in that, There are two wire positioning slots, and the two wire positioning slots are parallel. The wire pressing component corresponds to the wire positioning slot one by one.

9. The semiconductor cooling chip laser wire bonding positioning device according to claim 8, characterized in that, The base is fixedly installed, with the opening of the cooling chip positioning groove facing upwards and the opening of the wire positioning through groove facing upwards.

10. A semiconductor cooling chip laser wire bonding positioning device according to claim 8, characterized in that, It also includes a frame and a motor. The base is rotatably mounted on the frame via a rotating shaft. The motor drives the base to rotate. The wire positioning channel is parallel to the rotating shaft, and two wire positioning channel slots are symmetrically distributed on both sides of the rotating shaft.

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