Non-contact chip bonding apparatus and method

Abstract

The application discloses a kind of non-contact chip welding equipment and matching welding method, equipment includes rack, transfer mechanism and welding mechanism.Transfer mechanism is equipped with rotary table, rotary table carries chip and places chip on carrier, ensure that metal conductive sheet is placed above plastic matrix.Welding mechanism is equipped with vertically slidable lifting frame, lifting frame is configured with upper die table, upper die table is installed heat insulation press plate, and the top surface of press plate is attached to the body of coil assembly.Coil assembly includes assembly frame, connector and built-in controller of rack, and controller outputs alternating current to body through connector.Coil generates alternating magnetic field to make metal conductive sheet eddy current heat, and molten fusion welding rib realizes fusion welding and fixation of both.The application adopts electromagnetic induction precise temperature control, avoids carbonization of plastic overflow material, and synchronous pressing and heating is carried out.The whole machine structure is compact, processing efficiency is high, the heating and pressing conditions of each chip are unified, batch welding consistency is greatly improved, defective products are reduced, and cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, and in particular to a non-contact chip welding device and method. Background Technology

[0002] The main body of power chips, sensor chips and other products is composed of a metal conductive sheet and a plastic substrate. The plastic substrate has raised welding ribs integrally formed. The two are reliably bonded together by melting and wetting the surface of the metal sheet through the welding ribs. Existing conventional processing methods are difficult to simultaneously ensure the welding uniformity and the overall quality of the finished product. There is a lack of efficient and stable welding solutions adapted to this chip structure.

[0003] Currently, the mainstream assembly and bonding processes are mostly insert injection molding, adhesive bonding, ordinary thermoforming, and standard ultrasonic welding. Each process has its own unavoidable quality shortcomings. Insert injection molding can only embed metal sheets during the plastic part molding stage, which cannot be adapted to the secondary assembly of the plastic part and metal sheet after molding. The injection pressure can easily squeeze and deform the weld ribs and generate internal air bubbles, resulting in poor interface bonding stability. Adhesive bonding relies on adhesive layers to achieve adhesion, and is prone to delamination and cracking under high and low temperature alternation and humid environments. Excess adhesive can also contaminate chip circuits and cause electrical failures. The coating and curing process is also lengthy. Production cycle time is not conducive to mass production; hot pressing process relies on hard punch to apply pressure and heat up the whole, and mechanical extrusion can easily cause the weld ribs to break and stress cracks to be generated in the plastic parts. Moreover, the overall high temperature can be easily conducted to the internal wafer and bonding wire of the chip, causing thermal damage to the components; conventional ultrasonic welding relies on high-frequency friction to generate heat to melt the plastic. The degree of heating of each weld rib is significantly different. Some weld ribs are not melted enough, forming a poor weld gap. Moisture can easily penetrate into the package and cause delamination and peeling. The weld melting state of the same batch of products is uneven due to the placement and alignment and the dimensional tolerance of the plastic parts, and the welding strength is highly variable. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the problem that the welding process of chip products in the prior art cannot achieve synchronous and uniform melting of the weld beads, and to provide a non-contact chip welding equipment and method.

[0005] To address the aforementioned technical problems, this invention provides a non-contact chip welding device, comprising: a frame; a transfer mechanism connected to the frame, the transfer mechanism including a turntable rotatable about its central axis, a carrier on the turntable, a chip to be welded being placed on the carrier, and a metal conductive sheet positioned above a plastic substrate; and a welding mechanism including a lifting frame, a heat-insulating pressure plate, and a coil assembly, the lifting frame being located above the transfer mechanism and slidably connected to the frame in a vertical direction, the lifting frame having an upper mold platform on its side facing the transfer mechanism, and the coil assembly including an assembly frame, a body, and... The system includes a connector and a controller. The controller is located inside the frame. The assembly frame is connected to the lifting frame. The connector is fixed to the assembly frame and connected to the controller. The main body is connected to the power supply terminal of the connector. The heat insulation plate is connected to the upper mold platform. Its top is in contact with the main body, and its bottom has a pressing working surface corresponding to the chip welding area. The controller provides alternating current to the main body through the connector, causing the main body to generate an alternating magnetic field that acts on the lower metal conductive sheet. Based on eddy current heating, the welding ribs of the plastic substrate are melted, so that the metal conductive sheet is fused and fixed to the plastic substrate.

[0006] In one embodiment of the present invention, the top surface of the heat insulation plate is provided with a contoured fitting groove, and the body is fitted into the contoured fitting groove.

[0007] In one embodiment of the present invention, the welding mechanism includes a lifting driver, a lifting transmission screw, a transmission belt, multiple transmission wheels, and multiple fixed frames. The lifting driver is mounted on the frame. The middle part of the lifting transmission screw is connected to the power output end of the lifting driver. The multiple transmission wheels are divided into two groups. The transmission wheels in any group are arranged vertically and are respectively connected to the frame through the fixed frames. The two ends of the lifting transmission screw are respectively connected to the transmission wheels in the two groups. The transmission belt is sleeved on the transmission wheels in the same group. The lifting frame is connected to the transmission belt through belt clamps to move vertically.

[0008] In one embodiment of the present invention, the frame is provided with a lifting rail and two travel pins. The lifting rail extends in a vertical direction, and the two travel pins are respectively disposed at both ends of the lifting rail. The side wall of the lifting frame is provided with a slider that can be slidably connected to the lifting rail.

[0009] In one embodiment of the present invention, the turntable is provided with a partition to divide the area above the turntable into a loading station and a welding station. The carrier includes a mounting base plate, a platform handle, and guide posts. The mounting base plate is detachably connected to the loading station and / or the welding station. The handle, the guide posts, and the platform are all disposed on the mounting base plate. The chip to be welded is disposed on the platform. The guide posts extend vertically. The lifting frame also includes a changing template and guide pins. The changing template is detachably connected to the bottom surface of the lifting frame. The upper mold platform is connected to the changing template. The guide pins are disposed on the edge of the changing template. The guide posts can pass through the guide pins. The frame also includes a protective plate located between the loading station and the welding station. The protective plate is provided with an avoidance opening to allow the turntable to rotate.

[0010] In one embodiment of the present invention, the transfer mechanism further includes a rotary driver and at least two positioning components. The rotary driver is connected to the frame, and the turntable is connected to the power output end of the rotary driver. The positioning components include a positioning driver, a pusher, and a limit pin. The positioning driver is connected to the edge of the turntable, and the carrier is disposed between the positioning drivers. The pusher is connected to the power output end of the positioning driver and faces the carrier. The limit pin is connected to the pusher and can pass through a positioning groove on the edge of the carrier.

[0011] In one embodiment of the present invention, the non-contact chip welding equipment further includes a control mechanism, and the transfer mechanism and the welding mechanism are respectively connected to the control mechanism.

[0012] This invention also provides a non-contact chip welding method, which performs chip welding processing using the aforementioned non-contact chip welding equipment, comprising: step S1, placing the chip to be welded in a carrier, with the metal conductive sheet positioned above the plastic substrate, and then connecting the carrier to a turntable; step S2, moving the chip to be welded to below the heat-insulating pressure plate via the turntable; step S3, driving the lifting frame to press down until the heat-insulating pressure plate presses onto the metal conductive sheet of the chip to be welded; step S4, activating the controller, which provides alternating current to the body through a connector, the body generating an alternating magnetic field that acts on the lower metal conductive sheet, and melting the welding ribs of the plastic substrate based on eddy current heating, until the metal conductive sheet and the plastic substrate are fused and fixed.

[0013] In one embodiment of the present invention, the heat-insulating pressure plate substrate is one of polyetheretherketone, epoxy glass, polyimide, and high-temperature resistant resin.

[0014] In one embodiment of the present invention, the controller outputs a high-frequency alternating current, the operating frequency range of the alternating current is 20kHz to 60kHz, the output operating current range is 0.5A to 10A, the rated output power is 1kW to 5kW, and the single chip welding time is 0.5s to 3s.

[0015] The technical solution of the present invention has the following advantages compared with the prior art:

[0016] The non-contact chip welding equipment and method described in this invention, by setting up a rotatable indexing turntable and using a special carrier to stably place the chip to be welded, can realize multi-station continuous flow operation, which greatly improves the efficiency of chip batch welding processing.

[0017] The lifting frame drives the heat insulation plate to press down synchronously, uniformly pressing and limiting the metal conductive sheet, so that the metal conductive sheet and the fusion rib of the plastic substrate are tightly attached throughout, effectively eliminating the gap and avoiding defects such as incomplete welding and delamination after welding. The coil body is embedded and assembled above the heat insulation plate. The heat insulation plate is made of high temperature resistant insulating resin, which can not only isolate the high temperature generated by welding from being transmitted upward, preventing the upper structure such as the lifting frame and the upper mold table from being deformed and aged by heat, but also has no magnetic and conductive properties, so it will not generate additional eddy currents that interfere with the magnetic field distribution under the action of the coil's alternating magnetic field, ensuring that the magnetic field acts uniformly on the surface of the metal conductive sheet.

[0018] The controller stably supplies alternating current to the coil body via the connector, and the welding of the fusion rib is completed by the eddy current heat generated by the metal sheet itself. There is no need to apply high temperature stamping to the entire chip, which can significantly reduce the risk of thermal stress damage to the internal wafer and bonding circuit of the chip.

[0019] The entire structure of this application uses magnetic field induction for precise temperature control and relies on local melting of the welding ribs to complete the composite fixation. This avoids problems such as plastic over-melting and overflow, carbonization and scorching, and balances the bonding strength of the welding interface with the reliability of product packaging. The overall equipment structure is compact, and the pressing and heating processes are completed simultaneously, resulting in a short processing cycle. This effectively improves the consistency of welding quality of chips in the same batch and reduces the production defect rate and manufacturing cost. Attached Figure Description

[0020] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0021] Figure 1 This is a three-dimensional structural diagram of a non-contact chip welding device according to a preferred embodiment of the present invention;

[0022] Figure 2 yes Figure 1 A three-dimensional structural schematic diagram of the non-contact chip welding equipment from another perspective;

[0023] Figure 3 yes Figure 1 A three-dimensional structural diagram of the transfer mechanism in the non-contact chip welding equipment shown.

[0024] Figure 4 yes Figure 1 A three-dimensional structural diagram of part of the welding mechanism in the non-contact chip welding equipment shown;

[0025] Figure 5 yes Figure 4 A three-dimensional structural schematic diagram of the welding mechanism shown from another perspective;

[0026] Figure 6 yes Figure 1 A three-dimensional structural diagram of the heat insulation plate and part of the coil assembly in the non-contact chip welding equipment shown.

[0027] Figure 7 yes Figure 1 The diagram shows a three-dimensional structural schematic of a portion of the coil assembly in the non-contact chip welding equipment.

[0028] Explanation of reference numerals in the accompanying drawings: 100, frame; 110, lifting rail; 120, protective plate; 130, travel pin; 200, transfer mechanism; 210, turntable; 211, partition; 220, rotary actuator; 230, carrier; 231, mounting base plate; 232, platform; 233, guide column; 234, handle; 240, positioning assembly; 241, positioning actuator; 242, pushing component; 243, limit pin; 300, welding... 310. Lifting drive; 320. Lifting transmission screw; 330. Transmission wheel; 340. Fixing frame; 350. Lifting frame; 351. Template changing; 352. Upper mold table; 353. Slider; 354. Guide pin; 360. Heat insulation plate; 361. Contouring fitting groove; 370. Coil assembly; 371. Body; 372. Connector; 373. Controller; 374. Assembly frame; 380. Transmission belt; 400. Chip. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0030] Example 1: See Figures 1 to 7As shown, this embodiment provides a chip 400 welding device, which includes: a frame 100; a transfer mechanism 200 connected to the frame 100, which includes a turntable 210 rotatable about its central axis, a carrier 230 on the turntable 210, the chip 400 to be welded being placed on the carrier 230, and a metal conductive sheet located above a plastic substrate; and a welding mechanism 300, which includes a lifting frame 350, a heat-insulating pressure plate 360, and a coil assembly 370. The lifting frame 350 is located above the transfer mechanism 200 and is slidably connected to the frame 100 in the vertical direction. An upper mold stage 352 is provided on the side of the lifting frame 350 facing the transfer mechanism 200. The coil assembly 370 includes an assembly frame 374 and a body 37. 1. Connector 372 and controller 373, wherein the controller 373 is disposed inside the frame 100, the assembly frame 374 is connected to the lifting frame 350, the connector 372 is fixed on the assembly frame 374 and connected to the controller 373, the body 371 is connected to the power supply end of the connector 372, the heat insulation plate 360 ​​is connected to the upper mold stage 352, its top is attached to the body 371, and its bottom is provided with a pressing working surface corresponding to the chip 400 welding area. The controller 373 provides alternating current to the body 371 through the connector 372, so that the body 371 generates an alternating magnetic field and acts on the lower metal conductive sheet. Based on the eddy current heating, the welding rib of the plastic substrate is melted, so that the metal conductive sheet is fused and fixed to the plastic substrate.

[0031] In this embodiment, the frame 100 serves as the basic support and installation base for the entire machine, providing a stable assembly benchmark and support rigidity for each component of the transfer mechanism 200 and the welding mechanism 300. This effectively ensures the alignment accuracy and structural stability of each station during long-term continuous operation of the equipment, and avoids welding offset deviations caused by equipment deformation.

[0032] Furthermore, the frame 100 is provided with a lifting rail 110 and two travel pins 130. The lifting rail 110 extends in a vertical direction, and the two travel pins 130 are respectively disposed at both ends of the lifting rail 110. The side wall of the lifting frame 350 is provided with a slider 353 that can be slidably connected to the lifting rail 110. The lifting track 110 is arranged vertically on the frame 100 and forms a lifting stroke limit structure with the stroke pins 130 at both ends of the track. The lifting frame 350 moves smoothly vertically by sliding the side wall slider 353 with the lifting track 110. The track can guide and constrain the movement path of the lifting frame 350, preventing the heat insulation plate 360 ​​and the coil assembly 370 from shifting horizontally during the lifting process, thus changing the induction distance between the coil and the metal conductive sheet. The stroke pins 130 at both ends can precisely limit the extreme positions of the lifting frame 350 for downward welding and lifting avoidance, preventing the lifting frame 350 from going down too far and squeezing the chip 400, causing the plastic part to crack, the weld rib to be crushed, or the coil assembly 370 to be bumped and damaged due to excessive upward movement. The entire process ensures smooth lifting action and stable alignment accuracy, thereby maintaining a constant magnetic field distance and ensuring that the weld rib is uniformly molten when each chip 400 is welded. At the same time, the mechanical limit reduces the error of the electric control start and stop adjustment, reduces the difficulty of equipment debugging, and improves the welding stability and equipment operation safety in the mass production process.

[0033] Furthermore, the frame 100 also includes a protective plate 120, which is located between the loading station and the welding station, and the protective plate 120 is provided with an avoidance opening to allow the turntable 210 to rotate. The protective plate 120 forms a regional isolation barrier when the turntable 210 indexes and transfers the chip 400, preventing the alternating magnetic field generated by the welding station coil from spreading outward to the personnel loading operation area, thus avoiding electromagnetic interference to the operators and surrounding auxiliary electronic components. The protective plate 120 has a clearance opening adapted to the rotational movement of the turntable 210, which will not interfere with the rotational movement of the turntable 210 carrying the carrier 230 to complete the station switching, and can also prevent molten plastic splashes and debris from scattering outward during the welding process and contaminating the chip 400 to be processed in the loading area. At the same time, it can also isolate the local high temperature generated in the welding area from being conducted to the upward loading side, reducing the risk of burns to the operators. Under the premise of not affecting the smooth operation of the automated flow process of the equipment, it simultaneously achieves multiple effects of electromagnetic shielding, preventing debris splashes, and heat insulation protection, taking into account both the safety of equipment operation and the cleanliness of chip 400 production.

[0034] In this embodiment, the transfer mechanism 200 is mounted on the frame 100. The turntable 210, which can rotate around its own central axis, realizes the automated indexing and switching of the workstation. With the help of the dedicated carrier 230 on the turntable 210, the precise positioning and stable support of the chip 400 to be welded are completed. The carrier 230 can precisely limit the placement posture of the chip 400, ensuring that the metal conductive sheet of the chip 400 is stably mounted above the plastic substrate. It can not only realize precise positioning and welding of a single workstation, but also realize the continuous feeding, welding and unloading of multiple chips 400 by relying on the rotation of the turntable 210, which greatly improves the overall processing efficiency and production continuity of chip 400 packaging and welding.

[0035] In this embodiment, the turntable 210 is provided with a partition 211 to divide the area above the turntable 210 into a loading station and a welding station. The carrier 230 includes a mounting base plate 231, a platform 232, a handle 234, and a guide post 233. The mounting base plate 231 is detachably connected to the loading station and / or the welding station. The handle 234, the guide post 233, and the platform 232 are all disposed on the mounting base plate 231. The chip 400 to be welded is disposed on the platform 232. The guide post 233 extends in the vertical direction. Among them, the partition 211 can stably divide the table into independent loading and welding stations, preventing debris and foreign matter from entering the welding area during loading and affecting welding accuracy. It also blocks the high temperature and alternating magnetic field of the welding station from interfering with the loading operation. The mounting base 231 has a detachable assembly design for easy overall replacement, cleaning, and individual maintenance. The platform 232 integrated into the base plate supports and positions the chip 400 to be welded. The vertically arranged guide columns 233 provide alignment guidance during the downward pressing of the heat-insulating pressure plate 360. The carrier 230 is horizontally offset from the chip 400 to ensure that the metal conductive sheet and the welding rib always maintain a precise fit. The matching platform 232 and handle 234 facilitate operators to quickly pick up and put down the entire carrier 230, greatly improving the convenience of loading and unloading operations. The overall carrier 230 structure is flexible to disassemble and reliably positioned. With the help of the partition 211, the workstation is isolated and protected. While simplifying the changeover, cleaning and maintenance process, it can stably ensure the consistency of the welding alignment of batches of chips 400, effectively reducing the probability of defects such as poor soldering and misalignment.

[0036] Specifically, the transfer mechanism 200 further includes a rotary driver 220 and at least two positioning components 240. The rotary driver 220 is connected to the frame 100, and the turntable 210 is connected to the power output end of the rotary driver 220. The positioning component 240 includes a positioning driver 241, a pusher 242, and a limit pin 243. The positioning driver 241 is connected to the edge of the turntable 210, and the carrier 230 is disposed between the positioning drivers 241. The pusher 242 is connected to the power output end of the positioning driver 241 and is positioned towards the carrier 230. The limit pin 243 is connected to the pusher 242 and can pass through a positioning groove on the edge of the carrier 230. The rotary actuator 220 provides stable indexing rotation power to the turntable 210, thereby driving the turntable 210 to precisely switch the carrier 230 between various workstations. Multiple sets of positioning components 240 distributed on the edge of the turntable 210 can lock and position the carrier 230 placed therein. The positioning actuator 241 outputs power to drive the pusher 242 to feed towards the carrier 230, so that the limiting pin 243 at the end of the pusher 242 is inserted into the corresponding positioning groove on the edge of the carrier 230, forming a bidirectional limiting constraint from both sides of the carrier 230, effectively eliminating the carrier 230's movement during the start and stop of the turntable 210 and under the heat insulation pressure plate 360. To prevent slippage and shaking during pressing, the position of the carrier 230 and the internal chip 400 is kept fixed, avoiding fluctuations in the sensing distance between the coil and the metal conductive sheet that could cause uneven heating of the weld ribs. The rotary driver 220 and the positioning component 240 work together, and after the turntable 210 completes the workstation switch, the position of the carrier 230 can be locked immediately by the limit pin 243. No manual secondary calibration of the positioning is required. This not only improves the automation level of the equipment and shortens the production cycle, but also continuously ensures the uniformity of the welding alignment accuracy of the batch of chips 400, and significantly reduces welding defects such as incomplete soldering and inconsistent melting caused by positioning offset.

[0037] In this embodiment, the welding mechanism 300 serves as the core welding execution structure of the equipment. It relies on the lifting frame 350, which can slide vertically along the frame 100, to achieve precise vertical lifting and lowering motion. This provides a motion basis for the opening and closing of the welding pressing station and the precise control of the welding spacing. The upper mold platform 352 set at the bottom of the lifting frame 350 provides a reliable integrated installation carrier for the heat insulation plate 360 ​​and the coil assembly 370, ensuring that the assembly position of each welding component is fixed and the coaxiality is accurate. The heat insulation plate 360 ​​is fixed to the lower end of the upper mold platform 352. Its top is in contact with and limited by the coil body 371, which can stably fix the installation position of the coil assembly 370 and prevent the coil from shifting or shaking during operation. This ensures that the relative distance between the coil and the metal conductive sheet of the chip 400 below is constant. At the same time, the pressing working surface at the bottom of the heat insulation plate 360 ​​can evenly press the metal conductive sheet during the pressing of the lifting frame 350, so that the metal conductive sheet and the weld rib of the plastic substrate are tightly attached without assembly gaps. This structurally eliminates defects such as false soldering and delamination. In addition, the heat insulation plate 360 ​​has the characteristics of insulation, non-magnetic conduction and low thermal conductivity. It can not only isolate the high temperature of welding from being conducted upward, protecting the upper mold platform and the lifting frame 350 structure from heat damage, but also will not be affected by the eddy currents induced by the alternating magnetic field of the coil, thus ensuring the uniformity of the magnetic field. The coil assembly 370 is the core functional component of electromagnetic heating. The mounting frame 374 securely connects the overall coil structure to the lifting frame 350. The connector 372 serves as a circuit converter and fixed installation, stably connecting the power supply circuit of the controller 373 and the coil body 371 to ensure the stability of current transmission. The controller 373, built into the frame 100, can accurately output a controllable alternating current and supply power to the coil body 371 through the connector 372, enabling the coil body 371 to continuously generate a uniform alternating magnetic field. The magnetic field precisely acts on the metal conductive sheet under the pressing state below, using the principle of metal eddy current heating to achieve controllable melting of the plastic substrate welding ribs without the need for additional high-temperature heat sources and mechanical impact. Ultimately, it achieves high-precision, damage-free, and uniform welding and fixing of the metal conductive sheet and the plastic substrate. Each structure cooperates with each other and performs its own function, solving the industry pain points of uneven heating, easy damage to the chip 400, and poor welding consistency in traditional welding processes from multiple dimensions such as positioning, pressing, magnetic control, and temperature control.

[0038] Furthermore, the welding mechanism 300 includes a lifting driver 310, a lifting transmission screw 320, a transmission belt 380, multiple transmission wheels 330, and multiple fixed frames 340. The lifting driver 310 is mounted on the frame 100. The middle part of the lifting transmission screw 320 is connected to the power output end of the lifting driver 310. The multiple transmission wheels 330 are divided into two groups. The transmission wheels 330 in any group are arranged vertically and are respectively connected to the frame 100 through the fixed frames 340. The two ends of the lifting transmission screw 320 are respectively connected to the transmission wheels 330 in the two groups. The transmission belt 380 is sleeved on the transmission wheels 330 in the same group. The lifting frame 350 is connected to the transmission belt 380 through a belt clamp to move vertically. The screw synchronously transmits the drive power to the vertically arranged transmission wheels 330 on both sides. The transmission belt 380 is rigidly connected to the lifting frame 350 through a belt clamp. The belts on both sides synchronously pull the lifting frame 350 vertically. Multiple sets of transmission wheels 330, together with the fixed frame 340, stably constrain the running trajectory of the belt, ensuring that the lifting strokes on both sides of the lifting frame 350 are completely synchronized. This effectively avoids the problem of uneven pressure on the heat insulation plate 360 ​​caused by the unilateral tilt of the lifting frame 350, and avoids inconsistent melting degree of the welded ribs due to local pressing gap differences of the metal conductive sheet. The transmission form of the screw and belt combination operates smoothly with small transmission gaps. The pressing and lifting action is uniform and smooth, and there will be no impact vibration that causes the carrier 230 and chip 400 to shift. At the same time, the overall transmission components are neatly assembled with the fixed frame 340 of the frame 100, which is compact and durable. It can maintain stable lifting and guiding accuracy even under long-term batch operation, and continuously ensure that the induction distance between the coil and the metal conductive sheet is constant. From the power transmission level, it ensures that the pressing and heating conditions of each chip 400 are uniform, and improves the consistency of the finished product welding quality.

[0039] Specifically, the template 351 is detachably connected to the bottom surface of the lifting frame 350, the upper mold platform 352 is connected to the template 351, the guide pin 354 is disposed on the edge of the template 351, and the guide post 233 can be inserted into the guide pin 354. The quick-change template enables the entire upper mold table 352 to be quickly disassembled and replaced, adapting to the welding production changeover needs of chips 400 of different specifications and sizes. The entire mold table can be replaced without disassembling the main structure of the lifting frame 350, significantly shortening the equipment changeover and debugging time. The guide pins 354 arranged on the edge of the template 351 can cooperate with the guide posts 233 on the carrier 230. During the pressing of the heat insulation plate 360, the guide posts 233 penetrate the guide pins 354 to achieve precise vertical alignment, effectively correcting the horizontal offset between the template 351, the upper mold table 352 and the chip 400 below, ensuring that the working surface of the heat insulation plate 360 ​​is completely and evenly attached to the metal conductive sheet, preventing uneven melting of the weld bead and defects such as false welding caused by local pressing gaps. The template 351 integrates the guide and positioning structure into one assembly, taking into account both the functions of quick changeover and high-precision pressing guidance. This not only improves the equipment's compatibility with multiple product specifications, but also stably maintains the alignment accuracy during batch welding, reducing the product defect rate.

[0040] See Figure 6 As shown, the top surface of the heat insulation plate 360 ​​is provided with a contoured fitting groove 361, and the body 371 is fitted into the contoured fitting groove 361. The contoured fitting groove 361 is adapted to the shape of the coil body 371. The coil body 371 is fitted into the groove to form an all-round limiting constraint on the coil, preventing the coil body 371 from horizontally shifting or tilting during the lifting and pressing operation of the lifting frame 350. It stably maintains a constant induction distance between the coil body 371 and the lower metal conductive sheet, ensuring that the alternating magnetic field uniformly covers the entire metal conductive sheet. At the same time, the fitting groove 361 can rely on the heat insulation, insulation and non-magnetic material of the heat insulation plate 360 ​​itself to isolate the heat generated by the coil from upward conduction, reduce the heating efficiency fluctuation caused by the heat loss of the coil, and prevent the pressing pressure from directly acting on the coil body 371 to cause coil deformation and damage. While stabilizing the positioning of the coil, balancing the magnetic field distribution and protecting the coil structure, it ensures that the degree of melting of each section of the welding rib is consistent, effectively improving the problem of inconsistent welding quality of the same batch of chips 400.

[0041] In this embodiment, the chip 400 welding equipment also includes a control mechanism. The transfer mechanism 200 and the welding mechanism 300 are respectively connected to the control mechanism. The control mechanism uniformly manages all the operating actions of the transfer mechanism 200 and the welding mechanism 300, and can synchronously coordinate the timing logic of each process, such as the rotation and indexing of the turntable 210, the positioning and locking of the carrier 230, the lifting and lowering of the lifting frame 350, and the on / off heating of the coil. This achieves fully automated and linked operation of the entire process of material loading, precise positioning, and pressing and welding, without the need for manual step-by-step operation and control. This simplifies the equipment operation process, improves the overall production cycle, and enables unified management. By controlling the action parameters of each mechanism, the station dwell time, pressing pressure, electromagnetic heating time, and heating power of each chip 400 are kept at a standard and uniform level. This avoids parameter deviations caused by manual operation, which can lead to inconsistent melting of the weld bead. At the same time, the control mechanism can collect the operating status of each stage of transfer and welding in real time. When faults such as turntable 210 misalignment, lifting overtravel, and coil abnormality occur, the machine will stop in time with an early warning, reducing the output of defective products such as chip 400 pressure loss, cold solder joints, and overheating carbonization. On the basis of achieving fully automated continuous production, the welding process conditions of batch products are stabilized and uniform, taking into account both production efficiency and finished product welding consistency.

[0042] Example 2: This example provides a chip 400 welding method, which uses the chip 400 welding equipment described in Example 1 to perform chip 400 welding processing, and includes:

[0043] Step S1: Place the chip 400 to be welded in the carrier 230, with the metal conductive sheet positioned above the plastic substrate. Then connect the carrier 230 to the turntable 210. This step allows the guide post 233 and the stage 232 on the carrier 230 to pre-position the chip 400, standardize the chip 400's placement, and prevent misalignment between the metal conductive sheet and the welding rib. At the same time, the detachable assembly of the carrier 230 facilitates centralized loading operations by operators, enabling pre-positioning of the workpiece and providing a stable foundation for subsequent transfer and precise pressing and welding on the turntable 210. This avoids the problem of uneven welding gaps caused by workpiece misalignment from the source.

[0044] Step S2: Move the chip 400 to be welded to the underside of the heat insulation plate 360 ​​using the turntable 210. Lock and fix the carrier 230 with the help of the positioning component 240 of the turntable 210. This can complete the automated switching of the workpiece station, replacing manual handling of the workpiece to the welding area and reducing the positional deviation caused by manual touch. The indexing positioning of the turntable 210 can ensure that each chip 400 can be accurately placed in the standard welding area directly below the coil, stably maintaining the reference induction distance between the coil and the metal conductive sheet, and ensuring the uniformity of the subsequent magnetic field range.

[0045] Step S3: Drive the lifting frame 350 to press down until the heat insulation plate 360 ​​presses onto the metal conductive sheet of the chip 400 to be welded. During the pressing process, the guide post 233 of the carrier 230 and the guide pin 354 of the template 351 cooperate to complete the alignment and correction. The heat insulation plate 360 ​​evenly presses the metal conductive sheet to eliminate the tiny gaps between the metal conductive sheet and the welding rib, so that the two are tightly attached. This avoids the occurrence of local gaps during the welding process, which would cause the welding rib to melt and fail to wet and adhere, resulting in a false weld. At the same time, the heat insulation plate 360 ​​itself has heat insulation material that can prevent the high temperature generated by subsequent heating from being transmitted upward in advance, protecting the upper coil and lifting structure from the influence of high temperature.

[0046] Furthermore, the heat-insulating pressure plate 360 ​​substrate is preferably a high-temperature resistant resin. In different embodiments, the heat-insulating pressure plate 360 ​​substrate can be configured as one of polyetheretherketone, epoxy glass, polyimide, and high-temperature resistant resin. All of these materials possess the characteristics of insulation and non-magnetic conduction, no eddy current heating, and low thermal conductivity. They will not generate additional heat sources that interfere with the temperature field distribution of the metal conductive sheet under the alternating magnetic field of the coil, ensuring uniform eddy current heating throughout the metal sheet. Simultaneously, the materials exhibit excellent high-temperature resistance and mechanical compressive strength, making them less prone to deformation and cracking during pressing, and ensuring sustainable operation. The system isolates the upward transmission of high welding temperatures to protect upper components such as coils and lifting frames (350°C). Different substrates can be matched to production needs as required. Polyetheretherketone (PEEK) is wear-resistant and temperature-resistant, suitable for high-volume precision chip welding (400°C). Epoxy glass has a moderate cost and is suitable for general mass production models. Polyimide has a higher temperature resistance limit and is suitable for ultra-thin small chip welding (400°C). Various high-temperature resistant resins can be modified and customized according to product specifications. While achieving stable and uniform pressing, heat insulation and shielding, and no magnetic field interference, the system expands the equipment's adaptability range, taking into account both welding quality consistency and equipment lifespan.

[0047] Step S4: Start the controller 373, which provides alternating current to the body 371 through the connector 372. The body 371 generates an alternating magnetic field and acts on the lower metal conductive sheet. Based on eddy current heating, the weld ribs of the plastic substrate are melted until the metal conductive sheet and the plastic substrate are fused and fixed. This step uses the metal's own eddy current internal heating method. The heat is directly generated in the metal conductive sheet and conducted to the weld ribs. There is no need for an external heat source to directly bake the plastic part. With the constant pressing state of the heat insulation plate 360, the weld ribs can be heated and melted at the same time. There will be no local over-melting and carbonization or insufficient melting and delamination. The parameters of the entire heating process are uniformly controlled by the controller 373. The heating time and magnetic field strength of a single workpiece are kept consistent, which greatly improves the welding strength and product quality uniformity of batch chips 400.

[0048] Furthermore, the controller 373 described in this embodiment outputs a high-frequency alternating current, the operating frequency range of which is 50kHz, the output operating current range is 5A, the rated output power is 3kW, and the single chip 400 welding time is 2s.

[0049] In different implementations, the controller 373 limits the output of a high-frequency alternating current in the range of 20kHz to 60kHz, coupled with an operating current of 0.5A to 10A and a rated output power of 1kW to 5kW, and controls the energizing time of a single welding operation to 0.5s to 3s. This parameter range enables the coil to generate an alternating magnetic field of moderate intensity and uniform distribution, ensuring that eddy currents are stably generated inside the metal conductive sheet to supply the heat required for the melting of the weld bead, while preventing localized eddy current concentration and excessive instantaneous temperature rise in the metal due to excessive frequency, current, or power. This avoids excessive melting and overflow of the weld bead, carbonization and burn-off, and high-temperature conduction damage. The internal components of the Chip 400, along with its short power-on time, enable instantaneous and precise heating. Combined with adjustable power and current parameters, it can adapt to the welding needs of metal conductive sheets of different thicknesses and weld beads of different specifications. The low-frequency, low-power range can be used for slow and uniform heating of small, thin-walled Chips 400, while the high-frequency, high-power range can be used for rapid welding of thick metal sheets. The parameter ranges work together to precisely control the melting degree of the weld beads, standardizing the heating conditions for welding each batch of Chips 400, effectively balancing the welding strength and the protective effect of Chips 400, and significantly reducing problems such as poor soldering and damage to plastic parts caused by mismatched heating parameters.

[0050] In summary, the chip 400 welding equipment and method of the present invention, by setting up a rotatable indexing turntable 210 and a special carrier 230 to stably place the chip 400 to be welded, can realize multi-station continuous flow operation and greatly improve the batch welding processing efficiency of chip 400.

[0051] The lifting frame 350 drives the heat insulation plate 360 ​​to press down synchronously to uniformly press and limit the metal conductive sheet, so that the metal conductive sheet and the fusion rib of the plastic substrate are tightly attached throughout the process, effectively eliminating the gap between the parts and avoiding the defects of incomplete welding and delamination after welding. The coil body 371 is embedded and assembled above the heat insulation plate 360. The heat insulation plate 360 ​​is made of high temperature resistant insulating resin, which can not only isolate the high temperature generated by welding from being transmitted upward, preventing the upper structure such as the lifting frame 350 and the upper mold table 352 from being deformed and aged by heat, but also the heat insulation plate 360 ​​has no magnetic and conductive properties, so it will not generate additional eddy currents that interfere with the magnetic field distribution under the action of the coil's alternating magnetic field, ensuring that the magnetic field is uniformly applied to the surface of the metal conductive sheet.

[0052] The controller 373 stably supplies alternating current to the coil body 371 via the connector 372, and completes the welding of the fusion rib by relying on the eddy current heat generated by the metal sheet itself. There is no need to apply high temperature stamping to the chip 400 as a whole, which can significantly reduce the risk of thermal stress damage to the internal wafer and bonding circuit of the chip 400.

[0053] The entire structure of this application uses magnetic field induction to precisely control the temperature and relies on local melting of the welding ribs to complete the composite fixation. This avoids problems such as plastic over-melting and overflow, carbonization and scorching. It takes into account both the bonding strength of the welding interface and the reliability of product packaging. The overall equipment structure is compact, and the pressing and heating processes are completed simultaneously, resulting in a short processing cycle. This effectively improves the consistency of 400 welding quality of chips in the same batch and reduces the production defect rate and manufacturing cost.

[0054] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A non-contact chip bonding device, characterized in that: include: frame; A transfer mechanism connected to the frame includes a turntable rotatable about its central axis, a carrier on the turntable, a chip to be welded placed on the carrier, and a metal conductive sheet located above a plastic substrate. The welding mechanism includes a lifting frame, a heat-insulating pressure plate, and a coil assembly. The lifting frame is located above the transfer mechanism and is slidably connected to the frame in the vertical direction. An upper mold platform is provided on the side of the lifting frame facing the transfer mechanism. The coil assembly includes an assembly frame, a body, a connector, and a controller. The controller is located inside the frame. The assembly frame is connected to the lifting frame. The connector is fixed to the assembly frame and connected to the controller. The body is connected to the power supply terminal of the connector. The heat-insulating pressure plate is connected to the upper mold platform. Its top is in contact with the body, and its bottom is provided with a pressing working surface corresponding to the chip welding area. The controller provides alternating current to the body through a connector, causing the body to generate an alternating magnetic field that acts on the lower metal conductive sheet. Based on eddy current heating, the welding ribs of the plastic substrate are melted, so that the metal conductive sheet is fused and fixed to the plastic substrate.

2. The non-contact chip welding equipment according to claim 1, characterized in that: The top surface of the heat insulation plate is provided with a contoured fitting groove, and the body is fitted into the contoured fitting groove.

3. The non-contact chip welding equipment according to claim 1, characterized in that: The welding mechanism includes a lifting driver, a lifting transmission screw, a transmission belt, multiple transmission wheels, and multiple fixed frames. The lifting driver is mounted on the frame. The middle part of the lifting transmission screw is connected to the power output end of the lifting driver. The multiple transmission wheels are divided into two groups. The transmission wheels in any group are arranged vertically and are respectively connected to the frame through the fixed frames. The two ends of the lifting transmission screw are respectively connected to the transmission wheels in the two groups. The transmission belt is sleeved on the transmission wheels in the same group. The lifting frame is connected to the transmission belt through belt clamps to move vertically.

4. The non-contact chip welding equipment according to claim 1, characterized in that: The frame is provided with a lifting rail and two travel pins. The lifting rail extends vertically, and the two travel pins are respectively located at both ends of the lifting rail. The side wall of the lifting frame is provided with a slider that can be slidably connected to the lifting rail.

5. The non-contact chip welding equipment according to claim 1, characterized in that: The turntable is equipped with a partition to divide the area above the turntable into a loading station and a welding station. The carrier includes a mounting base plate, a platform handle, and a guide post. The mounting base plate is detachably connected to the loading station and / or the welding station. The handle, the guide post, and the platform are all mounted on the mounting base plate. The chip to be welded is mounted on the platform. The guide post extends vertically. The lifting frame also includes a changing template and a guide pin. The changing template is detachably connected to the bottom surface of the lifting frame. The upper mold platform is connected to the changing template. The guide pin is located at the edge of the changing template. The guide post can be inserted into the guide pin. The frame also includes a protective plate located between the loading station and the welding station, and the protective plate has an opening to allow the turntable to rotate.

6. The non-contact chip welding equipment according to claim 1, characterized in that: The transfer mechanism further includes a rotary driver and at least two positioning components. The rotary driver is connected to the frame, and the turntable is connected to the power output end of the rotary driver. The positioning components include a positioning driver, a pusher, and a limit pin. The positioning driver is connected to the edge of the turntable, and the carrier is disposed between the positioning drivers. The pusher is connected to the power output end of the positioning driver and faces the carrier. The limit pin is connected to the pusher and can pass through a positioning groove on the edge of the carrier.

7. The non-contact chip welding equipment according to claim 1, characterized in that: The non-contact chip welding equipment also includes a control mechanism, and the transfer mechanism and the welding mechanism are respectively connected to the control mechanism.

8. A non-contact chip bonding method, characterized in that: Chip welding processing is performed using the non-contact chip welding equipment according to any one of claims 1 to 7, comprising: Step S1: Place the chip to be soldered in the carrier, with the metal conductive sheet positioned above the plastic substrate, and then connect the carrier to the turntable. Step S2: Move the chip to be soldered to the underside of the heat insulation plate using a turntable; Step S3: Drive the lifting frame to press down until the heat insulation plate presses onto the metal conductive sheet of the chip to be welded; Step S4: Start the controller so that it provides alternating current to the body through the connector. The body generates an alternating magnetic field and acts on the lower metal conductive sheet. Based on the eddy current heating, the welding ribs of the plastic substrate melt until the metal conductive sheet is fused and fixed to the plastic substrate.

9. The non-contact chip welding method according to claim 8, characterized in that: The heat-insulating pressure plate substrate is one of polyetheretherketone, epoxy glass, polyimide, and high-temperature resistant resin.

10. The non-contact chip welding method according to claim 8, characterized in that: The controller outputs a high-frequency alternating current with a working frequency range of 20kHz to 60kHz, an output working current range of 0.5A to 10A, a rated output power of 1kW to 5kW, and a single chip welding time of 0.5s to 3s.

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