A grinding forming equipment and method suitable for a spherical diamond surface

Abstract

The application discloses a grinding forming equipment and a processing method suitable for a spherical diamond surface and relates to the technical field of optical manufacturing. The application comprises a machine tool bed, a first clamping mechanism, a second clamping mechanism and an in-situ measurement system. The first clamping mechanism comprises an X-axis assembly and a C-axis assembly. The X-axis assembly is installed on the upper portion of the machine tool bed and can move linearly along the X-axis direction. The C-axis assembly is installed on the moving end of the X-axis assembly. The rotary end of the C-axis assembly is connected with a grinding wheel. A T-shaped layout five-axis grinding machine tool is adopted. The grinding wheel side and the workpiece side are separately arranged on the X-axis and Z-axis movement chains. Through the cooperative control of the X-axis, the Z-axis, the B-axis, the C-axis and the workpiece rotary shaft, the accurate adjustment of the included angle between the grinding wheel and the workpiece axis, the relative position and the feeding movement is realized. The application provides the multi-degree-of-freedom hardware conditions for three-stage processes of step chamfering, generative grinding and trajectory envelope ultra-precision correction. The application is suitable for the processing scene of the large allowance and uneven allowance distribution of the spherical CVD diamond blank.

Description

Technical Field

[0001] This invention relates to the field of optical manufacturing technology, specifically to a grinding and shaping equipment and processing method suitable for spherical diamond surfaces. Background Technology

[0002] As aircraft continue to develop towards higher speeds and greater maneuverability, their optoelectronic detection systems place increasingly stringent technical requirements on the comprehensive service performance of optical radomes and infrared optical windows. Spherical CVD diamond materials possess extremely high hardness, high thermal conductivity, high infrared transmittance, excellent wear resistance, and ablation resistance, making them the preferred material for optical windows and radome components in the extreme service environments of hypersonic aircraft. They have irreplaceable application value in the field of aerospace optoelectronic equipment.

[0003] Spherical diamonds are typically formed by chemical vapor deposition (CVD) on the surface of a high-precision silicon substrate. However, due to differences in the growth rate distribution during the deposition process, the thickness distribution of the spherical diamonds after deposition is uneven. In particular, after the deposition and growth of convex spherical diamond elements, their edge areas have a large machining allowance, posing a challenge to the ultra-precision machining of diamonds due to their extreme hardness and brittleness.

[0004] Currently, the mainstream ultra-precision grinding methods for spherical optical components include generating grinding and trajectory envelope grinding. The generating method forms the target spherical surface by rotating the cup-shaped grinding wheel and the workpiece. During the large-mass machining stage of the blank, the grinding wheel needs to simultaneously undertake the tasks of forming and removing a large amount of material, which can easily lead to problems such as rapid wear of the grinding wheel, accumulation of surface shape errors, and excessive grinding force causing system vibration. Grinding stress can also induce microcracks in the diamond, and even lead to the scrapping of the component. The trajectory envelope method relies on a preset trajectory to achieve point-by-point deterministic removal. It has good process flexibility and strong error correction capability. However, it is limited by the amount of diamond removed in a single pass. When processing large-mass edges of the blank, multiple reciprocating scans are required, resulting in long processing paths and long cycles, making it impossible to achieve efficient and low-damage forming. Summary of the Invention

[0005] The purpose of this invention is to address the problem that existing trajectory envelope methods and generating methods are insufficient to simultaneously achieve rapid removal of large allowances, high surface accuracy, and surface integrity, thus failing to meet the current processing requirements of spherical diamond optical windows. Therefore, this invention provides a grinding and shaping equipment and processing method suitable for spherical diamond surfaces.

[0006] The technical solution of the present invention is: a grinding and forming equipment suitable for spherical diamond surfaces, comprising: a machine tool bed, a first clamping mechanism, a second clamping mechanism, and an in-situ measurement system;

[0007] The first clamping mechanism includes an X-axis assembly and a C-axis assembly. The X-axis assembly is mounted on the upper part of the machine tool bed and can move linearly along the X-axis direction. The C-axis assembly is mounted on the moving end of the X-axis assembly. A grinding wheel is connected to the rotating end of the C-axis assembly, and the C-axis assembly is used to drive the grinding wheel to rotate around the C-axis.

[0008] The second clamping mechanism includes a Z-axis assembly, a B-axis assembly, and a tool axis assembly. The Z-axis assembly is mounted on the upper part of the machine tool bed and can move linearly along the Z-axis direction. The B-axis assembly is mounted on the moving end of the Z-axis assembly, and the tool axis assembly is mounted on the rotating end of the B-axis assembly. The rotating end of the tool axis assembly is connected to a workpiece. The tool axis assembly is used to clamp the workpiece and drive the workpiece to rotate around its own axis.

[0009] The in-situ measurement system is installed on the C-axis assembly and is used to perform in-situ detection of the workpiece contour after grinding and to provide measurement data for machining error compensation.

[0010] Furthermore, the X-axis assembly includes an X-axis linear drive mechanism and an X-axis slide. The X-axis linear drive mechanism is mounted on the upper part of the machine tool bed along the X-axis direction, and the X-axis slide is mounted on the moving end of the X-axis linear drive mechanism.

[0011] Furthermore, X-axis protective skins are respectively provided on both sides of the X-axis slide.

[0012] Furthermore, the C-axis assembly includes a C-axis rotation drive mechanism and a C-axis clamp, the C-axis clamp is mounted on the X-axis slide, the C-axis rotation drive mechanism is mounted on the C-axis clamp, and the grinding wheel is mounted on the rotating end of the C-axis rotation drive mechanism.

[0013] Furthermore, the Z-axis assembly includes a Z-axis linear drive mechanism and a Z-axis slide. The Z-axis linear drive mechanism is mounted on the upper part of the machine tool bed along the Z-axis direction, and the Z-axis slide is mounted on the moving end of the Z-axis linear drive mechanism.

[0014] Furthermore, Z-axis protective skins are respectively provided on both sides of the Z-axis slide.

[0015] Furthermore, the B-axis assembly includes a B-axis rotation drive mechanism and a B-axis turntable. The B-axis rotation drive mechanism is mounted on the Z-axis slide, and the B-axis turntable is mounted on the rotating end of the B-axis rotation drive mechanism.

[0016] Furthermore, the tool axis assembly includes a tool axis rotation drive mechanism and a tool axis fixture. The tool axis fixture is mounted on the B-axis rotary table, the tool axis rotation drive mechanism is mounted on the tool axis fixture, and the workpiece is mounted on the rotary end of the tool axis rotation drive mechanism.

[0017] A processing method for a grinding and shaping equipment suitable for spherical diamond surfaces, employing any of the above-mentioned solutions, includes: a first stage, a second stage, and a third stage;

[0018] The first stage is the step-by-step chamfering rapid surface forming stage. Based on the allowance distribution between the actual contour of the spherical CVD diamond blank and the target spherical contour, the first chamfering target contour is established, and the first chamfering angle, grinding depth and X-axis feed parameters are determined. During the processing, the rotation axis of the grinding wheel and the rotation axis of the workpiece are kept in the same processing plane, and the included angle between the two axes is kept constant. The grinding wheel and the workpiece rotate around their own rotation axis. At the same time, the X-axis assembly drives the grinding wheel to feed along the X-axis to complete the chamfering grinding, and prioritizes the removal of large allowance materials at the edge of the spherical diamond blank.

[0019] The second stage is the generating method grinding convergence stage. After the large amount of material at the edge of the first stage is removed, the process switches to generating method to carry out spherical convergence forming. The workpiece posture is adjusted by the B-axis assembly so that the cutting edge of the grinding wheel end face and the spherical surface to be processed of the workpiece form a generating envelope posture. The C-axis assembly is controlled to drive the grinding wheel to rotate at high speed, and the tool axis assembly drives the spherical diamond workpiece to rotate at a constant speed around its own central axis. The spherical surface is generated by the cooperative rotational motion envelope of the cutting edge of the grinding wheel end face and the workpiece. Only a small grinding allowance is set in this stage. Continuous spherical convergence processing is performed on the multi-segment broken line contour formed by the chamfering process in the first stage. The segmented chamfered contour of the workpiece is gradually trimmed and transitioned into a continuous smooth spherical contour.

[0020] The third stage is the trajectory envelope ultra-precision correction stage. Based on the target spherical contour, the grinding wheel motion trajectory is generated. The X-axis, Z-axis, B-axis and C-axis components are coordinated to realize the multi-axis linkage of the grinding wheel. The grinding wheel performs envelope scanning grinding on the workpiece surface according to the preset trajectory. The residual low-frequency and medium-frequency contour errors on the workpiece surface are further corrected, driving the actual contour of the workpiece to converge further to the target spherical contour. At the same time, the depth of residual subsurface damage of spherical diamond is reduced, the spherical surface accuracy and surface quality are improved, and the spherical diamond component is formed by efficient ultra-precision grinding.

[0021] Furthermore, in the first stage of rapid chamfering surface forming, after a single chamfering grinding process is completed, the in-situ measurement system is invoked to move to the measurement station and perform non-contact measurement on the current actual contour of the workpiece to obtain the actual machining contour data of the workpiece. The measured contour data is compared with the target contour corresponding to this chamfering to determine whether the preset contour requirements for this chamfering are met. If the measured result meets the target contour for this chamfering, the chamfering grinding is determined to be completed. The remaining machining allowance is recalculated based on the current actual contour, and the target contour for the next chamfering process is planned. If the measured result does not meet the target contour for this chamfering, the machining compensation amount is calculated based on the contour error, and the machining parameters of the chamfering angle, grinding depth, and X-axis feed amount corresponding to this chamfering are compensated and corrected. The chamfering grinding process continues until the target contour requirements for this chamfering are met.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] 1. The grinding and forming equipment for spherical diamond surfaces provided by this invention adopts a T-shaped layout five-axis grinding machine tool. The grinding wheel side and the workpiece side are respectively placed on the X-axis and Z-axis motion chains. Through the coordinated control of the X-axis, Z-axis, B-axis, C-axis and workpiece rotation axis, the angle between the grinding wheel and the workpiece axis, the relative position and the feed motion can be precisely adjusted. It provides multi-degree-of-freedom hardware conditions for the three-stage process of step-by-step chamfering, generating grinding and trajectory envelope ultra-precision correction, and is suitable for the processing scenarios of large allowance and uneven allowance distribution of spherical CVD diamond blanks.

[0024] 2. The grinding and forming equipment for spherical diamond surfaces provided by this invention implements closed-loop control for each chamfering process through in-situ measurement and error compensation mechanisms. After a single chamfering is completed, the actual contour data of the workpiece can be obtained in situ. Combined with the actual measurement results, the process parameters such as chamfering angle, grinding depth, and X-axis feed are dynamically corrected, which effectively improves the convergence accuracy of the spherical contour and the processing stability of the entire process, and provides a high-precision intermediate processing benchmark for subsequent generating grinding and ultra-precision trajectory envelope correction.

[0025] 3. The processing method of the grinding forming equipment for spherical diamond surfaces provided by this invention addresses the processing difficulties of large and uneven processing allowances at the edges of spherical CVD diamond blanks. It proposes a step-by-step chamfering rapid surface forming method, which gradually brings the actual contour of the workpiece closer to the target convex spherical contour through multiple passes of chamfering grinding. The large allowance material at the edges is removed in stages and in an orderly manner, which effectively alleviates the problem of drastic fluctuations in grinding force under large allowance grinding, improves the forming stability of the roughing process, and significantly improves the roughing removal efficiency of the blank.

[0026] 4. The processing method for grinding and forming equipment suitable for spherical diamond surfaces provided by the present invention adopts a three-stage progressive processing technology of step-by-step chamfering and rapid surface forming, generating grinding convergence, and trajectory envelope ultra-precision correction. It organically combines large-mass efficient removal, spherical contour convergence, and ultra-precision error correction to achieve a combination of high material removal efficiency and high surface accuracy. It is suitable for the efficient and ultra-precision manufacturing of spherical diamond optical windows and fairings for hypersonic aircraft. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 yes Figure 1 Top view;

[0029] Figure 3 This is a process flow diagram of the present invention;

[0030] Figure 4 This is a schematic diagram of the step-by-step chamfering rapid surface forming stage of the present invention;

[0031] Figure 5 This is a schematic diagram of the convergence stage of the generating grinding method of the present invention;

[0032] Figure 6 This is a schematic diagram of the trajectory envelope ultra-precision correction stage of the present invention;

[0033] Figure 7 This is a schematic diagram of the in-situ measurement system of the present invention.

[0034] In the diagram: 1. Machine bed; 2. X-axis assembly; 3. C-axis assembly; 4. Grinding wheel; 5. Z-axis assembly; 6. B-axis assembly; 7. Tool axis assembly; 8. In-situ measurement system; 9. X-axis slide; 10. X-axis protective skin; 11. C-axis rotation drive mechanism; 12. C-axis fixture; 13. Z-axis slide; 14. Z-axis protective skin; 15. B-axis rotary table; 16. Tool axis rotation drive mechanism; 17. Tool axis fixture. Detailed Implementation

[0035] Specific implementation method one: Combining Figure 1 , Figure 2This embodiment describes a machine tool bed 1, a first clamping mechanism, a second clamping mechanism, and an in-situ measurement system 8. The first clamping mechanism includes an X-axis assembly 2 and a C-axis assembly 3. The X-axis assembly 2 is mounted on the upper part of the machine tool bed 1 and can move linearly along the X-axis. The C-axis assembly 3 is mounted on the moving end of the X-axis assembly 2, and a grinding wheel 4 is connected to the rotating end of the C-axis assembly 3. The C-axis assembly 3 is used to drive the grinding wheel 4 to rotate around the C-axis. The second clamping mechanism includes a Z-axis assembly 5, a B-axis assembly 6, and a tool axis assembly 7. The Z-axis assembly 5 is mounted on the upper part of the machine tool bed 1 and can move linearly along the Z-axis. The B-axis assembly 6 is mounted on the moving end of the Z-axis assembly 5, and the tool axis assembly 7 is mounted on the rotating end of the B-axis assembly 6. A workpiece is connected to the rotating end of the tool axis assembly 7, and the tool axis assembly 7 is used to clamp the workpiece and drive the workpiece to rotate around its own axis. The in-situ measurement system 8 is mounted on the C-axis assembly 3 and is used to perform in-situ detection of the workpiece contour after grinding and to provide measurement data for machining error compensation.

[0036] This embodiment of the grinding and forming equipment applicable to spherical diamond surfaces adopts a T-type layout five-axis grinding machine tool. The grinding wheel 4 side and the workpiece side are respectively placed on the X-axis and Z-axis motion chains. Through the coordinated control of the X-axis, Z-axis, B-axis, C-axis and workpiece rotation axis, the angle between the grinding wheel 4 and the workpiece axis, the relative position and the feed motion can be precisely adjusted. It provides multi-degree-of-freedom hardware conditions for the three-stage process of step-by-step chamfering, generating grinding and trajectory envelope ultra-precision correction, and is suitable for the processing scenarios of large allowance and uneven allowance distribution of spherical CVD diamond blanks.

[0037] Specific Implementation Method Two: Combining Figure 1 , Figure 2 This embodiment differs from specific embodiment one in that the X-axis assembly 2 includes an X-axis linear drive mechanism and an X-axis slide 9. The X-axis linear drive mechanism is mounted on the upper part of the machine tool bed 1 along the X-axis direction, and the X-axis slide 9 is mounted on the moving end of the X-axis linear drive mechanism. The machine tool bed 1 has a high-rigidity hydrostatic guide rail for the X-axis. The X-axis linear drive mechanism is driven by a linear motor, driving the X-axis slide 9 to slide along the high-rigidity hydrostatic guide rail. The linear drive mechanism ensures the controllability of the feed displacement, and the slide's load-bearing structure improves the rigidity of the component installation, reducing feed jitter during diamond large-margin chamfering grinding and ensuring the accuracy of the grinding wheel's 4X-axis feed position, providing a reliable linear motion execution basis for the first stage of step-by-step chamfering grinding. Other components and connections are the same as in specific embodiment one.

[0038] Specific implementation method three: Combining Figure 1 , Figure 2This embodiment differs from Specific Embodiment Two in that X-axis protective skins 10 are respectively provided on both sides of the X-axis slide 9. The X-axis protective skins 10 can prevent abrasive particles and cutting fluid from entering the X-axis linear drive mechanism and guide rail mating pair, avoiding scratches on the guide rail and wear and jamming of the motion mechanism caused by hard abrasive particles, protecting the accuracy of the X-axis motion pair, and extending the service life of the X-axis assembly 2. Other components and connections are the same as in Specific Embodiment Two.

[0039] Specific implementation method four: Combination Figure 1 , Figure 2 This embodiment differs from Specific Embodiment Two in that the C-axis assembly 3 includes a C-axis rotation drive mechanism 11 and a C-axis clamp 12. The C-axis clamp 12 is bolted to the X-axis slide 9, and the C-axis rotation drive mechanism 11 is bolted inside the C-axis clamp 12. The grinding wheel 4 is mounted on the rotating end of the C-axis rotation drive mechanism 11, and the in-situ measurement system 8 is bolted to the side of the C-axis clamp 12. The clamp uses a sleeve structure to hold the measurement sensor. The C-axis rotation drive mechanism 11 directly drives the grinding wheel 4 to rotate, providing high-speed and stable grinding wheel 4 rotation for grinding. This satisfies the rotational cutting conditions of the first stage chamfering grinding and also supports the high-speed rotation of the grinding wheel 4 required for the second stage generating grinding, reducing grinding wheel 4 rotational runout and minimizing spherical ripple errors caused by grinding wheel 4 rotational eccentricity. Other components and connections are the same as in Specific Embodiment Two.

[0040] Specific Implementation Method Five: Combining Figure 1 , Figure 2 This embodiment differs from specific embodiment one in that the Z-axis assembly 5 includes a Z-axis linear drive mechanism and a Z-axis slide 13. The Z-axis linear drive mechanism is mounted on the upper part of the machine tool bed 1 along the Z-axis direction, and the Z-axis slide 13 is mounted on the moving end of the Z-axis linear drive mechanism. The machine tool bed 1 has a Z-axis high-rigidity hydrostatic guide rail. The Z-axis linear drive mechanism is driven by a linear motor, driving the Z-axis slide 13 to slide along the Z-axis high-rigidity hydrostatic guide rail, providing high-precision linear displacement capability in the Z-axis direction for the entire workpiece-side posture mechanism. It can cooperate with the X-axis to complete the spatial relative position adjustment of the grinding wheel 4 and the workpiece, providing Z-axis motion freedom for multi-axis linkage for ultra-precision correction of the trajectory envelope in the third stage. Other components and connections are the same as in specific embodiment one.

[0041] Specific Implementation Method Six: Combination Figure 1 , Figure 2This embodiment differs from specific embodiment five in that it has Z-axis protective skins 14 on both sides of the Z-axis slide 13. These protective skins isolate the Z-axis linear drive mechanism and guide rail pair from diamond grinding chips and grinding fluid, preventing hard diamond chips from wearing down the Z-axis moving parts and maintaining the motion accuracy and smoothness of the Z-axis linear motion. Other components and connections are the same as in specific embodiment five.

[0042] Specific implementation method seven: Combining Figure 1 , Figure 2 This embodiment differs from specific embodiment five in that the B-axis assembly 6 includes a B-axis rotation drive mechanism and a B-axis rotary table 15. The B-axis rotation drive mechanism is mounted on the Z-axis slide 13, and the B-axis rotary table 15 is mounted on the rotating end of the B-axis rotation drive mechanism. The B-axis rotary shaft uses a hydrostatic shaft to achieve high rotational accuracy. The B-axis rotary table 15 serves as the rotation output end, carrying the tool shaft assembly 7. The B-axis rotary table 15 can drive the entire workpiece to achieve posture angle adjustment. It can adjust the workpiece posture during the second stage of generating grinding, so that the cutting edge of the grinding wheel 4 end face matches the spherical surface of the workpiece in a generating envelope posture. It can also provide workpiece posture adjustment freedom for the third stage of trajectory envelope grinding. Other components and connections are the same as in specific embodiment five.

[0043] Specific implementation method eight: Combination Figure 1 , Figure 2 This embodiment differs from specific embodiment seven in that the tool spindle assembly 7 includes a tool spindle rotation drive mechanism 16 and a tool spindle fixture 17. The tool spindle fixture 17 is bolted to the B-axis rotary table 15, and the tool spindle rotation drive mechanism 16 is bolted inside the tool spindle fixture 17. The workpiece is mounted on the rotating end of the tool spindle rotation drive mechanism 16, which drives the workpiece to rotate, satisfying the workpiece rotation requirements throughout the chamfering and generating envelope grinding processes and ensuring smooth workpiece rotation. Other components and connections are the same as in specific embodiment seven.

[0044] Specific Implementation Method Nine: Combining Figures 3 to 6 This embodiment also provides a processing method for grinding and shaping equipment suitable for spherical diamond surfaces, including: a first stage, a second stage, and a third stage;

[0045] The first stage is the step-by-step chamfering rapid surface forming stage. Based on the allowance distribution between the actual contour of the spherical CVD diamond blank and the target spherical contour, the first chamfering target contour is established, and the first chamfering angle, grinding depth and X-axis feed parameters are determined. During the processing, the rotation axis of the grinding wheel 4 and the rotation axis of the workpiece are kept in the same processing plane, and the included angle between the two axes is kept constant. The grinding wheel 4 and the workpiece rotate around their own rotation axis. At the same time, the X-axis assembly 2 drives the grinding wheel 4 to feed along the X-axis to complete the chamfering grinding, and prioritizes the removal of large allowance materials at the edge of the spherical diamond blank.

[0046] The second stage is the generating method grinding convergence stage. After the large amount of material at the edge of the first stage is removed, the process switches to generating method to carry out spherical convergence forming. The workpiece posture is adjusted by B-axis assembly 6 so that the cutting edge of the end face of the grinding wheel 4 and the spherical surface to be processed of the workpiece form a generating envelope posture. The C-axis assembly 3 is controlled to drive the grinding wheel 4 to rotate at high speed, and the tool axis assembly 7 drives the spherical diamond workpiece to rotate at a constant speed around its own central axis. The spherical surface is generated by the cooperative rotational motion envelope of the cutting edge of the end face of the grinding wheel 4 and the workpiece. Only a small grinding allowance is set in this stage. Continuous spherical convergence processing is performed on the multi-segment broken line contour formed by the chamfering process in the first stage. The segmented chamfered contour of the workpiece is gradually trimmed and transitioned into a continuous smooth spherical contour.

[0047] The third stage is the trajectory envelope ultra-precision correction stage. Based on the target spherical contour, the motion trajectory of the grinding wheel 4 is generated. The X-axis assembly 2, Z-axis assembly 5, B-axis assembly 6, and C-axis assembly 3 are coordinated to realize the multi-axis linkage of the grinding wheel 4. The grinding wheel 4 performs envelope scanning grinding on the workpiece surface according to the preset trajectory, further corrects the residual low-frequency and medium-frequency contour errors on the workpiece surface, drives the actual contour of the workpiece to converge further to the target spherical contour, reduces the residual subsurface damage depth of the spherical diamond, improves the spherical surface accuracy and surface quality, and completes the efficient ultra-precision grinding and forming of the spherical diamond component.

[0048] By organically combining step-by-step chamfering rapid surface forming, generating spherical convergence, and trajectory envelope ultra-precision correction, the large allowance removal, continuous spherical forming, and ultra-precision surface correction of spherical diamond are completed in different processing stages, realizing efficient, high-precision, and low-damage ultra-precision grinding forming of spherical diamond components.

[0049] Specific Implementation Method Ten: Combining Figure 7This embodiment differs from Specific Embodiment Nine in that, in the first stage of the rapid chamfering surface forming process, after a single chamfering grinding operation is completed, the in-situ measurement system 8 is invoked and moved to the measurement station to perform non-contact measurement on the current actual contour of the workpiece, acquiring the actual machining contour data. The measured contour data is compared with the target contour corresponding to this chamfering operation to determine if the preset contour requirements for this chamfering operation are met. If the measured result meets the target contour requirements, the chamfering grinding operation is considered complete. The remaining machining allowance is recalculated based on the current actual contour, and the target contour for the next chamfering operation is planned. If the measured result does not meet the target contour requirements, the machining compensation amount is calculated based on the contour error, and the chamfering angle, grinding depth, and X-axis feed rate machining parameters corresponding to this chamfering operation are compensated and corrected. The chamfering grinding operation continues until the target contour requirements for this chamfering operation are met. Other components and connections are the same as in Specific Embodiment Nine.

[0050] The scope of this invention is not limited to the above-described embodiments; a combination of one or more specific embodiments can also achieve the purpose of the invention.

Claims

1. A grinding and shaping equipment suitable for spherical diamond surfaces, characterized in that, include: The machine tool bed (1), the first clamping mechanism, the second clamping mechanism, and the in-situ measurement system (8); The first clamping mechanism includes an X-axis assembly (2) and a C-axis assembly (3). The X-axis assembly (2) is mounted on the upper part of the machine tool bed (1) and can move linearly along the X-axis direction. The C-axis assembly (3) is mounted on the moving end of the X-axis assembly (2). A grinding wheel (4) is connected to the rotating end of the C-axis assembly (3). The C-axis assembly (3) is used to drive the grinding wheel (4) to rotate around the C-axis. The second clamping mechanism includes a Z-axis assembly (5), a B-axis assembly (6), and a tool axis assembly (7). The Z-axis assembly (5) is mounted on the upper part of the machine tool bed (1) and can move linearly along the Z-axis direction. The B-axis assembly (6) is mounted on the moving end of the Z-axis assembly (5). The tool axis assembly (7) is mounted on the rotating end of the B-axis assembly (6). The rotating end of the tool axis assembly (7) is connected to a workpiece. The tool axis assembly (7) is used to clamp the workpiece and drive the workpiece to rotate around its own axis. The in-situ measurement system (8) is installed on the C-axis assembly (3) and is used to perform in-situ detection of the workpiece contour after grinding and to provide measurement data for machining error compensation.

2. The grinding and shaping equipment suitable for spherical diamond surfaces according to claim 1, characterized in that, The X-axis assembly (2) includes an X-axis linear drive mechanism and an X-axis slide (9). The X-axis linear drive mechanism is installed on the upper part of the machine tool bed (1) along the X-axis direction, and the X-axis slide (9) is installed on the moving end of the X-axis linear drive mechanism.

3. The grinding and shaping equipment suitable for spherical diamond surfaces according to claim 2, characterized in that, X-axis protective skins (10) are provided on both sides of the X-axis slide (9).

4. The grinding and shaping equipment suitable for spherical diamond surfaces according to claim 2, characterized in that, The C-axis assembly (3) includes a C-axis rotation drive mechanism (11) and a C-axis clamp (12). The C-axis clamp (12) is mounted on the X-axis slide (9). The C-axis rotation drive mechanism (11) is mounted on the C-axis clamp (12). The grinding wheel (4) is mounted on the rotating end of the C-axis rotation drive mechanism (11).

5. The grinding and shaping equipment suitable for spherical diamond surfaces according to claim 1, characterized in that, The Z-axis assembly (5) includes a Z-axis linear drive mechanism and a Z-axis slide (13). The Z-axis linear drive mechanism is mounted on the upper part of the machine tool bed (1) along the Z-axis direction, and the Z-axis slide (13) is mounted on the moving end of the Z-axis linear drive mechanism.

6. The grinding and shaping equipment suitable for spherical diamond surfaces according to claim 5, characterized in that, Z-axis protective skins (14) are respectively provided on both sides of the Z-axis slide (13).

7. The grinding and shaping equipment for spherical diamond surfaces according to claim 5, characterized in that, The B-axis assembly (6) includes a B-axis rotation drive mechanism and a B-axis turntable (15). The B-axis rotation drive mechanism is mounted on the Z-axis slide (13), and the B-axis turntable (15) is mounted on the rotating end of the B-axis rotation drive mechanism.

8. The grinding and shaping equipment for spherical diamond surfaces according to claim 7, characterized in that, The tool shaft assembly (7) includes a tool shaft rotation drive mechanism (16) and a tool shaft fixture (17). The tool shaft fixture (17) is mounted on the B-axis rotary table (15), and the tool shaft rotation drive mechanism (16) is mounted on the tool shaft fixture (17). The workpiece is mounted on the rotating end of the tool shaft rotation drive mechanism (16).

9. A processing method using a grinding and shaping equipment suitable for spherical diamond surfaces as described in any one of claims 1-8, characterized in that, include: Phase 1, Phase 2, and Phase 3; The first stage is the step-by-step chamfering rapid surface forming stage. Based on the allowance distribution between the actual contour of the spherical CVD diamond blank and the target spherical contour, the first chamfering target contour is established, and the first chamfering angle, grinding depth and X-axis feed parameters are determined. During the processing, the rotation axis of the grinding wheel (4) and the rotation axis of the workpiece are kept in the same processing plane, and the included angle between the two axes is kept constant. The grinding wheel (4) and the workpiece rotate around their own rotation axis. At the same time, the X-axis assembly (2) drives the grinding wheel (4) to feed along the X-axis direction to complete the chamfering grinding, and prioritizes the removal of large allowance material at the edge of the spherical diamond blank. The second stage is the generating method grinding convergence stage. After the large amount of material at the edge of the first stage is removed, the process is switched to generating method to carry out spherical convergence forming. The workpiece posture is adjusted by the B-axis assembly (6) so that the cutting edge of the grinding wheel (4) and the spherical surface to be processed of the workpiece form a generating envelope posture. The C-axis assembly (3) is controlled to drive the grinding wheel (4) to rotate at high speed. The tool axis assembly (7) drives the spherical diamond workpiece to rotate at a constant speed around its own central axis. The spherical surface is generated by the cooperative rotational motion envelope of the cutting edge of the grinding wheel (4) and the workpiece. Only a small grinding allowance is set in this stage. The multi-segment broken line contour formed by the chamfering process in the first stage is continuously spherical convergence processed, and the segmented chamfer contour of the workpiece is gradually trimmed and transitioned into a continuous smooth spherical contour. The third stage is the trajectory envelope ultra-precision correction stage. Based on the target spherical contour, the motion trajectory of the grinding wheel (4) is generated. The X-axis assembly (2), Z-axis assembly (5), B-axis assembly (6), and C-axis assembly (3) are coordinated to realize the multi-axis linkage of the grinding wheel (4). The grinding wheel (4) performs envelope scanning grinding on the workpiece surface according to the preset trajectory. The residual low-frequency and medium-frequency contour errors on the workpiece surface are further corrected, driving the actual contour of the workpiece to converge further to the target spherical contour. At the same time, the residual subsurface damage depth of the spherical diamond is reduced, the spherical surface accuracy and surface quality are improved, and the efficient ultra-precision grinding of the spherical diamond component is completed.

10. A processing method for a grinding and shaping equipment suitable for spherical diamond surfaces according to claim 9, characterized in that, In the first stage of rapid chamfering surface forming, after a single chamfering grinding process is completed, the in-situ measurement system (8) is called to move to the measurement station to perform non-contact measurement on the current actual contour of the workpiece, obtain the actual machining contour data of the workpiece, compare the measured contour data with the target contour corresponding to this chamfering, and determine whether the preset contour requirements of this chamfering are met. If the measured result meets the target contour of this chamfering, it is determined that this chamfering grinding is completed. The remaining machining allowance is recalculated based on the current actual contour, and the target contour of the next chamfering process is planned. If the measured result does not meet the target contour of this chamfering, the machining compensation amount is calculated based on the contour error, and the machining parameters of the chamfering angle, grinding depth, and X-axis feed amount corresponding to this chamfering are compensated and corrected. This chamfering grinding process continues until the target contour requirements of this chamfering are met.

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