A multi-station full-automatic metallographic sample grinding and polishing system

Abstract

The present application belongs to the technical field of metallographic preparation, and particularly relates to a multi-station full-automatic metallographic sample grinding and polishing system, which aims to solve the problems of low efficiency and poor consistency caused by manual operation in the prior art. The present application comprises an automatic grabbing mechanism arranged in a first mounting space, which is used for clamping and moving a clamping disc. A cross beam is horizontally fixed on a mounting plate. A movement mechanism can drive the automatic grabbing mechanism to move along the axis direction of the cross beam. A multi-station module is provided with an independent motor and a grinding and polishing disc or a cleaning tank, which can grind, polish and clean the workpiece in the clamping disc. A control mechanism integrates a PLC or an embedded system, which is used for adjusting the grinding and polishing parameters of the multi-station module, the work station switching sequence and the flow control of the automatic liquid dropping device. The multi-station full-automatic grinding and polishing machine is completely automated, which can save the labor cost and the time wasted by human-machine alternation, greatly improve the work efficiency, and make the operation of the control system interface convenient and the operation effect of the whole machine more reliable.

Description

Technical Field

[0001] This invention belongs to the field of metallographic preparation technology, specifically relating to a multi-station fully automatic metallographic sample grinding and polishing system. Background Technology

[0002] Metallographic examination is an important physical testing item for metallic materials. It is mainly used to detect and evaluate non-metallic inclusions, carbides, metallographic structures, etc. in materials. The preparation of metallographic samples includes steps such as sampling, mounting, grinding, polishing, and etching. Among them, the grinding and polishing process is the key step in preparing a flat and smooth sample surface.

[0003] For many years, metallographic sample preparation has relied heavily on manual grinding and polishing. The polishing effect is closely related to the individual's sample preparation experience, which is not only time-consuming and labor-intensive but also poses certain safety hazards. With the advancement of technology, metallographic sample preparation is developing towards automation and multi-functional integration. Various semi-automatic and automatic grinding and polishing machines have appeared on the market: single-disc semi-automatic grinding and polishing machines require stopping the machine to change sandpaper or polishing cloth; double-disc grinding and polishing machines require manually moving the grinding and polishing head to the polishing position after grinding and then setting the polishing parameters; other types of integrated grinding and polishing machines have disadvantages such as huge structure, non-automatic connection and conversion of multiple grinding processes, need for manual clamping of workpieces, uneven grinding and polishing surfaces, and high cost. Summary of the Invention

[0004] To address the problems of low efficiency and poor consistency caused by reliance on manual operation in existing technologies, this invention provides a multi-station fully automated metallographic sample grinding and polishing system, comprising:

[0005] The body includes a first mounting space and a second mounting space, and a mounting plate is provided between the first mounting space and the second mounting space;

[0006] An automatic gripping mechanism is provided within the first installation space for gripping and moving the gripping disc;

[0007] A crossbeam is horizontally fixed within the first installation space, and both ends are fixed to the mounting plate by support frames.

[0008] A motion mechanism is connected to the automatic gripping mechanism, and the motion mechanism can drive the automatic gripping mechanism to move along the axial direction of the crossbeam;

[0009] The multi-station module includes loading and unloading stations, semi-fine grinding stations, fine grinding stations, cleaning stations, semi-fine polishing stations, and fine polishing stations set on the mounting plate. The multi-station module is equipped with an independent motor and a grinding and polishing disc or a cleaning tank. The multi-station module can grind, polish, and clean the workpiece in the clamping disc.

[0010] The control mechanism, integrating a PLC or embedded system, is used to adjust the grinding and polishing parameters of the multi-station module, the station switching sequence, and the flow control of the automatic dripping device.

[0011] A multi-station fully automatic metallographic sample grinding and polishing system provided according to some embodiments of this application further includes a guide rail, a slider, and a moving body;

[0012] The guide rail is fixedly installed along the axial direction of the crossbeam, the moving body is mounted on the guide rail via the slider, and the motion mechanism can drive the moving body to move along the laying direction of the guide rail.

[0013] According to some embodiments of this application, a multi-station fully automatic metallographic sample grinding and polishing system is provided. The motion mechanism includes a rack, a gear, and a drive motor. The rack is arranged on the crossbeam along the axial direction. The drive motor is arranged on the moving body. The output end of the drive motor is provided with the gear, which meshes with the rack. The drive motor drives the moving body to move along the axial direction of the guide rail.

[0014] According to some embodiments of this application, a multi-station fully automatic metallographic sample grinding and polishing system is provided, wherein the automatic gripping mechanism includes a housing, a cylinder, a stepper motor, a worm gear mechanism, a grinding and polishing spindle, a linear guide rail, and a moving base;

[0015] The movable seat is mounted on the movable body via the linear guide rail. The cylinder is fixedly mounted on the top of the movable body. The telescopic end of the cylinder is connected to the movable seat and controls the movable seat to move on the movable body. The stepper motor and worm gear mechanism are fixed on the movable seat. The output end of the stepper motor is drivenly connected to one end of the grinding and polishing spindle via the worm gear mechanism. The other end of the grinding and polishing spindle is fixedly connected to the clamping plate via a locking assembly.

[0016] According to some embodiments of this application, a multi-station fully automatic metallographic sample grinding and polishing system is provided, wherein the locking assembly includes an electromagnet and a locking jacket;

[0017] A locking hole is provided at one end of the grinding and polishing spindle near the clamping plate. The locking sleeve is coaxially disposed outside the grinding and polishing spindle. The electromagnet is also disposed outside the end of the grinding and polishing spindle near the clamping plate.

[0018] The clamping plate is provided with a locking pressure plate, and the locking head on the locking pressure plate is adapted to the locking hole of the grinding and polishing spindle and the locking sleeve.

[0019] According to some embodiments of this application, a multi-station fully automatic metallographic sample grinding and polishing system is provided, wherein the semi-fine grinding station is equipped with coarse sandpaper or diamond grinding wheel, the fine grinding station is equipped with medium-grit sandpaper or diamond grinding disc, the semi-fine polishing station is equipped with fine-grit polishing cloth or polishing disc, and the fine polishing station is equipped with high-precision polishing cloth or mirror polishing disc.

[0020] According to some embodiments of this application, a multi-station fully automatic metallographic sample grinding and polishing system is provided, which also includes photoelectric induction switches. Multiple photoelectric induction switches are provided and are configured corresponding to the multi-station module.

[0021] According to some embodiments of this application, a multi-station fully automatic metallographic sample grinding and polishing system is provided, wherein the automatic liquid dripping device is provided in three sets, and the automatic liquid dripping device is connected to the bamboo-joint water pipe through a corresponding water pump, and the outlet of the bamboo-joint water pipe is aligned with the working area of ​​the multi-station module.

[0022] The beneficial effects of this invention are:

[0023] The existing technology relies on manual operation, which results in low efficiency and poor consistency. The multi-station fully automatic grinding and polishing machine is fully automated, saving labor costs and time wasted on human-machine interaction. The automatic loading and unloading uses quick connectors, which makes the workpiece clamping speed faster and greatly improves the working efficiency. The control system interface is easy to operate, and the overall machine operation is more reliable.

[0024] The six-station fully automatic grinding and polishing machine design adds an automatic loading and unloading station to the traditional five-station configuration. The automatic loading and unloading mechanism ensures uniform force on each workpiece during clamping, achieving consistency in sample clamping and avoiding the unevenness of the polished surface caused by traditional manual clamping. Then, grinding and polishing parameters such as pressure, speed, and time are controlled according to material characteristics and process requirements to further ensure the consistency of processing quality for each workpiece. Therefore, the six-station design integrates automatic loading and unloading, grinding and polishing, and cleaning functions, forming a complete fully automated sample preparation process. This avoids manual operation and multiple equipment switching, achieving continuous and automated sample preparation, reducing manual intervention, lowering labor intensity, significantly shortening the processing cycle, and improving overall work efficiency. It also avoids errors caused by manual operation, improving the quality of sample preparation, while reducing the randomness introduced by human operation, improving the reliability and repeatability of sample preparation. Furthermore, it significantly enhances the integration and intelligence level of the equipment, effectively meeting the needs of high-volume, high-efficiency sample preparation.

[0025] Multi-station collaborative operation integrates loading and unloading, grinding and polishing, and cleaning processes into one device, reducing the space occupied in the laboratory or production line and significantly improving operational efficiency and equipment utilization. Attached Figure Description

[0026] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0027] Figure 1 This is a schematic diagram of the overall structure of some embodiments of this application;

[0028] Figure 2 This is a cross-sectional view of an automatic gripping mechanism of some embodiments of this application assembled onto a crossbeam;

[0029] Figure 3 This is an overall structural diagram of the automatic gripping mechanism of some embodiments of this application after the shell has been removed;

[0030] Figure 4 This is a schematic diagram of the internal structure of some embodiments of this application.

[0031] In the diagram: 101. First installation space; 102. Second installation space; 1. Control mechanism; 2. Loading / unloading station; 3. Clamping plate; 31. Locking pressure plate; 4. Semi-fine grinding station; 5. Fine grinding station; 6. Cleaning station; 7. Semi-fine polishing station; 8. Fine polishing station; 9. Photoelectric sensor switch; 10. Automatic gripping mechanism; 1001. Housing; 1002. Cylinder; 1003. Stepper motor; 1004. Worm gear. 1005. Grinding and polishing spindle; 1006. Electromagnet; 1007. Locking sleeve; 1008. Linear guide rail; 1009. Moving seat; 11. Automatic dripping device; 111. Water pump; 112. Bamboo-joint water pipe; 12. Crossbeam; 13. Safety light curtain; 14. Limit block; 15. Rack; 16. Gear; 17. Drive motor; 18. Guide rail; 19. Slider; 20. Moving body. Detailed Implementation

[0032] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0033] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0034] like Figure 1-4 As shown, the present invention provides a multi-station fully automatic metallographic sample grinding and polishing system, comprising:

[0035] The body includes a first mounting space 101 and a second mounting space 102, and a mounting plate is provided between the first mounting space 101 and the second mounting space 102.

[0036] An automatic gripping mechanism 10 is set in the first installation space 101 and is used to grip and move the gripping disk 3.

[0037] The crossbeam 12 is horizontally fixed within the first installation space 101, and both ends are fixed to the mounting plate by support frames.

[0038] The motion mechanism is connected to the automatic gripping mechanism 10, and the motion mechanism can drive the automatic gripping mechanism 10 to move along the axis of the crossbeam 12.

[0039] The multi-station module includes loading and unloading station 2, semi-fine grinding station 4, fine grinding station 5, cleaning station 6, semi-fine polishing station 7 and fine polishing station 8 set on the mounting plate. The multi-station module is equipped with an independent motor and a grinding and polishing disc or cleaning tank. The multi-station module can grind, polish and clean the workpiece in the clamping disc 3.

[0040] The control mechanism 1, which integrates a PLC or embedded system, is used to adjust the grinding and polishing parameters of the multi-station module, the station switching sequence, and the flow control of the automatic dripping device 11.

[0041] In practice, the body serves as the framework support and carrier of the system as a whole. It is divided into a first installation space 101 and a second installation space 102 that are stacked vertically by the mounting plate. Each installation space is equipped with an outer shell. The front side of the second installation space 102 located at the bottom can be set as an openable cabinet door.

[0042] A horizontal beam 12 is provided on the mounting plate, extending horizontally from the left side plate to the right side plate, with both ends fixed to the left and right sides respectively. The rear side of the beam 12 abuts against the rear plate of the machine body, which also serves to fix the beam 12. The left end of the bottom of the beam 12 is supported on the mounting plate by a left support frame, and the right end of the bottom of the beam 12 is supported on the mounting plate by a right support frame. The mounting plate also serves to fix the beam 12.

[0043] Safety light curtains 13 are installed on the left and right side panels. During automatic operation, the light curtains on both sides of the equipment will detect if a person or object enters. The equipment will automatically stop and an alarm will pop up on the screen.

[0044] The control mechanism 1 is a programmable logic controller (PLC) or an embedded control system. The control mechanism 1 automatically adjusts the polishing parameters through real-time data acquisition. The polishing parameters include polishing pressure, speed, polishing fluid flow rate, cleaning fluid temperature, and other parameters, to achieve fully automated operation. It can control the polishing pressure applied to the sample and automatically maintain a constant pressure.

[0045] According to different process requirements, all grinding and polishing parameters such as the speed of each motor, grinding and polishing time, rotation direction, and water valve switch can be controlled. These parameters can be set, automatically saved, and easily recalled. The liquid spraying of the cleaning station 6 is started, and the automatic dripping device 11 of three different polishing liquids is controlled to supply liquid to the designated station as needed.

[0046] The automatic dripping device 11 is provided in three sets. The automatic dripping device 11 is connected to the bamboo joint water pipe 112 through the corresponding water pump 111. The water outlet of the bamboo joint water pipe 112 is aligned with the working area of ​​the multi-station module. The automatic dripping device 11 provides precise and efficient cooling, lubrication and surface treatment support during the polishing process, thereby improving the processing quality, stability and efficiency.

[0047] The system controls the sequence of grinding, polishing, cleaning, and workpiece movement at multiple workstations. The workstation switching sequence includes the sequence of the automatic gripping mechanism 10 and the clamping plate 3 at workstations such as loading / unloading station 2, semi-fine grinding station 4, fine grinding station 5, cleaning station 6, semi-fine polishing station 7, and fine polishing station 8, ensuring that tasks such as cleaning and grinding / polishing start and stop at the correct time. After the task at each workstation is completed, the system controls the workpiece to automatically move to the next workstation.

[0048] The precise position of the workpiece and the clamping plate 3 is determined by sensor feedback (such as photoelectric switch), the position of the rotary table is adjusted so that the clamping plate 3 is aligned with the grinding and polishing spindle 1005, and the cylinder 1002, stepper motor 1003 and other components are driven to automatically complete the gripping, placement and release of the workpiece.

[0049] It provides a user-friendly touchscreen interface for starting, stopping, setting parameters, and viewing status. Users can customize grinding and polishing speeds, pressures, and cleaning times according to different workpiece requirements.

[0050] In some embodiments, the system also includes a guide rail 18, a slider 19, and a movable body 20;

[0051] The guide rail 18 is fixedly installed along the axis of the crossbeam 12. The moving body 20 is installed on the guide rail 18 via the slider 19. The motion mechanism can drive the moving body 20 to move along the laying direction of the guide rail 18.

[0052] The motion mechanism includes a rack 15, a gear 16, and a drive motor 17. The rack 15 is arranged on the crossbeam 12 along the axial direction, and the drive motor 17 is arranged on the moving body 20. The output end of the drive motor 17 is provided with a gear 16, which meshes with the rack 15. The drive motor 17 drives the moving body 20 to move along the axial direction of the guide rail 18.

[0053] In specific implementation, two guide rails 18 are provided, and a rack 15 is set between the two guide rails. The guide rails 18 and the rack 15 are set parallel to each other. The extension length of the rack 15 is the same as the length of the crossbeam 12. Limit blocks 14 are set at both the beginning and end of the extension of the rack 15. Multiple sliders 19 are set on the moving body 20. The sliders 19 are provided with grooves. The groove openings extend horizontally and are inserted into the guide rails 18. The drive motor 17 is set on the moving body 20. The drive shaft of the drive motor 17 passes through the moving body 20 from front to back. The drive motor 17 drives the gear 16 to rotate. Through the meshing of the gear 16 and the rack 15, the moving body 20 slides horizontally along the guide rails 18 via the sliders 19. When the moving body 20 slides along the guide rails 18, it drives the device set on it to move synchronously. When the automatic gripping mechanism 10 moves horizontally on the rack 15, it provides stable horizontal movement through the two upper and lower guide rails 18, and at the same time bears the weight of the entire automatic gripping mechanism 10, further improving the polishing quality.

[0054] In some embodiments, the automatic gripping mechanism 10 includes a housing 1001, a cylinder 1002, a stepper motor 1003, a worm gear mechanism 1004, a grinding and polishing spindle 1005, a linear guide rail 1008, and a moving seat 1009.

[0055] The movable seat 1009 is mounted on the movable body 20 via a linear guide rail 1008. The cylinder 1002 is fixedly mounted on the top of the movable body 20. The telescopic end of the cylinder 1002 is connected to the movable seat 1009 and controls the movable seat 1009 to move on the movable body 20. The stepper motor 1003 and the worm gear mechanism 1004 are fixed on the movable seat 1009. The output end of the stepper motor 1003 is connected to one end of the grinding and polishing spindle 1005 via the worm gear mechanism 1004. The other end of the grinding and polishing spindle 1005 is fixedly connected to the clamping plate 3 via a locking assembly.

[0056] In specific implementation, the longitudinally arranged linear guide rail 1008 is set on the moving body 20. The cylinder 1002 is used to control the device on the moving seat 1009 to move longitudinally on the linear guide rail 1008. The moving seat 1009 drives the stepper motor 1003, the worm gear mechanism 1004 and the grinding and polishing spindle 1005 to move synchronously. The stepper motor 1003 is connected to the grinding and polishing spindle 1005 through the worm gear mechanism 1004, so that the grinding and polishing spindle 1005 rotates. The housing 1001 is covered outside the automatic gripping mechanism 10.

[0057] In some embodiments, the locking assembly includes an electromagnet 1006 and a locking sleeve 1007. A locking hole is provided at one end of the grinding and polishing spindle 1005 near the clamping plate 3. The locking sleeve 1007 is coaxially disposed outside the grinding and polishing spindle 1005. An electromagnet 1006 is also provided outside the end of the grinding and polishing spindle 1005 near the clamping plate 3.

[0058] The clamping plate 3 is provided with a locking pressure plate 31, and the locking head on the locking pressure plate 31 is adapted to the locking hole and locking sleeve 1007 of the grinding and polishing spindle 1005.

[0059] In practice, the piston rod of cylinder 1002 presses down, driving the grinding and polishing components, such as the grinding and polishing spindle 1005, to move downward under the guidance of the linear guide rail 1008. The end of the grinding and polishing spindle 1005 is inserted into the locking head, and the locking head engages with the locking hole at the end of the grinding and polishing spindle 1005. When the electromagnet 1006 is energized, it releases the clamping disc 3, and when it is de-energized, it locks it. When the electromagnet 1006 is de-energized, the grinding and polishing spindle 1005 locks itself to the locking head through the locking sleeve 1007, thus completing the gripping of the clamping disc 3. After gripping, the piston rod of cylinder 1002 moves upward, the grinding and polishing spindle 1005 moves upward with the piston rod, and drives the locking head after clamping, which in turn drives the clamping plate 3 to move upward under the guidance of the linear guide rail 1008, and drives the clamping plate 3 away from the worktable. After the clamping plate 3 is gripped and leaves the worktable, the motion mechanism drives the automatic gripping mechanism 10 with the clamping plate 3 to move along the crossbeam 12, so that the workpiece in the clamping plate 3 passes one by one through the positions of the grinding and polishing mechanism and the cleaning mechanism on the base plate. Optionally, the grinding and polishing spindle 1005 with the clamping plate 3 grips the workpiece. Cylinder 1002 does not need to be lifted. The motion mechanism drives the clamping plate 3 to move directly from the worktable to the next station. Cylinder 1002 presses down again, placing the clamping disc 3 within the working area of ​​the polishing or cleaning mechanism. Stepper motor 1003 drives worm gear mechanism 1004 to rotate polishing spindle 1005, which in turn rotates the clamping disc 3 locked on polishing spindle 1005. The polishing and cleaning mechanisms then perform corresponding polishing and cleaning treatments on the workpieces one by one, completing the workpiece sample preparation. Then, cylinder 1002 lifts up again, moving the clamping disc 3 away from the polishing or cleaning mechanism after sample preparation. The motion mechanism drives the automatic gripping mechanism 10, which holds the clamping disc 3 after sample preparation, to move in the opposite direction along the crossbeam 12, returning it to its position on the worktable. The clamping disc 3 on polishing spindle 1005 is now aligned with the empty space on the worktable where the clamping disc 3 left. Electromagnet 1006 is de-energized, the polishing spindle 1005 releases from the locking head, and the locking head falls to separate from the polishing spindle 1005. The clamping disc 3, after sample preparation, returns to its original position on the worktable. The worktable rotates so that the next clamping plate 3 is positioned in the position of the previous clamping plate 3 after the sample preparation is completed, thereby completing the sample preparation of all workpieces in the clamping plates 3 one by one.

[0060] In some embodiments, the semi-fine grinding station 4 is provided with coarse sandpaper or diamond grinding wheel, the fine grinding station 5 is provided with medium grit sandpaper or diamond grinding disc, the semi-fine polishing station 7 is provided with fine grit polishing cloth or polishing disc, and the fine polishing station 8 is provided with high precision polishing cloth or mirror polishing disc.

[0061] In practice, from right to left, there are six stations: loading and unloading station 2, semi-fine grinding station 4, fine grinding station 5, cleaning station 6, semi-fine polishing station 7, and fine polishing station 8. These six stations are set on the mounting plate and each station is equipped with a corresponding motor. The motors are hidden in the cavity structure of the second mounting space 102. The automatic gripping mechanism 10 passes through each station in sequence under the action of the motion mechanism to complete the processing at the corresponding station.

[0062] Semi-fine grinding station 4 is equipped with coarse sandpaper or diamond grinding wheels. This allows for rapid surface roughness adjustment of the workpiece, removing oxide layers, scratches, or impurities.

[0063] The fine grinding station 5 uses medium-grit sandpaper or diamond grinding discs. After the semi-fine grinding is completed, the workpiece is transferred to the fine grinding station 5 to remove the small scratches left after the semi-fine grinding and further improve the surface smoothness.

[0064] Semi-finish polishing station 7 is equipped with fine-grit polishing cloth or polishing disc. After fine grinding, the workpiece is sent to semi-finish polishing station 7 to remove microscopic defects left by fine grinding and initially improve surface gloss and uniformity.

[0065] The fine polishing station 8 uses a high-precision polishing cloth or a mirror polishing disc. After semi-fine polishing, the workpiece is sent to the fine polishing station 8 to further eliminate microscopic unevenness on the surface and achieve a mirror effect. In this way, each sample can be ground to the same plane efficiently and quickly.

[0066] Cleaning station 6 is equipped with a cleaning tank containing cleaning fluid. After polishing, the workpiece is transferred to cleaning station 6 by an automatic gripping mechanism 10. The cleaning fluid removes residual polishing fluid and tiny particles from the surface of the workpiece through ultrasonic action.

[0067] Semi-fine grinding station 4, fine grinding station 5, semi-fine polishing station 7, and fine polishing station 8 are each equipped with a polishing disc that is fixedly connected to the motor shaft. Both the disc and the polishing spindle 1005 rotate, and the workpiece and the abrasive make relative rotational contact, achieving a highly efficient and uniform polishing effect. The polishing disc uses a servo motor, which is stable and reliable. The polishing disc can start and stop quickly and has a wide speed range, from 5 rpm to 1500 rpm. The polishing disc is fixed in place by a threaded or snap-fit ​​mechanism to ensure that it will not loosen during operation.

[0068] Above each workstation is a photoelectric sensor switch 9. Six photoelectric sensor switches 9 are set on the crossbeam 12, and the positions of the six photoelectric sensor switches 9 correspond to the positions of the six workstations. Each workstation is locked by the photoelectric sensor switch 9 and then runs automatically, completing one workstation and automatically moving to the next workstation. It is stable and reliable until it returns to the designated workstation as instructed. The sensor locates the current workpiece status, and the control system sends a signal to drive the motion mechanism to transfer the workpiece to the designated workstation in sequence, ensuring a continuous and efficient processing flow. The cavity structure of the second installation space 102 is provided with a pre-installation area, where multiple clamping components can be placed. After the clamping disks 3 on the worktable have all been sampled, they can be easily picked up and placed directly onto the worktable.

[0069] In the description of this invention, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0070] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0071] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent in such process, method, article, or apparatus / device.

[0072] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A multi-station fully automatic metallographic sample grinding and polishing system, characterized in that, include: The body includes a first mounting space and a second mounting space, and a mounting plate is provided between the first mounting space and the second mounting space; An automatic gripping mechanism is provided within the first installation space for gripping and moving the gripping disc; A crossbeam is horizontally fixed within the first installation space, and both ends are fixed to the mounting plate by support frames. A motion mechanism is connected to the automatic gripping mechanism, and the motion mechanism can drive the automatic gripping mechanism to move along the axial direction of the crossbeam; The multi-station module includes loading and unloading stations, semi-fine grinding stations, fine grinding stations, cleaning stations, semi-fine polishing stations, and fine polishing stations set on the mounting plate. The multi-station module is equipped with an independent motor and a grinding and polishing disc or a cleaning tank. The multi-station module can grind, polish, and clean the workpiece in the clamping disc. The control mechanism, integrating a PLC or embedded system, is used to adjust the grinding and polishing parameters of the multi-station module, the station switching sequence, and the flow control of the automatic dripping device.

2. The multi-station fully automatic metallographic sample grinding and polishing system according to claim 1, characterized in that, It also includes guide rails, sliders, and moving parts; The guide rail is fixedly installed along the axial direction of the crossbeam, the moving body is mounted on the guide rail via the slider, and the motion mechanism can drive the moving body to move along the laying direction of the guide rail.

3. The multi-station fully automatic metallographic sample grinding and polishing system according to claim 2, characterized in that, The motion mechanism includes a rack, a gear, and a drive motor. The rack is arranged on the crossbeam along the axial direction, the drive motor is arranged on the moving body, and the output end of the drive motor is provided with the gear. The gear meshes with the rack, and the drive motor drives the moving body to move along the axial direction of the guide rail.

4. The multi-station fully automatic metallographic sample grinding and polishing system according to claim 3, characterized in that, The automatic gripping mechanism includes a housing, a cylinder, a stepper motor, a worm gear mechanism, a grinding and polishing spindle, a linear guide rail, and a moving base; The movable seat is mounted on the movable body via the linear guide rail. The cylinder is fixedly mounted on the top of the movable body. The telescopic end of the cylinder is connected to the movable seat and controls the movable seat to move on the movable body. The stepper motor and worm gear mechanism are fixed on the movable seat. The output end of the stepper motor is drivenly connected to one end of the grinding and polishing spindle via the worm gear mechanism. The other end of the grinding and polishing spindle is fixedly connected to the clamping plate via a locking assembly.

5. The multi-station fully automatic metallographic sample grinding and polishing system according to claim 4, characterized in that, The locking assembly includes an electromagnet and a locking sleeve; A locking hole is provided at one end of the grinding and polishing spindle near the clamping plate. The locking sleeve is coaxially disposed outside the grinding and polishing spindle. The electromagnet is also disposed outside the end of the grinding and polishing spindle near the clamping plate. The clamping plate is provided with a locking pressure plate, and the locking head on the locking pressure plate is adapted to the locking hole of the grinding and polishing spindle and the locking sleeve.

6. The multi-station fully automatic metallographic sample grinding and polishing system according to claim 1, characterized in that, The semi-fine grinding station is equipped with sandpaper or diamond grinding wheel, the fine grinding station is equipped with sandpaper or diamond grinding disc, the semi-fine polishing station is equipped with polishing cloth or polishing disc, and the fine polishing station is equipped with polishing cloth or mirror polishing disc.

7. The multi-station fully automatic metallographic sample grinding and polishing system according to claim 6, characterized in that, It also includes photoelectric sensor switches, of which multiple photoelectric sensor switches are provided and are configured corresponding to the multi-station module.

8. A multi-station fully automatic metallographic sample grinding and polishing system according to claim 6, characterized in that, The automatic dripping device is provided in three sets. The automatic dripping device is connected to the bamboo-shaped water pipe through a corresponding water pump. The water outlet of the bamboo-shaped water pipe is aligned with the working area of ​​the multi-station module.

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