Hemispherical resonator ring elastic polishing tool and method

Abstract

The application belongs to the technical field of hemispherical resonator gyroscopes, and relates to a hemispherical resonator ring elastic polishing tool and method. The hemispherical resonator ring elastic polishing tool comprises a polisher base body, a pre-tightening force adjusting stud, a flat-end pair of top springs, a sliding sleeve, a limiting pin, a limiting bolt, a quick-change adapter, a quick-change adapter fixing screw, a polishing die, a polishing die fixing screw, a polishing material and a hemispherical resonator. A new type of annular elastic polishing tool for the inner and outer spherical surfaces of the hemispherical resonator is designed, so that high-efficiency and high-precision polishing of the hemispherical resonator is realized.

Description

Technical Field

[0001] This invention belongs to the technical field of hemispherical resonator gyroscopes, and relates to an elastic polishing tool and method for a hemispherical resonator ring. Background Technology

[0002] The hemispherical resonator gyroscope (HRG) is simple in structure, has few parts, is small in size, light in weight, high in precision, and low in manufacturing cost. It also has good stability, shock resistance, and temperature characteristics. The HRG uses the Coriolis effect to sense angle or angular velocity, and the hemispherical harmonic oscillator is its core sensing component.

[0003] The quality factor (Q value) is a key objective in the manufacture of hemispherical resonators and is one of their most important parameters. Typically, the Q value is primarily determined by the mechanical energy loss of the resonator. After precision machining, surface damage is inevitable on the resonator's surface, which significantly increases energy loss. To mitigate the Q value reduction caused by this surface damage, optical polishing and chemical cleaning are usually performed on the inner and outer spherical shells of the resonator after precision grinding, thereby reducing surface damage and improving surface finish.

[0004] Low cost is an advantage of hemispherical resonator gyroscopes, but if they lose this advantage, they will struggle to survive in the competitive market compared to mature laser gyroscopes, fiber optic gyroscopes, and future MEMS gyroscopes. Therefore, low-cost manufacturing is a prerequisite for the development of hemispherical resonator gyroscopes in China. However, the current manufacturing cost of domestic hemispherical resonator gyroscopes lags far behind advanced levels in Europe and America. In particular, the hemispherical resonator, as the core component of the hemispherical resonator gyroscope, suffers from high manufacturing cycles and costs, severely restricting the improvement of manufacturing efficiency and the reduction of manufacturing costs. For example, in the hemispherical resonator polishing process, polishing one hemispherical resonator typically requires a high-value machine to continuously polish for 1 to 3 days. Assuming an average output of 2 days per piece, and 300 working days per year, one machine can produce 150 hemispherical resonators annually. Based on an annual demand of 10,000 sets of gyroscopes, approximately 67 high-value machines are needed just for hemispherical resonator polishing. In contrast, for the same demand of 10,000 sets of mature laser gyroscopes, the manufacturing process for all core optical components such as the laser gyroscope cavity and reflectors requires no more than 60 high-value pieces of equipment. Therefore, the data comparison above shows that, given the extremely low polishing efficiency of hemispherical resonators, their manufacturing cost advantage has been lost. Thus, improving manufacturing efficiency and reducing manufacturing costs has become a bottleneck in the current engineering development of hemispherical resonator gyroscopes in China.

[0005] Furthermore, precision polishing of hemispherical resonators is a challenging process, primarily due to the unique structure of the hemispherical resonator, the hardness and brittleness of the material, and the high precision requirements. During polishing, because of its complex structural features such as a steep spherical surface, thin walls, and irregular shape, the design of the polishing mold must avoid interference with the machining of the central support rod. Additionally, there are polishing "dead angles" at the arc transition where the support rod intersects the spherical surface; to ensure polishing accuracy, the polishing mold must employ a special rounded corner design and manufacturing. The resonator components are thin-walled and the material is hard and brittle; improper machining forces can easily lead to component breakage. This necessitates that the polishing tools be designed with a certain degree of flexibility to avoid rigid contact. Moreover, because hemispherical resonators have sub-micron level ultra-high precision requirements, significant uneven force during polishing can severely compromise the polishing accuracy, requiring strict control of the process parameters.

[0006] Currently, there are many polishing tools and methods available in China for the inner and outer spherical surfaces of hemispherical harmonic oscillators. Among them, the most typical polishing scheme for hemispherical harmonic oscillators is the generating method of spherical surface forming and polishing, such as... Figure 1 As shown (excerpted from patent CN 209579177). This polishing method is commonly used for traditional spherical parts and usually achieves good polishing results. However, due to the special characteristics of hemispherical resonators, such as their thin shells, brittle fracture, and irregular shapes, polishing hemispherical resonators is extremely difficult. Traditional spherical polishing methods struggle to simultaneously achieve uniform polishing of the spherical surface and the radius (R-angle) of the root of the resonator, and it is also difficult to address the deterioration in polishing accuracy due to assembly precision issues. The polishing tool described in patent CN 209579177 consists of a simple spring structure mounted on a rigid body to ensure sufficient flexibility during the polishing process. However, this polishing tool structure lacks adjustment and control of the polishing preload, making it difficult to achieve precise control of the polishing load. This not only affects the polishing accuracy but also frequently causes the thin shell of the hemispherical resonator to fracture, resulting in an extremely low yield rate for polished hemispherical resonators.

[0007] Other domestic organizations also use the small-ball-head magnetohydrodynamic polishing method. This polishing method requires extremely high precision in the movement of the polishing equipment and the manufacturing of the polishing tools. Not only is the equipment expensive and the tool manufacturing cost high, but the polishing process involves removing material point by point, resulting in extremely low polishing efficiency. It typically takes more than two days to polish a single resonator. This violates the prerequisite of high-efficiency and low-cost manufacturing of hemispherical resonators.

[0008] Whether using the generating method for polishing or the small-ball-head magnetohydrodynamic polishing method, the polishing process of hemispherical harmonic oscillators places extremely high demands on the polishing tools, and the design of the polishing tools has a great impact on the polishing accuracy. Summary of the Invention

[0009] The technical problem solved by this invention is to achieve high-efficiency and high-precision polishing of hemispherical resonators by designing a novel annular elastic polishing tool for the inner and outer spherical surfaces of the hemispherical resonator.

[0010] The technical solution of the present invention:

[0011] On one hand, the present invention provides a hemispherical harmonic oscillator elastic floating polishing tool, comprising:

[0012] 1. Polisher base; 2. Preload adjusting stud; 3. Flat-end top spring; 4. Sliding sleeve; 5. Limiting pin; 6. Limiting bolt; 7. Quick-change adapter; 8. Quick-change adapter fixing screw; 9. Polishing mold fixing screw; 10. Polishing material; 11. Hemispherical resonator; 12.

[0013] The polisher base is provided with an annular limiting groove a for positioning the flat-end top spring; the polisher base has a threaded hole in the center for installing a preload adjusting stud; the front end of the polisher base is provided with a high-precision cylindrical surface for high-precision sliding fit with the sliding sleeve; the polisher base is provided with a "U" shaped groove b for interference fit installation of a limiting pin.

[0014] The limiting bolt is located at the top of the sliding sleeve, and its tail end is threadedly connected and fixed to the preload adjusting stud.

[0015] The quick-change adapter is located at the top of the sliding sleeve, and its lower end face fits against the upper end face of the sliding sleeve. The quick-change adapter has three screw mounting holes evenly distributed on the circumference for connecting the quick-change adapter and the sliding sleeve with quick-change adapter fixing screws. The front end of the quick-change adapter has a cylindrical step for connecting with the polishing mold.

[0016] The quick-change adapter fixing screw is used to connect and fix the quick-change adapter and the sliding sleeve.

[0017] The polishing mold is provided with a through hole for installation and fixation with the cylindrical step of the quick-change adapter through clearance fit; the polishing mold is provided with 3 screw holes evenly distributed in the circumferential direction;

[0018] The polishing mold fixing screws are used to connect and fix the polishing mold and the quick-change adapter.

[0019] The polishing material is bonded to the polishing mold.

[0020] Furthermore,

[0021] The preload adjusting stud is located inside the polisher base and is screwed in from the back of the polisher base; the front end of the preload adjusting stud is provided with a threaded hole for connection with the limit bolt.

[0022] Furthermore,

[0023] The flat-end top spring is located in the annular limiting groove a of the polisher base. The lower end face of the flat-end top spring is in contact with the bottom surface of the annular limiting groove of the polisher base, and the upper end face of the flat-end top spring is in contact with the bottom surface d of the cylindrical blind hole of the sliding sleeve.

[0024] Furthermore,

[0025] The sliding sleeve is provided with a high-precision cylindrical hole for sliding engagement with the front end high-precision cylindrical surface of the polisher base; the sliding sleeve is provided with open "U"-shaped grooves c on both sides for sliding engagement with the limit pin; the front end of the sliding sleeve is provided with a through hole for the limit bolt to be connected and fixed to the preload adjusting stud through the through hole; the top end of the sliding sleeve is provided with 3 threaded holes evenly distributed in the circumferential direction.

[0026] Furthermore,

[0027] The limiting pin is installed in the "U"-shaped groove of the polisher base by interference fit.

[0028] Furthermore,

[0029] The polishing material is a polishing felt, damping cloth, or polyurethane.

[0030] On the other hand, the present invention also provides a method for elastic polishing of a hemispherical harmonic oscillator ring, wherein the polishing method is performed using the aforementioned polishing tool and includes the following process:

[0031] Step 1: Set the polishing pressure F;

[0032] Step 2: Adjust the preload adjusting stud to apply the preload, and the length of the facility to which the preload is applied is x;

[0033] Step 3: Install the ring elastic polishing tool on the machine tool spindle. The machine tool spindle drives the ring elastic polishing tool to rotate around the center of rotation. Use a dresser to dress the polishing material at the end of the ring elastic polishing tool.

[0034] Step 4: Clamp the hemispherical resonator on the clamping fixture of the processing equipment. The clamping fixture is located on the workpiece spindle of the equipment. The central axis of the turntable coincides with the cylindrical axis of the hemispherical resonator. Thus, the rotation of the turntable drives the hemispherical resonator to rotate.

[0035] Step 5: Determine the coordinates of the center of the hemispherical harmonic oscillator to be polished as (X... p ,Y p Z p Adjust the machine tool spindle so that the rotation center of the ring elastic polishing tool always passes through the sphere's center coordinate (X). p ,Y p Z p );

[0036] Step 6: Adjust the angle Ψ of the ring elastic polishing tool relative to the workpiece spindle, and adjust the ring elastic polishing tool to move in a straight line until it contacts the spherical surface of the hemispherical harmonic oscillator to be polished. Apply polishing pressure for a length of Δx.

[0037] Step 7: The machine tool spindle and the machine tool spindle rotate simultaneously, and a polishing solution is applied to achieve precision polishing of the inner and outer spherical surfaces of the hemispherical harmonic oscillator.

[0038] Furthermore,

[0039] In steps 2 and 6, the length of the facility with pre-tightening force (x), the length of the polishing pressure (Δx), and the polishing normal force F generated by the flat-end top spring conform to Hooke's Law, and their relationship is as follows:

[0040] F = k(x + Δx)

[0041] In the formula, k is the stiffness coefficient of the flat-end spring.

[0042] Furthermore,

[0043] In step 1, the polishing pressure F should meet the following relationship:

[0044]

[0045] In the formula, K is the contact deformation correction coefficient, and the value of K ranges from (0, 2.19e-7], R is the large radius of the polishing contact point, r is the small radius of the polishing contact point, E is the elastic modulus of the polishing material, and λ is the Poisson's ratio of the polishing material.

[0046] Furthermore,

[0047] In step 6, the angle Ψ between the ring elastic polishing tool and the workpiece spindle changes continuously under the conditions of step 7. For polishing the outer spherical surface of a hemispherical harmonic oscillator, the range of Ψ is... For polishing the inner spherical surface of a hemispherical harmonic oscillator, the range of values ​​for Ψ is... In the formula, R is the radius of the inner sphere of the hemispherical harmonic oscillator, and L is the vertical distance from the center of the anchor post to the point where the root fillet of the transition between the inner sphere and the central anchor post is tangent to the inner sphere.

[0048] This invention discloses an elastic polishing tool and method for a hemispherical resonator ring. It proposes a method for flexible precision polishing of hemispherical resonators based on a precision mechanism, achieving higher precision. The method employs a two-stage flexible design of spring preload and polishing material, improving both polishing flexibility and positioning precision, enabling high-precision polishing of the hemispherical resonator. This invention designs a ring-shaped polishing structure with a specific radius (R) that conforms to the root rounded corner of the resonator. This structure enables surface quality removal during the hemispherical resonator polishing process. Compared to traditional generating ring polishing, it simultaneously polishes the root rounded corner and the spherical surface, ensuring a perfect transition between the root rounded corner and the spherical surface. Compared to single-point polishing with magnetohydrodynamics, it offers higher processing efficiency. The elastic polishing tool for the hemispherical resonator ring proposed in this invention has an adjustable polishing preload, which is convenient to adjust. This design method avoids the problem of inaccurate polishing force control found in comparative patents. Attached Figure Description

[0049] Figure 1 A schematic diagram of the polishing of the inner spherical surface of a hemispherical harmonic oscillator;

[0050] Figure 2 An overall assembly drawing of the hemispherical harmonic oscillator elastic floating polishing tool;

[0051] Among them, the polisher base 1, the preload adjusting stud 2, the flat end top spring 3, the sliding sleeve 4, the limit pin 5, the limit bolt 6, the quick-change adapter 7, the quick-change adapter fixing screw 8, the polishing mold 9, the polishing mold fixing screw 10, the polishing material composition 11, and the hemispherical harmonic oscillator 12.

[0052] Figure 3 This is a schematic diagram showing the large and small radii of the polishing contact point. Detailed Implementation

[0053] The technical solution of the present invention will be described in detail below with reference to the accompanying drawings.

[0054] This invention provides a hemispherical harmonic oscillator elastic floating polishing tool, such as... Figure 2 As shown, it includes:

[0055] 1. Polisher base; 2. Preload adjusting stud; 3. Flat-end top spring; 4. Sliding sleeve; 5. Limiting pin; 6. Limiting bolt; 7. Quick-change adapter; 8. Quick-change adapter fixing screw; 9. Polishing mold fixing screw; 10. Polishing material; 11. Hemispherical resonator; 12.

[0056] The polisher base is provided with an annular limiting groove a for positioning the flat-end top spring; the polisher base has a threaded hole in the center for installing a preload adjusting stud; the front end of the polisher base is provided with a high-precision cylindrical surface for high-precision sliding fit with the sliding sleeve; the polisher base is provided with a "U" shaped groove b for interference fit installation of a limiting pin.

[0057] The preload adjusting stud is located inside the polisher base and is screwed in from the back of the polisher base; the front end of the preload adjusting stud is provided with a threaded hole for connection with the limit bolt;

[0058] The flat-end top spring is located in the annular limiting groove a of the polisher base. The lower end face of the flat-end top spring is in contact with the bottom surface of the annular limiting groove of the polisher base, and the upper end face of the flat-end top spring is in contact with the bottom surface d of the cylindrical blind hole of the sliding sleeve.

[0059] The sliding sleeve is provided with a high-precision cylindrical hole for sliding engagement with the high-precision cylindrical surface at the front end of the polisher base; the sliding sleeve is provided with open "U"-shaped grooves c on both sides for sliding engagement with the limit pin; the front end of the sliding sleeve is provided with a through hole for the limit bolt to be connected and fixed to the preload adjusting stud through the through hole; the top end of the sliding sleeve is provided with 3 threaded holes evenly distributed in the circumferential direction.

[0060] The limiting pin is installed in the "U" groove of the polisher base by interference fit;

[0061] The limiting bolt is located at the top of the sliding sleeve, and its tail end is threadedly connected and fixed to the preload adjusting stud.

[0062] The quick-change adapter is located at the top of the sliding sleeve, and its lower end face fits against the upper end face of the sliding sleeve. The quick-change adapter has three screw mounting holes evenly distributed on the circumference for connecting the quick-change adapter and the sliding sleeve with quick-change adapter fixing screws. The front end of the quick-change adapter has a cylindrical step for connecting with the polishing mold.

[0063] The quick-change adapter fixing screw is used to connect and fix the quick-change adapter and the sliding sleeve.

[0064] The polishing mold is provided with a through hole for installation and fixation with the cylindrical step of the quick-change adapter through clearance fit; the polishing mold is provided with 3 screw holes evenly distributed in the circumferential direction;

[0065] The polishing mold fixing screws are used to connect and fix the polishing mold and the quick-change adapter.

[0066] The polishing material is bonded to the polishing mold, and the polishing material can be polishing felt, damping cloth, polyurethane, etc.

[0067] The present invention also provides a method for polishing a hemispherical harmonic oscillator using an elastic floating polishing tool as described above, comprising the following steps:

[0068] Step 1: Set the polishing normal pressure F. According to the contact deformation theory of elastic materials, the contact deformation of the polishing material during the polishing process of the resonator should be controlled within a certain range; otherwise, the polishing accuracy of the resonator will be reduced due to the deformation of the polishing material. Theoretically, the basic deformation correction coefficient K = 4 / 3 * δ ∧ (3 / 2), where δ is the polishing stress. However, due to the thin-walled nature of the resonator parts, the resonator itself will deform as the polishing stress increases. At this time, the polishing contact deformation correction coefficient will deviate. Therefore, to simplify the polishing normal pressure model, based on the experience of the resonator polishing process, the value range of K is set to (0, 2.19e-7]. Then, based on the contact deformation theory of elastic materials, the polishing normal pressure F should conform to the following relationship:

[0069]

[0070] In the formula, K is the contact deformation correction coefficient, with a value range of (0, 2.19e-7], R is the large radius of the polishing contact point, and r is the small radius of the polishing contact point. Figure 3 As shown, E is the elastic modulus of the polishing material, and λ is the Poisson's ratio of the polishing material.

[0071] Step 2: Adjust the preload. Apply the preload using the adjusting stud. The length of the facility to which the preload is applied is x.

[0072] Step 3: Install the ring elastic polishing tool on the machine tool spindle. The machine tool spindle drives the ring elastic polishing tool to rotate around the center of rotation. Use a special dresser to dress the polishing material at the end of the ring elastic polishing tool.

[0073] Step 4: Clamp the hemispherical resonator on the clamping fixture of the processing equipment. The clamping fixture is located on the workpiece spindle of the equipment. The central axis of the turntable coincides with the cylindrical axis of the hemispherical resonator. Thus, the rotation of the turntable drives the hemispherical resonator to rotate.

[0074] Step 5: Determine the coordinates of the center of the hemispherical harmonic oscillator to be polished as (X... p ,Y p Z p Adjust the machine tool spindle so that the rotation center of the ring elastic polishing tool always passes through the sphere's center coordinate (X). p ,Y p Z p );

[0075] Step 6: Adjust the angle Ψ of the ring elastic polishing tool relative to the workpiece spindle, and adjust the ring elastic polishing tool to move in a straight line until it contacts the spherical surface of the hemispherical harmonic oscillator to be polished. Apply polishing pressure for a length of Δx.

[0076] Step 7: The machine tool spindle and the machine tool spindle rotate simultaneously, and a polishing solution is applied to achieve precision polishing of the inner and outer spherical surfaces of the hemispherical harmonic oscillator.

[0077] In steps 2 and 6, the length of the facility with pre-tightening force (x), the length of the polishing pressure (Δx), and the polishing normal force F generated by the flat-end top spring conform to Hooke's Law, and their relationship is as follows:

[0078] F = k(x + Δx)

[0079] In the formula, k is the stiffness coefficient of the flat-end spring.

[0080] In step 6, the angle Ψ between the ring elastic polishing tool and the workpiece spindle can be continuously varied under the conditions of step 7. For polishing the outer spherical surface of a hemispherical harmonic oscillator, the range of Ψ is... For polishing the inner spherical surface of a hemispherical harmonic oscillator, the range of values ​​for Ψ is... In the formula, R is the radius of the inner sphere of the hemispherical harmonic oscillator, and L is the vertical distance from the center of the anchor post to the point where the root fillet of the transition between the inner sphere and the central anchor post is tangent to the inner sphere.

[0081] This invention discloses a hemispherical resonator ring elastic polishing tool and method. It proposes a method for flexible precision polishing of hemispherical resonators based on a precision mechanism, achieving higher precision. The method employs a two-stage flexible design of spring preload and polishing material, improving both polishing flexibility and positioning precision, enabling high-precision polishing of the hemispherical resonator. This invention designs a ring polishing structure with a specific R-angle function that conforms to the root rounded corner of the resonator. This structure enables surface quality removal during the hemispherical resonator polishing process. Compared to traditional generating ring polishing, it simultaneously polishes the root rounded corner and the spherical surface, ensuring a perfect transition between the root rounded corner and the spherical surface. Compared to single-point polishing with magnetohydrodynamics for small spherical heads, it offers higher processing efficiency. The hemispherical resonator ring elastic polishing tool proposed in this invention has a polishing preload adjustment function, and this preload adjustment is convenient. Using this design method avoids the problem of inaccurate polishing force control in comparative patents. The ring elastic polishing tool and method of this invention provide boundary conditions for the polishing normal pressure F. The range of values ​​for the polishing normal pressure F conforms to the following relationship: In the formula, K is the contact deformation correction coefficient, with a value range of (0, 2.19e-7], R is the large radius of the contact point between the annular polishing pad and the hemispherical harmonic oscillator, r is the small radius of the contact point between the annular polishing material and the hemispherical harmonic oscillator, E is the elastic modulus of the polishing material, and λ is the Poisson's ratio of the polishing material. The polishing method described in this invention provides the range of values ​​for the angle Ψ of the annular elastic polishing tool relative to the workpiece spindle during the inner and outer spherical surface polishing of the hemispherical harmonic oscillator. For the outer spherical surface polishing of the hemispherical harmonic oscillator, the range of values ​​for Ψ is... For polishing the inner spherical surface of a hemispherical harmonic oscillator, the range of values ​​for Ψ is... In the formula, R is the radius of the inner sphere of the hemispherical harmonic oscillator, and L is the vertical distance from the center of the anchor post to the point where the root fillet of the transition between the inner sphere and the central anchor post is tangent to the inner sphere. The ring elastic polishing tool adapter and polishing mold described in this invention have the feature of quick change. Even if the size of the hemispherical harmonic oscillator is changed, most of the parts of the ring elastic polishing tool do not need to be remade. Only the adapter or polishing mold needs to be replaced to achieve the polishing of parts of different specifications.

Claims

1. A hemispherical harmonic oscillator ring elastic polishing tool, characterized in that, include: Polisher base (1), preload adjusting stud (2), flat end top spring (3), sliding sleeve (4), limit pin (5), limit bolt (6), quick change adapter (7), quick change adapter fixing screw (8), polishing mold (9), polishing mold fixing screw (10), polishing material (11), hemispherical harmonic oscillator (12); The polisher base is provided with an annular limiting groove (a) for positioning the flat end top spring; the polisher base has a threaded hole in the center for installing a preload adjusting stud; the front end of the polisher base is provided with a high-precision cylindrical surface for high-precision sliding fit with the sliding sleeve; the polisher base is provided with a "U" shaped groove (b) for interference fit installation of a limiting pin. The limiting bolt is located at the top of the sliding sleeve, and its tail end is threadedly connected and fixed to the preload adjusting stud. The quick-change adapter is located at the top of the sliding sleeve, and its lower end face fits against the upper end face of the sliding sleeve. The quick-change adapter has three screw mounting holes evenly distributed on the circumference for connecting the quick-change adapter and the sliding sleeve with quick-change adapter fixing screws. The front end of the quick-change adapter has a cylindrical step for connecting with the polishing mold. The quick-change adapter fixing screw is used to connect and fix the quick-change adapter and the sliding sleeve. The polishing mold is provided with a through hole for installation and fixation with the cylindrical step of the quick-change adapter through clearance fit; the polishing mold is provided with 3 screw holes evenly distributed in the circumferential direction; The polishing mold fixing screws are used to connect and fix the polishing mold and the quick-change adapter. The polishing material is bonded to the polishing mold.

2. The hemispherical harmonic oscillator ring elastic polishing tool according to claim 1, characterized in that, The preload adjusting stud is located inside the polisher base and is screwed in from the back of the polisher base; the front end of the preload adjusting stud has a threaded hole for connecting with the limit bolt.

3. The elastic polishing tool for a hemispherical harmonic oscillator ring according to claim 1, characterized in that, The flat-end top spring is located in the annular limiting groove (a) of the polisher base. The lower end face of the flat-end top spring is in contact with the bottom surface of the annular limiting groove of the polisher base, and the upper end face of the flat-end top spring is in contact with the bottom surface (d) of the cylindrical blind hole of the sliding sleeve.

4. The hemispherical harmonic oscillator ring elastic polishing tool according to claim 1, characterized in that, The sliding sleeve is provided with a high-precision cylindrical hole for sliding engagement with the high-precision cylindrical surface at the front end of the polisher base; the sliding sleeve is provided with open "U"-shaped grooves (c) on both sides for sliding engagement with the limiting pin; the front end of the sliding sleeve is provided with a through hole for the limiting bolt to be connected and fixed to the preload adjusting stud through the through hole; the top end of the sliding sleeve is provided with 3 threaded holes evenly distributed in the circumferential direction.

5. The elastic polishing tool for a hemispherical harmonic oscillator ring according to claim 1, characterized in that, The limiting pin is installed in the "U" groove of the polisher base by interference fit.

6. The elastic polishing tool for a hemispherical harmonic oscillator ring according to claim 1, characterized in that, The polishing material is a polishing felt, damping cloth, or polyurethane.

7. A method for elastic polishing of a hemispherical harmonic oscillator ring, characterized in that, The polishing method is performed using the polishing tool as described in any one of claims 1-6, and includes the following process: Step 1: Set the polishing pressure F; Step 2: Adjust the preload adjusting stud to apply the preload, and the length of the facility to which the preload is applied is x; Step 3: Install the ring elastic polishing tool on the machine tool spindle. The machine tool spindle drives the ring elastic polishing tool to rotate around the center of rotation. Use a dresser to dress the polishing material at the end of the ring elastic polishing tool. Step 4: Clamp the hemispherical resonator on the clamping fixture of the processing equipment. The clamping fixture is located on the workpiece spindle of the equipment. The central axis of the turntable coincides with the cylindrical axis of the hemispherical resonator. Thus, the rotation of the turntable drives the hemispherical resonator to rotate. Step 5: Determine the coordinates of the center of the hemispherical harmonic oscillator to be polished as (X... p ,Y p Z p Adjust the machine tool spindle so that the rotation center of the ring elastic polishing tool always passes through the sphere's center coordinate (X). p ,Y p Z p ); Step 6: Adjust the angle Ψ of the ring elastic polishing tool relative to the workpiece spindle, and adjust the ring elastic polishing tool to move in a straight line until it contacts the spherical surface of the hemispherical harmonic oscillator to be polished. Apply polishing pressure for a length of Δx. Step 7: The machine tool spindle and the machine tool spindle rotate simultaneously, and a polishing solution is applied to achieve precision polishing of the inner and outer spherical surfaces of the hemispherical harmonic oscillator.

8. The method for elastic polishing of a hemispherical harmonic oscillator ring according to claim 7, characterized in that, In steps 2 and 6, the length of the facility with pre-tightening force (x), the length of the polishing pressure (Δx), and the polishing normal force F generated by the flat-end top spring conform to Hooke's Law, and their relationship is as follows: F = k(x + Δx) In the formula, k is the stiffness coefficient of the flat-end spring.

9. The method for elastic polishing of a hemispherical harmonic oscillator ring according to claim 7, characterized in that, In step 1, the polishing pressure F should meet the following relationship: In the formula, K is the contact deformation correction coefficient, and the value of K ranges from (0, 2.19e-7], R is the large radius of the polishing contact point, r is the small radius of the polishing contact point, E is the elastic modulus of the polishing material, and λ is the Poisson's ratio of the polishing material.

10. The method for elastic polishing of a hemispherical harmonic oscillator ring according to claim 7, characterized in that, In step 6, the angle Ψ between the ring elastic polishing tool and the workpiece spindle changes continuously under the conditions of step 7. For polishing the outer spherical surface of a hemispherical harmonic oscillator, the range of Ψ is... For polishing the inner spherical surface of a hemispherical harmonic oscillator, the range of values ​​for Ψ is... In the formula, R is the radius of the inner sphere of the hemispherical harmonic oscillator, and L is the vertical distance from the center of the anchor post to the point where the root fillet of the transition between the inner sphere and the central anchor post is tangent to the inner sphere.

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