Polishing apparatus and polishing method of polishing apparatus

Abstract

The application discloses a polishing device and a polishing method of the polishing device, and the polishing device comprises a preposition device, a polishing device, a cleaning device and a water tank storage device, wherein the water tank storage device comprises a cleaning storage part and a carrying part, the cleaning storage part is provided with a plurality of interval arranged buffer stations, the cleaning storage part is provided with a liquid inlet and a liquid outlet, the plurality of buffer stations are located between the liquid inlet and the liquid outlet, the carrying part is arranged at intervals with the cleaning storage part, and the carrying part selectively carries the material between the polishing device and the cleaning storage part. Therefore, by arranging the water tank storage device between the cleaning device and the polishing device, the water tank storage device can temporarily store the material and clean the material at the same time, so that the polishing of the material is not restricted by the station in the cleaning device, the production efficiency can be improved, the conveying process of the material in the multiple devices can be simplified, and the purposes of protecting the wafer, saving the consumables and shortening the process period can be achieved.

Description

Technical Field

[0001] This invention relates to the field of polishing technology, and in particular to a polishing device and a polishing method for the polishing device. Background Technology

[0002] Polishing and cleaning are the two core processes in CMP (Chip Polishing). After wafer polishing, residual chemicals continue to corrode the wafer, and the exposed copper, tungsten, and other metal layers on the wafer are also prone to oxidation in the air, forming bumps.

[0003] Due to the above constraints, polished wafers should be sent to the cleaning unit for cleaning as soon as possible. This creates a binding relationship between the polishing and cleaning units, meaning that if either unit stops operating due to a malfunction or other reason, the production line will be shut down. This results in a low fault tolerance and low production efficiency for the CMP process. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a polishing apparatus that has a short production cycle, high production efficiency, and better wafer reliability.

[0005] The present invention further proposes a polishing method for a polishing device.

[0006] To achieve the above objectives, an embodiment of the present invention provides a polishing apparatus, comprising: a pre-processing device; A polishing device is arranged along a first direction with the pre-positioning device; a cleaning device is spaced apart along the first direction between the pre-positioning device and the polishing device; the pre-positioning device selectively transfers material to the transfer station of the cleaning device, and the pre-positioning device also selectively sends material from the cleaning device to a material box; a water tank storage device is spaced apart along the first direction between the cleaning device and the polishing device, the water tank storage device includes a cleaning storage component and a transport component, the cleaning storage component is provided with multiple spaced buffer stations, the cleaning storage component is provided with an inlet and an outlet, the multiple buffer stations are located between the inlet and the outlet, the transport component is spaced apart from the cleaning storage component, the transport component selectively transports material from the transfer station to the polishing device for polishing, the transport component also selectively transports material between the polishing device and the buffer stations, and the transport component also selectively transports material from the polishing device to the cleaning device.

[0007] Therefore, by setting up a water tank storage device between the cleaning device and the polishing device, the water tank storage device can clean the material while temporarily storing it. This not only allows the polishing of the material to be free from the constraints of the workstation in the cleaning device, thus improving production efficiency, but also simplifies the material transportation process between multiple devices, thereby achieving the goals of protecting wafers, saving consumables, and shortening the process cycle.

[0008] According to some embodiments of the present invention, the transport component is a robotic arm transport component, which includes a robotic arm, a lifting drive component, and a rotation drive component. The lifting drive component is driven to the robotic arm to selectively drive the robotic arm to lift. The rotation drive component is driven to the lifting drive component and the robotic arm to selectively drive the robotic arm to rotate.

[0009] According to some embodiments of the present invention, the cleaning storage component is provided with limit blocks on both opposite sides of the buffer station. The limit blocks are used to limit the material movement. The limit blocks can be selectively moved in the cleaning storage component to change the size of the buffer station, so that the buffer station can adapt to materials of different sizes. According to some embodiments of the present invention, a plurality of cache stations have row directions spaced apart along a first direction, and / or a plurality of cache stations have column directions spaced apart along a second direction, wherein the first direction and the second direction are perpendicular to each other.

[0010] According to some embodiments of the present invention, the cleaning device includes a main housing and a cleaning body, the cleaning body being disposed within the main housing and adapted to clean incoming materials, and the water tank storage device being integrated within the main housing.

[0011] According to some embodiments of the present invention, the cleaning body is disposed on the side of the main housing adjacent to the front device, and the water tank storage device is located on the side of the main housing adjacent to the polishing device.

[0012] According to some embodiments of the present invention, the water tank storage device is located below the cleaning body.

[0013] According to some embodiments of the present invention, the main housing is provided with a switch door corresponding to the portion of the water tank storage device.

[0014] According to an embodiment of the present invention, a polishing method for a polishing device is provided, comprising the following steps: a pre-processing device transfers material to a transfer table of a cleaning device; a transporter transports the material from the transfer table to the polishing device; the polishing device polishes the front side of the material, wherein the material has a front side and a back side on both sides along the thickness direction; after the front side of the material is polished, the transporter transports the material from the polishing device to a buffer station of a cleaning storage device for cleaning; the transporter flips the material over and places it into the polishing device, where the polishing device polishes the back side of the material; after the back side of the material is polished, the transporter transfers the material to the cleaning device for cleaning; after cleaning, the pre-processing device then sends the material to a material box.

[0015] According to some embodiments of the present invention, the polishing method of the polishing equipment further includes the following steps: when the external equipment completes the front polishing of the material and the polishing station of the external equipment is saturated, the material is transferred to the buffer station of the cleaning storage component of the polishing equipment; after the buffer station cleans the material, the material is flipped over by the transport component and placed into the polishing device, and the polishing device polishes the back side of the material; after the back side of the material is polished, the transport component transfers the material to the cleaning device for cleaning, and after cleaning, the pre-positioning device sends the material to the material box.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a partial schematic diagram of a polishing apparatus according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a cleaning storage component according to an embodiment of the present invention; Figure 3 This is a schematic diagram of a polishing method using existing polishing equipment; Figure 4 This is a schematic diagram of a polishing method using a polishing apparatus according to an embodiment of the present invention; Figure 5 This is a schematic diagram of a polishing method using a polishing apparatus according to an embodiment of the present invention; Figure 6 This is a schematic diagram of a polishing method using a polishing apparatus according to another embodiment of the present invention; Figure 7 This is a flowchart of a polishing method using a polishing apparatus according to an embodiment of the present invention.

[0018] Figure label: 100. Polishing equipment; 10. Pre-installation device; 20. Polishing device; 30. Cleaning device; 31. Main housing; 32. Cleaning body; 40. Water tank storage device; 41. Cleaning storage component; 411. Buffer station; 412. Liquid inlet; 413. Liquid outlet. Detailed Implementation

[0019] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0020] The following is for reference. Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 and Figure 7 A polishing apparatus 100 according to an embodiment of the present invention is described.

[0021] Combination Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the polishing equipment 100 according to an embodiment of the present invention may mainly include: a pre-processing device 10, a polishing device 20, a cleaning device 30, and a water tank storage device 40, wherein the polishing device 20 and the pre-processing device 10 are arranged along a first direction, and the cleaning device 30 is spaced apart between the pre-processing device 10 and the polishing device 20 along the first direction; the pre-processing device 10 selectively transfers materials to the transfer table of the cleaning device 30, and the pre-processing device 10 also selectively sends materials on the cleaning device 30 to a material box; the water tank storage device 40 is spaced apart between the cleaning device 30 and the polishing device 20 along the first direction, and the water tank... The storage device 40 includes a cleaning storage component 41 and a transport component. The cleaning storage component 41 is provided with multiple buffer stations 411 spaced apart. The cleaning storage component 41 is provided with an inlet 412 and an outlet 413. The multiple buffer stations 411 are located between the inlet 412 and the outlet 413. The transport component is spaced apart from the cleaning storage component 41. The transport component selectively transports the material on the transfer table to the polishing device 20 for polishing. The transport component also selectively transports the material between the polishing device 20 and the buffer stations 411. The transport component also selectively transports the material on the polishing device 20 to the cleaning device 30.

[0022] Specifically, when the polishing equipment 100 is working normally, the pre-processor 10 can transfer the material to the transfer table of the cleaning device 30, and then the material is transported to the polishing device 20 by the transporter. The polishing device 20 can polish the material. In some embodiments of the present invention, the material is a wafer. The polishing device 20 can first polish the front side of the wafer. After the polishing device 20 completes the polishing of the front side of the wafer, the transporter in the water tank storage device 40 can transport the wafer to the buffer station 411 of the cleaning storage device 41 for buffering. Since the buffer station 411 is located between the liquid inlet 412 and the liquid outlet 413, the wafer cleaning liquid will continuously circulate from the liquid inlet 412 to the liquid outlet 413, thereby cleaning the wafers buffered on the buffer station 411 between the liquid inlet 412 and the liquid outlet 413. This can prevent the chemical liquid remaining on the front side of the wafer when the polishing device 20 polishes the front side of the wafer from continuously corroding the wafer, and can ensure the yield of the wafer.

[0023] After the front side of the wafer is cleaned, the transporter can transport the wafer to the polishing device 20, so that the polishing device 20 can clean the back side of the wafer. In some embodiments of the present invention, the transporter can not only transport the wafer between the polishing device 20 and the water tank storage device 40, but also flip the wafer so that when the wafer enters the polishing device 20 from the water tank storage device 40, the back side of the wafer is facing up, and the polishing device 20 polishes the back side of the wafer.

[0024] After the polishing device 20 finishes polishing the back side of the wafer, the transporter can directly transfer the wafer to the cleaning device 30 for cleaning. After cleaning, the pre-mount device 10 then unloads the wafer and transfers it to the hopper.

[0025] Combination Figure 3 As shown, in the prior art, the wafers that have completed front-side polishing need to be transported to the cleaning device 30 for cleaning in order to ensure the yield of the wafers. When the cleaning device 30 malfunctions or the workstations on the cleaning device 30 are saturated and cannot clean the wafers, the polishing device 20 also needs to be stopped to wait for the cleaning device 30 to complete the maintenance.

[0026] Combination Figure 4 As shown, in some embodiments of the present invention, due to the presence of the water tank storage device 40, even if the cleaning device 30 malfunctions or the workstation on the cleaning device 30 is saturated, the polishing device 20 does not need to be stopped. The water tank storage device 40 can clean the front side of the wafer and can continue to work. This can effectively break the binding relationship between the polishing device 20 and the cleaning device 30 in the polishing equipment 100, thereby improving the fault tolerance of the polishing equipment 100 and improving the wafer production efficiency.

[0027] It should be noted that in some embodiments of the present invention, when the cleaning device 30 malfunctions or the workstation on the cleaning device 30 is saturated, after the polishing device 20 has finished polishing the back side of the wafer, the transporter can also transport the wafer to the water tank storage device 40 to clean the back side of the wafer. After the back side of the wafer is cleaned, the pre-mounted device 10 can unload the wafer into the material box.

[0028] In addition, in the prior art, after the front side of the wafer is polished, the front-end device 10 needs to transfer the wafer from the polishing device 20 to the cleaning device 30 for front-side cleaning, and then transfer it back to the front-end device 10 to flip the wafer. Then the front-end device 10 transfers the flipped wafer to the polishing device 20 to polish the back side of the wafer. The front-end device 10 needs to transfer the wafer across devices, which is difficult to transport and the wafer is less stable during the transportation process.

[0029] In this embodiment of the invention, the polishing device 20 and the pre-installation device 10 are arranged along the first direction, and the water tank storage device 40 is spaced apart between the cleaning device 30 and the polishing device 20 in the first direction. The water tank storage device 40 can not only clean the wafer, but also flip the wafer. With this arrangement, the wafer does not need to be transported across devices during the wafer polishing process. This not only makes the wafer production and manufacturing more stable and reliable, but also improves the wafer yield and shortens the wafer processing and manufacturing cycle, thereby improving the efficiency of wafer production and manufacturing.

[0030] Combination Figure 2 As shown, the cleaning storage unit 41 is equipped with multiple buffer stations 411. The cleaning storage unit 41 can buffer multiple wafers at the same time. The polishing device 20 can continuously polish the front side of multiple wafers in sequence, and then transport the multiple wafers with the front side polished to the multiple buffer stations 411 for cleaning. After the front side of the wafer is cleaned, the wafers are flipped over and transported to the polishing device 20 for polishing. This can further improve the wafer production efficiency.

[0031] In addition, when wafers on other polishing equipment 100 need to be buffered and cleaned, the wafers on other polishing equipment 100 can be transferred to the water tank storage device 40, which can further improve the flexibility and production efficiency of the polishing production line.

[0032] In some embodiments of the present invention, the transport component is a robotic arm transport component, which includes a robotic arm, a lifting drive component, and a rotation drive component. The lifting drive component is connected to the robotic arm in a transmission manner to selectively drive the robotic arm to lift and lower. The rotation drive component is connected to the lifting drive component and the robotic arm in a transmission manner to selectively drive the robotic arm to rotate.

[0033] Specifically, by setting the transport component as a robotic arm transport component, the lifting drive component is connected to the robotic arm via transmission. The lifting drive component can drive the robotic arm to move up and down, thereby moving closer to or away from the polishing device 20 to grip the wafer. The rotation drive component is connected to the lifting drive component and the robotic arm via transmission. The rotation drive component can drive the robotic arm and the lifting drive component to rotate as a whole, thereby transporting the wafer to a preset position.

[0034] Furthermore, the robotic arm can be a telescopic robotic arm, which can extend and retract, enabling the robotic arm to achieve multiple degrees of freedom of movement and making the handling of wafers more flexible.

[0035] Combination Figure 2 As shown, the cleaning storage unit 41 is provided with limit blocks on both sides of the buffer station 411. The limit blocks are used to limit the material. The limit blocks can be selectively moved in the cleaning storage unit 41 to change the size of the buffer station 411 so that the buffer station 411 can adapt to materials of different sizes.

[0036] Specifically, the size of the cache station 411 can be changed by moving the distance between the limiting blocks on both sides of the cache station 411, that is, by moving the limiting blocks on both sides of the cache station 411 closer to each other or further away from each other, so that cache stations 411 of different sizes can be adapted to wafers of different sizes.

[0037] In some specific embodiments of the present invention, the buffer station of the water tank storage device 40 can be compatible with 6-inch, 8-inch and 12-inch wafers.

[0038] In some embodiments of the present invention, a plurality of cache stations 411 have row directions spaced apart along a first direction, and / or a plurality of cache stations 411 have column directions spaced apart along a second direction, wherein the first direction and the second direction are perpendicular to each other.

[0039] Specifically, the multiple buffer stations 411 have a row direction arranged at intervals along a first direction, and / or the multiple buffer stations 411 have a column direction arranged at intervals along a second direction. The arrangement direction of the multiple buffer stations 411 can be selectively set according to the setting position of the water tank storage device 40, so that the multiple buffer stations 411 can make full use of the space in the first and second directions. While ensuring the number of buffer stations 411, it can prevent the multiple buffer stations 411 from excessively occupying the space in a certain direction, and can optimize the structural design of the water tank storage device 40.

[0040] Combination Figure 1As shown, the cleaning device 30 includes a main housing 31 and a cleaning body 32. The cleaning body 32 is disposed inside the main housing 31 and is suitable for cleaning the material being transported. The water tank storage device 40 is integrated inside the main housing 31.

[0041] Specifically, by integrating the cleaning body 32 and the water tank storage device 40 into the main housing 31, the space in the main housing 31 can be fully utilized, the structural compactness of the polishing equipment 100 can be improved, the wafer handling path can be further shortened, the wafer processing and manufacturing cycle can be reduced, and thus production efficiency can be improved.

[0042] Combination Figure 1 As shown, the cleaning body 32 is located on the side of the main housing 31 adjacent to the front device 10, and the water tank storage device 40 is located on the side of the main housing 31 adjacent to the polishing device 20.

[0043] Specifically, by placing the cleaning body 32 on the side of the main housing 31 adjacent to the pre-mount device 10, and the water tank storage device 40 on the side of the main housing 31 adjacent to the polishing device 20, the cleaning body 32 can be placed closer to the pre-mount device 10, and the water tank storage device 40 can be placed closer to the polishing device 20. This can further shorten the wafer handling path, reduce the wafer processing cycle, and thus improve production efficiency.

[0044] Combination Figure 1 As shown, the water tank storage device 40 is located below the cleaning body 32.

[0045] Specifically, the water tank storage device 40 is located below the cleaning body 32. While ensuring the compact structure of the cleaning device 30 and the water tank storage device 40, the independence between the cleaning body 32 and the water tank storage device 40 can be guaranteed, preventing interference between the cleaning body 32 and the water tank storage device 40 during normal operation. In some embodiments of the present invention, the main housing 31 is provided with a switch door corresponding to the portion of the water tank storage device 40.

[0046] Combination Figure 4 and Figure 7 As shown, the polishing method of the polishing apparatus 100 according to an embodiment of the present invention includes the following steps: S1. The material is transferred to the transfer table of the cleaning device 30 by the front device 10. The transporter transports the material on the transfer table to the polishing device 20. The polishing device 20 polishes the front side of the material. The material has a front side and a back side on both sides along the thickness direction. S2. After the front of the material is polished, the transporter moves the material from the polishing device 20 to the buffer station 411 of the cleaning storage unit 41 and cleans it. S3. The transporter flips the material over and places it into the polishing device 20, which polishes the back of the material. S4. After the back of the material is polished, the transporter transfers the material to the cleaning device 30 for cleaning. After cleaning, the pre-installation device 10 sends the material to the material box.

[0047] Specifically, in the above-mentioned wafer material processing and production steps, the wafers are not transported across devices. This not only improves the safety of wafer transportation but also shortens the wafer processing cycle, thereby improving wafer production efficiency.

[0048] Combination Figure 6 As shown, in some embodiments of the present invention, the polishing method of the polishing apparatus 100 further includes the following steps: When the external equipment completes the front polishing of the material and the polishing station of the external equipment is saturated, the material is transferred to the buffer station 411 of the cleaning storage component 41 of the polishing equipment 100. After the buffer station 411 cleans the material, the transported material is turned over and placed into the polishing device 20, which polishes the back of the material. After the back of the material is polished, the transporter transfers the material to the cleaning device 30 for cleaning. After cleaning, the pre-processor 10 sends the material to the material box.

[0049] Combination Figure 5 As shown, in some other embodiments of the present invention, when the external device has finished polishing both the front and back sides of the material and the cleaning device 30 of the external device is saturated, the material can be transferred to the buffer station 411 of the cleaning storage unit 41 of the polishing device 100. After the buffer station 411 cleans the material, it is transferred to the cleaning device 30, and the front device 10 unloads the material into the material box.

[0050] Specifically, since the water tank storage device 40 of this embodiment has multiple buffer stations 411, it can meet the production and processing needs of its own wafers while also being compatible with wafers transferred from external equipment. This makes the wafer processing and production on the overall polishing production line more flexible, thereby further improving the efficiency of wafer production and manufacturing.

[0051] It should be noted that the wafer can be transferred from external equipment to the buffer station 411 in the water tank storage device 40 of the polishing equipment 100 of this embodiment of the invention by manual transfer.

[0052] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0053] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0054] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A polishing device, characterized in that, include: Pre-amplifier (10); Polishing device (20), the polishing device (20) and the front device (10) are arranged along a first direction; A cleaning device (30) is disposed at a distance between the pre-mount device (10) and the polishing device (20) along a first direction; the pre-mount device (10) selectively transfers material to the transfer table of the cleaning device (30), and the pre-mount device (10) also selectively sends the material on the cleaning device (30) to the material box. A water tank storage device (40) is spaced apart between the cleaning device (30) and the polishing device (20) along a first direction. The water tank storage device (40) includes a cleaning storage component (41) and a transport component. The cleaning storage component (41) is provided with a plurality of spaced buffer stations (411). The cleaning storage component (41) is provided with an inlet (412) and an outlet (413). The plurality of buffer stations (411) are located between the inlet (412) and the outlet (413). The transport component is spaced apart from the cleaning storage component (41). The transport component selectively transports the material on the transfer table to the polishing device (20) for polishing. The transport component also selectively transports the material between the polishing device (20) and the buffer station (411). The transport component also selectively transports the material on the polishing device (20) to the cleaning device (30).

2. The polishing equipment according to claim 1, characterized in that, The transport component is a robotic arm transport component, which includes a robotic arm, a lifting drive component, and a rotation drive component. The lifting drive component is connected to the robotic arm to selectively drive the robotic arm to lift and lower. The rotation drive component is connected to both the lifting drive component and the robotic arm to selectively drive the robotic arm to rotate.

3. The polishing equipment according to claim 1, characterized in that, The cleaning storage unit (41) is provided with limit blocks on both sides of the buffer station (411). The limit blocks are used to limit the material. The limit blocks can be selectively moved in the cleaning storage unit (41) to change the size of the buffer station (411) so that the buffer station (411) can be adapted to materials of different sizes.

4. The polishing equipment according to claim 1, characterized in that, Multiple cache stations (411) have row directions spaced apart along a first direction, and / or multiple cache stations (411) have column directions spaced apart along a second direction, wherein the first direction and the second direction are perpendicular to each other.

5. The polishing equipment according to claim 1, characterized in that, The cleaning device (30) includes a main housing (31) and a cleaning body (32). The cleaning body (32) is disposed inside the main housing (31) and is adapted to clean the material being transported. The water tank storage device (40) is integrated inside the main housing (31).

6. The polishing equipment according to claim 5, characterized in that, The cleaning body (32) is located on the side of the main housing (31) adjacent to the front device (10), and the water tank storage device (40) is located on the side of the main housing (31) adjacent to the polishing device (20).

7. The polishing equipment according to claim 6, characterized in that, The water tank storage device (40) is located below the cleaning body (32).

8. The polishing equipment according to claim 5, characterized in that, The main housing (31) is provided with a switch door corresponding to the water tank storage device (40).

9. A polishing method for a polishing apparatus, applicable to the polishing apparatus according to any one of claims 1-8, characterized in that, Includes the following steps: The material is transferred to the transfer station of the cleaning device (30) by the front device (10), and the transporter transports the material on the transfer station to the polishing device (20). The polishing device (20) polishes the front side of the material, wherein the material has the front side and the back side on both sides along the thickness direction. After the front of the material is polished, the transporter moves the material from the polishing device (20) to the buffer station (411) of the cleaning storage device (41) and cleans it; The transporter flips the material over and places it into the polishing device (20), which polishes the back side of the material. After the back of the material is polished, the transporter transfers the material to the cleaning device (30) for cleaning. After cleaning, the pre-installation device (10) sends the material to the material box.

10. The polishing method of the polishing equipment according to claim 9, characterized in that, It also includes the following steps: when the external equipment completes the front polishing of the material and the polishing station of the external equipment is saturated, the material is transferred to the buffer station (411) of the cleaning storage component (41) of the polishing equipment (100). After the buffer station (411) cleans the material, the transported material is turned over and placed in the polishing device (20), which polishes the back side of the material. After the back of the material is polished, the transporter transfers the material to the cleaning device (30) for cleaning. After cleaning, the pre-installation device (10) sends the material to the material box.

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