Glass panel thermal chamfering method and glass panel

Abstract

The present application relates to a glass panel thermal chamfering method and a glass panel, and particularly relates to a glass panel thermal chamfering method and a glass panel, which forms a cutting line on one side of a glass panel before a thermal chamfering process on an edge area of the glass panel is performed by a thermal chamfering device, so that a step part formed on the edge area of the glass panel after the thermal chamfering process is maximally inhibited.

Description

Technical Field

[0001] This invention relates to a method for hot beveling a glass panel and a glass panel, and more particularly to a method and a glass panel for hot beveling a glass panel in which a cutting line is formed on one side of the glass panel before hot beveling the edge region of the glass panel is performed by a hot beveling device, thereby minimizing the formation of a step in the edge region of the glass panel after the hot beveling process is performed. Background Technology

[0002] In recent years, mobile products such as smartphones and tablets have introduced various designs and functions to meet consumer demands. These mobile products primarily use displays such as liquid crystal displays (LCDs), light-emitting diode (LED) panels, organic light-emitting diode (OLED) panels, and touch panels. To protect the surface of the display, screen protector glass (hereinafter referred to as "glass panel") is used. The glass panel, as described above, is cut using methods such as lasers, scribers, and water jets, depending on the size of the applicable display, and undergoes surface treatment and strengthening processes. In the surface treatment and strengthening processes of the glass panel, to prevent breakage and improve its roughness, a grinding process must be performed on the cut surfaces. As an example of the grinding process described above, a technique related to thermal chamfering, which involves contacting a heating element heated by a high-frequency induction heater with the glass substrate to cut the edges, can be used.

[0003] Figure 1 This is a reference diagram used to illustrate glass panels formed through an existing glass panel hot beveling process.

[0004] See Figure 1 The hot chamfering process refers to the process of controlling a rod-shaped heating element 7 to move along the sides and corners of a glass panel 9, thereby causing the glass to separate from the glass panel 9 on its own. Specifically, the heating element 7 can enter from the glass panel 9 at the initial contact position P1 and move along the processing path L1, and then detach from the glass panel 9 at the detachment position P2. At this time, the entry position P1 and the detachment position P2 can be set at positions spaced apart from each other according to the processing path L1.

[0005] During the hot chamfering process, the heat conducted to the rod-shaped heating element 7 by the high-frequency induction heater can be conducted radially from the heating element 7. Therefore, a pair of inwardly recessed portions 9b can be formed on the side surface 9a of the glass panel 9 on the side corresponding to the entry position P1 of the heating element 7 and the side corresponding to the exit position P2, and an outwardly protruding step portion 9c can be formed between the pair of recessed portions 9b.

[0006] Therefore, one side 9a of the glass panel 9 processed by the hot chamfering process will become uneven, which may lead to a decrease in the quality of the glass panel 9.

[0007] To address the problems described above, this invention provides a novel method for hot chamfering of glass panels and a glass panel, the details of which will be explained in subsequent sections.

[0008] Prior technology documents

[0009] Patent documents

[0010] (Patent Document 1) Korean Patent No. 10-1620375, "Method for Processing Ultrathin Glass Including Lamination and Cutting Processes" Summary of the Invention

[0011] The present invention is proposed to solve the problems existing in the prior art as described above.

[0012] The purpose of this invention is to provide a glass panel hot chamfering method and a glass panel that, before performing a hot chamfering process on the edge region of the glass panel, forms a cutting line on one side of the glass panel, thereby maximally suppressing the formation of a step in the edge region of the glass panel after the hot chamfering process is performed.

[0013] Furthermore, the present invention aims to provide a method for hot chamfering a glass panel and a glass panel in which a cutting line is formed on one side adjacent to a side of a glass panel at an entry position and a exit position of a set processing component, thereby suppressing the formation of a step portion in the edge region of the glass panel between the entry position and the exit position.

[0014] Furthermore, the present invention aims to provide a method for hot chamfering a glass panel, and a glass panel, in which the entry position is set on the side off-center from the center of the cutting line based on the processing path of the processing component, thereby suppressing the formation of a recess in the edge region of the glass panel on the side adjacent to the disengagement position of the processing component.

[0015] Furthermore, the present invention aims to provide a method for hot chamfering a glass panel, and a glass panel, in which the cutting line has one side that extends along the oblique direction, thereby suppressing the formation of recesses in the edge region of the glass panel on the side where the cutting line is not formed.

[0016] To achieve the objectives described above, the present invention can be implemented through embodiments having the following configuration.

[0017] In one embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized by comprising: a cutting line forming step, forming a cutting line on one side of a glass panel; and a hot chamfering step, performing hot chamfering on the edge region of the glass panel on which the cutting line is formed by a hot chamfering device; the hot chamfering device comprising: a processing component that moves along a processing path to perform hot chamfering on the edge region of the glass panel; and a heat generating part that heats the processing component.

[0018] In another embodiment of the invention, the glass panel hot chamfering method according to the invention is characterized in that at least one side of the cutting line overlaps with an imaginary line, which is the boundary between the area removed from the glass panel and the remaining area when the hot chamfering step is performed.

[0019] In yet another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the cutting line is a laser cutting line.

[0020] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the processing component enters the glass panel from an entry position and exits the glass panel from an exit position, and the cutting line overlaps with the entry position and the exit position along a direction that intersects the processing path of the processing component perpendicularly on a horizontal plane.

[0021] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the entry position is spaced apart from the exit position based on the processing path.

[0022] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the entry position is set on one side off-center from the center of the cutting line, based on the processing path of the processing component.

[0023] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the detachment position is set at the center of the cutting line or on the side eccentric from the center to the other side, based on the processing path of the processing component.

[0024] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the processing component enters the glass panel along an approach path, the approach path forming an acute angle with the processing path.

[0025] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the processing component is disengaged from the glass panel along a disengagement path, the disengagement path forming an obtuse angle with the processing path.

[0026] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the cutting line is a straight line shape parallel to the processing path of the processing component.

[0027] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the cutting line comprises: a first line extending from the side adjacent to the entry position in a manner parallel to the processing path of the processing component; and a second line extending from the side adjacent to the exit position in an oblique direction.

[0028] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that, when the cutting line extends from the side adjacent to the departure position to the side adjacent to the entry position, it extends in an oblique direction in a manner adjacent to the edge region of the adjacent glass panel.

[0029] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the cutting line is spaced apart from the edge region of the glass panel, and the distance between the cutting line and the edge region is a value in the range of more than 1 times and less than 4 times the thickness of the glass panel.

[0030] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized in that the disengagement speed of the processing component at the disengagement position is faster than the moving speed of the processing component during the hot chamfering step of the glass panel.

[0031] In another embodiment of the present invention, the glass panel hot chamfering method according to the present invention is characterized by further comprising: a cutting step, wherein the original glass sheet is cut in the cutting step to obtain a unit glass panel.

[0032] In one embodiment of the present invention, the glass panel according to the present invention is characterized in that one side of the glass panel includes: a surface-treated area that has undergone hot chamfering; and an untreated area that has undergone laser cutting.

[0033] In another embodiment of the invention, the glass panel according to the invention is characterized in that the surface of the untreated area extends in a vertical direction.

[0034] In another embodiment of the present invention, the glass panel according to the present invention is characterized by further comprising: a strengthening step, wherein the glass panel is chemically strengthened before the hot chamfering step is performed; and the surface of the surface treatment area is rounded.

[0035] In another embodiment of the present invention, the glass panel according to the present invention is characterized in that the surface of the surface-treated area extends along the vertical direction.

[0036] The present invention can achieve the effects described below through the configuration described above.

[0037] Before performing the hot chamfering process on the edge area of ​​the glass panel, the present invention forms a cutting line on one side of the glass panel, thereby achieving the effect of maximally suppressing the formation of step marks on the edge area of ​​the glass panel after the hot chamfering process is performed.

[0038] Furthermore, the present invention forms a cutting line on one side of the glass panel adjacent to the side where the processing component is set to enter and exit positions, thereby achieving the effect of suppressing the formation of step portions in the edge region of the glass panel between the entering and exit positions.

[0039] Furthermore, the present invention sets the entry position based on the processing path of the processing component on one side off-center from the center of the cutting line, thereby achieving the effect of suppressing the formation of a recess in the edge region of the glass panel on the side adjacent to the disengagement position of the processing component.

[0040] Furthermore, the present invention provides that the cutting line has one side that extends along the oblique direction, thereby achieving the effect of suppressing the formation of recesses in the edge region of the glass panel on the side where the cutting line is not formed.

[0041] Furthermore, it should be noted that even effects not explicitly mentioned herein, but which are expected to be achieved through the technical features of the present invention and are described in the following description, should be considered as described in the description of the present invention. Attached Figure Description

[0042] Figure 1 This is a reference diagram used to illustrate glass panels formed through an existing glass panel hot beveling process.

[0043] Figure 2 This is a perspective view used to illustrate a glass panel according to one embodiment of the present invention.

[0044] Figure 3 This is a reference figure used to illustrate a hot chamfering apparatus according to one embodiment of the present invention.

[0045] Figure 4 It is used for the utilization of... Figure 3 A schematic diagram illustrating the state of the hot beveling device performing the hot beveling process on the glass panel.

[0046] Figure 5 This is a sequence diagram illustrating a method for hot chamfering a glass panel according to one embodiment of the present invention.

[0047] Figure 6 It is used for the purpose of... Figure 5 The following is a reference diagram illustrating the cutting steps.

[0048] Figure 7 This is a plan view for illustrating a glass panel in which a cutting line is formed by a cutting line forming step according to one embodiment of the present invention.

[0049] Figure 8 This is a plan view for illustrating a glass panel in which a cutting line is formed by a cutting line forming step according to another embodiment of the present invention.

[0050] Figure 9 This is a plan view for illustrating a glass panel in which a cutting line is formed by a cutting line forming step according to another embodiment of the present invention.

[0051] Figures 10a to 10c This is an enlarged view used to illustrate the hot chamfering steps according to one embodiment of the present invention.

[0052] Figure 11 It is a schematic diagram used to illustrate the entry angle of the machined part.

[0053] Figure 12 It is a schematic diagram used to illustrate the separation angle of machined parts.

[0054] Figure 13 This is a plan view of a glass panel formed by a glass panel hot chamfering method according to one embodiment of the present invention.

[0055] Figure 14 This is a plan view of a glass panel formed by the hot chamfering method of the glass panel according to the comparative example.

[0056] Symbol Explanation

[0057] 1: Glass panel, 1a: Strip, 1b: Cutting line, 1b1: First line, 1b2: Second line, 1c: Imaginary line, 11: Edge area, 11a: Surface treated area, 11b: Recess, 11c: Step, 11d: Untreated surface area, 3: Hot chamfering device, 31: Main body, 33: Processing component, 35: Heat generating part, 5: Fixture, A1: Area remaining from the glass panel, A2: Area removed from the glass panel, L1: Addition of the processing component Working path, L2: Approach path of the processed part, L3: Departure path of the processed part, P1: Entry position of the processed part, P2: Departure position of the processed part, M: Original sheet, C: Center of the cutting line, D1: Distance between the cutting line and the edge area, D2, D3: Protrusion length of the step section, θ1: Entry angle, θ2: Departure angle, S1: Hot chamfering method for glass panel, S10: Cutting step, S30: Cutting line forming step, S50: Hot chamfering step. Detailed Implementation

[0058] The embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various ways, and the scope of the present invention should not be limited to the following embodiments, but rather should be interpreted based on the matters set forth in the claims. Furthermore, these embodiments are provided for reference only to provide a more complete explanation of the invention to those skilled in the art.

[0059] Unless otherwise specified in the context, the singular form used in this specification may also include the plural form. Furthermore, the terms "comprise" and / or "comprising" as used in this specification indicate only the presence of the mentioned shapes, numbers, steps, actions, components, elements, and / or combinations thereof, and do not exclude the presence or addition of more than one other shape, number, action, component, element, and / or combination thereof.

[0060] The glass panel 1 manufactured by the glass panel hot chamfering method according to the present invention can be applied not only to displays for mobile products, but also to various other technical fields such as displays for automobiles or displays for wearable devices, and its scope of application is not subject to any special limitation.

[0061] Furthermore, as an example, the glass panel 1 can be a sheet of ultra-thin glass (UTG) or a thin glass film, but is not limited thereto. When the glass panel 1 is ultra-thin glass (UTG), the thickness of the glass panel 1 can, for example, be in the range of 1 μm or more and 100 μm or less, but the scope of the invention is not limited to these numerical ranges. Furthermore, the glass sheet M or glass panel 1 described below can be one or more silicate glasses selected from the group consisting of alumina (Al2O3) silicate glass, silicate glass, potash-calcium glass, and soda-lime glass. Furthermore, the glass sheet M or glass panel 1 may include materials such as Na+ for controlling its physical properties. + or K + Alkali metal ions.

[0062] Figure 2 This is a perspective view used to illustrate a glass panel according to one embodiment of the present invention; Figure 3 A schematic diagram illustrating the state of the hot beveling process performed on the glass panel by the hot beveling device; and Figure 4 It is used for the utilization of... Figure 3 A schematic diagram illustrating the state of the hot beveling device performing the hot beveling process on the glass panel.

[0063] Next, the hot beveling device used in the hot beveling method for glass panels according to one embodiment of the present invention will be described first.

[0064] See Figures 2 to 4 The hot chamfering device 3 refers to a device that heats at least one side to perform hot chamfering on the edge region 11 of an adjacent glass panel 1. As a hot processing method of the hot chamfering device 3, the edge region 11 of the glass panel 1 can be locally heated, causing the glass to separate from the glass panel 1 on its own. At this time, the hot chamfering device 3 can peel off a thin strip 1a from the glass panel 1 without generating particles, thereby removing defects on one side of the edge region 11 of the glass panel 1 and improving its strength. In this way, a cured area, i.e., a surface-treated area 11a, can be formed on the edge region 11 of the glass panel 1 by performing a hot chamfering process using the hot chamfering device 3. The term "edge region 11" refers to the area corresponding to the outer side surface of the glass panel 1. Specifically, before the hot chamfering step S50 is performed by the hot chamfering device 3, the edge region 11 can correspond to the side surface of the glass panel 1 and the corner where a pair of adjacent side surfaces contact; after the hot chamfering step S50 is performed, it can correspond to the side surface and corner of the glass panel 1 where the strip 1a is peeled off through contact with one side of the hot chamfering device 3.

[0065] In addition, the hot chamfering device 3 may include a main body 31, a processing component 33, and a heat generating part 35.

[0066] The main body 31 is configured such that the workable component 33 can be fixed to one side of it, preferably to its lower side. As an example, it can be formed in a rod shape, but its shape is not particularly limited.

[0067] The processing component 33 can be heated by a power supply to form a hot chamfer on the edge region 11 of the adjacent glass panel 1. As an example, its tip can be formed using a ceramic material, but it is not limited to this. The processing component 33 can move along a processing path L1 set according to the edge region 11 of the glass panel 1 to perform the hot chamfering process on the edge region 11.

[0068] Therefore, the processing component 33 can be designed to move horizontally along the processing path L1 to process the edge region 11 of the glass panel 1 disposed on the fixture 5. Alternatively, in some cases, it can be configured such that the processing component 33 is fixed in a fixed position while the glass panel 1 moves, or that both the processing component 33 and the glass panel 1 move.

[0069] As an example of the processing component 33, it can be formed in a rod shape and moved along the processing path L1 of the glass panel 1 to apply pressure to the edge region 11 along the normal direction. In this case, a voice coil motor (VCM) can also be used to maintain a certain pressure on the glass panel 1 by the processing component 33. Furthermore, when the processing component 33 applies pressure to the glass panel 1, it is preferable that only one position on the outer side or outer peripheral surface of the processing component 33 contacts the edge region 11 of the glass panel 1.

[0070] The heat generating section 35 is configured to transfer heat to the processing part 33. The heat generating section 35 may be disposed on the outer side or outer peripheral surface of the processing part 33. As an example, the heat generating section 35 may include a high-frequency induction heater, but the scope of the invention is not limited thereto.

[0071] When performing the hot chamfering process on the glass panel 1 using the hot chamfering device 3 described above, the processing component 33 is inserted into the entry position P1, which is adjacent to the glass panel 1 and initially contacts the glass panel 1, and into the exit position P2, where the processing component 33 detaches from the glass panel 1 after the hot chamfering process, preferably spaced apart from each other based on the processing path L1.

[0072] Specifically, the entry position P1 and the exit position P2 can be set on the same side of the glass panel 1 and spaced apart from each other along the processing path L1 of the processing member 33. When performing a hot chamfering process using the rod-shaped processing member 33, the heat transferred to the processing member 33 can be transferred from the processing member 33 in the radial direction.

[0073] At this time, if the entry position P1 and exit position P2 of the processing component 33 are set at the same position or too close to each other, the rounded recesses 11b formed inward in the edge region 11 of the glass panel 1 subjected to repeated heat transfer by the processing component 33 may become more prominent. If the resulting recesses 11b are more prominent, the step portion 11c formed between a pair of recesses 11b will also become more prominent. Therefore, it is preferable that the entry position P1 and exit position P2 of the processing component 33 are spaced a certain distance apart along the processing path L1 of the processing component 33. In this way, the processing component 33 can move along the processing path L1 after entering the entry position P1 and exit from the glass panel 1 at the exit position P2 before entering the entry position P1.

[0074] Figure 5 This is a sequence diagram illustrating a method for hot chamfering a glass panel according to one embodiment of the present invention.

[0075] Next, a method for hot chamfering of a glass panel according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0076] See Figure 5 The present invention relates to a glass panel hot chamfering method S1, and more particularly to a glass panel hot chamfering method S1 in which a cutting line 1b is formed on one side of the glass panel 1 before the hot chamfering process on the edge region 11 of the glass panel 1 is performed by the hot chamfering device 3, thereby minimizing the formation of a step portion 11c in the edge region 11 of the glass panel 1 after the hot chamfering process is performed.

[0077] Therefore, the glass panel hot chamfering method S1 may include a cutting step S10, a cutting line forming step S30, and a hot chamfering step S50.

[0078] Before and / or after performing the hot chamfering step S50, a strengthening step to compensate for the brittleness of the glass panel and a repair step to etch the glass panel 1 to a certain thickness can be performed. However, it should be noted that the strengthening step and the repair step are not essential components of the present invention.

[0079] Figure 6 It is used for the purpose of... Figure 5 The following is a reference diagram illustrating the cutting steps.

[0080] See Figure 5 as well as Figure 6 The cutting step S10 is a step of obtaining one or more unit glass panels 1 by cutting the glass sheet M or the mother glass. The cutting of the glass sheet M can be performed by laser cutting, but the scope of the present invention is not limited thereto. As an example of the cutting step S10 described above, it is performed by laser cutting the glass sheet M, so there will inevitably be residues such as glass dust in the edge area 11 of the unit glass panel 1. The generated glass dust can be removed from the glass panel 1 by the hot chamfering step S50 described later.

[0081] Figure 7 This is a plan view for illustrating a glass panel in which a cutting line is formed by a cutting line forming step according to one embodiment of the present invention.

[0082] See Figure 7 Step S30, forming the cutting line, is a step of forming a cutting line 1b on one side of a unit glass panel 1. The cutting line 1b is preferably formed on a side spaced a certain distance from the edge region 11 of the glass panel 1, and also preferably on a side spaced a certain distance from one side surface of the glass panel 1. The cutting line 1b is formed by laser cutting, and can extend from the upper side surface of the glass panel 1 to the bottom surface in a manner that penetrates the glass panel 1. That is, the cutting line 1b can be configured as a hole shape on one side of the glass panel 1.

[0083] Furthermore, at least one side of the cutting line 1b overlaps with the imaginary line 1c, the boundary between the area A2 removed from the glass panel 1 by performing the hot chamfering step S50 and the remaining area A1, and preferably has one side that extends a certain length along the processing path L1 of the processing member 33. The length of the cutting line 1b can be adjusted in a manner proportional to the thickness of the glass panel 1 and / or the diameter of the processing member 33.

[0084] Furthermore, it is preferable that the cutting line 1b is formed on the side adjacent to one side of the glass panel 1 at the entry position P1 and the exit position P2 of the processing component 33. In this case, the cutting line 1b can be formed on the side overlapping the entry position P1 and the exit position P2 along a direction that intersects perpendicularly with the processing path L1 of the processing component 33 on the horizontal plane.

[0085] Furthermore, the entry position P1 of the processing component 33 is preferably set based on the processing path of the processing component 33, on one side off-center from the center C of the cutting line 1b (or the direction of the processing path L1). Similarly, the exit position P2 of the processing component 33 is preferably set based on the processing path of the processing component 33, on approximately the center C of the cutting line 1b or on one side off-center from the center C (or the direction of the processing path L1). By setting the entry position P1 and the exit position P2 as described above, the formation of a recess 11b in the edge region 11 of the glass panel 1 on the side adjacent to the exit position P2 can be minimized.

[0086] The cutting line 1b may have one side that extends a certain distance along the processing direction of the processing component 33.

[0087] As an example, the cutting line 1b is a straight line that is substantially parallel to the machining path L1 of the machining part 33, and can be formed on the imaginary line 1c.

[0088] Figure 8 This is a plan view for illustrating a glass panel in which a cutting line is formed by a cutting line forming step according to another embodiment of the present invention.

[0089] See Figure 8 As another example, one side of the cutting line 1b adjacent to the entry position P of the processing component 33 is formed substantially parallel to the processing path L1 of the processing component 33 (referred to as the first line 1b1), while the other side adjacent to the exit position P2 of the processing component 33 can extend diagonally in a manner not parallel to the processing path L1 (referred to as the second line 1b2). Specifically, the first line 1b1 can be formed on the imaginary line 1c. Furthermore, the second line 1b2 can extend in the direction of the first line 1b1, thereby extending in a direction adjacent to the edge region 11 of the adjacent glass panel 1. The end of the second line 1b2 can be connected to the end of the first line 1b1.

[0090] Even when a laser-cut cutting line 1b is formed on one side of the glass panel 1, a step portion 11c may form in the edge region 11 of the glass panel 1 between the entry position P1 and the exit position P2 of the processing member 33. This is due to the difference in thermal conductivity between the glass panel 1 on the side where the cutting line 1b is formed and the adjacent glass panel 1 on the side where the cutting line 1b is not formed, during the hot chamfering step S50 through the processing member 33. The step portion 11c is a region that protrudes outward from the glass panel 1 between adjacent pairs of recesses 11b.

[0091] That is, because of the cutting line 1b, the glass volume at the detachment position P2 is smaller than the glass volume on the adjacent side where the cutting line 1b is not formed. Therefore, when performing the hot chamfering step S50, the amount of hot chamfering on the edge region 11 on the side where the cutting line 1b is not formed will necessarily be greater than the amount of hot chamfering on the detachment position P2. At this time, the recess 11b formed on the side where the cutting line 1b is not formed will be more obvious, and therefore the resulting step portion 11c will also be more obvious.

[0092] To prevent the phenomenon described above, the second line 1b2 can be extended in the direction of the first line 1b1 and then extended in the direction of the edge region 11 of the adjacent glass panel 1, thereby setting the glass volume on the side adjacent to the disengagement position P2 of the processing member 33 to be relatively large. This reduces the difference in glass volume between the side where the cutting line 1b is formed and the adjacent side where the cutting line 1b is not formed, thereby maximally suppressing the formation of the recess 11b and the step portion 11c on the glass panel 1.

[0093] Figure 9 This is a plan view for illustrating a glass panel in which a cutting line is formed by a cutting line forming step according to another embodiment of the present invention.

[0094] See Figure 9 As another example, the cutting line 1b can also be constructed by extending diagonally from the side adjacent to the disengagement position P2 of the processing component 33 to the side adjacent to the entry position P1, so as to be adjacent to the edge region 11 of the adjacent glass panel 1. The resulting effect can be seen in the description above.

[0095] See Figure 7 The distance (or shortest distance) D1 between the edge regions 11 of the cutting line 1b and the glass panel 1 should preferably be approximately 1 to 4 times the thickness of the glass panel 1. If the distance D1 is less than 1 times the thickness of the glass panel 1, it may cause the glass inside the cutting line 1b to be removed during the hot chamfering step S50. If it is more than 4 times the thickness of the glass panel 1, it may cause the glass to be unable to be removed to the cutting line 1b.

[0096] Figures 10a to 10c This is an enlarged view used to illustrate the hot chamfering steps according to one embodiment of the present invention.

[0097] See Figure 5 As shown in Figure 10, the hot chamfering step S50 is a step in which the processing component 33 moves along the processing path L1 while in contact with the edge region 11 of the glass panel 1 placed on the fixture 5, thereby causing the glass to separate from the glass panel 1 on its own.

[0098] See Figure 10a as well as Figure 10b The processing component 33 can enter the access position P1 of the glass panel 10b forming the cutting line 1b along the access path L2. (See reference...) Figure 10b Next, the processing component 33 can move along the processing path L1 to remove a portion of the glass between the cutting line 1b and the edge region 11 adjacent to the cutting line 1b. See also... Figure 10c Next, the processing component 33 can move to the disengagement position P2, at which point it will move along the processing path L1 to remove any remaining glass between the cutting line 1b and the edge region 11 adjacent to the cutting line 1b. Upon reaching the disengagement position P2, the processing component 33 can then detach from the glass panel 1 along the disengagement path L3.

[0099] By means of the processing component 33 entering the entry position P1 during the hot chamfering step S50, the glass between the cutting line 1b on the side adjacent to the entry position P1 and the edge region 11 of the glass panel 1 can be separated from the glass panel 1. Next, by means of the processing component 33 entering the exit position P2, the glass between the cutting line 1b on the side adjacent to the exit position P2 and the edge region 11 of the glass panel 1 can be separated from the glass panel 1. Thus, by performing the hot chamfering step S50, one side of the glass panel 1 can include a cured area, i.e., a surface-treated area 11a, processed by the hot chamfering step S50, and a laser-cut surface, i.e., an untreated area 11d, formed by the cutting line 1b. At this time, the surface-treated area 11a can have higher strength compared to the untreated area 11d.

[0100] The untreated area 11d can have a side shape that extends vertically along the vertical direction. Furthermore, the treated area 11a can have a side shape that extends vertically along the vertical direction, or it can have a rounded D-shaped cut shape. For example, by performing a strengthening step on the glass panel 1 before performing the hot chamfering step S50, the treated area 11a can have a rounded D-shaped cut shape when the hot chamfering step S50 is performed by the processing member 33.

[0101] The strengthening step can be a process of chemically strengthening the glass panel 1 by replacing alkali metal ions present on the surface of the glass panel 1 with larger diameter cations or alkali metal ions, thereby forming a strengthening layer on the surface of the glass panel 1. As an example, the Na+ on the surface of the glass panel 1 can be chemically strengthened to remove alkali metal ions. + Ion replacement with K +Ions, but the scope of the present invention is not limited to this, as long as the alkali metal ions present on the surface of the glass panel 1 are replaced with alkali metal ions with larger diameters.

[0102] During the hot chamfering step S50, the moving speed of the processing component 33 along the processing path L1 can be in the range of approximately 5 mm / s or more and less than 10 mm / s. The thickness of the glass panel 1 is inversely proportional to the moving speed of the processing component 33. If the moving speed is less than 5 mm / s, it may be difficult to control the shape of the edge region 11 of the glass panel 1. If the moving speed is more than 10 mm / s, it may be difficult to control the edge region 11 into the required shape or to easily separate the heated glass from the glass panel 1 because heat cannot be sufficiently transferred to the glass panel 1.

[0103] At this time, the speed at which the processing component 33 detaches from the detachment position P2 can be in the range of approximately 10 mm / s or more and 20 mm / s or less. That is, it is preferable to set the detachment speed of the processing component 33 to be faster than the entry speed. When the detachment speed of the processing component 33 at the detachment position P2 is less than 10 mm / s, the recess 11b formed on the edge region 11 of the glass panel 1 on the side where the detachment position P2 is set may become more noticeable. That is, because the edge region 11 of the glass panel 1 on the side adjacent to the detachment position P2 is in a state where heat has already been partially conducted when the processing component 33 enters the entry position P1, when the detachment speed of the processing component 33 is less than 10 mm / s, heat will be conducted to the edge region 11 again, resulting in an increase in the amount of heat chamfering and thus forming the recess 11b. Furthermore, when the detachment speed of the processing component 33 exceeds 20 mm / s, it may be difficult to control the glass into the desired shape or to easily separate the heated glass from the glass panel 1 because the heat cannot be sufficiently transferred to the glass panel 1.

[0104] Figure 11 It is a schematic diagram used to illustrate the entry angle of the machined part; and Figure 12 It is a schematic diagram used to illustrate the separation angle of machined parts.

[0105] In addition, see Figure 11 The machining component 33 can enter the entry position P1 with an entry angle θ1 between the approach path L2 and the machining path L1. In this case, the entry angle θ1 is preferably an acute angle, especially approximately 50°, but the scope of the invention is not limited to this numerical range. Furthermore, see [reference needed]. Figure 12The machining component 33 can be disengaged from the disengagement position P2 with a disengagement angle θ2 between the disengagement path L3 and the machining path L1. In this case, the disengagement angle θ2 is preferably an obtuse angle, especially about 130°, but the scope of the invention is not limited to the said numerical range.

[0106] Furthermore, during the hot chamfering step S50, the processing component 33 can be heated to a temperature ranging from above 1000°C to below 1500°C. If the processing component 33 is heated to below 1000°C, it may cause difficulties in melting the glass panel 1, while if it is heated to above 1500°C, it may cause damage to the processing component 130.

[0107] Furthermore, the applied pressure of the processing component 33, controlled by the voice coil motor (VCM), can be in the range of approximately 50 gf or more, but less than 80 gf. If the applied pressure controlled by the voice coil motor (VCM) is less than 50 gf, it may cause difficulty in precisely controlling the shape of the glass panel 1, while if it exceeds 80 gf, it may cause the glass panel 1 to break.

[0108] Figure 13 This is a plan view of a glass panel formed by a glass panel hot chamfering method according to one embodiment of the present invention; and Figure 14 This is a plan view of a glass panel formed by the hot chamfering method of the glass panel according to the comparative example.

[0109] Next, a comparative description will be given with reference to the accompanying drawings of a glass panel (test example) formed by a glass panel hot chamfering method according to an embodiment of the present invention and a comparative example. In forming the glass panel 1' according to the comparative example, the cutting step S10 and the hot chamfering step S50 were performed, but the cutting line forming step S30 was not performed.

[0110] In both the experimental and comparative examples, the parameters such as temperature, time, and composition weight % in the cutting and hot chamfering steps were set to substantially the same values. Furthermore, the thickness of glass panels 1 and 1' was 0.1T. In the experimental example, the cutting line 1b was substantially parallel to the processing path, spaced 0.1 mm from the adjacent glass panel 1, and extended along the processing path L1 with a length of 5 mm. Additionally, the cutting line 1b was formed with a width of approximately 3 μm along the processing path L1 and the direction of application of the processing component 33.

[0111] In such Figure 13In the experimental example shown, it can be confirmed that the step portion 11c has a length D2 that protrudes outward from the edge region 11 of the glass panel 1 by approximately 15 μm. That is, it can be confirmed that when performing the hot chamfering step S50 on the glass panel 1 that forms the cutting line 1b, the side line deviation of the edge region 11 of the glass panel 1 can be significantly improved by minimizing the step portion 11c.

[0112] In such Figure 14 In the comparative example shown, it can be confirmed that the step portion 11c' has a length D3 protruding outward from the edge region 11' of the glass panel 1' by approximately 70 μm. That is, the formed step portion 11c' is relatively noticeable. At this time, it can be assumed that after performing a thermal chamfer on the edge region 11' of the glass panel 1', the step portion 11c' is removed by laser cutting. Because the thickness and size of the step portion 11c' are very small, it will be difficult to remove it accurately from the glass panel 1' by laser cutting. That is, when removing the step portion 11c' by laser cutting, cracks or breakage will inevitably occur in the edge region 11' or its surrounding area of ​​the glass panel 1', even when the laser output power is adjusted.

[0113] The detailed description above is merely illustrative of the invention. Furthermore, the foregoing description is only a preferred embodiment of the invention, and the invention can be used in many other combinations, modifications, and environments. That is, changes or modifications can be made within the scope of the concepts disclosed in this specification, the equivalent of the described content, and / or the technical or knowledge scope of the industry. The embodiments described above are merely illustrative of the best state for implementing the technical idea of ​​the invention, and various modifications can be made according to the specific application field and usage requirements of the invention. Therefore, the detailed description of the invention above is not intended to limit the invention to the disclosed embodiments.

Claims

1. A method for hot chamfering a glass panel, characterized in that, include: The cutting line forming step involves forming a cutting line on one side of the glass panel; as well as The hot chamfering step involves using a hot chamfering device to hot chamfer the edge area of ​​the glass panel on which the cutting lines are formed. The hot chamfering device includes: A processing component moves along a processing path to perform a hot chamfer on the edge area of ​​the glass panel; as well as A heat-generating unit that heats the processed component.

2. The glass panel hot chamfering method according to claim 1, characterized in that, At least one side of the cutting line overlaps with an imaginary line, which is the boundary between the area removed from the glass panel and the remaining area during the hot chamfering step.

3. The glass panel hot chamfering method according to claim 1, characterized in that, The processing component enters the glass panel from the entry position and disengages from the glass panel from the disengagement position. The cutting line overlaps with the entry position and the exit position along a direction that intersects perpendicularly with the processing path of the processing component on a horizontal plane.

4. The glass panel hot chamfering method according to claim 3, characterized in that, The entry position is separated from the exit position by the processing path.

5. The glass panel hot chamfering method according to claim 3, characterized in that, The disengagement position is set at the center of the cutting line or on the side offset from the center in a direction opposite to the cutting line, based on the processing path of the processing component.

6. The glass panel hot chamfering method according to claim 1, characterized in that, The processing component enters the glass panel along the access path. The approach path and the processing path form an acute angle.

7. The glass panel hot chamfering method according to claim 1, characterized in that, The processed component detaches from the glass panel along the detachment path. The detachment path forms an obtuse angle with the processing path.

8. The glass panel hot chamfering method according to claim 1, characterized in that, The cutting line is a straight line shape that is parallel to the processing path of the processed part.

9. The glass panel hot chamfering method according to claim 3, characterized in that, The cutting line includes: The first line extends from the side adjacent to the entry position in a manner parallel to the processing path of the processed part; and The second line extends diagonally from the side adjacent to the disengagement position.

10. The method for hot chamfering of a glass panel according to claim 1, characterized in that, The cutting line is spaced apart from the edge area of ​​the glass panel. The distance between the cutting line and the edge region is a value in the range of more than 1 and less than 4 times the thickness of the glass panel.

11. The glass panel hot chamfering method according to claim 3, characterized in that, The disengagement speed of the processing component at the disengagement position is faster than the movement speed of the processing component during the hot chamfering step of the glass panel.

12. A glass panel formed by the hot chamfering method for a glass panel according to claim 1, characterized in that, One side of the glass panel includes: Surface treated area after hot chamfering; as well as Untreated areas of the surface after laser cutting.

13. The glass panel according to claim 12, characterized in that, The surface of the untreated area extends in the vertical direction.

14. The glass panel according to claim 12, characterized in that, Also includes: A strengthening step involves chemically strengthening the glass panel prior to the hot chamfering step. The surface of the surface-treated area has rounded corners.

15. The glass panel according to claim 12, characterized in that, The surface of the surface-treated area extends vertically.

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