A power charging and distribution system thermal management method, device and electronic equipment

Abstract

The application relates to the technical field of vehicles. In order to solve the problem of how to control the temperature of a charging and power supply system, the application provides a charging and power supply system heat management method, device and electronic equipment. The method comprises the following steps: obtaining a first temperature measurement value of a first temperature measurement point; based on a first design threshold group corresponding to the first temperature measurement point and a threshold correspondence relationship between a standard threshold group of a heat management scheme, the first temperature measurement value is converted into a first equivalent calculation temperature value, wherein: one or more design thresholds of the first design threshold group are matched with design characteristics of the charging and power supply system; the standard threshold comprises one or more standard thresholds corresponding to the one or more design thresholds; and based on the heat management scheme, the charging and power supply system is heat managed according to the first equivalent calculation temperature value. According to the method provided in the application, the workload of designing the heat management scheme can be reduced, and the parasitic energy consumption of the cooling system can be reduced.

Description

Technical Field

[0001] This application relates to the field of vehicles, and in particular to a thermal management method, apparatus and electronic device for a charging and distribution system. Background Technology

[0002] With the continuous development of new energy technologies, electric vehicles are becoming increasingly popular. To achieve charging and power distribution functions, electric vehicles are equipped with a charging and power distribution system. This system includes heat-generating components such as power modules, switching transistors, and main transformers. During operation, these components generate heat, causing their own and surrounding components to heat up. Excessive component temperature can lead to malfunctions in the charging and power distribution system, ultimately preventing the electric vehicle from operating normally and affecting its stability and safety.

[0003] Therefore, a thermal management method for charging and distribution systems is needed to control the temperature of the charging and distribution systems and prevent abnormal operation caused by excessively high temperatures. Summary of the Invention

[0004] To address the issue of controlling the temperature of a charging and distribution system, this application provides a method, apparatus, and electronic device for thermal management of a charging and distribution system. This application also provides a computer program product and a computer-readable storage medium.

[0005] The embodiments of this application adopt the following technical solutions: In a first aspect, this application provides a thermal management method for a charging and distribution system, applied to electronic devices, the method comprising: Obtain a first temperature measurement value, wherein the first temperature measurement value is the temperature measurement value of the first temperature measurement point of the charging and distribution system; Based on the threshold correspondence between the first design threshold group corresponding to the first temperature measurement point and the standard threshold group of the thermal management scheme, the first temperature measurement value is converted into a first equivalent calculated temperature value, wherein: the first design threshold group includes one or more design thresholds, and the one or more design thresholds of the first design threshold group match the design characteristics of the charging and distribution system; the standard threshold includes one or more standard thresholds corresponding to one or more design thresholds; when the first temperature measurement value is greater than or equal to the first design threshold of the first design threshold group, the first equivalent calculated temperature value is greater than or equal to the first standard threshold corresponding to the first design threshold; Based on the thermal management scheme, thermal management of the charging and distribution system is performed according to the first equivalent calculated temperature value.

[0006] According to the method of this application embodiment, by converting the temperature measurement value into an equivalent calculated temperature value, the data finally reported to the thermal management module is unified as an equivalent calculated temperature value. The thermal management system can realize thermal management based on a unified thermal management scheme. When designing the thermal management scheme, there is no need to consider the design differences of different charging and distribution systems, thereby reducing the workload of designing the thermal management scheme.

[0007] According to the method in the embodiments of this application, the temperature differences caused by the design differences of the charging and distribution system can be reported uniformly on the platform, thereby achieving fine control of the vehicle's energy consumption, significantly reducing the parasitic energy consumption of the cooling system, improving the range, and simultaneously simplifying the design of cooling calibration for real vehicle charging scenarios.

[0008] The method according to the embodiments of this application can achieve differentiated thermal management for charging and distribution systems with different designs. The method according to the embodiments of this application also provides high consistency in cooling performance, enabling consistent vehicle-wide thermal safety control for charging and distribution systems with different designs.

[0009] According to the method in the embodiments of this application, temperature differences caused by hardware differences are absorbed by software coefficients, thereby achieving "plug and play" control of multi-platform and multi-supplier components and simplifying repeated calibration tests of the whole vehicle.

[0010] In one implementation of the first aspect, the method further includes: Acquire a second temperature measurement value, wherein the second temperature measurement value is the temperature measurement value of the second temperature measurement point of the charging and distribution system; Based on the second design threshold group corresponding to the second temperature measurement point and the threshold correspondence between it and the standard threshold group, the second temperature measurement value is converted into a second equivalent calculated temperature value. Specifically: the second design threshold group includes one or more design thresholds, and the one or more design thresholds of the second design threshold group match the design characteristics of the charging and distribution system; the one or more design thresholds of the second design threshold group correspond to one or more standard thresholds; when the second temperature measurement value is greater than or equal to the second design threshold of the second design threshold group, the second equivalent calculated temperature value is greater than or equal to the second standard threshold corresponding to the second design threshold.

[0011] In one implementation of the first aspect, the method includes: Acquire multiple temperature measurements for the current thermal management cycle, the multiple temperature measurements including at least a first temperature measurement and a second temperature measurement; Multiple temperature measurements are converted into multiple equivalent calculated temperature values, wherein the multiple equivalent calculated temperature values ​​include at least a first equivalent calculated temperature value and a second equivalent calculated temperature value. If the first equivalent calculated temperature value is the highest among multiple equivalent calculated temperature values, then during the current thermal management cycle, thermal management of the charging and distribution system is performed based on the thermal management scheme and the first equivalent calculated temperature value.

[0012] In one implementation of the first aspect, the standard threshold set includes cooling standard thresholds; thermal management of the charging and distribution system based on a first equivalent calculated temperature value includes: If the equivalent calculated temperature value is greater than or equal to the cooling standard threshold, the cooling system is activated to cool the charging and distribution system.

[0013] In one implementation of the first aspect, the standard threshold group further includes a shutdown standard threshold; thermal management of the charging and distribution system based on a first equivalent calculated temperature value also includes: If the equivalent calculated temperature value is greater than or equal to the shutdown standard threshold, the charging and distribution system will be shut down.

[0014] In one implementation of the first aspect, the first design threshold group includes: Cooling design threshold, which describes the temperature threshold at which the charging and distribution system needs to be cooled according to the design characteristics of the charging and distribution system; Shutdown design threshold, which describes the temperature threshold at which the charging and distribution system needs to be shut down according to its design characteristics.

[0015] In one implementation of the first aspect, the first temperature measurement value is converted into a first equivalent calculated temperature value, wherein: If the first temperature measurement value is greater than or equal to the cooling design threshold, the first equivalent calculated temperature value is greater than or equal to the cooling standard threshold. If the first temperature measurement value is greater than or equal to the shutdown design threshold, the first equivalent calculated temperature value is greater than or equal to the shutdown standard threshold.

[0016] Secondly, this application provides an electronic device, which includes a memory and a processor; The processor executes instructions stored in memory to cause the electronic device to perform the method as described in the first aspect.

[0017] Thirdly, this application provides a computer program product containing instructions that, when executed by a computing device system, cause a cluster of computing devices to perform the method as described in the first aspect.

[0018] Fourthly, this application provides a computer-readable storage medium including computer program instructions, which, when executed by a computer system, cause the computer system to perform the method as described in the first aspect. Attached Figure Description

[0019] Figure 1 The diagram shown is a schematic diagram of an electronic device structure according to an embodiment of this application; Figure 2 The diagram shown is a schematic diagram of the thermal management device of a charging and distribution system according to an embodiment of this application; Figure 3 The diagram shown is a schematic flowchart of a detection method according to an embodiment of this application; Figure 4 This is a schematic diagram of an electronic device structure according to an embodiment of this application. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0022] To address the issue of controlling the temperature of the charging and distribution system, a feasible technical solution is to design a thermal management module for the charging and distribution system. Temperature sensors are configured in the charging and distribution system to detect the temperature of the components inside the system. When the component temperature reaches or exceeds a preset temperature threshold, the thermal management module takes corresponding temperature control measures, such as activating the active cooling system and / or stopping the component from working.

[0023] However, with the booming demand and expanded production capacity in the electric vehicle industry, OEMs typically adopt a multi-supplier development and supply model for the development and management of various components. The vehicle's charging and distribution system is no exception. The independent underlying development approaches of different manufacturers lead to inherent design differences in their charging and distribution systems. For example, there are significant differences in the hardware of power components: the main power topology, structural design, internal cooling characteristics, selection of key heat-generating components (power modules, switching transistors, main transformers, etc.), and the placement of temperature sensors vary from manufacturer to manufacturer. This results in significant differences in the temperature values ​​reported to the VCU (Vehicle Controller Unit) by different manufacturers' charging and distribution systems, even under the same operating conditions in a vehicle scenario.

[0024] In the above scenario, to ensure stable operation of the charging and distribution system, the thermal management module uses a temperature threshold that covers the temperature reporting characteristics of charging and distribution systems from all manufacturers. While this ensures consistent cooling in absolute terms, it cannot guarantee relatively consistent cooling across charging and distribution power modules from multiple suppliers. This leads to the thermal management module prematurely and continuously activating cooling for charging and distribution systems with temperature detection points closer to heat-generating components, resulting in unnecessary energy consumption and impacting the vehicle's range.

[0025] To address the aforementioned issues, a feasible solution is to design corresponding thermal management strategies for different manufacturers' charging and power distribution systems, thereby reducing cooling energy waste while ensuring effective thermal management. However, designing separate thermal management strategies for different manufacturers' charging and power distribution systems requires repeated calibration tests on the vehicle's extreme thermal damage and high-temperature charging conditions, which significantly increases development costs.

[0026] To address the aforementioned problems, this application provides a thermal management method for charging and distribution systems. In this method, a thermal management scheme based on temperature thresholds is designed. Temperature detection results reported by charging and distribution systems from different manufacturers are converted into standard temperature detection results that can be directly applied to the thermal management scheme and then provided to the thermal management module. According to the method of this application, the thermal management module only needs to adopt a unified thermal management scheme to achieve thermal management of the charging and distribution system, eliminating the need to design separate thermal management strategies for different manufacturers' charging and distribution systems. The method of this application can effectively reduce cooling energy waste while ensuring effective thermal management.

[0027] The methods described in this application are applied to electronic devices. This application does not impose specific limitations on the electronic devices to which the methods of this application are applied. For example, the electronic device may be a vehicle (the vehicle's infotainment system), a local device installed in the vehicle to provide thermal management functions, or a remote device (e.g., a cloud server) remotely connected to the vehicle to provide thermal management services.

[0028] Specifically, the method provided in any embodiment of this application can be applied to electronic devices such as vehicles, in-vehicle systems, mobile phones, tablets, personal digital assistants (PDAs), desktops, laptops, notebook computers, ultra-mobile personal computers (UMPCs), handheld computers, and netbooks. This application does not impose any special restrictions on the specific form of the aforementioned electronic devices.

[0029] Figure 1 The diagram shown is a schematic diagram of an electronic device structure according to an embodiment of this application.

[0030] The method provided in any embodiment of this application can be applied to... Figure 1 In the electronic device 100 shown.

[0031] Electronic device 100 may include processor 110, external memory interface 120, internal memory 121, interface 130, power management module 141, antenna 1, communication module 150, audio module 170, sensor module 180, camera 193, display screen 194, etc.

[0032] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0033] The processor 110 may be an on-chip device (SOC) or other architecture. The processor 110 may include a central processing unit (CPU) and may further include other types of processors.

[0034] Processor 110 may include one or more processing units. For example, the processing units of processor 110 may include any combination of one or more of the following: Central Processing Unit (CPU), Digital Signal Processor (DSP), Microcontroller Unit (MCU), Digital Signal Processor (DSP), Application Processor (AP), Graphics Processing Unit (GPU), Neural-network Processing Units (NPU), Image Signal Processing (ISP), Modem Processor, Controller, Video Codec, and Baseband Processor. Processing units of processor 110 may also include other processing units besides those described above.

[0035] In processor 110, different processing units can be independent devices or integrated into one or more processors. The controller can generate operation control signals based on the instruction opcode and timing signals to control instruction fetching and execution.

[0036] The processor may also include necessary hardware accelerators or logic processing hardware circuitry, such as an ASIC, or one or more integrated circuits for controlling the execution of the program in this application. Furthermore, the processor may have the capability to operate one or more software programs, which may be stored in a storage medium.

[0037] The processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the instruction or data again, it can retrieve it directly from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0038] In some embodiments, processor 110 may include one or more interfaces.

[0039] The interfaces of processor 110 may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc.

[0040] Interface 130 is used to provide an interface for external access of electronic device 100 to processor 110.

[0041] In one embodiment, interface 130 is an interface of processor 110. In another embodiment, interface 130 includes an interface conversion module for converting one type of interface to another. One end of the interface conversion module provides external access for electronic device 100, and the other end of the interface conversion module is connected to the interface of processor 110.

[0042] It is understood that the interface connection relationships between the modules illustrated in the embodiments of this application are merely illustrative and do not constitute a structural limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may also employ different interface connection methods or combinations of multiple interface connection methods as described in the above embodiments.

[0043] Internal memory 121 can be used to store computer executable program code, which includes instructions.

[0044] The internal memory 121 may include a program storage area and a data storage area. The program storage area may store the operating system and at least one application program required for a given function (such as sound playback, image playback, etc.). The data storage area may store data generated during the use of the electronic device 100 (such as vehicle driving data, navigation data, etc.).

[0045] Internal memory 121 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, universal flash storage (UFS), etc. Processor 110 executes various functional applications and data processing of electronic device 100 by running instructions stored in internal memory 121 and / or instructions stored in memory disposed in the processor.

[0046] The internal memory 121 may be a read-only memory (ROM), other types of static storage devices that can store static information and instructions, random access memory (RAM), or other types of dynamic storage devices that can store information and instructions. It may also be an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), a magnetic disk storage medium, or other magnetic storage devices. Alternatively, it may be any computer-readable medium capable of carrying or storing desired program code in the form of instructions or data structures that can be accessed by a computer.

[0047] Processor 110 and internal memory 121 can be combined into a single processing device, or more commonly they are separate components.

[0048] The external storage interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 100. The external memory card communicates with the processor 110 through the external storage interface 120 to perform data storage functions. For example, music, video, and other files can be saved on the external memory card.

[0049] The power management module 141 manages the power supply to various components of the electronic device 100. In one embodiment, the power management module 141 includes a charging management module and a battery. The charging management module receives charging input from a charger (e.g., a charging station).

[0050] The power management module 141 can also be used to monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance). In some other embodiments, the power management module 141 may also be located within the processor 110. In other embodiments, the power management module 141 and the charging management module 140 may also be located in the same device.

[0051] The wireless communication function of electronic device 100 can be realized through antenna 1, communication module 150, etc.

[0052] Antenna 1 is used to transmit and receive electromagnetic wave signals. Antenna 1 may include one or more physical antennas. Each antenna in electronic device 100 can be used to cover one or more communication frequency bands. Different antennas can also be reused to improve antenna utilization.

[0053] The communication module 150 may be one or more devices integrating at least one communication processing module. The communication module 150 can provide wireless communication solutions, including 2G / 3G / 4G / 5G, for use on the electronic device 100. The communication module 150 can also provide wireless communication solutions, including wireless local area networks (WLANs) (such as Wireless Fidelity (Wi-Fi) networks), Bluetooth (BT), Global Navigation Satellite System (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies, for use on the electronic device 100.

[0054] The display screen 194 is used to display images, videos, etc. In some embodiments, the electronic device 100 may include one or N display screens 194, where N is a positive integer greater than 1.

[0055] Camera 193 is used to capture still images or videos. In some embodiments, electronic device 100 may include one or N cameras 193, where N is a positive integer greater than 1.

[0056] The audio module 170 is used to convert digital audio information into analog audio signals for output, and also to convert analog audio input into digital audio signals. The audio module 170 can also be used for encoding and decoding audio signals. In some embodiments, the audio module 170 may be located in the processor 110, or some functional modules of the audio module 170 may be located in the processor 110.

[0057] In some embodiments, the electronic device 100 further includes a speaker, a microphone, etc. The electronic device 100 can implement audio functions through the audio module 170, the speaker, the microphone, and an application processor, such as music playback and voice control.

[0058] The sensor module 180 may include pressure sensors, gyroscope sensors, barometric pressure sensors, magnetic sensors, accelerometers, distance sensors, proximity sensors, fingerprint sensors, temperature sensors, touch sensors, ambient light sensors, bone conduction sensors, etc.

[0059] In some embodiments, the electronic device 100 also includes buttons, indicators, etc.

[0060] For example, buttons include vehicle start button, volume buttons, air conditioning control buttons, etc. Buttons can be mechanical buttons or touch-sensitive buttons. Electronic device 100 can receive button input and generate key signal inputs related to user settings and function control of electronic device 100.

[0061] Indicators can be indicator lights, used to indicate vehicle status such as speed, charging status, and battery level; they can also be used to indicate messages such as fault alarms and low battery alarms.

[0062] In addition to the aforementioned components, the electronic device runs an operating system. For example, iOS. ® Operating system, Android ® Operating system, Windows ® Operating systems, such as vehicle operating systems, can be used to install and run applications. The software system of electronic device 100 can adopt a layered architecture, event-driven architecture, microkernel architecture, microservice architecture, or cloud architecture.

[0063] Furthermore, in one embodiment, the method of this application embodiment can be applied to an electronic device. This electronic device may refer in whole or in part to electronic device 100.

[0064] In another embodiment, the method of this application can be applied to a system composed of multiple electronic devices, where each electronic device in the system executes a portion of the method steps. Any electronic device in the system can refer to electronic device 100 in whole or in part.

[0065] In order to implement the thermal management method for the charging and distribution system proposed in the embodiments of this application, an embodiment of this application also proposes a thermal management device for the charging and distribution system.

[0066] Figure 2 The diagram shown is a schematic diagram of the thermal management device of a charging and distribution system according to an embodiment of this application.

[0067] like Figure 2 As shown, the thermal management device 600 for the charging and distribution system includes a conversion module 201 and a thermal management module 202.

[0068] The conversion module 201 is used to convert the temperature measurement values ​​reported by the thermal management system into equivalent calculated temperature values.

[0069] The thermal management module 202 is used to load the thermal management scheme, taking the equivalent calculated temperature value output by the conversion module 201 as the input of the thermal management scheme, and performing the corresponding thermal management operation according to the input temperature value.

[0070] In one embodiment, a thermal management scheme is designed according to the component design, national standard requirements, and temperature characteristics of the charging and distribution assembly. In the thermal management scheme, a unified and fixed derating temperature threshold for the main power function at the component level and an over-temperature protection shutdown temperature threshold for the main power function at the component level are defined.

[0071] Specifically, in one embodiment, the thermal management scheme includes a standard threshold group, which comprises one or more standard thresholds, with different standard thresholds corresponding to different thermal management operations. The thermal management scheme is designed such that when the input temperature value is greater than or equal to a certain standard threshold, the thermal management operation corresponding to that standard threshold is executed.

[0072] This application does not limit the specific content of the thermal management scheme. Those skilled in the art can design the specific content of the thermal management scheme according to actual needs.

[0073] For example, in one embodiment, the standard threshold group includes a cooling standard threshold (a derating temperature threshold for the main power function), and the thermal management operation corresponding to the cooling standard threshold is to perform a cooling operation on the charging and distribution system, such as turning on the fan and / or the water cooling system.

[0074] For example, in one embodiment, the standard threshold group includes multiple different cooling standard thresholds, each corresponding to a different level of cooling operation for the charging and distribution system. For instance, turning on the fan and setting the speed to level 1, turning on the fan and setting the speed to level 2, turning on the fan and setting the speed to level 3, and so on.

[0075] For example, in one embodiment, the standard threshold group includes a shutdown standard threshold (over-temperature protection shutdown temperature threshold for the main power function), and the thermal management operation corresponding to the shutdown standard threshold is to shut down the charging and distribution system, for example, to turn off the power supply of the charging and distribution system or to turn off the power supply of one or more heat-generating components in the charging and distribution system.

[0076] For example, in one embodiment, the standard threshold group includes multiple different shutdown standard thresholds, each corresponding to a different level of shutdown operation for the charging and distribution system. For example, shutting off the power to one or more heat-generating components in the charging and distribution system, or shutting off the power to the entire charging and distribution system, etc.

[0077] Specifically, in one embodiment, the standard threshold set of the thermal management scheme includes a cooling standard threshold and a shutdown standard threshold.

[0078] This application does not limit the specific way of implementing the detection device. Those skilled in the art can design the implementation method of the device according to the actual situation.

[0079] For example, in one embodiment, the device is installed on the electronic device in hardware (e.g., a functional chip). In another embodiment, the device is installed in the operating system of the electronic device as software code. Yet another embodiment, the device is installed on the electronic device as a combination of hardware and software.

[0080] Furthermore, in one embodiment, the device is mounted on an electronic device.

[0081] In another embodiment, the device is mounted on multiple electronic devices, which together form a complete device structure. Different electronic devices may install the same functional modules, or different electronic devices may install different functional modules.

[0082] In the description of the embodiments of this application, for the sake of convenience, the device is described by dividing it into various modules according to its functions. The division of each module is only a logical functional division. When implementing the embodiments of this application, the functions of each module can be implemented in one or more software and / or hardware.

[0083] Specifically, the apparatus proposed in this application can be fully or partially integrated onto a single physical entity (e.g., a GPU or other type of processor), or it can be physically separated. These modules can be implemented entirely in software via processing element calls; entirely in hardware; or some modules can be implemented in software via processing element calls, while others are implemented in hardware. For example, the detection module can be a separate processing element or integrated into a chip in an electronic device. The implementation of other modules is similar. Furthermore, these modules can be fully or partially integrated together or implemented independently. During implementation, each step of the above method or each of the above modules can be completed through integrated logic circuits in the hardware of the processor element or through software instructions.

[0084] For example, these modules can be one or more integrated circuits configured to implement the above methods, such as one or more application-specific integrated circuits (ASICs), one or more digital signal processors (DSPs), or one or more field-programmable gate arrays (FPGAs). Alternatively, these modules can be integrated together as a system-on-a-chip (SOC).

[0085] Figure 3 The diagram shown is a schematic flowchart of a detection method according to an embodiment of this application.

[0086] In one embodiment, the electronic device performs as follows Figure 3 The following process is shown to implement thermal management for the vehicle's charging and distribution system.

[0087] S300, acquire the first temperature measurement value.

[0088] Specifically, in one embodiment, the vehicle's charging and distribution system is equipped with a first temperature measurement point, and the first temperature measurement value is the temperature measurement value of the first temperature measurement point.

[0089] This application does not limit the specific implementation method of temperature measurement, temperature value acquisition, and temperature value reporting for the vehicle's charging and distribution system. Those skilled in the art can design a vehicle's charging and distribution system according to actual needs to achieve temperature measurement, temperature value acquisition, and temperature value reporting.

[0090] S301, convert the first temperature measurement value into the first equivalent calculated temperature value.

[0091] In one embodiment, the electronic device is equipped with Figure 2 The thermal management device 200 of the charging and distribution system shown is executed by the conversion module 201 in step S301.

[0092] In one embodiment, design thresholds corresponding to standard thresholds are set for the charging and distribution system. Specifically, for the charging and distribution system, a design threshold group is set for each temperature measurement point, and a design threshold group includes one or more design thresholds. Within the same design threshold group, different design thresholds correspond to different thermal management operations.

[0093] In one embodiment, the design thresholds of the charging and power distribution system are matched with the design features of the charging and power distribution system. The design features of the charging and power distribution system include its structure, options, and other characteristics. The design threshold set corresponding to the temperature measurement point is fixed due to the inherent characteristics of the devices surrounding the temperature measurement point. Each design threshold in the design threshold set corresponding to the temperature measurement point is determined based on the characteristics of the key heat-generating devices near the temperature measurement point.

[0094] That is, according to the design of the charging and power distribution system, when the actual measured temperature of a certain temperature sensor in the charging and power distribution system is greater than or equal to a certain design threshold in its corresponding design threshold group, the thermal management operation corresponding to that design threshold needs to be executed to ensure that the charging and power distribution system continues to operate stably.

[0095] Specifically, in one embodiment, a first design threshold group is set for the first temperature measurement point. The first design threshold group includes one or more design thresholds, and the one or more design thresholds of the first design threshold group match the design characteristics of the charging and distribution system.

[0096] Furthermore, the design threshold settings of the charging and distribution system also correspond to the standard threshold settings of the thermal management scheme. Each design threshold in a design threshold group corresponds to a standard threshold, and different design thresholds may correspond to the same or different standard thresholds. Corresponding design thresholds and standard thresholds correspond to the same or equivalent thermal management operations.

[0097] Specifically, in one embodiment, the standard threshold includes one or more standard thresholds, and one or more design thresholds of the first design threshold group correspond to one or more standard thresholds of the standard threshold.

[0098] Specifically, in one embodiment, the number of design thresholds in the design threshold group of the charging and power distribution system is the same as the number of standard thresholds in the thermal management scheme, and the design thresholds in the design threshold group correspond one-to-one with the standard thresholds. In another embodiment, the number of design thresholds in the design threshold group of the charging and power distribution system is less than the number of standard thresholds in the thermal management scheme.

[0099] For example, in one embodiment, the standard threshold set includes a cooling standard threshold and a shutdown standard threshold; correspondingly, the first design threshold set includes: Cooling design threshold, which describes the temperature threshold at which the charging and distribution system needs to be cooled according to the design characteristics of the charging and distribution system; Shutdown design threshold, which describes the temperature threshold at which the charging and distribution system needs to be shut down according to its design characteristics.

[0100] In one embodiment, the temperature measurement value is converted into an equivalent calculated temperature value based on the correspondence between the design threshold and the standard threshold. Specifically, when converting the temperature measurement value into an equivalent calculated temperature value, if the temperature measurement value is greater than or equal to a certain design threshold corresponding to the temperature measurement point, the converted equivalent calculated temperature value is greater than or equal to the standard threshold corresponding to that design threshold.

[0101] For example, in S301, based on the threshold correspondence between the first design threshold group corresponding to the first temperature measurement point and the standard threshold group of the thermal management scheme, the first temperature measurement value is converted into a first equivalent calculated temperature value. Specifically, when the first temperature measurement value is greater than or equal to the first design threshold of the first design threshold group, the first equivalent calculated temperature value is greater than or equal to the first standard threshold corresponding to the first design threshold.

[0102] Specifically, in one embodiment, the standard threshold group includes a cooling standard threshold and a shutdown standard threshold, and correspondingly, the first design threshold group includes a cooling design threshold and a shutdown design threshold. In S301, if the first temperature measurement value is greater than or equal to the cooling design threshold, the converted first equivalent calculated temperature value is greater than or equal to the cooling standard threshold; if the first temperature measurement value is greater than or equal to the shutdown design threshold, the converted first equivalent calculated temperature value is greater than or equal to the shutdown standard threshold.

[0103] S302, Based on the thermal management scheme, thermal management is performed on the charging and distribution system according to the first equivalent calculated temperature value.

[0104] In one embodiment, the electronic device is equipped with Figure 2 The thermal management device 200 of the charging and distribution system shown is executed by the thermal management module 202 in step S302.

[0105] Specifically, in one embodiment, the thermal management module 202 uses the first equivalent calculated temperature value output by the conversion module 201 as the input of the thermal management scheme. When the first equivalent calculated temperature value is greater than or equal to a certain standard threshold, the thermal management operation corresponding to the standard threshold is executed.

[0106] For example, when the first equivalent calculated temperature value is greater than or equal to the cooling standard threshold, a cooling operation is performed on the charging and distribution system, such as turning on the fan and / or the water cooling system; when the first equivalent calculated temperature value is greater than or equal to the shutdown standard threshold, a shutdown operation is performed on the charging and distribution system, such as turning off the power supply to the charging and distribution system or turning off the power supply to one or more heat-generating components in the charging and distribution system.

[0107] According to the method of this application embodiment, by converting the temperature measurement value into an equivalent calculated temperature value, the data finally reported to the thermal management module is unified as an equivalent calculated temperature value. The thermal management system can realize thermal management based on a unified thermal management scheme. When designing the thermal management scheme, there is no need to consider the design differences of different charging and distribution systems, thereby reducing the workload of designing the thermal management scheme.

[0108] According to the method in the embodiments of this application, the temperature differences caused by the design differences of the charging and distribution system can be reported uniformly on the platform, thereby achieving fine control of the vehicle's energy consumption, significantly reducing the parasitic energy consumption of the cooling system, improving the range, and simultaneously simplifying the design of cooling calibration for real vehicle charging scenarios.

[0109] The method according to the embodiments of this application can achieve differentiated thermal management for charging and distribution systems with different designs. The method according to the embodiments of this application also provides high consistency in cooling performance, enabling consistent vehicle-wide thermal safety control for charging and distribution systems with different designs.

[0110] According to the method in the embodiments of this application, temperature differences caused by hardware differences are absorbed by software coefficients, thereby achieving "plug and play" control of multi-platform and multi-supplier components and simplifying repeated calibration tests of the whole vehicle.

[0111] Furthermore, in temperature measurement scenarios, environmental changes or temperature sensor malfunctions may cause the first temperature measurement value at the first temperature measurement point to fluctuate drastically in a short period of time, resulting in drastically fluctuating the calculated first equivalent temperature value. This, in turn, causes the thermal management module 202 to frequently change its thermal management operations, increasing unnecessary system losses and affecting system stability.

[0112] In response to the above situation, in one embodiment, a fixed thermal management cycle (e.g., 10 seconds) is set, during which the thermal management module 202 maintains a thermal management operation.

[0113] For example, in a thermal management cycle, the thermal management module 202 performs the corresponding thermal management operation based on the equivalent calculated temperature value received at the end of the previous thermal management cycle or at the beginning of the current thermal management cycle.

[0114] For example, in a thermal management cycle, the thermal management module 202 performs the corresponding thermal management operation based on the highest equivalent calculated temperature value among multiple equivalent calculated temperature values ​​received in the previous thermal management cycle.

[0115] Furthermore, in one embodiment, the conversion module 201 sends the equivalent calculated temperature value to the thermal management module 202 only once in a thermal management cycle to reduce the communication pressure between the conversion module 201 and the thermal management module 202.

[0116] For example, during a thermal management cycle, the conversion module 201 sends the equivalent calculated temperature value obtained at the end of the previous thermal management cycle or at the beginning of the current thermal management cycle to the thermal management module 202.

[0117] For example, in a thermal management cycle, the conversion module 201 sends the equivalent calculated temperature value with the highest value among the multiple equivalent calculated temperature values ​​obtained in the previous thermal management cycle to the thermal management module 202.

[0118] Furthermore, in one embodiment, the vehicle's charging and power distribution system is equipped with multiple different temperature measurement points. At the same time, the temperature measurement values ​​at different temperature measurement points may be the same or different.

[0119] In one embodiment, different design threshold groups are set for different temperature measurement points, and / or the same design threshold group is set for multiple different temperature measurement points. The design thresholds in different design threshold groups correspond one-to-one; the corresponding design thresholds in different design threshold groups may be the same or different.

[0120] For example, in one embodiment, the multiple different temperature measurement points of the charging and distribution system include at least a first temperature measurement point and a second temperature measurement point. Corresponding to the second temperature measurement point, a design threshold group is provided, which includes one or more design thresholds. The one or more design thresholds in the second design threshold group match the design characteristics of the charging and distribution system. The design thresholds in the second design threshold group correspond one-to-one with the design thresholds in the first design threshold group. Furthermore, the design thresholds in the second design threshold group correspond to the standard thresholds in the standard threshold group.

[0121] For example, in one embodiment, the standard thresholds of the thermal management scheme include a cooling standard threshold To_otp1 and a shutdown standard threshold To_otp2. The cooling standard threshold To_otp1 and the shutdown standard threshold To_otp2 correspond to cooling operations and shutdown operations, respectively.

[0122] The charging and distribution system includes temperature measurement point A (first temperature measurement point) and temperature measurement point B (second temperature measurement point). A cooling design threshold TA_otp1 and a shutdown design threshold TA_otp2 (first design threshold group) are set for temperature measurement point A. A cooling design threshold TB_otp1 and a shutdown design threshold TB_otp2 (second design threshold group) are set for temperature measurement point B.

[0123] TA_otp1 and TB_otp1 correspond to cooling operations, while TA_otp2 and TB_otp2 correspond to shutdown operations. That is, according to the design characteristics of the charging and power distribution system, when the temperature measurement value at temperature measurement point A is greater than or equal to TA_otp1 and / or the temperature measurement value at temperature measurement point B is greater than or equal to TB_otp1, a cooling operation needs to be performed on the charging and power distribution system to ensure its continued stable operation; when the temperature measurement value at temperature measurement point A is greater than or equal to TA_otp2 and / or the temperature measurement value at temperature measurement point B is greater than or equal to TB_otp2, a shutdown operation needs to be performed on the charging and power distribution system to ensure its safety.

[0124] Specifically, for the second temperature measurement point, in one embodiment, the method further includes: Acquire a second temperature measurement value, wherein the second temperature measurement value is the temperature measurement value of the second temperature measurement point of the charging and distribution system; Based on the second design threshold group corresponding to the second temperature measurement point and the threshold correspondence between the standard threshold group, the second temperature measurement value is converted into a second equivalent calculated temperature value, wherein: when the second temperature measurement value is greater than or equal to the second design threshold of the second design threshold group, the second equivalent calculated temperature value is greater than or equal to the second standard threshold corresponding to the second design threshold.

[0125] In one embodiment, the standard thresholds of the thermal management scheme include a cooling standard threshold To_otp1 and a shutdown standard threshold To_otp2. The cooling standard threshold To_otp1 and the shutdown standard threshold To_otp2 correspond to cooling operations and shutdown operations, respectively.

[0126] The charging and distribution system includes i temperature measurement points. A cooling design threshold Ti_otp1 and a shutdown design threshold Ti_otp2 are set for the i-th temperature measurement point. The temperature measurement value Si of the i-th temperature measurement point is converted into an equivalent calculated temperature value Vi based on the following formula.

[0127] , (Formula 1) In Formula 1, To_min is the preset minimum input temperature value in the thermal management scheme, To_max is the preset maximum input temperature value in the thermal management scheme, Ti_min is the minimum temperature measurement value of the i-th temperature measurement point, and Ti_max is the maximum temperature measurement value of the i-th temperature measurement point.

[0128] Furthermore, in scenarios where the charging and distribution system includes multiple temperature measurement points, the system simultaneously reports the temperature measurement values ​​from multiple points to the conversion module 201. The conversion module 201 then performs conversions to obtain multiple equivalent calculated temperature values ​​for each of the multiple temperature measurement points. When multiple equivalent calculated temperature values ​​simultaneously meet multiple standard thresholds, the thermal management module 202 cannot perform thermal management operations based on these multiple equivalent calculated temperature values ​​simultaneously.

[0129] Therefore, in one embodiment, the method includes: Acquire multiple temperature measurements for the current thermal management cycle, the multiple temperature measurements including at least a first temperature measurement and a second temperature measurement; Multiple temperature measurements are converted into multiple equivalent calculated temperature values, wherein the multiple equivalent calculated temperature values ​​include at least a first equivalent calculated temperature value and a second equivalent calculated temperature value. If the first equivalent calculated temperature value is the highest among multiple equivalent calculated temperature values, then during the current thermal management cycle, thermal management of the charging and distribution system is performed based on the thermal management scheme and the first equivalent calculated temperature value.

[0130] Specifically, in one embodiment, during a thermal management cycle, the charging and distribution system reports the temperature measurement values ​​of all temperature measurement points to the conversion module 201, which converts each received temperature measurement value into an equivalent calculated temperature value.

[0131] Furthermore, in one embodiment, the conversion module 201 sends all the converted equivalent calculated temperature values ​​to the thermal management module 202, and the thermal management module 202 performs thermal management operations in the current thermal management cycle based on the highest equivalent calculated temperature value received in the previous thermal management cycle.

[0132] In another embodiment, at the start of the current thermal management cycle, the conversion module 201 sends the equivalent calculated temperature value with the highest value among all equivalent calculated temperature values ​​converted from the previous thermal management cycle to the thermal management module 202.

[0133] Furthermore, in one embodiment, the charging and distribution system synchronously reports the temperature measurement values ​​of all temperature measurement points to the conversion module 201. In another embodiment, the charging and distribution system reports the temperature measurement values ​​of each temperature measurement point to the conversion module 201 in turn, and ensures that the temperature measurement value of each temperature measurement point is reported at least once within a thermal management cycle. Within a thermal management cycle, for the same temperature measurement point, the charging and distribution system reports the temperature measurement value at least once (multiple reports are possible).

[0134] An embodiment of this application also proposes an electronic device. This electronic device is used to execute the method flow or part of the method flow described in the embodiments of this application. This electronic device is the electronic device described in the embodiments of this application.

[0135] Figure 4 This is a schematic diagram of an electronic device structure according to an embodiment of this application.

[0136] like Figure 4 As shown, the electronic device 2500 includes a memory 2502 for storing computer program instructions and a processor 2501 for executing the program instructions. When the computer program instructions are executed by the processor 2501, the electronic device 2500 is triggered to execute the method steps performed by the electronic device as described in the embodiments of this application.

[0137] Specifically, in one embodiment of this application, the aforementioned one or more computer programs are stored in the aforementioned memory 2502. The aforementioned one or more computer programs include instructions that, when executed by the aforementioned electronic device 2500, cause the aforementioned electronic device 2500 to perform the method steps described in the embodiments of this application.

[0138] It is understood that the structural description of the electronic device 2500 in this application does not constitute a specific limitation on the electronic device 2500. In other embodiments of this application, the electronic device 2500 may include other components besides the processor 2501 and the memory 2502.

[0139] In one embodiment, electronic device 2500 may refer to electronic device 100, wherein processor 2501 may refer to processor 110, and memory 2502 may refer to internal memory 121.

[0140] Processor 2501 and memory 2502 can be combined into a single processing device, but more commonly they are separate components.

[0141] An embodiment of this application also provides an electronic chip. This electronic chip is used to execute the method flow or part of the method flow described in the embodiments of this application.

[0142] Specifically, the electronic chip includes a processor for executing program instructions. When the computer program instructions are executed by the processor, the electronic chip is triggered to perform the steps described in the embodiments of this application. The processor of the electronic chip can refer to the processor of the above-described electronic device.

[0143] Optionally, the devices, apparatuses, and modules described in the embodiments of this application may be implemented by computer chips or physical entities, or by products with certain functions.

[0144] Those skilled in the art will understand that embodiments of this application can be provided as methods, apparatus, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media containing computer-usable program code.

[0145] In the several embodiments provided in this application, any function, if implemented as a software functional unit and sold or used as an independent product, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application.

[0146] Specifically, one embodiment of this application also provides a computer-readable storage medium storing a computer program that, when run on a computer, causes the computer to execute the method provided in the embodiment of this application.

[0147] An embodiment of this application also provides a computer program product, which includes a computer program that, when run on a computer, causes the computer to perform the method provided in the embodiment of this application.

[0148] The embodiments described in this application are described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (devices), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations. Figure 1One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0149] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0150] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0151] It should also be noted that in the embodiments of this application, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent the existence of A alone, the simultaneous existence of A and B, or the existence of B alone. A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" and similar expressions refer to any combination of these items, including any combination of singular or plural items. For example, at least one of a, b, and c can represent: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, and c can be single or multiple.

[0152] In this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0153] This application can be described in the general context of computer-executable instructions, such as program modules, that are executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform a specific task or implement a specific abstract data type. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0154] The various embodiments in this application are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the device embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0155] Those skilled in the art will recognize that the units and algorithm steps described in the embodiments of this application can be implemented using electronic hardware, computer software, or a combination of electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0156] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the devices, apparatuses, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0157] The above description is merely a specific embodiment of this application. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application. The protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A thermal management method for a charging and distribution system, characterized in that, The method is applied to an electronic device, and the method includes: Obtain a first temperature measurement value, wherein the first temperature measurement value is the temperature measurement value of the first temperature measurement point of the charging and distribution system; Based on the threshold correspondence between the first design threshold group corresponding to the first temperature measurement point and the standard threshold group of the thermal management scheme, the first temperature measurement value is converted into a first equivalent calculated temperature value, wherein: the first design threshold group includes one or more design thresholds, and one or more design thresholds of the first design threshold group match the design characteristics of the charging and distribution system; the standard threshold includes one or more standard thresholds corresponding to the one or more design thresholds; when the first temperature measurement value is greater than or equal to the first design threshold of the first design threshold group, the first equivalent calculated temperature value is greater than or equal to the first standard threshold corresponding to the first design threshold; Based on the aforementioned thermal management scheme, thermal management is performed on the charging and distribution system according to the first equivalent calculated temperature value.

2. The method according to claim 1, characterized in that, The method further includes: Obtain a second temperature measurement value, wherein the second temperature measurement value is the temperature measurement value of the second temperature measurement point of the charging and distribution system; Based on the second design threshold group corresponding to the second temperature measurement point and the threshold correspondence between it and the standard threshold group, the second temperature measurement value is converted into a second equivalent calculated temperature value, wherein: the second design threshold group includes one or more design thresholds, and one or more design thresholds of the second design threshold group match the design characteristics of the charging and distribution system; one or more design thresholds of the second design threshold group correspond to one or more standard thresholds; when the second temperature measurement value is greater than or equal to the second design threshold of the second design threshold group, the second equivalent calculated temperature value is greater than or equal to the second standard threshold corresponding to the second design threshold.

3. The method according to claim 2, characterized in that, The method includes: Acquire multiple temperature measurements for the current thermal management cycle, wherein the multiple temperature measurements include at least the first temperature measurement and the second temperature measurement; The plurality of temperature measurements are converted into a plurality of corresponding equivalent calculated temperature values, wherein the plurality of equivalent calculated temperature values ​​include at least the first equivalent calculated temperature value and the second equivalent calculated temperature value; If the first equivalent calculated temperature value is the highest among the plurality of equivalent calculated temperature values, then in the current thermal management cycle, based on the thermal management scheme, thermal management is performed on the charging and distribution system according to the first equivalent calculated temperature value.

4. The method according to any one of claims 1-3, characterized in that, The standard threshold group includes cooling standard thresholds; the thermal management of the charging and distribution system based on the first equivalent calculated temperature value includes: If the equivalent calculated temperature value is greater than or equal to the cooling standard threshold, the cooling system is activated to cool the charging and distribution system.

5. The method according to claim 4, characterized in that, The standard threshold group further includes a shutdown standard threshold; the thermal management of the charging and distribution system based on the first equivalent calculated temperature value further includes: If the equivalent calculated temperature value is greater than or equal to the shutdown standard threshold, the charging and power distribution system is controlled to perform a shutdown operation.

6. The method according to claim 5, characterized in that, The first design threshold group includes: Cooling design threshold, which describes the temperature threshold at which the charging and distribution system needs to be cooled according to the design features of the charging and distribution system; Shutdown design threshold, which describes the temperature threshold at which the charging and distribution system needs to be shut down according to the design characteristics of the charging and distribution system.

7. The method according to claim 6, characterized in that, The step of converting the first temperature measurement value into a first equivalent calculated temperature value, wherein: If the first temperature measurement value is greater than or equal to the cooling design threshold, the first equivalent calculated temperature value is greater than or equal to the cooling standard threshold. If the first temperature measurement value is greater than or equal to the shutdown design threshold, the first equivalent calculated temperature value is greater than or equal to the shutdown standard threshold.

8. An electronic device, characterized in that, The electronic device includes a memory and a processor; The processor is configured to execute instructions stored in the memory to cause the electronic device to perform the method as described in any one of claims 1-7.

9. A computer program product containing instructions, characterized in that, When the instruction is executed by the computing device system, it causes the computing device cluster to perform the method as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, It includes computer program instructions, which, when executed by a computer system, perform the method as described in any one of claims 1-7.

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