Self-correcting material receiving device

Abstract

The application belongs to the technical field of chip manufacturing, and particularly relates to a self-correcting material receiving device which comprises a first camera, a second camera, a control unit, an XY displacement unit, an angle compensation unit and a material receiving unit, the first camera and the second camera are signal connected with the control unit, the angle compensation unit and the XY displacement unit are signal connected with the output end of the control unit, the XY displacement unit and the angle compensation unit are jointly connected with the signal receiving end of the material receiving unit, the first camera is located directly above a material taking station, and the first camera vertically downwardly shoots the material taking station, the second camera is located on one side of the material taking station, and the shooting direction of the second camera is parallel to the plane on which the chip is placed at the material taking station, and the problem of how the material receiving unit accurately receives the chip is solved.

Description

Technical Field

[0001] This application belongs to the field of chip manufacturing technology, specifically a self-calibrating feeding device. Background Technology

[0002] When the chip is located at the pick-up station, the chip's orientation is not standard. Therefore, if the pick-up unit does not match the chip's orientation when picking up the chip, the chip's orientation on the pick-up unit will be incorrect, thus affecting the feeding process. Summary of the Invention

[0003] The purpose of this application is to address the shortcomings of existing technologies by designing a self-calibrating receiving device using a combination of a first camera and a second camera with an angle compensation unit. This allows the first and second cameras to simultaneously capture the actual placement of the chip from different angles when the chip is transferred to the pick-up station, transmitting the position offset and rotation angle data to the control unit. The control unit then calculates the compensation parameters and controls the XY unit and the angle compensation unit to correct the planar offset and rotation deviation of the receiving unit. After completing the coordinate self-calibration, the receiving unit accurately receives the chip.

[0004] The technical solution adopted in this application to solve the above problems is as follows: A self-calibrating receiving device includes a first camera, a second camera, a control unit, an XY displacement unit, an angle compensation unit, and a receiving unit. The first camera and the second camera are signal-connected to the control unit. The angle compensation unit and the XY displacement unit are signal-connected to the output terminal of the control unit. The XY displacement unit and the angle compensation unit are jointly connected to the signal receiving terminal of the receiving unit. The first camera is located directly above the receiving station and takes vertically downward images of the receiving station. The second camera is located to one side of the receiving station, and its shooting direction is parallel to the plane where the chip is placed at the receiving station.

[0005] Preferably, the control unit has a preset state of the chip placed on the receiving unit.

[0006] Preferably, the control unit compares the photos taken by the first camera and the second camera with a preset chip placement state, and then sends the comparison results to the angle compensation unit. The angle compensation unit corrects the plane offset and rotation deviation of the receiving unit for placing the chip based on the comparison results.

[0007] Preferably, the XY unit includes a first lead screw conveying mechanism and a second lead screw conveying mechanism. The second lead screw conveying mechanism is fixedly disposed on the execution end of the first lead screw conveying mechanism. The first lead screw in the first lead screw conveying mechanism and the second lead screw in the second lead screw conveying mechanism are perpendicular to each other. The receiving unit is disposed on the execution end of the second lead screw conveying mechanism. The plane on the receiving unit for placing the chip is parallel to the second lead screw.

[0008] Preferably, the XY unit further includes a first servo motor and a second servo motor. The second servo motor is fixedly mounted on the output shaft of the first servo motor, and the first lead screw transmission mechanism is fixedly mounted on the output shaft of the second servo motor. The output shafts of the first servo motor and the second servo motor are perpendicular to each other. Both the first servo motor and the second servo motor are signal-connected to the angle compensation unit.

[0009] Preferably, both the first camera and the second camera are 3D cameras.

[0010] Preferably, the control unit is a microcontroller.

[0011] Compared with the prior art, the self-calibrating material receiving device provided in this application has the following advantages: This application employs a method of setting up a first camera and a second camera in conjunction with an angle compensation unit to design a self-calibrating receiving device. When the chip is transferred to the picking station, the first camera and the second camera simultaneously capture the actual placement posture of the chip from different directions, and transmit the position offset and rotation angle data to the control unit. The control unit calculates the compensation parameters and controls the XY unit and the angle compensation unit respectively to correct the planar offset and rotation deviation of the receiving unit. After completing the coordinate self-calibration, the receiving unit accurately receives the chip. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the principle structure of this application; Figure 2 This is a schematic diagram of the angle compensation unit and the XY displacement unit.

[0013] in: 1. First camera; 2. Second camera; 3. Control unit; 4. XY displacement unit; 5. Angle compensation unit; 6. Material receiving unit; 7. First lead screw transmission mechanism; 8. Second lead screw transmission mechanism; 9. First servo motor; 10. Second servo motor. Detailed Implementation

[0014] Please see Figure 1-2A self-calibrating receiving device includes a first camera 1, a second camera 2, a control unit 3, an XY displacement unit 4, an angle compensation unit 5, and a receiving unit 6. The first camera 1 and the second camera 2 are signal-connected to the control unit 3. The angle compensation unit 5 and the XY displacement unit 4 are signal-connected to the output terminal of the control unit 3. The XY displacement unit 4 and the angle compensation unit 5 are jointly connected to the signal receiving terminal of the receiving unit 6. The first camera 1 is located directly above the receiving station and takes vertically downward photos of the receiving station. The second camera 2 is located to one side of the receiving station, and the shooting direction of the second camera 2 is parallel to the plane on which the chip is placed at the receiving station.

[0015] In this embodiment, during operation, the first camera 1 and the second camera 2 take pictures of the chip located at the pick-up station from different positions. The first camera 1 sends the picture to the control unit 3. After calculation, the control unit 3 transmits the signal to the angle compensation unit 5. The angle compensation unit 5 performs angle compensation and adjusts the receiving unit 6 together with the XY displacement unit 4 to accurately pick up the chip at the pick-up station.

[0016] As a preferred embodiment, the control unit 3 is pre-set with the state of the chip placed on the receiving unit 6. With this setting, the control unit 3 compares the photos taken by the first camera 1 and the second camera 2 with pre-stored standard photos to obtain the angle value to be compensated, as well as the compensation values ​​in the X and Y directions. Then, the angle value to be compensated is sent to the angle compensation unit 5 for angle compensation of the receiving unit 6. Simultaneously, the compensation values ​​in the X and Y directions are sent to the XY displacement unit 4 for X and Y direction value compensation of the receiving unit 6, thereby ensuring that the receiving unit 6 accurately receives the chip at the picking station.

[0017] In a preferred manner, the control unit 3 compares the photos taken by the first camera 1 and the second camera 2 with the preset chip placement state, and then sends the comparison results to the angle compensation unit 5. The angle compensation unit 5 corrects the plane offset and rotation deviation of the receiving unit 6 for placing the chip based on the comparison results.

[0018] In a preferred embodiment, the XY unit 4 includes a first lead screw conveyor 7 and a second lead screw conveyor 8. The second lead screw conveyor 8 is fixedly mounted on the actuating end of the first lead screw conveyor 7. The first lead screw in the first lead screw conveyor 7 and the second lead screw in the second lead screw conveyor 8 are perpendicular to each other. The receiving unit 6 is mounted on the actuating end of the second lead screw conveyor 8, and the plane on the receiving unit 6 for placing the chip is parallel to the second lead screw. With this configuration, the first lead screw conveyor 7 moves its actuating end to adjust its position in the X direction, while the second lead screw conveyor 8 moves its actuating end to adjust its position in the Y direction. Simultaneously, the position adjustment in the X direction also adjusts the second lead screw conveyor 8, thus adjusting the position of the receiving unit 6 in the plane.

[0019] In a preferred embodiment, the XY unit 4 further includes a first servo motor 9 and a second servo motor 10. The second servo motor 10 is fixedly mounted on the output shaft of the first servo motor 9, and the first lead screw transmission mechanism 7 is fixedly mounted on the output shaft of the second servo motor 10. The output shafts of the first servo motor 9 and the second servo motor 10 are perpendicular. Both the first servo motor 9 and the second servo motor 10 are signal-connected to the angle compensation unit 5. With this configuration, the first servo motor 9 adjusts the rotation angle on the X-axis to achieve angle compensation, while the second servo motor 10 adjusts the rotation angle on the Y-axis to achieve angle compensation.

[0020] As a preferred embodiment, both the first camera 1 and the second camera 2 are 3D cameras. 3D cameras can better identify the angle and position of the plane on the receiving unit 6 used to receive the chip, facilitating calculations by the control unit 3.

[0021] As a preferred embodiment, the control unit 3 is a microcontroller.

Claims

1. A self-calibrating material receiving device, characterized in that: The device includes a first camera (1), a second camera (2), a control unit (3), an XY displacement unit (4), an angle compensation unit (5), and a receiving unit (6). The first camera (1) and the second camera (2) are connected to the control unit (3). The angle compensation unit (5) and the XY displacement unit (4) are connected to the output of the control unit (3). The receiving unit (6) is installed on the XY displacement unit (4). The first camera (1) is located directly above the material picking station and takes vertically downward pictures of the material picking station. The second camera (2) is located on one side of the material picking station and its shooting direction is parallel to the plane where the chip is placed at the material picking station.

2. The self-calibrating receiving device according to claim 1, characterized in that: The control unit (3) is pre-set with the state of the chip placed on the receiving unit (6).

3. The self-calibrating receiving device according to claim 2, characterized in that: The control unit (3) compares the photos taken by the first camera (1) and the photos taken by the second camera (2) with the preset chip placement state, and then sends the comparison results to the angle compensation unit (5). The angle compensation unit (5) corrects the plane offset and rotation deviation of the receiving unit (6) for placing the chip based on the comparison results.

4. The self-calibrating receiving device according to claim 1, characterized in that: The XY unit (4) includes a first lead screw conveying mechanism (7) and a second lead screw conveying mechanism (8). The second lead screw conveying mechanism (8) is fixedly installed on the execution end of the first lead screw conveying mechanism (7). The first lead screw in the first lead screw conveying mechanism (7) and the second lead screw in the second lead screw conveying mechanism (8) are perpendicular to each other. The receiving unit (6) is installed on the execution end of the second lead screw conveying mechanism (8). The plane on the receiving unit (6) for placing the chip is parallel to the second lead screw.

5. The self-calibrating receiving device according to claim 4, characterized in that: The XY unit (4) further includes a first servo motor (9) and a second servo motor (10). The second servo motor (10) is fixedly mounted on the output shaft of the first servo motor (9). The first lead screw transmission mechanism (7) is fixedly mounted on the output shaft of the second servo motor (10). The output shaft of the first servo motor (9) is perpendicular to the output shaft of the second servo motor (10). Both the first servo motor (9) and the second servo motor (10) are signal connected to the angle compensation unit (5).

6. The self-calibrating receiving device according to claim 5, characterized in that: Both the first camera (1) and the second camera (2) are 3D cameras.

7. A self-calibrating receiving device according to claim 6, characterized in that: The control unit (3) is a microcontroller.

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