Method for stacking and unstacking of compression separators

Abstract

The application provides a pressing partition plate stacking and unstacking method, and belongs to the technical field of printed circuit board manufacturing. The method comprises a stacking process and an unstacking process. In the stacking process, each pressing partition plate is offset by a preset misalignment distance in the same horizontal axis direction alternately and then is placed in a stack, so that a material stack with adjacent partition plates arranged in a staggered manner and at least one side having an exposed edge is formed. In the unstacking process, an unstacking grabbing mechanism sucks the top layer of partition plates upward through a middle suction cup, and at the same time, presses the exposed edge of the second layer of partition plates downward through a pressing rod, so that the upward suction force of the top layer of partition plates and the downward constraint force of the second layer of partition plates form a reverse separation force to break the vacuum adsorption effect between adjacent partition plates. The application solves the problem that the pressing partition plate with high mirror surface smoothness is difficult to be separated stably in single sheet due to vacuum adsorption and adhesion from the synergistic effect of the optimization of the stacking structure and the stress design of the unstacking, and has high unstacking success rate and wide adaptation range.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, and more specifically, to a method for stacking and destacking pressed partitions. Background Technology

[0002] In the printed circuit board (PCB) lamination process, lamination separators (commonly known as separators or mirror panels) are core tooling for ensuring uniform pressure transmission and board surface flatness during lamination. The PCB lamination process requires stacking multiple conductive and insulating layers in an alternating manner and then pressing them together. Lamination separators play a crucial role in uniform pressure transmission and surface isolation between adjacent PCB components. With the iterative upgrades of high-frequency, high-speed, and high-density interconnect PCB products, the industry's requirements for the surface finish and process flow efficiency of lamination separators continue to increase, leading to a gradual expansion in the application of high-mirror stainless steel lamination separators.

[0003] Currently, the stacking and destacking of laminated partitions mostly adopts a flush stacking method, where the edges of the boards are completely aligned. Destacking is mostly done using vacuum suction cups for direct removal. For high-mirror-finish laminated partitions with a surface roughness Ra≤0.05μm, after flush stacking, the bonding surfaces of the boards are almost completely sealed, resulting in a large effective bonding area and tight adhesion between adjacent partitions. During the cooling process after high-temperature lamination, residual gas between the boards is expelled or the cooling contraction creates negative pressure, which easily leads to a strong vacuum adsorption effect, causing a significant increase in the peeling resistance between adjacent partitions. When using the traditional suction cup direct removal method, because the vacuum adsorption force is much greater than the weight of a single partition, it is very easy for two or even more partitions to stick together. This can cause minor issues such as material feeding misalignment and production line shutdown, or more serious issues such as scratches and plastic deformation of the partition surface, failing to meet the requirements for efficient and stable mass production of high-mirror-finish laminated partitions.

[0004] Existing technologies already offer some improvements. For example, separating excess steel plates by bending the diagonal sections is simple but easily leads to plate deformation and damage from falling plates. Another method is shaking separation, but this is ineffective in scenarios with high adhesion—such as stacks of mirror-finish stainless steel sheets with a transparent film coating—where airtightness is extremely high and electrostatic adhesion exists. Furthermore, current plate removal processes rely primarily on manual assembly lines. The stacks of products entering the assembly line are often hot, heavy, and multi-layered, resulting in high labor intensity and low efficiency for workers. Some improvements use suction cups combined with push rods to separate the plates through pressure, but these are all designed for flush stacking and rely on interlocking or warping methods. Existing solutions are only suitable for general adhesion problems in ordinary plates; they lack a systematic solution for the strong vacuum adsorption effect generated by high-mirror-finish stainless steel press-fit partitions after flush stacking.

[0005] Therefore, there is an urgent need to provide a method that can work synergistically from both stacking structure optimization and destabilization stress design to fundamentally solve the problem of high mirror finish pressed partitions being difficult to separate stably on a single sheet due to vacuum adsorption adhesion, so as to meet the automated mass production flow requirements of various specifications of stainless steel pressed partitions. Summary of the Invention

[0006] The purpose of this invention is to provide a method for stacking and destacking pressed partitions, which aims to solve the problems mentioned in the background art.

[0007] This invention is implemented as follows: a method for stacking and destacking laminated partitions, applied to a partition return conveying system in the printed circuit board lamination process, uses a gripping mechanism to complete the stacking and destacking of laminated partitions, including a stacking process and a destacking process. In the stacking process, the stacking gripping mechanism alternately shifts each pressed partition relative to the previous pressed partition in opposite directions along the same horizontal axis by a preset misalignment distance and then places it down for stacking, thereby forming a stack of materials with adjacent partitions staggered and at least one side having an exposed edge. In the destacking process, the destacking gripping mechanism uses a central suction cup to lift the top partition upwards, while simultaneously using a top pressure rod to press down on the exposed edge of the second-to-top partition. This causes the upward suction force on the top partition and the downward constraint force on the second-to-top partition to form a reverse separation force, thereby breaking the vacuum adsorption effect between adjacent partitions.

[0008] Optionally, in the stacking process, one side edge of the first pressing partition is aligned with the side positioning reference of the stacking station as a position reference for subsequent stacking. The subsequent pressing partitions are stacked in a bidirectional staggered manner relative to the previous pressing partition along the width direction of the stack with a preset fixed offset, so that both sides of the stack form continuous exposed edges in the shape of a city wall, and the overall center of gravity of the stack coincides with the central axis of the stack in the vertical direction.

[0009] Optionally, the preset misalignment distance ranges from 20mm to 70mm.

[0010] Optionally, a buffer contact is fixedly provided at the lower end of the top pressure rod.

[0011] Optionally, the buffer contact is a polyurethane buffer contact.

[0012] Optionally, the extension and retraction drive of the top pressure rod can be any one of cylinder drive, servo motor drive, or electric cylinder drive, and the top pressure of the top pressure rod can be adjusted by a pressure regulating valve or servo mechanism to adapt to pressing partitions of different thicknesses and rigidities.

[0013] Optionally, the suction cup frame of the destacking and gripping mechanism is provided with a number of vacuum suction cups in the middle, the vacuum suction cups are arranged in an array, and the top pressure rods are respectively provided at both ends of the suction cup frame along the horizontal axis.

[0014] Optionally, the preset misalignment distance is alternately offset in both directions along the horizontal axis; during the destabilization operation, the system determines the offset direction of the current top partition based on the plate offset sequence recorded during the stacking stage, and correspondingly selects the top pressure rod acting on the side where the exposed edge of the second-top partition is located to perform the pressing action.

[0015] Optionally, the press-fit partition is a high mirror stainless steel press-fit partition with a working surface roughness Ra≤0.05μm.

[0016] Another object of the present invention is a stacking and destacking system for pressed partitions, applied to the partition return conveying in the printed circuit board lamination process, comprising: The stacking gripping mechanism is configured to grip the pressing partition in the stacking process and offset it alternately in opposite directions by a preset misalignment distance along the same horizontal axis, and then stack it layer by layer to form a stack of materials with adjacent partitions staggered and at least one side having an exposed edge. The destacking gripping mechanism is configured to pick up the top partition upwards via a central suction cup during the destacking process, and press down on the exposed edge of the second-top partition downwards via a top pressure rod. This causes the upward suction force on the top partition and the downward constraint force on the second-top partition to form a reverse separation force, thereby breaking the vacuum adsorption effect between adjacent partitions.

[0017] The stacking and destacking method for pressed partitions provided by this invention has the following beneficial effects: 1) This invention employs a bidirectional, alternating, staggered stacking method along the same horizontal axis, creating a staggered arrangement between adjacent pressed partitions and a continuous, wall-like exposed edge structure on both sides of the stack. Compared to the traditional flush stacking method where adjacent partition edges are completely aligned and the bonding surface is almost completely sealed, the effective bonding area of ​​adjacent partitions is significantly reduced in this invention, disrupting the fully planar sealed bonding condition from the stacking morphology. Mass production verification shows that using this method, the initial peel resistance of high-mirror stainless steel pressed partitions (surface roughness Ra≤0.05μm) is reduced by more than 45% compared to the traditional flush stacking method, significantly reducing the difficulty of destacking and separating from the stack and fundamentally weakening the vacuum adsorption strength between the boards.

[0018] 2) In the destacking process of this invention, the destacking gripping mechanism uses a central suction cup to lift the top partition upwards, while a corresponding top pressure rod presses down against the exposed edge of the second-to-top partition. The upward suction and lifting force and the downward pressure constraint force form a reverse peeling and separation force, instantly breaking the vacuum seal between the two panels. This force design fully utilizes the exposed stepped edge structure formed on both sides of the wall-like stack, allowing the top pressure rod to act precisely on the edge area of ​​the second-to-top partition, generating a couple effect, achieving reliable separation with relatively small external force. Mass production verification shows that after adopting the method of this invention, the double-sheet rate of high-mirror-finish laminated partitions during destacking is reduced from 8.2% in the traditional suction cup direct method to 0, completely eliminating the phenomenon of double or even multiple sheets sticking together, achieving a 100% destacking success rate.

[0019] 3) This invention eliminates the need for repeated trials, prying, or shaking during destacking; a single destacking operation can stably separate individual partitions. The lower end of the pressure bar is equipped with a polyurethane buffer contact, allowing for precise adjustment of the contact pressure via a pressure regulating valve or servo mechanism. This ensures reliable constraint force while preventing impact, scratches, or plastic deformation of the partitions during the pressure process. Mass production verification shows that using this method reduces the single-cycle destacking time to 2.8 seconds, decreases the rate of surface scratches and deformation defects by over 99.9%, and ensures a smooth, impact-free separation process, significantly improving the operational efficiency of the partition reflow stage in the lamination process.

[0020] 4) This invention utilizes a bidirectional, alternating, staggered stacking method along the width of the stack with a preset fixed offset. This ensures that the overall center of gravity of the stack always coincides with the central axis of the stack in the vertical direction, guaranteeing the stability of the entire stack of partitions during conveying, transfer, and buffering processes. This avoids the risks of tipping, slipping, or jamming caused by center of gravity shift. This method does not change the main layout of existing lamination production lines and can stably adapt to the automated mass production of various specifications of stainless steel laminated partitions, demonstrating good industrial compatibility and promotional value.

[0021] 5) The preset misalignment distance of this invention ranges from 20mm to 70mm. The top pressure of the top pressure rod can be precisely adjusted by a cylinder or servo mechanism, which can flexibly adapt to the stacking and destacking requirements of press-fit partitions with different thicknesses, rigidities, and sizes. At the same time, during destacking, the system automatically determines the offset direction of the current top partition based on the plate offset sequence recorded during the stacking stage and selects the corresponding top pressure rod to perform the pressing action. The entire process is automated and requires no manual intervention, demonstrating a high degree of intelligence.

[0022] In summary, this invention, through the synergistic effect of stacking structure optimization and destabilization stress design, fundamentally solves the technical problem of high mirror finish lamination partitions being difficult to separate stably on a single sheet due to vacuum adsorption adhesion. This is of great significance for the automation upgrade and capacity improvement of the printed circuit board lamination process.

[0023] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0025] Figure 1 This is a schematic diagram of the stack structure after the pressed partitions are stacked in an embodiment of the present invention; Figure 2 This is a schematic diagram of the action of the destacking and gripping mechanism in an embodiment of the present invention to destacking the top layer of the stacked partition.

[0026] In the diagram: 1-pressing partition, 2-suction cup, 3-top pressure rod, 4-lifting mechanism, 5-translation mechanism. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following description will be provided in conjunction with the accompanying drawings of the embodiments of the present invention (please refer to the accompanying drawings). Figure 1 and Figure 2 This document provides a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0028] In a basic embodiment, a method for stacking and destacking pressed partitions is provided, applied to a partition return conveying system in the printed circuit board lamination process. The method uses a gripping mechanism to complete the stacking and destacking of the pressed partitions 1. The method includes a stacking process and a destacking process. The core feature of this embodiment is that, in the stacking process, each pressed partition 1 is alternately offset in opposite directions along the same horizontal axis by a preset misalignment distance relative to the preceding pressed partition 1 before being placed down, sequentially stacking to form a stack of adjacent partitions arranged in a staggered pattern, resembling a city wall on both sides (e.g., ...). Figure 1 As shown); in the destacking process, the destacking gripping mechanism uses the central suction cup 2 to lift the top partition upwards, while the corresponding side telescopic top pressure rod 3 presses down against the exposed edge of the second-to-top partition, breaking the vacuum adsorption between the boards through the reverse separation force.

[0029] In one embodiment, another method for stacking and destacking pressed partitions is provided, which further includes, on the basis of the above, the following: during the destacking operation, the system determines the offset direction of the current top partition according to the plate offset sequence recorded in the stacking stage, and selects the corresponding side top pressure rod 3 to perform the pressing action to adapt to the force requirements of the staggered arrangement.

[0030] As can be seen from the above stacking and destabilizing collaborative scheme, when the pressed partition 1 adopts an alternating staggered stacking method, the effective bonding area between adjacent partitions is significantly reduced, which destroys the full-plane sealed bonding condition from the stacking form and greatly reduces the vacuum adsorption strength between the boards. During destabilization, the central suction cup 2 lifts the top partition upward, while the corresponding top pressure rod 3 presses down against the exposed edge of the second-top partition. The upward adsorption and lifting force and the downward top pressure constraint force form a reverse peeling separation force, instantly breaking the vacuum sealed environment of the bonding surface of the two boards. In other words, this scheme, through the synergy of stacking structure optimization and destabilization force design, transforms the traditional single-point direct destabilization method into a combined destabilization strategy of structural pre-separation and reverse auxiliary separation, fundamentally solving the problem that high mirror finish pressed partitions are difficult to separate stably on a single sheet due to vacuum adsorption adhesion.

[0031] In a preferred embodiment, during the stacking process, one edge of the first pressing partition 1 is aligned with the side positioning reference of the stacking station, serving as the position reference for subsequent stacking. Subsequent pressing partitions 1 are then stacked in a staggered, bidirectional manner relative to the preceding pressing partition, along the width of the stack, with a preset fixed offset. This preferred method ensures that the overall center of gravity of the stack coincides with its central axis in the vertical direction, guaranteeing the stability of the stack's posture during transport and transfer, and avoiding the risk of tipping or slipping due to center of gravity shift.

[0032] In some optional embodiments, the extension and retraction drive of the aforementioned top pressure rod 3 can be either cylinder-driven or servo motor-driven. In another optional embodiment, the top pressure rod 3 can also be driven by an electric cylinder to achieve more precise position and pressure control.

[0033] Based on the aforementioned embodiments, a buffer contact can also be fixedly provided at the lower end of the top pressure rod 3. Specifically, the buffer contact is a polyurethane buffer contact, used to absorb impact energy during pressing contact and prevent deformation of the partition plate edge and surface damage during the pressing process.

[0034] In another optional embodiment, the buffer contact can also be a rubber buffer contact or a silicone buffer contact. In some optional embodiments, polyurethane buffer contacts and rubber buffer contacts can be selected according to the material and surface finish requirements of the partition, and the control system automatically matches and calls them according to the specifications of the partition being processed.

[0035] For example, the preset misalignment distance ranges from 20mm to 70mm. In a specific example, for a standard PCB lamination partition with a length of 800mm, the fixed misalignment is 25mm. When the number of stacked partitions reaches 32, the lifting conveyor mechanism of the stacking station is activated to transfer the entire stack of partitions to the destacking station on the lamination line. During the destacking process, when the top pressure rod 3 extends downward, the top pressure can be precisely adjusted by the pressure regulating valve, specifically applying a downward constraint pressure of 0.3MPa. This pressure value is sufficient to break the vacuum adsorption while preventing the partition from being deformed by pressure.

[0036] As a specific material choice, the pressing partition 1 is a high-mirror stainless steel pressing partition with a surface roughness Ra≤0.05μm. The main body of the suction cup frame of the destacking and gripping mechanism is made of high-strength aluminum alloy to reduce the inertia of moving parts and improve response speed. The vacuum suction cup 2 arranged in the middle of the suction cup frame can be made of nitrile rubber or fluororubber to ensure sufficient adsorption force without leaving marks when in contact with the high-mirror stainless steel surface.

[0037] To make the description of the above technical solution clearer and more specific, a preferred structural layout is (e.g.) Figure 2 (As shown): Both the stacking gripping mechanism and the destacking gripping mechanism are equipped with independent lifting mechanisms 4 and translation mechanisms 5. The lifting mechanism 4 drives the gripping component to rise and fall vertically, and the translation mechanism 5 drives the gripping component to move horizontally. The suction cup frame of the destacking gripping mechanism has four vacuum suction cups 2 arranged in a 2×2 array in the middle. At each end of the suction cup frame along its length, there is a pneumatic telescopic top pressure rod 3 with a polyurethane buffer contact. The vacuum pipeline of each suction cup 2 is independently controlled and connected in parallel to the same vacuum source. The pneumatic circuit of the top pressure rod 3 and the vacuum circuit of the suction cup 2 are arranged in separate sections on the air circuit board to avoid air pipe interference and signal crosstalk.

[0038] In practical use, this method includes two parts: a stacking process and a destacking process, which are described in detail below.

[0039] For the stacking process: After the system is powered on, the stacking gripper mechanism first performs a zero-reset and initialization self-test. The stacking process includes the following steps: Step 1: The translation mechanism 5 of the stacking gripping mechanism moves horizontally to the top of the return flow station under no load. The lifting mechanism 4 of the stacking gripping mechanism descends to the partition and uses a vacuum suction cup to pick up the pressing partition 1 and lift the pressing partition 1 to the preset safe height. Step Two: The translation mechanism 5 of the stacking gripping mechanism, under load, moves horizontally along the horizontal axis (corresponding to the width of the partition) to above the stacking station, aligning one side (left side) of the first pressed partition with the preset fixed side reference surface of the stacking station. It then smoothly lowers the partition onto the support platform, serving as the starting position reference for the entire stacking sequence. After the second partition is gripped, it is shifted to the right by a fixed misalignment relative to the first partition along the horizontal axis before being lowered, so that its right edge extends outward and retracts inward relative to the first partition. After the third partition is gripped, it is shifted to the left by a fixed misalignment along the horizontal axis before being lowered, so that its left edge extends outward and retracts inward relative to the second partition. Subsequent partitions are stacked in a cyclical pattern of "right-left-right shift," ultimately forming a wall-like stack with staggered arrangement of adjacent panels on both sides. Continuous stepped exposed edges are formed on both sides of the stack (e.g., Figure 1 As shown), the center of gravity of the stack body always coincides with the reference axis; after the partition is lowered, the lifting mechanism 4 of the stacking gripping mechanism is reset upward.

[0040] Steps one and two are repeated in this way until the number of stacked pieces reaches the preset number of stacked pieces. At this time, the conveying mechanism of the stacking station is activated to transfer the entire stack of pressing partition 1 to the destacking and loading station of the target production line.

[0041] In practical applications, the stacking process can operate in multiple modes. For example, in continuous stacking mode, the stacking gripper immediately returns to the return flow station to grab the next partition after completing the stacking of one partition, achieving uninterrupted stacking operation; in intermittent stacking mode, the stacking gripper pauses after completing the stacking of a preset number of partitions, waiting for manual confirmation or quality inspection scanning, before continuing the subsequent stacking operation.

[0042] For the destacking process: After stacking is completed, the destacking process includes the following steps: Step 1: The translation mechanism 5 of the destacking and gripping mechanism moves horizontally without load to directly above the stack. Based on the plate offset sequence stored in the stack memory, the system determines the offset direction of the current top-level partition and controls the corresponding top pressure rod 3 to stand by. The lifting mechanism 4 of the destacking and gripping mechanism descends to the stack, and the central suction cup 2 applies negative pressure, adsorbing the central working surface area of ​​the top-level partition. Immediately, the suction cup frame is pulled upwards, while the corresponding top pressure rod 3 extends downwards, and the buffer contact precisely presses against the exposed edge of the corresponding side of the second-to-top-level partition, applying a preset pressure. The downward constraint pressure; the upward adsorption and lifting force and the downward top pressure constraint force form a reverse peeling and separation force, instantly breaking the vacuum sealing environment of the two plates' bonding surface and completely eliminating the adsorption and adhesion effect; the top partition is smoothly lifted with the suction cup frame, and the second-top partition is reliably constrained in the material stack by the top pressure rod 3; subsequently, the destacking and grabbing mechanism lifts the grabbed partition to the preset safe height, while the top pressure rod 3 retracts, that is, the top pressure rod 3 remains extended until a clear gap (e.g., gap ≥ 5mm) appears between the top partition and the second-top partition and then retracts; Step 2: The horizontal translation mechanism 5 of the destacking and gripping mechanism moves horizontally to above the laminate production line. Then, the lifting mechanism 4 descends to the position and closes the vacuum, placing a single partition into the laminate production line. After that, the lifting mechanism 4 of the destacking and gripping mechanism returns to its original position.

[0043] Repeat steps one and two in this way until the stack is completely dismantled and placed, then reset and wait for the next dismantling cycle.

[0044] Corresponding to the above system, this application also provides a method for stacking and destacking pressed partitions. In some possible implementations, the method further includes the following refined control logic in the destacking step: when the system determines that the current top partition is in a left-side offset state, the right-side pressure rod 3 is controlled to stand by and perform a pressing action; when the system determines that the current top partition is in a right-side offset state, the left-side pressure rod 3 is controlled to stand by and perform a pressing action. In some possible cases, the system triggers the action of the corresponding side pressure rod 3 by using the plate offset sequence recorded during the stacking stage or by using a vision sensor set above the destacking station to identify the offset direction of the current top partition in real time.

[0045] It should be noted that the aforementioned "preset safety height" should be interpreted broadly. It can be a fixed physical height value or a height value dynamically calculated based on the partition size and production line layout, as long as it ensures that the partition does not interfere with any obstacles during horizontal movement. It is understood that the aforementioned "gripping mechanism" is not limited to a vacuum suction cup gripping mechanism; it can also be an electromagnetic adsorption or mechanical gripper gripping mechanism, as long as it can reliably grip and release the pressed partition 1.

[0046] The term "horizontal axis" should be interpreted broadly, referring to either the length or width of the partition. The specific direction depends on the production line layout and the dimensions of the partition, as long as the alternating offset stacking forms a wall-like material pile. The term "wall-like" should also be interpreted broadly, referring to the continuous stepped exposed edge shape formed on the sidewall of the material pile after adjacent partitions are stacked in a staggered manner, and is not limited to a specific tooth shape or size ratio.

[0047] It is understandable that the lifting mechanism 4 of the gripping mechanism is not limited to cylinder lifting; it can also be a servo electric cylinder, a lead screw and nut mechanism, or a linear motor, as long as it can achieve reciprocating drive in the vertical direction. Similarly, the translation mechanism 5 is not limited to a specific form and can be any mechanism that can achieve horizontal linear reciprocating motion, such as a synchronous belt module, a lead screw module, or a linear motor module.

[0048] For ease of understanding, the mechanism of the aforementioned reverse separation force can be explained as follows: When the top partition is pulled upward by the central suction cup 2, the vacuum adsorption force between the top partition and the second-to-top partition hinders separation. At this time, the top pressure rod 3 presses downward against the exposed edge of the second-to-top partition from the corresponding side, which is equivalent to applying a downward constraint force located at the edge of the second-to-top partition. This constraint force and the upward pulling force applied to the top partition by the suction cup 2 are located on both sides of the partition in space (the suction cup pulls upward in the middle of the partition surface, and the top pressure rod presses downward at the edge of the partition), forming a couple effect, which causes local tearing stress concentration at the edge of the mating surface, thereby breaking the vacuum seal with a relatively small external force. It is understood that in the actual separation process, a multi-order difference method can also be used to calculate the trend of the adsorption force between the plates to dynamically adjust the magnitude of the top pressure, and this embodiment does not limit this.

[0049] It is also worth noting that when the air source pressure fluctuates abnormally or the vacuum level is insufficient, the control system can automatically pause the destacking operation and issue an audible and visual alarm signal after detecting that the adsorption pressure or top pressure deviates from the set threshold, in order to avoid the partition falling due to insufficient adsorption force or damage to the panel surface due to excessive top pressure. At the same time, when the extension stroke of the top pressure rod 3 exceeds the limit or the wear of the buffer contact reaches the preset level, the system can automatically switch to the maintenance reminder state, prompting the operator to replace the buffer contact or repair the pneumatic circuit.

[0050] In practical applications, the foregoing embodiments and their optional features can be arbitrarily combined according to actual needs. For example, the basic embodiment can be combined with any type of top pressure rod 3 driving method, or the preferred structural layout can be combined with specific material selection. Furthermore, the alternating offset rule of the stacking process can be coordinated with the corresponding side top pressure selection of the destabilizing process. Specific implementation is not limited in this embodiment. All equivalent substitutions or modifications made within the spirit of this application should be included within the protection scope of this application.

Claims

1. A method for stacking and destacking laminated partitions, applied to a partition return conveying system in the laminated circuit board process, wherein the method uses a gripping mechanism to complete the stacking and destacking of laminated partitions, characterized in that... This includes stacking and destacking processes: In the stacking process, the stacking gripping mechanism alternately shifts each pressed partition relative to the previous pressed partition in opposite directions along the same horizontal axis by a preset misalignment distance and then places it down for stacking, thereby forming a stack of materials with adjacent partitions staggered and at least one side having an exposed edge. In the destacking process, the destacking gripping mechanism uses a central suction cup to lift the top partition upwards, while simultaneously using a top pressure rod to press down on the exposed edge of the second-to-top partition. This causes the upward suction force on the top partition and the downward constraint force on the second-to-top partition to form a reverse separation force, thereby breaking the vacuum adsorption effect between adjacent partitions.

2. The method for stacking and destacking the pressed partitions according to claim 1, characterized in that, In the stacking process, one side edge of the first pressing partition is aligned with the side positioning reference of the stacking station as the position reference for subsequent stacking. The subsequent pressing partitions are stacked in a bidirectional staggered manner relative to the previous pressing partition along the width direction of the stack with a preset fixed offset, so that both sides of the stack form continuous exposed edges in the shape of a city wall, and the overall center of gravity of the stack coincides with the central axis of the stack in the vertical direction.

3. The method for stacking and destacking the pressed partitions according to claim 1, characterized in that, The preset misalignment distance ranges from 20mm to 70mm.

4. The method for stacking and destacking the pressed partitions according to claim 1, characterized in that, A buffer contact is fixedly installed at the lower end of the top pressure rod.

5. The method for stacking and destacking the pressed partitions according to claim 4, characterized in that, The buffer contact is a polyurethane buffer contact.

6. The method for stacking and destacking the pressed partitions according to claim 1, characterized in that, The extension and retraction drive of the top pressure rod can be any one of cylinder drive, servo motor drive or electric cylinder drive. The top pressure of the top pressure rod is adjusted by a pressure regulating valve or servo mechanism to adapt to pressing partitions of different thicknesses and rigidities.

7. The method for stacking and destacking the pressed partitions according to claim 1, characterized in that, The suction cup frame of the destacking and gripping mechanism has several vacuum suction cups arranged in the middle, and the vacuum suction cups are distributed in an array. The top pressure rods are respectively provided at both ends of the suction cup frame along the horizontal axis.

8. The method for stacking and destacking the pressed partitions according to claim 1 or 3, characterized in that, The preset misalignment distance is alternately offset in both directions along the horizontal axis; During the destacking operation, the system determines the offset direction of the current top partition based on the plate offset sequence recorded during the stacking stage, and correspondingly selects the top pressure bar acting on the exposed edge of the second-top partition to perform the pressing action.

9. The method for stacking and destacking the pressed partitions according to claim 1, characterized in that, The press-fit partition is a high mirror stainless steel press-fit partition with a surface roughness Ra≤0.05μm on its working surface.

10. A stacking and destacking system for pressed partitions, used in the return conveying of partitions in the printed circuit board lamination process, characterized in that, include: The stacking gripping mechanism is configured to grip the pressing partition in the stacking process and offset it alternately in opposite directions by a preset misalignment distance along the same horizontal axis, and then stack it layer by layer to form a stack of materials with adjacent partitions staggered and at least one side having an exposed edge. The destacking gripping mechanism is configured to pick up the top partition upwards via a central suction cup during the destacking process, and press down on the exposed edge of the second-top partition downwards via a top pressure rod. This causes the upward suction force on the top partition and the downward constraint force on the second-top partition to form a reverse separation force, thereby breaking the vacuum adsorption effect between adjacent partitions.

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