Micromechanical component for a pressure transducer and method for manufacturing a micromechanical component
Patent Information
- Application Number
- CN202610444013.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2025-04-08
- Filing Date
- 2026-04-07
- Publication Date
- 2026-10-16
AI Technical Summary
[0005] Compared to the prior art described above, another advantage of each micromechanical component according to the invention is that it eliminates the need to widen the corresponding anchorage region of at least one column structure of the corresponding micromechanical component on the outer layer of the same micromechanical component. As will become clear from the following description, the flexibility/warpability of the outer layer in mechanical contact with it can be improved without widening the corresponding anchorage region, and the sensitivity of the micromechanical component implemented in this way is also improved accordingly.
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Figure CN122916042A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a micromechanical component for a pressure conversion device. Similarly, this invention relates to a pressure conversion device. Furthermore, this invention relates to a method for manufacturing a micromechanical component. Background Technology
[0002] US 2023 / 0339743 A1 describes a semiconductor device equipped with an internal space defined along a first spatial direction by a first warpable film on one side and a second warpable film on the other, and a rigid film structure extending through the internal space. Furthermore, the semiconductor device has pillar structures extending from the first warpable film to the second warpable film, respectively, and the warpable films are fixed together by the pillar structures. Summary of the Invention
[0003] This invention proposes a micromechanical component for a pressure conversion device, a pressure conversion device, and a method for manufacturing the micromechanical component.
[0004] Advantages of the invention This invention proposes micromechanical components that can be used to realize pressure conversion devices, and these micromechanical components have improved stability due to the inventive construction of at least one column structure, wherein the two outer layers of the corresponding micromechanical component are mutually fixed by the at least one column structure. Due to the varying column width in at least one spatial direction of each column structure of the micromechanical component according to the invention, undesirable deformation / bending of the corresponding column structure will not occur or will be virtually nonexistent. This contributes to extending the lifespan of the corresponding micromechanical component according to the invention.
[0005] Compared to the prior art described above, another advantage of each micromechanical component according to the invention is that it eliminates the need to widen the corresponding anchorage region of at least one column structure of the corresponding micromechanical component on the outer layer of the same micromechanical component. As will become clear from the following description, the flexibility / warpability of the outer layer in mechanical contact with it can be improved without widening the corresponding anchorage region, and the sensitivity of the micromechanical component implemented in this way is also improved accordingly.
[0006] In one advantageous embodiment of the micromechanical component, at least one protruding step is constructed on each of the at least one column structure. Constructing at least one protruding step on the respective column structure is relatively easy to achieve, thus enabling the micromechanical component embodiments described herein to be manufactured relatively cost-effectively.
[0007] For example, the at least one column structure may have a maximum column width that is greater than or equal to 120% of its minimum column width in the second spatial direction. As will become clear from the following description, the column widths of the corresponding column structures, which vary significantly in the second spatial direction, can be used for a variety of purposes. In particular, the at least one column structure may have a maximum column width that is greater than or equal to 130% of its minimum column width in the second spatial direction.
[0008] In a particularly advantageous embodiment of the micromechanical component, mechanical contact occurs between at least one protruding outer wall surface of the at least one column structure and the inner wall of the at least one void constructed in the inner layer, when the first distance equals the maximum value of its first distance range and the second distance equals the minimum value of its second distance range, and / or when the first distance equals the minimum value of its first distance range and the second distance equals the maximum value of its second distance range. As will become clear from the following description, this enables a novel stopping structure scheme by means of which the corresponding warping of the first outer layer, the second outer layer, and / or the inner layer can be limited. By means of this novel stopping structure scheme, the conventional stopping structure in the embodiments of the micromechanical component described herein can be eliminated, which can be used to reduce the manufacturing cost of the embodiments of the micromechanical component described herein.
[0009] Preferably, at least one protruding inner wall surface is constructed on the inner wall of at least one void portion constructed in the inner layer, such that the projection of the corresponding protruding inner wall surface along the first spatial direction overlaps with at least one associated protruding outer wall surface of at least one column structure. In this way, the implementation of the micromechanical component described herein can be reliably prevented from being damaged due to excessive warping of the first outer layer, the second outer layer, and / or the inner layer.
[0010] More preferably, each pillar structure is at least partially formed of at least one electrically insulating material. In this way, even in the event of a potential difference between the outer and inner layers, and even if the at least one pillar structure comes into mechanical contact with the inner layer, unwanted current flow through the respective pillar structure can be prevented.
[0011] The above advantages are also ensured if the inner wall of each of the at least one void constructed in the inner layer is coated with at least one electrical insulating material on at least a portion of its surface.
[0012] The advantages described above are also ensured in pressure conversion devices with such micromechanical components. The pressure conversion device can be, for example, a microphone, a pressure sensor, or a sound wave and / or ultrasonic generator.
[0013] Furthermore, the advantages described above are also achieved by implementing the corresponding manufacturing method for micro-mechanical components. It is explicitly stated that the manufacturing method can be extended based on the implementation method of the micro-mechanical components described above. Attached Figure Description
[0014] Other features and advantages of the invention will be explained below with reference to the accompanying drawings, which show: Figures 1a to 1c : A schematic partial view of the first embodiment of the micromechanical component; Figure 2 : A schematic partial illustration of the second embodiment of the micromechanical component; Figure 3 : A schematic partial illustration of the third embodiment of the micromechanical component; Figures 4a to 4c : A schematic partial illustration of the fourth embodiment of the micromechanical component; Figure 5 A schematic partial diagram illustrating the fifth embodiment of the micromechanical component; and Figures 6a to 6e : A schematic partial illustration of intermediate and final products, used to illustrate one implementation of a method for manufacturing micromechanical components. Detailed Implementation
[0015] Figures 1a to 1c A schematic partial diagram of a first embodiment of the micromechanical component is shown.
[0016] With the help of Figures 1a to 1c The schematically illustrated micromechanical component has a partially hollow internal space 10 constructed within it, defined along a first spatial direction x by a first surface 12a of a first outer layer 12 and a second surface 14a of a second outer layer 14. The first outer layer 12 and / or the second outer layer 14 may optionally be either perforated layers or (hermetic) sealing layers (non-perforated). Furthermore, at least one inner layer 16 extends through the internal space 10. This is merely an example. Figures 1a to 1c The micromechanical component is constructed with only a (single) inner layer 16. However, as will become clear from the following embodiments, the micromechanical component may also have multiple inner layers 16 (with the characteristics described below). Figures 1a to 1c It is evident that at least one inner layer 16 should be understood as a layer structure having a third surface 18a oriented toward the first surface 12a and a fourth surface 18b oriented toward the second surface 14a, the layer structure existing in the inner space 10.
[0017] The micromechanical component also has at least one column structure 20, through which the first outer layer 12 and the second outer layer 14 are fixed to each other. To ensure this, the corresponding inner layer 16 also has at least one opening 22, which extends from its third surface 18a to its fourth surface 18b. Each column structure 20 thus extends from the first surface 12a of the first outer layer 12 through the at least one opening 22 of the inner layer 16 to the second surface 14a of the second outer layer 14. Accordingly, each column structure 20 has a first anchoring region 24a and a second anchoring region 24b, where mechanical contact exists between the corresponding column structure 20 and the first outer layer 12 at the first anchoring region, and mechanical contact exists between the corresponding column structure 20 and the second outer layer 14 at the second anchoring region.
[0018] Although Figures 1a to 1c This is only schematically shown, but the micromechanical component also includes a retaining portion 26 on which the first outer layer 12, the second outer layer 14, and the at least one inner layer 16 are tensioned. The retaining portion 26 may be, for example, at least one substrate having a cut-out / reservation portion spanned by the layers 12 to 16. Since such a retaining portion 26 is known from the prior art, it will not be discussed in more detail.
[0019] The tension of the first outer layer 12, the second outer layer 14, and the inner layer 16 on the retaining portion 26 is achieved in such a way that the first outer layer 12, the second outer layer 14, and / or the inner layer 16 can be warped / have been warped from their respective initial shapes by means of pressure acting on the first outer layer, the second outer layer 14, and / or the inner layer 16 and / or a non-zero potential difference exists between at least two of the layers 12 to 16. Figure 1a A first outer layer 12, a second outer layer 14, and an inner layer 16 are shown in their respective initial shapes, i.e., when no pressure is applied to at least one of layers 12 to 16, or when there is no potential difference between layers 12 to 16. (As shown by...) Figure 1a and Figure 1b and 1c As can be seen by comparison, the first distance x1 between the first surface 12a and the third surface 18a and the second distance x2 between the second surface 14a and the fourth surface 18b can be changed by warping at least the outer layers 12 and 14 or the inner layer 16. Optionally, the outer layers 12 and 14 can be constructed as a warpable membrane structure or a warpable cantilever structure, while the inner layer 16 is rigidly constructed (as a layer or cantilever). Alternatively, however, the inner layer 16 can also be implemented as a warpable membrane structure or a warpable cantilever structure, while the outer layers 12 and 14 are rigidly constructed (as a layer or cantilever).
[0020] Furthermore, the at least one column structure 20 has a maximum column width b in at least one second spatial direction y. maxThe maximum column width is greater than or equal to its minimum column width b in the second spatial direction y. min 110%. The second spatial direction y should be understood as a direction perpendicular to the first spatial direction x. By changing the column width of the at least one column structure 20 along the second spatial direction y, its mechanical stability is improved. The change in the column width of the at least one column structure 20 along the second spatial direction y thus resists undesirable deformation / bending of the at least one column structure 20. In particular, in this way, the conventional risk of fracture of the at least one column structure 20 is significantly reduced.
[0021] Another advantage of altering the column width of the at least one column structure 20 oriented along the second spatial direction y is that it can be combined with the relatively small anchorage areas 24a and 24b of the at least one column structure 20 on the outer layers 12 and 14. Therefore, an increase in the bending stiffness of at least one column structure 20 is achieved without increasing / expanding its anchorage areas 24a and 24b. Due to the relatively small anchorage areas 24a and 24b achieved, the first outer layer 12 and the second outer layer 14 can be constructed to be relatively flexible, i.e., with relatively low bending stiffness. With the help of... Figures 1a to 1c The micromechanical components schematically shown are therefore well-suited for use as pressure conversion devices with highly sensitive sensing capabilities. If desired, at least one column structure 20 may have its corresponding minimum column width b at its anchoring regions 24a and 24b. min As its column width oriented along the second spatial direction y.
[0022] For example, the at least one column structure 20 may have a minimum column width b in the second spatial direction y, which is greater than or equal to its minimum column width in the second spatial direction y. min 120% of the maximum column width b max In particular, it has a minimum column width b that is greater than or equal to its width in the second spatial direction y. min 130% of the maximum column width b max The numerical range of the corresponding column width of at least one column structure 20 in the second spatial direction y can be easily achieved by means of the manufacturing method described below.
[0023] At least one column structure 20 may, for example, be constructed with a circular or square cross-section in a cross-sectional plane oriented perpendicular to the first spatial direction x. It is also advantageous that at least one column structure 20 has a constant column width in a third spatial direction z, which is perpendicular to both the first spatial direction x and the second spatial direction y. The constant column width of at least one column structure 20 oriented along the third spatial direction z can, in particular, be (almost) equal to its minimum column width b in the second spatial direction y. minAll column shapes described herein for at least one column structure 20 are capable of achieving relatively small anchorage areas 24a and 24b.
[0024] If passed Figures 1a to 1c As illustrated in enlarged portion 28, when the first outer layer 12, the second outer layer 14, and the inner layer 16 exist in their respective initial shapes, preferably, each of the at least one column structure 20 has only a single sub-segment 30 extending through each void 22 constructed in the inner layer 16. Thus, the inner layer 16 has its own void 22 for each column structure 20.
[0025] As a favorable extension scheme, in Figures 1a to 1c The implementation also ensures that the first distance x1 is equal to the maximum value x1 of its first distance value range. max The second distance x2 is equal to the minimum value x2 in its range of second distance values. min When and / or when the first distance x1 equals the minimum value x1 of its first distance value range min The second distance x2 is equal to the maximum value x2 in its range of second distance values. max At that time, mechanical contact occurs between at least one protruding outer wall surface 32 of at least one column structure 20 and the inner wall 22a of at least one void 22 constructed in the inner layer 16. Thus, the micromechanical component has an "integrated" stop structure by which the first distance value range of the first distance x1 and the second distance value range of the second distance x2 can be easily and reliably determined.
[0026] according to Figure 1b and 1c As can be seen, this method can limit the corresponding warpage of the first outer layer 12, the second outer layer 14, and / or the inner layer 16. Once the first distance x1 equals the maximum value x1 of its first distance value range... max The second distance x2 is equal to the minimum value x2 in its range of second distance values. min The first outer layer 12, the second outer layer 14, and / or the inner layer 16 can then no longer warp (see [reference]). Figure 1b The mechanical contact between at least one protruding outer wall surface 32 of at least one column structure 20 and the inner wall 22a of at least one void 22 constructed in the inner layer 16 prevents a further increase in the first distance x1 and a further decrease in the second distance x2. Accordingly, once the first distance x1 equals the minimum value x1 of its first distance value range... min The second distance x2 is equal to the maximum value x2 in its range of second distance values. max This prevents further warping of the first outer layer 12, the second outer layer 14, and / or the inner layer 16 (see...). Figure 1cIn this way, damage to the micromechanical components due to excessive warping of its first outer layer 12, its second outer layer 14, and / or its inner layer 16 can be prevented. This additionally helps to improve the lifespan of the corresponding micromechanical components.
[0027] The integrated stopping structure eliminates the need for separate stopping structures in micromechanical components. Figure 1b and 1c The “integrated” stop structure shown in the diagram can thus help reduce the manufacturing cost of micromechanical components.
[0028] An "integrated" stop structure can be easily achieved by changing the corresponding column width of at least one column structure 20 in the second spatial direction y. Alternatively, each void 22 constructed in the inner layer 16 can also be constructed with a void width h oriented in the second spatial direction y that is not equal to its maximum void width y oriented in the second spatial direction y. max Minimum width of the empty space h min In this case, it can also be said that at least one protruding inner wall surface 34 is constructed on the inner wall 22a of at least one void 22 constructed in the inner layer 16. However, as will become clear from the following description, in order to achieve an "integrated" stop structure, it is not necessary to construct on each void 22 constructed in the inner layer 16 a void oriented in the second spatial direction y, which is not equal to its maximum void width h oriented in the second spatial direction y. max Minimum width of the empty space h min .
[0029] At least one protruding outer wall surface 32 of the at least one column structure 20 and the inner wall 22a of the corresponding open portion are at a first distance x1 equal to the maximum value x1. max (or the second distance x2 equals the minimum value x2) min When and / or when the first distance x1 equals the minimum value x1 min (or the second distance x2 equals the maximum value x2) max Mechanical contact during this process can be achieved, for example, by the following method: at least one column structure 20 along the maximum column width b of the second spatial direction y. max The maximum width h of the empty space 22 in each inner layer 16 along the second spatial direction y is greater than the maximum width of the empty space 22. max Or greater than the constant width (not shown) of the empty space 22 in each structure within the inner layer 16 along the second spatial direction y. An alternative construction for the "integrated" stop structure will also be explained below.
[0030] exist Figures 1a to 1cIn the example, when the first outer layer 12, the second outer layer 14, and the inner layer 16 are present in their respective initial shapes, each sub-segment 30 of the at least one column structure 20 extending through the associated void 22 has a maximum column width b along the second spatial direction y at at least one protruding outer wall surface 32. max Additionally, each void 22 constructed in the inner layer 16 has at least one protruding inner wall surface 34 on its inner wall 22a, wherein at least one column structure 20 has a maximum column width b along the second spatial direction y. max The maximum width h of the empty space along the second spatial direction y is greater than max Therefore, when the first outer layer 12, the second outer layer 14, and the inner layer 16 are present in their respective initial shapes, each sub-segment 30 of the at least one column structure 20 extending through the associated void 22 is "locked" in the associated void 22 by means of an "integrated" stop structure.
[0031] As an example only, in Figures 1a to 1c In this embodiment, each protruding outer wall surface 32 of at least one column structure 20 is arranged between two protruding inner wall surfaces 34 in the first spatial direction x. Therefore, the corresponding distance between the protruding inner wall surfaces 34 in the first spatial direction x determines the maximum value x1 of the first distance x1. max With minimum value x1 min The difference between them, and the maximum value of the second distance x2. max With minimum value x2 min The difference between them. Therefore, structurally, the range of the first distance value of the first distance x1 and the range of the second distance value of the second distance x2 can be easily and reliably determined. Accordingly, the warpability of the first outer layer 12, the second outer layer 14, and / or the inner layer 16 can also be easily and reliably limited to the desired degree.
[0032] Figure 2 A schematic partial diagram illustrating a second embodiment of the micromechanical component is shown.
[0033] As an optional supplement to the embodiments described above, in Figure 2 The micromechanical component shown in only a portion has three inner layers 16, wherein, exemplary, only the "middle" inner layer 16 is configured to have at least one protruding inner wall surface 34 on the inner wall 22a of at least one void 22. The at least one protruding inner wall surface 34, together with at least one protruding outer wall surface 32 of at least one column structure 20, achieves an advantageous "integrated" stop structure. Furthermore, at least one step 36 is also constructed on at least one column structure 20.
[0034] about Figure 2 Other features and properties of the micromechanical components and their advantages are described with reference to the embodiment shown in FIG1.
[0035] Figure 3 A schematic partial diagram illustrating a third embodiment of the micromechanical component is shown.
[0036] exist Figure 3 In this embodiment, each protruding inner wall surface 34 on the inner wall 22a of at least one void 22 constructed in at least one inner layer 16 is arranged in a first spatial direction x between two protruding outer wall surfaces 32 of at least one column structure 20. The corresponding distance between the two protruding outer wall surfaces 32 of the same column structure 20 in the first spatial direction x thereby determines the maximum value x1 of the first distance x1. max With minimum value x1 min The difference between them and the maximum value of the second distance x2. max With minimum value x2 min The difference between them.
[0037] about Figure 3 Other features and properties of the micromechanical components and their advantages are described with reference to the embodiments of Figures 1 and 2.
[0038] Figures 4a to 4c A schematic partial diagram showing a fourth embodiment of the micromechanical component is shown.
[0039] exist Figures 4a to 4c In the micromechanical component, each protruding inner wall surface 34 on the inner wall 22a of the void 22 constructed in its first inner layer 16a and each protruding inner wall surface 34 on the inner wall 22a of the void 22 constructed in its second inner layer 16b interacts with a correspondingly associated protruding outer wall surface 32 of at least one column structure 20 to produce an advantageous "integrated" stop structure. (The "intermediate" inner layer 16 is optional.) In the first inner layer 16a, each protruding inner wall surface 34 is arranged in the first spatial direction x on the side of the interacting protruding outer wall surface 32 oriented toward the second inner layer 16b. Correspondingly, in the second inner layer 16b, each protruding inner wall surface 34 is located in the first spatial direction x on the side of the interacting protruding outer wall surface 32 oriented toward the first inner layer 16a.
[0040] For further features and properties of the micromechanical component of Figure 4 and its advantages, refer to the description of the embodiments of Figures 1 to 3.
[0041] Figure 5 A schematic partial diagram illustrating a fifth embodiment of the micromechanical component is shown.
[0042] exist Figure 5 The implementation also ensures that the first distance x1 is equal to the maximum value x1 of its first distance value range. maxThe second distance x2 is equal to the minimum value x2 in its range of second distance values. min When and / or when the first distance x1 equals the minimum value x1 of its first distance value range min The second distance x2 is equal to the maximum value x2 in its range of second distance values. max Mechanical contact occurs between at least one protruding outer wall surface 32 of at least one column structure 20 and the inner wall 22a of the at least one void 22 constructed in the inner layer 16. For this purpose, at least one protruding inner wall surface 34 is constructed on the inner wall 22a of the void 22 of at least one inner layer 16a and 16b, such that the projection of the corresponding protruding inner wall surface 34 along the first spatial direction x overlaps with at least one associated protruding outer wall surface 32 of at least one column structure 20. This also achieves an advantageous "integrated" stop structure. (The embodiments described above in Figures 1 to 4 also each have at least one protruding inner wall surface 34, whose projection along the first spatial direction x overlaps with at least one associated protruding outer wall surface 32 of at least one column structure 20.) about Figure 5 Other features and properties of the micromechanical components and their advantages are described with reference to the embodiments shown in Figures 1 to 4.
[0043] Although this is not illustrated in Figures 1 through 5, alternatively, each pillar structure 20 may be at least partially formed of at least one electrically insulating material, such as, in particular, silicon dioxide. Therefore, even when a non-zero potential difference exists between the outer layers 12 and 14 and at least one inner layer 16, there is no concern about unwanted current flowing through at least one pillar structure 20 when it comes into mechanical contact with the corresponding inner layer 16. For example, each pillar structure 20 may be at least partially coated with the at least one electrically insulating material. Alternatively or additionally, at least one inner wall 22a of the at least one void 22 constructed in the inner layer 16 may also be at least partially coated with at least one electrically insulating material, particularly silicon dioxide.
[0044] All the micromechanical components described above are well-suited for use in pressure conversion devices. These devices can be sensing devices, such as (capacitive) microphones or (capacitive) pressure sensors. Where necessary, outer layers 12 and 14 or at least one inner layer 16 can be selectively used as a sensitive membrane and / or a sensitive cantilever. However, pressure conversion devices can also be actuators, particularly (capacitive) acoustic and / or ultrasonic generators. In this case, applying a voltage can cause at least one inner layer 16 to deflect relative to outer layers 12 and 14, thereby generating acoustic and / or ultrasonic waves. It should be noted, however, that the availability of the micromechanical components described above is not limited to any one type of pressure conversion device listed herein.
[0045] Figures 6a to 6e The diagram shows schematic partial illustrations of intermediate and final products to illustrate an implementation method for manufacturing micromechanical components.
[0046] When performing the manufacturing method described herein, the partially hollow internal space 10 in the subsequent micromechanical component is defined along a first spatial direction x by a first surface 12a of a first outer layer 12 and a second surface 14a of a second outer layer 14. For this purpose, the material of the first outer layer 12 (e.g., polycrystalline silicon) may first be deposited on a substrate (not shown) (e.g., as a sacrificial layer of silicon dioxide), while the formation / molding of the second outer layer 14 is performed at a later time.
[0047] The first outer layer 12 and the second outer layer 14 are fixed to each other by at least one pillar structure 20 during the manufacturing method described herein. However, at least one subsequent pillar structure 20 is formed in multiple sub-steps in the manufacturing method described herein. This can also be described as follows: at least one subsequent pillar structure 20 is formed from multiple sub-units 20a to 20e formed at different points in time during the manufacturing process. Therefore, at least one first sub-unit 20a adjacent to the first outer layer 12 of at least one subsequent pillar structure 20 is first formed. For this purpose, a sacrificial layer 38 (e.g., made of silicon dioxide) is deposited on the first surface 12a of the first outer layer 12, in which at least one through-hole is structured in the shape of each first sub-unit 20a of at least one subsequent pillar structure 20.
[0048] In the manufacturing method described herein, at least one inner layer 16a and 16b are also formed, said inner layer extending through the subsequent internal space 10. This is merely an example. Figures 6a to 6e In this embodiment, a first inner layer 16a and a second inner layer 16b are manufactured as at least one inner layer 16a and 16b. Advantageously, the inner layers 16a and 16b are also shaped from the same material as the sub-units 20a to 20e of at least one pillar structure 20. Thus, after the structured sacrificial layer 38, the same material is co-deposited on the sacrificial layer 38 and deposited in the shape of the respective first sub-units 20a of at least one subsequent pillar structure 20, for the respective first sub-units 20a and the first inner layer 16a of at least one subsequent pillar structure 20. (However, it should be noted that it is optional to use the same material for at least one inner layer 16a and 16b and for at least one sub-unit 20a to 20e of pillar structure 20.) Polycrystalline silicon can be used, for example, as the material for the inner layers 16a and 16b of the sub-units 20a to 20e of at least one pillar structure 20.
[0049] Each inner layer 16a and 16b is not only configured with a third surface 18a oriented toward the first surface 12a and a fourth surface 18b oriented toward the second surface 14a, respectively, but also configured with at least one void 22 extending from the third surface 18a to the fourth surface 18b. At least one void 22 in the at least one inner layer 16a and 16b is positioned such that at least one subsequent column structure 20 extends from the first surface 12a through at least one void 22 in the at least one inner layer 16a and 16b to the second surface 14a.
[0050] At least one void 22 constructed in the first inner layer 16a can be structured through the first inner layer 16a by means of an etching step. A particular advantage of etching polysilicon to form at least one void 22 in the first inner layer 16a is that, in this way, the at least one void 22 is correspondingly formed with a void inner wall 22a, which is inclined at an angle of at least 10° relative to the first spatial direction x. Subsequently, a thin sacrificial layer 40 (e.g., made of silicon dioxide) can be deposited onto the void inner wall 22a. The intermediate product obtained in this way is... Figure 6a The diagram in the image shows this.
[0051] After depositing the sacrificial layer 40, the remaining residual volume of at least one void 22 in the first inner layer 16a is filled with the material of each of the second subunits 20b of at least one subsequent pillar structure 20. Excess material can then be removed using a chemical mechanical polishing (CMP) process. Subsequently, another sacrificial layer 42 (e.g., made of silicon dioxide) is deposited, structuring at least one through void in the shape of each of the third subunits 20c of at least one subsequent pillar structure 20. The at least one through void structured in the sacrificial layer 42 can then be filled with the material of each of the third subunits 20c of at least one subsequent pillar structure 20. Figure 6b The intermediate product obtained in this manner is shown.
[0052] Subsequently, a layer 44 is deposited from the material of each of the fourth sub-units 20d of at least one subsequent pillar structure 20. From the deposited layer 44, each of the fourth sub-units 20d of the subsequent pillar structure 20 is structured. Here, the advantage of etching polysilicon can be reused, by which the sidewalls of each of the fourth sub-units 20d of the at least one subsequent pillar structure 20 are oriented at an angle of at least 10° to the first spatial direction x. The sidewalls obtained in this manner can then be covered with a thin sacrificial layer 46 (especially composed of silicon dioxide), as in... Figure 6c As can be seen in the text.
[0053] Material for the second inner layer 16b can be deposited on the thin sacrificial layer 46. If necessary, excess material can be removed again using a chemical mechanical polishing (CMP) process. To shape at least one subsequent fifth subunit 20e of the pillar structure 20, a sacrificial layer 48, for example made of silicon dioxide, is also deposited. In the sacrificial layer 48, the corresponding shapes of the respective fifth subunits 20e of the at least one subsequent pillar structure 20 are structured as through-holes through the sacrificial layer 48. Material for the respective fifth subunits 20e of the at least one subsequent pillar structure 20 can now be filled into at least one through-hole through the sacrificial layer 48. As in Figure 6d As can be seen in the image, the material of the second outer layer 14 was subsequently deposited.
[0054] Figure 6e The final product is shown after the etching step for removing the sacrificial layer is performed. Simultaneously with the method steps described above, a subsequent holding portion of the micromechanical component is formed, on which the first outer layer 12, the second outer layer 14, and at least one inner layer 16a and 16b are tensioned, such that the first outer layer 12, the second outer layer 14, and the inner layer can warp / have warped from their respective initial shapes by means of pressure acting on the first outer layer, the second outer layer, and / or at least one inner layer 16a and 16b and / or a non-zero potential difference existing between at least two of the layers 12 to 16, thereby changing the first distance between the first surface 12a and the third surface 18a and the second distance between the second surface 14a and the fourth surface 18b.
Claims
1. A micromechanical component for a pressure conversion device, comprising: The partially hollow internal space (10) constructed in the micromechanical component is defined along a first spatial direction (x) by a first surface (12a) of a first outer layer (12) and by a second surface (14a) of a second outer layer (14). At least one inner layer (16, 16a, 16b) extending through the interior space (10), the inner layer having a third surface (18a) oriented toward the first surface (12a), a fourth surface (18b) oriented toward the second surface (14a), and at least one void (22) extending from the third surface (18a) to the fourth surface (18b). At least one column structure (20) extends from the first surface (12a) through the at least one gap (22) to the second surface (14b), and the first outer layer (12) and the second outer layer (14) are fixed to each other by the column structure; and The micromechanical component's holding portion (26), the first outer layer (12), the second outer layer (14), and the inner layers (16, 16a, 16b) are tensioned on the holding portion such that the first outer layer (12), the second outer layer (14), and / or the inner layers (16, 16a, 16b) can warp from their respective initial shapes by means of pressure acting on at least one of the layers (12, 14, 16, 16a, 16b) and / or a non-zero potential difference existing between at least two of the layers (12, 14, 16, 16a, 16b), such that a first distance (x1) between the first surface (12a) and the third surface (18a) and a second distance (x2) between the second surface (14a) and the fourth surface (18b) can be changed; Its features are, The at least one column structure (20) has a maximum column width (bmax) that is greater than or equal to 110% of its minimum column width (bmin) in at least one second spatial direction (y) perpendicular to the first spatial direction (x).
2. The micromechanical component according to claim 1, wherein, At least one protruding step (36) is constructed on each of the at least one column structure (20).
3. The micromechanical component according to claim 1 or 2, wherein, The at least one column structure (20) has a width greater than or equal to its minimum column width (b) in the second spatial direction (y) at least in the second spatial direction (y). min ) 120% of the maximum column width (b max ).
4. The micromechanical component according to any one of the preceding claims, wherein, The at least one column structure (20) has a width greater than or equal to its minimum column width (b) in the second spatial direction (y) at least in the second spatial direction (y). min ) 130% of the maximum column width (b max ).
5. The micromechanical component according to any one of the preceding claims, wherein, The first distance (x1) is equal to the maximum value (x1) of its first distance value range. max The second distance (x2) is equal to the minimum value of its second distance range (x2). min When and / or when the first distance (x1) equals the minimum value of its first distance value range (x1) min And the second distance (x2) is equal to the maximum value of its second distance range (x2). max When the at least one column structure (20) is in mechanical contact with at least one protruding outer wall surface (32) of the column structure (20) and the inner wall (22a) of the at least one void (22) constructed in the inner layer (16), mechanical contact occurs between them.
6. The micromechanical component according to claim 5, wherein, At least one protruding inner wall surface (34) is constructed on the inner wall (22a) of the at least one empty portion (22) constructed in the inner layer (16), such that the projection of the corresponding protruding inner wall surface (34) along the first spatial direction (x) overlaps with at least one associated protruding outer wall surface (32) of the at least one column structure (20).
7. The micromechanical component according to any one of the preceding claims, wherein, Each column structure (20) is formed at least partially by at least one electrically insulating material.
8. The micromechanical component according to any one of the preceding claims, wherein, The inner wall (22a) of each of the at least one void (22) constructed in the inner layer (16) is coated with at least one electrical insulating material on at least a portion of its inner surface.
9. A pressure conversion device having a micromechanical component according to any one of the preceding claims, wherein, The pressure conversion device is a microphone, a pressure sensor, or a sound wave and / or ultrasonic generator.
10. A method for manufacturing micromechanical components, comprising the following steps: In the subsequent micromechanical components, along the first spatial direction (x), a partially hollow internal space (10) is defined on the one hand by the first surface (12a) of the first outer layer (12) and on the other hand by the second surface (14a) of the second outer layer (14). An inner layer (16, 16a, 16b) is formed extending through the internal space (10), the inner layer having a third surface (18a) oriented toward the first surface (12a), a fourth surface (18b) oriented toward the second surface (14a), and at least one void (22) extending from the third surface (18a) to the fourth surface (18b). At least one column structure (20) is formed, the column structure extending from the first surface (12a) through the at least one gap (22) to the second surface (14a), and the first outer layer (12) and the second outer layer (14) are fixed to each other by the column structure; and A holding portion (26) is formed for the subsequent micromechanical component, wherein the first outer layer (12), the second outer layer (14), and the inner layers (16, 16a, 16b) are tensioned on the holding portion such that the first outer layer (12), the second outer layer (14), and the inner layers (16, 16a, 16b) can warp from their respective initial shapes by means of pressure acting on at least one of the layers (12, 14, 16, 16a, 16b) and / or a non-zero potential difference exists between at least two of the layers (12, 14, 16, 16a, 16b), such that a first distance (x1) between the first surface (12a) and the third surface (18a) and a second distance (x2) between the second surface (14a) and the fourth surface (18b) are changed; Its features are, The at least one column structure (20) is configured to have a width greater than or equal to its minimum column width (b) in at least one second spatial direction (y) perpendicular to the first spatial direction (x). min ) 110% of the maximum column width (b max ).
Citation Information
Patent Citations
MEMS Device
US20230339743A1