Optical protective screen substrate and method for manufacturing the same

Abstract

The application discloses an optical protective screen substrate and a preparation method thereof, and relates to the technical field of glass coating, which comprises the following steps: step S1, stress treatment is performed on the surface of a glass base layer by using a multi-step ion exchange method; step S2, an organic film layer is grown on the surface of the pretreated UTG glass by using a multi-source co-deposition method, so that surface defects are repaired; step S3, the deposition rate of each evaporation source is monitored in real time and feedback adjustment is performed; step S4, a transparent film layer is coated by using a vacuum evaporation method; and step S5, low-temperature solidification treatment is performed on the glass cover plate. According to the application, an organic film layer is additionally arranged between the glass and the transparent film layer, the organic film layer penetrates into microcracks on the surface of the base material, the cracks are filled and repaired, the stacking sequence of the film layers and the coating process are optimized, the evaporation rate of each component of the organic film layer is monitored and adjusted in real time, the growth and structure of the organic film layer are controlled, the uniform and smooth deposition of the organic film layer is ensured, and the influence of defects and internal stress is reduced.

Description

Technical Field

[0001] This invention relates to the field of glass coating technology, and in particular to an optical protective screen substrate and its preparation method. Background Technology

[0002] As extended reality, foldable screens and other terminal devices develop towards thinner and more flexible designs, chemically tempered ultra-thin glass has become a core cover material due to its excellent flexibility, light transmittance and mechanical properties. To improve the visual effect, an anti-reflective coating layer needs to be deposited on the UTG surface to increase screen transmittance and reduce ambient light reflection, thereby enhancing display clarity.

[0003] Conventional AR coating processes, such as magnetron sputtering and electron beam evaporation, have shortcomings. First, during film growth, it is difficult to achieve atomic-level flatness in the deposition process of both magnetron sputtering target particles and electron beam evaporation film molecules. In actual production, the AR film is highly susceptible to structural defects such as pinholes and particulate matter due to microscopic process fluctuations. These microscopic defects form sharp geometric abrupt changes on the glass surface, becoming stress concentration points under stress. When UTG glass is subjected to external impact or bending stress during subsequent use or reliability testing, cracks can easily initiate and rapidly propagate from these defects, causing the glass to break under conditions far below its theoretical strength. Second, when an AR film is directly deposited on a chemically tempered UTG surface, the internal stress of the film can produce an annealing effect or reverse tensile stress on the underlying compressive stress layer. This stress interference can significantly damage, weaken, or even offset the surface compressive stress formed by chemical tempering. Summary of the Invention

[0004] The purpose of this invention is to provide an optical protective screen substrate and its preparation method to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a method for preparing an optical protective screen substrate, comprising the following steps:

[0006] Step S1: Substrate pretreatment. UTG glass is selected as the substrate. A multi-step ion exchange method is used to first establish a basic compressive stress layer on the surface of the glass substrate, then reconstruct the compressive stress peaks on the glass surface, and then clean the surface of the tempered UTG glass.

[0007] Step S2: Organic film layer evaporation. Organic film material is composed of organosilicon, elastic agent, curing agent and solvent. The organosilicon material is hydrolyzed as a surface treatment agent and dehydrated and condensed with the glass surface to anchor the organosilicon material on the glass substrate surface. An organic film layer is grown on the pretreated UTG glass surface through multi-source co-plating method to suppress stress transmission between the glass substrate and the surface film, fill the microcracks generated on the glass surface and repair surface defects.

[0008] Step S3: Deposition monitoring feedback. A quartz crystal oscillator is used to monitor the deposition rate of each evaporation source in real time and obtain the rate ratio. The temperature of each source is adjusted by independent PID feedback control, and a small amount of inert gas is introduced to generate gas phase collisions with the component gases, so as to avoid composition deviation caused by differences in the evaporation characteristics of each component of the organic film layer.

[0009] Step S4: Antireflection film deposition. An antireflection film is deposited on the surface of the organic film using a vacuum deposition method. The antireflection film is composed of alternating stacks of high refractive index film and low refractive index film.

[0010] Step S5: Curing treatment. After the coating is completed, the glass cover is subjected to low-temperature curing treatment to bond the interface between the organic film layer and the antireflective film layer, while further eliminating the internal stress of the film layer.

[0011] Preferably, the substrate pretreatment in step S1 includes the following steps:

[0012] Step S11: Select UTG glass as the substrate, and use molten salt ion exchange process to chemically temper the surface of the glass substrate to establish a deep basic compressive stress layer. Then, perform short-time ion exchange to reconstruct high and sharp compressive stress peaks on the surface of the glass substrate, so that the stress distribution exists below the surface peaks.

[0013] Step S12: The surface of the chemically treated UTG glass substrate is ultrasonically cleaned with an alkaline cleaning agent, rinsed with deionized water, dehydrated with isopropanol, and dried with nitrogen to remove surface oil, impurities, and micro-dust, ensuring the cleanliness of the subsequent vacuum evaporation operation.

[0014] Preferably, the organic film deposition in step S2 includes the following steps:

[0015] Step S21: Dissolve the silicone, elastic agent, and curing agent in a solvent, and place the silicone, elastic agent, and curing agent in separate evaporation sources;

[0016] Step S22: Under vacuum conditions, heating and evaporation are carried out, so that the vaporized molecules of each component are deposited on the surface of the UTG glass substrate and mixed to form an organic film layer. At the same time, under vacuum-assisted infiltration, when the vaporized organic molecules are deposited on the surface of the glass substrate, they penetrate into the depth of the microcracks generated during the substrate production process through capillary action to fill and repair the cracks.

[0017] Preferably, the monitoring of the deposition rate in step S3 includes the following steps:

[0018] Step S31: By setting quartz crystal oscillators corresponding to each independent evaporation source near the surface of the glass substrate, as each component settles in the gas phase, the molecules settle on the quartz crystal oscillator, causing its mass to increase and the equivalent thickness to increase accordingly, resulting in a proportional decrease in the resonant frequency of the quartz crystal oscillator.

[0019] Step S32: By continuously measuring the current frequency of the quartz crystal oscillator, calculate the change in frequency per unit time, convert it into a unit deposition rate based on the material density parameter, and obtain the deposition rate of each component in real time.

[0020] Preferably, the feedback adjustment in step S3 includes the following steps:

[0021] Step S33: Based on the above-measured deposition rates of each component, compare them with the preset target rates to obtain the rate ratio of each component. The rate ratio reflects the deviation between the deposition rates of each component and the preset rates.

[0022] Step S34: Based on the deviation of the sedimentation rate of each component, the PID controller outputs a pulse width modulation analog signal to the heating power supply of the evaporation source to control the temperature adjustment of the evaporation source, thereby rapidly adjusting the evaporation rate so that it is always near the preset target rate.

[0023] Preferably, the injection of inert gas in step S3 includes the following steps:

[0024] Step S35: By setting conduits for injecting inert gas in the evaporation source regions of each component of the organic film layer and equipping them with mass flow meters, the gas injection is controlled by the mass flow meters.

[0025] Step S36: When adjusting the evaporation rate of the organic film layer components, a small amount of inert gas is injected at the evaporation source to increase the gas phase collision of the components, slow down the condensation rate of the components, control the growth rate and microstructure of the organic film layer, and eliminate the effect of the evaporation rate adjustment response delay on component deposition.

[0026] Preferably, the antireflection film deposition in step S4 includes the following steps:

[0027] Step S41: A transition film is formed on the surface of the organic film by vacuum evaporation for adhesion between the antireflection film and the organic film.

[0028] Step S42: Subsequent films are vacuum-deposited using alternating stacking of low-refractive-index and high-refractive-index films. Simultaneously, during the antireflection film deposition process, ion source-assisted deposition is used to increase the amount of film atoms and facilitate surface migration.

[0029] Preferably, the curing process in step S5 includes the following steps:

[0030] Step S51: After the coating is completed, the glass is subjected to low-temperature curing treatment. Curing is achieved by short-time, concentrated heating. The unreacted active groups in the organic film layer gain energy and undergo dehydration condensation chemical reaction with the groups on the surface of the antireflective film layer to form covalent bonds.

[0031] Step S52: At the same time, the organic molecular chain segments gain mobility, allowing them to release the cohesive stress generated by volume shrinkage during thermosetting through chain segment rearrangement.

[0032] An optical protective screen substrate includes a glass substrate, an organic film layer, and an antireflective film layer. The organic film layer is disposed on the upper surface of the glass substrate, and the antireflective film layer is disposed on the upper surface of the organic film layer. The organic film layer is composed of 30-50 wt% organosilicon, 20-30 wt% elastic agent, 10-20 wt% curing agent, and 10-20 wt% solvent. The antireflective film layer is composed of alternating stacks of low refractive index film layers and high refractive index film layers.

[0033] Preferably, the organosilicon is made of γ-glycidyl etheroxypropyltrimethoxysilane, the elastic agent is made of acrylate elastomer, the curing agent is made of isophorone diisocyanate, the solvent is made of ethyl acetate, and the low refractive index film is made of... , The high refractive index film is made of one or a mixture of two of the following: , , , It is made from one or more of the following.

[0034] The technical effects and advantages of this invention are as follows:

[0035] This invention employs a vacuum evaporation method to perform multi-source co-deposition of organic film components, allowing organic material vapor molecules to deposit on the surface of a glass substrate. An organic film layer is added between the UTG glass substrate and the antireflective coating. This organic film layer penetrates deep into microcracks generated during the substrate manufacturing process via capillary action, filling and repairing these cracks. The invention also optimizes the film layer stacking sequence and coating process, and monitors the evaporation rate of each component in the organic film layer in real time. Based on the deviation in the deposition rate of each component, a PID controller outputs a pulse-width modulated analog signal to the heating power supply of the evaporation source to control the temperature adjustment of the evaporation source, thereby rapidly adjusting the evaporation rate and ensuring the stability of the organic film layer. Each component is deposited stably at a preset rate, and the deposition rate of the organic film layer is automatically corrected to prevent the film layer composition from deviating from the target, ensuring the consistency of the organic film layer performance. At the same time, by injecting a small amount of inert gas, the gas phase collision of the components is increased, and the condensation rate of the components is slowed down. By intervening in the gas phase transport and condensation links, more precise film layer control is achieved. In addition, when the PID feedback regulation has a response delay due to the thermal inertia of the heating system, the injection of inert gas near the evaporation source is used as a compensation method to quickly fine-tune the molecular flux and energy reaching the substrate, forming an organic film layer with consistent performance and uniform distribution, thereby improving the performance of the organic film layer. Attached Figure Description

[0036] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention, but do not constitute a limitation thereof. In the drawings:

[0037] Figure 1 This is a schematic diagram of the optical screen substrate method of the present invention;

[0038] Figure 2 This is a schematic diagram of the substrate pretreatment process of the present invention;

[0039] Figure 3 This is a schematic diagram of the organic film deposition process of the present invention;

[0040] Figure 4 This is a schematic diagram of the deposition rate monitoring process of the present invention;

[0041] Figure 5 This is a schematic diagram of the feedback adjustment process of the present invention;

[0042] Figure 6 This is a schematic diagram of the inert gas injection process of the present invention;

[0043] Figure 7 This is a schematic diagram of the antireflection film deposition process of the present invention;

[0044] Figure 8 This is a schematic diagram of the curing process of the present invention;

[0045] Figure 9 This is a front cross-sectional view of the glass substrate of the present invention;

[0046] Figure 10 This is a front cross-sectional view of the organic film layer of the present invention.

[0047] In the attached figures: 1. Glass substrate; 2. Organic film layer; 3. Antireflective film layer; 31. Low refractive index film layer; 32. High refractive index film layer. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] This invention provides, for example Figures 1-8 The method for preparing an optical protective screen substrate, as shown, includes the following steps:

[0050] Step S1: Substrate pretreatment. UTG glass is selected as the substrate. A multi-step ion exchange method is used to first establish a basic compressive stress layer on the surface of the glass substrate, then reconstruct the compressive stress peaks on the glass surface, and then clean the surface of the tempered UTG glass.

[0051] Step S2: Organic film layer evaporation. Organic film material is composed of organosilicon, elastic agent, curing agent and solvent. The organosilicon material is hydrolyzed as a surface treatment agent and dehydrated and condensed with the glass surface to anchor the organosilicon material on the glass substrate surface. An organic film layer is grown on the pretreated UTG glass surface through multi-source co-plating method to suppress stress transmission between the glass substrate and the surface film, fill the microcracks generated on the glass surface and repair surface defects.

[0052] Step S3: Deposition monitoring feedback. A quartz crystal oscillator is used to monitor the deposition rate of each evaporation source in real time and obtain the rate ratio. The temperature of each source is adjusted by independent PID feedback control, and a small amount of inert gas is introduced to generate gas phase collisions with the component gases, so as to avoid composition deviation caused by differences in the evaporation characteristics of each component of the organic film layer.

[0053] Step S4: Antireflection film deposition. An antireflection film is deposited on the surface of the organic film using a vacuum deposition method. The antireflection film is composed of alternating stacks of high refractive index film and low refractive index film.

[0054] Step S5: Curing treatment. After the coating is completed, the glass cover is subjected to low-temperature curing treatment to bond the interface between the organic film layer and the antireflective film layer, while further eliminating the internal stress of the film layer.

[0055] Multi-source co-deposition of organic film components is performed using vacuum evaporation, allowing organic material vapor molecules to deposit on the surface of the glass substrate. An organic film layer is added between the UTG glass substrate and the antireflective coating. The organic film layer penetrates deep into the microcracks generated during the substrate production process through capillary action, filling and repairing the cracks. The film layer stacking sequence and coating process are optimized. The evaporation rate of each component in the organic film layer is monitored in real time. Based on the deviation of the sedimentation rate of each component, a PID controller outputs a pulse width modulation analog signal to the heating power supply of the evaporation source to control the temperature regulation of the evaporation source, thereby rapidly adjusting the evaporation rate to keep it close to the preset target rate. At the same time, a small amount of inert gas is injected to increase the vapor-phase collision of the components, delay the condensation rate of the components, control the growth rate and microstructure of the organic film layer, and eliminate the influence of the evaporation rate regulation response delay on component deposition.

[0056] The substrate pretreatment in step S1 includes the following steps:

[0057] Step S11: Select UTG glass as the substrate, and use molten salt ion exchange process to chemically temper the surface of the glass substrate to establish a deep basic compressive stress layer. Then, perform short-time ion exchange to reconstruct high and sharp compressive stress peaks on the surface of the glass substrate, so that the stress distribution exists below the surface peaks.

[0058] Step S12: The surface of the chemically treated UTG glass substrate is ultrasonically cleaned with an alkaline cleaning agent, rinsed with deionized water, dehydrated with isopropanol, and dried with nitrogen to remove surface oil, impurities, and micro-dust, ensuring the cleanliness of the subsequent vacuum evaporation operation.

[0059] UTG glass with a thickness of 0.2mm or less is selected and chemically tempered to ensure its strength after tempering. The molten salt ion exchange process, with an exchange temperature of 350-500℃ and an exchange time of 6 hours, performs a long-term ion exchange to chemically temper the glass substrate surface, establishing a deep basic compressive stress layer. A short 0.2-hour ion exchange then reconstructs high and sharp compressive stress peaks on the glass substrate surface, ensuring that the stress distribution is below the surface peaks. The ion exchange process itself can close microcracks on the glass surface to a certain extent and improve surface smoothness. Simultaneously, the strong surface compressive stress can counteract externally applied tensile stress, preventing crack initiation from the surface or propagation inwards. Subsequently, the tempered UTG glass surface is cleaned sequentially through alkaline cleaning agent ultrasonic cleaning, deionized water rinsing, isopropanol dehydration, and nitrogen drying to remove surface oil, impurities, and micro-dust, ensuring the cleanliness of the glass surface and improving the quality of the organic film coating.

[0060] The organic film deposition in step S2 includes the following steps:

[0061] Step S21: Dissolve the silicone, elastic agent, and curing agent in a solvent, and place the silicone, elastic agent, and curing agent in separate evaporation sources;

[0062] Step S22: Under vacuum conditions, heating and evaporation are carried out, so that the vaporized molecules of each component are deposited on the surface of the UTG glass substrate and mixed to form an organic film layer. At the same time, under vacuum-assisted infiltration, when the vaporized organic molecules are deposited on the surface of the glass substrate, they penetrate into the depth of the microcracks generated during the substrate production process through capillary action to fill and repair the cracks.

[0063] An organic layer is grown on the surface of pretreated UTG glass using vacuum evaporation equipment and processes. The film thickness is controlled to be 5-50 nm. The organic layer is an organic composite system composed of 30-50 wt% γ-glycidyl etheroxypropyltrimethoxysilane, 20-30 wt% acrylate elastomer, 10-20 wt% isophorone diisocyanate, and 10-20 wt% ethyl acetate. The vaporized molecules of each component are deposited on the surface of the UTG glass substrate through evaporation, forming an organic film. Under vacuum-assisted permeation, the vaporized organic molecules penetrate deep into the microcracks generated during the substrate production process through capillary action, filling and repairing the cracks. This serves to buffer the stress transfer between the antireflective film layer and the glass substrate, and fill the microcracks on the glass surface caused by tempering or cleaning, repairing surface defects and reducing the stress impact during the glass cover production process.

[0064] Monitoring the deposition rate in step S3 includes the following steps:

[0065] Step S31: By setting quartz crystal oscillators corresponding to each independent evaporation source near the surface of the glass substrate, as each component settles in the gas phase, the molecules settle on the quartz crystal oscillator, causing its mass to increase and the equivalent thickness to increase accordingly, resulting in a proportional decrease in the resonant frequency of the quartz crystal oscillator.

[0066] Step S32: By continuously measuring the current frequency of the quartz crystal oscillator, calculate the change in frequency per unit time, convert it into a unit deposition rate based on the material density parameter, and obtain the deposition rate of each component in real time.

[0067] By utilizing the piezoelectric effect of quartz crystals, the deposition rate and thickness of the film during vacuum evaporation are monitored in real time and with high precision by measuring the change in its resonant frequency. The deposition rate is related to the evaporation rate, and the change in its resonant frequency has a good linear relationship with the mass increment of the deposited film. The change in frequency per unit time is calculated and converted into a unit deposition rate based on the material density parameter. The current resonant frequency of the quartz crystal is continuously read at a high sampling rate, and the change in frequency is calculated within a very short time interval. Based on the density parameter of the organic film material, the equivalent film thickness deposited on the crystal oscillator per unit time is calculated, which is the real-time deposition rate. This serves as a prerequisite for achieving closed-loop PID feedback control and stabilizing the rate at the target value. Furthermore, the measurement process does not involve contact or interference with the deposition beam, nor does it damage the film.

[0068] Step S3, feedback adjustment, includes the following steps:

[0069] Step S33: Based on the above-measured deposition rates of each component, compare them with the preset target rates to obtain the rate ratio of each component. The rate ratio reflects the deviation between the deposition rates of each component and the preset rates.

[0070] Step S34: Based on the deviation of the sedimentation rate of each component, the PID controller outputs a pulse width modulation analog signal to the heating power supply of the evaporation source to control the temperature adjustment of the evaporation source, thereby rapidly adjusting the evaporation rate so that it is always near the preset target rate.

[0071] Based on the organic film composition ratio and density parameters, the target deposition rate of each evaporation source is determined. During the evaporation process, the actual deposition rate of each source is monitored in real time by a quartz crystal oscillator. The actual value is compared with the target value, and the deviation is calculated. The deviation is the difference between the preset target rate and the actual deposition rate. The PID controller receives the deviation signal, calculates it, and generates a precise control signal. The control signal output by the PID controller is converted into an analog signal to control the heating power of the evaporation source through pulse width modulation technology, realizing the precise adjustment of the evaporation source temperature in a continuous, stepless, and rapid manner. This rapidly changes the evaporation rate, constructing a closed-loop feedback control for multi-source co-evaporation. This ensures that each component of the organic film is deposited stably at a preset rate. By automatically correcting the deposition rate of the organic film components, the film composition is prevented from deviating from the target, ensuring the consistency of the organic film performance.

[0072] The injection of inert gas in step S3 includes the following steps:

[0073] Step S35: By setting conduits for injecting inert gas in the evaporation source regions of each component of the organic film layer and equipping them with mass flow meters, the gas injection is controlled by the mass flow meters.

[0074] Step S36: When adjusting the evaporation rate of the organic film layer components, a small amount of inert gas is injected at the evaporation source to increase the gas phase collision of the components, slow down the condensation rate of the components, control the growth rate and microstructure of the organic film layer, and eliminate the effect of the evaporation rate adjustment response delay on component deposition.

[0075] Inert gas conduits are installed in the evaporation source regions of each component of the organic film layer, and mass flow controllers are fitted to achieve precise and stable control of the injected gas flow rate. Using inert gas molecules such as Ar, collisions occur with vaporized organic molecules near the evaporation source, increasing the kinetic energy of the vaporized gas molecules and improving material utilization and deposition uniformity. Based on molecular dynamics theory, the condensation rate of gaseous molecules is influenced by their energy state upon reaching the surface, utilizing the physical collisions with the vaporized organic molecules. Through inert gas collisions, the energy of deposited particles can be modulated, enabling them to migrate more effectively on the substrate surface, thereby affecting the nucleation density and microstructure of the film. This does not directly increase the evaporation rate, but rather achieves finer film control through intervention in gas phase transport and condensation. Furthermore, when PID feedback regulation experiences response delays due to the thermal inertia of the heating system, the injection of inert gas near the evaporation source can serve as a soft compensation method, rapidly fine-tuning the molecular flux and energy reaching the substrate.

[0076] Step S4, the deposition of the antireflective coating, includes the following steps:

[0077] Step S41: A transition film is formed on the surface of the organic film by vacuum evaporation for adhesion between the antireflection film and the organic film.

[0078] Step S42: Subsequent films are vacuum-deposited using alternating stacking of low-refractive-index and high-refractive-index films. Simultaneously, during the deposition of the antireflective film, ion-assisted deposition is performed to increase the amount of film atoms and facilitate surface migration.

[0079] An antireflective coating is deposited on the surface of an organic film using a vacuum evaporation process. This antireflective coating consists of alternating layers of high-refractive-index and low-refractive-index films, with the first layer being a low-refractive-index film. The material serves as a transition layer, enhancing the adhesion between the antireflective coating and the organic coating. Subsequent coatings employ an alternating stacking of low-refractive-index and high-refractive-index materials. When light passes through the multilayer film composed of alternating high-refractive-index and low-refractive-index materials, the reflected light generated at each layer interface interferes with each other. By precisely designing the optical thickness of each layer, reflected light within a specific wavelength or broad spectrum cancels each other out, thereby significantly reducing reflectivity and increasing transmittance. Furthermore, an ion beam of a certain energy and current continuously bombards the surface of the growing film, enabling the deposited atoms to gain higher kinetic energy and migrate to more stable positions on the surface, thus forming a denser film structure with fewer defects and improving refractive index stability. Simultaneously, the substrate surface is cleaned and activated, enhancing the nucleation and bonding force of subsequent deposited layers.

[0080] The curing process in step S5 includes the following steps:

[0081] Step S51: After the coating is completed, the glass is subjected to low-temperature curing treatment. Curing is achieved by short-time, concentrated heating. The unreacted active groups in the organic film layer gain energy and undergo dehydration condensation chemical reaction with the groups on the surface of the antireflective film layer to form covalent bonds.

[0082] Step S52: At the same time, the organic molecular chain segments gain mobility, allowing them to release the cohesive stress generated by volume shrinkage during thermosetting through chain segment rearrangement.

[0083] Heating allows polymer molecular chains to acquire higher thermal energy, enabling chain segments to overcome intermolecular forces and rotate and move. Through the rearrangement of chain segments, the strain energy originally generated inside the film due to volume shrinkage is released. At the same time, by activating active groups, the organic-inorganic interface is strengthened, resulting in an antireflective film layer that has both good adhesion and a stable stress state with the organic film layer, thereby improving the overall mechanical strength and optical durability of the UTG glass cover.

[0084] An optical protective screen substrate, such as Figure 9-10As shown, the device includes a glass substrate 1, an organic film layer 2, and an antireflective film layer 3. The organic film layer 2 is disposed on the upper surface of the glass substrate 1, and the antireflective film layer 3 is disposed on the upper surface of the organic film layer 2. The organic film layer 2 is composed of 30-50 wt% silicone, 20-30 wt% elastomer, 10-20 wt% curing agent, and 10-20 wt% solvent. The antireflective film layer 3 is composed of alternating stacks of low-refractive-index film layer 31 and high-refractive-index film layer 32. Through the buffering and defect repair effects of the organic film layer, combined with the organic film layer... The structural design of the transition layer allows the coated UTG glass to maintain high strength and improve mechanical properties, while retaining the core impact resistance advantage of chemical tempering. Furthermore, by optimizing the coating process and density of the antireflective coating, the coating layer meets the hardness requirements.

[0085] The silicone is made of γ-glycidyl etheroxypropyltrimethoxysilane, the elastic agent is made of acrylate elastomer, the curing agent is made of isophorone diisocyanate, the solvent is made of ethyl acetate, and the low refractive index film 31 is made of... , It is made of one or two of them, and the high refractive index film 32 is made of , , , It is made of one or more of the following, and both the organic film layer and the antireflective film layer are processed by vacuum evaporation process. The vacuum degree of the organic film layer is ≤1.0×10−3Pa, the evaporation rate is 0.1-1.2nm / s, the vacuum degree of the antireflective film layer is ≤1.2×10−3Pa, the evaporation rate is 0.6-1.2nm / s, and the film thickness is 20-150nm.

[0086] Principle of this invention:

[0087] Multi-source co-deposition of organic film components is performed using vacuum evaporation, allowing organic material vapor molecules to deposit on the surface of the glass substrate. An organic film layer is then added between the UTG glass substrate and the antireflective coating. This organic film layer penetrates deep into microcracks generated during the substrate manufacturing process via capillary action, filling and repairing these cracks. The film layer stacking sequence and coating process are optimized. The evaporation rate of each component in the organic film layer is monitored in real time. Based on the deviation in the deposition rate of each component, a PID controller outputs a pulse-width modulated analog signal to the heating power supply of the evaporation source, controlling the temperature adjustment of the evaporation source and thus rapidly adjusting its temperature. The evaporation rate is adjusted to ensure that each component of the organic film layer is deposited stably at a preset rate. The deposition rate of the organic film layer components is automatically corrected to prevent the film layer components from deviating from the target and to ensure the consistency of the organic film layer performance. At the same time, a small amount of inert gas is injected to increase the gas phase collision of the components and slow down the condensation rate of the components. By intervening in the gas phase transport and condensation links, more precise film layer control is achieved. In addition, when the PID feedback regulation has a response delay due to the thermal inertia of the heating system, the injection of inert gas near the evaporation source is used as a compensation method to quickly fine-tune the molecular flux and energy reaching the substrate.

[0088] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for preparing an optical protective screen substrate, characterized in that, Includes the following steps: Step S1: Substrate pretreatment. UTG glass is selected as the substrate. A multi-step ion exchange method is used to first establish a basic compressive stress layer on the surface of the glass substrate, then reconstruct the compressive stress peaks on the glass surface, and then clean the surface of the tempered UTG glass. Step S2: Organic film layer evaporation. Organic film material is composed of organosilicon, elastic agent, curing agent and solvent. The organosilicon material is hydrolyzed as a surface treatment agent and dehydrated and condensed with the glass surface to anchor the organosilicon material on the glass substrate surface. An organic film layer is grown on the pretreated UTG glass surface through multi-source co-plating method to suppress stress transmission between the glass substrate and the surface film, fill the microcracks generated on the glass surface and repair surface defects. Step S3: Deposition monitoring feedback. A quartz crystal oscillator is used to monitor the deposition rate of each evaporation source in real time and obtain the rate ratio. The temperature of each source is adjusted by independent PID feedback control, and a small amount of inert gas is introduced to generate gas phase collisions with the component gases, so as to avoid composition deviation caused by differences in the evaporation characteristics of each component of the organic film layer. Step S4: Antireflection film deposition. An antireflection film is deposited on the surface of the organic film using a vacuum deposition method. The antireflection film is composed of alternating stacks of high refractive index film and low refractive index film. Step S5: Curing treatment. After the coating is completed, the glass cover is subjected to low-temperature curing treatment to bond the interface between the organic film layer and the antireflective film layer, while further eliminating the internal stress of the film layer.

2. The method for preparing an optical protective screen substrate according to claim 1, characterized in that, The substrate pretreatment in step S1 includes the following steps: Step S11: Select UTG glass as the substrate, and use molten salt ion exchange process to chemically temper the surface of the glass substrate to establish a deep basic compressive stress layer. Then, perform short-time ion exchange to reconstruct high and sharp compressive stress peaks on the surface of the glass substrate, so that the stress distribution exists below the surface peaks. Step S12: The surface of the chemically treated UTG glass substrate is ultrasonically cleaned with an alkaline cleaning agent, rinsed with deionized water, dehydrated with isopropanol, and dried with nitrogen to remove surface oil, impurities, and micro-dust, ensuring the cleanliness of the subsequent vacuum evaporation operation.

3. The method for preparing an optical protective screen substrate according to claim 2, characterized in that, The organic film deposition in step S2 includes the following steps: Step S21: Dissolve the silicone, elastic agent, and curing agent in a solvent, and place the silicone, elastic agent, and curing agent in separate evaporation sources; Step S22: Under vacuum conditions, heating and evaporation are carried out, so that the vaporized molecules of each component are deposited on the surface of the UTG glass substrate and mixed to form an organic film layer. At the same time, under vacuum-assisted infiltration, when the vaporized organic molecules are deposited on the surface of the glass substrate, they penetrate into the depth of the microcracks generated during the substrate production process through capillary action to fill and repair the cracks.

4. The method for preparing an optical protective screen substrate according to claim 3, characterized in that, The monitoring of the deposition rate in step S3 includes the following steps: Step S31: By setting quartz crystal oscillators corresponding to each independent evaporation source near the surface of the glass substrate, as each component settles in the gas phase, the molecules settle on the quartz crystal oscillator, causing its mass to increase and the equivalent thickness to increase accordingly, resulting in a proportional decrease in the resonant frequency of the quartz crystal oscillator. Step S32: By continuously measuring the current frequency of the quartz crystal oscillator, calculate the change in frequency per unit time, convert it into a unit deposition rate based on the material density parameter, and obtain the deposition rate of each component in real time.

5. The method for preparing an optical protective screen substrate according to claim 4, characterized in that, The feedback adjustment in step S3 includes the following steps: Step S33: Based on the above-measured deposition rates of each component, compare them with the preset target rates to obtain the rate ratio of each component. The rate ratio reflects the deviation between the deposition rates of each component and the preset rates. Step S34: Based on the deviation of the sedimentation rate of each component, the PID controller outputs a pulse width modulation analog signal to the heating power supply of the evaporation source to control the temperature adjustment of the evaporation source, thereby rapidly adjusting the evaporation rate so that it is always near the preset target rate.

6. The method for preparing an optical protective screen substrate according to claim 5, characterized in that, The injection of inert gas in step S3 includes the following steps: Step S35: By setting conduits for injecting inert gas in the evaporation source regions of each component of the organic film layer and equipping them with mass flow meters, the gas injection is controlled by the mass flow meters. Step S36: When adjusting the evaporation rate of the organic film layer components, a small amount of inert gas is injected at the evaporation source to increase the gas phase collision of the components, slow down the condensation rate of the components, control the growth rate and microstructure of the organic film layer, and eliminate the effect of the evaporation rate adjustment response delay on component deposition.

7. The method for preparing an optical protective screen substrate according to claim 6, characterized in that, The antireflection coating deposition in step S4 includes the following steps: Step S41: A transition film is formed on the surface of the organic film by vacuum evaporation for adhesion between the antireflection film and the organic film. Step S42: Subsequent films are vacuum-deposited using alternating stacking of low-refractive-index and high-refractive-index films. Simultaneously, during the deposition of the antireflective film, ion-assisted deposition is performed to increase the amount of film atoms and facilitate surface migration.

8. The method for preparing an optical protective screen substrate according to claim 7, characterized in that, The curing process in step S5 includes the following steps: Step S51: After the coating is completed, the glass is subjected to low-temperature curing treatment. Curing is achieved by short-time, concentrated heating. The unreacted active groups in the organic film layer gain energy and undergo dehydration condensation chemical reaction with the groups on the surface of the antireflective film layer to form covalent bonds. Step S52: At the same time, the organic molecular chain segments gain mobility, allowing them to release the cohesive stress generated by volume shrinkage during thermosetting through chain segment rearrangement.

9. An optical protective screen substrate, characterized in that, The method for preparing an optical protective screen substrate according to any one of claims 1-8 includes a glass substrate (1), an organic film layer (2), and an antireflective film layer (3). The organic film layer (2) is disposed on the upper surface of the glass substrate (1), and the antireflective film layer (3) is disposed on the upper surface of the organic film layer (2). The organic film layer (2) is composed of 30-50 wt% organosilicon, 20-30 wt% elastic agent, 10-20 wt% curing agent, and 10-20 wt% solvent. The antireflective film layer (3) is composed of alternating stacks of a low refractive index film layer (31) and a high refractive index film layer (32).

10. The optical protective screen substrate according to claim 9, characterized in that, The organosilicon is made of γ-glycidyl etheroxypropyltrimethoxysilane, the elastic agent is made of acrylate elastomer, the curing agent is made of isophorone diisocyanate, the solvent is made of ethyl acetate, and the low refractive index film (31) is made of... , The high refractive index film (32) is made of one or a mixture of two of the following: , , , It is made from one or more of the following.

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