Resin composition, adhesive member, and electronic device including adhesive member

Abstract

The present application relates to a resin composition, an adhesive member, and an electronic device including the adhesive member. The resin composition includes a urethane acrylate compound including a structure according to Chemical Formula 1, a monomer having one polymerizable unsaturated group per molecule, and a photopolymerization initiator. The content of the urethane acrylate compound is about 5% by weight to about 18% by weight, based on the total weight of the resin composition, and the content of the structure according to Chemical Formula 1 in the urethane acrylate compound is about 20% by weight to about 60% by weight, based on the total weight of the urethane acrylate compound. Chemical Formula 1

Description

[0001] Cross-reference to related applications

[0002] This patent application claims priority and benefit to Japanese Patent Application No. 2025-062973, filed on April 7, 2025, with the Japan Intellectual Property Office, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure relates to resin compositions, adhesive members formed from resin compositions, and electronic devices including adhesive members. Background Technology

[0004] As display devices with screens (such as televisions, smartphones, tablets, navigation systems, and game consoles) become increasingly popular and a part of lifestyles, their development continues. These display devices comprise various components, with adhesive members between them. Adhesive members can be formed by providing a resin composition. Because adhesive members are used in multimedia devices (e.g., display devices), the adhesive members included in the display device should possess properties that ensure stable bonding of the components within the display device and prevent degradation of display quality. Summary of the Invention

[0005] This disclosure provides a resin composition having low viscosity before curing and increased adhesive strength after curing, an adhesive member formed from the resin composition, and an electronic device including the adhesive member.

[0006] Embodiments of the present invention provide a resin composition comprising: a urethane acrylate compound comprising a structure according to Formula 1; a monomer having a polymerizable unsaturated group per molecule; and a photopolymerization initiator, wherein the content of the urethane acrylate compound is from about 5% by weight to about 18% by weight based on the total weight of the resin composition; and wherein the content of the urethane acrylate compound comprising the structure according to Formula 1 is from about 20% by weight to about 60% by weight based on the total weight of the urethane acrylate compound.

[0007] Chemical Formula 1

[0008]

[0009] In Formula 1, R1 and R2 are each independently substituted or unsubstituted alkylene groups having 1 to 4 carbon atoms, R3 is substituted or unsubstituted alkylene groups having 1 to 3 carbon atoms, and subscripts n1 and n2 are each independently integers selected from 1 to 6.

[0010] In the implementation, the concentration is less than approximately 2000 millijoules per square centimeter (mJ / cm²).2 After being photocured in air under ultraviolet cumulative light, the resin composition can have a 180° peel strength of about 2000 gf / 25 mm to about 5000 gf / 25 mm as measured on a glass substrate at about 25°C.

[0011] In the implementation, it is less than about 2000 mJ / cm 2 After being photocured in air under ultraviolet cumulative light, the resin composition can have a 180° peel strength of about 250 gf / 25 mm to about 1000 gf / 25 mm as measured on a glass substrate at about 60°C.

[0012] In an embodiment, the urethane acrylate compound can be synthesized from reactants comprising a first polyfunctional alcohol having a structure according to Formula 1, a second alcohol different from the first polyfunctional alcohol, a polyfunctional isocyanate compound, and a compound comprising at least one (meth)acrylate group and at least one hydroxyl group per molecule.

[0013] In an embodiment, the second alcohol may include 2,2-bis(hydroxymethyl)butyric acid.

[0014] In embodiments, the polyfunctional isocyanate compound may include 1,3-bis(methyl isocyanate)cyclohexane.

[0015] In this embodiment, the polymerizable unsaturated group of the monomer may be an acrylate group.

[0016] In embodiments, the monomer may include at least one of 4-hydroxybutyl acrylate, tetrahydrofurfuryl acrylate, isobornyl acrylate, isodecanyl acrylate, dicyclopentenyl acrylate, lauryl (C12) acrylate, 2-ethylhexyl acrylate, and 2-{2-[(2-ethylhexyl)oxy]ethoxy}ethyl acrylate.

[0017] In this embodiment, the monomer content may be from about 50% by weight to about 93% by weight, based on the total weight of the resin composition.

[0018] In embodiments, the urethane acrylate compound may have a weight-average molecular weight Mw of about 3,000 grams (g / mol) to about 15,000 g / mol.

[0019] In embodiments, the photopolymerization initiator may include at least one of bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, α-hydroxyalkylphenyl ketone, ethyl(2,4,6-trimethylbenzoyl)phenylphosphine ester and 1-hydroxycyclohexyl-phenyl ketone.

[0020] In this embodiment, the resin composition may be provided by inkjet printing or dispensing.

[0021] In embodiments of the present invention, the adhesive component may include: a polymer derived from a resin composition, wherein the resin composition comprises a urethane acrylate compound comprising a structure according to Formula 1, a monomer having a polymerizable unsaturated group per molecule, and a photopolymerization initiator, wherein the content of the urethane acrylate compound is from about 5% by weight to about 18% by weight based on the total weight of the resin composition, and wherein the content of the urethane acrylate compound comprising the structure according to Formula 1 is from about 20% by weight to about 60% by weight based on the total weight of the urethane acrylate compound.

[0022] Chemical Formula 1

[0023]

[0024] In Formula 1, R1 and R2 are each independently substituted or unsubstituted alkylene groups having 1 to 4 carbon atoms, R3 is substituted or unsubstituted alkylene groups having 1 to 3 carbon atoms, and subscripts n1 and n2 are each independently integers selected from 1 to 6.

[0025] In an embodiment, the polymer may have a 180° peel strength of about 2000 gf / 25 mm to about 5000 gf / 25 mm as measured on a glass substrate at about 25°C.

[0026] In an embodiment, the polymer may have a 180° peel strength of about 250 gf / 25 mm to about 1000 gf / 25 mm as measured on a glass substrate at about 60°C.

[0027] In embodiments of the present invention, an electronic device may include: a display device comprising a display module and a window, and an adhesive member disposed between the display module and the window; wherein: the display device provides an image, and the adhesive member comprises a polymer derived from a resin composition, wherein the resin composition comprises a urethane acrylate compound comprising a structure according to Formula 1, a monomer having a polymerizable unsaturated group per molecule, and a photopolymerization initiator, wherein the content of the urethane acrylate compound is from about 5% by weight to about 18% by weight based on the total weight of the resin composition, and wherein the content of the urethane acrylate compound comprising a structure according to Formula 1 is from about 20% by weight to about 60% by weight based on the total weight of the urethane acrylate compound.

[0028] Chemical Formula 1

[0029]

[0030] In Formula 1, R1 and R2 are each independently substituted or unsubstituted alkylene groups having 1 to 4 carbon atoms, R3 is substituted or unsubstituted alkylene groups having 1 to 3 carbon atoms, and subscripts n1 and n2 are each independently integers selected from 1 to 6.

[0031] In an embodiment, the adhesive member may have a 180° peel strength of about 2000 gf / 25 mm to about 5000 gf / 25 mm measured on a glass substrate at about 25°C, and a 180° peel strength of about 250 gf / 25 mm to about 1000 gf / 25 mm measured on a glass substrate at about 60°C.

[0032] In one embodiment, the window may include a base layer and a printed layer disposed between the adhesive member and the base layer, and a resin composition provided on one surface of the display module or one surface of the window may be cured by irradiation with light passing through the printed layer and may form an adhesive member.

[0033] In this embodiment, the display device may include a display module, a processor, a memory, and a power module. Attached Figure Description

[0034] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0035] Figure 1 A block diagram of an electronic device according to an embodiment;

[0036] Figure 2 A schematic diagram of each of the various embodiments of the electronic device;

[0037] Figure 3 A perspective view illustrating an electronic device according to an embodiment;

[0038] Figure 4 An exploded perspective view illustrating the display device according to an embodiment;

[0039] Figure 5 For along Figure 4 A cross-sectional view taken from line I-I';

[0040] Figure 6 To explain the basis Figure 5 Detailed cross-sectional view of the display module;

[0041] Figure 7A A view illustrating a method for manufacturing an adhesive component according to an embodiment;

[0042] Figure 7B A view illustrating a method for manufacturing an adhesive component according to an embodiment;

[0043] Figure 7C A view illustrating a method for manufacturing an adhesive component according to an embodiment;

[0044] Figure 7D A view illustrating a method for manufacturing an adhesive component according to an embodiment;

[0045] Figure 8A A view illustrating a method for manufacturing an adhesive component according to an embodiment;

[0046] Figure 8B A view illustrating a method for manufacturing an adhesive component according to an embodiment;

[0047] Figure 8C A view illustrating a method for manufacturing an adhesive component according to an embodiment;

[0048] Figure 9 A cross-sectional view illustrating the display device according to an embodiment; and

[0049] Figure 10 A cross-sectional view illustrating the display device according to an embodiment. Detailed Implementation

[0050] The inventive concept can be implemented in various modifications and has various forms, and specific embodiments are illustrated in the accompanying drawings and described in detail herein. However, it should be understood that the inventive concept is not intended to be limited to the specific forms disclosed, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the inventive concept.

[0051] In this specification, it will be understood that when an element (or area, layer, or part, etc.) is referred to as being "on", "connected to", or "attached to" another element (or area, layer, or part, etc.), it may be directly disposed on, directly connected to, or directly attached to another element (or area, layer, or part, etc.), or other elements may be disposed between them.

[0052] The same reference numerals or symbols refer to the same elements throughout the drawings. In the drawings, the scale and dimensions (e.g., thickness) of the elements are enlarged for effective description of the technical content. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed elements.

[0053] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, the elements are not limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. For example, without departing from the scope of the inventive concept, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion. Similarly, the second element, component, region, layer, or portion may be referred to as the first element, component, region, layer, or portion. In this specification, unless the context clearly indicates otherwise, the singular expressions “a,” “an,” and “the” are intended to include the plural forms as well.

[0054] Additionally, the terms "below," "under," "on the underside of," "above," "on top," or "on the upper side of" are used to describe the relationships between the elements illustrated in the accompanying drawings. These terms are relative concepts and are described based on the directions indicated in the drawings. It will be understood that when an element is referred to as "on" another element, it may be in direct contact with that element, or an intervening element may exist between them. In contrast, when an element is referred to as "directly on" another element, there is no intervening element.

[0055] It will be further understood that, when used in this specification, the terms “comprises,” “includes,” “has,” and / or “comprising,” “including,” “having” indicate the presence of the described features, quantities, steps, operations, elements, components, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, elements, components, and / or combinations thereof.

[0056] Exemplary embodiments are described herein with reference to illustrative cross-sectional illustrations as preferred embodiments. Therefore, variations in the illustrated shape are contemplated, for example, due to manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shape of the regions illustrated herein, but rather include deviations in shape, for example, due to manufacturing processes. For instance, regions illustrated or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners may be rounded. Therefore, the regions illustrated in the figures are essentially illustrative, and their shapes are not intended to illustrate precise shapes of regions and are not intended to limit the scope of the claims.

[0057] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms (such as those defined in commonly used dictionaries) shall be interpreted as having meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an ideal or overly formal sense, unless expressly so defined herein.

[0058] The following describes resin compositions according to embodiments of the present invention, adhesive members according to embodiments, and electronic devices including adhesive members. Display devices according to embodiments are applicable to various electronic devices. Electronic devices according to embodiments may include display devices and further include modules or devices having additional functions in addition to display devices. As used herein, “about” or “approximately” includes stated values ​​and means within an acceptable deviation of a particular value determined by a person skilled in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the stated value, or within ±20%, ±10%, or ±5% of the stated value.

[0059] Figure 1 This is a block diagram of an electronic device EA according to an embodiment. (Reference) Figure 1 According to the embodiments, the electronic device EA may include a display module DM, a processor PR, a memory MR, and a power module PM.

[0060] The processor PR may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0061] The memory MR can store the data information required for the operation of the processor PR or the display module DM. When the processor PR executes the application program stored in the memory MR, image data signals and / or input control signals are transmitted to the display module DM, and the display module DM can process the received signals and output image information through the display screen.

[0062] The power module PM may include a power supply module (such as a power adapter or battery device) and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device EA.

[0063] At least one component of the aforementioned electronic device EA may be included in the display device according to the above embodiments. Additionally, some of the individual modules functionally included in a single module may be included in the display device, and other modules may be provided separately from the display device. For example, the display device includes a display module DM, and the processor PR, memory MR, and power module PM may be provided within the electronic device EA as other devices besides the display device.

[0064] Figure 2 This is a schematic diagram of each of various embodiments of an electronic device. Reference Figure 2 Various electronic devices that utilize the display device according to the implementation method may include electronic devices for displaying images (such as smartphones EA_1a, tablet computers EA_1b, laptop computers EA_1c, televisions EA_1d, and desktop monitors EA_1e), wearable electronic devices including display modules (such as smart glasses EA_2a, head-mounted displays EA_2b, and smartwatches EA_2c), and automotive electronic devices including display modules EA_3 (such as central information displays (CIDs) installed on the instrument panel, center console, or dashboard of a car, and interior mirror displays).

[0065] Figure 3 A perspective view illustrating an electronic device EA according to an embodiment.

[0066] Figure 3 The electronic device EA according to the embodiment described herein can be activated in response to an electrical signal. Figure 3 In this context, the electronic device EA is exemplarily illustrated as a smartphone.

[0067] An electronic device EA according to an embodiment can display an image IM via a display area DA. The display area DA may include a flat surface defined by a first directional axis DR1 and a second directional axis DR2. The display area DA may also include a curved surface that bends from at least one side of the flat surface defined by the first directional axis DR1 and the second directional axis DR2. Figure 3 An electronic device EA according to an embodiment includes two curved surfaces that bend from both sides of a flat surface defined by a first directional axis DR1 and a second directional axis DR2. However, the shape of the display area DA is not limited to this. For example, the display area DA may include only the flat surface defined by the first directional axis DR1 and the second directional axis DR2, and may further include at least three curved surfaces, for example, four curved surfaces that bend from all four sides of the flat surface defined by the first directional axis DR1 and the second directional axis DR2.

[0068] The electronic device EA according to the embodiment is flexible. The term "flexible" means that it is bendable and can include all of the following: fully foldable structures and structures that can be bent to the level of a few nanometers. For example, the electronic device EA can be a foldable device. Alternatively, the electronic device EA can be rigid.

[0069] The non-display area NDA may be adjacent to the display area DA. The non-display area NDA may surround the display area DA. Accordingly, the shape of the display area DA may be substantially defined by the non-display area NDA. However, this is presented as an example. The non-display area NDA may be configured to be adjacent to only one side of the display area DA, or the non-display area NDA may be omitted. The display area DA may be provided in various shapes and is not limited to any one implementation.

[0070] exist Figure 3 As illustrated in the following figures, the directions from the first direction axis DR1 to the third direction axis DR3 are explained, and the directions indicated by the first to third direction axes DR1, DR2, and DR3 described herein are relative concepts and can therefore be changed to other directions. Furthermore, the directions indicated by the first to third direction axes DR1, DR2, and DR3 may be referred to as the first to third direction and may be represented by the same reference numerals or symbols. In this specification, the first direction axis DR1 may be perpendicular to the second direction axis DR2, and the third direction axis DR3 may be the normal direction of the plane defined by the first direction axis DR1 and the second direction axis DR2.

[0071] The thickness direction of the electronic device EA may be parallel to a third directional axis DR3, which is the normal direction of the plane defined by the first directional axis DR1 and the second directional axis DR2. In this specification, the front surface (or upper surface, top surface, upper side) and rear surface (or lower surface, bottom surface, lower side) of each component constituting the electronic device EA may be defined based on the third directional axis DR3. In this specification, the direction in which the third directional axis DR3 extends is parallel to the thickness direction. A front surface (or upper surface, top surface, upper side) refers to a surface (or direction) adjacent to the surface (or direction) on which the image IM is displayed, and a rear surface (or lower surface, bottom surface, lower side) refers to a surface (or direction) spaced apart from the surface (or direction) on which the image IM is displayed. In this specification, a plane refers to a surface parallel to the plane defined by the first directional axis DR1 and the second directional axis DR2, and a section refers to a surface perpendicular to the plane defined by the first directional axis DR1 and the second directional axis DR2 and parallel to the third directional axis DR3.

[0072] Figure 4 An exploded perspective view illustrating the display device DD according to an embodiment. Figure 4 The display device DD according to the embodiments described herein may include in Figure 3 The electronic device EA according to the implementation method is explained in the text.

[0073] refer to Figure 4 According to an embodiment, the display device DD may include a display module DM, a window WP disposed on the display module DM, and an adhesive member AP disposed between the display module DM and the window WP. Additionally, the display device DD may further include a housing HAU that accommodates the display module DM.

[0074] exist Figure 4 In the display device DD described herein, the window WP and the housing HAU can be connected to form the exterior of the display device DD. The housing HAU can be disposed below the display module DM. The housing HAU may comprise a material with relatively high rigidity. For example, the housing HAU may comprise multiple frames and / or plates formed of glass, plastic, or metal. The housing HAU provides a receiving space. The display module DM can be housed within the receiving space and protected from external impacts.

[0075] In an implementation, the adhesive component AP may include components derived from the resin composition RC (see...). Figure 7A and Figure 8A The polymer of ) can be used to bond the AP component to the resin composition RC (see Figure 7A and Figure 8A It is formed by photocuring. The adhesive component AP can combine the display module DM and the window WP. The adhesive component AP according to the embodiment is made of the resin composition RC according to the embodiment (see Figure 7A and Figure 8A This process forms a bond that exhibits excellent adhesion reliability. Additionally, it prevents discoloration of the adhesive member AP according to the embodiment due to external light (e.g., ultraviolet light).

[0076] The window WP may include a transmissive area TA and a border area BZA. The transmissive area TA may overlap with at least a portion of the effective area AA-DM of the display module DM. The transmissive area TA may be an optically transparent area. Image IM (see...) Figure 3 It can be provided to the user through the transmission zone TA.

[0077] The border region BZA can be a region with relatively lower light transmittance than the transmission region TA. The border region BZA can define the shape of the transmission region TA. The border region BZA can be adjacent to and surround the transmission region TA.

[0078] The border area BZA may be colored. The border area BZA may cover the peripheral area NAA-DM of the display module DM and prevent the peripheral area NAA-DM from being seen from the outside. However, the implementation is not limited to what has been illustrated. The border area BZA may be configured to be adjacent only to one side of the transmissive area TA, or at least a portion of the border area BZA may be omitted.

[0079] Figure 5 For along Figure 4 The cross-sectional view taken from line I-I'. Figure 5 For including Figure 4 A cross-sectional view of the display device DD according to an embodiment, comprising the display module DM, the adhesive member AP, and the window WP.

[0080] refer to Figure 5 The display module DM may include a display panel DP and an input sensing unit TP disposed on the display panel DP. The display panel DP may be configured to substantially generate an image. The display panel DP may include a substrate BS, a circuit layer DP-CL disposed on the substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and an encapsulation layer TFE covering the display element layer DP-EL. An adhesive member AP may be disposed between the display module DM and a window WP. When the display module DM includes the display panel DP and the input sensing unit TP, the adhesive member AP may be disposed between the window WP and the input sensing unit TP disposed on the display panel DP.

[0081] Figure 5 The components of the display panel DP described in the examples are illustrated, and the components of the display panel DP are not limited thereto. For example, the display panel DP may include liquid crystal display elements, and in this case, the encapsulation layer TFE may be omitted.

[0082] The substrate BS provides a substrate surface on which the circuit layer DP-CL is disposed. The substrate BS can be a flexible substrate that is bendable, foldable, rollable, etc. The substrate BS can be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiments are not limited to these, and the substrate BS may include inorganic layers, organic layers, or composite material layers.

[0083] The circuit layer DP-CL may include insulating layers, semiconductor patterns, conductive patterns, signal lines, etc. For example, the circuit layer DP-CL may include light-emitting elements (EDs) for driving the display element layer DP-EL, which will be described later. Figure 6 ( ) is a switching transistor or a driving transistor.

[0084] The display element layer DP-EL may include light-emitting elements ED (see...) Figure 6 For example, light-emitting elements (EDs) (see...) Figure 6 It may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micron LEDs or nano LEDs.

[0085] A TFE (Transmission Equipment) encapsulation layer may be disposed on the display element layer (DP-EL). The TFE encapsulation layer protects the DP-EL from moisture, oxygen, and / or foreign matter (such as dust particles). The TFE encapsulation layer may include at least one inorganic layer. For example, the TFE encapsulation layer may include an inorganic layer, an organic layer, and an inorganic layer stacked sequentially.

[0086] The input sensing unit TP can be disposed on the display panel DP. For example, the input sensing unit TP can be directly disposed on the encapsulation layer TFE of the display panel DP. Optionally, an adhesive layer can also be disposed between the input sensing unit TP and the display panel DP.

[0087] In this specification, when an element is referred to as being directly mounted / provided on another element, there is no intermediary element between them. That is, the phrase "an element is 'directly mounted / provided on' another element" means that the element is "in direct contact" with the "other element".

[0088] The input sensing unit TP can detect external input, convert the detected external input into an input signal, and provide the input signal to the display panel DP. For example, in the display device DD according to the embodiment, the input sensing unit TP can be a touch sensing component that detects touch. The input sensing unit TP can recognize direct touch by the user, indirect touch by the user, direct contact with an object, indirect contact with an object, etc.

[0089] The input sensing unit TP can detect at least one of the position and intensity (pressure) of a touch applied from the outside. In embodiments, the input sensing unit TP can have various structures or be composed of various materials, but is not limited to any one embodiment. For example, the input sensing unit TP can detect external input capacitively. The display panel DP can receive the input signal from the input sensing unit TP and generate an image corresponding to the input signal.

[0090] The window WP may include a base layer BL and a printed layer BM. Although not illustrated, the window WP may further include at least one functional layer (not illustrated) provided on the base layer BL. For example, the functional layer (not illustrated) may be a hard coating, an anti-fingerprint coating, etc., but the implementation is not limited thereto.

[0091] The substrate BL can be a glass substrate or a polymer substrate. Optionally, the substrate BL can be a plastic substrate. For example, the substrate BL can be formed of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene vinyl alcohol copolymer, or a combination thereof.

[0092] The printed layer BM can be disposed on one surface of the substrate layer BL. The printed layer BM can be provided on the lower surface of the substrate layer BL adjacent to the display module DM. The printed layer BM can be disposed at the edge area of ​​the substrate layer BL. The printed layer BM can be an ink-printed layer. Alternatively, the printed layer BM can be a layer formed of pigment or dye. The printed layer BM can be formed of a light-absorbing material, or it can be formed of black pigment or black dye. However, this is presented as an example, and the implementation is not limited thereto. In the window WP, the border area BZA (see...) Figure 4 It can be provided for the part with the printed layer BM.

[0093] The thickness T0 of the adhesive member AP can be from about 50 μm to about 300 μm. For example, the adhesive member AP can have a thickness T0 of from about 50 μm to about 250 μm. However, this is presented as an example, and the thickness T0 of the adhesive member AP is not limited thereto.

[0094] Figure 6 To explain the basis Figure 5 A detailed cross-sectional view of the display module DM. Figure 6 The components of the display module DM described herein are illustrated as examples, and the implementation is not limited thereto.

[0095] refer to Figure 6 The substrate BS may comprise a single layer or multiple layers. For example, the substrate BS may comprise at least one of a first synthetic resin layer, a multilayer or single-layer inorganic layer disposed on the first synthetic resin layer, and a second synthetic resin layer disposed on the multilayer or single-layer inorganic layer. The first and second synthetic resin layers may each comprise a polyimide resin. Alternatively, the first and second synthetic resin layers may each comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. In this specification, the functional group preceding the term "resin class" is considered to be included in that resin class. For example, "siloxane resin" means including siloxane functional groups.

[0096] The display panel DP may include transistors TR and light-emitting elements ED. The transistors TR and light-emitting elements ED may be disposed on the substrate BS. Figure 6 While a transistor TR can be described, a display panel DP can essentially include at least one capacitor and multiple transistors for driving the light-emitting elements ED.

[0097] The circuit layer DP-CL can be disposed on the substrate BS. The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connection electrode CNE, and multiple insulating layers BFL and INS1 to INS6. The multiple insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and first to sixth insulating layers INS1 to INS6. However, Figure 6 The stacking structure of the DP-CL circuit layer is presented as an example, and the stacking structure of the DP-CL circuit layer can be changed according to the configuration of the display panel DP and the process used for the DP-CL circuit layer.

[0098] A shielding electrode BML may be disposed on a substrate BS. The shielding electrode BML may overlap with a transistor TR. The shielding electrode BML blocks light incident on the transistor TR from below the display panel DP, thereby protecting the transistor TR. The shielding electrode BML may include a conductive material. When a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR disposed on the shielding electrode BML can be maintained. However, the implementation is not limited to this, and the shielding electrode BML may be a floating electrode. The shielding electrode BML may also be omitted.

[0099] A buffer layer BFL can be disposed on a substrate BS and cover a shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL can improve the adhesion between the substrate BS and the semiconductor or conductive pattern disposed on the buffer layer BFL.

[0100] A transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, channel C1, and drain D1 of the transistor TR may be formed from a semiconductor pattern. The semiconductor pattern of the transistor TR may include polycrystalline silicon, amorphous silicon, or metal oxide. However, any material having semiconductor properties may be used without limitation, and the material is not limited to any one embodiment.

[0101] A semiconductor pattern may include multiple regions divided according to conductivity levels. In the semiconductor pattern, regions doped with dopant or where metal oxides are reduced may have high conductivity and can essentially serve as the source S1 and drain D1 of a transistor TR. The highly conductive regions of the semiconductor pattern may correspond to the source S1 and drain D1 of the transistor TR. In the semiconductor pattern, undoped or lightly doped regions, or regions with low conductivity due to unreduced metal oxides, may correspond to the channel (or active region) C1 of the transistor TR.

[0102] A first insulating layer INS1 may cover the semiconductor pattern of transistor TR and may be disposed on buffer layer BFL. The gate G1 of transistor TR may be disposed on the first insulating layer INS1. In a planar plane, gate G1 may overlap with the channel C1 of transistor TR. Gate G1 may be used as a mask during the process of doping the semiconductor pattern of transistor TR.

[0103] The second insulating layer INS2 may cover the gate G1 and may be disposed on the first insulating layer INS1. The third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0104] The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 that electrically connect the transistor TR and the light-emitting element ED. However, the configuration of the connection electrode CNE that electrically connects the transistor TR and the light-emitting element ED is not limited thereto. The first connection electrode CNE1 or the second connection electrode CNE2 may be omitted, or additional connection electrodes may be included.

[0105] The first connecting electrode CNE1 may be disposed on the third insulating layer INS3. The first connecting electrode CNE1 may be connected to the drain electrode D1 through the first contact hole CH1 penetrating the first to third insulating layers INS1 to INS3. The fourth insulating layer INS4 may cover the first connecting electrode CNE1 and may be disposed on the third insulating layer INS3. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0106] The second connecting electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 through the second contact hole CH2 penetrating the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 may cover the second connecting electrode CNE2 and may be disposed on the fifth insulating layer INS5.

[0107] The first to sixth insulating layers INS1 to INS6 may each comprise an inorganic layer or an organic layer. For example, the inorganic layer may comprise at least one of alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins.

[0108] The display element layer DP-EL may include a pixel-defining film (PDL) and a light-emitting element (ED). The light-emitting element ED may include a first electrode (AE), a hole control layer (HCL), a light-emitting layer (EML), an electronic control layer (TCL), and a second electrode (CE).

[0109] The first electrode AE ​​can be disposed on the sixth insulating layer INS6. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the third contact hole CH3 penetrating the sixth insulating layer INS6. The first electrode AE ​​can be electrically connected to the drain D1 of the transistor TR through the first connecting electrode CNE1 and the second connecting electrode CNE2.

[0110] The first electrode AE ​​may be formed of a metallic material, a metallic alloy, or a conductive compound. The first electrode AE ​​may be an anode or a cathode. Alternatively, the first electrode AE ​​may be a pixel electrode. The first electrode AE ​​may be a transmission electrode, a transmission-reflection electrode, or a reflection electrode. The first electrode AE ​​may include: at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; or a compound of two or more of these materials; a mixture of two or more of these materials; or an oxide thereof.

[0111] When the first electrode AE ​​is a transmission electrode, the first electrode AE ​​may include a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. When the first electrode AE ​​is a transmissive-reflective electrode or a reflective electrode, the first electrode AE ​​may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, or their compounds or mixtures thereof (e.g., a mixture of Ag and Mg), or multilayer structure materials such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). Optionally, the first electrode AE ​​may have a multilayer structure, which includes a reflective film or a transmissive-reflective film formed from the above materials and a transparent conductive film formed from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but is not limited thereto. Furthermore, the embodiments are not limited to this, and the first electrode AE ​​may include the aforementioned metallic material, a combination of two or more of the aforementioned metallic materials, or an oxide of the aforementioned metallic material, etc.

[0112] A pixel-defining film (PDL) can be disposed on the sixth insulating layer INS6. The PDL can be formed from a polymer resin. For example, the PDL can be formed from a polyacrylate resin or a polyimide resin. Alternatively, in addition to a polymer resin, the PDL can be further formed from an inorganic material. The PDL can be formed from a light-absorbing material or from a black pigment or dye. A PDL formed from a black pigment or dye can constitute a black pixel-defining film. When forming the PDL, carbon black or the like can be used as a black pigment or dye, but the implementation is not limited to this.

[0113] Furthermore, the pixel-defining film (PDL) can be formed from inorganic materials. For example, the pixel-defining film (PDL) can be formed from inorganic materials (such as silicon nitride (SiN)). x ), silicon dioxide (SiO) x ) and silicon oxynitride (SiO) x N y ))form.

[0114] The light-emitting opening PX_OP, which exposes a portion of the first electrode AE, can be defined within the pixel-defining film PDL. The portion of the first electrode AE ​​exposed by the light-emitting opening PX_OP can be defined as the light-emitting region LA.

[0115] The effective area AA-DM of the display module DM may include a light-emitting area LA and a light-blocking area NLA. The area where the pixel defining film PDL is disposed may correspond to the light-blocking area NLA. In the effective area AA-DM, the light-blocking area NLA may surround the light-emitting area LA.

[0116] A hole control layer (HCL) may be disposed on the first electrode (AE) and the pixel defining film (PDL). The hole control layer (HCL) may be a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). The hole control layer (HCL) may include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer (HCL) may include typical hole injection materials and / or typical hole transport materials.

[0117] The luminescent layer (EML) can be disposed on the hole control layer (HCL). The EML can be disposed in the region corresponding to the luminescent opening (PX_OP). Alternatively, the EML can be provided as a common layer. The EML can include organic and / or inorganic luminescent materials. The EML can emit light of one of the colors red, green, and blue. For example, the EML can emit blue light.

[0118] An electron control layer (TCL) may be disposed on the light-emitting layer (EML). The TCL may be a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). The TCL may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The TCL may include typical electron injection materials and / or typical electron transport materials.

[0119] The second electrode CE can be disposed on the electronic control layer TCL. The second electrode CE can be provided as a common layer overlapping the light-emitting region LA and the light-blocking region NLA.

[0120] The second electrode CE can be a common electrode. The second electrode CE can be a cathode or an anode. For example, when the first electrode AE ​​is an anode, the second electrode CE can be a cathode, and when the first electrode AE ​​is a cathode, the second electrode CE can be an anode.

[0121] The second electrode CE can be a transmission electrode, a transmission-reflection electrode, or a reflection electrode. When the second electrode CE is a transmission electrode, it can be formed of a transparent metal oxide (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.).

[0122] When the second electrode CE is a transmissive or reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, Yb, W, Na, or their compounds or mixtures thereof (e.g., AgMg, AgYb, MgYb, AgLi, or AgNa), or multilayer materials such as LiF / Ca or LiF / Al. Optionally, the second electrode CE may have a multilayer structure, which includes a reflective or transmissive film formed from the above materials and a transparent conductive film formed from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the second electrode CE may include the above-mentioned metallic materials, combinations of two or more of the above-mentioned metallic materials, or oxides of the above-mentioned metallic materials.

[0123] An encapsulation layer TFE can be disposed on the second electrode CE and cover the light-emitting element ED. The encapsulation layer TFE may include multiple thin films. For example, the encapsulation layer TFE may include multiple inorganic films disposed on the second electrode CE and an organic film disposed between the multiple inorganic films. The multiple inorganic films can protect the light-emitting element ED from moisture / oxygen, and the organic film can protect the light-emitting element ED from foreign matter (such as dust particles).

[0124] The input sensing unit TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing unit TP may include at least one conductive layer disposed on the sensing insulating layer. The input sensing unit TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0125] A first sensing insulating layer IL1 may be disposed on the encapsulation layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the encapsulation layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, and in this case, the first conductive layer CDL1 may be in contact with the encapsulation layer TFE.

[0126] A first conductive layer CDL1 may be disposed on a first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sensing insulating layer IL1. A second sensing insulating layer IL2 may be disposed on the first sensing insulating layer IL1 such that it covers at least a portion of the first conductive layer CDL1.

[0127] A second conductive layer CDL2 may be disposed on a second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. Each of the plurality of second conductive patterns may be connected to a plurality of first conductive patterns through a contact hole formed in the second sensing insulating layer IL2.

[0128] The plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 can each correspond to the light-blocking region NLA. The plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 can each correspond to a grid pattern.

[0129] The third sensing insulating layer IL3 may be disposed on the second sensing insulating layer IL2 and cover the second conductive layer CDL2. The second sensing insulating layer IL2 and the third sensing insulating layer IL3 may each include an inorganic insulating layer or an organic insulating layer.

[0130] The first conductive layer CDL1 and the second conductive layer CDL2 may each have a single-layer structure or a multilayer structure in which multiple layers are stacked along a third direction DR3. The single-layer conductive layers CDL1 and CDL2 may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium zinc tin oxide (IZTO). Alternatively, the transparent conductive layer may include conductive polymers (such as PEDOT), metal nanowires, graphene, etc.

[0131] The conductive layers CDL1 and CDL2, which have a multilayer structure, may include metal layers. For example, the metal layers may have a three-layer structure of titanium (Ti) layer / aluminum (Al) layer / titanium (Ti) layer. The conductive layers CDL1 and CDL2, which have a multilayer structure, may include at least one metal layer and at least one transparent conductive layer.

[0132] Figures 7A to 7D To illustrate the method for manufacturing adhesive components AP according to embodiments (see...) Figure 4 and Figure 5 The view of the method, specifically, Figures 7A to 7D To illustrate the adhesive component AP manufactured from the resin composition RC according to the embodiment (see... Figure 4 and Figure 5 A schematic diagram of a method for manufacturing adhesive components (AP). For example, a method for manufacturing adhesive components (see...). Figure 4 and Figure 5 The method may include the steps of: providing a resin composition RC on a substrate CF; forming an initial adhesive member P-AP by providing a first light UV-1 to the resin composition RC; and forming an adhesive member AP by providing a second light UV-2 to the initial adhesive member P-AP (see...). Figure 4 and Figure 5 The following text is about... Figures 7A to 7D The description will no longer be explained or referenced. Figures 1 to 6 The content described is repetitive, and the following description will focus primarily on the differences.

[0133] refer to Figure 7A The resin composition RC according to the embodiments can be provided on the substrate CF. The resin composition RC can be provided on the substrate CF via nozzle NZ. For example, the substrate CF provided with the resin composition RC may include polyethylene terephthalate (PET). The substrate CF is for forming an adhesive member AP from the resin composition RC (see Figure 4 and Figure 5 A temporary substrate, CF, can be used without restriction as long as it can be easily removed after the resin composition RC has cured. One surface of the substrate CF on which the resin composition RC is provided can be released.

[0134] The resin composition RC according to the embodiments can be provided by inkjet printing or dispensing. In the embodiments, the liquid resin composition RC can be provided in a uniform amount and / or at a uniform rate. Figure 7A The resin composition RC is provided via nozzle NZ, but the equipment used to provide the resin composition RC is not limited thereto.

[0135] The resin composition RC according to the embodiments may include a urethane acrylate compound comprising a structure according to chemical formula 1, a monomer having a polymerizable unsaturated group per molecule, and a photopolymerization initiator.

[0136] All structures described in this specification based on chemical formula 1 refer to chemical formula 1.

[0137] Chemical Formula 1

[0138]

[0139] In Formula 1, R1 and R2 can each be independently a substituted or unsubstituted alkylene group having 1 to 4 carbon atoms. For example, alkylene groups may include methylene, ethylene, propylene, butylene, etc. Alkylene groups can be straight-chain, branched, or cyclic. R1 to R2 can be the same as or different from each other.

[0140] In Formula 1, R3 can be a substituted or unsubstituted alkylene group having 1 to 3 carbon atoms. For example, the alkylene group can include methylene, ethylene, or propylene. The alkylene group can be straight-chain, branched, or cyclic. R3 can be the same as or different from R1 and R2.

[0141] In an embodiment, R1 and R2 may be branched propylene groups, such as –CH(CH3)CH2–. In an embodiment, R3 may be a branched propylene group or an ethylene group.

[0142] In chemical formula 1, subscripts n1 and n2 can each be independent integers selected from 1 to 6. Subscripts n1 and n2 can be the same or different from each other.

[0143] The urethane acrylate compound containing the structure according to Formula 1 may be a single compound or may be used in combination of two or more different urethane acrylate compounds.

[0144] Carbamate acrylate compounds containing the structure according to Formula 1 may have a weight-average molecular weight Mw of about 3000 g / mol to about 15000 g / mol. The weight-average molecular weight Mw can be determined by gel permeation chromatography and calculated as a standard polystyrene conversion value.

[0145] A carbamate acrylate compound comprising the structure according to Formula 1 may have a number-average molecular weight Mn of about 2000 g / mol to about 7000 g / mol. The number-average molecular weight Mn can be determined by end-group titration using methods such as nuclear magnetic resonance spectroscopy, but the method is not limited thereto, as long as the method can be appropriately selected by those skilled in the art.

[0146] For example, the weight-average molecular weight Mw and number-average molecular weight Mn according to the embodiment are determined using a gel permeation chromatography (GPC) analyzer “HLC-8420GPC” manufactured by TOSOHC Corporation. The values ​​of weight-average molecular weight Mw and number-average molecular weight Mn can be calculated from standard polystyrene (PS) conversions selected from SEC curves detected using an RI detector with a TSKgel SUPER HZM-N as the measurement column.

[0147] The resin composition RC according to the embodiments may include a urethane acrylate compound comprising the structure according to Formula 1, thereby having a low viscosity before curing and exhibiting increased adhesive strength at room temperature after curing, and also exhibiting increased adhesive strength at elevated temperatures. In this specification, "room temperature" generally refers to 25°C.

[0148] Relative to the total weight of the resin composition RC, the resin composition RC may include a urethane acrylate compound comprising the structure according to Formula 1 in an amount of about 5% to about 18% by weight. When the content of the urethane acrylate compound in the resin composition RC is less than 5% by weight, the 180° peel strength measured on a glass substrate after curing at about 25°C and about 60°C may be significantly lower than the 180° peel strength measured on a glass substrate after curing at about 25°C and about 60°C for the resin composition RC comprising 5% to 18% by weight of the urethane acrylate compound comprising the structure according to Formula 1. Relative to the total weight of the resin composition RC, when the content of urethane acrylate compound in the resin composition RC exceeds 18% by weight, the 180° peel strength measured on a glass substrate at about 25°C after curing can be significantly lower than the 180° peel strength measured on a glass substrate at about 25°C after curing of the resin composition RC comprising 5% to 18% by weight of urethane acrylate compound containing the structure according to Formula 1, and the viscosity before curing will be higher.

[0149] The content of the structure according to Formula 1 in the urethane acrylate compound relative to the total weight of the urethane acrylate compound can be from about 20% by weight to about 60% by weight. When the content of the structure according to Formula 1 is less than 20% by weight relative to the total weight of the urethane acrylate compound, the resin composition RC can have a significantly lower 180° peel strength measured on a glass substrate at about 25°C and about 60°C than that of a resin composition RC having the structure according to Formula 1 at about 20% by weight to about 60% by weight relative to the total weight of the urethane acrylate compound, and the resin composition RC can have a greater storage modulus measured at about 25°C than that of a resin composition RC having the structure according to Formula 1 at about 20% by weight to about 60% by weight relative to the total weight of the urethane acrylate compound. When the content of the structure according to Formula 1 exceeds 60% by weight relative to the total weight of the urethane acrylate compound, the resin composition RC can have a significantly lower 180° peel strength measured on a glass substrate at about 25°C than the resin composition RC having 20% ​​to 60% by weight relative to the total weight of the urethane acrylate compound.

[0150] A urethane acrylate compound comprising the structure according to Formula 1 can be synthesized from reactants comprising: a first polyfunctional alcohol comprising the structure according to Formula 1; a second alcohol different from the first polyfunctional alcohol; a polyfunctional isocyanate compound; and a compound comprising at least one (meth)acrylate group and at least one hydroxyl group per molecule. However, the composition of the reactants is not limited thereto, and additional components may be suitably included, provided that these components do not significantly affect the resulting product. In addition to the reactants, a catalyst, etc., may be added during the synthesis of the urethane acrylate compound comprising the structure according to Formula 1.

[0151] In this specification, (meth)acrylic acid group refers to acrylic acid group or methacrylic acid group, and (meth)acrylic acid refers to acrylic acid or methacrylic acid.

[0152] For example, a first polyfunctional alcohol according to an embodiment may include 2,2-bis(4-polyoxypropoxyphenyl)propane. For example, a first polyfunctional alcohol according to an embodiment may include 2,2-bis(4-polyoxypropoxyphenyl)propane and 2,2-bis(4-polyoxypropoxyphenyl)ethane. However, this is presented as an example, and first polyfunctional alcohols comprising the structure according to Formula 1 are not limited thereto. A first polyfunctional alcohol comprising the structure according to Formula 1 may be a single compound or may be used in combination of two or more compounds.

[0153] For example, the content of the first polyfunctional alcohol may be from about 20% by weight to about 60% by weight relative to the total weight of the reactants. However, this is presented as an example and the composition may be appropriately modified by those skilled in the art within the same range.

[0154] The second alcohol may differ from the first polyfunctional alcohol. The second alcohol may include polyfunctional alcohols that differ from the first polyfunctional alcohol. In addition to polyfunctional alcohols, the second alcohol may further include monofunctional alcohols. The second alcohol may be a single compound or may be used in combination of two or more compounds.

[0155] For example, the second alcohol may include 2,2-bis(hydroxymethyl)butyric acid. For example, the second alcohol may include 2,2-bis(hydroxymethyl)butyric acid and ethanol.

[0156] When synthesizing a urethane acrylate compound comprising a resin composition RC according to the embodiments, wherein the second alcohol as a reactant comprises 2,2-bis(hydroxymethyl)butyric acid, the adhesive strength at high temperatures can be significantly increased after photocuring the resin composition RC. This is because the backbone of 2,2-bis(hydroxymethyl)butyric acid comprises carboxylic acid groups. In this specification, "high temperature" can include, for example, 60°C.

[0157] When the second alcohol does not include 2,2-bis(hydroxymethyl)butyric acid, the resin composition RC comprising the urethane acrylate compound synthesized from such reactants can have a 180° peel strength of less than about 200 gf / 25 mm as measured on a glass substrate at 60°C after photocuring.

[0158] For example, the content of the second alcohol relative to the total weight of the reactants may be from about 1% by weight to about 20% by weight. However, this is presented as an example and the composition may be appropriately modified by those skilled in the art within the same range.

[0159] For example, polyfunctional isocyanates may include at least one of 1,3-bis(methyl isocyanate)cyclohexane and isophorone diisocyanate. However, this is presented by way of example, and polyfunctional isocyanates are not limited thereto. Polyfunctional isocyanates may be a single compound or may be used in combination of two or more compounds. For example, the content of the polyfunctional isocyanate relative to the total weight of the reactants may be from about 20% by weight to about 50% by weight.

[0160] The polyfunctional isocyanate compounds according to the embodiments may include 1,3-bis(methyl isocyanate)cyclohexane.

[0161] For example, a compound comprising at least one (meth)acrylate group and at least one hydroxyl group per molecule may include 2-hydroxyethyl acrylate or PLACEL FA1DDM (manufactured by Daicel Corp.). However, this is presented as an example, and the compound is not limited thereto, as long as the compound comprises at least one (meth)acrylate group and at least one hydroxyl group per molecule.

[0162] When synthesizing urethane acrylate compounds comprising the structure according to Formula 1, a catalyst may be added in addition to the reactants. For example, dibutyltin dilaurate can be used as a catalyst. However, this is presented as an example, and the catalyst is not limited thereto, as long as it can be appropriately selected by those skilled in the art.

[0163] The content of monomers having one polymerizable unsaturated group per molecule may be from about 50% by weight to about 93% by weight, relative to the total weight of the resin composition RC. For example, the content of monomers having one polymerizable unsaturated group per molecule may be from about 70% by weight to about 93% by weight.

[0164] In this context, a polymerizable unsaturated group can refer to a functional group having unsaturated bonds capable of participating in a polymerization reaction, and the unsaturated group can include double or triple bonds. For example, polymerizable unsaturated groups can include acrylate groups, acrylic groups, vinyl groups, allyl groups, methacrylate groups, etc.

[0165] Monomers having a polymerizable unsaturated group per molecule may include at least one of 4-hydroxybutyl acrylate, tetrahydrofurfuryl acrylate, isobornyl acrylate, isodecanyl acrylate, dicyclopentenyl acrylate, lauryl acrylate (C12), stearyl acrylate (C18), isostearyl acrylate, 2-ethylhexyl acrylate, isoamyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, phenoxyethyl acrylate, phenoxydiethylene glycol acrylate, 2-{2-[(2-ethylhexyl)oxy]ethoxy}ethyl acrylate, 1,4-cyclohexanediol monoacrylate, N,N-diethylacrylamide, N-(2-hydroxyethyl)acrylamide, and 4-acryloylmorpholine. However, this is presented by way of example, and monomers having a polymerizable unsaturated group per molecule included in the resin composition RC are not limited thereto. Monomers having a polymerizable unsaturated group per molecule included in the resin composition RC may be a single compound or may be used in combination of two or more compounds.

[0166] In an embodiment, a monomer having a polymerizable unsaturated group per molecule may include an acrylate group as a polymerizable unsaturated group.

[0167] The resin composition RC according to the embodiments may include a photopolymerization initiator. A photopolymerization initiator may refer to a substance that absorbs light (such as ultraviolet light) to initiate a polymerization reaction of monomers or oligomers.

[0168] For example, the photopolymerization initiator may include at least one of 2,2-dimethoxy-1,2-diphenylethyl-1-one, 1-hydroxycyclohexyl-phenyl one, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propanoyl)-benzyl]-phenyl}-2-methylprop-1-one.

[0169] In addition, photopolymerization initiators may include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinoprop-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morphone-4-yl-phenyl)-but-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl(2,4,6-trimethyl... At least one of the following: bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, [1-(4-phenylthiobenzoyl)heptylamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazole-3-yl]ethyleneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrrolidinyl)phenyl]titanium (IV).

[0170] In embodiments, the resin composition RC may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and / or α-hydroxyalkylbenzophenone as a photopolymerization initiator. The photopolymerization initiator may be a single compound or may be used in combination of two or more compounds. However, the photopolymerization initiator is not limited to the types described above, and may be used without limitation as long as it falls within a range that can be suitably selected by those skilled in the art. For example, the content of the photopolymerization initiator relative to the total weight of the resin composition may be from about 1% by weight to about 5% by weight.

[0171] Less than approximately 2000 mJ / cm 2After photocuring in air under conditions of high cumulative UV light intensity, the resin composition RC according to the embodiments can have a 180° peel strength of about 2000 gf / 25 mm to about 6000 gf / 25 mm measured on a glass substrate at about 25°C. After curing, when the resin composition RC has a 180° peel strength of less than about 2000 gf / 25 mm on a glass substrate at room temperature, the resin composition RC may not have sufficient adhesive strength to adjacent components of the display device (e.g., display modules and / or windows).

[0172] Less than approximately 2000 mJ / cm 2 After photocuring in air under conditions of high cumulative UV light intensity, the resin composition RC according to the embodiments can have a 180° peel strength of about 250 gf / 25 mm to about 1000 gf / 25 mm measured on a glass substrate at about 60°C. After curing, when the resin composition RC has a 180° peel strength of less than about 250 gf / 25 mm on a glass substrate at high temperature, the resin composition RC can have low adhesion reliability.

[0173] The resin composition RC according to the embodiment can have a viscosity of about 5 mPa·s to about 20 mPa·s, measured at about 25°C, before curing. When the resin composition RC has a viscosity of less than about 5 mPa·s, measured at about 25°C, before curing, the adhesive strength and mechanical strength after curing can be reduced. When the resin composition RC has a viscosity of greater than about 20 mPa·s, measured at about 25°C, before curing, it is difficult to coat the substrate CF with the resin composition RC, and therefore the processability can be deteriorated. Conversely, when the resin composition RC has a viscosity that meets the above range, excellent coatability and adhesive strength after curing can be achieved.

[0174] The resin composition RC according to the embodiments can have a glass transition temperature Tg of about -20°C to about 20°C, about -20°C to about 10°C, or about -20°C to about 5°C after curing. When the glass transition temperature Tg after curing is less than about -20°C, the electrical resistance decreases in high temperature and high humidity environments, and therefore the adhesive strength may deteriorate. Furthermore, when the glass transition temperature Tg after curing is greater than about 20°C, the polymer derived from the resin composition RC has high cohesiveness, which can lead to susceptibility to external impacts. Conversely, when the glass transition temperature Tg is within the range of about -20°C to about 20°C, appropriate adhesive strength and durability can be achieved.

[0175] The resin composition RC according to the embodiments can have a storage modulus of about 0.02 MPa to about 0.2 MPa after curing, measured at about 25°C. When the storage modulus after curing is less than about 0.02 MPa, the mechanical strength is low, which can lead to susceptibility to impact. Conversely, when the storage modulus after curing is greater than about 0.2 MPa, flexibility and adhesive strength can deteriorate.

[0176] Accordingly, the resin composition RC according to the embodiments can have low viscosity before curing and exhibit excellent adhesion reliability after curing. Furthermore, the adhesive component formed by curing the resin composition RC according to the embodiments and the electronic device including the adhesive component can also exhibit excellent adhesion reliability.

[0177] refer to Figure 7B A first UV-1 light can be provided to a resin composition RC coated on a substrate CF with a uniform thickness. The liquid resin composition RC can be cured by the first UV-1 light to form an initial adhesive member P-AP (see...). Figure 7C The first light, UV-1, can be ultraviolet light. Figure 7B The illustration describes the formation of an initial adhesive member P-AP by directly irradiating a resin composition RC coated on a substrate CF with a first light UV-1, but the embodiment is not limited to this. A carrier film (not illustrated) may be disposed on the resin composition RC coated with a uniform thickness, and the carrier film (not illustrated) may transmit ultraviolet light.

[0178] refer to Figure 7C and Figure 7D The initial bonded member P-AP formed by irradiating the resin composition RC with the first light UV-1 (see Figure 7B The initial adhesive component P-AP can be detached from the substrate CF and provided on one surface of the window WP or one surface of the display module DM. One surface of the initial adhesive component P-AP is stacked on one surface of the window WP or one surface of the display module DM, and the other surface of the display module DM not to which the initial adhesive component P-AP is attached or the other surface of the window WP not to which the initial adhesive component P-AP is attached can be attached to the other surface of the initial adhesive component P-AP. Subsequently, the initial adhesive component P-AP is irradiated with a second light UV-2 to form the adhesive component AP (see...). Figure 4 and Figure 5 The second light, UV-2, can be ultraviolet light. The second light, UV-2, is provided from above the window WP, and the window WP allows the second light, UV-2 to pass through. The second light, UV-2, can pass through the window WP to be provided to the initial adhesive component P-AP. Additionally, the second light, UV-2, can pass through the printed layer BM to be provided to the initial adhesive component P-AP.

[0179] One area of ​​the initial adhesive component P-AP that overlaps with the printed layer BM can be irradiated with a small amount of second light UV-2 compared to another area of ​​the initial adhesive component P-AP that does not overlap with the printed layer BM.

[0180] Figures 7A to 7D This illustrates how an adhesive component AP is formed by curing a resin composition RC twice (e.g., by providing light twice). Figure 4 and Figure 5 However, the implementation is not limited to this. For example, the resin composition RC can be cured once to form the adhesive member AP (see...). Figure 4 and Figure 5 Alternatively, the resin composition can be cured three or more times (RC) to form an adhesive component (AP) (see Figure 4 and Figure 5 ).

[0181] Figures 8A to 8C To illustrate the method for manufacturing adhesive components AP according to embodiments (see...) Figure 4 and Figure 5 The view of the method, specifically, Figures 8A to 8C To illustrate the adhesive component AP manufactured from the resin composition RC according to the embodiment (see... Figure 4 and Figure 5 A schematic diagram of the method. The following section discusses... Figures 8A to 8C The description will no longer be explained or referenced. Figures 1 to 7D The content described is repetitive, and the following description will focus primarily on the differences.

[0182] For example, Figures 8A to 8C The AP used for manufacturing adhesive components is explained in the text (see Figure 4 and Figure 5 The method may include the steps of: providing a resin composition RC on a display module DM; forming an initial adhesive member P-AP by providing a first light UV-1 to the resin composition RC; and forming an adhesive member AP by providing a second light UV-2 to the initial adhesive member P-AP (see...). Figure 4 and Figure 5 ). Figures 8A to 8C The manufacturing method explained in the text and Figures 7A to 7D The difference in the manufacturing method described in the text lies in providing the resin composition RC on the display module DM.

[0183] The resin composition RC can be directly provided on one surface of the display module DM or one surface of the window WP. Figure 8A The explanation involves directly applying the resin composition RC to one surface of the display module DM.

[0184] refer to Figure 8BA first UV-1 light can be provided to a uniformly coated resin composition RC. The first UV-1 light is provided to the resin composition RC, and an initial adhesive member P-AP can then be formed. A window WP can be provided on the initial adhesive member P-AP. (Reference) Figure 8C The second UV-2 light can pass through the window WP to be provided to the initial adhesive component P-AP. Additionally, the second UV-2 light can pass through the printed layer BM to be provided to the initial adhesive component P-AP. The initial adhesive component P-AP can be cured by the second UV-2 light to form the adhesive component AP (see...). Figure 4 and Figure 5 ).

[0185] Adhesive member AP formed from resin composition RC according to the embodiment (see Figure 4 and Figure 5 It can exhibit high adhesive strength. Additionally, the adhesive member AP (see embodiment) formed from the resin composition RC according to the embodiment... Figure 4 and Figure 5 High adhesion strength can be exhibited even under the printed BM layer.

[0186] Figure 9 and Figure 10 Cross-sectional views of display devices DD-a and DD-b according to embodiments are shown below. (The following refers to references...) Figure 9 and Figure 10 The descriptions of the display devices DD-a and DD-b according to the embodiments will not be further explained or referenced. Figures 1 to 8C The content described is repetitive, and the following description will focus primarily on the differences.

[0187] Reference Figure 4 and Figure 5 Compared to the DD display device, Figure 9 The display device DD-a described herein may further include a light control layer PP and an optical adhesive layer AP-a. According to an embodiment, the display device DD-a may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP. The light control layer PP may include a polarizer or a color filter layer.

[0188] The optical adhesive layer AP-a can be formed from the resin composition RC according to the embodiments. The optical adhesive layer AP-a, which includes a polymer derived from the resin composition RC, exhibits excellent adhesive strength. The display device DD-a, which includes the optical adhesive layer AP-a, exhibits excellent adhesion reliability and display quality.

[0189] Reference Figure 4 and Figure 5 Compared to the DD display device, Figure 10The display device DD-b according to the embodiment described herein may further include a light control layer PP, an optical adhesive layer AP-a, and an interlayer adhesive layer PIB.

[0190] In the display device DD-b according to the embodiment, an adhesive member AP can be provided between the display panel DP and the input sensing unit TP. That is, the input sensing unit TP is not directly disposed on the display panel DP, but the input sensing unit TP can be connected to the display panel DP via the adhesive member AP. For example, the adhesive member AP can be disposed on the encapsulation layer TFE of the display panel DP (see...). Figure 4 and Figure 5 Between the input sensing unit TP and the input sensing unit TP.

[0191] An interlayer adhesive layer (PIB) is provided beneath the light control layer (PP). The interlayer adhesive layer (PIB) is disposed between the input sensing unit (TP) and the light control layer (PP) and can be formed of an adhesive material with excellent moisture-proof properties. For example, the interlayer adhesive layer (PIB) can be formed of polyisobutylene. The interlayer adhesive layer (PIB) can be disposed on the input sensing unit (TP) to prevent corrosion of the sensing electrodes of the input sensing unit (TP). The display device DD-b according to an embodiment includes an optical adhesive layer (AP-a) and an adhesive member (AP) formed from the resin composition RC according to an embodiment, and the display device DD-b including the optical adhesive layer (AP-a) and the adhesive member (AP) exhibits excellent adhesion reliability and display quality.

[0192] The following describes in detail, with reference to embodiments and comparative examples, the resin composition and the adhesive member formed from the resin composition according to the present invention. Furthermore, the following embodiments are merely illustrative of the present invention, and the scope of the present invention is not limited thereto.

[0193] Example

[0194] Table 1 shows the composition and content of the resin compositions according to the examples and comparative examples. The resin compositions were prepared as liquid resin compositions by stirring the components in Table 1 below at room temperature. The content of each component in Table 1 was measured in a light-proof container.

[0195] Furthermore, Table 2 shows the compounds and their contents used in the synthesis of urethane acrylate compounds A-1 to A-9 in the resin compositions according to the examples and comparative examples. The methods for synthesizing urethane acrylate compounds A-1 to A-9 will be described in more detail below.

[0196] The resin compositions according to Examples 1 to 7 comprise a urethane acrylate compound containing a structure according to Formula 1, a monomer having one polymerizable unsaturated group per molecule, and a photopolymerization initiator. The content of the urethane acrylate compound in the resin compositions according to Examples 1 to 7 falls within the range of about 5% by weight to about 18% by weight, relative to the total weight of the urethane acrylate compound. The content of the urethane acrylate compound according to Formula 1 in Examples 1 to 7 falls within the range of about 20% by weight to about 60% by weight, relative to the total weight of the resin composition. The content of the monomer having one polymerizable unsaturated group per molecule in the resin compositions according to Examples 1 to 7 falls within the range of about 50% by weight to about 95% by weight, relative to the total weight of the resin composition.

[0197] Chemical Formula 1

[0198]

[0199] In Formula 1, R1 and R2 are each independently a substituted or unsubstituted alkylene group having 1 to 4 carbon atoms, R3 is a substituted or unsubstituted alkylene group having 1 to 3 carbon atoms, and subscripts n1 and n2 are each independently an integer selected from 1 to 6.

[0200] In Examples 1 to 7, urethane acrylate compounds A-1 to A-7 were used as urethane acrylate compounds containing the structure according to Formula 1 in the resin composition. Methods for synthesizing urethane acrylate compounds A-1 to A-7 are provided below.

[0201] In the examples, 4-HBA, THF-A, IBXA, IDAA, and / or FA-511 are used as monomers having one polymerizable unsaturated group per molecule. In the examples, Omnirad 819 and / or Omnirad 184 are used as photopolymerization initiators.

[0202] In Comparative Examples 1 to 3, urethane acrylate compounds that do not contain the structure according to Formula 1 were used.

[0203] In Comparative Examples 4 and 5, urethane acrylate compounds containing the structure according to Formula 1 were used, but the content of the structure according to Formula 1 in the urethane acrylate compound was less than about 20% by weight or greater than about 60% by weight relative to the total weight of the urethane acrylate compound (see Table 2).

[0204] In Comparative Examples 6 and 7, a urethane acrylate compound comprising the structure according to Formula 1 was used, but the content of the urethane acrylate compound relative to the total weight of the resin composition was less than about 5% by weight or greater than about 18% by weight.

[0205] Table 1

[0206]

[0207] The compounds used in Table 1 are listed below, and the amount of each component is expressed in grams (g). Additionally, the term "percentage by weight (wt%)" in Table 1 is calculated relative to the total weight of the resin composition, and the term "monomer content" refers to "the content of monomers having one polymerizable unsaturated group per molecule".

[0208] 4-HBA: 4-Hydroxybutyl acrylate (Osaka Organic Chemical Industry Ltd.)

[0209] THF-A: Tetrahydrofurfuryl acrylate (Kyoeisha Chemical Co., Ltd.)

[0210] IBXA: Isoborneol Acrylate (Osaka Organic Chemical Industry Ltd.)

[0211] IDAA: Isodecyl acrylate (Osaka Organic Chemical Industry Ltd.)

[0212] FA-511: Dicyclopentenyl acrylate (Resonac Corporation)

[0213] UV3300B: An ethyl carbamate acrylate compound with a weight-average molecular weight (Mw) of 13,000 g / mol (Mitsubishi Chemical Corporation).

[0214] Omnirad 819: Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (IGM Resin)

[0215] Omnirad 184: α-Hydroxyalkylphenyl ketone (IGM Resin)

[0216] In addition, the urethane acrylate compounds A-1 to A-9 used in Table 1 above are manufactured using the compounds in Table 2 below.

[0217] Among them, urethane acrylate compounds A-1 to A-7 refer to urethane acrylate compounds containing the structure according to Formula 1, and urethane acrylate compounds A-8 and A-9 refer to urethane acrylate compounds that do not contain the structure according to Formula 1.

[0218] The urethane acrylate compounds used in the resin compositions of Examples 1 to 7 correspond to compounds synthesized from reactants comprising: a first polyfunctional alcohol comprising a structure according to Formula 1; a second alcohol different from the first polyfunctional alcohol; a polyfunctional isocyanate compound; and a compound comprising at least one (meth)acrylate group and at least one hydroxyl group per molecule. A catalyst is used concurrently during the synthesis of the urethane acrylate compounds.

[0219] In this case, 2,2-bis(4-polyoxypropoxyphenyl)ethane and / or 2,2-bis(4-polyoxypropoxyphenyl)propane are used as the first polyfunctional alcohol comprising the structure according to Formula 1. Furthermore, 2,2-bis(hydroxymethyl)butyric acid is used alone as the second alcohol or in combination with ethanol. 1,3-bis(methyl isocyanate)cyclohexane is used as a polyfunctional isocyanate compound. 2-hydroxyethyl acrylate or PLACEL FA1DDM is used as a compound comprising at least one (meth)acrylate group and at least one hydroxyl group per molecule. Dibutyltin dilaurate is used as a catalyst.

[0220] In the urethane acrylate compound used in the resin compositions of Examples 1 to 7, the content of the structure according to Formula 1 is about 20% by weight to about 60% by weight relative to the total weight of the urethane acrylate compound.

[0221] (Method for synthesizing urethane acrylate compound A-1)

[0222] About 18.9 parts by weight of BA-2, about 20.7 parts by weight of BA-P2M, about 3.8 parts by weight of 2-hydroxyethyl acrylate and about 0.011 parts by weight of dibutyltin dilaurate were added to a flask equipped with a stir bar, a temperature sensor and a water-cooled condenser, and mixed with the stir bar to prepare a mixture, and then the mixture was heated to about 60°C.

[0223] Then, about 32.0 parts by weight of 1,3-bis(methyl isocyanate)cyclohexane were added to the mixture while carefully heating it to about 85°C to avoid overheating and maintaining it for about 2 hours.

[0224] Once it is confirmed that the isocyanate content is about 3.0% by weight or less relative to the total weight of the mixture, the temperature is lowered to about 70°C. Then, about 3.1 parts by weight of ethanol are added, and the temperature is raised to about 80°C. The mixture is then allowed to react until the isocyanate content reaches about 0.1% by weight relative to the total weight of the mixture containing ethanol. The mixture is then cooled, and urethane acrylate compound A-1 is obtained. Here, the term "isocyanate content" refers to the content of isocyanate groups present in the mixture, expressed as a weight percentage (wt%), and calculated by reacting the mixture with a dibutylamine solution and measuring the titration volume with a standard hydrochloric acid solution.

[0225] The obtained urethane acrylate compound has a weight-average molecular weight (Mw) of approximately 6100 g / mol. The same procedure is also applied below to prepare urethane acrylate compounds A-2 to A-9 by varying the components and contents in Table 2.

[0226] The synthesized urethane acrylate compounds A-1 to A-5 have a weight-average molecular weight Mw of about 3,000 g / mol to about 15,000 g / mol and a number-average molecular weight Mn of about 2,000 g / mol to about 7,000 g / mol.

[0227] In the urethane acrylate compounds A-1 to A-5 synthesized by the above method, the content of the structure represented by Formula 1 is about 20% to about 60% by weight relative to the total weight of the urethane acrylate compounds.

[0228] Conversely, in urethane acrylate compound A-6, the content of the structure according to Formula 1 is less than about 20% by weight relative to the total weight of the urethane acrylate compound. Furthermore, in urethane acrylate compound A-7, the content of the structure according to Formula 1 is greater than about 60% by weight relative to the total weight of the urethane acrylate compound.

[0229] The difference between urethane acrylate compound A-8 and urethane acrylate compounds A-1 to A-7 is that a first polyfunctional alcohol comprising the structure according to Formula 1 is not used in the synthesis of the urethane acrylate compound. Furthermore, the difference between urethane acrylate compound A-9 and urethane acrylate compounds A-1 to A-7 is that a first polyfunctional alcohol comprising the structure according to Formula 1 is not used in the synthesis of the urethane acrylate compound, and a monofunctional isocyanate compound is used instead of a polyfunctional isocyanate compound. In Table 2 below, AOI-VM are essentially monofunctional isocyanates; however, for ease of comparison and presentation, AOI-VM are listed under the entry corresponding to the polyfunctional isocyanate compound used in the synthesis.

[0230] Table 2

[0231]

[0232] In Table 2, the contents of the first polyfunctional alcohol and the second alcohol are calculated relative to the total weight of the reactants. Here, the term "total weight of reactants" refers to the sum of the amounts of compounds included in the reactants, each of which includes at least one first polyfunctional alcohol, at least one second alcohol, at least one polyfunctional isocyanate compound, and at least one compound comprising at least one (meth)acrylate group and at least one hydroxyl group per molecule. The compounds used in Table 2 are listed below, and the amount of each component is expressed in grams (g). Additionally, the weight percentages of the structures according to Formula 1 are calculated relative to the total weight of the urethane acrylate compounds.

[0233] BA-2: 2,2-bis(4-polyoxypropoxyphenyl)ethane (Nippon Nyukazai Co., Ltd.)

[0234] BA-P2M: 2,2-bis(4-polyoxypropoxyphenyl)propane (Nippon Nyukazai Co., Ltd.)

[0235] BA-P3U: 2,2-bis(4-polyoxypropoxyphenyl)propane (Nippon Nyukazai Co., Ltd)

[0236] BA-P8: 2,2-bis(4-polyoxypropoxyphenyl)propane (Nippon Nyukazai Co., Ltd); BA-10: 2,2-bis(4-polyoxypropoxyphenyl)propane (Nippon Nyukazai Co., Ltd).

[0237] Nipporan 4009: Polyester polyol (TOSOH Corporation)

[0238] SC-P1600: Polyglycerol polyether (Sakamoto Yakuhin Kogyo Co., Ltd.)

[0239] 1,3-Bis(methyl isocyanate)cyclohexane: (Mitsui Chemicals, Inc.)

[0240] Isophorone diisocyanate: (TCI CO., LTD.)

[0241] AOI-VM: Ethyl 2-isocyanate (Resonac Corporation)

[0242] Dibutyltin dilaurate: (TCI CO., LTD.)

[0243] 2-Hydroxyethyl acrylate: (TCI CO., LTD.)

[0244] PLACCEL FA1DDM: Caprolactone-modified acrylate (Daicel Corporation)

[0245] Table 3 below shows the viscosity of the resin composition before curing and the physical properties of the bonded components after curing. The methods used to evaluate each property are as follows.

[0246] Viscosity measurement

[0247] The viscosity of the resin compositions in the examples and comparative examples before curing was measured at approximately 25°C according to the JIS K2283 method.

[0248] Glass transition temperature and storage modulus measurement

[0249] Glass transition temperature and storage modulus were measured using samples obtained by curing the resin compositions of the examples and comparative examples.

[0250] On a glass slide (manufactured by Matsunami Glass Ind., Ltd., product name: glass slide S1112), a release-treated PET film (manufactured by PANAC Co., Ltd., product name: NP1000A) and a silicone rubber sheet (manufactured by Tigers Polymer Corporation) were sequentially laminated (with holes of approximately 8 mm diameter formed through the silicone rubber sheet). The resin compositions of the examples and comparative examples were each dropped into the holes of the silicone rubber sheet in an amount of approximately 28 μL. Using a UVLED lamp with peaks at approximately 365 nm and approximately 385 nm, the dropped resin compositions of the examples and comparative examples were irradiated with ultraviolet light, such that the cumulative light intensity provided to the dropped resin compositions of the examples and comparative examples reached approximately 1000 mJ / cm², respectively. 2 and approximately 520 mJ / cm 2 This process yields measurement samples with a diameter of approximately 8 mm and a thickness of approximately 500 μm. The glass transition temperature (Tg) and storage modulus at approximately 25°C of the cured measurement samples are measured using a dynamic viscoelastic analyzer (manufactured by Anton Paar Japan KK, product name: MCR302).

[0251] The glass transition temperature (Tg) and storage modulus were measured at a frequency of about 1 Hz and a heating rate of about 2 °C / min from about -30 °C to about 80 °C.

[0252] 180° peel strength measurement of bonded components

[0253] The resin composition was coated onto a piece of soda-lime glass (manufactured by Central Glass Co., Ltd.) with dimensions of approximately 26 mm × 76 mm using an inkjet printer to achieve a thickness of approximately 100 μm. Subsequently, the resin composition was irradiated with ultraviolet light using a UV-LED lamp with peaks at wavelengths of approximately 365 nm and 385 nm to achieve a thickness of approximately 1000 mJ / cm². 2 and approximately 520 mJ / cm 2 The cumulative light intensity was then measured. Subsequently, a PET film (manufactured by Toyobo Co., Ltd., product name: A4360, and thickness: approximately 50 μm) cut to approximately 20 mm × approximately 150 mm was bonded to soda-lime glass irradiated with ultraviolet light by applying a pressure of approximately 0.15 MPa, and a sample was obtained.

[0254] Using a universal testing machine (manufactured by Instron Corporation, product type: 5965), the 180° peel strength of the obtained samples was measured at temperatures of approximately 25°C and approximately 60°C, at a rate of approximately 300 mm per minute, resulting in a peel angle of approximately 180°. The 180° peel strength was measured three times, and the average peel value of approximately 50 mm was calculated. The obtained value was then multiplied by approximately 1.25 to evaluate the 180° peel strength.

[0255] Table 3

[0256]

[0257] Referring to Table 3, it can be confirmed that after curing, the resin compositions of Examples 1 to 7 have a 180° peel strength of about 2000 gf / 25 mm to about 5000 gf / 25 mm measured on a glass substrate at about 25°C, and a 180° peel strength of about 250 gf / 25 mm to about 1000 gf / 25 mm measured on a glass substrate at about 60°C. In contrast, after curing, all the resin compositions of Comparative Examples 1 to 7 have significantly lower 180° peel strengths when measured at about 25°C and about 60°C.

[0258] The resin compositions of Examples 1 to 7 have a viscosity of about 5 mPa·s to about 20 mPa·s as measured at 25°C before curing, and therefore exhibit excellent coatability.

[0259] The resin compositions of Examples 1 to 7 have a glass transition temperature Tg of about -20°C to about 20°C after curing, and therefore can appropriately achieve adhesive strength and durability. In contrast, in Comparative Example 3, the adhesive strength is significantly lower when the resin composition has a glass transition temperature Tg of less than about -20°C after curing.

[0260] Furthermore, the resin compositions of Examples 1 to 7, after curing, have a storage modulus of about 0.02 MPa to about 0.2 MPa, measured at about 25°C, and thus can appropriately achieve adhesive strength and elasticity. In contrast, Comparative Example 4 has a storage modulus greater than about 0.2 MPa after curing, and all adhesive strengths of both at room temperature and high temperature are significantly lower than those of Examples 1 to 7 at both room temperature and high temperature.

[0261] The resin composition according to the embodiments may have low viscosity before curing and increased adhesive strength after curing.

[0262] Adhesive components formed from the resin compositions according to the embodiments exhibit excellent adhesion reliability.

[0263] Electronic devices according to embodiments may include adhesive members formed from resin compositions according to embodiments, thereby exhibiting excellent adhesion reliability.

[0264] The resin composition according to the embodiments may have low viscosity before curing, allowing for short curing time, and exhibits high adhesive strength at room temperature and high adhesive strength at high temperature after curing.

[0265] The adhesive component according to the embodiments can demonstrate excellent adhesion reliability.

[0266] The electronic device according to the embodiments may include the adhesive member according to the embodiments, thereby exhibiting excellent adhesion reliability.

[0267] The embodiments of the present invention have been described above with reference to the present invention concept. However, it will be understood by those skilled in the art or those of ordinary skill in the art that various modifications and changes can be made to the present invention concept, as long as such modifications and changes do not depart from the spirit and technical scope of the present invention concept set forth in the claims.

[0268] Therefore, the technical scope of this invention is not limited to the details described in the specification, but should be determined by the claims.

Claims

1. A resin composition comprising: Contains urethane acrylate compounds with a structure according to Formula 1; Monomers with one polymerizable unsaturated group per molecule; and Photopolymerization initiator, The content of the urethane acrylate compound is from 5% to 18% by weight, based on the total weight of the resin composition; and Based on the total weight of the urethane acrylate compound, the content of the structure according to Formula 1 in the urethane acrylate compound is from 20% to 60% by weight. Chemical Formula 1 In chemical formula 1, R1 and R2 are each independently a substituted or unsubstituted alkylene group having 1 to 4 carbon atoms. R3 is a substituted or unsubstituted alkylene group having 1 to 3 carbon atoms, and Subscripts n1 and n2 are each independent integers selected from 1 to 6.

2. The resin composition according to claim 1, wherein the content is less than 2000 mJ / cm 2 After being photocured in air under ultraviolet cumulative light, the resin composition has a 180° peel strength of 2000 gf / 25 mm to 5000 gf / 25 mm as measured on a glass substrate at 25°C.

3. The resin composition according to claim 1, wherein the content is less than 2000 mJ / cm 2 After being photocured in air under ultraviolet cumulative light, the resin composition has a 180° peel strength of 250 gf / 25 mm to 1000 gf / 25 mm as measured on a glass substrate at 60°C.

4. The resin composition according to claim 1, wherein the urethane acrylate compound is synthesized from reactants comprising a first polyfunctional alcohol containing the structure according to Formula 1, a second alcohol different from the first polyfunctional alcohol, a polyfunctional isocyanate compound, and a compound comprising at least one (meth)acrylate group and at least one hydroxyl group per molecule.

5. The resin composition according to claim 4, wherein the second alcohol comprises 2,2-bis(hydroxymethyl)butyric acid.

6. The resin composition according to claim 4, wherein the polyfunctional isocyanate compound comprises 1,3-bis(methyl isocyanate)cyclohexane.

7. The resin composition according to claim 1, wherein the polymerizable unsaturated group of the monomer is an acrylate group.

8. The resin composition according to claim 1, wherein the monomer comprises at least one selected from 4-hydroxybutyl acrylate, tetrahydrofurfuryl acrylate, isobornyl acrylate, isodecyl acrylate, dicyclopentenyl acrylate, lauryl acrylate, 2-ethylhexyl acrylate, and 2-{2-[(2-ethylhexyl)oxy]ethoxy}ethyl acrylate.

9. The resin composition according to claim 1, wherein the content of the monomer is from 50% to 93% by weight based on the total weight of the resin composition.

10. The resin composition according to claim 1, wherein the urethane acrylate compound has a weight-average molecular weight Mw of 3,000 g to 15,000 g per mole.

11. The resin composition according to claim 1, wherein the photopolymerization initiator comprises at least one selected from bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, α-hydroxyalkylphenyl ketone, ethyl(2,4,6-trimethylbenzoyl)phenylphosphine ester and 1-hydroxycyclohexyl-phenyl ketone.

12. The resin composition of claim 1, wherein the resin composition is provided by inkjet printing or dispensing.

13. An adhesive component comprising a polymer derived from a resin composition according to any one of claims 1 to 12.

14. The adhesive member of claim 13, wherein the polymer has a 180° peel strength of 2000 gf / 25 mm to 5000 gf / 25 mm as measured on a glass substrate at 25°C.

15. The adhesive member of claim 13, wherein the polymer has a 180° peel strength of 250 gf / 25 mm to 1000 gf / 25 mm as measured on a glass substrate at 60°C.

16. An electronic device comprising: A display device that provides images; and An adhesive member included in the display device and comprising a polymer derived from a resin composition according to any one of claims 1 to 12, or comprising an adhesive member according to any one of claims 13 to 15.

17. The electronic device of claim 16, wherein the adhesive member has a 180° peel strength of 2000 gf / 25 mm to 5000 gf / 25 mm measured on a glass substrate at 25°C, and Peel strength at 180° on glass substrates ranging from 250 gf / 25 mm to 1000 gf / 25 mm, measured at 60°C.

18. The electronic device of claim 16, wherein the display device comprises a display module and a window, and The adhesive component is disposed between the display module and the window.

19. The electronic device of claim 18, wherein the window comprises a base layer and a printed layer disposed between the adhesive member and the base layer, and The resin composition provided on one surface of the display module or one surface of the window is cured by irradiation with light passing through the printed layer and forms the adhesive member.

20. The electronic device of claim 16, wherein the display device comprises a display module, a processor, a memory, and a power module.

Images