Position determination method, semiconductor manufacturing apparatus, position determination device, and computer storage medium

Abstract

The application discloses a position determination method of a support unit, a semiconductor preparation device, a position determination device and a computer storage medium, and relates to the technical field of semiconductor preparation. The method is applied to a target device, the target device is provided with a support unit, the support unit is composed of multiple support bodies, and the method comprises the following steps: determining one or more initial position combinations containing multiple initial positions of the support bodies, the initial position being a candidate installation point of the support body in a preset position range; determining a target distance between a first barycenter of a supported object corresponding to each initial position combination and a second barycenter of the support unit, and a target ratio of a second area of the support unit to a first area of the supported object; and determining a target position combination of the support unit in the initial position combination according to the target distance and the target ratio. The target position combination of the support unit is selected from the initial position combination according to the target distance and the target ratio, and the motion stability of the substrate and the film uniformity of the substrate are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor fabrication technology, and in particular to a method for determining the location of semiconductors, semiconductor fabrication equipment, a device for determining the location of semiconductors, and a computer storage medium. Background Technology

[0002] Physical vapor deposition (PVD) technology is a core coating process in modern microelectronics, optoelectronics, display panels, precision optics, and hard coatings. It can prepare high-performance thin films with specific compositions, structures, and thicknesses on complex substrates. In advanced semiconductor manufacturing processes, PVD technology is required to achieve high-uniformity, low-defect coating processes on mask blank substrates.

[0003] In PVD equipment, multi-layer coatings can be applied to mask blank substrates. The architecture of PVD equipment often consists of multiple chambers. To adapt to different requirements during the process, the mask blank substrate needs to undergo switching, transfer, and precise lifting and hovering movements. The stability of the substrate during movement—that is, its ability to maintain a preset trajectory and posture and resist unexpected deformation, micro-vibrations, and drift disturbances—affects the thickness uniformity of the final deposited film and the number of interface particle defects. Currently, in physical vapor deposition (PVD) equipment, the substrate support structure typically consists of multiple pins. However, if a four-pin structure is used to support the mask blank substrate, a single support point may become unstable due to pin leveling errors. If a three-pin structure is used, the support point on the substrate forms an isosceles triangle symmetrical structure under the boundary constraints of the robotic arm, resulting in insufficient anti-interference capability. Therefore, existing support structures generally cannot meet the high stability requirements of high-end processes for mask blank substrates, leading to poor film uniformity. Summary of the Invention

[0004] This application discloses a position determination method, semiconductor fabrication equipment, position determination device, and computer storage medium, used to determine the position layout scheme of support units in semiconductor fabrication equipment, so as to reduce the potential instability risk during the movement of the MASK BLANK substrate.

[0005] In a first aspect, this application provides a method for determining the position of a support unit, characterized in that it is applied to a target device, wherein the target device is provided with the support unit, and the support unit is composed of a plurality of support bodies; the method includes: determining one or more initial position combinations, each initial position combination including the initial positions of the plurality of support bodies within a preset position range; the preset position range being a position range in the target device used for setting the support bodies, and the initial positions being candidate installation points of the support bodies within the preset position range; determining a target distance and a target ratio corresponding to each initial position combination; the target distance being used to characterize the distance between a first center of gravity corresponding to a supported object and a second center of gravity corresponding to the support unit in the target device, and the target ratio being used to characterize the ratio between a second area corresponding to the support unit and a first area corresponding to the supported object; and determining a target position combination from the initial position combinations based on the target distance and the target ratio, the target position combination being used to set the support unit in the target device.

[0006] In this solution, for a support unit composed of multiple supports, a preset position range of the supports in the target device can be determined first, and multiple initial position combinations of the supports can be determined within this range. Then, a target position combination is selected from all initial position combinations by using a target distance (i.e., the distance between the first center of gravity of the supported object and the second center of gravity of the support unit) and a target ratio (i.e., the ratio between the second area of ​​the support unit and the first area of ​​the supported object). In this way, based on the above two quantifiable indicators, the target position combination of the support unit is determined from the initial position combinations. The resulting target position combination is used to arrange the support unit, which can take into account both the uniformity of force on the support unit and its stability, helping to reduce the risk of instability during the movement of the supported object, thereby improving the stability of the MASK BLANK substrate during movement and improving the film uniformity on the MASK BLANK substrate.

[0007] In one possible implementation, the first center of gravity is the projection point of the physical center of gravity of the supported object onto the first contact surface, and the first area is the area of ​​the first contact surface, which is the surface of the supported object that contacts the support unit. In this implementation, the first center of gravity is the projection point of the physical center of gravity of the supported object onto the first contact surface, and the first area is the total area of ​​the first contact surface between the supported object and the support unit. Using this as a benchmark for the target position combination determination process allows the mass distribution of the supported object to be converted into fixed parameters. This ensures that the position determination process conforms to the actual stress condition of the supported object, avoids unreasonable support unit positions, and guarantees the practicality of the target position combination in the target device.

[0008] In one possible implementation, the second centroid is the centroid of the target polygon, which is a polygon determined based on multiple contact points between the supported object and the support unit. The contact point is the highest point of the horizontal cross-section of the second contact surface, the second contact surface is the surface on the support body that contacts the supported object, and the second area is the area of ​​the target polygon. In this implementation, the second centroid is defined as the centroid of the target polygon formed by the contact points between multiple support bodies and the supported object, and the second area is the area of ​​the target polygon. Simultaneously, the contact point is determined as the highest point of the horizontal cross-section of the contact surface between the support body and the supported object. This allows for the characterization of the support structure, transforming the geometric layout of the support structure into corresponding centroid and area parameters. This ensures that the calculated parameters are consistent with the actual state of the equipment, avoiding deviations between theoretical calculations and engineering implementation, and helps evaluate the actual support effect at different support positions.

[0009] In one possible implementation, before determining one or more initial position combinations, the method further includes: determining the preset position range based on at least one target area on the first contact surface; wherein the target area is the projection area of ​​the control component on the first contact surface when the target device controls the movement of the supported object using its own control component. In this implementation, before determining the initial position combination, it is necessary to first determine the preset position range, that is, based on the projection area (target area) of the control component in the target device that controls the movement of the supported object on the first contact surface, to determine the preset position range that the support body can be set in. This can avoid the problem of only considering the static support effect without considering the interference of moving parts within the device, which could lead to the support body easily colliding with control components such as robotic arms and lifting mechanisms, and failing to adapt to the actual operating conditions of the device. By considering the interference risk of moving parts within the device in advance, the movement interference between the support body and the control component can be avoided, ensuring that the actual position of the support body meets the operating requirements of the device.

[0010] In one possible implementation, determining the preset position range based on at least one target area on the first contact surface includes: determining a first preset distance between the first center of gravity of the supported object in the target device and each of the supports; determining a target distance based on the center of the second contact surface and the first preset distance; constructing a first positioning condition; and determining the preset position range based on the first positioning condition and the target area; wherein the first positioning condition includes: the distance between the center of the second contact surface corresponding to the support and the first center of gravity is not less than the target distance. In this implementation, when determining the preset position range, a preset safety distance between the supported object and the support can be determined first, and the target distance can be determined in combination with the center of the contact surface of the support to construct the first positioning condition, that is, the distance between the center of the contact surface of any support and the first center of gravity is not less than the target distance. Finally, the preset position range of the support is determined by combining the first positioning condition with the target area corresponding to the control component. This avoids the problem of insufficient safety distance due to not considering the safety distance of the supported object, and ensures that the center of the support and the supported object maintains a sufficient safety distance, avoids the corresponding structural interference risk, and ensures that the actual position of the support meets the operating requirements of the device.

[0011] In one possible implementation, determining the preset position range based on at least one target area on the first contact surface includes: constructing a second positioning condition based on the target area, and determining the preset position range based on the second positioning condition; wherein, the second positioning condition is used to ensure that, when the center of the second contact surface corresponding to the support is located in a preset area, the vertical distance between the center of the second contact surface and any of the target areas is not less than a second preset spacing, the preset area being an interval region located between different target areas on the first contact surface, and the second preset spacing being the distance between the center of the second contact surface and any point on the edge of the second contact surface. In this implementation, the second positioning condition can be constructed based on the projected target area of ​​the control component. When the center of the contact surface of the support is located in a preset area between different target areas, the vertical distance between the center and any target area is not less than the second preset spacing. This further refines the preset position range, enabling refined edge obstacle avoidance constraints, ensuring that the support maintains a sufficient safe distance from the projected areas of all control components, guaranteeing interference-free operation of the equipment, and improving the safety and reliability of the support position determination.

[0012] In one possible implementation, determining the target position combination from the initial position combinations based on the target distance and the target ratio includes: determining the target position combination from the plurality of initial position combinations based on a third positioning condition; wherein the third positioning condition includes: among the plurality of initial position combinations, minimizing the distance between the first center of gravity and the second center of gravity corresponding to the target position combination, and maximizing the ratio between the second area corresponding to the target position combination and the first area. In this implementation, the target position combination can be screened from the initial position combinations based on the third positioning condition, which is to select the position combination that minimizes the distance between the first center of gravity and the second center of gravity and maximizes the ratio between the second area and the first area from all initial position combinations, as the final target support position. This can simultaneously take into account the uniformity of support force and the overturning resistance of the support structure, improve the stability of the supported object, avoid instability of the supported object in high-speed movement and high-precision manufacturing processes, ensure that the physical center of gravity of the supported object is highly coincident with the support center of gravity, the support force is most uniform, the support coverage is maximized, and the overturning resistance of the support structure is strongest.

[0013] In one possible implementation, determining the target position combination from the plurality of initial position combinations based on the third positioning condition includes: determining the target position combination from the plurality of initial position combinations based on the third positioning condition and using a genetic algorithm. In this implementation, the solution for the target position combination can be based on the third positioning condition, using a genetic algorithm to iteratively solve from the plurality of initial position combinations to finally determine the target position combination. By using the genetic algorithm under established multi-constraint conditions, the target position combination that optimizes the stability of the supported object can be determined efficiently and accurately, improving the efficiency and accuracy of the position determination process and adapting to the complex scenarios of semiconductor devices.

[0014] Secondly, this application provides a semiconductor fabrication apparatus, which includes a support unit composed of multiple supports for supporting a supported object; the semiconductor fabrication apparatus further includes: a memory for storing a computer program; and a processor for executing the computer program to implement the aforementioned method for determining the position of the support unit in the first aspect.

[0015] Thirdly, this application provides a position determination device, comprising a unit or module for implementing the position determination method of the support unit as described in the first aspect.

[0016] Thirdly, this application provides a computer-readable storage medium for storing a computer program, which, when executed by a processor, implements the aforementioned method for determining the location of the support unit in the first aspect.

[0017] Thirdly, this application provides a computer program product comprising a computer program that, when executed by a processor, implements the aforementioned method for determining the position of the support unit in the first aspect.

[0018] Based on the above technical solution, this application first determines one or more initial position combinations within a preset position range for setting up supports in the target device. Each initial position combination includes multiple initial positions of supports within the preset position range. It then determines the target distance between the first center of gravity of the supported object and the second center of gravity of the support unit in the target device corresponding to each initial position combination, as well as the target ratio between the second area of ​​the support unit and the first area of ​​the supported object. Based on the target distance and target ratio, a target position combination is determined within the initial position combination, and then the support unit is set up in the target device using the target position combination. Thus, for a support unit composed of multiple supports, a preset position range for the supports in the target device can be determined first. Within this range, one or more initial position combinations of supports can be determined, each initial position combination including candidate installation points for installing supports. Finally, the target position combination is selected from all initial position combinations using the target distance and target ratio. In this way, the target position combination for setting the support unit in the target device can be determined from multiple initial position combinations within a preset position range by using quantitative indicators. Furthermore, the target position combination can be screened by using the distance between the first center of gravity of the supported object and the second center of gravity of the support unit, and the ratio between the second area of ​​the support unit and the first area of ​​the supported object. This approach can take into account both the uniformity of force distribution and the stability of the support unit, helping to reduce the risk of instability during the movement of the supported object and further improving the stability of the MASK BLANK substrate. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram showing the position of a mask blank substrate in a PVD device, provided as an embodiment of this application; Figure 2 This is a schematic diagram of a PVD device using a support unit to support a supported object, provided in an embodiment of this application. Figure 3 A flowchart illustrating a method for determining the position of a support unit provided in an embodiment of this application; Figure 4This application provides a specific support structure layout diagram; Figure 5 A flowchart illustrating a specific method for determining the position of a support unit provided in this application embodiment; Figure 6 This is a schematic diagram of a support unit position determination device provided in an embodiment of this application; Figure 7 This is a structural diagram of a semiconductor fabrication apparatus provided in an embodiment of this application.

[0021] Explanation of reference numerals in the attached figures: 1-The object being supported; 2-Support unit; 21-Support. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0024] As used in this application, “multiple” means at least two, that is, two or more.

[0025] In PVD equipment, the mask board substrate (or simply "substrate") can be coated with multiple layers of film. The architecture of PVD equipment is often composed of multiple chambers. During the process, the mask board substrate needs to be switched, transferred, and subjected to precise lifting, hovering, and other movements to adapt to different requirements. Existing mask board substrate support structures occupy a large space and are prone to suspension and instability. They also have insufficient anti-interference capabilities and cannot meet the evolving requirements of high-end processes for controlling the stability of the mask board substrate. This application can determine the initial position combination within the preset position range of the support body in the target equipment, and then select the target position combination from all initial position combinations by using target distance and target ratio to set the support unit. This ensures the uniformity and stability of the force on the support unit and further improves the stability of the mask board substrate during movement.

[0026] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] This application can be applied to, for example Figure 1 In semiconductor fabrication equipment such as PVD equipment, a robotic arm within the equipment performs operations such as picking up, placing, lifting, and hovering the mask blank substrate. Specifically, as shown... Figure 2 As shown, the support for the supported object 1 is mainly achieved by using multiple support bodies 21 in the support unit 2. The supported object 1 is... Figure 2 The square mask board substrate is supported by three support bodies 21. Therefore, by determining the specific arrangement position of the support bodies 21 in the support unit 2, highly stable movement of the supported object 1 within the coating cavity is achieved, meeting the stringent requirements of high-end processes for film deposition precision. For example, the aforementioned mask board substrate is typically a high-purity quartz substrate that has not yet been patterned, used as the raw material for manufacturing masks, and can be applied to the patterning process in high-end semiconductor manufacturing. Furthermore, the method for determining the position of the support unit in this application can also be applied to other scenarios requiring highly stable motion support, such as precision optical component processing equipment, to determine the position of the support units supporting optical lenses, mirrors, and other components, ensuring stable component movement and preventing optical performance from being affected by positional deviations.

[0028] See Figure 3 As shown, this application discloses a method for determining the position of a support unit, applied to target equipment such as PVD equipment capable of coating a mask blank substrate. The target equipment includes the support unit, which is composed of multiple support bodies. Exemplarily, the method can be executed by a programmable logic controller. Specifically, the method for determining the position of the support unit includes: Step S11. Determine one or more initial position combinations, each initial position combination including the initial positions of the plurality of supports within a preset position range; the preset position range is the position range in the target device used to set the supports, and the initial position is a candidate installation point of the support within the preset position range.

[0029] In one embodiment, the support unit 2 is an assembly composed of multiple support bodies 21. For example, in this embodiment, the support body 21 of the MASK BLANK substrate can be a rigid metal pin. The top of the pin contacts the bottom surface of the MASK BLANK substrate, with the bottom surface of the MASK BLANK substrate serving as the contact surface and the top of the pin as the contact point. During movement, the pin supports the MASK BLANK substrate, and under the action of the motion mechanism, the MASK BLANK substrate moves up and down within the cavity to reach various preset heights. For example, a single pin has a diameter r = 8mm, a length L = 90mm, a top end face that is curved or flat, and a bottom fixedly connected to the lifting mechanism. Figure 4 As shown, the support unit 2 may include three cylindrical pins of the same specification: A, B, and C. It is understood that the core of this embodiment lies in determining the position of the support body 21 constituting the support unit 2. Any component capable of making contact with the supported object 1, having an adjustable position, and possessing sufficient support performance can serve as the support body in this embodiment. For example, in addition to the pins, a support body with a cylindrical metal rod as its main body and a hemispherical protrusion at the top can be selected. In this case, the contact point between the support body 21 and the MASK BLANK substrate is the apex of the hemispherical protrusion (i.e., the highest point of the horizontal cross-section); or, a support body with a frustum-shaped structure can be selected, in which case the contact point is the center of the top surface of the frustum; or, a metal column with a square cross-section can be selected, in which case the contact point is the center of the top surface of the square. Therefore, the specific number and shape of the support body 21 are not limited. The support function of the MASK BLANK substrate can be achieved by using at least two support bodies 21. For example, four or more support bodies 21 can be selected to constitute the support unit 2. Specifically, CAD (Computer-Aided Design) software can be used first to create a simplified model of the supported object 1 (MASK BLANK substrate) and the supporting unit 2, and a model can be created using the first contact surface of the MASK BLANK substrate as the reference plane. Figure 4The diagram shows a two-dimensional Cartesian coordinate system. The first contact surface is the bottom surface of the MASK BLANK substrate that contacts the pin. For example, this first contact surface can be a square with a side length D = 152 mm. The origin of the coordinate system coincides with the lower left corner vertex of the square, and the two sides of the square coincide with the X-axis and Y-axis of the two-dimensional Cartesian coordinate system, respectively. This completes the basic modeling of the support unit, allowing for the determination of the target position combination of the support unit from multiple initial position combinations. It can be understood that the support unit contains multiple support bodies, and correspondingly, the target position combination is composed of the target positions corresponding to each of the multiple support bodies. In one embodiment, a system is established as follows... Figure 4 The two-dimensional rectangular coordinate system shown in the figure Figure 4 The origin of the two-dimensional rectangular coordinate system coincides with the lower left corner vertex of the first contact surface. The X-axis extends horizontally to the right along the bottom edge of the first contact surface, and the Y-axis extends vertically upward along the left side of the first contact surface. The coordinates of the four vertices of the first contact surface are, in order, the lower left corner (0, 0), the lower right corner (D, 0), the upper right corner (D, D), and the upper left corner (0, D), where D is the side length of the first contact surface. The first centroid g of the MASK BLANK substrate coincides with the geometric center of the square, and its coordinates are (D / 2, D / 2). Figure 4 The rectangular shaded areas on the top and bottom sides are the projection areas (i.e. target areas) of the robot arm on the first contact surface. The contact points A, B, and C of the three supports and the substrate are all located in the XY plane where the first contact surface is located, and their coordinates are denoted as A(x1,y1), B(x2,y2), and C(x3,y3), respectively. The arrangement range of all supports must avoid the projection area of ​​the robot arm.

[0030] In one embodiment, a preset position range for the support body 21 can be determined. This preset position range is a set of all points where pins can be placed without affecting the operation of the device. For example, this range can be determined based on avoiding the movement areas of control components such as the lifting mechanism controlling the MASK BLANK substrate and the robotic arm for picking up and placing the MASK BLANK substrate within the device, ensuring that the pins do not interfere with other moving mechanisms during device operation. Then, within the defined preset position range, multiple initial position combinations of pins can be generated through random sampling. For example, when the support unit 2 includes three support bodies 21, each initial position combination contains the coordinate points corresponding to three pins, such as... Figure 4As shown, in the initial position combination, the initial positions of each support 21 are the first pin A(x1,y1), the second pin B(x2,y2), and the third pin C(x3,y3), respectively. All initial positions are within the preset position range. A candidate sample set is then constructed based on all determined initial position combinations. It can be understood that in the initial position combination, each support 21 is the first pin A(x1,y1), the second pin B(x2,y2), and the third pin C(x3,y3), and all initial positions are within the preset position range. A candidate sample set is then constructed based on all determined initial positions. The candidate sample set contains one or more initial position combinations, each consisting of the coordinate points corresponding to the three support 21s, i.e., each initial position combination is a set {A(x1,y1), B(x2,y2), C(x3,y3)}. Therefore, the candidate sample set is the complete set of all initial position combinations that satisfy the preset position range constraint. A genetic algorithm can be used to iteratively filter through this candidate sample set to determine the target position combination.

[0031] In this way, this embodiment can establish a standardized coordinate system model. By pre-determining the preset position range, when the support unit 2 is arranged in any initial position combination in the candidate sample set, it can avoid motion interference with other components when the substrate is controlled by the robot arm, which would affect the operation of the equipment. Furthermore, it can determine the target position combination corresponding to the support unit in multiple initial position combinations in the candidate sample set, so as to improve the stability of the substrate when the support unit is arranged in the target position combination.

[0032] Step S12. Determine the target distance and target ratio corresponding to each of the initial position combinations; the target distance is used to characterize the distance between the first center of gravity of the supported object in the target device and the second center of gravity of the support unit, and the target ratio is used to characterize the ratio between the second area of ​​the support unit and the first area of ​​the supported object.

[0033] like Figure 4 As shown, in this embodiment, the target distance K and target ratio corresponding to the triangle formed by A(x1,y1), B(x2,y2), and C(x3,y3) in the initial position combination can be determined. The target distance characterizes the distance between the first center of gravity g corresponding to the supported object 1 and the second center of gravity G corresponding to the support unit 2 in the target device. The target ratio characterizes the ratio between the second area corresponding to the supported unit 1 and the first area corresponding to the supported object 2. Specifically, the first center of gravity g is the projection point of the physical center of gravity of the supported object 1 on the first contact surface. For example, when the first contact surface between the supported object 1 and the support unit 2 is a square with side length D, the first area is the area D of the first contact surface. 2The first contact surface is the surface on the supported object 1 that contacts the support unit 2. Furthermore, when the support unit 2 is a triangular support structure composed of three support bodies 21, the second centroid G is the centroid of the target polygon, with coordinates ((x1+x2+x3) / 3, (y1+y2+y3) / 3), which is the intersection of the three medians of the target triangle; where the target polygon is based on multiple contact points between the supported object 1 and the support unit 2, such as... Figure 4 As shown, the polygon (triangle ABC) is defined by A, B, and C. When the second contact surface is an arc surface, the contact point is the highest point of the horizontal tangent of the second contact surface. The second contact surface is the surface on the support 21 that contacts the supported object 1 (e.g., Figure 4 The circles containing points A, B, and C (i.e., when support 21 is a cylindrical pin) have the same diameter (r=8mm) as the pin diameter, and the second area is the area of ​​the target polygon. It can be understood that the contact points A, B, and C represent the initial position combination of the support unit when support unit 2 includes three support bodies.

[0034] Therefore, in determining the support points for the highly stable movement of the MASK BLANK substrate in this embodiment, it is necessary to establish a quantitative index to measure the structural stability of the support unit 2 when supporting the substrate. This index is the distance between the physical center of gravity of the MASK BLANK substrate and the support center of gravity, and the area of ​​the polygon formed by the lines connecting the support points / the total area of ​​the region. For example, in this embodiment, the target position combination among multiple initial position combinations should satisfy the following: when arranging the support unit 2 based on the target position combination, the distance between the physical center of gravity of the MASK BLANK substrate and the support center of gravity is minimized, and the ratio of the area of ​​the polygon formed by the lines connecting the support points to the total area of ​​the region is maximized. This allows for the construction of a corresponding functional relationship. Again, assuming the support unit includes... Figure 4 Taking the three pins A, B, and C shown as an example, we can first determine the first center of gravity and the first area of ​​the supported object 1. For example, the supported object 1 is a MASKBLANK substrate and is a square structure of uniform material. Its physical center of gravity coincides with the geometric center of the square. Therefore, the coordinates of the first center of gravity in the rectangular coordinate system are g(D / 2, D / 2); the first area is the total area of ​​the first contact surface of the square, which is D² = 23104 mm². 2Then, for each initial position combination, the corresponding second centroid and second area are calculated. For the three pin coordinates A(x1,y1), B(x2,y2), and C(x3,y3) in each initial position combination, a target triangle ABC is constructed using the contact points between the three pins and the MASK BLANK substrate (e.g., the center of the pin's circular top surface) as vertices. Correspondingly, the second centroid is the geometric centroid of the target triangle ABC, and its coordinates are the average of the three vertex coordinates, i.e., ((x1+x2+x3) / 3, (y1+y2+y3) / 3). The second area is the area of ​​the target triangle ABC, specifically... Furthermore, the target distance to target ratio corresponding to each initial position combination is calculated, such as... Figure 4 As shown, the target distance K is the distance between the physical center of gravity of the MASK BLANK substrate and the supporting center of gravity, that is, the straight-line distance between the first center of gravity g(D / 2, D / 2) and the second center of gravity. The calculation formula is K = K is used to characterize the degree of overlap between the support center of gravity and the physical center of gravity of the MASK BLANK substrate. The smaller the value of K, the higher the degree of overlap between the first and second centers of gravity. The target ratio is the area of ​​the triangle formed by the lines connecting the support points divided by the total area of ​​the region, i.e., the ratio S of the second area to the first area, calculated by the formula S=[ ] / The value is used to characterize the coverage area of ​​the supporting triangle; the larger the value, the stronger the stability of the supporting structure. In this way, the stability of the MASK BLANK substrate support can be quantified using the above numerical indicators, and the stress uniformity and stability of the supporting structure can be ensured by determining the target distance to the target ratio. In another embodiment, the second area is the area of ​​the target triangle ABC, calculated using the following general coordinate area formula: Furthermore, it can be understood that taking the absolute value in the above formula ensures that the area is positive. This formula applies to cases where the three supports 21 are in any position, regardless of the distribution of the supports 21 at the edge of the substrate. Therefore, the target ratio S is the ratio of the second area to the first area D²: Furthermore, it should be noted that if the layout of the support 21 satisfies the following conditions... Figure 4 Given the specific distribution constraint shown, with A on top, B on the bottom, and C on the right, the above formula can be simplified to S=[ ] / For example, let D = 152 mm, A(10, 10), B(120, 10), and C(70, 100), and substitute them into the general coordinate area formula: =4950mm 2 The target ratio S = 4950 / 152 2≈0.2142. It should be noted that the above example is only used to illustrate the calculation method. The position combination determined based on the above coordinates A(10,10), B(120,10), C(70,100) is not the target position combination. The target distance to target ratio does not meet the optimization objective. The genetic algorithm will find the target position combination that minimizes K and maximizes S through iterative evolution.

[0035] Step S13. Determine a target position combination in the initial position combination based on the target distance and the target ratio, the target position combination being used to set the support unit in the target device.

[0036] In this embodiment, the support unit includes, for example, Figure 4 Taking the three pins A, B, and C shown as an example, in this scenario, to achieve the stability of the support, it is necessary to ensure that the center of gravity of the supported component is as close as possible to the center of gravity of the shape formed by the lines connecting the support points, and that the ratio of the area of ​​the triangle formed by the lines connecting the support points to the total area of ​​the region is as large as possible. Therefore, it is necessary to optimize the minimum value between the physical center of gravity of the MASK BLANK substrate and the center of gravity of the support, and to optimize the maximum value between the area of ​​the triangle formed by the lines connecting the support points and the total area of ​​the region. That is, to determine the target position combination among the initial position combinations that minimizes the target distance and maximizes the target ratio. Specifically, determining the target position based on the target distance and the target ratio includes: determining the target position combination among multiple initial position combinations based on a third positioning condition; wherein, the third positioning condition is that among multiple initial position combinations, the distance between the first center of gravity and the second center of gravity corresponding to the target position combination is the smallest, and the ratio between the second area and the first area corresponding to the target position combination is the largest.

[0037] Therefore, in this embodiment, a third positioning condition can be constructed as a screening criterion for target position combinations. For example, the third positioning condition may include: selecting, from all initial position combinations, the target position combination that minimizes the target distance K between the first and second centroids and maximizes the ratio S of the second area to the first area. This third positioning condition ensures that the supporting centroid is highly aligned with the physical centroid of the MASK BLANK substrate, resulting in uniform force distribution on the supported object and reducing the risk of instability; simultaneously, it maximizes the coverage area of ​​the supporting unit, maximizing the overturning resistance of the supporting structure.

[0038] In one implementation, a genetic algorithm can be used to iterate through all initial position combinations based on a third positioning condition. The genetic algorithm can optimize each initial position combination containing all support coordinates as an independent individual in the population. The specific process includes the following steps 131-134: Step 131: Initialize the population, including: taking each initial position combination containing all support coordinates as a single independent individual in the population, and taking all initial position combinations as the initial population of the genetic algorithm, setting algorithm parameters such as the number of iterations, crossover probability, and mutation probability; and it can be understood that in this embodiment, the selection, crossover, and mutation operations are all performed on a unit of initial position combination.

[0039] Step 132: Fitness Calculation. For each initial position combination in the initial population, calculate the fitness value based on the target distance K and the target ratio S. The fitness value is negatively correlated with the K value and positively correlated with the S value, and is used to characterize the support stability when each support is placed in the initial position of the initial position combination. For example, the fitness function can be defined as: ;in, This is the maximum value of the target distance K corresponding to all initial position combinations in the population, used to normalize K; and Let be the weighting coefficient, satisfying + =1, used to adjust the importance of the two optimization objectives, exemplarily taken as follows: =0.5, =0.5, meaning that both objectives are assigned the same weight. The higher the fitness value F, the stronger the stability of the support structure corresponding to this initial position combination.

[0040] Step 133, selection operation, including: selecting initial position combination with high fitness value from the initial population as parent generation; crossover and mutation operation, performing coordinate crossover and random mutation on the determined parent generation position to generate new offspring position, and all newly generated offspring position is constrained within the preset position range.

[0041] Step 134, convergence judgment, includes: repeating the above fitness calculation, selection, crossover, and mutation processes until the preset maximum number of iterations is reached, or until the fitness value tends to stabilize. At this point, the position combination with the highest fitness value in the population is the target position combination that satisfies the third positioning condition. For example, the maximum number of iterations can be set to 500; fitness value tends to stabilize, meaning the change in the optimal fitness value of the population within a preset number of consecutive generations is lower than a preset threshold, for example, if the change in the optimal fitness value within 50 consecutive iterations is less than 10... -6 If convergence is achieved, the iteration is considered complete. The iteration terminates when the preset maximum number of iterations is reached, or when the fitness value stabilizes. The combination of positions with the highest fitness value in the population at this point is output as the target position combination. The final target position combination can then be output, including the coordinates of the target positions corresponding to each support 21.

[0042] For example, when there are three supports 21, the coordinates of each support 21 are A(x1,y1), B(x2,y2), and C(x3,y3), respectively, satisfying the conditions of minimizing the distance between the first and second centroids and maximizing the ratio of the second area to the first area. Then, the three pins can be installed and adjusted to the points corresponding to the target positions, thereby achieving stable lifting and hovering of the MASK BLANK substrate within the PVD equipment cavity through the support structure constructed by multiple supports. By constructing a third positioning condition through the synergistic optimization of the target ratio and target distance, the support stability of the target position combination is optimized among all initial positions. Furthermore, a genetic algorithm can be used to accurately select the target position combination under complex constraints, significantly improving efficiency and accuracy.

[0043] Therefore, in this embodiment, multiple initial position combinations corresponding to the three pins can be generated by combining uniform sampling and random sampling, ensuring that the initial position combinations uniformly cover the entire preset position range. Furthermore, for each initial position combination, the corresponding target distance K and target ratio S are calculated to establish an objective function, with minimizing K and maximizing S as the optimization objectives. Then, the Genetic Algorithm is applied iteratively within the preset position range, and through multiple generations of evolutionary selection, the minimum value between the centroid of the PIN support point and the centroid of the MASK BLANK substrate is determined. The maximum value of the area of ​​the triangle formed by connecting the support points to the total area of ​​the region. The system obtains the corresponding pin placement points, which are the optimal placement points under the current conditions. The target position combination can then be output to the equipment's control system, which drives the pins to adjust to the coordinate points corresponding to the target positions, thus completing the layout of the support unit.

[0044] Through the above technical solution, from multiple initial position combinations within a preset position range, the target position combination for setting the support unit in the target device can be determined by the distance between the first center of gravity of the supported object and the second center of gravity of the support unit, and the ratio between the second area of ​​the support unit and the first area of ​​the supported object. Then, a support body is arranged at each target position in the target position combination. In the process of device operation, the support unit enables the MASK BLANK substrate to be accurately lifted and stably suspended in the coating chamber, ensuring the positional accuracy and stability of the MASK BLANK substrate during the coating process, and ultimately improving the film deposition accuracy and film thickness uniformity.

[0045] Based on the above embodiments, it can be seen that for a support unit 2 composed of multiple support bodies 21, the initial position combination of the support unit 2 in the target device can be determined first, and the target position combination can be selected from multiple initial position combinations for the arrangement of the support unit 2. In order to further explain the specific process of defining the initial position, this embodiment will elaborate on the process of determining the preset position range. For example Figure 5 As shown, this embodiment provides a specific method for determining the position of a support unit, including: Step S21. Determine a preset location range based on at least one target area.

[0046] In this embodiment, before executing step S11 to determine multiple initial position combinations within a preset position range, the preset position range can be determined based on at least one target area on the first contact surface. The target area is the projection area of ​​the control component on the first contact surface when the target device uses its own control component to control the movement of the supported object. This control component includes, but is not limited to, a robotic arm within the device for picking up and placing the MASK BLANK substrate, and a power mechanism for driving the MASK BLANK substrate to rise and fall. For example, the target area is the projection area on the first contact surface when the robotic arm and the lifting power mechanism in the target device move, such as... Figure 4 As shown, when the robotic arm and lifting mechanism control the movement of the substrate, they may pass through the robotic arm area below the substrate. In this case, the projected area of ​​the robotic arm area below the substrate is two rectangular regions. For example, the two robotic arm areas are the same size, and their length is equal to the side length of the substrate. That is, the length of the robotic arm area is a = D = 152 mm, and the width is b = 24.8 mm - 14 mm = 10.8 mm. The 14 mm is a safety distance reserved for the control components.

[0047] In one embodiment, determining a preset position range based on at least one target area on the first contact surface includes: determining a first preset distance between the first center of gravity of the supported object in the target device and each support body, determining a target distance based on the center of the second contact surface and the first preset distance, then constructing a first positioning condition based on the target distance, and determining the preset position range based on the first positioning condition and the target area; wherein, the first positioning condition includes: the distance between the center of the second contact surface corresponding to the support body and the first center of gravity is not less than the target distance.

[0048] In one embodiment, determining the preset position range based on at least one target area on the first contact surface includes: constructing a second positioning condition based on the target area, and determining the preset position range based on the second positioning condition; wherein, the second positioning condition is used to ensure that, when the center of the second contact surface corresponding to the support is located in the preset area, the vertical distance between the center of the second contact surface and any target area is not less than a second preset spacing, and the preset area is the interval area between different target areas on the first contact surface, and the second preset spacing is the distance between the center of the second contact surface and any point on the edge of the second contact surface. It should be noted that the preset area in this embodiment is... Figure 4 The area shown is the middle region between the two robotic arm regions. Therefore, when the center of the second contact surface is located in the preset region, there can be a certain distance between the center of the second contact surface and the robotic arm region to avoid the robotic arm touching the support during movement. Furthermore, it can be understood that when constructing the second positioning condition and determining the preset position range based on the second positioning condition in this embodiment, the preset position range can be determined directly by combining the second positioning condition and at least one target region on the first contact surface; alternatively, the preset position range can be determined by combining the first positioning condition and the second positioning condition based on the target region.

[0049] It is understood that the above steps are performed before determining multiple initial position combinations within the preset position range, so that corresponding constraints can be constructed based on the device's spatial obstacle avoidance requirements and boundary limitations, in order to determine the deployable range of the support body, i.e., the aforementioned preset position range.

[0050] Specifically, the target area on the first contact surface of the target device can be determined first. For example, the movement path of the robotic arm and the installation position of the lifting mechanism within the device can be collected. The projection area of ​​these components on the first contact surface of the MASK BLANK substrate is then marked as the target area to ensure that the pin does not interfere with the control components. It is understood that multiple target areas can be determined based on different conditions in this embodiment. For example, based on the different types and movement ranges of control components within the device, the movement path, installation position, and action boundary of each robotic arm, lifting mechanism, and other control component can be collected. The projection area of ​​each control component on the first contact surface of the MASK BLANK substrate is then marked as an independent target area. For example, the movement path of the robotic arm that picks up and places the substrate, the installation position of the power mechanism that drives the substrate lifting, and the installation area of ​​the sensors inside the cavity can be collected to generate multiple non-overlapping target areas. Each target area corresponds to the movement or installation space of a control component to ensure that the pin does not interfere with any of the control components.

[0051] In one embodiment, the first positioning condition can be constructed as follows: First, a first preset distance between the MASK BLANK substrate and each pin is determined. This first preset distance can be a safe clearance distance d between the pin and the center of the MASK BLANK substrate. Then, a target radius r of the second contact surface between the pin and the MASK BLANK is determined, i.e., the radius of the pin itself. The sum of r and d (r+d) is used as the target distance, i.e., the target distance is the minimum safe distance between the center of the second contact surface and the first center of gravity corresponding to the supported object. Then, the first positioning condition is constructed based on the target distance. The first positioning condition is that the distance between the center of the second contact surface corresponding to any pin and the first center of gravity is not less than the target distance (r+d). For example, as shown... Figure 4 As shown: For the first pin A(x1,y1): ; For the second pin B(x2,y2): ; For the third pin C(x3,y3): ; The first positioning condition ensures that all pins maintain a sufficient safe distance from the center of the MASK BLANK substrate, avoiding the risk of structural interference in the central area.

[0052] In one implementation, the second positioning condition can be constructed as follows: First, determine the reserved safety distance h of the robot arm, and combine it with the pin radius r to construct the second positioning condition. The second positioning condition is that if the center of the second contact surface of any pin is located in a preset area between different target areas, the vertical distance between the center of the circle and any target area is not less than the target radius r of the pin; that is, r + h ≤ y3 ≤ , ≤y3≤Drh. The second positioning condition ensures a sufficient safe distance between the pin and the projected area of ​​the robot arm, preventing collision during robot arm movement. In one specific implementation, all coordinate points satisfying the first positioning condition can be determined; and / or, all coordinate points satisfying the second positioning condition; or all coordinate points satisfying both positioning conditions simultaneously. Further, all obtained coordinate points can be defined as a preset position range for the pin, i.e., the coordinates of all points satisfying the positioning conditions (…). , ) N, where N is the set of all points under this positioning condition. The above positioning conditions ensure that the determined combination of target positions meets the actual engineering constraints, avoids moving parts such as robotic arms, and meets the interference-free operation requirements of the pin insertion under all operating conditions of the equipment.

[0053] In this embodiment, considering that the actual placement of the support 21 is limited because the lifting and lowering of the MASK BLANK substrate relies on a motion mechanism for support and lifting, the selection of PIN positions must also avoid the motion mechanisms at the bottom and top of the MASK BLANK substrate, such as the lifting power mechanism and the robotic arm for picking up and placing the substrate, to prevent motion interference between the PIN and surrounding motion mechanisms during equipment operation. Therefore, it is necessary to add a reasonable safety distance to the positioning conditions and search for all possible PIN positions that meet the above positioning conditions. Specifically, by converting all interference risks in the actual operation of the equipment into corresponding positioning conditions, the preset position range is accurately determined to ensure that all possible placement points meet the equipment operation requirements, adapt to the structural layout of different equipment, and help shorten the design cycle of the support structure.

[0054] Step S22. Determine multiple initial position combinations within the preset position range, so as to determine the target position combination among the multiple initial position combinations using the support unit position determination method in steps S11 to S13 of the previous embodiment.

[0055] In this embodiment, within the preset position range determined in the above steps, the target position combination of the support units in the target device can be determined by the distance between the first center of gravity of the supported object and the second center of gravity of the support unit, and the ratio between the second area of ​​the support unit and the first area of ​​the supported object. The support units are then arranged in the target position combination. Thus, during the operation of the device, the support structure enables the MASK BLANK substrate to be accurately lifted and stably suspended in the coating cavity, ensuring the positional accuracy and stability of the MASK BLANK substrate during the coating process, and ultimately improving the film deposition accuracy and film thickness uniformity.

[0056] It is understood that, in another embodiment, in addition to the above-mentioned implementation with three supports, the number of supports can be adjusted according to the supported object. For example, the support unit 2 can be composed of four supports 21. The supported object 1 is a square MASK BLANK substrate with a side length D=152mm. The support 21 is a square prism stainless steel pin with a cross-sectional size of 10mm×10mm and a square plane at the top, with the center of the square top surface serving as the contact point. In this embodiment, a two-dimensional rectangular coordinate system can be established with the lower left corner of the MASK BLANK substrate as the origin. Then, based on the projection area of ​​the robot and lifting mechanism inside the device, combined with the avoidance distance d and the robot's reserved distance h, the first and second positioning conditions are constructed to define the preset position range of the four pins. Multiple initial position combinations are generated within the preset position range. Each initial position combination includes the coordinates of the four pins A(x1,y1), B(x2,y2), C(x3,y3), and D(x4,y4), which are distributed on the four sides of the square, respectively. Then, for each initial position combination, a quadrilateral target polygon ABCD is constructed. Its geometric centroid and area are calculated to obtain the target distance K and the target ratio S. Then, based on the third positioning condition (K is minimized and S is maximized), a genetic algorithm is used iteratively to obtain the target positions of the four pins, achieving highly stable support for the substrate. For example, when calculating the area of ​​the polygon, similar to the case where three support bodies 21 form a triangular target polygon, when the support unit 2 is composed of four or more support bodies 21, the target polygon is a quadrilateral, pentagon, etc., and its second area is also calculated using the corresponding coordinate area formula. For example: , where n is the number of vertices of the polygon, and the coordinates of the vertices are arranged in order (clockwise or counterclockwise), and ( and( The same, meaning the polygon is closed at both ends. In one embodiment, when the support unit 2 contains four pins A(x1,y1), B(x2,y2), C(x3,y3), and D(x4,y4), after arranging them in vertex order, the area of ​​quadrilateral ABCD is: It should be noted that the coordinates of each vertex in the target polygon are arranged according to the actual outline order of the polygon (clockwise or counterclockwise). It can be understood that in this embodiment, a layout of 5 supports can also be used, with 1 support located near the center and 4 supports evenly distributed around the perimeter. The target polygon is a pentagon; only the coordinates need to be expanded to 5, and the remaining steps are completely consistent with the aforementioned embodiment.

[0057] like Figure 6As shown, this embodiment provides a support unit position determination device applied to a target device. The target device includes the support unit, which is composed of multiple support bodies. It can be understood that this device is used to execute the support unit position determination method described in any of the above embodiments. Its technical principle and the achieved technical effect are consistent with the above method embodiments. For details and technical effects not described in detail in the device embodiments, please refer to the corresponding parts in the foregoing method embodiments, and will not be repeated here. The support unit position determination device includes: The position determination module 11 is used to determine one or more initial position combinations, each initial position combination including the initial positions of the plurality of supports within a preset position range; the preset position range is the position range in the target device used to set the supports, and the initial position is a candidate installation point of the support within the preset position range; The parameter determination module 12 is used to determine the target distance and target ratio corresponding to each of the initial position combinations; the target distance is used to characterize the distance between the first center of gravity of the supported object in the target device and the second center of gravity of the support unit, and the target ratio is used to characterize the ratio between the second area of ​​the support unit and the first area of ​​the supported object; The location filtering module 13 is used to determine a target location combination in the initial location combination based on the target distance and the target ratio, and the target location combination is used to set the support unit in the target device.

[0058] In one embodiment, the first center of gravity is the projection point of the physical center of gravity of the supported object onto the first contact surface, the first area is the area of ​​the first contact surface, and the first contact surface is the surface on the supported object that contacts the support unit.

[0059] In one embodiment, the second centroid is the centroid of the target polygon, which is a polygon determined based on multiple contact points between the supported object and the support unit. The contact point is the highest point of the horizontal cross-section of the second contact surface. The second contact surface is the surface on the support body that contacts the supported object. The second area is the area of ​​the target polygon.

[0060] In one embodiment, the position determination module 11 is further configured to determine the preset position range based on at least one target area on the first contact surface; wherein the target area is the projection area of ​​the control component on the first contact surface when the target device controls the movement of the supported object using its own control component.

[0061] For example, the position determination module 11 is specifically used to determine the first preset distance between the first center of gravity of the supported object in the target device and each of the supports; determine the target distance based on the center of the second contact surface and the first preset distance; construct a first positioning condition, and determine the preset position range based on the first positioning condition and the target area; wherein, the first positioning condition includes: the distance between the center of the second contact surface corresponding to the support and the first center of gravity is not less than the target distance.

[0062] For example, the position determination module 11 is specifically used to construct a second positioning condition based on the target area, and to determine the preset position range based on the second positioning condition; wherein, the second positioning condition is used to ensure that when the center of the second contact surface corresponding to the support is located in the preset area, the vertical distance between the center of the second contact surface and any of the target areas is not less than a second preset spacing, the preset area is the interval area between different target areas on the first contact surface, and the second preset spacing is the distance between the center of the second contact surface and any point on the edge of the second contact surface.

[0063] In one embodiment, the location filtering module 13 is specifically used to determine the target location combination among the plurality of initial location combinations based on a third positioning condition; wherein, the third positioning condition includes: among the plurality of initial location combinations, minimizing the distance between the first centroid and the second centroid corresponding to the target location combination, and maximizing the ratio between the second area corresponding to the target location combination and the first area.

[0064] For example, the location filtering module 13 is specifically used to determine the target location combination from a plurality of initial location combinations based on the third positioning condition and using a genetic algorithm.

[0065] Figure 7 This is a schematic structural diagram of the semiconductor fabrication apparatus provided in this application. The apparatus 20 includes a support unit, which is composed of multiple support bodies and is used to support the supported object. The semiconductor fabrication apparatus 20 also includes a processor 21, which is coupled to a memory 22. The memory 22 is used to store computer programs or instructions and / or data. The processor 21 is used to execute the computer programs or instructions stored in the memory 22, or to read the data stored in the memory 22, to execute the methods in the above-described method embodiments.

[0066] Optionally, there may be one or more processors 21.

[0067] Optionally, the memory 22 may be one or more.

[0068] Alternatively, the memory 22 can be integrated with the processor 21, or it can be set separately.

[0069] In addition, this application also provides a computer-readable storage medium storing computer instructions that, when executed on a computer, cause the methods in the various method embodiments of this application to be performed.

[0070] This application also provides a computer program product, which includes computer program code or instructions, such that when the computer program code or instructions are run on a computer, the methods in the various method embodiments of this application are executed.

[0071] Furthermore, this application also provides a chip including a processor, and a memory for storing a computer program is provided independently of the chip. The processor is used to execute the computer program stored in the memory so that the methods in the various method embodiments of this application are executed.

[0072] Furthermore, the chip may also include a communication interface. The communication interface may be an input / output interface or an interface circuit, etc. Furthermore, the chip may also include a memory.

[0073] It should be understood that the processor in the embodiments of this application can be an integrated circuit chip with the ability to process signals. In implementation, each step of the above method embodiments can be completed by the integrated logic circuits in the processor's hardware or by instructions in software form. The processor can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in the embodiments of this application can be directly implemented by a hardware encoding processor, or implemented by a combination of hardware and software modules in the encoding processor. The software modules can be located in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. The storage medium is located in memory, and the processor reads the information in the memory and, in conjunction with its hardware, completes the steps of the above method.

[0074] The memory in the embodiments of this application can be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), which serves as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), and synchronous link dynamic memory (SLDRAM).

[0075] It should be noted that when the processor is a general-purpose processor, DSP, ASIC, FPGA, or other programmable logic device, discrete gate or transistor logic device, or discrete hardware component, the memory can be integrated into the processor.

[0076] It should also be noted that the memory described herein is intended to include, but is not limited to, these and any other suitable types of memory.

Claims

1. A method for determining the position of a support unit, characterized in that, The method is applied to a target device, wherein the target device is provided with the support unit, and the support unit is composed of multiple support bodies; the method includes: One or more initial position combinations are determined, each initial position combination including the initial positions of the plurality of supports within a preset position range; the preset position range is the position range in the target device used to set the supports, and the initial positions are candidate installation points of the supports within the preset position range; Determine the target distance and target ratio corresponding to each of the initial position combinations; the target distance is used to characterize the distance between the first center of gravity of the supported object in the target device and the second center of gravity of the support unit, and the target ratio is used to characterize the ratio between the second area of ​​the support unit and the first area of ​​the supported object; Based on the target distance and the target ratio, a target position combination is determined from the initial position combination, and the target position combination is used to set the support unit in the target device.

2. The method for determining the position of the support unit according to claim 1, characterized in that, The first center of gravity is the projection point of the physical center of gravity of the supported object onto the first contact surface, the first area is the area of ​​the first contact surface, and the first contact surface is the surface on the supported object that contacts the supporting unit.

3. The method for determining the position of the support unit according to claim 2, characterized in that, The second centroid is the centroid of the target polygon, which is a polygon determined based on multiple contact points between the supported object and the support unit. The contact point is the highest point of the horizontal cross-section of the second contact surface. The second contact surface is the surface on the support body that contacts the supported object. The second area is the area of ​​the target polygon.

4. The method for determining the position of the support unit according to claim 3, characterized in that, Before determining one or more initial position combinations, the method further includes: The preset position range is determined based on at least one target area on the first contact surface; The target area is the projection area of ​​the control component on the first contact surface when the target device controls the movement of the supported object using its own control component.

5. The method for determining the position of the support unit according to claim 4, characterized in that, Determining the preset position range based on at least one target area on the first contact surface includes: Determine the first preset distance between the first center of gravity of the supported object in the target device and each of the supporting bodies; The target spacing is determined based on the center of the second contact surface and the first preset spacing. Construct a first positioning condition, and determine the preset location range based on the first positioning condition and the target area; The first positioning condition includes: the distance between the center of the second contact surface corresponding to the support and the first center of gravity is not less than the target spacing.

6. The method for determining the position of the support unit according to claim 4 or 5, characterized in that, Determining the preset position range based on at least one target area on the first contact surface includes: A second positioning condition is constructed based on the target area, and the preset location range is determined based on the second positioning condition; The second positioning condition is used to ensure that when the center of the second contact surface corresponding to the support is located in a preset area, the vertical distance between the center of the second contact surface and any of the target areas is not less than a second preset distance. The preset area is the interval area between different target areas on the first contact surface, and the second preset distance is the distance between the center of the second contact surface and any point on the edge of the second contact surface.

7. The method for determining the position of a support unit according to any one of claims 1 to 6, characterized in that, The step of determining the target position combination in the initial position combination based on the target distance and the target ratio includes: The target position combination is determined from the plurality of initial position combinations based on the third positioning condition; The third positioning condition includes: among the multiple initial position combinations, minimizing the distance between the first centroid and the second centroid corresponding to the target position combination, and maximizing the ratio between the second area corresponding to the target position combination and the first area.

8. The method for determining the position of the support unit according to claim 7, characterized in that, Determining the target position combination from the plurality of initial position combinations based on the third positioning condition includes: Based on the third positioning condition and using a genetic algorithm, the target position combination is determined from multiple initial position combinations.

9. A semiconductor fabrication apparatus, characterized in that, The semiconductor fabrication equipment includes a support unit, which is composed of multiple support bodies and is used to support the supported object. The semiconductor fabrication equipment further includes: Memory, used to store computer programs; A processor for executing the computer program to implement the method for determining the position of the support unit as described in any one of claims 1 to 8.

10. A position determination device comprising a unit or module for implementing the position determination method of a support unit as described in any one of claims 1 to 8.

11. A computer-readable storage medium, characterized in that, Used to store a computer program, which, when executed by a processor, implements the method for determining the position of the support unit as described in any one of claims 1 to 8.

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