Sealing system for a reactor system

Abstract

A reactor can include a reaction chamber volume enclosed within a reaction chamber; a susceptor configured to translate up and down within the reaction chamber; a reaction space within the reaction chamber volume above the susceptor and a lower chamber space within the reaction chamber volume below the susceptor; and / or a sealing system to substantially fluidly separate the reaction space and the lower chamber space. The sealing system can include a partition plate surrounding the susceptor; and / or a sealing device coupled to and / or engaged with the susceptor and the partition plate, wherein the sealing device includes a base ring coupled to the susceptor and a spring coupled to the base ring. The spring can have a spring bias to facilitate creating a substantial seal between the partition plate and the susceptor such that the reaction space and the lower chamber space are substantially fluidly separated when the susceptor translates within the reaction chamber.

Description

Technical Field

[0001] This disclosure generally relates to semiconductor processing or reactor systems, and more particularly to reactor systems and components included therein, which allow for sealing between an upper and lower volume within a reaction chamber. Background Technology

[0002] Reaction chambers can be used for a variety of processes during the fabrication of electronic devices. For example, reaction chambers can be used to deposit various material layers onto semiconductor substrates, etch materials, and / or clean surfaces. The substrate can be placed on a pedestal within the reaction chamber. Both the substrate and the pedestal can be heated to a desired substrate temperature setpoint. In an example process, one or more reactant gases can pass through the heated substrate, causing a thin film of material to be deposited on the substrate surface.

[0003] A reaction chamber may comprise, for example, two spaces or volumes separated by a base. Processing may take place in the reaction space or chamber (e.g., an upper chamber positioned vertically above a lower chamber) within the two chambers. During operation of a reactor system comprising two chambers separated by a base, contaminants may undesirably transfer from the reaction space to the other chamber (e.g., from the upper chamber to the lower chamber) and vice versa. Therefore, systems and methods may be needed to provide a seal between the two volumes within the reaction chamber (e.g., to at least partially fluidly separate the two chambers).

[0004] Any discussion of problems and solutions is included in this disclosure for the purpose of providing context for this disclosure only, and should not be construed as an admission that any or all of the discussions were known at the time this disclosure was made. Summary of the Invention

[0005] This synopsis is provided to introduce some concepts in a simplified form. These concepts are further described in detail in the following detailed description of exemplary embodiments of this disclosure. This synopsis is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0006] In some examples, a reactor system is provided. The reactor systems disclosed herein can facilitate at least a partial seal (e.g., a substantial seal) between two chambers or volumes within the reactor system's reaction chamber.

[0007] In various examples, a reactor may include a reaction chamber volume enclosed within a reaction chamber; a base configured to translate vertically along an axis within the reaction chamber; a reaction space located above the base within the reaction chamber volume; a lower chamber space located below the base within the reaction chamber volume; and / or a sealing system for substantially fluidly separating the reaction space and the lower chamber space. The sealing system may include a partition plate surrounding the base; and / or a sealing device coupled to and / or engaging with the base and partition plate, wherein the sealing device includes a base ring coupled to the base and a spring coupled to the base ring. The spring may have a bias toward a compressed or extended position, such that the spring bias facilitates the formation of a substantial seal between the partition plate and the base, thereby substantially fluidly separating the reaction space and the lower chamber space as the base moves vertically within the reaction chamber.

[0008] In various examples, the sealing system may also include a flow control ring disposed around the base and between the base and the partition plate. A sealing device may be disposed between the flow control ring and the partition plate, such that the sealing device is coupled to the base via the flow control ring. A basic seal between the partition plate and the base can be facilitated by spring biasing between the flow control ring and the partition plate. The sealing device may be disposed between the upper-facing surface of the flow control ring and the lower-facing surface of the partition plate. The spring may be biased toward an extended position such that a downward force from the spring is applied to the flow control ring, thereby generating a downward force on the base, resulting in a basic seal between the flow control ring and the base, thereby creating a basic fluid separation between the reaction space and the lower chamber space. The spring may be fixedly coupled to the base ring. The sealing device may surround the base, wherein the spring includes a plurality of accordion-like plates, including a first accordion-like plate and an end accordion-like plate, and wherein each accordion-like plate spans between the flow control ring and the partition plate.

[0009] The base ring may include a base inner diameter closest to the base, wherein the spring includes a spring inner diameter closest to the base, and the base inner diameter may be closer to the base than the spring inner diameter. The base ring may include a bottom surface abutting an upper surface of the flow control ring and a radially inward surface abutting an outer surface of the flow control ring, wherein the base ring may also include a chamfered surface spanning between the bottom surface and the radially inward surface of the base ring. The flow control ring may also include an annular chamfered surface spanning between the upper surface and the outer surface, which may be complementary to the chamfered surface of the base ring. The base ring may include a top surface and a connecting protrusion projecting upward from the top surface, wherein a first accordion-type plate in the accordion-type plates is coupled to the connecting protrusion. The first accordion-type plate may include a flat end surface coupled to the connecting protrusion. The base ring may include a base inner diameter closest to the base, wherein the connecting protrusion is disposed close to the base inner diameter. The end accordion-type plates may be coupled to and / or abutting against a partition plate. The sealing device may also include a second base ring coupled to an end accordion plate, such that a spring spans between the second and third base rings. The second base ring may contact a partition plate to create a substantial seal between the second base ring and the partition plate. The mass of the base ring may be at least three times the mass of the spring.

[0010] In various examples, a sealing device for a reactor may include: a base ring; and / or a spring fixedly coupled to and extending from the base ring, wherein the spring includes a plurality of accordion plates spanning between a first accordion plate and an end accordion plate. The base ring may include a base inner diameter, and the spring may include a spring inner diameter, wherein the base inner diameter is radially inward than the spring inner diameter. The base ring may include a bottom surface, a radially inward surface, and a chamfered surface spanning between the bottom surface and the radially inward surface of the base ring. The base ring may include a top surface and a connecting protrusion projecting from the top surface, wherein the first accordion plate in the accordion plate may include a flat end face coupled to the connecting protrusion.

[0011] In various examples, a sealing system for a reactor may include a partition plate configured to surround a base; a flow control ring configured to surround the base and disposed between the partition plate and the base; and / or a sealing device. The sealing device may include a base ring; and / or a spring fixedly coupled to and extending from the base ring, wherein the spring includes a plurality of accordion-like plates, including a first accordion-like plate and an end accordion-like plate, wherein the base ring and the spring span between an upper-facing surface of the flow control ring and a lower-facing surface of the partition plate. The spring may include a spring bias to an extended position configured to create a substantial seal between the flow control ring and the partition plate.

[0012] For the purpose of outlining this disclosure and the advantages achieved relative to the prior art, certain objects and advantages of this disclosure have been described above. It should be understood, of course, that not all of these objects or advantages may necessarily be achieved according to any particular example of this disclosure. Therefore, for example, those skilled in the art will recognize that the examples disclosed herein may be implemented in a way that achieves or optimizes one or more advantages taught or suggested herein, without necessarily achieving other objects or advantages that may be taught or suggested herein.

[0013] All these examples are intended to fall within the scope of this disclosure. These and other examples will become apparent to those skilled in the art from the following detailed description of some examples with reference to the accompanying drawings, and this disclosure is not limited to any particular example discussed. Attached Figure Description

[0014] Although the specification concludes with claims, which specifically point out and explicitly claim protection for what is considered an example of this disclosure, the advantages of this disclosure can be more readily determined from the description of certain examples when read in conjunction with the accompanying drawings. Elements having the same element number throughout the drawings are intended to be identical.

[0015] Figure 1 These are schematic diagrams of exemplary reactor systems based on various examples.

[0016] Figure 2A This is a schematic diagram of an exemplary reaction chamber having a base positioned at a lower location, according to various examples.

[0017] Figure 2B This is a schematic diagram of an exemplary reaction chamber having a base positioned in an elevated position, according to various examples.

[0018] Figure 3 A schematic diagram of a portion of a reaction chamber is shown, based on various examples.

[0019] Figure 4 Sealing devices for reactor systems are shown according to various examples.

[0020] Figure 5A and Figure 5B Sealing devices for reactor systems are shown according to various examples.

[0021] It should be understood that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be exaggerated relative to other elements to aid in understanding the embodiments shown in this disclosure. Detailed Implementation

[0022] The descriptions of the methods, structures, devices, and systems provided below are merely exemplary and intended for illustrative purposes only. The following descriptions are not intended to limit the scope of this disclosure or the claims. Furthermore, the recitation of multiple examples having the described features is not intended to exclude other examples having additional features or other examples comprising different combinations of the described features. For example, various examples are illustrated as embodiments and may be recited in the dependent claims. Unless otherwise stated, examples or components thereof may be combined or may be applied separately from each other. Methods may include the disclosed steps in any suitable and / or desired order or combination. The illustrations presented herein are not intended to be actual views of any particular material, apparatus, structure, or device, but are merely representations for illustrating examples of this disclosure.

[0023] As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Unless otherwise stated, expressions such as “at least one of…” modify the entire column of elements when following an element in the column, and not necessarily a single element in the column.

[0024] As used herein, the terms “comprising,” “including,” and variations thereof specify the presence of the stated feature, integer, step, process, component, part, and / or group thereof, but do not exclude the presence or addition of one or more other features, integers, steps, processes, components, parts, and / or groups thereof. In this disclosure, the meaning of any definition does not necessarily exclude the common and customary meanings in some examples.

[0025] As used herein, the term "substrate" can refer to any one or more underlying materials, including any one or more underlying materials that can be modified or on which devices, circuits, or films can be formed. A "substrate" can be continuous or discontinuous; rigid or flexible; solid or porous; and combinations thereof. A substrate can be in any form, such as powder, plate, or workpiece. Plate-type substrates can include wafers of various shapes and sizes. Substrates can be made of semiconductor materials, including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0026] As used herein, the term "atomic layer deposition" (ALD) can refer to a vapor-phase deposition process in which deposition cycles, preferably multiple consecutive cycles, are performed in a processing chamber. Typically, during each cycle, a precursor is chemisorbed onto the deposition surface (e.g., a substrate surface or a previously deposited lower layer surface, such as material from a previous ALD cycle), forming a monolayer or sub-monolayer that is not readily reactive with another precursor (i.e., a self-limiting reaction). Subsequently, if desired, a reactant (e.g., another precursor or reactive gas) can be introduced into the processing chamber to convert the chemisorbed precursor into the desired material on the deposition surface. Typically, this reactant is capable of further reacting with the precursor. Furthermore, a purging step can be used during each cycle to remove excess precursor from the processing chamber and / or excess reactant and / or reaction byproducts from the processing chamber after the conversion of the chemisorbed precursor. Furthermore, as used herein, the term “atomic layer deposition” is also intended to include processes specified by related terms such as “chemical vapor deposition,” “atomic layer epitaxy” (ALE), molecular beam epitaxy (MBE), gas-source MBE or organometallic MBE, and chemical beam epitaxy when performed with alternating pulses of a precursor composition, a reactive gas, and a purge gas (e.g., an inert carrier gas).

[0027] As used herein, the term “chemical vapor deposition” can refer to any process in which a substrate is exposed to one or more volatile precursors that react and / or decompose on the substrate surface to produce the desired deposition.

[0028] In some examples, "membrane" refers to a layer extending in a direction perpendicular to the thickness direction. In some examples, "layer" refers to a material of a certain thickness formed on a surface, and can be synonymous with membrane or non-membrane structures. A membrane or layer can consist of discrete single membranes or layers or multiple membranes or layers with certain properties, and the boundaries between adjacent membranes or layers may or may not be clear, and can be established based on or not based on the physical, chemical and / or any other properties, formation process or sequence and / or function or purpose of adjacent membranes or layers. A layer or membrane can be continuous or discontinuous. Furthermore, a single membrane or layer can be formed using one or more deposition cycles and / or one or more deposition and processing cycles.

[0029] As used herein, the term "contaminant" can refer to any unwanted material disposed within the reaction chamber that may affect the purity of the substrate disposed within the reaction chamber. The term "contaminant" can refer to, but is not limited to, unwanted deposits, metallic and non-metallic particles, impurities, and waste products disposed within the reactor system or reaction chamber or any part thereof.

[0030] In this disclosure, any two numbers of a variable may constitute a feasible range of the variable, and any range indicated may include or exclude endpoints, and may combine all ranges and ratio limits disclosed herein. Furthermore, any value of the indicated variable (whether or not it is indicated by “about”) may refer to an exact value or an approximate value and include equivalents, and in some examples may refer to the mean, median, representative value, multi-value, etc. Unless otherwise specified, references to “a,” “an,” and / or “the” may include one or more, and references to singular items may also include plural items. When referring to components of the system discussed herein, the term “connection” means a direct connection or an indirect connection with other intermediate elements, as appropriate. Unless otherwise stated, the terms “first,” “second,” etc., and / or “primary,” “secondary,” etc., are used herein merely as labels and are not intended to impose any order, position, or hierarchy requirements on the items referred to by these terms. Furthermore, references to items such as “second” do not require or exclude the existence of items such as “first” or lower numbered items and / or items such as “third” or higher numbered items. Furthermore, references to items such as "first" and "second" do not imply the absence of intermediate items, and such intermediate items may exist.

[0031] Reactor systems used for ALD, CVD, etc., can be used in a variety of applications, including depositing and etching materials on substrate surfaces. In various examples, refer to... Figure 1 The reactor system 50 may include a reaction chamber 4, a base 6 for holding the substrate 30 during processing, a fluid distribution system 8 (e.g., a spray head) for distributing one or more reactants to the surface of the substrate 30, one or more reactant sources 10, 12 and / or carrier gas and / or purge gas source 14 (fluidly coupled to the reaction chamber 4 via lines 16-20), and / or valves or controllers 22-26. The system 50 may also include a vacuum source 28 fluidly coupled to the reaction chamber 4. A sealing member 29 may separate (e.g., at least partially fluidly separate) a portion of the volume within the reaction chamber 4.

[0032] Go to Figure 2A and 2B Examples of this disclosure may include reactor systems and methods for processing substrates within reactor 100. In various examples, reactor 100 may include a reaction chamber 110 for processing substrates. In various examples, reaction chamber 110 may include a reaction space 112 (i.e., upper chamber) and / or a lower chamber space 114 (i.e., lower chamber) that can be configured to process one or more substrates. Lower chamber space 114 may be configured to load and unload substrates from and / or to provide a pressure differential between lower chamber space 114 and reaction space 112.

[0033] In various examples, substrate 150 and base 130 can move relative to each other. For example, in various examples, lifting pin 139 can be configured to allow substrate 150 to separate from base 130 and to allow substrate 150 to be positioned in contact with (i.e., supported by) base 130. In various examples, base 130 can move up or down, for example via base lift 104, such that base 130 moves relative to substrate 150. In various examples, lifting pin 139 can move up or down, for example via lifting pin lift / platform 202, such that substrate 150 moves relative to base 130. In various examples, base 130 and / or lifting pin 139 can be stationary while the other is moving. In various examples, base 130 and / or lifting pin 139 can be configured to move relative to each other.

[0034] In various examples, the base 130 can be moved from the loading position 103 to the processing position 106, thereby moving the substrate 150 into the reaction space 112. The substrate 150 can then be processed within the reaction chamber.

[0035] In various examples, reaction space 112 and lower chamber space 114 may be separated by a base 130 disposed within reaction chamber 110. In various examples, reaction space 112 and lower chamber space 114 may be substantially fluidly separated or isolated from each other. For example, base 130 may substantially fluidly separate reaction space 112 and lower chamber space 114 by creating at least a partial seal (i.e., at least restricting fluid flow) between base 130 and chamber sidewall 111 of reaction chamber 110 disposed near the outer surface 132 of base 130. That is, the space 108 between base 130 and chamber sidewall 111 may be minimized or eliminated such that there is no or little fluid movement between base 130 and chamber sidewall 111. As used herein, “substantially fluid separated,” “substantially sealed,” “substantially sealed,” and / or other similar phrases may refer to a seal intended to minimize fluid movement through the seal as much as possible, such that no fluid is expected and / or measured through the seal (i.e., leakage) (the goal is complete sealing, but in practice, some fluid may leak).

[0036] In various examples, to prevent or reduce fluid flow between the base 130 and the chamber sidewall 111 (i.e., to form a substantial seal between them), one or more sealing members (e.g., sealing member 129) may be coupled to the base 130 (e.g., from the outer surface 132 of the base) and / or the chamber sidewall 111 of the reaction chamber 110 to another, thereby creating at least a partial seal (i.e., a substantial seal) between the base 130 and the chamber sidewall 111. Sealing member 129 may be a diaphragm. A substantial seal between the reaction space 112 and the lower chamber space 114 may be desirable to prevent or reduce the entry and / or contact of precursor gases and / or other fluids used to process the substrate 150 into and / or with the lower chamber space 114 of the reaction chamber 110. For example, precursor gases used to process the substrate in the reaction space may include corrosive deposition precursors that can contact the lower chamber space 114, producing unwanted deposits / contaminants / particles that can then be reintroduced into the reaction space 112, thereby providing a source of contamination for the substrate disposed in the reaction space.

[0037] In various examples, to create a basic seal between the reaction space and the lower chamber space, the reaction chamber may include a sealing system disposed between the base and the chamber sidewall. For example, the sealing system in reaction chamber 110 may include a sealing member 129 disposed between the base 130 and the chamber sidewall 111 to create a basic seal between the reaction space 112 and the lower chamber space 114.

[0038] In various examples, the sealing system within the reaction chamber may include a partition (e.g., Figure 3 The partition plate 370 in the reaction chamber may protrude from the side wall of the chamber into the reaction chamber volume. In various examples, the partition plate may surround a base in the reaction chamber (e.g., Figure 3 The base 330 in the middle. The partition plate can be coupled to the base (e.g., in response to the reaction chamber moving to or being positioned in a processing position (e.g., an elevated position)). In various examples, the partition plate can contact and / or be directly coupled to the base (e.g., when the base is in the elevated or processing position). For example, the lower-facing surface of the partition plate (e.g., Figure 3 Surface 374 in the middle can be aligned with the upper surface of the base (e.g., the surface facing upwards). Figure 3 The upper surface 336 of the substrate is connected and / or in contact with the partition plate. In various examples, the upper surface of the base of the partition plate may be the substrate support surface.

[0039] In various examples, the sealing system may include a flow control ring disposed between the base and the partition plate (e.g., Figure 3 (Flow control loop 390 in the middle). The flow control loop can be disposed around the base and can be configured to control the fluid flow within the reaction chamber. For example, Figure 1The sealing member 129 can be a flow control ring. Therefore, the base can be connected to and / or engaged with the partition plate via the flow control ring. The reaction space and the lower chamber space can be substantially (fluidly and / or physically) separated by the base, the flow control ring, and / or the partition plate. For example, as... Figure 3 As shown, a flow control ring 390 may be disposed between a partition plate 370 and a base 330. The flow control ring 390 may include an upper-facing surface 394 that engages (i.e., connects and / or contacts) a lower-facing surface 374 of the partition plate 370. The flow control ring 390 may include a lower-facing surface 392 that engages (i.e., connects and / or contacts) an upper-facing surface 337 of the base 330. In various examples, the upper-facing surface of the base engaging the flow control ring may be a substrate support surface. In various examples, at least a portion of the flow control ring may be disposed above at least a portion of the partition plate, such that the flow control ring cannot translate below the partition plate.

[0040] In various examples, the sealing system in the reaction chamber may include a sealing device (e.g., sealing device 200) disposed between and / or coupled to the partition plate and the base (e.g., wherein the upper-facing surface of the base is configured to engage with the lower-facing surface of the partition plate via the sealing device). In various examples, the sealing device may be disposed between and / or coupled to the partition plate and the flow control ring in the sealing system for the reaction chamber (e.g., wherein the flow control ring is disposed between the base and the partition plate). In this example, the sealing device may be coupled to the base via the flow control ring.

[0041] refer to Figure 4 In various examples, the sealing device 400 may include a base ring 420 and a spring 440 coupled to the base ring 420. The spring 440 may be removably or fixedly coupled to the base ring 420. The spring 440 may be coupled to the top surface 424 of the base ring 420. The base ring 420 may at least partially surround a base and / or a flow control ring, and may have an inner diameter 421 and an outer diameter 429. The inner diameter 421 may be the portion of the base ring 420 closest to the base, and the outer diameter 429 may be the portion of the base ring 420 furthest from the base. The inner diameter 421 may be aligned with at least a portion of the radially inward surface 426 of the base ring 420. The base ring 420 may include a height spanning between the top surface 424 and the bottom surface 423. The bottom surface 423 may be disposed against the upper-facing surface of the base or the flow control ring. The radially inward surface 426 of the base ring 420 may be disposed close to and / or against the outer surface of the base or flow control ring.

[0042] In various examples, the spring 440 may at least partially surround the base and / or flow control ring, and may include an accordion-style plate stack (e.g., a bellows). The accordion-style plate stack may include one or more accordion-style plates 450. The accordion-style plates 450 may be integral and / or monolithic, or they may be separate plates joined together. Each accordion-style plate 450 may span between an inner end 452 and an outer end 454, and between an inner diameter 421 and an outer diameter 429 of the base ring 420. The inner end 452 of each accordion-style plate 450 may be the portion of the respective accordion-style plate 450 closest to the inner diameter 421 of the base ring 420. The outer end 454 of each accordion-style plate 450 may be the portion of the respective accordion-style plate 450 closest to the outer diameter 429 of the base ring 420. An inner end 452 of one accordion-type plate 450 can be connected to the inner end 452 of another (adjacent) accordion-type plate 450 in a stack of accordion-type plates. Similarly, an outer end 454 of one accordion-type plate 450 can be connected to the outer end 454 of another (adjacent) accordion-type plate 450 in a stack of accordion-type plates. The accordion-type plates 450 can be (fixedly) connected to each other in any suitable manner (e.g., welding, adhesive, fasteners, etc.) to form a bellows.

[0043] The inner end 452 of each accordion plate 450 may include an inner flat end 456, and / or the outer end 454 of each accordion plate 450 may include an outer flat end 457. The flat ends of the accordion plates 450 facilitate attachment to other accordion plates 450 and / or base rings 420. That is, the flat ends provide a flat surface for attachment (e.g., between accordion plates 450 and / or to base rings 420), thereby providing a larger surface area for contact and attachment between the respective components, rather than the accordion plates 450 forming a corrugated or serrated configuration without flat surfaces at the ends of the accordion plates 450. The flat ends may include any suitable dimensions, such as a length of approximately one millimeter (mm) (between the inner and outer diameters of each flat end) (where “approximately” in this context means ±0.5 mm). The flat ends of the accordion-style plates 450 may span in a direction substantially parallel to the surface of the base ring 420 to which the spring 440 is connected, and / or in a direction substantially perpendicular to the direction of compression or extension of the spring 440 (“substantially” means ±10 degrees). The body 458 of each accordion-style plate 450 spans between the flat ends and may be angled to the direction of the flat ends of the accordion-style plates 450 (this angle may vary depending on the compression or extension of the spring 440).

[0044] A spring 440 (accordion-style plate stack) may span or protrude from a base ring 420 (e.g., from a top surface 424). The spring 440 may span (e.g., in the compression or extension direction of the spring 440) between a first accordion-style plate 442 and an end accordion-style plate 444. The first accordion-style plate 442 may be attached to the base ring 420 (e.g., to its top surface 424). A first end of the first accordion-style plate 442 may be attached to the base ring 420 by any suitable means, such as by welding, adhesive, fasteners, etc. A first end of the first accordion-style plate 442 may be attached to the base ring 420 near an inner diameter 421, such that the first accordion-style plate 442 spans from its first end toward an outer diameter 429 of the base ring 420. Attaching the first accordion plate 442 to the inner diameter 421 of the base ring 420 (and / or at or near the inner diameter 441 of the spring 440) rather than attaching the first accordion plate 442 to the outer diameter 429 closer to the base ring 420 can reduce the likelihood of contamination by allowing a smaller space in which particles or contaminants can flow.

[0045] Spring 440 may include an inner diameter 441 (the portion of accordion plate 450 closest to the base) and an outer diameter 449 (the portion of accordion plate 450 furthest from the base). The inner diameter 441 of spring 440 may be radially outside the inner diameter 421 of base ring 420 (i.e., the inner diameter 421 of base ring 420 may be smaller and closer to the base than the inner diameter 441 of spring 440). Therefore, base ring 420 may contact the base and / or flow control ring by abutting against base ring 420 (or its inner diameter 421), and the smaller inner diameter 421 of base ring 420 keeps the inner diameter 441 of spring 440 separated from the base and / or flow control ring. Thus, base ring 420, which may be a solid material, can protect the more fragile spring 440 from impact or other deformation or damage due to contact with other components of the reactor.

[0046] In various examples, the sealing device 400 may also include a second base ring 460. The second base ring 460 may be configured opposite to the base ring 420, with the spring 440 spanning between the second base ring 460 and the base ring 420. The second base ring 460 may radially span from a radially inward surface 466, which may at least partially align with the inner diameter 421 (and / or the radially inward surface 426 of the base ring 420). The second base ring 460 may include a height spanning between a top surface 464 and a bottom surface 463. The top surface 464 may contact and / or be disposed against the downward-facing surface of the partition plate (e.g., in response to movement of the base toward a raised position, which may compress the spring 440). The radially inward surface 466 of the second base ring 460 may be disposed close to and / or against the outer surface of the base or the flow control ring.

[0047] In various examples, the sealing device may not include a second base ring 460. Therefore, the end accordion plate 444 (or its flat end 456) may be positioned to contact and / or abut against the downward-facing surface of the partition plate (e.g., in response to movement of the base toward a raised position, which could compress the spring 440). In contrast to a smaller point of contact, the flat end 456 of the end accordion plate 444 can facilitate a larger contact surface area and thus a better seal (e.g., a basic seal) with the partition plate.

[0048] For further reference Figure 5A and Figure 5B Another example of a sealing device is depicted. Figure 5A and Figure 5B The sealing devices 500A and 500B described in the drawings respectively can have the same as Figure 4 Similar components to sealing device 400. Therefore, the discussion of sealing device 400 and its components can be appropriately applied to sealing devices 500A and 500B and their corresponding components. A base ring 520 (another example of base ring 420) may radially span between a radially inward surface 526 and a radially outward surface 528, and may include a height spanning between a top surface 524 and a bottom surface 523. The bottom surface 523 may be disposed against the upper surface of the base or flow control ring. The radially inward surface 526 of the base ring 520 may be disposed near and / or against the outer surface of the base or flow control ring. The radially inward surface 526 of the base ring 520 may at least partially define the inner diameter 521 of sealing device 500A.

[0049] In various examples, the base ring 520 may include a chamfered surface 525 spanning between the bottom surface 523 and the radially inward surface 526. The chamfered surface 525 may be angled (i.e., an angled bridge) between the bottom surface 523 and the radially inward surface 526. The chamfered surface 525 may be set at any suitable angle. For example, the chamfered surface 525 may be set at an angle of approximately 45 degrees relative to the plane spanned by the bottom surface 523, and / or at an angle of approximately 135 degrees relative to the bottom surface 523. The chamfered surface 525 may be set at an angle of approximately 45 degrees relative to the plane spanned by the radially inward surface 526, and / or at an angle of approximately 135 degrees relative to the radially inward surface 526 (in this context, the term "approximately" means ±20 or 30 degrees). The chamfered surface 525 can be configured to provide a smoother surface for accessing the base or flow control ring (e.g., instead of a sharper corner between the bottom surface 523 and the radially inward surface 526, which could cause scratches, chipping, or other damage to the base or flow control ring). Therefore, for now, refer to... Figure 3When the sealing device 200 (an example of the sealing device 500A) is (removably) positioned between the flow control ring 390 and the partition plate 370, the base ring 220 may be configured such that the bottom surface 223 of the base ring 220 contacts the upper surface 394 of the flow control ring 390, and may move or slide along the upper surface 394 of the flow control ring 390 until the chamfered surface 225 and / or the radially inward surface 226 of the base ring 220 contacts the chamfered surface 395 and / or the outer surface 393 of the flow control ring 390, respectively.

[0050] Sealing devices 500A and 500B may include springs (similar to spring 440 of sealing device 400) comprising a plurality of accordion plates 550 (similar to accordion plates 450). Sealing device 500A may include spring 540A, and sealing device 500B may include spring 540B. Spring 540A may span (e.g., in the compression or extension direction of spring 540) between a first accordion plate 542 and an end accordion plate 544A. The first accordion plate 542 may be coupled to a base ring 520. The end accordion plate 544A may be coupled to and / or engage (i.e., abut) a partition plate to form a basic seal therewith (e.g., in response to upward translation of the base to induce contact between sealing device 500A and the partition plate and / or compression of spring 540A). Springs 540A and 540B may include an inner diameter 541. The inner diameter 541 may be radially outside the inner diameter 521 of the base ring 520, for example separated by a radial gap 533.

[0051] Each accordion plate 550 may span between the inner end 552 and the outer end 554, and between the inner diameter 521 and the outer diameter 529 of the base ring 420. The inner end 552 and / or the outer end 554 of each accordion plate 550 may include a flat end (e.g., an inner flat end 556 or an outer flat end 557) which may facilitate engagement with other accordion plates (or their corresponding flat ends) and / or the base ring, and / or facilitate engagement with a partition plate to form a basic seal therewith.

[0052] In various examples, the base ring 520 may include a connecting protrusion 530 projecting from the top surface 524. The connecting protrusion 530 may extend from the base ring 520 in the compression or extension direction of the spring 540. A first accordion plate 542 may be coupled to the connecting protrusion 530 (e.g., at the peak or apex of the connecting protrusion 530). The connecting protrusion 530 may include a connecting surface 534 to which the first accordion plate 542 may be coupled. The connecting surface 534 may be at least partially flat to facilitate coupling with the flat end of the inner end 552 of the first accordion plate 542. That is, the connecting surface 534 may have a surface complementary to (including complementary shape, size, texture, etc.) the surface of the inner end 552 of the first accordion plate 542 to facilitate coupling between them. The first accordion plate 542 may be coupled to the connecting protrusion 530 in any suitable manner (fixedly), such as welding, adhesive, mechanical connection, fastener, etc. The connecting protrusion 530 may be disposed on the top surface 524, closer to the base inner diameter 521 than to the base outer diameter 529. The connecting protrusion 530 may be disposed radially inward from the base inner diameter 521 on the top surface 524, and may be separated from the base inner diameter 521 by a radial gap 533.

[0053] The surface between the radial clearance 533 and the radially inward surface 526 of the base ring 520 may include an angled surface 527. The angled surface 527 may include an angle similar to that of the chamfered surface 525. The angled surface 527 may be configured to provide a smoother surface for accessing the base or flow control ring (e.g., instead of a sharper corner between the radial clearance 533 and the radially inward surface 526, which could cause scratches, chipping, or other damage to the base or flow control ring).

[0054] The connecting protrusion 530 may have a substantially flat or vertical radially inward surface (where "substantially" is within ±20 degrees of being flat or vertical). The connecting protrusion 530 may have an inclined or angled radially outward surface that tapers downward toward the top surface 524 of the base ring 520 in the radially outward direction. The tapering radially outward surface of the connecting protrusion 530 may allow access to the connection point between the connecting protrusion 530 and the first accordion-type plate 542 (e.g., to allow for tools used to connect, disconnect, or hold the components). The radially inward surface of the connecting protrusion 530 may include a recessed access recess 532 therein. The access recess 532 may be recessed into the radially inward surface of the connecting protrusion 530 near the connection surface 534 to allow access to the connection point between the connecting protrusion 530 and the first accordion-type plate 542 (e.g., to allow for tools used to connect, disconnect, or hold the components).

[0055] For further reference Figure 5BSpring 540B can span (e.g., in the compression or extension direction of spring 540B) between the first accordion plate 542 and the end accordion plate 544B. The end accordion plate 544B can be connected to the second base ring 560 in the same or similar manner as the first accordion plate 542 is connected to the base ring 520. Therefore, spring 540B (and the accordion plate 550 included therein) can span between the base ring 520 and the second base ring 560.

[0056] The second base ring 560 (an example of the second base ring 460) may have the same or similar structure as the base ring 520 (e.g., and / or a mirror image of the base ring 520). The second base ring 560 may radially span between a radially inward surface 566 and a radially outward surface 568, and may include a height spanning between a top surface 563 and a bottom surface 564. The top surface 563 may be positioned against the downward-facing surface of the partition plate in response to upward translation of the base and / or compression of the spring 540B. Thus, the second base ring 560 may contact the partition plate, thereby creating a substantial seal therewith. The radially inward surface 566 of the second base ring 560 may be positioned close to and / or against the outer surface of the base or flow control ring. The radially inward surface 566 of the second base ring 560 may at least partially define the inner diameter 521 of the sealing device 500B.

[0057] In various examples, the second base ring 560 may include a chamfered surface 565 spanning between the top surface 563 and the radially inward surface 566. The chamfered surface 565 may be angled (i.e., an angled bridge) between the top surface 563 and the radially inward surface 566. The chamfered surface 565 may be set at any suitable angle, such as approximately 45 degrees relative to the plane spanned by the top surface 563, and / or approximately 135 degrees relative to the top surface 563. The chamfered surface 525 may be set at an angle of approximately 45 degrees relative to the plane spanned by the radially inward surface 566, and / or at an angle of approximately 135 degrees relative to the radially inward surface 566 (in this context, the term "approximately" means ±20 or 30 degrees). The chamfered surface 565 may be configured to provide a smoother surface for accessing the base or flow control ring (e.g., instead of a sharper corner between the top surface 563 and the radially inward surface 566, which could cause scratches, chipping, or other damage to the base or flow control ring).

[0058] In various examples, the second base ring 560 may include a connecting protrusion 570 projecting from the bottom surface 564. The connecting protrusion 570 may extend from the second base ring 560 in the compression or extension direction of the spring 540. An end accordion plate 544B may be coupled to the connecting protrusion 570 (e.g., at the peak or apex of the connecting protrusion 570). The connecting protrusion 570 may include a connecting surface 574 to which the end accordion plate 544B may be coupled. The connecting surface 574 may be at least partially flat to facilitate coupling with the flat end of the inner end 552 of the end accordion plate 544B. That is, the connecting surface 574 may have a surface complementary to (including complementary shape, size, texture, etc.) the surface of the inner end 552 of the end accordion plate 544B to facilitate coupling between them. The end accordion plate 544B may be coupled to the connecting protrusion 570 in any suitable manner (fixedly), such as by welding adhesive, mechanical connection, fastener, etc. The connecting protrusion 570 may be disposed on the bottom surface 564, closer to the base inner diameter 521 than to the base outer diameter 529. The connecting protrusion 570 may be disposed radially inward from the base inner diameter 521 on the bottom surface 564, and may be separated from the base inner diameter 521 by a radial gap 573.

[0059] The surface between the radial clearance 573 and the radially inward surface 566 of the second base ring 560 may include an angled surface 567. The angled surface 567 may include an angle similar to that of the chamfered surface 525. The angled surface 567 may be configured to provide a smoother surface for accessing the base or flow control ring (e.g., instead of a sharper bend between the radial clearance 573 and the radially inward surface 566, which could cause scratches, chipping, or other damage to the base or flow control ring).

[0060] The connecting protrusion 570 may have a substantially flat or vertical radially inward surface (where "substantially" is within ±20 degrees of being flat or vertical). The connecting protrusion 570 may have an inclined or angled radially outward surface that tapers upward toward the top surface 563 of the second base ring 560 in a radially outward direction. The tapering radially outward surface may allow access to the connection point between the connecting protrusion 570 and the end accordion plate 544B (e.g., to allow for tools used to connect, disconnect, or hold the components). The radially inward surface of the connecting protrusion 570 may include a recessed access recess 572. The access recess 572 may be recessed into the radially inward surface of the connecting protrusion 570 near the connection surface 574 to allow access to the connection point between the connecting protrusion 570 and the end accordion plate 544B (e.g., to allow for tools used to connect, disconnect, or hold the components).

[0061] refer to Figure 3A reactor 300 with a base 330, a flow control ring 390, a partition plate 370, and / or a sealing device 200 is shown. The sealing device 200 is an example of sealing devices 500A, 500B, and / or sealing device 400; therefore, the description of sealing devices 400 and / or 500A, 500B and their components can be appropriately applied to sealing device 200 and its components. The sealing device includes a base ring 220 (similar to base rings 420 and 520) and a spring 240 (similar to springs 440 and / or 540A, 540B) coupled to the base ring 220. The base ring 220 may radially span between a radially inward surface 226 and a radially outward surface 228 (radial direction along the y-axis) and may include a height spanning between a top surface 224 and a bottom surface 223. The bottom surface 223 may abut against the upward-facing surface 394 of the flow control ring 390. The radially inward surface 226 of the base ring 220 may be positioned close to and / or against the outer surface 393 of the flow control ring 390.

[0062] The base ring 220 may include a chamfered surface 225 (similar to chamfered surface 525) spanning between the bottom surface 223 and the radially inward surface 226. The chamfered surface 225 may be angled (i.e., an angled bridge) between the bottom surface 223 and the radially inward surface 226. The chamfered surface 225 may be positioned at an angle of approximately 45 degrees relative to the plane spanned by the bottom surface 223, and / or at an angle of approximately 135 degrees relative to the bottom surface 223. The chamfered surface 225 may be positioned at an angle of approximately 45 degrees relative to the plane spanned by the radially inward surface 226, and / or at an angle of approximately 135 degrees relative to the radially inward surface 226 (in this context, the term "approximately" means ±20 or 30 degrees). The chamfered surface 225 may be configured to provide a smoother surface for accessing the base or flow control ring (e.g., instead of a sharper corner between the bottom surface 223 and the radially inward surface 226, which could cause scratches, chipping, or other damage to the base or flow control ring).

[0063] The flow control ring 390 may include a chamfered surface 395 spanning between an outer surface 393 and an upper-facing surface 394 of the flow control ring 390. The chamfered surface 395 may be complementary to the chamfered surface 225 of the base ring 220 (e.g., in terms of size, texture, and / or any other suitable characteristics) and may include angles complementary to the angles of the chamfered surface 225 of the base ring 220. The complementary nature of the chamfered surface 395 of the flow control ring 390 and the chamfered surface 225 of the base ring 220 facilitates the placement of the chamfered surface 225 of the base ring 220 close to and / or against the chamfered surface 395 of the flow control ring 390, such that the angles of the two surfaces and their surroundings match and adapt to each other. In other words, the angle formed by the chamfered surface 395 of the flow control ring 390 and the upper surface 394 can match the angle formed by the bottom surface 223 and the chamfered surface 225 of the base ring 220, and the angle formed by the chamfered surface 395 of the flow control ring 390 and the outer surface 393 can match the angle formed by the radially inward surface 226 and the chamfered surface 225 of the base ring 220.

[0064] like Figure 3 As shown, and in discussion of the sealing device disclosed herein, the inner diameter of the base ring 220 is smaller than the inner diameter of the spring 240. Therefore, the inner diameter of the base ring 220 contacts the flow control ring 390, and prevents the flow control ring 390 from contacting the spring 240 (e.g., to mitigate the risk of damaging the spring 240).

[0065] In various examples, the sealing device and its components (e.g., base ring and / or spring) may include a shape surrounding a base in the reaction chamber. For example, Figure 3 The sealing device 200 (including a base ring 220 and a spring 240) can extend all the way around the base 330. In various examples, the spring can be positioned at one or more points around the base, such that the force on the base that creates the seal in the reaction chamber can occur at multiple points around the base.

[0066] During operation, the base 330 in reactor 300 can be translated along the x-axis from a lower position to an elevated position. In various examples, the base 330 may not be in contact with the flow control ring 390 in the lower position. In various examples, the flow control ring 390 and / or the sealing device 200 may be translated together with the base 330. As the base 330 translates upward and contacts / engages with the flow control ring 390 (and / or applies an upward force to the flow control ring 390), the spring 240 of the sealing device 200 can be compressed from a relaxed or extended position to a compressed position between the flow control ring 390 and the partition plate 370. The spring 240 may be biased toward an uncompressed (extended) or less compressed position. The partition plate 370 and / or its portion protruding from the chamber sidewall may be substantially stationary (i.e., the partition plate 370 and its portion do not move in response to the force of the spring 240). In response to compression of spring 240, spring 240 can apply an upward force on the downward-facing surface 374 of partition plate 370, and / or apply a downward force on the upward-facing surface 394 of flow control ring 390. Figure 3 As shown, the downward force of spring 240 causes a downward force from base ring 220 to the upper surface 394 of flow control ring 390. In response, flow control ring 390 may apply a downward force on the upper surface 337 of base 330. In various examples, the upper surface of the base receiving the downward force from the spring and / or flow control ring may be contained on a substrate support surface of the base. The downward force of flow control ring 390 on base 330 may result in a substantial seal between flow control ring 390 and base 330. The downward force on upper surface 394 of flow control ring 390 may result in a substantial seal between flow control ring 390 and sealing device (e.g., via base ring 220 and its bottom surface 223). The upward force on lower surface 374 of partition plate 370 may create a substantial seal between partition plate 370 and sealing device and / or its spring 240. In an example where the sealing device includes a second base ring (e.g., second base ring 460 and / or 560) coupled to a spring (e.g., coupled to the other end of spring 240, opposite to base ring 220), an upward force from the top surface of the second base ring on the downward-facing surface 374 of the partition plate 370 can result in a substantial seal between the partition plate 370 and the sealing device (e.g., via the second base ring and its top surface). Therefore, the reaction space 312 and the lower chamber space 314 can be substantially fluidly separated.

[0067] In response to the base 330 translating from a raised position to a lower position, the spring 240 expands, thus reducing the force between the aforementioned components. In response, the reaction space 312 and the lower chamber space 314 can be in fluid communication.

[0068] In various examples, the components of the sealing device may be made of and / or comprise any suitable material. The spring and its components may comprise metals (e.g., elemental metals) or metal alloys, such as stainless steel, nickel, nickel alloys, Hastelloy, etc. The base ring may comprise metals (e.g., elemental metals) or metal alloys, such as stainless steel, nickel, nickel alloys, Hastelloy, etc. In various examples, the spring and base ring may comprise and / or be made of the same material.

[0069] The base ring of the sealing device may have a weight and / or mass significantly greater than that of the spring of the sealing device. For example, the base ring may have a mass at least three to five times, at least two times, three times, or five times greater than that of the spring, or about three times or five times greater (in this context, "about" means within 10% or 20% of the corresponding value). The spring may have a mass of 150 to 200 grams or about 180 grams, while the base ring may have a mass of 800 to 1000 grams or about 880 or 900 grams (in this document, "about" means ±50 grams).

[0070] A sealing device with one or more base rings can be configured to protect the springs coupled to it from damage. The base rings may comprise a large and / or solid block of material relative to the spring, and the base rings may be configured to contact components of the sealing system and / or reactor system. The contact between the base rings and the components of the sealing system and / or reactor system can be configured to prevent contact between the springs and these components of the sealing system and / or reactor system, mitigating the risk of damage to the springs due to such contact (the springs may be more fragile than the base rings). The relatively large base rings also facilitate handling of the sealing device, as the user can grasp the base rings instead of the springs without worrying about damaging, warping, and / or bending the springs, or otherwise unintentionally modifying the sealing device in a way that might prevent the springs from functioning properly to produce the required basic seal. Therefore, the sealing device can be removed and / or replaced between the partition plate and the flow control ring, and / or between the partition plate and the base.

[0071] Furthermore, the substantially flat surface provided by the base ring of the sealing device can facilitate greater contact between the sealing device and the components it contacts. Similarly, the flat ends of the accordion plates of the springs in the sealing device can facilitate greater contact between the accordion plates, between the accordion plates and the base ring, and / or between the accordion plates and the partition plates. Therefore, this greater contact (e.g., via greater surface area contact from the flat surfaces of the various components) can result in greater sealing capacity to achieve the desired basic seal.

[0072] The examples given above in this disclosure do not limit the scope of the claimed subject matter, as they are merely examples. The invention is defined by the appended claims and their legal equivalents. Any equivalent embodiments are intended to fall within the scope of this disclosure. In fact, various modifications to this disclosure, such as alternative useful combinations of the described elements, in addition to those shown and described herein, will become apparent to those skilled in the art from the description. These modifications and embodiments are also intended to fall within the scope of the appended claims.

Claims

1. A reactor, comprising: The volume of the reaction chamber, which is enclosed within the reaction chamber; A base configured to translate vertically along an axis within the reaction chamber; The reaction space is located above the base within the reaction chamber volume; The lower chamber space is located below the base within the reaction chamber volume; as well as A sealing system that substantially separates the reaction space from the lower chamber space, wherein the sealing system includes: The partition surrounding the base; and A sealing device, which is connected to a base and a partition plate, wherein the sealing device includes a base ring connected to the base and a spring connected to the base ring. The spring has an offset toward the compressed or extended position, which facilitates a basic seal between the partition plate and the base, thereby enabling basic fluid separation between the reaction space and the lower chamber space as the base moves up and down within the reaction chamber.

2. The reactor according to claim 1, wherein, The sealing system further includes a flow control ring disposed around the base and between the base and the partition plate, wherein the sealing device is disposed between the flow control ring and the partition plate such that the sealing device is connected to the base via the flow control ring, wherein a basic seal between the partition plate and the base is facilitated by a spring bias between the flow control ring and the partition plate.

3. The reactor according to claim 2, wherein, The sealing device is disposed between the upper surface of the flow control ring and the lower surface of the partition plate.

4. The reactor according to claim 3, wherein, The spring is biased toward the extended position such that a downward force from the spring is applied to the flow control ring, thereby generating a downward force on the base, resulting in a substantially sealed area between the flow control ring and the base, thereby creating a substantially fluid separation between the reaction space and the lower chamber space.

5. The reactor according to claim 3, wherein, The spring is fixedly connected to the base ring.

6. The reactor according to claim 5, wherein, The sealing device surrounds the base, wherein the spring includes a plurality of accordion plates, including a first accordion plate and an end accordion plate, and wherein each accordion plate spans between the flow control ring and the partition plate.

7. The reactor according to claim 6, wherein, The base ring includes a base inner diameter closest to the base, wherein the spring includes a spring inner diameter closest to the base, and wherein the base inner diameter is closer to the base than the spring inner diameter.

8. The reactor according to claim 7, wherein, The base ring includes a bottom surface abutting against the upper surface of the flow control ring and a radially inward surface abutting against the outer surface of the flow control ring, wherein the base ring also includes a chamfered surface spanning between the bottom surface and the radially inward surface of the base ring.

9. The reactor according to claim 8, wherein, The flow control ring also includes a chamfered surface spanning between the upper surface and the outer surface, which is complementary to the chamfered surface of the base ring.

10. The reactor according to claim 6, wherein, The base ring includes a top surface and a connecting protrusion projecting upward from the top surface, wherein the first accordion-style plate in the accordion-style plate is connected to the connecting protrusion.

11. The reactor according to claim 10, wherein, The first accordion-style plate includes a flat end surface that is connected to the connecting protrusion.

12. The reactor according to claim 11, wherein, The base ring includes a base inner diameter closest to the base, wherein the connecting protrusion is configured close to the base inner diameter.

13. The reactor according to claim 11, wherein, The end accordion-style plate is connected to or abuts against the partition plate.

14. The reactor according to claim 11, wherein, The sealing device further includes a second base ring connected to the end accordion plate, such that the spring spans between the base ring and the second base ring.

15. The reactor according to claim 14, wherein, The second base ring contacts the partition plate to create a basic seal between the second base ring and the partition plate.

16. The reactor according to claim 1, wherein, The mass of the base ring is at least three times the mass of the spring.

17. A sealing device for a reactor, comprising: Base ring; as well as A spring, fixedly connected to and extending from a base ring, wherein the spring includes a plurality of accordion-type plates spanning between a first accordion-type plate and an end accordion-type plate, and The base ring includes a base inner diameter, and the spring includes a spring inner diameter, wherein the base inner diameter is radially inward than the spring inner diameter.

18. The sealing device according to claim 17, wherein, The base ring includes a bottom surface, a radially inward surface, and a chamfered surface spanning between the bottom surface and the radially inward surface of the base ring.

19. The sealing device according to claim 17, wherein, The base ring includes a top surface and a connecting protrusion projecting from the top surface, wherein the first accordion-style plate in the accordion-style plate includes a flat end surface connected to the connecting protrusion.

20. A sealing system for a reactor, comprising: A partition plate configured to surround the base; A flow control loop configured to surround the base and disposed between the partition plate and the base; as well as Sealing device, including: Base ring; and A spring, fixedly connected to and extending from a base ring, includes a plurality of accordion-type plates, including a first accordion-type plate and an end accordion-type plate, wherein the base ring and the spring span between the upper-facing surface of the flow control ring and the lower-facing surface of the separator plate. The spring includes a spring bias to an extended position, configured to create a basic seal between the flow control ring and the separator.

Images