Anode assembly, electroplating device and electroplating method

Abstract

The application discloses an anode assembly, an electroplating device and an electroplating method. The anode assembly comprises a plurality of anode bodies, and a longitudinal section of each anode body in the plurality of anode bodies is a preset obtuse polygon. Compared with a square anode of a conventional electroplating device, the anode assembly provided by the application has the advantages that by being divided into a plurality of anode bodies, each anode body is cut into an obtuse polygon, the gathering of electric field lines in an edge region of the anode is reduced, the uniformity of the distribution of electric field lines at each position of the anode is improved, the electric field edge effect is weakened, and the uniformity of electroplating is ensured; the current density of each anode body is independently controlled, the electric field is more accurately controlled, and the electroplating uniformity and accuracy are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an anode component, an electroplating apparatus, and an electroplating method. Background Technology

[0002] Through Glass Via (TGV) plating is an advanced technology for forming conductive vias on glass substrates. By creating vias on the glass substrate and filling them with conductive materials (such as copper), vertical electrical interconnects are achieved. Compared with traditional Through Silicon Via (TSV) technology, TGV has advantages such as thermal stability, high insulation, and transparency, and is widely used in 3D packaging, MEMS (Micro-Electro-Mechanical Systems), radio frequency devices, and advanced packaging.

[0003] When vertical electroplating is performed on large square glass substrates, especially those with a high aspect ratio, to form conductive vias, square anodes are symmetrically placed on both sides of the substrate to replenish cations in the electroplating solution. Due to the large curvature of the edge area of ​​the square anode, the electric field will be enhanced in the sharp or edge area, forming an electric field edge effect. The electric field intensity in the edge area is higher, which leads to more metal ions being deposited on the substrate in this area, forming a thicker coating, resulting in uneven electroplating. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defect of uneven electroplating caused by the high electric field intensity in the edge area of ​​the square anodes set on both sides of the glass substrate in the prior art. The present invention provides an anode assembly, an electroplating apparatus and an electroplating method.

[0005] The present invention solves the above-mentioned technical problems through the following technical solution:

[0006] The present invention provides an anode assembly, the anode assembly comprising a plurality of anode bodies, wherein the longitudinal section of each anode body is a preset obtuse-angled polygon.

[0007] Preferably, at least one of the anode bodies has a longitudinal section that is a regular octagon.

[0008] Preferably, each of the anode bodies is connected to a power supply via an independent adjustable resistor to independently control the current density of each anode body.

[0009] Preferably, the plurality of anode bodies are arranged in a multi-grid pattern; the number of anode bodies arranged horizontally in the multi-grid pattern is the same as the number of anode bodies arranged vertically.

[0010] Preferably, the power source includes a first power source;

[0011] All anode bodies located in a horizontal region of the multi-grid are connected in parallel and each is connected to a first power supply via an independent adjustable resistor; and / or,

[0012] The power source includes a second power source;

[0013] All anode bodies located in the middle horizontal region of the multi-grid are connected in parallel and each is connected to the first power supply through an independent adjustable resistor; and / or,

[0014] The power source includes a third power source;

[0015] All anode bodies located in another horizontal region of the multi-grid are connected in parallel to the first power supply via independent adjustable resistors.

[0016] Preferably, the first power supply, the second power supply, and the third power supply are all pulse power supplies, and they are turned on or off synchronously to synchronize the pulse waveform of the entire anode assembly.

[0017] Preferably, the anode is made of a corrosion-resistant material; and / or,

[0018] Adjacent anodes are isolated by insulating material.

[0019] The present invention also provides an anode assembly, the anode assembly comprising a plurality of anode bodies, wherein at least one of the plurality of anode bodies has a predetermined circular cross-section.

[0020] The present invention also provides an electroplating apparatus, the electroplating apparatus comprising:

[0021] Control module, power module, and anode assembly as described above;

[0022] The control module is electrically connected to the power module;

[0023] The control module is used to send power supply commands to the power module;

[0024] The power module is used to supply power to all anode bodies when it receives the power supply command.

[0025] The present invention also provides an electroplating method, wherein the electroplating method uses the anode assembly described above or the electroplating apparatus described above to perform vertical electroplating.

[0026] The positive and progressive effects of this invention are as follows:

[0027] Compared to the square anodes of conventional electroplating devices, the anode assembly provided by this invention, by dividing the anode body into multiple regions, with each anode body cut into an obtuse-angled polygon, reduces the concentration of electric field lines at the edge region of the anode, improves the uniformity of the distribution of electric field lines throughout the anode, weakens the edge effect of the electric field, and ensures the uniformity of electroplating; each anode body independently controls the current density, which allows for more precise control of the electric field, and the two anode bodies do not affect each other, thus improving the uniformity and accuracy of electroplating. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0029] Figure 1 This is a side view schematic diagram of the TGV electroplating apparatus in Embodiment 1 of the present invention.

[0030] Figure 2 This is a schematic diagram of the anode assembly in Embodiment 1 of the present invention.

[0031] Figure 3 This is a schematic diagram of the longitudinal section of the anode body in Embodiment 1 of the present invention.

[0032] Figure 4 This is a schematic diagram of the electronic device in Embodiment 4 of the present invention. Detailed Implementation

[0033] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the document does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] It should be understood that the terms “device,” “system,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0036] As illustrated herein, unless the context clearly indicates otherwise, the words “a,” “an,” “an,” and / or “the” do not specifically refer to the singular and may also include the plural. Generally speaking, the terms “comprising” and “including” only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0037] The definitions used herein, such as the terms “having,” “may have,” “comprising,” or “may include,” indicate the presence of the corresponding function, operation, element, etc., and do not limit the presence of one or more other functions, operations, elements, etc. Furthermore, it should be understood that the terms “comprising” or “having” as used herein indicate the presence of the features, figures, steps, operations, elements, components, or combinations thereof described in the specification, without excluding the presence or addition of one or more other features, figures, steps, operations, elements, components, or combinations thereof.

[0038] Example 1

[0039] Please refer to Figure 1 This is a side view of the TGV electroplating apparatus in this embodiment, as shown below. Figure 1 As shown, when vertical electroplating is performed on large square glass substrates, especially those with a high depth-to-width ratio, to form conductive vias, anode components are symmetrically arranged on both sides of the substrate to replenish cations in the electroplating solution; an ion exchange membrane is arranged between the anode and cathode areas to maintain the chemical balance of the electroplating solution.

[0040] Please refer to Figure 2 This is a schematic diagram of the anode assembly in this embodiment, as shown below. Figure 2 As shown, the anode assembly includes several anode bodies 1, and the longitudinal section of each anode body is a preset obtuse-angled polygon.

[0041] Specifically, by cutting off all four corners of a conventional square anode, each corner can form two obtuse angles, which can reduce the accumulation of electric field lines in the anode edge region and weaken the electric field edge effect; this embodiment does not limit the specific way of forming the polygon. By dividing the anode into several anode bodies to form an anode assembly, the length of a single anode edge can be reduced, while the number of obtuse angles can be increased, thereby greatly reducing the accumulation of electric field lines in the anode edge region and weakening the electric field edge effect; preferably, adjacent anodes can be isolated by an insulating material 3, such as PP material, so that the isolated anode bodies do not affect each other's electric fields.

[0042] like Figure 2As shown, in one optional embodiment, the anode assembly includes nine anode bodies arranged in a 3x3 grid. It is worth noting that the 3x3 grid arrangement is a preferred embodiment, but this embodiment does not limit the number or arrangement of the anode bodies. For example, the anode assembly may also include six anode bodies arranged in a 6x6 grid; the anode assembly may also include twelve anode bodies arranged in a 12x12 grid.

[0043] Please refer to Figure 3 This is a schematic diagram of the longitudinal section of the anode body in this embodiment, as shown below. Figure 3 As shown, in one optional embodiment, at least one of the anode bodies has a longitudinal section that is a regular octagon. This is achieved by cutting off the four corners of a conventional square anode, resulting in an anode body with an octagonal outer contour in its longitudinal section. It is worth noting that while a regular octagon is a preferred embodiment, this embodiment does not limit the specific shape of the longitudinal section of the anode body; it can also be other obtuse-angled polygons.

[0044] like Figure 2 As shown, in this embodiment, each anode body is connected to the power supply through an independent adjustable resistor 2 to independently control the current density of each anode body.

[0045] Specifically, the power supply includes a first power supply, a second power supply, and a third power supply; Figure 2 In the 3x3 grid, the three anode bodies in the upper horizontal region are connected in parallel to the first power supply via independent adjustable resistors; the three anode bodies in the middle horizontal region of the 3x3 grid are connected in parallel to the first power supply via independent adjustable resistors; and the three anode bodies in the lower horizontal region of the 3x3 grid are connected in parallel to the first power supply via independent adjustable resistors. The first, second, and third power supplies are all pulse power supplies and are synchronously turned on or off to synchronize the pulse waveform of the entire anode assembly.

[0046] Each anode body connected to a power source is controlled in parallel. The current density of each anode body can be individually controlled by adjusting an adjustable resistor according to the operating conditions. For example, the adjustable resistor can be electronically controlled (e.g., a digital potentiometer) or mechanically controlled (e.g., a servo motor). There are no limitations, but remote control is preferred. Multiple power sources on a single anode can be turned on simultaneously without affecting the transmission of pulse signals, achieving precise control of the electroplating waveform.

[0047] In addition, the anode material is a corrosion-resistant material, such as a titanium plate. A soluble anode (such as a copper anode) is stacked on the titanium plate to replenish cations to the electroplating solution. The soluble anode can be added or replaced according to the actual situation.

[0048] The anode assembly provided in this embodiment divides the original monolithic square anode into multiple anode bodies, each of which is cut into polygons. This alters the electric field line distribution of the original square anode, reducing the concentration of electric field lines at the anode edges and improving the uniformity of the electric field line distribution throughout the anode, thus weakening the edge effect. The improved anode allows for easy replacement of the soluble anode with the cations required by the electroplating solution, depending on the electroplating conditions. It is convenient to operate and has a wide range of applications. By dividing the original square anode into multiple anode bodies, each anode body is insulated and isolated, ensuring that they do not affect each other's electric fields. The current density of each anode body can be individually adjusted, improving the uniformity and precision of electroplating.

[0049] Example 2

[0050] This embodiment provides an anode assembly comprising a plurality of anode bodies, at least one of which has a predetermined circular cross-section. Specifically, by replacing a conventional square anode with one or more anode bodies having a predetermined circular cross-section, the concentration of electric field lines at the anode edge region can be reduced, thus weakening the electric field edge effect.

[0051] Other parameters and settings of the anode assembly in this embodiment can be found in the anode assembly of Embodiment 1.

[0052] Example 3

[0053] This embodiment provides an electroplating apparatus, characterized in that the electroplating apparatus includes:

[0054] Control module, power supply module, and anode assembly of embodiment 1 or embodiment 2;

[0055] The control module is electrically connected to the power module;

[0056] The control module is used to send power supply commands to the power module;

[0057] The power module is used to supply power to all anode bodies when it receives the power supply command.

[0058] Example 4

[0059] This embodiment provides an electroplating method, wherein the electroplating method uses the anode assembly of Embodiment 1 or the electroplating apparatus of Embodiment 2 to perform vertical electroplating.

[0060] Example 5

[0061] Figure 4 This is a schematic diagram of an electronic device according to Embodiment 4 of the present invention. The electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the method of Embodiment 4. Figure 4 The electronic device 30 shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of the present invention.

[0062] like Figure 4 As shown, the electronic device 30 can be manifested as a general-purpose computing device, such as a server device. The components of the electronic device 30 may include, but are not limited to: at least one processor 31, at least one memory 32, and a bus 33 connecting different system components (including memory 32 and processor 31).

[0063] Bus 33 includes a data bus, an address bus, and a control bus.

[0064] The memory 32 may include volatile memory, such as random access memory (RAM) 321 and / or cache memory 322, and may further include read-only memory (ROM) 323.

[0065] The memory 32 may also include a program / utility 325 having a set (at least one) of program modules 324, including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0066] The processor 31 executes various functional applications and data processing, such as the method of Embodiment 4 of the present invention, by running computer programs stored in the memory 32.

[0067] Electronic device 30 can also communicate with one or more external devices 34 (e.g., keyboard, pointing device, etc.). This communication can be performed via input / output (I / O) interface 35. Furthermore, the model-generated device 30 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public network, such as the Internet) via network adapter 36. As shown, network adapter 36 communicates with other modules of the model-generated device 30 via bus 33. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with the model-generated device 30, including but not limited to: microcode, device drivers, redundant processors, external disk drive arrays, RAID (disk array) systems, tape drives, and data backup storage systems.

[0068] It should be noted that although several units / modules or sub-units / modules of the electronic device have been mentioned in the detailed description above, this division is merely exemplary and not mandatory. In fact, according to embodiments of the present invention, the features and functions of two or more units / modules described above can be embodied in one unit / module. Conversely, the features and functions of one unit / module described above can be further divided and embodied by multiple units / modules.

[0069] Example 6

[0070] This embodiment provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method of Embodiment 4.

[0071] The readable storage medium may be more specifically adopted, including but not limited to: portable disk, hard disk, random access memory, read-only memory, erasable programmable read-only memory, optical storage device, magnetic storage device, or any suitable combination thereof.

[0072] In a possible implementation, the present invention can also be implemented as a program product comprising program code that, when the program product is run on a terminal device, causes the terminal device to execute the method of embodiment 4.

[0073] The program code for executing the present invention can be written in any combination of one or more programming languages. The program code can be executed entirely on the user device, partially on the user device, as a standalone software package, partially on the user device and partially on a remote device, or entirely on a remote device.

[0074] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. An anode assembly, characterized in that, The anode assembly includes several anode bodies, and the longitudinal section of each anode body is a preset obtuse-angled polygon.

2. The anode assembly as described in claim 1, characterized in that, At least one of the anode bodies has a longitudinal section that is a regular octagon.

3. The anode assembly as described in claim 1, characterized in that, Each anode body is connected to a power supply via an independent adjustable resistor to independently control the current density of each anode body.

4. The anode assembly as described in claim 3, characterized in that, The plurality of anode bodies are arranged in a multi-grid pattern; the number of anode bodies arranged horizontally in the multi-grid pattern is the same as the number of anode bodies arranged vertically.

5. The anode assembly as described in claim 4, characterized in that, The power source includes a first power source; All anode bodies located in a horizontal region of the multi-grid are connected in parallel and each is connected to a first power supply via an independent adjustable resistor; and / or, The power source includes a second power source; All anode bodies located in the middle horizontal region of the multi-grid are connected in parallel and each is connected to the first power supply through an independent adjustable resistor; and / or, The power source includes a third power source; All anode bodies located in another horizontal region of the multi-grid are connected in parallel to the first power supply via independent adjustable resistors.

6. The anode assembly as described in claim 5, characterized in that, The first power supply, the second power supply, and the third power supply are all pulse power supplies, and they are turned on or off synchronously to synchronize the pulse waveform of the entire anode assembly.

7. The anode assembly as claimed in claim 1, characterized in that, The anode is made of a corrosion-resistant material; and / or, Adjacent anodes are isolated by insulating material.

8. An anode assembly, characterized in that, The anode assembly includes several anode bodies, and at least one of the anode bodies has a predetermined circular cross-section.

9. An electroplating apparatus, characterized in that, The electroplating apparatus includes: The control module, the power supply module, and the anode assembly as described in any one of claims 1-8; The control module is electrically connected to the power module; The control module is used to send power supply commands to the power module; The power module is used to supply power to all anode bodies when it receives the power supply command.

10. An electroplating method, characterized in that, The electroplating method uses the anode assembly as described in any one of claims 1-8 or the electroplating apparatus as described in claim 9 for vertical electroplating.

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