Temperature control device, energy storage device, control device, control method, and computer-readable storage medium

Abstract

The application provides a temperature regulating device, an energy storage device, a control device, a control method and a computer readable storage medium. The temperature regulating device comprises a pipeline module, a pump module, a valve module, a monitoring module and a control module. The pump module comprises a plurality of pump bodies. The valve module is connected to the pipeline module and the pump bodies respectively. The monitoring module is connected to the pipeline module and is used to monitor the flow resistance of the pipeline module. The control module is connected to the plurality of pump bodies, the valve module and the monitoring module and is used to control the valve module to adjust the number of pump bodies in communication with the pipeline module according to the flow resistance, so that the overall output lift of the pump module is dynamically matched with the flow resistance of the pipeline module, the risk of insufficient overall lift of the pump module leading to insufficient temperature regulating capacity of the temperature regulating device is avoided, the problem of excessive overall lift of the pump module leading to power consumption waste is avoided, and the overall reliability of the temperature regulating device is improved.

Description

Technical Field

[0001] This application relates to the field of energy storage technology, and in particular to a temperature control device, energy storage equipment, control device, control method, and computer-readable storage medium. Background Technology

[0002] In water-cooled units of energy storage devices, the temperature and amount of impurities in the coolant change over time, causing variations in the flow resistance of the pipes. In related technologies, the pump head of the water-cooled unit is fixed, which can easily lead to a mismatch between the pump head and the flow resistance of the pipes. Summary of the Invention

[0003] This application provides a temperature regulating device, energy storage device, control device, control method, and computer-readable storage medium to solve the problem of short circuits in cylindrical batteries.

[0004] In a first aspect, this application provides a temperature regulating device, which includes a pipeline module, a pump module, a valve module, a monitoring module, and a control module. The pump module includes multiple pump bodies. Valve modules are respectively connected to the pipeline module and the pump bodies. The monitoring module is connected to the pipeline module and is used to monitor the flow resistance of the pipeline module. The control module is connected to the multiple pump bodies, the valve module, and the monitoring module, and is used to control the valve module to adjust the number of pump bodies connected to the pipeline module according to the flow resistance.

[0005] In some embodiments, the number of pump bodies connected to the pipeline module is positively correlated with the magnitude of the flow resistance.

[0006] In some embodiments, the valve module includes a first connection mode and a second connection mode, wherein the number of pumps connected to the pipeline module in the second connection mode is greater than the number of pumps connected to the pipeline module in the first connection mode, and the control module is further configured to control the valve module to switch between the first connection mode and the second connection mode based on the flow resistance.

[0007] In some embodiments, in the second connection mode, at least a portion of the pump body connected to the pipeline module is connected in series.

[0008] In some embodiments, the pump body connected to the pipeline module stops operating when the flow resistance exceeds a threshold.

[0009] In some embodiments, the temperature control device further includes an alarm module connected to the control module. The control module is further configured to determine the flow resistance change rate based on the change value of the flow resistance per unit time, and to control the alarm module to issue an alarm when the flow resistance change rate is greater than a preset change rate and the flow resistance is greater than a warning flow resistance, wherein the warning flow resistance is less than the threshold.

[0010] In some embodiments, the pump body stops working when it is disconnected from the pipeline module.

[0011] In some embodiments, the pump module includes a first pump body and a second pump body. In the first connection mode, one of the first pump body and the second pump body is connected to the pipeline module. In the second connection mode, both the first pump body and the second pump body are connected to the pipeline module.

[0012] In some embodiments, when both the first pump body and the second pump body are connected to the pipeline module, the first pump body and the second pump body are connected in series.

[0013] In some embodiments, the valve module includes a first control valve and a second control valve, the first pump body and the second pump body are connected in series, the first control valve is connected in parallel with the first pump body, and the second control valve is connected in parallel with the second pump body.

[0014] In some embodiments, the monitoring module includes a first pressure detector and a second pressure detector, the first pressure detector and the second pressure detector being respectively connected to the pipeline module, the plurality of pump bodies being connected to the pipeline module at positions corresponding to the first pressure detector and the second pressure detector, the control module being respectively connected to the first pressure detector and the second pressure detector, and being used to receive first pressure data detected by the first pressure detector and second pressure data detected by the second pressure detector, and to determine the flow resistance based on the difference between the first pressure data and the second pressure data.

[0015] Secondly, this application provides an energy storage device, which includes an energy storage unit and a temperature regulating device as described in any of the above claims, wherein the temperature regulating device is connected to the energy storage unit.

[0016] Thirdly, this application provides a control method for a temperature regulating device, the control method being applied to any of the temperature regulating devices described above or the energy storage devices described above, the control method comprising: Obtain the flow resistance of the piping module; Based on the flow resistance, the control valve module adjusts the number of pumps connected to the pipeline module.

[0017] In some embodiments, the number of pump bodies connected to the pipeline module is positively correlated with the magnitude of the flow resistance.

[0018] In some embodiments, controlling the valve module to adjust the number of pump bodies connected to the pipeline module according to the flow resistance includes: Determine whether the flow resistance is greater than the preset flow resistance; When the flow resistance is less than or equal to the preset flow resistance, the valve module is controlled to be in the first connection mode; When the flow resistance is greater than the preset flow resistance, the valve module is controlled to be in a second connection mode. In the second connection mode, the number of pumps connected to the pipeline module is greater than the number of pumps connected to the pipeline module in the first connection mode.

[0019] In some embodiments, in the second connection mode, at least a portion of the pump body connected to the pipeline module is arranged in series.

[0020] In some embodiments, the step of controlling the valve module to adjust the number of pump bodies connected to the pipeline module according to the flow resistance further includes: Determine whether the flow resistance is greater than a threshold, wherein the threshold is greater than the preset flow resistance; When the flow resistance is greater than the threshold, the pump body connected to the pipeline module is controlled to stop working.

[0021] In some embodiments, the control method further includes: Obtain the rate of change of flow resistance of the pipeline module; Determine whether the rate of change of flow resistance is greater than a preset rate of change; Determine whether the flow resistance is greater than the warning flow resistance; When the rate of change of flow resistance is greater than the preset rate of change and the flow resistance is greater than the warning flow resistance, the control alarm module will issue an alarm. The warning flow resistance is greater than the preset flow resistance and less than the threshold.

[0022] In some embodiments, the step of controlling the valve module to adjust the number of pump bodies connected to the pipeline module according to the flow resistance further includes: The pump body, which is disconnected from the pipeline module, is stopped from operating.

[0023] Fourthly, this application provides a control device, which includes a memory and a processor. The memory is used to store program instructions, and the processor is used to invoke the program instructions to execute the control method described in any of the above-mentioned methods.

[0024] Fifthly, this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the control method described in any of the above claims.

[0025] The temperature control device, energy storage device, control device, control method, and computer-readable storage medium provided in this application, based on the control module controlling the valve module to adjust the number of pumps connected to the pipeline module according to the flow resistance of the pipeline module monitored by the monitoring module, enable the overall output head of the pump module to be dynamically adjusted, thereby dynamically matching the overall output head of the pump module with the flow resistance of the pipeline module. This avoids the risk of insufficient temperature control capability of the temperature control device due to insufficient overall head of the pump module, and avoids the problem of power consumption waste caused by excessive overall head of the pump module, thus improving the overall reliability of the temperature control device. On the other hand, it enables the pumps connected to the pipeline module to operate within the high-efficiency operating range, improving the working efficiency of the pumps and extending their service life. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a structural block diagram of the energy storage device provided in the embodiments of this application; Figure 2 This is a partial structural schematic diagram of the energy storage device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the pump head and flow rate, and the flow resistance and flow rate of the pipeline module provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of the pipeline module, pump module, and valve module provided in some embodiments of this application; Figure 5 This is a flowchart of the control method of the temperature regulating device provided in the embodiments of this application; Figure 6 This is a flowchart of a control method for a temperature regulating device provided in some embodiments of this application; Figure 7 This is a structural block diagram of the control device provided in the embodiments of this application.

[0028] Key reference numerals in the attached drawings: Energy storage device 1000; Energy storage unit 100; Temperature control device 200; Piping module 21; Pump module 22; Pump body 220; First pump body 221; Second pump body 222; Valve module 23; First control valve 231; Second control valve 232; Third control valve 233; Fourth control valve 234; Monitoring module 24; First pressure detector 241; Second pressure detector 242; Control module 25; Alarm module 26; Condenser 271; Throttling valve 272; Compressor 273; Heat exchanger 274; Heating module 275; Buffer tank 276; Control device 400; Memory 410; Processor 420.

[0029] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0031] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] It should be noted that the terminology in the specification, claims, and accompanying drawings of this application is for describing specific embodiments only and is not intended to limit this application. The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. The term "and / or" as used in this application refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations.

[0033] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a structural block diagram of the energy storage device 1000 provided in the embodiments of this application. Figure 2This is a partial structural schematic diagram of the energy storage device 1000 provided in an embodiment of this application. This application provides an energy storage device 1000. The energy storage device 1000 includes an energy storage unit 100 and a temperature control unit 200. The temperature control unit 200 is connected to the energy storage unit 100. The temperature control unit 200 is used to regulate the temperature of the energy storage unit 100 so that the energy storage unit 100 operates at a suitable temperature. Exemplarily, the energy storage device 1000 can be configured as a containerized energy storage cabinet. The energy storage device 1000 can be used to connect to power generation equipment such as solar panels and wind turbines to store electrical energy generated by the power generation equipment and to output electrical energy to the power grid. Of course, the energy storage device 1000 can also be configured as other devices, such as a residential energy storage device.

[0034] This application embodiment also provides a temperature control device 200. The temperature control device 200 includes a pipeline module 21, a pump module 22, a valve module 23, a monitoring module 24, and a control module 25. The pipeline module 21 is used to contain a temperature control medium. The temperature control medium can include, but is not limited to, gases, liquids, and gas-liquid mixtures. Gases can include, but are not limited to, air. Liquids include, but are not limited to, organic solutions, inorganic solutions, and mixed organic and inorganic solutions; for example, liquids can be water, salt water, oil, etc. The pump module 22 includes multiple pump bodies 220. The valve module 23 is connected to the pipeline module 21 and each pump body 220. When a pump body 220 is connected to the pipeline module 21, the pump body 220 can pump the temperature control medium during operation, causing the temperature control medium to flow in the pipeline module 21. The monitoring module 24 is connected to the pipeline module 21. The monitoring module 24 is used to monitor the flow resistance of the pipeline module 21. The control module 25 is connected to the multiple pump bodies 220, the valve module 23, and the monitoring module 24. The control module 25 is used to control the valve module 23 to adjust the number of pumps 220 connected to the pipeline module 21 according to the flow resistance. Thus, on the one hand, when the temperature, viscosity, or impurity content of the temperature-regulating medium changes, causing a change in the flow resistance of the pipeline module 21, the control module 25 controls the valve module 23 to adjust the number of pumps 220 connected to the pipeline module 21. This allows the overall output head of the pump module 22 to be dynamically adjusted, thereby dynamically matching the overall output head of the pump module 22 with the flow resistance of the pipeline module 21. This avoids the risk of insufficient temperature regulation capacity of the temperature-regulating device 200 due to insufficient overall head of the pump module 22, and also avoids the problem of power consumption waste caused by excessive overall head of the pump module 22, improving the overall reliability of the temperature-regulating device 200. On the other hand, it enables the pumps 220 connected to the pipeline module 21 to operate within their high-efficiency operating range, improving the working efficiency of the pumps 220 and extending their service life.

[0035] Furthermore, the structure of pipeline modules varies in different energy storage devices. Changes in the elbows, valves, inner diameter of the pipeline, and the cold plate process structure can alter the flow resistance of the pipeline module. In related technologies, the pump head of water-cooled units is fixed, and a mismatch often occurs between the pump head and the flow resistance of the pipeline module. This necessitates customization of the pump head, leading to high costs and long production cycles for the temperature control device. In this embodiment, the pump module 22 includes multiple pump bodies 220. The control module 25, based on the flow resistance of the pipeline module 21 monitored by the monitoring module 24, controls the valve module 23 to adjust the number of pump bodies 220 connected to the pipeline module 21. This makes the overall head of the pump module 22 adjustable, matching the overall head of the pump module 22 with the flow resistance of the pipeline module 21. This allows the pump module 22 to use conventional pump bodies 220 without requiring special customization, reducing the design and manufacturing costs and production cycle of the temperature control device 200.

[0036] Multiple pump bodies 220 can be connected to the piping module 21 respectively. A valve module 23 is used to regulate the connection or disconnection of at least a portion of the multiple pump bodies 220 with the piping module 21. Connection between a pump body 220 and the piping module 21 can mean that all or most of the temperature-regulating medium in the piping module 21 flows through the pump body 220, which pumps the temperature-regulating medium during operation, applying a driving force to the medium and causing it to flow within the piping module 21. Disconnection between a pump body 220 and the piping module 21 can mean that the inlet and / or outlet of the pump body 220 is isolated from the piping module 21, or it can mean that the inlet and outlet of the pump body 220 are connected by a bypass pipeline, with all or most of the temperature-regulating medium flowing through the bypass pipeline, and the medium not flowing or substantially not flowing through the pump body 220 disconnected from the piping module 21.

[0037] The number of pumps 220 connected to the pipeline module 21 is positively correlated with the flow resistance. Higher flow resistance makes the flow of the temperature-regulating medium in the pipeline module 21 more difficult. Increasing the number of pumps 220 connected to the pipeline module 21 increases the overall head of the pump module 22, enhancing its pumping capacity for the temperature-regulating medium. This allows the medium to overcome flow resistance, ensuring smooth flow within the pipeline module 21 and enabling the temperature-regulating module to properly regulate the temperature of the energy storage device 100. Conversely, lower flow resistance results in smoother flow of the temperature-regulating medium in the pipeline module 21. Reducing the number of pumps 220 connected to the pipeline module 21 decreases the overall head of the pump module 22, matching its pumping capacity to the flow resistance of the medium. This reduces power consumption waste and helps maintain the temperature of the energy storage device 100 within a suitable range.

[0038] Valve module 23 includes a first connection mode and a second connection mode. In the second connection mode, the number of pump bodies 220 connected to pipeline module 21 is greater than the number of pump bodies 220 connected to pipeline module 21 in the first connection mode. When valve module 23 is in the first connection mode, the number of pump bodies 220 connected to pipeline module 21 is the first number. When valve module 23 is in the second connection mode, the number of pump bodies 220 connected to pipeline module 21 is the second number. The second number is greater than the first number. The first number can be one or more. The second number can be multiple. Control module 25 is also used to control valve module 23 to switch between the first connection mode and the second connection mode based on flow resistance.

[0039] In some embodiments, the control module 25 is further configured to control the valve module 23 to be in a first connection mode when the flow resistance is less than or equal to a preset flow resistance. The control module 25 is also configured to control the valve module 23 to be in a second connection mode when the flow resistance is greater than the preset flow resistance. The preset flow resistance can be configured as the maximum flow resistance corresponding to the operation of a first number of pumps 220 together, maintaining the rated output flow rate required by the pipeline module 21. When the flow resistance is less than or equal to the preset flow resistance, the output flow rate when the first number of pumps 220 are working together is greater than or equal to the rated flow rate required by the pipeline module 21, and the temperature control device 200 can normally regulate the temperature of the energy storage device 100. When the flow resistance is greater than the preset flow resistance, the output flow rate when the first number of pumps 220 are working together is less than the rated flow rate required by the pipeline module 21, and the temperature control device 200's temperature regulation capability for the energy storage device 100 is insufficient. In this embodiment, by controlling the valve module 23 to be in a second connection mode when the flow resistance of the control module 25 is greater than the preset flow resistance, the number of pump bodies 220 connected to the pipeline module 21 is increased from a first number to a second number. This increases the number of pump bodies 220 connected to the pipeline module 21, thereby increasing the overall output head and output flow of the pump module 22. This ensures that the output flow of the pump module 22 meets the rated flow required by the pipeline module 21, enabling the temperature control device 200 to properly regulate the temperature of the energy storage device 100, which is beneficial for ensuring the normal operation of the energy storage device 100. In some embodiments, the preset flow resistance can also be set according to actual needs, and this application does not impose specific limitations. For example, the preset flow resistance can also be set based on historical data of the temperature control device 200 or user experience data.

[0040] Please refer to the following: Figure 1 , Figure 2 and Figure 3 , Figure 3 This is a schematic diagram of the pump body 220 head and flow rate, and the pipeline module 21 flow resistance and flow rate provided in the embodiments of this application. Figure 3The dashed line represents the head and flow rate curve of a single pump body 220, and the solid line represents the flow resistance and flow rate curve of the pipeline module 21. For example, in the first connection mode, the control module 25 can control the valve module 23 to adjust the number of pump bodies 220 connected to the pipeline module 21 to one. The preset flow resistance can be selected based on the intersection of the head and flow rate curves of the single pump body 220 and the flow resistance and flow rate curves of the pipeline module 21. For example, the head of the single pump body 220 can be configured to 20m. The preset flow resistance can be set to 100kPa.

[0041] In some embodiments, in the first connection mode, the control module 25 can also control the valve module 23 to adjust the number of pumps 220 connected to the pipeline module 21 to be multiple. The preset flow resistance can be selected based on the intersection of the head and flow rate curves of the multiple pumps 220 and the flow resistance and flow rate curves of the pipeline module 21. The number of multiple pumps 220 is the number of pumps 220 connected to the pipeline module 21 in the first connection mode.

[0042] In some embodiments, when the valve module 23 is in the second connection mode, at least a portion of the pump body 220 connected to the pipeline module 21 is connected in series to increase the overall pumping head of the pump module 22 and improve the ability of the temperature-regulating medium to overcome flow resistance, thereby matching the head of the pump module 22 with the flow resistance of the pipeline module 21. When multiple pump bodies 220 are connected in series, the overall pumping head of the pump module 22 is or approximately the sum of the output heads of the multiple pump bodies 220.

[0043] In some embodiments, when the valve module 23 is in the second connection mode, the pump bodies 220 connected to the pipeline module 21 can be arranged in parallel to increase the overall pumping flow of the pump module 22. In some embodiments, when the valve module 23 is in the second connection mode, some pump bodies 220 can be arranged in series and some pump bodies 220 can be arranged in parallel.

[0044] In some embodiments, the pump 220 connected to the piping module 21 stops operating when the flow resistance exceeds a threshold, thereby reducing the risk of damage to the piping module 21 and the pump 220. The control module 25 is further configured to control the pump 220 connected to the piping module 21 to stop operating when the flow resistance is greater than the threshold. The threshold is greater than a preset flow resistance. The threshold is configured as the maximum operating flow resistance of the piping module 21. The threshold can be configured as the maximum flow resistance corresponding to the operation of all pumps 220 (e.g., a second number of pumps 220) to maintain the required rated output flow of the piping module 21. For example, the threshold can be set to 500 kPa. When the flow resistance is greater than the threshold, the flow of the temperature-regulating medium in the piping module 21 is obstructed, causing a blockage fault in the piping module 21. The control module 25 controls the pump 220 connected to the piping module 21 to stop operating, which helps reduce the pressure of the temperature-regulating medium in the piping module 21 and reduces the risk of failure of the temperature-regulating device 200. The control module 25 can also send a fault shutdown signal to the host computer in the energy storage device 1000 to alert the user that the temperature control module has a blockage fault. In some embodiments, the threshold can also be set according to actual needs, and is not specifically limited in this application. For example, the threshold can also be set based on historical data of the temperature control device 200 or user experience data.

[0045] The control module 25 is also used to control the operation of the pump body 220 connected to the pipeline module 21. The control module 25 is also used to control the pump body 220 disconnected from the pipeline module 21 to stop working, so as to reduce the power consumption waste of the temperature control device 200, improve working efficiency, and reduce the risk of pump body 220 failure.

[0046] In some embodiments, when controlling the operation of the pump body 220 connected to the pipeline module 21, the control module 25 is also used to control the rotational speed of the pump body 220. By adjusting the rotational speed of the pump body 220, the overall head of the pump module 22 is fine-tuned, improving the matching degree between the overall head of the pump module 22 and the flow resistance of the pipeline module 21. Thus, the temperature control device 200 adjusts the number of pump bodies 220 connected to the pipeline module 21 through the valve module 23 to achieve coarse adjustment of the overall head of the pump module 22, and fine-tunes the overall head of the pump module 22 by adjusting the rotational speed of the pump body 220. Through the combination of coarse and fine adjustments, the matching degree between the overall head of the pump module 22 and the flow resistance of the pipeline module 21 is improved, which is beneficial to improving the temperature control capability of the temperature control device 200, reducing power consumption waste, and improving the overall reliability of the temperature control device 200.

[0047] For example, the number of pump bodies 220 can be set to two. Of course, the number of pump bodies 220 can also be set to other numbers as needed, and this application does not make a specific limitation. For example, the number of pump bodies 220 can also be set to three, four, etc.

[0048] Pump module 22 includes a first pump body 221 and a second pump body 222. When valve module 23 is in a first connection mode, one of the first pump body 221 and the second pump body 222 is connected to pipeline module 21. When valve module 23 is in a second connection mode, both the first pump body 221 and the second pump body 222 are connected to pipeline module 21. Control module 25 is used to control valve module 23 to be in the first connection mode when the flow resistance is less than or equal to a preset flow resistance, so that valve module 23 adjusts the connection between one of the first pump body 221 and the second pump body 222 and pipeline module 21, so that temperature control device 200 is in single-pump operation state, and the head of pump module 22 matches the flow resistance of pipeline module 21. The control module 25 is also used to control the valve module 23 to be in the second connection mode when the flow resistance is greater than the preset flow resistance, so that the valve module 23 adjusts the first pump body 221 and the second pump body 222 to be connected to the pipeline module 21, so that the temperature control device 200 is in the dual pump operation state, so that the head of the pump module 22 matches the flow resistance of the pipeline module 21, thereby improving the overall head and flow rate of the pump module 22.

[0049] In the second connection mode, when both the first pump body 221 and the second pump body 222 are connected to the pipeline module 21, the first pump body 221 and the second pump body 222 can be arranged in series to increase the overall head of the pump module 22. After the first pump body 221 and the second pump body 222 are connected in series, the overall head of the pump module 22 is the sum of the head of the first pump body 221 and the head of the second pump body 222.

[0050] Valve module 23 includes a first control valve 231 and a second control valve 232. A first pump body 221 and a second pump body 222 are connected in series. The first control valve 231 is connected in parallel with the first pump body 221. The second control valve 232 is connected in parallel with the second pump body 222. When valve module 23 is in a first connection mode, one of the first control valve 231 and the second control valve 232 is closed, and the other is open. The temperature regulating medium can flow through the open control valve due to the lack of obstruction, and flows through the first pump body 221 or the second pump body 222 under the obstruction of the closed control valve. When valve module 23 is in the first connection mode, the first control valve 231 can be in the closed state and the second control valve 232 can be in the open state. The temperature regulating medium is blocked by the first control valve 231 and flows through the first pump body 221. Since there is no obstruction at the second control valve 232, it flows through the second control valve 232, thereby connecting the first pump body 221 with the pipeline module 21 and disconnecting the second pump body 222 from the pipeline module 21. Alternatively, the first control valve 231 can be in the open state and the second control valve 232 can be in the closed state. The temperature regulating medium flows through the first control valve 231 without obstruction and is blocked by the second control valve 232 and flows through the second pump body 222, thereby disconnecting the first pump body 221 from the pipeline module 21 and connecting the second pump body 222 to the pipeline module 21.

[0051] When valve module 23 is in the second connection mode, the first control valve 231 and the second control valve 232 are closed respectively, and the temperature regulating medium flows through the first pump body 221 and the second pump body 222 in sequence under the obstruction of the first control valve 231 and the second control valve 232.

[0052] Please see Figure 4 , Figure 4This is a schematic diagram of the piping module 21, pump module 22, and valve module 23 provided in some embodiments of this application. In some embodiments, the valve module 23 further includes a third control valve 233 and a fourth control valve 234. The third control valve 233 is connected to the inlet side or the outlet side of the first pump body 221. The fourth control valve 234 is connected to the inlet side or the outlet side of the second pump body 222. When valve module 23 is in the first connection mode, the first control valve 231 and the fourth control valve 234 can be in the closed state, and the second control valve 232 and the third control valve 233 can be in the open state. The temperature regulating medium is blocked by the fourth control valve 234 and cannot flow through the second pump body 222. The temperature regulating medium flows through the third control valve 233, the first pump body 221 and the second control valve 232 in sequence. Alternatively, the first control valve 231 and the fourth control valve 234 can be in the open state, and the second control valve 232 and the third control valve 233 can be in the closed state. The temperature regulating medium is blocked by the third control valve 233 and cannot flow through the first pump body 221. The temperature regulating medium flows through the first control valve 231, the fourth control valve 234 and the second pump body 222 in sequence.

[0053] Please refer to the following: Figure 1 and Figure 2 The monitoring module 24 includes a first pressure detector 241 and a second pressure detector 242. The first pressure detector 241 and the second pressure detector 242 are respectively connected to the pipeline module 21. The pump module 22 is connected to the pipeline module 21 at the position corresponding to the first pressure detector 241 and the second pressure detector 242. Other components may be provided between the first pressure detector 241 and the pump module 22, and between the second pressure detector 242 and the pump module 22, or no other components may be provided. The control module 25 is connected to the first pressure detector 241 and the second pressure detector 242, and is used to receive first pressure data detected by the first pressure detector 241 and second pressure data detected by the second pressure detector 242. The control module 25 is also used to determine the flow resistance of the pipeline module 21 based on the difference between the first pressure data and the second pressure data. The flow resistance of the pipeline module 21 is the pressure change value of the portion of the pipeline module 21 between the first pressure detector 241 and the second pressure detector 242. The larger the pressure change value, the larger the flow resistance. Control module 25 is also used to determine the rate of change of flow resistance based on the change in flow resistance per unit time. The unit time can be, for example, 1 second. The larger the change value, the greater the rate of change of flow resistance, indicating that the flow resistance of pipeline module 21 increases more rapidly.

[0054] In some embodiments, the temperature control device 200 further includes an alarm module 26. The alarm module 26 is connected to the control module 25. The control module 25 is also used to determine the flow resistance change rate based on the change value of the flow resistance per unit time, and to control the alarm module 26 to sound an alarm when the flow resistance change rate is greater than a preset change rate and the flow resistance is greater than a warning flow resistance, so as to provide the user with a blockage warning and facilitate the user to troubleshoot the working condition of the temperature control device 200. The warning flow resistance is greater than the preset flow resistance but less than a threshold. When the flow resistance change rate is greater than the preset change rate, the increasing trend of the flow resistance of the temperature control medium in the pipeline module 21 is abnormal, and the risk of blockage failure in the pipeline module 21 increases. When the flow resistance change rate is less than or equal to the preset flow resistance, the flow resistance of the temperature control medium in the pipeline module 21 is in normal fluctuation, and the control module 25 can control the working status of the valve module 23 and the pump body 220 according to the flow resistance of the pipeline module 21. When the flow resistance is greater than the warning flow resistance, the flow resistance in the pipeline module 21 is at a large value, and the risk of blockage failure in the pipeline module 21 is correspondingly greater. When the flow resistance is greater than the warning flow resistance but less than or equal to the threshold, although the flow resistance in the pipeline module 21 is relatively large, it is still less than the maximum operating flow resistance of the pipeline module 21, so the pump module 22 can still operate normally. When the flow resistance is less than the warning flow resistance, the flow resistance in the pipeline module 21 is at a relatively small value, and the risk of blockage failure in the pipeline module 21 is correspondingly smaller, so the pump module 22 can operate normally. Specifically, the control module 25 can control the pump body 220 connected to the pipeline module 21 to operate normally when the flow resistance change rate is greater than the preset change rate, the flow resistance is greater than the warning flow resistance, and the flow resistance is less than or equal to the threshold. The magnitudes of the warning flow resistance and the preset change rate can be specifically set according to actual needs, and are not specifically limited in this application. For example, the magnitudes of the warning flow resistance and the preset change rate can be set based on historical data of the temperature control device 200 or user experience data. For example, the warning flow resistance can be configured to be greater than or equal to 300 kPa and less than 500 kPa.

[0055] In some embodiments, the control module 25 is further configured to control the alarm module 26 to issue an alarm when the flow resistance is greater than a threshold, so as to prompt the user that the flow resistance of the temperature control device 200 is too high.

[0056] In some embodiments, the temperature control device 200 may further include at least one of a condenser 271, a throttle valve 272, a compressor 273, a heat exchanger 274, a heating module 275, and a buffer tank 276. The piping module 21 includes a first circuit and a second circuit. The condenser 271, throttle valve 272, and compressor 273 are connected to the first circuit. The pump module 22, valve module 23, monitoring module 24, energy storage device 100, heating module 275, and buffer tank 276 are connected to the second circuit. The heat exchanger 274 is connected between the first circuit and the second circuit. A refrigerant may be provided in the first circuit. A temperature-regulating medium may be provided in the second circuit. When the temperature control device 200 is cooling, the compressor 273 compresses the refrigerant, reducing its volume or changing it from a gaseous to a liquid state, thus increasing its temperature. After flowing through the condenser 271, the refrigerant exchanges heat with the outside air, lowering its temperature. When the refrigerant flows through the expansion valve 272, its volume expands or changes from a liquid to a gaseous state, further decreasing its temperature. As the refrigerant flows through the heat exchanger 274, it cools the temperature control medium in the second loop. The cooled temperature control medium then dissipates heat from the energy storage device 100 as it flows through the energy storage device 100. When the temperature control device 200 is heating, the heating module 275 operates to heat the temperature control medium. The heated temperature control medium then heats the energy storage device 100 as it flows through the energy storage device 100. The buffer tank 276 buffers the temperature control medium in the second loop, preventing excessive pressure and absorbing pressure fluctuations, thus stabilizing the pressure of the temperature control medium in the pipeline module 21. The heat exchanger 274 can be configured as a plate heat exchanger. The heating module 275 can be configured as a PTC (Positive Temperature Coefficient) heater. The PTC heater generates heat after being energized, thereby heating the temperature-regulating medium.

[0057] In some embodiments, the energy storage device 100 is connected to the pipeline module 21 at the position corresponding to the first pressure detector 241 and the second pressure detector 242. The heat exchanger 274, heating module 275, and buffer tank 276 are connected to the pipeline module 21 at the position corresponding to the first pressure detector 241 and the pump module 22. The flow resistance of the pipeline module 21 is the pressure change value generated after the temperature-regulating medium flows through the energy storage device 100.

[0058] Please refer to the following: Figure 1 , Figure 2 and Figure 5 , Figure 5 This is a flowchart of a control method for a temperature regulating device 200 provided in an embodiment of this application. The control method can be applied to the temperature regulating device 200 in any embodiment of this application, or to the energy storage device 1000 in any embodiment of this application. The control method comprises the following steps.

[0059] Step 310: Obtain the flow resistance of the pipeline module.

[0060] Step 320: Based on the flow resistance, the control valve module adjusts the number of pumps connected to the pipeline module.

[0061] Thus, on the one hand, when the flow resistance of the temperature-regulating medium in the pipeline module 21 changes, the number of pumps 220 connected to the pipeline module 21 can be adjusted by controlling the valve module 23, so that the overall output head of the pumps 220 connected to the pipeline module 21 can be dynamically adjusted. This allows the overall output head of the pumps 220 connected to the pipeline module 21 to be dynamically matched with the flow resistance of the pipeline module 21, avoiding the risk of insufficient temperature regulation capacity of the temperature regulating device 200 due to insufficient overall head of the pumps 220 connected to the pipeline module 21, and avoiding the problem of power consumption waste caused by excessive overall head of the pumps 220 connected to the pipeline module 21, thereby improving the overall reliability of the temperature regulating device 200. On the other hand, it enables the pumps 220 connected to the pipeline module 21 to operate within the high-efficiency operating range, improving the working efficiency of the pumps 220 and extending the working life of the pumps 220.

[0062] In step 320, the number of pumps 220 connected to the piping module 21 is positively correlated with the magnitude of the flow resistance. The greater the flow resistance, the more difficult it is for the temperature-regulating medium to flow in the piping module 21. By increasing the number of pumps 220 connected to the piping module 21, the overall head of the pump module 22 can be increased, improving its pumping capacity for the temperature-regulating medium. This allows the temperature-regulating medium to overcome flow resistance and flow smoothly within the piping module 21, enabling the temperature-regulating module to properly regulate the temperature of the energy storage device 100. Conversely, the smaller the flow resistance, the easier it is for the temperature-regulating medium to flow in the piping module 21. By reducing the number of pumps 220 connected to the piping module 21, the overall head of the pump module 22 can be reduced, matching the pumping capacity of the pump module 22 to the flow resistance of the temperature-regulating medium and reducing power consumption waste in the pump module 22.

[0063] Please refer to the following: Figure 1 , Figure 5 and Figure 6 , Figure 6 This is a flowchart of a control method for a temperature regulating device 200 provided in some embodiments of this application. In some embodiments, step 320 includes: Step 321: Determine whether the flow resistance is greater than the preset flow resistance; Step 322: When the flow resistance is less than or equal to the preset flow resistance, control the valve module to be in the first connection mode.

[0064] The setting method for the preset flow resistance can be referred to above, as can the structure and setting method of the pump body 220 and valve module 23. They will not be described in detail here.

[0065] Step 323: When the flow resistance is greater than the preset flow resistance, control the valve module to be in the second connection mode. In the second connection mode, the number of pumps connected to the pipeline module is greater than the number of pumps connected to the pipeline module in the first connection mode.

[0066] When the flow resistance is greater than the preset flow resistance, the valve module 23 is controlled to be in the second connection mode, which increases the number of pumps 220 connected to the pipeline module 21, thereby increasing the overall output head and output flow of the pumps 220 connected to the pipeline module 21. This ensures that the output flow of the pumps 220 connected to the pipeline module 21 meets the rated flow required by the pipeline module 21, enabling the temperature control device 200 to properly regulate the temperature of the energy storage device 100, which is beneficial to ensuring the normal operation of the energy storage device 100.

[0067] In the second connection mode, at least a portion of the pump body 220 connected to the pipeline module 21 is connected in series to increase the overall pumping head of the pump module 22 and improve the ability of the temperature-regulating medium to overcome flow resistance, thereby matching the head of the pump module 22 with the flow resistance of the pipeline module 21.

[0068] In some embodiments, step 320 further includes: Step 324: Determine whether the flow resistance is greater than a threshold value, wherein the threshold value is greater than the preset flow resistance.

[0069] Step 325: When the flow resistance is greater than the threshold, control the pump body connected to the pipeline module to stop working.

[0070] The threshold is configured as the maximum operating flow resistance of the piping module 21. The threshold can be configured as the maximum flow resistance required for all pumps 220 to operate together and maintain the rated output flow rate of the piping module 21. When the flow resistance exceeds the threshold, the flow of the temperature-regulating medium in the piping module 21 is obstructed, causing a blockage fault. The control module 25 then controls the pumps 220 connected to the piping module 21 to stop operating, which helps reduce the pressure of the temperature-regulating medium in the piping module 21 and reduces the risk of malfunction of the temperature-regulating device 200.

[0071] In some embodiments, the control method further includes: Step 326: Obtain the flow resistance change rate of the pipeline module.

[0072] The flow resistance change rate can be determined based on the change in flow resistance per unit time.

[0073] Step 327: Determine whether the rate of change of flow resistance is greater than the preset flow resistance.

[0074] Step 328: Determine whether the flow resistance is greater than the warning flow resistance.

[0075] Step 329: When the flow resistance change rate is greater than the preset change rate and the flow resistance is greater than the warning flow resistance, the alarm module is controlled to issue an alarm. The warning flow resistance is greater than the preset flow resistance and less than the threshold.

[0076] Specifically, when the rate of change of flow resistance is greater than the preset rate of change, the increasing trend of the flow resistance of the temperature-regulating medium in the pipeline module 21 becomes abnormal, increasing the risk of blockage failure in the pipeline module 21. When the rate of change of flow resistance is less than or equal to the preset flow resistance, the flow resistance of the temperature-regulating medium in the pipeline module 21 fluctuates normally, and the control module 25 can control the operation of the valve module 23 and the pump body 220 according to the magnitude of the flow resistance of the pipeline module 21.

[0077] When the flow resistance is greater than the warning flow resistance, the flow resistance in pipe module 21 is at a relatively high value, and the risk of blockage failure in pipe module 21 is correspondingly higher. When the flow resistance is greater than the warning flow resistance but less than or equal to the threshold, although the flow resistance in pipe module 21 is relatively high, it is still less than the maximum operating flow resistance of pipe module 21, so pump module 22 can still operate normally. When the flow resistance is less than the warning flow resistance, the flow resistance in pipe module 21 is at a relatively low value, the risk of blockage failure in pipe module 21 is correspondingly lower, and pump module 22 can operate normally.

[0078] When the rate of change of flow resistance is greater than the preset rate of change and the flow resistance is greater than the warning flow resistance, the alarm module 26 will be activated to provide users with a blockage warning, making it easier for users to troubleshoot the working condition of the temperature control device 200.

[0079] Specifically, when the rate of change of flow resistance is greater than the preset rate of change, the flow resistance is greater than the warning flow resistance, and the flow resistance is less than or equal to the threshold, the pump body 220 connected to the pipeline module 21 can be controlled to operate normally. The magnitudes of the warning flow resistance and the preset rate of change can be set according to actual needs, and are not specifically limited in this application.

[0080] In some embodiments, step 320 further includes: Step 330: Control the pump body, which is disconnected from the pipeline module, to stop working.

[0081] By controlling the pump body 220, which is disconnected from the pipeline module 21, to stop working, the power consumption of the temperature control device 200 can be reduced, the working efficiency can be improved, and the risk of pump body 220 failure can be reduced.

[0082] The order of steps 321-330 can be adjusted as needed, and no specific limitation is made in this application.

[0083] Please see Figure 7 , Figure 7 This is a structural block diagram of the control device 400 provided in an embodiment of this application. An embodiment of this application also provides a control device 400. The control device 400 includes a memory 410 and a processor 420. The memory 410 is used to store program instructions, and the processor 420 is used to execute any of the control methods described above by running or executing computer programs and / or modules stored in the memory 410, and by calling program instructions. For example, the processor 420 is also used to execute... Figure 5 Steps 310 to 320 in the process Figure 6 Steps 321 to 330 are described above. Specifically, memory 410 stores program code, and processor 420 calls the program code in memory 410 to execute all the steps in the control method described above.

[0084] The memory 410 may primarily include a program storage area and a data storage area. The program storage area may store the operating system, applications required for multiple functions, etc.; the data storage area may store data created according to the operating system, data generated by the applications, etc. Furthermore, the memory 410 may include high-speed random access memory, and may also include non-volatile memory, such as hard disks, RAM, plug-in hard disks, smart media cards (SMC), secure digital cards (SD cards), flash cards, multiple disk storage devices, flash memory devices, or other volatile solid-state storage devices.

[0085] The processor 420 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0086] In some embodiments, this application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, it implements the steps of the control method as described in any embodiment of this application. The computer-readable storage medium includes, but is not limited to, various media capable of storing program code, such as USB flash drives, portable hard drives, magnetic disks, optical disks, read-only memory (ROM), or random access memory (RAM).

[0087] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0088] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A temperature regulating device, characterized in that, include: Piping module; The pump module includes multiple pump bodies; Valve modules are respectively connected to the pipeline module and each of the pump bodies; A monitoring module is connected to the pipeline module, and the monitoring module is used to monitor the flow resistance of the pipeline module; A control module is connected to the plurality of pump bodies, the valve module, and the monitoring module. The control module is used to control the valve module to adjust the number of pump bodies connected to the pipeline module according to the flow resistance.

2. The temperature regulating device according to claim 1, characterized in that, The number of pump bodies connected to the pipeline module is positively correlated with the magnitude of the flow resistance.

3. The temperature regulating device according to claim 1, characterized in that, The valve module includes a first connection mode and a second connection mode. In the second connection mode, the number of pumps connected to the pipeline module is greater than the number of pumps connected to the pipeline module in the first connection mode. The control module is also used to control the valve module to switch between the first connection mode and the second connection mode according to the flow resistance.

4. The temperature regulating device according to claim 3, characterized in that, In the second connection mode, at least a portion of the pump body connected to the pipeline module is connected in series.

5. The temperature regulating device according to claim 3, characterized in that, The pump body connected to the pipeline module stops working when the flow resistance exceeds the threshold.

6. The temperature regulating device according to claim 5, characterized in that, The temperature control device also includes an alarm module, which is connected to the control module. The control module is further configured to determine the flow resistance change rate based on the change value of the flow resistance per unit time, and to control the alarm module to issue an alarm when the flow resistance change rate is greater than a preset change rate and the flow resistance is greater than a warning flow resistance, wherein the warning flow resistance is less than the threshold.

7. The temperature regulating device according to claim 1, characterized in that, When the pump body is disconnected from the pipeline module, the pump body stops working.

8. The temperature regulating device according to claim 3, characterized in that, The pump module includes a first pump body and a second pump body. In the first connection mode, one of the first pump body and the second pump body is connected to the pipeline module. In the second connection mode, both the first pump body and the second pump body are connected to the pipeline module.

9. The temperature regulating device according to claim 8, characterized in that, When both the first pump body and the second pump body are connected to the pipeline module, the first pump body and the second pump body are connected in series.

10. The temperature regulating device according to claim 8, characterized in that, The valve module includes a first control valve and a second control valve. The first pump body and the second pump body are connected in series, the first control valve is connected in parallel with the first pump body, and the second control valve is connected in parallel with the second pump body.

11. The temperature regulating device according to claim 1, characterized in that, The monitoring module includes a first pressure detector and a second pressure detector, which are respectively connected to the pipeline module. The plurality of pumps are connected to the pipeline module at positions corresponding to the first and second pressure detectors. The control module is connected to the first and second pressure detectors respectively and is used to receive first pressure data detected by the first pressure detector and second pressure data detected by the second pressure detector, and to determine the flow resistance based on the difference between the first pressure data and the second pressure data.

12. An energy storage device, characterized in that, The energy storage device includes an energy storage unit and a temperature control device as described in any one of claims 1-11, wherein the temperature control device is connected to the energy storage unit.

13. A control method for a temperature regulating device, characterized in that, The control method is applied to the temperature regulating device as described in any one of claims 1-11 or the energy storage device as described in claim 12, and the control method includes: Obtain the flow resistance of the piping module; Based on the flow resistance, the control valve module adjusts the number of pumps connected to the pipeline module.

14. The control method according to claim 13, characterized in that, The number of pump bodies connected to the pipeline module is positively correlated with the magnitude of the flow resistance.

15. The control method according to claim 13, characterized in that, The step of controlling the valve module to adjust the number of pumps connected to the pipeline module according to the flow resistance includes: Determine whether the flow resistance is greater than the preset flow resistance; When the flow resistance is less than or equal to the preset flow resistance, the valve module is controlled to be in the first connection mode; When the flow resistance is greater than the preset flow resistance, the valve module is controlled to be in a second connection mode. In the second connection mode, the number of pumps connected to the pipeline module is greater than the number of pumps connected to the pipeline module in the first connection mode.

16. The control method according to claim 15, characterized in that, In the second connection mode, at least a portion of the pump body connected to the pipeline module is arranged in series.

17. The control method according to claim 15, characterized in that, The step of controlling the valve module to adjust the number of pumps connected to the pipeline module according to the flow resistance further includes: Determine whether the flow resistance is greater than a threshold, wherein the threshold is greater than the preset flow resistance; When the flow resistance is greater than the threshold, the pump body connected to the pipeline module is controlled to stop working.

18. The control method according to claim 17, characterized in that, The control method further includes: Obtain the rate of change of flow resistance of the pipeline module; Determine whether the rate of change of flow resistance is greater than a preset rate of change; Determine whether the flow resistance is greater than the warning flow resistance; When the rate of change of flow resistance is greater than the preset rate of change and the flow resistance is greater than the warning flow resistance, the control alarm module will issue an alarm. The warning flow resistance is greater than the preset flow resistance and less than the threshold.

19. The control method according to claim 15, characterized in that, The step of controlling the valve module to adjust the number of pumps connected to the pipeline module according to the flow resistance further includes: The pump body, which is disconnected from the pipeline module, is stopped from operating.

20. A control device, characterized in that, It includes a memory and a processor, the memory being used to store program instructions, and the processor being used to invoke the program instructions to execute the control method as described in any one of claims 13-19.

21. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the control method as described in any one of claims 13-19.

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